Prospective applications of two-dimensional materials beyond laboratory frontiers: A review

The development of nanotechnology has been advancing for decades and gained acceleration in the 21st century. Two-dimensional (2D) materials are widely available, giving them a wide range of material platforms for technological study and the advancement of atomic-level applications. The design and application of 2D materials are discussed in this review. In order to evaluate the performance of 2D materials, which might lead to greater applications benefiting the electrical and electronics sectors as well as society, the future paradigm of 2D materials needs to be visualized. The development of 2D hybrid materials with better characteristics that will help industry and society at large is anticipated to result from intensive research in 2D materials. This enhanced evaluation might open new opportunities for the synthesis of 2D materials and the creation of devices that are more effective than traditional ones in various sectors of application.

Polyhedral oligosilsesquioxane-modified boron nitride enhances the mechanical properties of polyimide nanocomposites

A novel high-strength polyimide (PI) nanocomposite film was designed and constructed by the copolymerization of epoxidized polyhedral oligomeric silsesquioxane-modified hexagonal boron nitride and polyamic acid (PAA). The composite filler (EPPOSS@Gh-BN) was composed of silane coupling agent KH550 modified hexagonal boron nitride (Gh-BN) and epoxidized polyhedral oligomeric silsesquioxanes (EPPOSS), which improved not only the dispersion of the h-BN but also the effective interfacial stress transfer, leading to an enhanced mechanical strength of the resultant PI nanocomposite film of 114 MPa even with a slight EPPOSS@Gh-BN loading of 0.30 wt%, and the storage modulus was increased by more than 30% to 4 GPa compared to pure PI. Meanwhile, the PI/EPPOSS@Gh-BN nanocomposite has better heat transfer performance, higher hydrophobicity, lower dielectric properties, and higher heat stability than pure PI, and is therefore expected to provide an ideal platform for the development of highly flexible electronics in the future.

A novel high-strength polyimide nanocomposite film was obtained by the copolymerization of epoxidized polyhedral oligomeric silsesquioxane-modified hexagonal boron nitride and polyamic acid.

Recent progress on improving the mechanical, thermal and electrical conductivity properties of polyimide matrix composites from nanofillers perspective for technological applications

The adoption of polymer nanocomposites in the design/manufacturing of parts for engineering and technological applications showcases their outstanding properties. Among the polymer nanocomposites, polyimide (PI) nanocomposites have attracted much attention as a composite material capable of withstanding mechanical, thermal and electrical stresses, hence engineered for use in harsh environments. However, the nanocomposites are limited to the application area that demands conduction polymer and polymer composites due to the low electrical conductivity of PI. Although, there has been advancement in improving the mechanical, thermal and electrical properties of PI nanocomposites. Thus, the review focuses on recent progress on improving the mechanical, thermal and electrical conductivity properties of PI nanocomposites via the incorporation of carbon nanotubes (CNTs), graphene and graphene oxide (GO) fillers into the PI matrix. The review summarises the influence of CNTs, graphene and GO on the mechanical and conductivity properties of PI nanocomposites. The authors ended the review with advancement, challenges and recommendations for future improvement of PI reinforced conductive nanofillers composites. Therefore, the review study proffers an understanding of the improvement and selection of PI nanocomposites material for mechanical, thermal and electrical conductivity applications. Additionally, in the area of conductive polymer nanocomposites, this review will also pave way for future study.

Applications of polyimide coatings: a review

Polyimides, high-performance polymers with superior properties such as high temperature stability, resistance to solvents and high strength, can be used in high-tech applications of the aerospace and aviation, medical or electronics industry in different forms (film, fiber, nanofiber, membrane, foam, adhesive or coating). Among these applications, coating has a special place and is used to develop advanced structures having high temperature resistance, flame retardancy and etc. for high tech industries via an economical and feasible way. Therefore, in this review, we aimed to report the broad application status of polyimide coatings by reviewing publications, patents and commercial products. Thus, this study can assist in selecting suitable polyimide types and production methods for polyimide coating applications and in understanding their applicability for future products.