1
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Jiang Y, Ye D, Li A, Zhang B, Han W, Niu X, Zeng M, Guo L, Zhang G, Yin Z, Huang Y. Transient charge-driven 3D conformal printing via pulsed-plasma impingement. Proc Natl Acad Sci U S A 2024; 121:e2402135121. [PMID: 38771869 PMCID: PMC11145272 DOI: 10.1073/pnas.2402135121] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/05/2024] [Accepted: 04/23/2024] [Indexed: 05/23/2024] Open
Abstract
Seamless integration of microstructures and circuits on three-dimensional (3D) complex surfaces is of significance and is catalyzing the emergence of many innovative 3D curvy electronic devices. However, patterning fine features on arbitrary 3D targets remains challenging. Here, we propose a facile charge-driven electrohydrodynamic 3D microprinting technique that allows micron- and even submicron-scale patterning of functional inks on a couple of 3D-shaped dielectrics via an atmospheric-pressure cold plasma jet. Relying on the transient charging of exposed sites arising from the weakly ionized gas jet, the specified charge is programmably deposited onto the surface as a virtual electrode with spatial and time spans of ~mm in diameter and ~μs in duration to generate a localized electric field accordantly. Therefore, inks with a wide range of viscosities can be directly drawn out from micro-orifices and deposited on both two-dimensional (2D) planar and 3D curved surfaces with a curvature radius down to ~1 mm and even on the inner wall of narrow cavities via localized electrostatic attraction, exhibiting a printing resolution of ~450 nm. In addition, several conformal electronic devices were successfully printed on 3D dielectric objects. Self-aligned 3D microprinting, with stacking layers up to 1400, is also achieved due to the electrified surfaces. This microplasma-induced printing technique exhibits great advantages such as ultrahigh resolution, excellent compatibility of inks and substrates, antigravity droplet dispersion, and omnidirectional printing on 3D freeform surfaces. It could provide a promising solution for intimately fabricating electronic devices on arbitrary 3D surfaces.
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Affiliation(s)
- Yu Jiang
- State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - Dong Ye
- State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - Aokang Li
- State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - Bo Zhang
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, Shaanxi710049, People's Republic of China
| | - Wenhu Han
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, Shaanxi710049, People's Republic of China
| | - Xuechen Niu
- Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - Mingtao Zeng
- State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - Lianbo Guo
- Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - Guanjun Zhang
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, Shaanxi710049, People's Republic of China
| | - Zhouping Yin
- State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
| | - YongAn Huang
- State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan430074, People's Republic of China
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2
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Zhao H, Liu M, Guo Q. Silicon-based transient electronics: principles, devices and applications. NANOTECHNOLOGY 2024; 35:292002. [PMID: 38599177 DOI: 10.1088/1361-6528/ad3ce1] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/06/2023] [Accepted: 04/10/2024] [Indexed: 04/12/2024]
Abstract
Recent advances in materials science, device designs and advanced fabrication technologies have enabled the rapid development of transient electronics, which represents a class of devices or systems that their functionalities and constitutions can be partially/completely degraded via chemical reaction or physical disintegration over a stable operation. Therefore, numerous potentials, including zero/reduced waste electronics, bioresorbable electronic implants, hardware security, and others, are expected. In particular, transient electronics with biocompatible and bioresorbable properties could completely eliminate the secondary retrieval surgical procedure after their in-body operation, thus offering significant potentials for biomedical applications. In terms of material strategies for the manufacturing of transient electronics, silicon nanomembranes (SiNMs) are of great interest because of their good physical/chemical properties, modest mechanical flexibility (depending on their dimensions), robust and outstanding device performances, and state-of-the-art manufacturing technologies. As a result, continuous efforts have been made to develop silicon-based transient electronics, mainly focusing on designing manufacturing strategies, fabricating various devices with different functionalities, investigating degradation or failure mechanisms, and exploring their applications. In this review, we will summarize the recent progresses of silicon-based transient electronics, with an emphasis on the manufacturing of SiNMs, devices, as well as their applications. After a brief introduction, strategies and basics for utilizing SiNMs for transient electronics will be discussed. Then, various silicon-based transient electronic devices with different functionalities are described. After that, several examples regarding on the applications, with an emphasis on the biomedical engineering, of silicon-based transient electronics are presented. Finally, summary and perspectives on transient electronics are exhibited.
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Affiliation(s)
- Haonan Zhao
- School of Integrated Circuits, Shandong University, Jinan 250100, People's Republic of China
| | - Min Liu
- School of Integrated Circuits, Shandong University, Jinan 250100, People's Republic of China
| | - Qinglei Guo
- School of Integrated Circuits, Shandong University, Jinan 250100, People's Republic of China
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3
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Liu X, Gong Y, Jiang Z, Stevens T, Li W. Flexible high-density microelectrode arrays for closed-loop brain-machine interfaces: a review. Front Neurosci 2024; 18:1348434. [PMID: 38686330 PMCID: PMC11057246 DOI: 10.3389/fnins.2024.1348434] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 12/02/2023] [Accepted: 01/12/2024] [Indexed: 05/02/2024] Open
Abstract
Flexible high-density microelectrode arrays (HDMEAs) are emerging as a key component in closed-loop brain-machine interfaces (BMIs), providing high-resolution functionality for recording, stimulation, or both. The flexibility of these arrays provides advantages over rigid ones, such as reduced mismatch between interface and tissue, resilience to micromotion, and sustained long-term performance. This review summarizes the recent developments and applications of flexible HDMEAs in closed-loop BMI systems. It delves into the various challenges encountered in the development of ideal flexible HDMEAs for closed-loop BMI systems and highlights the latest methodologies and breakthroughs to address these challenges. These insights could be instrumental in guiding the creation of future generations of flexible HDMEAs, specifically tailored for use in closed-loop BMIs. The review thoroughly explores both the current state and prospects of these advanced arrays, emphasizing their potential in enhancing BMI technology.
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Affiliation(s)
- Xiang Liu
- Neuroscience Program, Department of Physiology, Michigan State University, East Lansing, MI, United States
- Institute for Quantitative Health Science and Engineering (IQ), East Lansing, MI, United States
| | - Yan Gong
- Institute for Quantitative Health Science and Engineering (IQ), East Lansing, MI, United States
- Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, United States
| | - Zebin Jiang
- Institute for Quantitative Health Science and Engineering (IQ), East Lansing, MI, United States
- Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, United States
| | - Trevor Stevens
- Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, United States
| | - Wen Li
- Neuroscience Program, Department of Physiology, Michigan State University, East Lansing, MI, United States
- Institute for Quantitative Health Science and Engineering (IQ), East Lansing, MI, United States
- Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, United States
- Department of Biomedical Engineering, Michigan State University, East Lansing, MI, United States
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4
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Wei S, Jiang A, Sun H, Zhu J, Jia S, Liu X, Xu Z, Zhang J, Shang Y, Fu X, Li G, Wang P, Xia Z, Jiang T, Cao A, Duan X. Shape-changing electrode array for minimally invasive large-scale intracranial brain activity mapping. Nat Commun 2024; 15:715. [PMID: 38267440 PMCID: PMC10808108 DOI: 10.1038/s41467-024-44805-2] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/05/2023] [Accepted: 01/03/2024] [Indexed: 01/26/2024] Open
Abstract
Large-scale brain activity mapping is important for understanding the neural basis of behaviour. Electrocorticograms (ECoGs) have high spatiotemporal resolution, bandwidth, and signal quality. However, the invasiveness and surgical risks of electrode array implantation limit its application scope. We developed an ultrathin, flexible shape-changing electrode array (SCEA) for large-scale ECoG mapping with minimal invasiveness. SCEAs were inserted into cortical surfaces in compressed states through small openings in the skull or dura and fully expanded to cover large cortical areas. MRI and histological studies on rats proved the minimal invasiveness of the implantation process and the high chronic biocompatibility of the SCEAs. High-quality micro-ECoG activities mapped with SCEAs from male rodent brains during seizures and canine brains during the emergence period revealed the spatiotemporal organization of different brain states with resolution and bandwidth that cannot be achieved using existing noninvasive techniques. The biocompatibility and ability to map large-scale physiological and pathological cortical activities with high spatiotemporal resolution, bandwidth, and signal quality in a minimally invasive manner offer SCEAs as a superior tool for applications ranging from fundamental brain research to brain-machine interfaces.
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Affiliation(s)
- Shiyuan Wei
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
- Academy for Advanced Interdisciplinary Studies, Peking University, Beijing, 100871, China
| | - Anqi Jiang
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
| | - Hongji Sun
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
| | - Jingjun Zhu
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
- National Biomedical Imaging Centre, Peking University, Beijing, 100871, China
| | - Shengyi Jia
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
| | - Xiaojun Liu
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
| | - Zheng Xu
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
| | - Jing Zhang
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
- Academy for Advanced Interdisciplinary Studies, Peking University, Beijing, 100871, China
| | - Yuanyuan Shang
- Key Laboratory of Material Physics, Ministry of Education, School of Physics and Microelectronics, Zhengzhou University, Zhengzhou, 450052, China
| | - Xuefeng Fu
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
| | - Gen Li
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
| | - Puxin Wang
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
- Academy for Advanced Interdisciplinary Studies, Peking University, Beijing, 100871, China
| | - Zhiyuan Xia
- School of Materials Science and Engineering, Peking University, Beijing, China
| | - Tianzi Jiang
- Brainnetome Centre, Institute of Automation, Chinese Academy of Sciences (CAS), Beijing, 100190, China
| | - Anyuan Cao
- School of Materials Science and Engineering, Peking University, Beijing, China
| | - Xiaojie Duan
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China.
- Academy for Advanced Interdisciplinary Studies, Peking University, Beijing, 100871, China.
- National Biomedical Imaging Centre, Peking University, Beijing, 100871, China.
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5
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Gogurla N, Wahab A, Kim S. A biomaterial-silicon junction for photodetection. Mater Today Bio 2023; 20:100642. [PMID: 37153757 PMCID: PMC10154958 DOI: 10.1016/j.mtbio.2023.100642] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/10/2023] [Revised: 04/05/2023] [Accepted: 04/23/2023] [Indexed: 05/10/2023] Open
Abstract
Bio-integrated optoelectronics can be interfaced with biological tissues, thereby offering opportunities for clinical diagnosis and therapy. However, finding a suitable biomaterial-based semiconductor to interface with electronics is still challenging. In this study, a semiconducting layer is assembled comprising a silk protein hydrogel and melanin nanoparticles (NPs). The silk protein hydrogel provides a water-rich environment for the melanin NPs that maximizes their ionic conductivity and bio-friendliness. An efficient photodetector is produced by forming a junction between melanin NP-silk and a p-type Si (p-Si) semiconductor. The observed charge accumulation/transport behavior at the melanin NP-silk/p-Si junction is associated with the ionic conductive state of the melanin NP-silk composite. The melanin NP-silk semiconducting layer is printed as an array on an Si substrate. The photodetector array exhibits uniform photo-response to illumination at various wavelengths, thus providing broadband photodetection. Efficient charge transfer between melanin NP-silk and Si provides fast photo-switching with rise and decay constants of 0.44 s and 0.19 s, respectively. The photodetector with a biotic interface comprising an Ag nanowire-incorporated silk layer as the top contact can operate when underneath biological tissue. The photo-responsive biomaterial-Si semiconductor junction using light as a stimulus offers a bio-friendly and versatile platform for artificial electronic skin/tissue.
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Affiliation(s)
- Narendar Gogurla
- Department of Energy Systems Research, Ajou University, Suwon, 16499, South Korea
| | - Abdul Wahab
- Department of Energy Systems Research, Ajou University, Suwon, 16499, South Korea
| | - Sunghwan Kim
- Department of Biomedical Engineering & Department of Electronic Engineering, Hanyang University, Seoul, 04763, South Korea
- Corresponding author.
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6
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Luo Y, Abidian MR, Ahn JH, Akinwande D, Andrews AM, Antonietti M, Bao Z, Berggren M, Berkey CA, Bettinger CJ, Chen J, Chen P, Cheng W, Cheng X, Choi SJ, Chortos A, Dagdeviren C, Dauskardt RH, Di CA, Dickey MD, Duan X, Facchetti A, Fan Z, Fang Y, Feng J, Feng X, Gao H, Gao W, Gong X, Guo CF, Guo X, Hartel MC, He Z, Ho JS, Hu Y, Huang Q, Huang Y, Huo F, Hussain MM, Javey A, Jeong U, Jiang C, Jiang X, Kang J, Karnaushenko D, Khademhosseini A, Kim DH, Kim ID, Kireev D, Kong L, Lee C, Lee NE, Lee PS, Lee TW, Li F, Li J, Liang C, Lim CT, Lin Y, Lipomi DJ, Liu J, Liu K, Liu N, Liu R, Liu Y, Liu Y, Liu Z, Liu Z, Loh XJ, Lu N, Lv Z, Magdassi S, Malliaras GG, Matsuhisa N, Nathan A, Niu S, Pan J, Pang C, Pei Q, Peng H, Qi D, Ren H, Rogers JA, Rowe A, Schmidt OG, Sekitani T, Seo DG, Shen G, Sheng X, Shi Q, Someya T, Song Y, Stavrinidou E, Su M, Sun X, Takei K, Tao XM, Tee BCK, Thean AVY, Trung TQ, Wan C, Wang H, Wang J, Wang M, Wang S, Wang T, Wang ZL, Weiss PS, Wen H, Xu S, Xu T, Yan H, Yan X, Yang H, Yang L, Yang S, Yin L, Yu C, Yu G, Yu J, Yu SH, Yu X, Zamburg E, Zhang H, Zhang X, Zhang X, Zhang X, Zhang Y, Zhang Y, Zhao S, Zhao X, Zheng Y, Zheng YQ, Zheng Z, Zhou T, Zhu B, Zhu M, Zhu R, Zhu Y, Zhu Y, Zou G, Chen X. Technology Roadmap for Flexible Sensors. ACS NANO 2023; 17:5211-5295. [PMID: 36892156 PMCID: PMC11223676 DOI: 10.1021/acsnano.2c12606] [Citation(s) in RCA: 171] [Impact Index Per Article: 171.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity.
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Affiliation(s)
- Yifei Luo
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Mohammad Reza Abidian
- Department of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States
| | - Jong-Hyun Ahn
- School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
| | - Deji Akinwande
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Anne M Andrews
- Department of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Markus Antonietti
- Colloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany
| | - Zhenan Bao
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Magnus Berggren
- Laboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden
- Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC), SE-100 44 Stockholm, Sweden
| | - Christopher A Berkey
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Christopher John Bettinger
- Department of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States
| | - Jun Chen
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Peng Chen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Wenlong Cheng
- Nanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800
- Monash Institute of Medical Engineering, Monash University, Clayton, Australia3800
| | - Xu Cheng
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Seon-Jin Choi
- Division of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea
| | - Alex Chortos
- School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Canan Dagdeviren
- Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
| | - Reinhold H Dauskardt
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Chong-An Di
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States
| | - Xiangfeng Duan
- Department of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Antonio Facchetti
- Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States
| | - Zhiyong Fan
- Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
| | - Yin Fang
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Jianyou Feng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Xue Feng
- Laboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
| | - Huajian Gao
- School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Wei Gao
- Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States
| | - Xiwen Gong
- Department of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States
| | - Chuan Fei Guo
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China
| | - Xiaojun Guo
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
| | - Martin C Hartel
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Zihan He
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - John S Ho
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore
| | - Youfan Hu
- School of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China
| | - Qiyao Huang
- School of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Yu Huang
- Department of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Fengwei Huo
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China
| | - Muhammad M Hussain
- mmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Ali Javey
- Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States
- Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States
| | - Unyong Jeong
- Department of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea
| | - Chen Jiang
- Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
| | - Xingyu Jiang
- Department of Biomedical Engineering, Southern University of Science and Technology, No 1088, Xueyuan Road, Xili, Nanshan District, Shenzhen, Guangdong 518055, PR China
| | - Jiheong Kang
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Daniil Karnaushenko
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
| | | | - Dae-Hyeong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Il-Doo Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea
| | - Dmitry Kireev
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Lingxuan Kong
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Chengkuo Lee
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
- NUS Graduate School-Integrative Sciences and Engineering Programme (ISEP), National University of Singapore, Singapore 119077, Singapore
| | - Nae-Eung Lee
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Pooi See Lee
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Singapore-HUJ Alliance for Research and Enterprise (SHARE), Campus for Research Excellence and Technological Enterprise (CREATE), Singapore 138602, Singapore
| | - Tae-Woo Lee
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
- School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
- Institute of Engineering Research, Research Institute of Advanced Materials, Seoul National University, Soft Foundry, Seoul 08826, Republic of Korea
- Interdisciplinary Program in Bioengineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Fengyu Li
- College of Chemistry and Materials Science, Jinan University, Guangzhou, Guangdong 510632, China
| | - Jinxing Li
- Department of Biomedical Engineering, Department of Electrical and Computer Engineering, Neuroscience Program, BioMolecular Science Program, and Institute for Quantitative Health Science and Engineering, Michigan State University, East Lansing, Michigan 48823, United States
| | - Cuiyuan Liang
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Chwee Teck Lim
- Department of Biomedical Engineering, National University of Singapore, Singapore 117583, Singapore
- Mechanobiology Institute, National University of Singapore, Singapore 117411, Singapore
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 119276, Singapore
| | - Yuanjing Lin
- School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
| | - Darren J Lipomi
- Department of Nano and Chemical Engineering, University of California, San Diego, La Jolla, California 92093-0448, United States
| | - Jia Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Kai Liu
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Nan Liu
- Beijing Key Laboratory of Energy Conversion and Storage Materials, College of Chemistry, Beijing Normal University, Beijing 100875, PR China
| | - Ren Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Yuxin Liu
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Biomedical Engineering, N.1 Institute for Health, Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore 119077, Singapore
| | - Yuxuan Liu
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Zhiyuan Liu
- Neural Engineering Centre, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 518055
| | - Zhuangjian Liu
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xian Jun Loh
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Nanshu Lu
- Department of Aerospace Engineering and Engineering Mechanics, Department of Electrical and Computer Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Zhisheng Lv
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Shlomo Magdassi
- Institute of Chemistry and the Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
| | - George G Malliaras
- Electrical Engineering Division, Department of Engineering, University of Cambridge CB3 0FA, Cambridge United Kingdom
| | - Naoji Matsuhisa
- Institute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan
| | - Arokia Nathan
- Darwin College, University of Cambridge, Cambridge CB3 9EU, United Kingdom
| | - Simiao Niu
- Department of Biomedical Engineering, Rutgers University, Piscataway, New Jersey 08854, United States
| | - Jieming Pan
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
| | - Changhyun Pang
- School of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea
| | - Qibing Pei
- Department of Materials Science and Engineering, Department of Mechanical and Aerospace Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Huisheng Peng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Dianpeng Qi
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Huaying Ren
- Department of Chemistry and Biochemistry, University of California, Los Angeles, Los Angeles, California, 90095, United States
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
- Department of Materials Science and Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Departments of Electrical and Computer Engineering and Chemistry, and Department of Neurological Surgery, Northwestern University, Evanston, Illinois 60208, United States
| | - Aaron Rowe
- Becton, Dickinson and Company, 1268 N. Lakeview Avenue, Anaheim, California 92807, United States
- Ready, Set, Food! 15821 Ventura Blvd #450, Encino, California 91436, United States
| | - Oliver G Schmidt
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz 09107, Germany
- Nanophysics, Faculty of Physics, TU Dresden, Dresden 01062, Germany
| | - Tsuyoshi Sekitani
- The Institute of Scientific and Industrial Research (SANKEN), Osaka University, Osaka, Japan 5670047
| | - Dae-Gyo Seo
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Guozhen Shen
- School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China
| | - Xing Sheng
- Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Center for Flexible Electronics Technology, and IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, China
| | - Qiongfeng Shi
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
| | - Takao Someya
- Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan
| | - Yanlin Song
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Eleni Stavrinidou
- Laboratory of Organic Electronics, Department of Science and Technology, Linköping University, SE-601 74 Norrkoping, Sweden
| | - Meng Su
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Xuemei Sun
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Kuniharu Takei
- Department of Physics and Electronics, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan
| | - Xiao-Ming Tao
- Research Institute for Intelligent Wearable Systems, School of Fashion and Textiles, Hong Kong Polytechnic University, Hong Kong, China
| | - Benjamin C K Tee
- Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore
- iHealthtech, National University of Singapore, Singapore 119276, Singapore
| | - Aaron Voon-Yew Thean
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Tran Quang Trung
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Changjin Wan
- School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
| | - Huiliang Wang
- Department of Biomedical Engineering, University of Texas at Austin, Austin, Texas 78712, United States
| | - Joseph Wang
- Department of Nanoengineering, University of California, San Diego, California 92093, United States
| | - Ming Wang
- Frontier Institute of Chip and System, State Key Laboratory of Integrated Chip and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China
- the Shanghai Qi Zhi Institute, 41th Floor, AI Tower, No.701 Yunjin Road, Xuhui District, Shanghai 200232, China
| | - Sihong Wang
- Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, 60637, United States
| | - Ting Wang
- State Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Zhong Lin Wang
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China
- Georgia Institute of Technology, Atlanta, Georgia 30332-0245, United States
| | - Paul S Weiss
- California NanoSystems Institute, Department of Chemistry and Biochemistry, Department of Bioengineering, and Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Hanqi Wen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
- Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, China 314000
| | - Sheng Xu
- Department of Nanoengineering, Department of Electrical and Computer Engineering, Materials Science and Engineering Program, and Department of Bioengineering, University of California San Diego, La Jolla, California, 92093, United States
| | - Tailin Xu
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong, 518060, PR China
| | - Hongping Yan
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Xuzhou Yan
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Hui Yang
- Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Tianjin, China, 300072
| | - Le Yang
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Materials Science and Engineering, National University of Singapore (NUS), 9 Engineering Drive 1, #03-09 EA, Singapore 117575, Singapore
| | - Shuaijian Yang
- School of Biomedical Sciences, Faculty of Biological Sciences, University of Leeds, Leeds, LS2 9JT, United Kingdom
| | - Lan Yin
- School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, and Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
| | - Cunjiang Yu
- Department of Engineering Science and Mechanics, Department of Biomedical Engineering, Department of Material Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, 16802, United States
| | - Guihua Yu
- Materials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, 78712, United States
| | - Jing Yu
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Shu-Hong Yu
- Department of Chemistry, Institute of Biomimetic Materials and Chemistry, Hefei National Research Center for Physical Science at the Microscale, University of Science and Technology of China, Hefei 230026, China
| | - Xinge Yu
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Evgeny Zamburg
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Haixia Zhang
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Xiangyu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Xiaosheng Zhang
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
| | - Xueji Zhang
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong 518060, PR China
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Yu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Siyuan Zhao
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Xuanhe Zhao
- Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, United States
| | - Yuanjin Zheng
- Center for Integrated Circuits and Systems, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
| | - Yu-Qing Zheng
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Zijian Zheng
- Department of Applied Biology and Chemical Technology, Faculty of Science, Research Institute for Intelligent Wearable Systems, Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Tao Zhou
- Center for Neural Engineering, Department of Engineering Science and Mechanics, The Huck Institutes of the Life Sciences, Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Bowen Zhu
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou 310024, China
| | - Ming Zhu
- Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore
| | - Rong Zhu
- Department of Precision Instrument, Tsinghua University, Beijing 100084, China
| | - Yangzhi Zhu
- Terasaki Institute for Biomedical Innovation, Los Angeles, California, 90064, United States
| | - Yong Zhu
- Department of Mechanical and Aerospace Engineering, Department of Materials Science and Engineering, and Department of Biomedical Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Guijin Zou
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xiaodong Chen
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
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7
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Tracking neural activity from the same cells during the entire adult life of mice. Nat Neurosci 2023; 26:696-710. [PMID: 36804648 DOI: 10.1038/s41593-023-01267-x] [Citation(s) in RCA: 24] [Impact Index Per Article: 24.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/22/2021] [Accepted: 01/19/2023] [Indexed: 02/22/2023]
Abstract
Stably recording the electrical activity of the same neurons over the adult life of an animal is important to neuroscience research and biomedical applications. Current implantable devices cannot provide stable recording on this timescale. Here, we introduce a method to precisely implant electronics with an open, unfolded mesh structure across multiple brain regions in the mouse. The open mesh structure forms a stable interwoven structure with the neural network, preventing probe drifting and showing no immune response and neuron loss during the year-long implantation. Rigorous statistical analysis, visual stimulus-dependent measurement and unbiased, machine-learning-based analysis demonstrated that single-unit action potentials have been recorded from the same neurons of behaving mice in a very long-term stable manner. Leveraging this stable structure, we demonstrated that the same neurons can be recorded over the entire adult life of the mouse, revealing the aging-associated evolution of single-neuron activities.
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8
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Bathaei MJ, Singh R, Mirzajani H, Istif E, Akhtar MJ, Abbasiasl T, Beker L. Photolithography-Based Microfabrication of Biodegradable Flexible and Stretchable Sensors. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2207081. [PMID: 36401580 DOI: 10.1002/adma.202207081] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/04/2022] [Revised: 11/12/2022] [Indexed: 06/16/2023]
Abstract
Biodegradable sensors based on integrating conductive layers with polymeric materials in flexible and stretchable forms have been established. However, the lack of a generalized microfabrication method results in large-sized, low spatial density, and low device yield compared to the silicon-based devices manufactured via batch-compatible microfabrication processes. Here, a batch fabrication-compatible photolithography-based microfabrication approach for biodegradable and highly miniaturized essential sensor components is presented on flexible and stretchable substrates. Up to 1600 devices are fabricated within a 1 cm2 footprint and then the functionality of various biodegradable passive electrical components, mechanical sensors, and chemical sensors is demonstrated on flexible and stretchable substrates. The results are highly repeatable and consistent, proving the proposed method's high device yield and high-density potential. This simple, innovative, and robust fabrication recipe allows complete freedom over the applicability of various biodegradable materials with different properties toward the unique application of interests. The process offers a route to utilize standard micro-fabrication procedures toward scalable fabrication of highly miniaturized flexible and stretchable transient sensors and electronics.
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Affiliation(s)
- Mohammad Javad Bathaei
- Department of Biomedical Sciences and Engineering, Koç University, Rumelifeneri Yolu, Sarıyer, Istanbul, 34450, Turkey
| | - Rahul Singh
- Department of Mechanical Engineering, Koç University, Rumelifeneri Yolu, Sarıyer, Istanbul, 34450, Turkey
| | - Hadi Mirzajani
- Department of Mechanical Engineering, Koç University, Rumelifeneri Yolu, Sarıyer, Istanbul, 34450, Turkey
| | - Emin Istif
- Faculty of Engineering and Natural Sciences, Kadir Has University, Cibali, Istanbul, 34083, Turkey
| | - Muhammad Junaid Akhtar
- Department of Electrical and Electronics Engineering, Koç University, Rumelifeneri Yolu, Sarıyer, Istanbul, 34450, Turkey
| | - Taher Abbasiasl
- Department of Mechanical Engineering, Koç University, Rumelifeneri Yolu, Sarıyer, Istanbul, 34450, Turkey
| | - Levent Beker
- Department of Biomedical Sciences and Engineering, Koç University, Rumelifeneri Yolu, Sarıyer, Istanbul, 34450, Turkey
- Department of Mechanical Engineering, Koç University, Rumelifeneri Yolu, Sarıyer, Istanbul, 34450, Turkey
- Research Center for Translational Medicine (KUTTAM), Koç University, Rumelifeneri Yolu, Sarıyer, Istanbul, 34450, Turkey
- Nanofabrication and Nanocharacterization Center for Scientific and Technological Advanced Research (n2Star), Koç University, Rumelifeneri Yolu, Sarıyer, Istanbul, 34450, Turkey
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9
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Large-scale multimodal surface neural interfaces for primates. iScience 2022; 26:105866. [PMID: 36647381 PMCID: PMC9840154 DOI: 10.1016/j.isci.2022.105866] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/27/2022] Open
Abstract
Deciphering the function of neural circuits can help with the understanding of brain function and treating neurological disorders. Progress toward this goal relies on the development of chronically stable neural interfaces capable of recording and modulating neural circuits with high spatial and temporal precision across large areas of the brain. Advanced innovations in designing high-density neural interfaces for small animal models have enabled breakthrough discoveries in neuroscience research. Developing similar neurotechnology for larger animal models such as nonhuman primates (NHPs) is critical to gain significant insights for translation to humans, yet still it remains elusive due to the challenges in design, fabrication, and system-level integration of such devices. This review focuses on implantable surface neural interfaces with electrical and optical functionalities with emphasis on the required technological features to realize scalable multimodal and chronically stable implants to address the unique challenges associated with nonhuman primate studies.
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10
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Lee S, Byun SH, Kim CY, Cho S, Park S, Sim JY, Jeong JW. Beyond Human Touch Perception: An Adaptive Robotic Skin Based on Gallium Microgranules for Pressure Sensory Augmentation. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2204805. [PMID: 36190163 DOI: 10.1002/adma.202204805] [Citation(s) in RCA: 9] [Impact Index Per Article: 4.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/27/2022] [Revised: 07/27/2022] [Indexed: 06/16/2023]
Abstract
Robotic skin with human-skin-like sensing ability holds immense potential in various fields such as robotics, prosthetics, healthcare, and industries. To catch up with human skin, numerous studies are underway on pressure sensors integrated on robotic skin to improve the sensitivity and detection range. However, due to the trade-off between them, existing pressure sensors have achieved only a single aspect, either high sensitivity or wide bandwidth. Here, an adaptive robotic skin is proposed that has both high sensitivity and broad bandwidth with an augmented pressure sensing ability beyond the human skin. A key for the adaptive robotic skin is a tunable pressure sensor built with uniform gallium microgranules embedded in an elastomer, which provides large tuning of the sensitivity and the bandwidth, excellent sensor-to-sensor uniformity, and high reliability. Through the mode conversion based on the solid-liquid phase transition of gallium microgranules, the sensor provides 97% higher sensitivity (16.97 kPa-1 ) in the soft mode and 262.5% wider bandwidth (≈1.45 MPa) in the rigid mode compared to the human skin. Successful demonstration of the adaptive robotic skin verifies its capabilities in sensing a wide spectrum of pressures ranging from subtle blood pulsation to body weight, suggesting broad use for various applications.
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Affiliation(s)
- Simok Lee
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Republic of Korea
| | - Sang-Hyuk Byun
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Republic of Korea
| | - Choong Yeon Kim
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Republic of Korea
| | - Sungwoo Cho
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Republic of Korea
| | - Steve Park
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Republic of Korea
| | - Joo Yong Sim
- Department of Mechanical Systems Engineering, Sookmyung Women's University, Seoul, 04310, Republic of Korea
| | - Jae-Woong Jeong
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), KAIST Institute for Health Science and Technology, Daejeon, 34141, Republic of Korea
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11
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Sang M, Kim K, Shin J, Yu KJ. Ultra-Thin Flexible Encapsulating Materials for Soft Bio-Integrated Electronics. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2022; 9:e2202980. [PMID: 36031395 PMCID: PMC9596833 DOI: 10.1002/advs.202202980] [Citation(s) in RCA: 16] [Impact Index Per Article: 8.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/22/2022] [Revised: 07/22/2022] [Indexed: 05/11/2023]
Abstract
Recently, bioelectronic devices extensively researched and developed through the convergence of flexible biocompatible materials and electronics design that enables more precise diagnostics and therapeutics in human health care and opens up the potential to expand into various fields, such as clinical medicine and biomedical research. To establish an accurate and stable bidirectional bio-interface, protection against the external environment and high mechanical deformation is essential for wearable bioelectronic devices. In the case of implantable bioelectronics, special encapsulation materials and optimized mechanical designs and configurations that provide electronic stability and functionality are required for accommodating various organ properties, lifespans, and functions in the biofluid environment. Here, this study introduces recent developments of ultra-thin encapsulations with novel materials that can preserve or even improve the electrical performance of wearable and implantable bio-integrated electronics by supporting safety and stability for protection from destruction and contamination as well as optimizing the use of bioelectronic systems in physiological environments. In addition, a summary of the materials, methods, and characteristics of the most widely used encapsulation technologies is introduced, thereby providing a strategic selection of appropriate choices of recently developed flexible bioelectronics.
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Affiliation(s)
- Mingyu Sang
- School of Electrical and Electronic EngineeringYonsei University50 Yonsei‐ro, SeodaemunguSeoul03722Republic of Korea
| | - Kyubeen Kim
- School of Electrical and Electronic EngineeringYonsei University50 Yonsei‐ro, SeodaemunguSeoul03722Republic of Korea
| | - Jongwoon Shin
- School of Electrical and Electronic EngineeringYonsei University50 Yonsei‐ro, SeodaemunguSeoul03722Republic of Korea
| | - Ki Jun Yu
- School of Electrical and Electronic EngineeringYonsei University50 Yonsei‐ro, SeodaemunguSeoul03722Republic of Korea
- YU‐KIST InstituteYonsei University50 Yonsei‐ro, SeodaemunguSeoul03722Republic of Korea
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12
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Wide bandgap semiconductor nanomembranes as a long-term biointerface for flexible, implanted neuromodulator. Proc Natl Acad Sci U S A 2022; 119:e2203287119. [PMID: 35939711 PMCID: PMC9388084 DOI: 10.1073/pnas.2203287119] [Citation(s) in RCA: 4] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/18/2022] Open
Abstract
Electrical neuron stimulation holds promise for treating chronic neurological disorders, including spinal cord injury, epilepsy, and Parkinson's disease. The implementation of ultrathin, flexible electrodes that can offer noninvasive attachment to soft neural tissues is a breakthrough for timely, continuous, programable, and spatial stimulations. With strict flexibility requirements in neural implanted stimulations, the use of conventional thick and bulky packages is no longer applicable, posing major technical issues such as short device lifetime and long-term stability. We introduce herein a concept of long-lived flexible neural electrodes using silicon carbide (SiC) nanomembranes as a faradic interface and thermal oxide thin films as an electrical barrier layer. The SiC nanomembranes were developed using a chemical vapor deposition (CVD) process at the wafer level, and thermal oxide was grown using a high-quality wet oxidation technique. The proposed material developments are highly scalable and compatible with MEMS technologies, facilitating the mass production of long-lived implanted bioelectrodes. Our experimental results showed excellent stability of the SiC/silicon dioxide (SiO2) bioelectronic system that can potentially last for several decades with well-maintained electronic properties in biofluid environments. We demonstrated the capability of the proposed material system for peripheral nerve stimulation in an animal model, showing muscle contraction responses comparable to those of a standard non-implanted nerve stimulation device. The design concept, scalable fabrication approach, and multimodal functionalities of SiC/SiO2 flexible electronics offer an exciting possibility for fundamental neuroscience studies, as well as for neural stimulation-based therapies.
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13
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Nguyen TK, Yadav S, Truong TA, Han M, Barton M, Leitch M, Guzman P, Dinh T, Ashok A, Vu H, Dau V, Haasmann D, Chen L, Park Y, Do TN, Yamauchi Y, Rogers JA, Nguyen NT, Phan HP. Integrated, Transparent Silicon Carbide Electronics and Sensors for Radio Frequency Biomedical Therapy. ACS NANO 2022; 16:10890-10903. [PMID: 35816450 PMCID: PMC9332346 DOI: 10.1021/acsnano.2c03188] [Citation(s) in RCA: 4] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
The integration of micro- and nanoelectronics into or onto biomedical devices can facilitate advanced diagnostics and treatments of digestive disorders, cardiovascular diseases, and cancers. Recent developments in gastrointestinal endoscopy and balloon catheter technologies introduce promising paths for minimally invasive surgeries to treat these diseases. However, current therapeutic endoscopy systems fail to meet requirements in multifunctionality, biocompatibility, and safety, particularly when integrated with bioelectronic devices. Here, we report materials, device designs, and assembly schemes for transparent and stable cubic silicon carbide (3C-SiC)-based bioelectronic systems that facilitate tissue ablation, with the capability for integration onto the tips of endoscopes. The excellent optical transparency of SiC-on-glass (SoG) allows for direct observation of areas of interest, with superior electronic functionalities that enable multiple biological sensing and stimulation capabilities to assist in electrical-based ablation procedures. Experimental studies on phantom, vegetable, and animal tissues demonstrated relatively short treatment times and low electric field required for effective lesion removal using our SoG bioelectronic system. In vivo experiments on an animal model were conducted to explore the versatility of SoG electrodes for peripheral nerve stimulation, showing an exciting possibility for the therapy of neural disorders through electrical excitation. The multifunctional features of SoG integrated devices indicate their high potential for minimally invasive, cost-effective, and outcome-enhanced surgical tools, across a wide range of biomedical applications.
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Affiliation(s)
- Tuan-Khoa Nguyen
- Queensland
Micro and Nanotechnology Centre, Griffith
University, Brisbane, Queensland 4111, Australia
| | - Sharda Yadav
- Queensland
Micro and Nanotechnology Centre, Griffith
University, Brisbane, Queensland 4111, Australia
| | - Thanh-An Truong
- Queensland
Micro and Nanotechnology Centre, Griffith
University, Brisbane, Queensland 4111, Australia
- School
of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, New South Wales 2052, Australia
| | - Mengdi Han
- Department
of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
| | - Matthew Barton
- School
of Nursing and Midwifery, Griffith University, Brisbane, Queensland 4111, Australia
- Menzies
Health Institute Queensland, Brisbane, Queensland 4222, Australia
| | - Michael Leitch
- School
of Nursing and Midwifery, Griffith University, Brisbane, Queensland 4111, Australia
| | - Pablo Guzman
- Queensland
Micro and Nanotechnology Centre, Griffith
University, Brisbane, Queensland 4111, Australia
| | - Toan Dinh
- Centre
for Future Materials, University of Southern
Queensland, Toowoomba, Queensland 4305, Australia
| | - Aditya Ashok
- Australian
Institute for Bioengineering and Nanotechnology, The University of Queensland, Brisbane, Queensland 4072, Australia
| | - Hieu Vu
- School
of Engineering and Built Environment, Griffith
University, Brisbane, Queensland 4215, Australia
| | - Van Dau
- School
of Engineering and Built Environment, Griffith
University, Brisbane, Queensland 4215, Australia
| | - Daniel Haasmann
- Queensland
Micro and Nanotechnology Centre, Griffith
University, Brisbane, Queensland 4111, Australia
| | - Lin Chen
- State
Key Laboratory for Mechanical Behavior of Materials, School of Materials
Science and Engineering, Xi’an Jiaotong
University, Xi’an 710049, Shaanxi, People’s Republic of China
| | - Yoonseok Park
- Querrey
Simpson Institute for Bioelectronics, Northwestern
University, Evanston, Illinois 60208, United States
- Department
of Advanced Materials Engineering for Information and Electronics, Kyung Hee University, Yongin 17104, Republic
of Korea
| | - Thanh Nho Do
- Graduate
School of Biomedical Engineering, The University
of New South Wales, Sydney, New South Wales 2032, Australia
| | - Yusuke Yamauchi
- Australian
Institute for Bioengineering and Nanotechnology, The University of Queensland, Brisbane, Queensland 4072, Australia
- JST-ERATO
Yamauchi Materials Space-Tectonics Project, Kagami Memorial Research
Institute for Science and Technology, Waseda
University, Tokyo 169-0051, Japan
| | - John A. Rogers
- Querrey
Simpson Institute for Bioelectronics, Northwestern
University, Evanston, Illinois 60208, United States
- Department
of Materials Science and Engineering, Department of Mechanical Engineering,
Department of Biomedical Engineering, Departments of Electrical and
Computer Engineering and Chemistry, and Department of Neurological
Surgery, Northwestern University, Evanston, Illinois 60208, United States
| | - Nam-Trung Nguyen
- Queensland
Micro and Nanotechnology Centre, Griffith
University, Brisbane, Queensland 4111, Australia
| | - Hoang-Phuong Phan
- Queensland
Micro and Nanotechnology Centre, Griffith
University, Brisbane, Queensland 4111, Australia
- School
of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, New South Wales 2052, Australia
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14
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Zhang H, Peng Y, Zhang N, Yang J, Wang Y, Ding H. Emerging Optoelectronic Devices Based on Microscale LEDs and Their Use as Implantable Biomedical Applications. MICROMACHINES 2022; 13:mi13071069. [PMID: 35888886 PMCID: PMC9323269 DOI: 10.3390/mi13071069] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 05/30/2022] [Revised: 06/27/2022] [Accepted: 06/29/2022] [Indexed: 02/05/2023]
Abstract
Thin-film microscale light-emitting diodes (LEDs) are efficient light sources and their integrated applications offer robust capabilities and potential strategies in biomedical science. By leveraging innovations in the design of optoelectronic semiconductor structures, advanced fabrication techniques, biocompatible encapsulation, remote control circuits, wireless power supply strategies, etc., these emerging applications provide implantable probes that differ from conventional tethering techniques such as optical fibers. This review introduces the recent advancements of thin-film microscale LEDs for biomedical applications, covering the device lift-off and transfer printing fabrication processes and the representative biomedical applications for light stimulation, therapy, and photometric biosensing. Wireless power delivery systems have been outlined and discussed to facilitate the operation of implantable probes. With such wireless, battery-free, and minimally invasive implantable light-source probes, these biomedical applications offer excellent opportunities and instruments for both biomedical sciences research and clinical diagnosis and therapy.
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Affiliation(s)
- Haijian Zhang
- Beijing Engineering Research Center of Mixed Reality and Advanced Display, School of Optics and Photonics, Beijing Institute of Technology, Beijing 100081, China; (H.Z.); (Y.P.); (J.Y.); (Y.W.)
| | - Yanxiu Peng
- Beijing Engineering Research Center of Mixed Reality and Advanced Display, School of Optics and Photonics, Beijing Institute of Technology, Beijing 100081, China; (H.Z.); (Y.P.); (J.Y.); (Y.W.)
| | - Nuohan Zhang
- GMA Optoelectronic Technology Limited, Xinyang 464000, China;
| | - Jian Yang
- Beijing Engineering Research Center of Mixed Reality and Advanced Display, School of Optics and Photonics, Beijing Institute of Technology, Beijing 100081, China; (H.Z.); (Y.P.); (J.Y.); (Y.W.)
| | - Yongtian Wang
- Beijing Engineering Research Center of Mixed Reality and Advanced Display, School of Optics and Photonics, Beijing Institute of Technology, Beijing 100081, China; (H.Z.); (Y.P.); (J.Y.); (Y.W.)
| | - He Ding
- Beijing Engineering Research Center of Mixed Reality and Advanced Display, School of Optics and Photonics, Beijing Institute of Technology, Beijing 100081, China; (H.Z.); (Y.P.); (J.Y.); (Y.W.)
- Correspondence:
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15
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Cho KW, Sunwoo SH, Hong YJ, Koo JH, Kim JH, Baik S, Hyeon T, Kim DH. Soft Bioelectronics Based on Nanomaterials. Chem Rev 2021; 122:5068-5143. [PMID: 34962131 DOI: 10.1021/acs.chemrev.1c00531] [Citation(s) in RCA: 46] [Impact Index Per Article: 15.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/14/2022]
Abstract
Recent advances in nanostructured materials and unconventional device designs have transformed the bioelectronics from a rigid and bulky form into a soft and ultrathin form and brought enormous advantages to the bioelectronics. For example, mechanical deformability of the soft bioelectronics and thus its conformal contact onto soft curved organs such as brain, heart, and skin have allowed researchers to measure high-quality biosignals, deliver real-time feedback treatments, and lower long-term side-effects in vivo. Here, we review various materials, fabrication methods, and device strategies for flexible and stretchable electronics, especially focusing on soft biointegrated electronics using nanomaterials and their composites. First, we summarize top-down material processing and bottom-up synthesis methods of various nanomaterials. Next, we discuss state-of-the-art technologies for intrinsically stretchable nanocomposites composed of nanostructured materials incorporated in elastomers or hydrogels. We also briefly discuss unconventional device design strategies for soft bioelectronics. Then individual device components for soft bioelectronics, such as biosensing, data storage, display, therapeutic stimulation, and power supply devices, are introduced. Afterward, representative application examples of the soft bioelectronics are described. A brief summary with a discussion on remaining challenges concludes the review.
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Affiliation(s)
- Kyoung Won Cho
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea.,Interdisciplinary Program for Bioengineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Sung-Hyuk Sunwoo
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea.,School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, Seoul 08826, Republic of Korea
| | - Yongseok Joseph Hong
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea.,School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, Seoul 08826, Republic of Korea
| | - Ja Hoon Koo
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea
| | - Jeong Hyun Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea
| | - Seungmin Baik
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea.,School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, Seoul 08826, Republic of Korea
| | - Taeghwan Hyeon
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea.,Interdisciplinary Program for Bioengineering, Seoul National University, Seoul 08826, Republic of Korea.,School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, Seoul 08826, Republic of Korea
| | - Dae-Hyeong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea.,Interdisciplinary Program for Bioengineering, Seoul National University, Seoul 08826, Republic of Korea.,School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, Seoul 08826, Republic of Korea.,Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
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16
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Moazeni S, Pollmann E, Boominathan V, Cardoso FA, Robinson J, Veeraraghavan A, Shepard K. A Mechanically Flexible, Implantable Neural Interface for Computational Imaging and Optogenetic Stimulation Over 5.4×5.4mm 2 FoV. IEEE TRANSACTIONS ON BIOMEDICAL CIRCUITS AND SYSTEMS 2021; 15:1295-1305. [PMID: 34951854 DOI: 10.1109/tbcas.2021.3138334] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/14/2023]
Abstract
Emerging optical functional imaging and optogenetics are among the most promising approaches in neuroscience to study neuronal circuits. Combining both methods into a single implantable device enables all-optical neural interrogation with immediate applications in freely-behaving animal studies. In this paper, we demonstrate such a device capable of optical neural recording and stimulation over large cortical areas. This implantable surface device exploits lens-less computational imaging and a novel packaging scheme to achieve an ultra-thin (250μm-thick), mechanically flexible form factor. The core of this device is a custom-designed CMOS integrated circuit containing a 160×160 array of time-gated single-photon avalanche photodiodes (SPAD) for low-light intensity imaging and an interspersed array of dual-color (blue and green) flip-chip bonded micro-LED (μLED) as light sources. We achieved 60μm lateral imaging resolution and 0.2mm3 volumetric precision for optogenetics over a 5.4×5.4mm2 field of view (FoV). The device achieves a 125-fps frame-rate and consumes 40 mW of total power.
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17
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Cho Y, Park S, Lee J, Yu KJ. Emerging Materials and Technologies with Applications in Flexible Neural Implants: A Comprehensive Review of Current Issues with Neural Devices. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2021; 33:e2005786. [PMID: 34050691 DOI: 10.1002/adma.202005786] [Citation(s) in RCA: 26] [Impact Index Per Article: 8.7] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/26/2020] [Revised: 09/29/2020] [Indexed: 05/27/2023]
Abstract
Neuroscience is an essential field of investigation that reveals the identity of human beings, with a comprehensive understanding of advanced mental activities, through the study of neurobiological structures and functions. Fully understanding the neurotransmission system that allows for connectivity among neuronal circuits has paved the way for the development of treatments for neurodegenerative diseases such as Parkinson's disease, Alzheimer's disease, and depression. The field of flexible implants has attracted increasing interest mainly to overcome the mechanical mismatch between rigid electrode materials and soft neural tissues, enabling precise measurements of neural signals from conformal contact. Here, the current issues of flexible neural implants (chronic device failure, non-bioresorbable electronics, low-density electrode arrays, among others are summarized) by presenting material candidates and designs to address each challenge. Furthermore, the latest investigations associated with the aforementioned issues are also introduced, including suggestions for ideal neural implants. In terms of the future direction of these advances, designing flexible devices would provide new opportunities for the study of brain-machine interfaces or brain-computer interfaces as part of locomotion through brain signals, and for the treatment of neurodegenerative diseases.
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Affiliation(s)
- Younguk Cho
- School of Electrical Engineering, Yonsei University, Seoul, 03722, Korea
| | - Sanghoon Park
- School of Electrical Engineering, Yonsei University, Seoul, 03722, Korea
| | - Juyoung Lee
- School of Electrical Engineering, Yonsei University, Seoul, 03722, Korea
| | - Ki Jun Yu
- School of Electrical Engineering, YU-KIST Institute, Yonsei University, Seoul, 03722, Korea
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18
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Shao R, Wang C, Zhao J, Yang H, Sun S. Crosstalk-Free, Stretching-Insensitive Sensor Based on Arch-Bridge Architecture for Tactile Mapping with Parallel Addressing Strategy toward Million-Scale-Pixels Processing. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2021; 8:e2101876. [PMID: 34499410 PMCID: PMC8564424 DOI: 10.1002/advs.202101876] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/06/2021] [Revised: 07/14/2021] [Indexed: 05/04/2023]
Abstract
In the field of biomimetic electronics, flexible sensors with both high resolution and large size are attracting a lot of attention. However, attempts to increase the number of sensor pixels have been thwarted by the need for complex inner circuits and the resulting interferences with the output. Technological challenges, such as real-time spatiotemporal mapping and long-time reliability, must be resolved for large-scale sensor matrices. This paper reports a simple and robust sensor with an arch-bridge architecture (ABA) to address these challenges. The device, which consists of an anti-icing all-transparent material system, is fabricated by immobilizing ABA ionic arrays on predefined grooves on the substrate. It systematically integrates ABA structure-designing, resistance-position-sensing, and parallel-addressing logic, allowing for an improvement of three orders of magnitude in the scanning speed (million-scale pixels) without logical "diagnose confusion." In addition, it can withstand 100 000 stretching cycles without functional failure. It is also resistant to interferences from stretching. humidity, wet surfaces, and power lines. The proposed strategy is envisaged to serve as a general solution for high-density, large-area tactile sensors in various applications.
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Affiliation(s)
- Ruomei Shao
- Institute of Biopharmaceutical and Healthcare EngineeringShenzhen International Graduate SchoolTsinghua UniversityShenzhen518055China
| | - Chunnan Wang
- Institute of Biopharmaceutical and Healthcare EngineeringShenzhen International Graduate SchoolTsinghua UniversityShenzhen518055China
| | - Jingru Zhao
- Institute of Biopharmaceutical and Healthcare EngineeringShenzhen International Graduate SchoolTsinghua UniversityShenzhen518055China
| | - Hang Yang
- State Key Laboratory for Strength and Vibration of Mechanical StructuresInternational Center for Applied MechanicsDepartment of Engineering MechanicsXi'an Jiaotong UniversityXi'an710049China
| | - Shuqing Sun
- Institute of Biopharmaceutical and Healthcare EngineeringShenzhen International Graduate SchoolTsinghua UniversityShenzhen518055China
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19
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Zhu M, Wang H, Li S, Liang X, Zhang M, Dai X, Zhang Y. Flexible Electrodes for In Vivo and In Vitro Electrophysiological Signal Recording. Adv Healthc Mater 2021; 10:e2100646. [PMID: 34050635 DOI: 10.1002/adhm.202100646] [Citation(s) in RCA: 30] [Impact Index Per Article: 10.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/03/2021] [Revised: 05/10/2021] [Indexed: 12/19/2022]
Abstract
A variety of electrophysiological signals (electrocardiography, electromyography, electroencephalography, etc.) are generated during the physiological activities of human bodies, which can be collected by electrodes and thus provide critical insights into health status or facilitate fundamental scientific research. The long-term stable and high-quality recording of electrophysiological signals is the premise for their further applications, leading to demands for flexible electrodes with similar mechanical modulus and minimized irritation to human bodies. This review summarizes the latest advances in flexible electrodes for the acquisition of various electrophysiological signals. First, the concept of electrophysiological signals and the characteristics of different subcategory signals are introduced. Second, the invasive and noninvasive methods are reviewed for electrophysiological signal recording with a highlight on the design of flexible electrodes, followed by a discussion on their material selection. Subsequently, the applications of the electrophysiological signal acquisition in pathological diagnosis and restoration of body functions are discussed, showing the advantages of flexible electrodes. Finally, the main challenges and opportunities in this field are discussed. It is believed that the further exploration of materials for flexible electrodes and the combination of multidisciplinary technologies will boost the applications of flexible electrodes for medical diagnosis and human-machine interface.
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Affiliation(s)
- Mengjia Zhu
- Key Laboratory of Organic Optoelectronics and Molecular Engineering of the Ministry of Education Department of Chemistry Tsinghua University Beijing 100084 P. R. China
| | - Huimin Wang
- Key Laboratory of Organic Optoelectronics and Molecular Engineering of the Ministry of Education Department of Chemistry Tsinghua University Beijing 100084 P. R. China
| | - Shuo Li
- Key Laboratory of Organic Optoelectronics and Molecular Engineering of the Ministry of Education Department of Chemistry Tsinghua University Beijing 100084 P. R. China
| | - Xiaoping Liang
- Key Laboratory of Organic Optoelectronics and Molecular Engineering of the Ministry of Education Department of Chemistry Tsinghua University Beijing 100084 P. R. China
| | - Mingchao Zhang
- Key Laboratory of Organic Optoelectronics and Molecular Engineering of the Ministry of Education Department of Chemistry Tsinghua University Beijing 100084 P. R. China
| | - Xiaochuan Dai
- Department of Biomedical Engineering School of Medicine Tsinghua University Beijing 100084 P. R. China
| | - Yingying Zhang
- Key Laboratory of Organic Optoelectronics and Molecular Engineering of the Ministry of Education Department of Chemistry Tsinghua University Beijing 100084 P. R. China
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20
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Cho C, Kang P, Taqieddin A, Jing Y, Yong K, Kim JM, Haque MF, Aluru NR, Nam S. Strain-resilient electrical functionality in thin-film metal electrodes using two-dimensional interlayers. NATURE ELECTRONICS 2021; 4:126-133. [PMID: 35136855 PMCID: PMC8819722 DOI: 10.1038/s41928-021-00538-4] [Citation(s) in RCA: 26] [Impact Index Per Article: 8.7] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/01/2020] [Accepted: 01/05/2021] [Indexed: 05/18/2023]
Abstract
Flexible electrodes that allow electrical conductance to be maintained during mechanical deformation are required for the development of wearable electronics. However, flexible electrodes based on metal thin-films on elastomeric substrates can suffer from complete and unexpected electrical disconnection after the onset of mechanical fracture across the metal. Here we show that the strain-resilient electrical performance of thin-film metal electrodes under multimodal deformation can be enhanced by using a two-dimensional (2D) interlayer. Insertion of atomically-thin interlayers - graphene, molybdenum disulfide, or hexagonal boron nitride - induce continuous in-plane crack deflection in thin-film metal electrodes. This leads to unique electrical characteristics (termed electrical ductility) in which electrical resistance gradually increases with strain, creating extended regions of stable resistance. Our 2D-interlayer electrodes can maintain a low electrical resistance beyond a strain in which conventional metal electrodes would completely disconnect. We use the approach to create a flexible electroluminescent light emitting device with an augmented strain-resilient electrical functionality and an early-damage diagnosis capability.
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Affiliation(s)
- Chullhee Cho
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
- These authors contributed equally
| | - Pilgyu Kang
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
- Department of Mechanical Engineering, George Mason University, Fairfax, VA, USA
- These authors contributed equally
| | - Amir Taqieddin
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Yuhang Jing
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Keong Yong
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Jin Myung Kim
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Md Farhadul Haque
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Narayana R Aluru
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - SungWoo Nam
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
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21
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Ghelich P, Nolta NF, Han M. Unprotected sidewalls of implantable silicon-based neural probes and conformal coating as a solution. NPJ MATERIALS DEGRADATION 2021; 5:5. [PMID: 33855191 PMCID: PMC8043659 DOI: 10.1038/s41529-021-00154-9] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/07/2023]
Abstract
Silicon-based implantable neural devices have great translational potential as a means to deliver various treatments for neurological disorders. However, they are currently held back by uncertain longevity following chronic exposure to body fluids. Conventional deposition techniques cover only the horizontal surfaces which contain active electronics, electrode sites, and conducting traces. As a result, a vast majority of today's silicon devices leave their vertical sidewalls exposed without protection. In this work, we investigated two batch-process silicon dioxide deposition methods separately and in combination: atomic layer deposition and inductively-coupled plasma chemical vapor deposition. We then utilized a rapid soak test involving potassium hydroxide to evaluate the coverage quality of each protection strategy. Focused ion beam cross sectioning, scanning electron microscopy, and 3D extrapolation enabled us to characterize and quantify the effectiveness of the deposition methods. Results showed that bare silicon sidewalls suffered the most dissolution whereas ALD silicon dioxide provided the best protection, demonstrating its effectiveness as a promising batch process technique to mitigate silicon sidewall corrosion in chronic applications.
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Affiliation(s)
- Pejman Ghelich
- Department of Biomedical Engineering, University of Connecticut, Storrs, CT, USA
| | - Nicholas F Nolta
- Department of Biomedical Engineering, University of Connecticut, Storrs, CT, USA
| | - Martin Han
- Department of Biomedical Engineering, University of Connecticut, Storrs, CT, USA
- Institute of Materials Science, University of Connecticut, Storrs, CT, USA
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22
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Choi HK, Lee JH, Lee T, Lee SN, Choi JW. Flexible Electronics for Monitoring in vivo Electrophysiology and Metabolite Signals. Front Chem 2020; 8:547591. [PMID: 33330353 PMCID: PMC7710703 DOI: 10.3389/fchem.2020.547591] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/31/2020] [Accepted: 10/07/2020] [Indexed: 11/13/2022] Open
Abstract
Numerous efforts have been made to develop efficient biosensors for detecting analytes in the human body. However, biosensors are often developed on rigid materials, which limits their application on skin, organs, and other tissues in the human body where good flexibility is required. Developing flexible materials for biosensors that can be used on soft and irregularly shaped surfaces would significantly expand the clinical application of biosensors. In this review, we will provide a selective overview of recently developed flexible electronic devices and their applications for monitoring in vivo metabolite and electrophysiology signals. The article provides guidelines for the development of an in vivo signal monitoring system and emphasizes research from various disciplines for the further development of flexible electronics that can be used in more biomedical applications in the future.
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Affiliation(s)
- Hye Kyu Choi
- Department of Chemical and Biomolecular Engineering, Sogang University, Seoul, South Korea
| | - Jin-Ho Lee
- School of Biomedical Convergence Engineering, Pusan National University, Yangsan, South Korea
| | - Taek Lee
- Department of Chemical Engineering, Kwangwoon University, Seoul, South Korea
| | | | - Jeong-Woo Choi
- Department of Chemical and Biomolecular Engineering, Sogang University, Seoul, South Korea
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23
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Ghora M, Majumdar P, Anas M, Varghese S. Enabling Control over Mechanical Conformity and Luminescence in Molecular Crystals: Interaction Engineering in Action. Chemistry 2020; 26:14488-14495. [PMID: 32761653 DOI: 10.1002/chem.202003311] [Citation(s) in RCA: 5] [Impact Index Per Article: 1.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/14/2020] [Indexed: 11/11/2022]
Abstract
Molecular crystals of π-conjugated molecules are of great interest as the highly ordered dense packing offers superior charge and exciton transport compared with its amorphous counterparts. However, integration into optoelectronic devices remains a major challenge owing to its inherently brittle nature. Herein, control over the mechanical conformity in single crystals of pyridine-appended thiazolothiazole derivatives is reported by modulating the molecular packing through interaction engineering. Two polymorphs were prepared by achieving control over the thermodynamic/kinetic factors of crystallization; one of the polymorphs exhibits elastic bending whereas the other is brittle. The control over the bending ability was achieved by forming co-crystals with hydrogen/halogen bond donors. A seamless extended crisscross pattern with respect to the bend plane through a ditopic hydrogen-bonding motif showed the highest compliance towards mechanical bending, whereas the co-crystals with a layered crisscross arrangement with segregated layers of co-formers exhibit slightly lower bending conformity. These results update the rationale behind the plastic/elastic bending in molecular crystals. The co-crystals of ditopic halogen bond co-assemblies are particularly appealing for waveguiding applications as the co-crystals blend high mechanical flexibility and luminescence properties. The hydrogen bonded co-crystals are non-emissive in nature owing to excited state proton transfer dynamics. The rationale behind the fluorescence properties of these materials was also established from DFT calculations in a quantum mechanics/molecular mechanics (QM/MM) framework.
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Affiliation(s)
- Madhubrata Ghora
- Technical Research Centre and School of Applied and Interdisciplinary Sciences, Indian Association for the Cultivation of, Science, Kolkata, 700032, India
| | - Prabhat Majumdar
- Technical Research Centre and School of Applied and Interdisciplinary Sciences, Indian Association for the Cultivation of, Science, Kolkata, 700032, India
| | - Mohammed Anas
- Technical Research Centre and School of Applied and Interdisciplinary Sciences, Indian Association for the Cultivation of, Science, Kolkata, 700032, India
| | - Shinto Varghese
- Technical Research Centre and School of Applied and Interdisciplinary Sciences, Indian Association for the Cultivation of, Science, Kolkata, 700032, India
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24
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Yan S, Shan S, Wen J, Li J, Kang N, Wu Z, Lombardi J, Cheng HW, Wang J, Luo J, He N, Mott D, Wang L, Ge Q, Hsiao BS, Poliks M, Zhong CJ. Surface-Mediated Interconnections of Nanoparticles in Cellulosic Fibrous Materials toward 3D Sensors. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2020; 32:e2002171. [PMID: 32705728 DOI: 10.1002/adma.202002171] [Citation(s) in RCA: 8] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/29/2020] [Revised: 06/12/2020] [Indexed: 06/11/2023]
Abstract
Fibrous materials serve as an intriguing class of 3D materials to meet the growing demands for flexible, foldable, biocompatible, biodegradable, disposable, inexpensive, and wearable sensors and the rising desires for higher sensitivity, greater miniaturization, lower cost, and better wearability. The use of such materials for the creation of a fibrous sensor substrate that interfaces with a sensing film in 3D with the transducing electronics is however difficult by conventional photolithographic methods. Here, a highly effective pathway featuring surface-mediated interconnection (SMI) of metal nanoclusters (NCs) and nanoparticles (NPs) in fibrous materials at ambient conditions is demonstrated for fabricating fibrous sensor substrates or platforms. Bimodally distributed gold-copper alloy NCs and NPs are used as a model system to demonstrate the semiconductive-to-metallic conductivity transition, quantized capacitive charging, and anisotropic conductivity characteristics. Upon coupling SMI of NCs/NPs as electrically conductive microelectrodes and surface-mediated assembly (SMA) of the NCs/NPs as chemically sensitive interfaces, the resulting fibrous chemiresistors function as sensitive and selective sensors for gaseous and vaporous analytes. This new SMI-SMA strategy has significant implications for manufacturing high-performance fibrous platforms to meet the growing demands of the advanced multifunctional sensors and biosensors.
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Affiliation(s)
- Shan Yan
- Department of Chemistry, and System Science and Industrial Engineering State University of New York at Binghamton, Binghamton, NY, 13902, USA
| | - Shiyao Shan
- Department of Chemistry, and System Science and Industrial Engineering State University of New York at Binghamton, Binghamton, NY, 13902, USA
| | - Jianguo Wen
- Center for Nanoscale Materials, Nanoscience and Technology Division, Argonne National Laboratory, Lemont, IL, 60439, USA
| | - Jing Li
- Department of Chemistry, and System Science and Industrial Engineering State University of New York at Binghamton, Binghamton, NY, 13902, USA
| | - Ning Kang
- Department of Chemistry, and System Science and Industrial Engineering State University of New York at Binghamton, Binghamton, NY, 13902, USA
| | - Zhipeng Wu
- Department of Chemistry, and System Science and Industrial Engineering State University of New York at Binghamton, Binghamton, NY, 13902, USA
| | - Jack Lombardi
- Department of Chemistry, and System Science and Industrial Engineering State University of New York at Binghamton, Binghamton, NY, 13902, USA
| | - Han-Wen Cheng
- Department of Chemistry, and System Science and Industrial Engineering State University of New York at Binghamton, Binghamton, NY, 13902, USA
| | - Jie Wang
- Center for Nanoscale Materials, Nanoscience and Technology Division, Argonne National Laboratory, Lemont, IL, 60439, USA
| | - Jin Luo
- Department of Chemistry, and System Science and Industrial Engineering State University of New York at Binghamton, Binghamton, NY, 13902, USA
| | - Ning He
- Department of Chemical and Biochemical Engineering, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005, China
| | - Derrick Mott
- Department of Chemistry, and System Science and Industrial Engineering State University of New York at Binghamton, Binghamton, NY, 13902, USA
| | - Lichang Wang
- Department of Chemistry and Biochemistry, Southern Illinois University, Carbondale, IL, 62901, USA
| | - Qingfeng Ge
- Department of Chemistry and Biochemistry, Southern Illinois University, Carbondale, IL, 62901, USA
| | - Benjamin S Hsiao
- Department of Chemistry, Stony Brook University, Stony Brook, NY, 11794, USA
| | - Mark Poliks
- Department of Chemistry, and System Science and Industrial Engineering State University of New York at Binghamton, Binghamton, NY, 13902, USA
| | - Chuan-Jian Zhong
- Department of Chemistry, and System Science and Industrial Engineering State University of New York at Binghamton, Binghamton, NY, 13902, USA
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Luo Y, Wang M, Wan C, Cai P, Loh XJ, Chen X. Devising Materials Manufacturing Toward Lab-to-Fab Translation of Flexible Electronics. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2020; 32:e2001903. [PMID: 32743815 DOI: 10.1002/adma.202001903] [Citation(s) in RCA: 26] [Impact Index Per Article: 6.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/19/2020] [Revised: 05/04/2020] [Indexed: 06/11/2023]
Abstract
Flexible electronics have witnessed exciting progress in academia over the past decade, but most of the research outcomes have yet to be translated into products or gain much market share. For mass production and commercialization, industrial adoption of newly developed functional materials and fabrication techniques is a prerequisite. However, due to the disparate features of academic laboratories and industrial plants, translating materials and manufacturing technologies from labs to fabs is notoriously difficult. Therefore, herein, key challenges in the materials manufacturing of flexible electronics are identified and discussed for its lab-to-fab translation, along the four stages in product manufacturing: design, materials supply, processing, and integration. Perspectives on industry-oriented strategies to overcome some of these obstacles are also proposed. Priorities for action are outlined, including standardization, iteration between basic and applied research, and adoption of smart manufacturing. With concerted efforts from academia and industry, flexible electronics will bring a bigger impact to society as promised.
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Affiliation(s)
- Yifei Luo
- Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis, #08-03, Singapore, 138634, Singapore
| | - Ming Wang
- Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Changjin Wan
- Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Pingqiang Cai
- Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Xian Jun Loh
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis, #08-03, Singapore, 138634, Singapore
- College of Chemical Engineering and Materials Science, Quanzhou Normal University, Quanzhou, Fujian, 362000, China
| | - Xiaodong Chen
- Innovative Center for Flexible Devices (iFLEX), Max Planck - NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
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Wang C, Linghu C, Nie S, Li C, Lei Q, Tao X, Zeng Y, Du Y, Zhang S, Yu K, Jin H, Chen W, Song J. Programmable and scalable transfer printing with high reliability and efficiency for flexible inorganic electronics. SCIENCE ADVANCES 2020; 6:eabb2393. [PMID: 32596472 PMCID: PMC7299632 DOI: 10.1126/sciadv.abb2393] [Citation(s) in RCA: 32] [Impact Index Per Article: 8.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/10/2020] [Accepted: 05/06/2020] [Indexed: 05/23/2023]
Abstract
Transfer printing that enables heterogeneous integration of materials in desired layouts offers unprecedented opportunities for developing high-performance unconventional electronic systems. However, large-area integration of ultrathin and delicate functional micro-objects with high yields in a programmable fashion still remains as a great challenge. Here, we present a simple, cost-effective, yet robust transfer printing technique via a shape-conformal stamp with actively actuated surface microstructures for programmable and scalable transfer printing with high reliability and efficiency. The shape-conformal stamp features the polymeric backing and commercially available adhesive layer with embedded expandable microspheres. Upon external thermal stimuli, the embedded microspheres expand to form surface microstructures and yield weak adhesion for reliable release. Systematic experimental and computational studies reveal the fundamental aspects of the extraordinary adhesion switchability of stamp. Demonstrations of this protocol in deterministic assemblies of diverse challenging inorganic micro-objects illustrate its extraordinary capabilities in transfer printing for developing high-performance flexible inorganic electronics.
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Affiliation(s)
- Chengjun Wang
- Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Changhong Linghu
- Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Shuang Nie
- Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Chenglong Li
- Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Qianjin Lei
- Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Xiang Tao
- College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China
| | - Yinjia Zeng
- Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Yipu Du
- Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Shun Zhang
- Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Kaixin Yu
- Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Hao Jin
- College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China
| | - Weiqiu Chen
- Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Jizhou Song
- Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
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Song E, Li J, Won SM, Bai W, Rogers JA. Materials for flexible bioelectronic systems as chronic neural interfaces. NATURE MATERIALS 2020; 19:590-603. [PMID: 32461684 DOI: 10.1038/s41563-020-0679-7] [Citation(s) in RCA: 170] [Impact Index Per Article: 42.5] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/14/2019] [Accepted: 04/09/2020] [Indexed: 05/03/2023]
Abstract
Engineered systems that can serve as chronically stable, high-performance electronic recording and stimulation interfaces to the brain and other parts of the nervous system, with cellular-level resolution across macroscopic areas, are of broad interest to the neuroscience and biomedical communities. Challenges remain in the development of biocompatible materials and the design of flexible implants for these purposes, where ulimate goals are for performance attributes approaching those of conventional wafer-based technologies and for operational timescales reaching the human lifespan. This Review summarizes recent advances in this field, with emphasis on active and passive constituent materials, design architectures and integration methods that support necessary levels of biocompatibility, electronic functionality, long-term stable operation in biofluids and reliability for use in vivo. Bioelectronic systems that enable multiplexed electrophysiological mapping across large areas at high spatiotemporal resolution are surveyed, with a particular focus on those with proven chronic stability in live animal models and scalability to thousands of channels over human-brain-scale dimensions. Research in materials science will continue to underpin progress in this field of study.
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Affiliation(s)
- Enming Song
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
| | - Jinghua Li
- Department of Materials Science and Engineering, The Ohio State University, Columbus, OH, USA
- Center for Chronic Brain Injury, The Ohio State University, Columbus, OH, USA
| | - Sang Min Won
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea
| | - Wubin Bai
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - John A Rogers
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.
- Department of Neurological Surgery, Northwestern University, Evanston, IL, USA.
- Department of Chemistry, Northwestern University, Evanston, IL, USA.
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
- Department of Electrical Engineering, Northwestern University, Evanston, IL, USA.
- Department of Computer Science, Northwestern University, Evanston, IL, USA.
- Feinberg School of Medicine, Northwestern University, Evanston, IL, USA.
- Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
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Linghu C, Zhang S, Wang C, Yu K, Li C, Zeng Y, Zhu H, Jin X, You Z, Song J. Universal SMP gripper with massive and selective capabilities for multiscaled, arbitrarily shaped objects. SCIENCE ADVANCES 2020; 6:eaay5120. [PMID: 32110730 PMCID: PMC7021497 DOI: 10.1126/sciadv.aay5120] [Citation(s) in RCA: 39] [Impact Index Per Article: 9.8] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/25/2019] [Accepted: 11/25/2019] [Indexed: 05/23/2023]
Abstract
Grippers are widely used for the gripping, manipulation, and assembly of objects with a wide range of scales, shapes, and quantities in research, industry, and our daily lives. A simple yet universal solution is very challenging. Here, we manage to address this challenge utilizing a simple shape memory polymer (SMP) block. The embedding of objects into the SMP enables the gripping while the shape recovery upon stimulation facilitates the releasing. Systematic studies show that friction, suction, and interlocking effects dominate the grip force individually or collectively. This universal SMP gripper design provides a versatile solution to grip and manipulate multiscaled (from centimeter scale down to 10-μm scale) 3D objects with arbitrary shapes, in individual, deterministic, or massive, selective ways. These extraordinary capabilities are demonstrated by the gripping and manipulation of macroscaled objects, mesoscaled steel sphere arrays and microparticles, and the selective and patterned transfer printing of micro light-emitting diodes.
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Bao Y, Hong G, Chen Y, Chen J, Chen H, Song WL, Fang D. Customized Kirigami Electrodes for Flexible and Deformable Lithium-Ion Batteries. ACS APPLIED MATERIALS & INTERFACES 2020; 12:780-788. [PMID: 31849209 DOI: 10.1021/acsami.9b18232] [Citation(s) in RCA: 12] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/10/2023]
Abstract
Customized deformable lithium-ion batteries (LIBs) have attracted interest in the emerging power systems for flexible and wearable electronics. However, a key challenge for developing these batteries is the fabrication of customized deformable electrodes that exhibit strong mechanical tolerance and robust electrochemical performance during deformation. Here, free-standing customized kirigami electrodes for deformable LIBs are fabricated by an evolutionary printing method with universal viscous electrode inks and a customizable polydimethylsiloxane template. The electrodes comprise lithium iron phosphate or lithium titanium oxide nanoparticles with a conductive carbon nanotubes/poly(vinylidene fluoride) scaffold, which is ideal for electron transfer. The compact microstructure and kirigami pattern endow the electrodes with superior mechanical robustness (over 500 stretch-release cycles) and resistance stability both in unstretched and stretched states. Finite element analysis and corresponding experiment tests reveal ultralow strain inside the materials, showing less than 3% strain even under 100% stretch ratio. With 500-times stretched electrodes, the full-cell LIBs can still deliver a considerable discharge capacity of average 94.5 mA h g-1 at 0.3 C after 100 discharge/charge cycles. The integration of such outstanding mechanical stability, excellent electrochemical performance, and simple printing method with accessible starting materials presents promising opportunities for customizing deformable components for flexible energy storage devices.
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Affiliation(s)
- Yinhua Bao
- State Key Laboratory for Turbulence and Complex Systems & Center for Applied Physics and Technology, College of Engineering , Peking University , Beijing 100871 , China
| | - Guangqi Hong
- Institute of Advanced Structure Technology , Beijing Institute of Technology , Beijing 100081 , China
| | - Ya Chen
- Institute of Advanced Structure Technology , Beijing Institute of Technology , Beijing 100081 , China
| | - Jian Chen
- Institute of Advanced Structure Technology , Beijing Institute of Technology , Beijing 100081 , China
| | - Haosen Chen
- Institute of Advanced Structure Technology , Beijing Institute of Technology , Beijing 100081 , China
| | - Wei-Li Song
- Institute of Advanced Structure Technology , Beijing Institute of Technology , Beijing 100081 , China
| | - Daining Fang
- State Key Laboratory for Turbulence and Complex Systems & Center for Applied Physics and Technology, College of Engineering , Peking University , Beijing 100871 , China
- Institute of Advanced Structure Technology , Beijing Institute of Technology , Beijing 100081 , China
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30
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Yang W, Gong Y, Li W. A Review: Electrode and Packaging Materials for Neurophysiology Recording Implants. Front Bioeng Biotechnol 2020; 8:622923. [PMID: 33585422 PMCID: PMC7873964 DOI: 10.3389/fbioe.2020.622923] [Citation(s) in RCA: 19] [Impact Index Per Article: 4.8] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/29/2020] [Accepted: 12/10/2020] [Indexed: 01/28/2023] Open
Abstract
To date, a wide variety of neural tissue implants have been developed for neurophysiology recording from living tissues. An ideal neural implant should minimize the damage to the tissue and perform reliably and accurately for long periods of time. Therefore, the materials utilized to fabricate the neural recording implants become a critical factor. The materials of these devices could be classified into two broad categories: electrode materials as well as packaging and substrate materials. In this review, inorganic (metals and semiconductors), organic (conducting polymers), and carbon-based (graphene and carbon nanostructures) electrode materials are reviewed individually in terms of various neural recording devices that are reported in recent years. Properties of these materials, including electrical properties, mechanical properties, stability, biodegradability/bioresorbability, biocompatibility, and optical properties, and their critical importance to neural recording quality and device capabilities, are discussed. For the packaging and substrate materials, different material properties are desired for the chronic implantation of devices in the complex environment of the body, such as biocompatibility and moisture and gas hermeticity. This review summarizes common solid and soft packaging materials used in a variety of neural interface electrode designs, as well as their packaging performances. Besides, several biopolymers typically applied over the electrode package to reinforce the mechanical rigidity of devices during insertion, or to reduce the immune response and inflammation at the device-tissue interfaces are highlighted. Finally, a benchmark analysis of the discussed materials and an outlook of the future research trends are concluded.
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Affiliation(s)
- Weiyang Yang
- Microtechnology Lab, Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, United States
| | - Yan Gong
- Microtechnology Lab, Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, United States
| | - Wen Li
- Microtechnology Lab, Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, United States
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