Electrochemical deposition of copper on a gold electrode in sulfuric acid: resolution of the interfacial structure

In Situ Electrochemical Atomic Force Microscopy: From Interfaces to Interphases

The electrochemical interface formed between an electrode and an electrolyte significantly affects the rate and mechanism of the electrode reaction through its structure and properties, which vary across the interface. The scope of the interface has been expanded, along with the development of energy electrochemistry, where a solid-electrolyte interphase may form on the electrode and the active materials change properties near the surface region. Developing a comprehensive understanding of electrochemical interfaces and interphases necessitates three-dimensional spatial resolution characterization. Atomic force microscopy (AFM) offers advantages of imaging and long-range force measurements. Here we assess the capabilities of AFM by comparing the force curves of different regimes and various imaging modes for in situ characterizing of electrochemical interfaces and interphases. Selected examples of progress on work related to the structures and processes of electrode surfaces, electrical double layers, and lithium battery systems are subsequently illustrated. Finally, this review provides perspectives on the future development of electrochemical AFM.

Probe the Dynamic Adsorption and Phase Transition of Underpotential Deposition Processes at Electrode-Electrolyte Interfaces

Electrochemical scanning tunneling microscopy (EC-STM) and electrochemical quartz crystal microbalance (E-QCM) techniques in combination with DFT calculations have been applied to reveal the static phase and the phase transition of copper underpotential deposition (UPD) on a gold electrode surface. EC-STM demonstrated, for the first time, the direct visualization of the disintegration of (√3 × √3)R30° copper UPD adlayer with coadsorbed SO42- while changing sample potential (ES) toward the redox Pa2/Pc2 peaks, which are associated with the phase transition between the Cu UPD (√3 × √3)R30° phase II and disordered randomly adsorbed phase III. DFT calculations show that SO42- binds via three oxygens to the bridge sites of the copper with sulfate being located directly above the copper vacancy in the (√3 × √3)R30° adlayer, whereas the remaining oxygen of the sulfate points away from the surface. E-QCM measurement of the change of the electric charge due to Cu UPD Faradaic processes, the change of the interfacial mass due to the adsorption and desorption of Cu(II) and SO42-, and the formation and stripping of UPD copper on the gold surface provide complementary information that validates the EC-STM and DFT results. This work demonstrated the advantage of using complementary in situ experimental techniques (E-QCM and EC-STM) combined with simulations to obtain an accurate and complete picture of the dynamic interfacial adsorption and UPD processes at the electrode/electrolyte interface.

In Situ and Operando X-ray Scattering Methods in Electrochemistry and Electrocatalysis

Electrochemical and electrocatalytic processes are of key importance for the transition to a sustainable energy supply as well as for a wide variety of other technologically relevant fields. Further development of these processes requires in-depth understanding of the atomic, nano, and micro scale structure of the materials and interfaces in electrochemical devices under reaction conditions. We here provide a comprehensive review of in situ and operando studies by X-ray scattering methods, which are powerful and highly versatile tools to provide such understanding. We discuss the application of X-ray scattering to a wide variety of electrochemical systems, ranging from metal and oxide single crystals to nanoparticles and even full devices. We show how structural data on bulk phases, electrode-electrolyte interfaces, and nanoscale morphology can be obtained and describe recent developments that provide highly local information and insight into the composition and electronic structure. These X-ray scattering studies yield insights into the structure in the double layer potential range as well as into the structural evolution during electrocatalytic processes and phase formation reactions, such as nucleation and growth during electrodeposition and dissolution, the formation of passive films, corrosion processes, and the electrochemical intercalation into battery materials.

X-Ray Scattering and Imaging Studies of Electrode Structure and Dynamics

We will review structures and dynamics of electrode interfaces studied in situ using x-ray scattering and imaging techniques. The examples cover single-crystal and nanocrystal structures relevant to electrocatalytic activities, anodic oxidation and corrosion, aqueous dissolution reactions, surface reconstructions, and surface modifications by under potential deposition. The x-ray techniques include the widely used traditional surface x-ray scattering, such as crystal truncation rods and x-ray reflectivity, as well as recently developed resonance surface scattering, coherent surface x-ray photon correlation spectroscopy, coherent x-ray Bragg diffraction imaging, and surface ptychography. Results relevant to various electrochemical phenomena will be highlighted.

Effect of Concentration on the Electrochemistry and Speciation of the Magnesium Aluminum Chloride Complex Electrolyte Solution

Magnesium batteries offer an opportunity to use naturally abundant Mg and achieve large volumetric capacities reaching over four times that of conventional Li-based intercalation anodes. High volumetric capacity is enabled by the use of a Mg metal anode in which charge is stored via electrodeposition and stripping processes, however, electrolytes that support efficient Mg electrodeposition and stripping are few and are often prepared from highly reactive compounds. One interesting electrolyte solution that supports Mg deposition and stripping without the use of highly reactive reagents is the magnesium aluminum chloride complex (MACC) electrolyte. The MACC exhibits high Coulombic efficiencies and low deposition overpotentials following an electrolytic conditioning protocol that stabilizes species necessary for such behavior. Here, we discuss the effect of the MgCl₂ and AlCl₃ concentrations on the deposition overpotential, current density, and the conditioning process. Higher concentrations of MACC exhibit enhanced Mg electrodeposition current density and much faster conditioning. An increase in the salt concentrations causes a shift in the complex equilibria involving both cations. The conditioning process is strongly dependent on the concentration suggesting that the electrolyte is activated through a change in speciation of electrolyte complexes and is not simply due to the annihilation of electrolyte impurities. Additionally, the presence of the [Mg₂(μ-Cl)₃·6THF]⁺ in the electrolyte solution is again confirmed through careful analysis of experimental Raman spectra coupled with simulation and direct observation of the complex in sonic spray ionization mass spectrometry. Importantly, we suggest that the ∼210 cm^-1 mode commonly observed in the Raman spectra of many Mg electrolytes is indicative of the C_3v symmetric [Mg₂(μ-Cl)₃·6THF]⁺. The 210 cm^-1 mode is present in many electrolytes containing MgCl₂, so its assignment is of broad interest to the Mg electrolyte community.

Monolayer Growth Front of Precious Metals through Insulating Mesoporous Membranes

Monolayers of precious metals are deposited within the pores of insulating mesoporous anodized aluminum oxide (AAO) membranes via a new electrochemical underpotential Cu deposition growth front mechanism, followed by spontaneous galvanic replacement of copper by platinum or iridium as demonstrated by XPS, ICP-OES, conductivity, and current analysis. Applications include fuel cells, hydrogen storage, flow batteries, and electrocatalytic conversions.

Underpotential deposition of Cu on Au(111) from neutral chloride containing electrolyte

The structure of a chloride terminated copper monolayer electrodeposited onto Au(111) from a CuSO₄/KCl electrolyte was investigated ex situ by three complementary experimental techniques (scanning tunneling microscopy (STM), photoelectron spectroscopy (PES), X-ray standing wave (XSW) excitation) and density functional theory (DFT) calculations. STM at atomic resolution reveals a stable, highly ordered layer which exhibits a Moiré structure and is described by a (5 × 5) unit cell. The XSW/PES data yield a well-defined position of the Cu layer and the value of 2.16 Å above the topmost Au layer suggests that the atoms are adsorbed in threefold hollow sites. The chloride exhibits some distribution around a distance of 3.77 Å in agreement with the observed Moiré pattern due to a higher order commensurate lattice. This structure, a high order commensurate Cl overlayer on top of a commensurate (1 × 1) Cu layer with Cu at threefold hollow sites, is corroborated by the DFT calculations.

Real-time observation of interfacial ions during electrocrystallization

Understanding the electrocrystallization mechanisms of metal cations is of importance for many industrial and scientific fields. We have determined the transitional structures during underpotential deposition (upd) of various metal cations on Au(111) electrode using time–resolved surface X–ray diffraction and step–scan IR spectroscopy. At the initial stage of upd, a characteristic intensity transient appears in the time–resolved crystal truncation rod depending on metal cations. Metal cations with relatively high coordination energies of hydration water are deposited in two steps: first, the hydrated metal cations approached the surface and are metastably located at the outer Helmholtz plane, then they are deposited via the destruction of the hydration shell. However, Tl⁺ and Ag⁺, which have low hydration energy, are rapidly adsorbed on Au(111) electrode without any metastable states of dehydration. Therefore, the deposition rate is strongly related to the coordination energy of the hydration water. Metal cations strongly interacting with the counter coadsorbed anions such as Cu²⁺ in sulfuric acid causes the deposition rate to be slower because of the formation of complexes.

Palladium Electrodeposition onto Pt(100): Two-Layer Underpotential Deposition

Electrodeposition of the first Pd layers onto Pt(100) was investigated using cyclic voltammetry at a low scan rate (0.1 mV·s^-1). Ultrathin films were characterized by cyclic voltammetry in 0.1 M H₂SO₄ solution and with ex situ AFM (atomic force microscopy). For the first time, we evidenced the underpotential character of the deposition of the first two Pd layers, characterized by a two-step mechanism, each step corresponding to the deposition of a complete Pd atomic layer. For thicker deposits, especially above 10 monolayers as equivalent thickness, the electrochemical characterization displays a strong irreversibility and a broadening of the adsorption/desorption peaks, associated with a reduction of long-range ordered flat areas. Ex situ AFM images are in agreement with this description. They show rough thick deposits and the growth of (100)-oriented rectangular shaped islands with their sides aligned with the two [011] and [0-11] perpendicular directions of the (100) Pt surface.

Design of Electrodeposited Bilayer Structures for Reliable Resistive Switching with Self-Compliance

Programmable memory characteristics of electrodeposited CuO_x-based resistive random access memory (ReRAM) can be significantly improved by adopting a bilayer structure with a built-in current limiter. To control the on-current and enhance the device uniformity, the bilayer structure of Pt/CuO_x (switching layer)/CuO_x (current limiter)/Pt is proposed. This structure is synthesized by controlling solution pH during electrochemical deposition (ECD). The bilayer structure of Pt/CuO_x (synthesized at pH 9)/CuO_x (synthesized at pH 11.5)/Pt exhibits reliable and uniform self-compliant resistive switching behavior. The origin of resistive switching is attributed to formation and rupture of conductive filaments in the CuO_x (pH 9) layer. However, the CuO_x (pH 11.5) layer acts as the resistor without resistive switching to control the overall resistance in ReRAM. Reversible "on" and "off" switching occurs with a switching time of 100 ns. Devices based on the bilayer structure showed long data retention and good endurance. This simple use of ECD to improve the memory characteristics of electrodeposited ReRAM offers the opportunity to realize reliable and self-compliant memory devices with low-cost solution processes.

Flexible resistive switching memory with a Ni/CuO x /Ni structure using an electrochemical deposition process

Flexible resistive switching memory (ReRAM) devices were fabricated with a Ni/CuO x /Ni structure. Fabrication involved simple and low-cost electrochemical deposition of electrodes and resistive switching layers on a polyethylene terephthalate substrate. The devices exhibited reproducible and reliable ReRAM characteristics. Bipolar resistive switching was observed in flexible Ni/CuO x /Ni-based ReRAM devices with low operation voltages. The reliability of the devices was confirmed by data retention, endurance, and cyclic bending measurements. The processes for fabrication of flexible ReRAM devices were based on simple-solution, bottom-up growth and they can be performed at low temperatures. Therefore, the methods presented in this work could be a viable solution for fabricating flexible non-volatile memory devices in the future.

Study of underpotential deposited Cu layers on Pt(111) and their stability against CO and CO2 in perchloric acid

The underpotential deposition (UPD) of copper on a Pt(111) electrode and the influence of gas coadsorbates, i.e. CO and CO2, on the thus deposited copper layer were studied in a 0.1 M HClO4 electrolyte by means of EC-STM. By UPD, an atomically flat Cu layer is formed, which exhibits a pseudomorphic (1 × 1) structure. However, it contains several point defects due to which its total coverage is less than a monolayer, in agreement with the measured charge density in the CV curves. Upon exposure to a CO-saturated solution the pseudomorphic structure collapses to a coalescent structure with many vacancy islands. This phase transition is induced by the preferential binding of CO to the Pt(111) surface. In contrast, CO2, which binds stronger to copper, does not affect the pseudomorphic structure of the Cu layer.

Adsorption and assembly of ions and organic molecules at electrochemical interfaces: nanoscale aspects

We describe the history of electrochemical scanning tunneling microscopy (STM) and advances made in this field during the past 20 years. In situ STM allows one to monitor various electrode processes, such as the underpotential deposition of copper and silver ions; the specific adsorption of iodine and sulfate/bisulfate ions; electrochemical dissolution processes of silicon and gold single-crystal surfaces in electrolyte solutions; and the molecular assembly of metalloporphyrins, metallophthalocyanines, and fullerenes, at atomic and/or molecular resolution. Furthermore, a laser confocal microscope, combined with a differential interference contrast microscope, enables investigation of the dynamics of electrochemical processes at atomic resolution.

Reversible mechano-electrochemical writing of metallic nanostructures with the tip of an atomic force microscope

We recently introduced a method that allows the controlled deposition of nanoscale metallic patterns at defined locations using the tip of an atomic force microscope (AFM) as a "mechano-electrochemical pen", locally activating a passivated substrate surface for site-selective electrochemical deposition. Here, we demonstrate the reversibility of this process and study the long-term stability of the resulting metallic structures. The remarkable stability for more than 1.5 years under ambient air without any observable changes can be attributed to self-passivation. After AFM-activated electrochemical deposition of copper nanostructures on a polycrystalline gold film and subsequent AFM imaging, the copper nanostructures could be dissolved by reversing the electrochemical potential. Subsequent AFM-tip-activated deposition of different copper nanostructures at the same location where the previous structures were deleted, shows that there is no observable memory effect, i.e., no effect of the previous writing process on the subsequent writing process. Thus, the four processes required for reversible information storage, "write", "read", "delete" and "re-write", were successfully demonstrated on the nanometer scale.

Exploring the first steps in core-shell electrocatalyst preparation: in situ characterization of the underpotential deposition of Cu on supported Au nanoparticles

The underpotential deposition (upd) of a Cu shell on a non-Pt nanoparticle core followed by galvanic displacement of the Cu template shell to form core–shell electrocatalyst materials is one means by which the Pt-based mass activity targets required for commercialization of PEM fuel cells may be reached. In situ EXAFS measurements were conducted at both the Au L₃ and the Cu K absorption edges during deposition of Cu onto a carbon-supported Au electrocatalyst to study the initial stages of formation of such a core–shell electrocatalyst. The Au L₃ EXAFS data obtained in 0.5 mol dm^–3 H₂SO₄ show that the shape of the Au core is potential dependent, from a flattened to a round spherical shape as the Cu upd potential is approached. Following the addition of 2 mmol dm^–3 Cu, the structure was also measured as a function of the applied potential. At +0.2 V vs Hg/Hg₂SO₄, the Cu²⁺ species was found to be a hydrated octahedron. As the potential was made more negative, single-crystal studies predict an ordered bilayer of sulfate anions and partially discharged Cu ions, followed by a complete/uniform layer of Cu atoms. In contrast, the model obtained by fitting the Au L₃ and Cu K EXAFS data corresponds first to partially discharged Cu ions deposited at the defect sites in the outer shell of the Au nanoparticles at −0.42 V, followed by the growth of clusters of Cu atoms at −0.51 V. The absence of a uniform/complete Cu shell, even at the most negative potentials investigated, has implications for the structure, and the activity and/or stability, of the core–shell catalyst that would be subsequently formed following galvanic displacement of the Cu shell.

The atomic force microscope as a mechano-electrochemical pen

We demonstrate a method that allows the controlled writing of metallic patterns on the nanometer scale using the tip of an atomic force microscope (AFM) as a "mechano-electrochemical pen". In contrast to previous experiments, no voltage is applied between the AFM tip and the sample surface. Instead, a passivated sample surface is activated locally due to lateral forces between the AFM tip and the sample surface. In this way, the area of tip-sample interaction is narrowly limited by the mechanical contact between tip and sample, and well-defined metallic patterns can be written reproducibly. Nanoscale structures and lines of copper were deposited, and the line widths ranged between 5 nm and 80 nm, depending on the deposition parameters. A procedure for the sequential writing of metallic nanostructures is introduced, based on the understanding of the passivation process. The mechanism of this mechano-electrochemical writing technique is investigated, and the processes of site-selective surface depassivation, deposition, dissolution and repassivation of electrochemically deposited nanoscale metallic islands are studied in detail.

STM Studies of Electrode/Electrolyte Interfaces and Silicon Surface Reactions in Controlled Atmospheres

We have assembled a scanning tunneling microscope with an inverted sample that allows the sample surface to be contacted by fluid electrolytes in a controlled atmosphere. A hanging meniscus is formed between the sample and a small cup surrounding the tunneling tip. In-situ imaging of the electrode/electrolyte interface is conveniently achieved with clean samples under potentiostatic control. The functioning of the microscope is illustrated by the imaging of the electrodeposition of copper on gold. This microscope has been used to image hydrogen-terminated silicon surfaces and to demonstrate that islands, tentatively assigned as silicon oxide, are formed on rinsing in water but can be avoided if the surface is not rinsed on withdrawal from the ammonium fluoride etching solution. Finally, STM shows that the convenient, gas-phase photochlorination of H-Si(111) produces the simple Cl-Si(111)(1×1) structure with little or no etching of the silicon surface.

The Initial Stages of Metal Deposition on Metal and Semiconductor Electrodes Studied byIn SituStm

The deposition of Cu onto Au(100) and of Pb onto n- Si(111) electrodes from aqueous solutions has been monitoredin situby scanning tunneling microscopy. In the first case, a bcc structure of the Cu overlayer is observed, which allows pseudomorphic growth on Au(100) up to the 10th layer. Then a slow structural transition to fee begins. In contrast, Pb on Si(111) is shown to deposit as 3D crystallites with flat (111) terminated surfaces.

Catalytically active structure of Bi deposited on a Au(111) electrode for the hydrogen peroxide reduction reaction

The surface structure of underpotentially deposited Bi has been determined on Au(111) in perchloric acid solution using surface X-ray diffraction (SXD), scanning tunneling microscopy (STM), and density functional theory (DFT) calculations. SXD analysis and STM images reveal that the catalytically active structure for the hydrogen peroxide reduction reaction (HPRR) is the (2 x 2)-Bi honeycomb structure with theta(Bi) = 0.50. The stability is supported by DFT calculations. The hydrated perchlorate anion is located in the center of the honeycomb structure without hydrogen peroxide. DFT calculations predict that the Bi honeycomb structure promotes the dissociation of the O-O bond of hydrogen peroxide. Hydrogen peroxide expels the hydrated perchlorate anion, and then HPRR takes place at the honeycomb center.

On a New Phase Transition in the Cu/Au(111)/H2SO4 System

A new pair of current spikes has been found in the cyclic voltammogram of Au(111) in an acidic copper sulphate solution, indicative of a phase transition in the Cu adlayer. The spike potential is well inside the bulk deposition region and hence, the new feature can be observed only at low Cu++ concentration, when bulk deposition is slow. The charge under the spike correlates linearly with extent of the (√3 × √3)R30° structure, up to 40μCcm-2 for the fully developed superstructure. The spike potential shifts with the sulphate concentration and hence, this feature is assigned to the desorption of sulphate from the well-known honey comb structure of the Cu upd layer.

Nanotribology under electrochemical conditions: influence of a copper (sub)monolayer deposited on single crystal electrodes on friction forces studied with atomic force microscopy

Friction force measurements performed by means of an atomic force microscope (AFM) under electrochemical conditions on a pure Au(111) electrode surface and one modified with a foreign metal are presented; after deposition of a (sub)monolayer copper on a Au(111) single crystal electrode a large increase of the friction force is observed compared to the pure Au(111) electrode surface; the extent of the increase not only depends on the copper coverage, but also on the normal load and may be explained by a higher energy dissipation due to motion of the sulfate anions adsorbed on the copper atoms induced by the AFM tip.

Copper sulfide nanostripe patterns at the Au(111)/electrolyte interface studied by in situ STM

One monolayer of Cu was prepared on Au(111) by underpotential deposition from CuSO4/H2SO4 solution and, by two electrolyte exchanges for (i) Cu-free H2SO4 and (ii) NaOH/Na2S solution, exposed to bisulfide. This procedure leads to several incommensurate phases with characteristic stripe patterns. These are irreversibly displaced upon cathodic potential sweeps by different structures, which, after returning to the initial potential, transform into the rectangular CuxS phase already known for the sulfidation of a Cu submonolayer on Au(111).

Platinum Nanofilm Formation by EC-ALE via Redox Replacement of UPD Copper: Studies Using in-Situ Scanning Tunneling Microscopy

The growth of Pt nanofilms on well-defined Au(111) electrode surfaces, using electrochemical atomic layer epitaxy (EC-ALE), is described here. EC-ALE is a deposition method based on surface-limited reactions. This report describes the first use of surface-limited redox replacement reactions (SLR(3)) in an EC-ALE cycle to form atomically ordered metal nanofilms. The SLR(3) consisted of the underpotential deposition (UPD) of a copper atomic layer, subsequently replaced by Pt at open circuit, in a Pt cation solution. This SLR(3) was then used a cycle, repeated to grow thicker Pt films. Deposits were studied using a combination of electrochemistry (EC), in-situ scanning tunneling microscopy (STM) using an electrochemical flow cell, and ultrahigh vacuum (UHV) surface studies combined with electrochemistry (UHV-EC). A single redox replacement of upd Cu from a PtCl(4)(2-) solution yielded an incomplete monolayer, though no preferential deposition was observed at step edges. Use of an iodine adlayer, as a surfactant, facilitated the growth of uniformed films. In-situ STM images revealed ordered Au(111)-(square root 3 x square root 3)R30 degrees-iodine structure, with areas partially distorted by Pt nanoislands. After the second application, an ordered Moiré pattern was observed with a spacing consistent with the lattice mismatch between a Pt monolayer and the Au(111) substrate. After application of three or more cycles, a new adlattice, a (3 x 3)-iodine structure, was observed, previously observed for I atoms adsorbed on Pt(111). In addition, five atom adsorbed Pt-I complexes randomly decorated the surface and showed some mobility. These pinwheels, planar PtI(4) complexes, and the ordered (3 x 3)-iodine layer all appeared stable during rinsing with blank solution, free of I(-) and the Pt complex (PtCl(4)(2-)).

Anion adsorption induced reversal of coherency strain

Experimental results are presented for stress evolution, in vacuum and electrolyte, for the first monolayer of Cu on Au(111). In electrolyte the monolayer is pseudomorphic and the stress-thickness change is -0.60 N/m, while conventional epitaxy theory predicts a value of +7.76 N/m. In vacuum, the monolayer is incoherent with the underlying gold. Using a combination of first-principles based calculations and molecular dynamic simulations we analyzed these results and demonstrate that in electrolyte, overlayer coherency is maintained owing to anion adsorption.

Role of the anion in the underpotential deposition of cadmium on a Rh(111) electrode: probed by voltammetry and in situ scanning tunneling microscopy

In situ scanning tunneling microscopy (STM) and cyclic voltammetry (CV) were employed to examine the underpotential deposition (UPD) of cadmium on a rhodium(111) electrode in sulfuric and hydrochloric acids. The (bi)sulfate and chloride anions in the electrolytes played a main role in controlling the number and arrangement of Cd adatoms. Deposition of Cd along with hydrogen adsorption occurred near 0.1 V (vs reversible hydrogen electrode) in either 0.05 M H2SO4 or 0.1 M HCl containing 1 mM Cd(ClO4)2. These coupled processes resulted in an erroneous coverage of Cd adatoms. The process of Cd deposition shifted positively to 0.3 V and thus separated from that of hydrogen in 0.05 M H2SO4 containing 0.5 M Cd2+. The amount of charge (80 microC/cm2) for Cd deposition in 0.5 M Cd2+ implied a coverage of 0.17 for the Cd adatoms, which agreed with in situ STM results. Regardless of [Cd2+], in situ STM imaging revealed a highly ordered Rh(111)-(6 x 6)-6Cd + HSO4- or SO42- structure in sulfuric acid,. In hydrochloric acid, in situ STM discerned a (2 x 2)-Cd + Cl structure at potentials where Cd deposition commenced. STM atomic resolution showed roughly one-quarter of a monolayer of Cd adatoms were deposited, ca. 50% more than in sulfuric acid. Dynamic in situ STM imaging showed potential dependent, reversible transformations between the (6 x 6) Cd adlattices and (square root 3 x square root 7)-(bi)sulfate structure, and between (2 x 2) and (square root 7 x square root 7)R19.1 degrees -Cl structures. The fact that different Cd structures observed in H2SO4 and HCl entailed the involvement of anions in Cd deposition, i.e. (bi)sulfate and chloride anions were codeposited with Cd adatoms on Rh(111).