Recent progress in the development of thermal interface materials: a review

Interactions between carbon nanotubes and external structures of SARS-CoV-2 using molecular docking and molecular dynamics

Molecular modeling techniques are used to describe the process of interaction between nanotubes and the main structures of the Covid-19 virus: the envelope protein, the main protease, and the Spike glycoprotein. Molecular docking studies show that the ligands have interaction characteristics capable of adsorbing the structures. Molecular dynamics simulations provide information on the mean squared deviation of atomic positions ​​between 0.5 and 3.0 Å. The Gibbs free energy model and solvent accessible surface area approaches are used. Through the results obtained through molecular dynamics simulations, it is noted that the zig-zag nanotube prefers to interact with E-pro, M-pro, and S-gly, respectively. Molecular couplings and free energy showed that the S-gly active site residues strongly interact with zigzag, chiral, and armchair nanotubes, in this order. The interactions demonstrated in this manuscript may predict some promising candidates for virus antagonists, which may be confirmed through experimental approaches.

Enhanced Thermal Conductivity of Epoxy Composites by Introducing 1D AlN Whiskers and Constructing Directionally Aligned 3D AlN Filler Skeletons

With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have attracted increasing attention. For regular ceramic particles as fillers, it is necessary to achieve the highest filling fraction to obtain high thermal conductivity, yet leading to higher production cost and reduced mechanical properties. In this paper, AlN whiskers with a high aspect ratio were successfully prepared using a modified direct nitriding method, which was further paired with AlN particles as fillers to prepare the AlN/epoxy composites. It is indicated that AlN whiskers could form bridging links between AlN particles, which favored the establishment of thermal pathways inside the polymer matrix. On this basis, we constructed the 3D AlN skeletons as a thermal conductivity pathway by the freeze-casting method, which could further enhance the thermal conductivity of the composites. The synergistic enhancement effect of 1D AlN whiskers and directional filler skeletons on the composite thermal conductivity was further demonstrated by the actual heat transfer process and finite element simulations. More significantly, the experimental results showed that the addition of one-dimensional fillers could also effectively improve the thermal stability and mechanical properties of the composites, which was beneficial for preparing high-performance TIMs.

Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics

With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.

Interfacial thermal transport between graphene and diamane

Similar to graphene, diamane is a single layer of diamond that has been investigated in recent years due to its peculiar mechanical, thermal, and electronic properties. Motivated by earlier work that showed an exceptionally high intra-plane thermal conductivity in diamane, in this work, we investigate the interfacial thermal resistance (R) between graphene and diamane using non-equilibrium classical molecular dynamics simulations. The calculated R for a pristine graphene and AB-stacked diamane at room temperature is 1.89 × 10^-7 K m²/W, which is comparable to other common graphene/semi-conductor bilayers. These results are understood in terms of the overlap of the phonon density of states between the graphene and diamane layers. We further explore the impact of stacking pattern, system temperature, coupling strength, in-plane tensile strain, and hydrogenation ratio on R. Intriguingly, we find that unlike single layer diamane, where the intra-plane thermal conductively is reduced by ∼50% under 5% strain, the inter-plane thermal conductance of the graphene-diamane bilayer is enhanced by ∼50% under 8% strain. The difference is caused by the opposite behavior between the inter- and intra-layer conductances as phonon relaxation time is decreased. The high intra-plane thermal conductivity and low inter-plane thermal resistance shows the high potential of using graphene-diamane heterostructures in electronic applications.

Modulation of the thermal conductivity, interlayer thermal resistance, and interfacial thermal conductance of C2N

C₂N, a novel 2D semiconductor with orderly distributed holes and nitrogen atoms, has attracted significant attention due to its possible practical applications. This paper investigates the in-plane thermal conductivity and interlayer thermal resistance of C₂N and the interfacial thermal conductance of in-plane heterostructures assembled by C₂N and carbonized C₂N(C-C₂N) using molecular dynamics simulations. The in-plane thermal conductivities of C₂N monolayers along zigzag and armchair directions are 73.2 and 77.3 W m^-1 K^-1, respectively, and can be effectively manipulated by point defects, chemical doping, and strain engineering. Remarkably, nitrogen vacancies have a more substantial impact on reducing the thermal conductivity than carbon vacancies because of the more pronounced suppression of the high-frequency peaks. The difference in doping sites leads to a change in phonon mode localization. When the C₂N size is small, as the tensile strain increases, k_i is affected by dimensional lengthening due to stretching in addition to tensile strain. The interlayer thermal resistance decreases with increasing layer number and interlayer coupling strength. The AA stacking gives rise to a lower thermal resistance than the AB stacking when the heat flow passes through the multilayer due to the weaker in-plane bonding strength. Moreover, various possible atomic structures of C₂N/C-C₂N in-plane heterojunctions and the effect of carbon and nitrogen vacancies on interfacial thermal conductance are explored. The results provide valuable insights into the thermal transport properties in the application of C₂N-based electronic devices.

Graphene-based SiC Van der Waals heterostructures: nonequilibrium molecular dynamics simulation study

The structural properties and thermal conductivity of graphene-based SiC heterostructures are investigated using the reverse nonequilibrium molecular dynamics. The C/SiC/C heterostructure has the greatest value of cohesive energy due to the effect of vdW interactions between layers. The surfaces of heterostructures begin to ripple as a direct consequence of the plane fluctuations observed around T = 400 K. The thermal conductivity at room temperature is determined. The length and the armchair and zigzag orientations increase the magnitude of κ which decreases with increasing temperature. This change is attributed to the phonon Umklapp scattering and phonon cross-plane couplings. The impact of point vacancy, bi-vacancy and edge vacancy in a concentration range up to 2% is also discussed. The localization of low-frequency phonons around the vacancy induces a decaying characteristic of thermal conductivity. The effect depends on the type of vacancy and is more pronounced in heterostructures with point vacancy. The present results make pristine and defective heterostructures promising materials for various thermoelectric applications with tunable functionalities.

Improvement of Heat Transfer Properties through TiO2 Nanosphere Monolayer Embedded Polymers as Thermal Interface Materials

A thermal interface material (TIM) is a substance that reduces the thermal resistance between a heat source and heat sink, which facilitates heat conduction towards the outside. In this study, a TiO2 nanosphere (NS)-filler based TIM was fabricated via facile processes such as spin-coating and icing methods. Thermal conductivity of the fabricated TiO2 NS-based TIM was enhanced by increasing the loading contents of the TiO2 NS-filler and successfully cooling down the GPU chipset temperature from 62 °C to 50 °C. Moreover, the TIM with the TiO2 NS-monolayer additionally lowered the GPU temperature by 1–7 °C. The COMSOL simulation results show that the TiO2 NS-monolayer, which was in contact with the heat source, boosts the heat transfer characteristics from the heat source toward the inside of the TIM. The suggested metal oxide monolayer-based TIM is an effective structure that reduces the temperature of the device without an additional filler loading, and it is expected to have a wide range of applications for the thermal management of advanced devices.

Modulating thermal transport in a porous carbon honeycomb using cutting and deformation techniques

During the past few years, there has been a flurry of investigations on the lattice thermal transport of three-dimensional (3D) graphene, however, few studies have detailed how to adjust this property effectively using the presently available engineering technologies. In this work, the thermal transport properties of a porous single layer carbon honeycomb (SL-dCHC-2) and its mechanical response are systematically studied. We show that the thermal conductivity of SL-dCHC-2 can be adjusted effectively by varying the tensile strain, and its value is enhanced by up to 11.3 times with 8% strain as compared to the unstrained case. This value is significantly larger than what was observed for other two-dimensional (2D) materials such as silicene (∼7 times larger). This outstanding behavior is explained by the phonon mode level, indicating that a profound increase of the thermal conductivity under tensile strain is attributed to the enhancement of the phonon lifetime. In addition, the trend for the root mean squared displacement, which is closely related to the phonon anharmonic effect, correlates with the non-monotonic response of the dimerized C-C bonds at the linkage of the structure. These investigations and obtained results provide important guidance to develop 3D carbon honeycombs for several different purposes, such as for use as molecular sieves and in water purification applications.

Advances in Studies of Boron Nitride Nanosheets and Nanocomposites for Thermal Transport and Related Applications

Hexagonal boron nitride (h-BN) and exfoliated nanosheets (BNNs) not only resemble their carbon counterparts graphite and graphene nanosheets in structural configurations and many excellent materials characteristics, especially the ultra-high thermal conductivity, but also offer other unique properties such as being electrically insulating and extreme chemical stability and oxidation resistance even at elevated temperatures. In fact, BNNs as a special class of 2-D nanomaterials have been widely pursued for technological applications that are beyond the reach of their carbon counterparts. Highlighted in this article are significant recent advances in the development of more effective and efficient exfoliation techniques for high-quality BNNs, the understanding of their characteristic properties, and the use of BNNs in polymeric nanocomposites for thermally conductive yet electrically insulating materials and systems. Major challenges and opportunities for further advances in the relevant research field are also discussed.

Liquid Metal Composites with Enhanced Thermal Conductivity and Stability Using Molecular Thermal Linker

Gallium-based liquid metal (LM) composite with metallic fillers is an emerging class of thermal interface materials (TIMs), which are widely applied in electronics and power systems to improve their performance. In situ alloying between gallium and many metallic fillers like copper and silver, however, leads to a deteriorated composite stability. This paper presents an interfacial engineering approach using 3-chloropropyltriethoxysilane (CPTES) to serve as effective thermal linkers and diffusion barriers at the copper-gallium oxide interfaces in the LM matrix, achieving an enhancement in both thermal conductivity and stability of the composite. By mixing LM with copper particles modified by CPTES, a thermal conductivity (κ) as high as 65.9 W m^-1 K^-1 is achieved. In addition, κ can be tuned by altering the terminal groups of silane molecules, demonstrating the flexibility of this approach. The potential use of such composite as a TIM is also shown in the heat dissipation of a computer central processing unit. While most studies on LM-based composites enhance the material performance via direct mixing of various fillers, this work provides a different approach to fabricate high-performance LM-based composites and may further advance their applications in various areas including thermal management systems, flexible electronics, consumer electronics, and biomedical systems.

Enhancing Thermal Transport in Silicone Composites via Bridging Liquid Metal Fillers with Reactive Metal Co-Fillers and Matrix Viscosity Tuning

Polymer matrix composites containing room temperature liquid metal (LM) microdroplets offer a unique set of thermo-mechanical characteristics that makes them attractive candidates for high performance thermal interface materials. However, to achieve the desired level of the composite thermal conductivity, effective bridging of such fillers into interconnected percolation networks needs to be induced. Thermal percolation of the LM microdroplets requires two physical barriers to be overcome. First, the LM microdroplets must directly contact each other through the polymer matrix. Second, the native oxide shell on the LM microdroplet must also be ruptured. In this work, we demonstrate that both physical barriers can be penetrated to induce ample bridging of the LM microdroplets and thereby achieve higher thermal conductivity composites. We accomplish this through a synergistic combination of solid silver and LM fillers, tuning of the silicone oil "matrix" viscosity, and sample compression. We selected silver as the solid additive because it rapidly alloys with gallium to form microscale needles that could act as additional paths that aid in connecting the LM droplets. We systematically explore the impact of the composition (filler type, volume fraction, and matrix oil viscosity) and applied pressure on the thermal conductivity and multiscale structure of these composites. We reveal the microscopic mechanism underlying the macroscopic experimental trends and also identify an optimal composition of the multiphase Ag-LM-Silicone oil composite for thermal applications. The identified design knobs offer path for developing tunable LM-based polymer composites for microelectronics cooling, biomedical applications, and flexible electronics.