Directed assembly-based printing of homogeneous and hybrid nanorods using dielectrophoresis

Electrophoretic Deposition of Single Nanoparticles

The controlled assembly of colloid particles on a solid substrate has always been a major challenge in colloid and surface science. Here we provide an overview of electrophoretic deposition (EPD) of single charge-stabilized nanoparticles. We demonstrate that surface templated EPD (STEPD) assembly, which combines EPD with top-down nanofabrication, allows a wide range of nanoparticles to be built up into arbitrary structures with high speed, scalability, and excellent fidelity. We will also discuss some of the current colloid chemical limitations and challenges in STEPD assembly for sub-10 nm nanoparticles and for the fabrication of densely packed single particle arrays.

Electromagnetic Forces and Torques: From Dielectrophoresis to Optical Tweezers

Electromagnetic forces and torques enable many key technologies, including optical tweezers or dielectrophoresis. Interestingly, both techniques rely on the same physical process: the interaction of an oscillating electric field with a particle of matter. This work provides a unified framework to understand this interaction both when considering fields oscillating at low frequencies─dielectrophoresis─and high frequencies─optical tweezers. We draw useful parallels between these two techniques, discuss the different and often unstated assumptions they are based upon, and illustrate key applications in the fields of physical and analytical chemistry, biosensing, and colloidal science.

Directed Assembly of Nanomaterials for Making Nanoscale Devices and Structures: Mechanisms and Applications

Nanofabrication has been utilized to manufacture one-, two-, and three-dimensional functional nanostructures for applications such as electronics, sensors, and photonic devices. Although conventional silicon-based nanofabrication (top-down approach) has developed into a technique with extremely high precision and integration density, nanofabrication based on directed assembly (bottom-up approach) is attracting more interest recently owing to its low cost and the advantages of additive manufacturing. Directed assembly is a process that utilizes external fields to directly interact with nanoelements (nanoparticles, 2D nanomaterials, nanotubes, nanowires, etc.) and drive the nanoelements to site-selectively assemble in patterned areas on substrates to form functional structures. Directed assembly processes can be divided into four different categories depending on the external fields: electric field-directed assembly, fluidic flow-directed assembly, magnetic field-directed assembly, and optical field-directed assembly. In this review, we summarize recent progress utilizing these four processes and address how these directed assembly processes harness the external fields, the underlying mechanism of how the external fields interact with the nanoelements, and the advantages and drawbacks of utilizing each method. Finally, we discuss applications made using directed assembly and provide a perspective on the future developments and challenges.

Controlled assembly of gold nanoparticles in resonant gold nanoapertures for SERS applications

The controlled assembly of plasmonic nanoparticles is vital for realizing low-cost, high efficiency plasmonic substrates with tunable resonances. Here, we present a strategy to assemble gold nanoparticles (AuNPs) in resonant gold nanoapertures (NAs) to enable coupling-mediated near-field enhancement. The NAs templates are fabricated using shadow sphere lithography on polyelectrolyte (PE) coated substrates. Subsequently, AuNPs are assembled in the resonant NA templates via a simple immersion step. The PE layer, AuNP concentration, NaCl concentration, incubation time, and template thickness are used to control the particle number per aperture and the interparticle distance of the AuNP assemblies. The fabricated AuNP-NA substrates are evaluated for their SERS potential using 4-Mercaptobenzoic acid (MBA) as a Raman reporter molecule. The SERS intensity of the AuNP-NA templates can be enhanced by ten times by controlling the AuNP and NA template parameters as compared to the bare NA templates. Numerical simulations show that the coupling between the various plasmonic modes is crucial for this SERS enhancement. The proposed strategy can be used to fabricate hybrid AuNP-NA based SERS substrates with improved sensitivity.

Droplet-Based Techniques for Printing of Functional Inks for Flexible Physical Sensors

Printed electronics (PE) is an emerging technology that uses functional inks to print electrical components and circuits on variety of substrates. This technology has opened up new possibilities to fabricate flexible, bendable, and form-fitting devices at low-cost and fast speed. There are different printing technologies in use, among which droplet-based techniques are of great interest as they provide the possibility of printing computer-controlled design patterns with high resolution, and greater production flexibility. Nanomaterial inks form the heart of this technology, enabling different functionalities. To this end, intensive research has been carried out on formulating inks with conductive, semiconductive, magnetic, piezoresistive, and piezoelectric properties. Here, a detailed landscape view on different droplet-based printing technologies (inkjet, aerosol jet, and electrohydrodynamic jet) is provided, with comprehensive discussion on their working principals. This is followed by a detailed research overview of different functional inks (metal, carbon, polymer, and ceramic). Different sintering methods and common substrates being used in printed electronics are also discussed, followed by an in-depth review of different physical sensors fabricated by droplet-based techniques. Finally, the challenges facing the field are considered and a perspective on possible ways to overcome them is provided.

High-Rate Printing of Micro/Nanoscale Patterns Using Interfacial Convective Assembly

Printing of electronics has been receiving increasing attention from academia and industry over the recent years. However, commonly used printing techniques have limited resolution of micro- or sub-microscale. Here, a directed-assembly-based printing technique, interfacial convective assembly, is reported, which utilizes a substrate-heating-induced solutal Marangoni convective flow to drive particles toward patterned substrates and then uses van der Waals interactions as well as geometrical confinement to trap the particles in the pattern areas. The influence of various assembly parameters including type of mixing solvent, substrate temperature, particle concentration, and assembly time is investigated. The results show successful assembly of various nanoparticles in patterns of different shapes with a high resolution down to 25 nm. In addition, the assembly only takes a few minutes, which is two orders of magnitude faster than conventional convective assembly. Small-sized (diameter below 5 nm) nanoparticles tend to coalesce during the assembly process and form sintered structures. The fabricated silver nanorods show single-crystal structure with a low resistivity of 8.58 × 10^-5 Ω cm. With high versatility, high resolution, and high throughput, the interfacial convective assembly opens remarkable opportunities for printing next generation nanoelectronics and sensors.