A computer vision-based system for real-time component identification from waste printed circuit boards

With an exponential increase in consumers' need for electronic products, the world is facing an ever-increasing economic and environmental threat of electronic waste (e-waste). To minimize their adverse effects, e-waste recycling is one of the pivotal factors that can help in minimizing the environmental pollution andto increase recovery of valuable materials. For instance, Printed Circuit Boards (PCBs), while they have several valuable elements, they are hazardous too; and therefore, they form a large chunk of e-waste being generated today. Thus, in recycling PCBs, Electronic Components (ECs) are segregated at first, and separately processed for recovering key elements that could be re-used. However, in the current recycling process, especially in developing nations, humans manually screen ECs, which goes on to affect their health. It also causes losses of valuable materials. Therefore, automated solutions need to be adopted for both to classify and to segregate ECs from waste PCBs. The study proposes a robust EC identification system based on computer vision and deep learning algorithms (YOLOv3) to automate sorting process which would help in further processing. The study uses a publicly available dataset, and a PCB dataset which reflect challenging recycling environments like lighting conditions, cast shadows, orientations, viewpoints, and different cameras/resolutions. The outcome of YOLOv3 detection model based on training of both datasets presents satisfactory classification accuracy and capability of real-time competent identification, which in turn, could help in automatically segregating ECs, while leading towards effective e-waste recycling.

The Use of PCB Scrap in the Reduction in Metallurgical Copper Slags

The article presents the results of a study on metallurgical sludge reduction using electronic waste such as Printed Circuit Boards (PCBs). Two aspects were taken into account when selecting such a reducer, namely the environmental aspect and the technological aspect. The research was an attempt to use waste metal-bearing material of which the effective management causes many problems from an environmental point of view. In the technological aspect, the specific chemical composition of this waste was taken into account. Its gasification yields significant amounts of hydrocarbons, which are excellent reducing agents in such process. The separation of these compounds may additionally cause the mixing of the molten slag, which should result in faster separation of the formed metal droplets and the molten slag. In the case of the fragmented PCB (Printed Circuit Board) reducer used in this study, a significant degree of copper removal was achieved, as much as 92%. As the reduction-process time increased, the degree of copper removal also increased. For the 1 h process, the average value of copper removal was 60%, and for the 4.5 h process it was over 70%. The case was the same with the addition of reductant: as the amount of reductant added to the process increased, an increase in copper removal was observed. With the addition of 30 g of the reducing agent (per 65 g of slag), the degree of copper removal was over 90%.

Morphology, Phase and Chemical Analysis of Leachate after Bioleaching Metals from Printed Circuit Boards

The article presents the assessment of solutions and dried residues precipitated from solutions after the bioleaching process of Printed Circuit Boards (PCB) utilizing the Acidithiobacillus ferrooxidans. The obtained dried residues precipitated from bioleaching solution (leachate) and control solution were tested using morphology, phase, and chemical composition analysis, with particular emphasis on the assessment of crystalline and amorphous components. The analysis of the dried residues from leachate after bioleaching as well as those from the sterile control solution demonstrated a difference in the component oxidation—the leachate consisted of mainly amorphous spherical particles in diameter up to 200 nm, forming lacy aggregates. In the specimenform control solution larger particles (up to 500 nm) were observed with a hollow in the middle and crystalline outer part (probably Fe2O3, CuFeS2, and Cu2O). The X-ray diffraction phase analysis revealed that specimen obtained from leachate after bioleaching consisted mainly of an amorphous component and some content of Fe2O3 crystalline phase, while the dried residue from control solution showed more crystalline components. The share of the crystalline and amorphous components can be related to efficiency in dissolving metals during bioleaching. Obtained results of the investigation confirm the activity and participation of the A. ferrooxidans bacteria in the solubilization process of electro-waste components, with their visible degradation–acceleration of the reaction owing to a continuous regeneration of the leaching medium. The performed investigations allowed to characterize the specimen from leachate and showed that the application of complementary cross-check of the micro (SEM and S/TEM) and macro (ICP-OES and XRD) methods are of immense use for complete guidance assessment and obtained valuable data for the next stages of PCBs recycling.

Recycling Non-Metallic Powder of Waste Printed Circuit Boards to Improve the Performance of Asphalt Material

Non-metallic fractions (NMFs) from waste printed circuit boards (PCBs) are mostly composed of cured resin and fiber. In this study, NMF material from a PCB was ground into powder and added into matrix asphalt to produce PCB-NMF-modified asphalt. To improve the compatibility of PCB-NMF and asphalt, a compatibilizer consisting of tung oil and glycerol was also developed. The optimum compatibilizer content was determined to be 8% by weight of the PCB-NMF through a series of laboratory tests, including the softening point, penetration, ductility, and softening point difference (SPD). The micro-mechanism of NMF powder-modified asphalt was analyzed through Fourier transform infrared spectroscopy (FTIR) and a scanning electron microscope test (SEM). The performances of PCB-NMF-modified asphalt were evaluated by the dynamic shear rheology (DSR) test and the low-temperature bending beam rheometer (BBR) test. The optimum compatibilizer content was 8% by weight of the NMF powder and the optimum content of NMF powder was determined to be 30% by weight of the asphalt based on a comprehensive evaluation. The results show that PCB-NMF can significantly improve stiffness, rutting resistance, high-temperature stability, and temperature sensitivity of asphalt material at an appropriate content. The BBR tests revealed that PCB-NMF slightly weakened the cracking resistance of asphalt at low temperatures. The SEM test showed that the addition of a compatibilizer can increase the compatibility by making the NMF powder evenly dispersed. The FTIR test results implied that a chemical reaction may not have happened between PCB-NMF, compatibilizer, and the matrix asphalt. Overall, it is a promising and sustainable way to utilize PCB-NMF as a modifier for asphalt material and reduce electronic waste treatment at a low cost.

Metals extraction processes from electronic waste: constraints and opportunities

The skyrocketing demand and progressive technology have increased our dependency on electrical and electronic devices. However, the life span of these devices has been shortened because of rapid scientific expansions. Hence, massive volumes of electronic waste (e-waste) is generating day by day. Nevertheless, the ongoing management of e-waste has emerged as a major threat to sustainable economic development worldwide. In general, e-waste contains several toxic substances such as metals, plastics, and refractory oxides. Metals, particularly lead, mercury, nickel, cadmium, and copper along with some valuable metals such as rare earth metals, platinum group elements, alkaline and radioactive metal are very common; which can be extracted before disposing of the e-waste for reuse. In addition, many of these metals are hazardous. Therefore, e-waste management is an essential issue. In this study, we critically have reviewed the existing extraction processes and compared among different processes such as physical, biological, supercritical fluid technologies, pyro and hydrometallurgical, and hybrid methods used for metals extraction from e-waste. The review indicates that although each method has particular merits but hybrid methods are eco-friendlier with extraction efficiency > 90%. This study also provides insight into the technical challenges to the practical realization of metals extraction from e-waste sources.

Recovery of Non-Ferrous Metals from PCBs Scrap by Liquation from Lead

This article presents the results of research on the recycling of non-ferrous metals from PCB scrap using melting in metallic lead. The idea of this process is to dissolve (transfer) metals from PCB scrap in lead, and then liquation them by cooling the lead-metals alloy. PCB scrap was crushed and then melted into liquid lead. The lead after process was then poured into the casting mold and its chemical composition was examined. Among the various metals in the PCB scrap, copper and tin in particular are dissolved in lead. The more scrap dissolved in lead, the higher the concentration of copper and tin in the alloy. The highest obtained concentration of copper in lead were about 2.2 wt.%, and for tin about 0.8 wt.%.

A Comparative Analysis of Computer-Aided Design Tools for Complex Power Electronics Systems

Companies working on semiconductors must currently assure the customers of not only the performance of the semiconductor device per se, but also its performance when it is implemented in a real board, therefore including the role of parasitic effects. It is therefore very important to evaluate, especially during the design phase, not only the single device, but the complete board and their mutual interactions. This consideration opens a new area of investigation in the field of electronic systems engineering. In the current literature, the problem of a software evaluation of parasitic dynamics and electromagnetic effects on printed boards is addressed from the point of view of researchers. Moreover, it is fundamental to have a complete view of the various tools that could be usefully adopted from the perspective of manufacturers. This is the main motivation of this technical note, which performs a comparative analysis of the most prominent software tools for printed circuit boards’ (PCBs) simulation. The main features, the key aspects, and the limitations of the software packages are analyzed in terms of the industrial design of power electronics devices, in order to ensure efficiency and fastness in the semiconductor market.

O2-enriched microbial activity with pH-sensitive solvo-chemical and electro-chlorination strategy to reclaim critical metals from the hazardous waste printed circuit boards

An innovative process integration for the sustainable recovery of critical metals from waste printed circuit boards (WPCBs) is demonstrated. In the acid pre-treatment of WPCBs, > 95% of highly toxic metals lead and tin could dissolve after 240 min of contact in 4.0 mol L^-1 HNO₃. Thereafter, the microbial activity of Sulfobacillus thermosulfidooxidans (strain RDB) under intense aeration is found favorable for base metals' liberation. ~92% copper, 89% nickel, and 93% zinc get extracted at the optimal condition of O₂-mixed-aeration, 30%; pulp density, 10 g L^-1; aeration rate, 0.5 L min^-1; sulfur dosage, 2%; temperature, 45 °C; and duration, 21 days. Quantitative separation of base metals is achieved using ketoxime as a function of equilibrium pH that yielding pH_0.5 order: Cu (1.45) < Ni (5.7) < Zn (8.1). The residual gold from WPCBs is uniquely leached (~99% efficiency) in brine solution (2.0 mol L^-1 NaCl) under the electro-chlorination rate, 0.62 mmol min^-1; dissolution pH, 1.0; pulp density, 20 g L^-1; temperature, 30 °C; and time, 60 min. Subsequently, gold from brine solution is solvated with tri-butyl-phosphate at pH_eq, ≤ 0.5, forming [2(RP=O)·HAuCl₄·H₂O]¯ complex in the organic phase. Finally, > 99% of high-purity gold is stripped from loaded organic while contacting ammoniacal thiosulfate solution in two-stages of counter-current flow.

Bioleaching: urban mining option to curb the menace of E-waste challenge

Resource Recovery from Waste Electronics has emerged as one of the most imperative processes due to its pressing challenges all over the world. The Printed Circuit Board (PCB) is one of the typical E-waste components that comprise large varieties of metals and nonmetals. Urban Mining of these metals has received major attention all over the world. The existing treatment procedures used extensively for the resource extraction are hydrometallurgy and pyro-metallurgy and crude recycling practices in the informal sector. However, these methods are prone to cause secondary pollutants with certain drawbacks. Also, the existing informal recycling procedures resulted in insignificant occupational health hazards and severe environmental threats. The application of biotechnology is extensively exploited for metal extraction and emerged as one of the sustainable and eco-friendly tools. However, a limited field-scale study is prevailing in the realm of resource recovery from E-waste using bioleaching method. Hence, the application of bioleaching requires more attention and technical know-how in developing countries to curtail crude practices. The application of bioleaching in E-waste, including its available methods, kinetics mechanism associated opportunities, and barriers, have been discussed in this paper. A glance of E-waste management in India and the menace of 95% crude E-waste recycling are also elaborated. The incentives toward profit, socio-economic, and environmentally sustainable approaches have been delineated based on critical analysis of the available literature.

Highly Thermally Stable, Green Solvent Disintegrable, and Recyclable Polymer Substrates for Flexible Electronics

Flexible electronics require its substrate to have adequate thermal stability, but current thermally stable polymer substrates are difficult to be disintegrated and recycled; hence, generate enormous electronic solid waste. Here, a thermally stable and green solvent-disintegrable polymer substrate is developed for flexible electronics to promote their recyclability and reduce solid waste generation. Thanks to the proper design of rigid backbones and rational adjustments of polar and bulky side groups, the polymer substrate exhibits excellent thermal and mechanical properties with thermal decomposition temperature (T_d,5% ) of 430 °C, upper operating temperature of over 300 °C, coefficient of thermal expansion of 48 ppm K^-1 , tensile strength of 103 MPa, and elastic modulus of 2.49 GPa. Furthermore, the substrate illustrates outstanding optical and dielectric properties with high transmittance of 91% and a low dielectric constant of 2.30. Additionally, it demonstrates remarkable chemical and flame resistance. A proof-of-concept flexible printed circuit device is fabricated with this substrate, which demonstrates outstanding mechanical-electrical stability. Most importantly, the substrate can be quickly disintegrated and recycled with alcohol. With outstanding thermally stable properties, accompanied by excellent recyclability, the substrate is particularly attractive for a wide range of electronics to reduce solid waste generation, and head toward flexible and "green" electronics.

Microorganisms and Plants in the Recovery of Metals from the Printed Circuit Boards of Computers and Cell Phones: A Mini Review

Most electrical and electronic equipment contain a printed circuit board (PCB), which is the board on which microelectronic components are mounted. The PCBs of obsolete and discarded electrical and electronic equipment are a material of great value due to their high metal content that is of commercial importance (i.e., Au, Ag, Pd, Pt, Ir, Ti, Ge, Si, Al, Cu, Ni, Zn, Fe, Sn, As, and Pb). Hydrometallurgical and pyrometallurgical methods have been used to extract metals from PCBs; however, these methods have energy and environmental disadvantages, which is why in recent years sustainable alternatives have been sought. Among these alternatives are the biological methods that contemplate the use of microorganisms and plants to recover metals from PCBs. In this review, only studies specifying the use of bacteria, fungi, and plants in the recovery of metals from the PCBs of computers and cell phones were considered, since the metallic composition of these plates varies according to the electronic equipment. In addition, the challenges and recommendations for these biotechnological processes to be improved and implemented at the industrial level in the coming years are discussed.

Advanced Recovery Techniques for Waste Materials from IT and Telecommunication Equipment Printed Circuit Boards

Waste from information technology (IT) and telecommunication equipment (WITTE) constitutes a significant fraction of waste from electrical and electronic equipment (WEEE). The presence of rare metals and hazardous materials (e.g., heavy metals or flame retardants) makes the necessary recycling procedures difficult and expensive. Important efforts are being made for Waste Printed Circuit Board (WPCB) recycling because, even if they only amount to 5–10% of the WITTE weight, they constitute up to 80% of the recovered value. This paper summarizes the recycling techniques applicable to WPCBs. In the first part, dismantling and mechanical recycling techniques are presented. Within the frame of electro-mechanical separation technology, the chain process of shredding, washing, and sieving, followed by one or a combination of magnetic, eddy current, corona electrostatic, triboelectrostatic, or gravity separation techniques, is presented. The chemical and electrochemical processes are of utmost importance for the fine separation of metals coming from complex equipment such as WPCBs. Thermal recycling techniques such as pyrolysis and thermal treatment are presented as complementary solutions for achieving both an extra separation stage and thermal energy. As the recycling processes of WPCBs require adequate, efficient, and ecological recycling techniques, the aim of this survey is to identify and highlight the most important ones. Due to the high economic value of the resulting raw materials relative to the WPCBs’ weight and composition, their recycling represents both a necessary environmental protection action, as well as an economic opportunity.

Physical and thermal processing of Waste Printed Circuit Boards aiming for the recovery of gold and copper

The recovery of electronic waste to obtain secondary raw materials is a subject of high relevance in the context of circular economy. Accordingly, the present work relies on the evaluation of mining separation/concentration techniques (comminution, size screening, magnetic separation and gravity concentration) alone as well as combined with thermal pre-treatment to recover gold and copper from Waste Printed Circuit Boards. For that purpose, Waste Printed Circuit Boards were subjected to physical processing (comminution, size screening in 6 classes from <0.425 mm to > 6.70 mm, magnetic separation and gravity concentration) alone and combined with thermal treatment (200-500 °C), aiming the recovery of gold and copper. Mixed motherboards and graphic cards (Lot 1 and 3) and highly rich components (connectors separated from memory cards, Lot 2) were analyzed. Gold and copper concentrations were determined before and after treatment. Before treatment, concentrations from 0.01 to 0.6 % wt. and from 9 to 20 % wt. were found for gold and copper respectively. The highest concentrations were observed in the size fractions between 0.425 and 1.70 mm. The highest copper concentration was around 35 % wt. (class 0.425-0.85 mm) and when analyzing memory card connectors alone, gold concentrations reached almost 2% in the same class, reflecting the interest of separating such components. The physical treatment alone was more effective for Lot 1/3, compared to Lot 2, allowing recoveries of 67 % wt. and 87 % wt. for gold and copper respectively, mostly due to differences in particles size and shape. The thermal treatment showed unperceptive influence on gold concentration but significant effect for copper concentration, mostly attributed to the size of the copper particles. Concentrations increased in a factor of around 10 when the thermal treatment was performed at 300 °C for the larger particles (1.70-6.70 mm); the best results were obtained at 400 °C for the other sizes, when the highest rate of thermal decomposition of the material occurred.

The stripping effect of using high voltage electrical pulses breakage for waste printed circuit boards

In this study, high voltage electrical pulses were utilized to process waste printed circuit boards to cost effectively liberate metal and nonmetal materials. Relative mass ω_iand particles content η_iindexes were defined to assess the stripping effect produced by high voltage electrical pulses breakage. For relative mass level in the 0-10% range, in the -6+3 mm fraction, particles content accounted for 84.84% of the total particles, while the mechanical crushing only occupied 8.84%. Voltage and pulse experiments were carried out to investigate the crushing effect of high voltage electrical pulse breakage for printed circuit boards. It was found that when the voltage and pulse number was at 160 kV and 300, the stripping rate of copper was 98.56% and 92.58% in the -25+13 mm fraction respectively. The measured bending strength of the material revealed the selective crushing effect of high voltage electrical pulses in the different material interfaces. A liberation mechanism was elaborated by using the energy band theory, and a process model was utilized to reveal the mode of crushing. Furthermore, the microscopic appearance of the resulting product confirmed that copper underwent high-temperature melting, while the resin was decomposed during the crushing process. Compared to conventional mechanical crushing process, high voltage electrical pulses can better liberate metal-bearing than mechanical comminution technology.

Comprehensive characterization of printed circuit boards of various end-of-life electrical and electronic equipment for beneficiation investigation

Comprehensive characterization of printed circuit board (PCB) of end-of-life electrical and electronic equipment (EEE) is obligatory for prospective profitable beneficiation. In this study, beneficiation oriented comprehensive characterization of two brands of PCBs each of 16 end-of-life EEE was conducted in terms of their physicochemical characteristics with special emphasis on the content of 16 general elements, 2 precious metals and 15 rare earth elements (REEs). General elements and their highest weight percent composition found in different PCBs of the EEEs were Cu (23% in laptop), Al (6% in computer), Pb (15% in DVD player) and Ba (7% in TV). The high abundant of precious metals such as Au (316 g/ton) and Ag (636 g/ton) in mobile phone and laptop, respectively coupled with rapid obsolescence age makes waste PCBs of information technology and telecommunication equipment the most potent resource reservoir. Additionally, most of the waste PCBs were observed to contain REEs in considerable quantity with Sc up to 31 g/ton and Ce up to 13 g/ton being the major constituents. Comprehensive characterization of waste PCBs therefore will systematically help towards better understanding of e-waste recycling processes for beneficiation purpose and sustainable resource circulation and conservation.

Qualitative and quantitative metals liberation assessment for characterization of various waste printed circuit boards for recycling

Metals liberation and composition are decisive attributes in characterization of e-waste for metal recycling. Though end-of-life printed circuit board (PCB) is an integral part of e-waste as secondary resource reservoir, yet no standardized procedure exists for metals liberation and dissolution for its characterization. Thus, the paper aims at assessment of metals liberation upon comminution employing scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM-EDS) followed by comparative assessment of the existing United States Environmental Protection Agency (USEPA) digestion procedures, viz., USEPA 3050B, USEPA 3051A, and USEPA 3052, in effective dissolution of metals from comminuted particles of waste PCBs of computer, laptop, mobile phone, and television. Effect of comminution and digestion conditions was assessed to have significant role in metal liberation and dissolution from PCBs. The SEM-EDS analysis demonstrated partial release of metals from the silica matrix of PCBs. The USEPA digestion methods showed statistically significant (P < 0.05) difference with greater dissolution of metals complexed to PCB matrix by the USEPA 3052 method owing to use of strong acid like hydrofluoric acid. Base metals like Cu and Zn and toxic metals such as Pb and Cd were present in abundance in PCBs and in general exceeded the total threshold limit concentration (TTLC). The maximum contents of Cu (20.13 ± 0.04 wt.%) and Zn (1.89 ± 0.05 wt.%) in laptop PCBs, Pb (2.26 ± 0.08 wt.%) in TV PCBs, and Cd (0.0812 ± 0.0008 wt.%) in computer PCBs were observed.

Selective thermal transformation of old computer printed circuit boards to Cu-Sn based alloy

This study investigates, verifies and determines the optimal parameters for the selective thermal transformation of problematic electronic waste (e-waste) to produce value-added copper-tin (Cu-Sn) based alloys; thereby demonstrating a novel new pathway for the cost-effective recovery of resources from one of the world's fastest growing and most challenging waste streams. Using outdated computer printed circuit boards (PCBs), a ubiquitous component of e-waste, we investigated transformations across a range of temperatures and time frames. Results indicate a two-step heat treatment process, using a low temperature step followed by a high temperature step, can be used to produce and separate off, first, a lead (Pb) based alloy and, subsequently, a Cu-Sn based alloy. We also found a single-step heat treatment process at a moderate temperature of 900 °C can be used to directly transform old PCBs to produce a Cu-Sn based alloy, while capturing the Pb and antimony (Sb) as alloying elements to prevent the emission of these low melting point elements. These results demonstrate old computer PCBs, large volumes of which are already within global waste stockpiles, can be considered a potential source of value-added metal alloys, opening up a new opportunity for utilizing e-waste to produce metal alloys in local micro-factories.

Comparative assessment of metallurgical recovery of metals from electronic waste with special emphasis on bioleaching

Waste electrical and electronic equipment (WEEE) or electronic waste (e-waste) is one of the fastest growing waste streams in the urban environment worldwide. The core component of printed circuit board (PCB) in e-waste contains a complex array of metals in rich quantity, some of which are toxic to the environment and all of which are valuable resources. Therefore, the recycling of e-waste is an important aspect not only from the point of waste treatment but also from the recovery of metals for economic growth. Conventional approaches for recovery of metals from e-waste, viz. pyrometallurgical and hydrometallurgical techniques, are rapid and efficient, but cause secondary pollution and economically unviable. Limitations of the conventional techniques have led to a shift towards biometallurgical technique involving microbiological leaching of metals from e-waste in eco-friendly manner. However, optimization of certain biotic and abiotic factors such as microbial species, pH, temperature, nutrients, and aeration rate affect the bioleaching process and can lead to profitable recovery of metals from e-waste. The present review provides a comprehensive assessment on the metallurgical techniques for recovery of metals from e-waste with special emphasis on bioleaching process and the associated factors.

Recovery of metals and nonmetals from electronic waste by physical and chemical recycling processes

This paper reviews the existing and state of art knowledge for electronic waste (e-waste) recycling. Electrical and/or electronic devices which are unwanted, broken or discarded by their original users are known as e-waste. The main purpose of this article is to provide a comprehensive review of e-waste problem, strategies of e-waste management and various physical, chemical and metallurgical e-waste recycling processes, their advantages and disadvantages towards achieving a cleaner process of waste utilization, with special attention towards extraction of both metallic values and nonmetallic substances. The hazards arise from the presence of heavy metals Hg, Cd, Pb, etc., brominated flame retardants (BFRs) and other potentially harmful substances in e-waste. Due to the presence of these substances, e-waste is generally considered as hazardous waste and, if improperly managed, may pose significant human and environmental health risks. This review describes the potential hazards and economic opportunities of e-waste. Firstly, an overview of e-waste/printed circuit board (PCB) components is given. Current status and future perspectives of e-waste/PCB recycling are described. E-waste characterization, dismantling methods, liberation and classification processes are also covered. Manual selective dismantling after desoldering and metal-nonmetal liberation at -150μm with two step crushing are seen to be the best techniques. After size reduction, mainly physical separation processes employing gravity, electrostatic, magnetic separators, froth floatation, etc. have been critically reviewed here for separation of metals and nonmetals, along with useful utilizations of the nonmetallic materials. The recovery of metals from e-waste material after physical separation through pyrometallurgical, hydrometallurgical or biohydrometallurgical routes is also discussed along with purification and refining. Suitable PCB recycling flowsheets for industrial applications are also given. It seems that hydrometallurgical route will be a key player in the base and precious metals recoveries from e-waste. E-waste recycling will be a very important sector in the near future from economic and environmental perspectives. Recycling technology aims to take today's waste and turn it into conflict-free, sustainable polymetallic secondary resources (i.e. Urban Mining) for tomorrow. Recycling technology must ensure that e-waste is processed in an environmentally friendly manner, with high efficiency and lowered carbon footprint, at a fraction of the costs involved with setting multibillion dollar smelting facilities. Taking into consideration our depleting natural resources, this Urban Mining approach offers quite a few benefits. This results in increased energy efficiency and lowers demand for mining of new raw materials.

An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America

The printed circuit boards basis of electronic equipment have seen a rapid growth in recent years and played a significant role in modern life. Nowadays, the fact that electronic devices upgrade quickly necessitates a proper management of waste printed circuit boards. Non-destructive desoldering of waste printed circuit boards becomes the first and the most crucial step towards recycling electronic components. Owing to the diversity of materials and components, the separation process is difficult, which results in complex and expensive recovery of precious materials and electronic components from waste printed circuit boards. To cope with this problem, we proposed an innovative approach integrating Theory of Inventive Problem Solving (TRIZ) evolution theory and technology maturity mapping system to forecast the evolution trends of desoldering technology of waste printed circuit boards. This approach can be applied to analyse the technology evolution, as well as desoldering technology evolution, then research and development strategy and evolution laws can be recommended. As an example, the maturity of desoldering technology is analysed with a technology maturity mapping system model. What is more, desoldering methods in different stages are analysed and compared. According to the analysis, the technological evolution trends are predicted to be 'the law of energy conductivity' and 'increasing the degree of idealisation'. And the potential technology and evolutionary state of waste printed circuit boards are predicted, offering reference for future waste printed circuit boards recycling.

Printed circuit board recycling: Physical processing and copper extraction by selective leaching

Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB.

Characterization and mechanical separation of metals from computer Printed Circuit Boards (PCBs) based on mineral processing methods

In this paper, a novel mechanical process is proposed for enriching metal content of computer Printed Circuit Boards (PCBs). The PCBs are crushed and divided into three different size fractions namely: -0.59, +0.59 to 1.68 and +1.68 mm. Wet jigging and froth flotation methods are selected for metal enrichment. The coarse size fraction (+1.68 mm) is processed by jigging. The plastic free product is grinded and screened. The oversized product is separated as the first concentrate. It was rich of metal because the grinding process was selective. The undersized product is processed by froth flotation. Based on the obtained results, the middle size fraction (+0.59 to 1.68 mm) and the small size fraction (-0.59 mm) are processed by wet jigging and froth flotation respectively. The wet jigging process is optimized by investigating the effect of pulsation frequency and water flow rate. The results of examining the effect of particle size, solid to liquid ratio, conditioning time and using apolar collector showed that collectorless flotation is a promising method for separating nonmetals of PCBs. 95.6%, 97.5% and 85% of metal content of coarse size, middle size and small size fraction are recovered. The grades of obtained concentrates were 63.3%, 92.5% and 75% respectively. The total recovery is calculated as 95.64% and the grade of the final concentrate was 71.26%. Determining the grade of copper and gold in the final product reveals that 4.95% of copper and 24.46% of gold are lost during the concentration. The major part of the lost gold is accumulated in froth flotation tail.

Mechanical pre-treatment of mobile phones and its effect on the Printed Circuit Assemblies (PCAs)

The recycling of Waste Electrical and Electronic Equipment (WEEE) has attracted a notable amount of interest during the last few decades due to the high metal concentrations and substantial increase in the growth rate of WEEE. In addition, higher recovery and recycling rates required by the European Union demand more comprehensive treatment of WEEE. However, complex product design and the presence of harmful substances together with low concentrations of special metals present challenges for processing. This study examines the effect of mechanical treatment of mobile phones on metal concentrations in the printed circuit assembly (PCA) fraction compared to manual dismantling. The designed mechanical treatment process including crushing, sieving, magnetic-, eddy current- and sensor-based separation was able to separate plastics, ferrous metals, PCA and stainless steel for further treatment. The process separated PCA with an efficiency of 85%. However, the quality of the separated PCAs was poor compared with "pure" manually dismantled PCAs. The primary crushing of mobile phones destroys PCAs thus resulting in the loss of especially precious metals used in the connector coatings and in the surface-mounted components. As a result, the theoretical value of the produced PCA fraction is only half compared to using manual dismantling. However, high labour costs in western countries and low capacity may hinder the feasibility of hand dismantling.

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further "sustainable" recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both "traditional" (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.

Investigations of metal leaching from mobile phone parts using TCLP and WET methods

Metal leaching from landfills containing end-of-life or otherwise discarded mobile phones poses a threat to the environment as well as public health. In the present study, the metal toxicity of printed wire boards (PWBs), plastics, liquid crystal displays (LCDs) and batteries of mobile phones was assessed using the Toxicity Characteristics Leaching Procedures (TCLP) and the Waste Extraction Test (WET). The PWBs failed TCLP for Pb and Se, and WET for Pb and Zn. In WET, the two PWB samples for Pb and Zn and the battery samples for Co and Cu failed the test. Furthermore, the PWBS for Ni and the battery samples for Ni and Co failed the WET in their TCLP leachates. Both, Ni and Co are the regulatory metals in only WET and not covered under TCLP. These observations indicate that the TCLP seems to be a more aggressive test than the WET for the metal leaching from the mobile phone parts. The compositional variations, nature of leaching solution (acetate in TCLP and citrate in WET) and the redox conditions in the leaching solution of the PWBs resulted in different order of metals with respect to their amounts of leaching from PWBs in TCLP (Fe > Pb > Zn > Ni > Co > Cu) and WET (Zn > Fe > Ni > Pb > Cu). The metal leaching also varied with the make, manufacturing year and part of the mobile phone tested. PWBs, plastics and batteries should be treated as hazardous waste. Metal leaching, particularly of Se and Pb, from mobile phones can be harmful to the environment and human health. Therefore, a scientifically sound and environmentally safe handling and disposal management system needs to be evolved for the mobile phone disposal.

Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs) from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver) has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions.

Printed circuit boards: a review on the perspective of sustainability

Modern life increasingly requires newer equipments and more technology. In addition, the fact that society is highly consumerist makes the amount of discarded equipment as well as the amount of waste from the manufacture of new products increase at an alarming rate. Printed circuit boards, which form the basis of the electronics industry, are technological waste of difficult disposal whose recycling is complex and expensive due to the diversity of materials and components and their difficult separation. Currently, printed circuit boards have a fixing problem, which is migrating from traditional Pb-Sn alloys to lead-free alloys without definite choice. This replacement is an attempt to minimize the problem of Pb toxicity, but it does not change the problem of separation of the components for later reuse and/or recycling and leads to other problems, such as temperature rise, delamination, flaws, risks of mechanical shocks and the formation of "whiskers". This article presents a literature review on printed circuit boards, showing their structure and materials, the environmental problem related to the board, some the different alternatives for recycling, and some solutions that are being studied to reduce and/or replace the solder, in order to minimize the impact of solder on the printed circuit boards.

A review of the recycling of non-metallic fractions of printed circuit boards

There is a big waste generation nowadays due to the growing demand for innovation and the fact that more and more products have a reduced lifetime, increasing the volume of dumps and landfills. Currently, one of the segments of large volume is the technology waste, which reflects on the printed circuit boards (PCBs) that are the basis of the electronics industry. This type of waste disposal is difficult, given that recycling is complex and expensive, because of the diversity of existing materials and components, and their difficult separation process. Regarding the material involved in PCBs, there are metal fractions (MFs) and non-metallic fractions (NMFs), of which the recycling of NMFs is one of the most important and difficult processes, because they amount to about 70% of the weight of the PCB’s waste. In the present paper, a literature review of the recycling of non-metallic fractions (NMFs) has been carried out, showing different studies and guidelines regarding this type of recycling, emphasizing that this type of waste still lacks for further application.

Metals recovering from waste printed circuit boards (WPCBs) using molten salts

Recycling of waste electrical and electronic equipments (WEEE) has been taken into consideration in the literature due to the large quantity of concerned wastes and their hazardous contents. The situation is so critical that EU published European Directives imposing collection and recycling with a minimum of material recovery [1]. Moreover, WEEEs contain precious metals, making the recycling of these wastes economically interesting, but also some critical metals and their recycling leads to resource conservation. This paper reports on a new approach for recycling waste printed circuit boards (WPCBs). Molten salts and specifically molten KOH-NaOH eutectic is used to dissolve glasses, oxides and to destruct plastics present in wastes without oxidizing the most valuable metals. This method is efficient for recovering a copper-rich metallic fraction, which is, moreover, cleared of plastics and glasses. In addition, analyses of gaseous emission show that this method is environmentally friendly since most of the process gases, such as carbon monoxide and dioxide and halogens, are trapped in the highly basic molten salt. In other respects, under operation without oxygen, a large quantity of hydrogen is produced and might be used as fuel gas or as synthesis gas, leading to a favourable energy balance for this new process.

Examining the technology acceptance for dismantling of waste printed circuit boards in light of recycling and environmental concerns

The dismantling of printed circuit board assemblies (PCBAs) and the recovery of their useful materials can lead to serious environmental impacts mainly due to their complicated physical structure and the variety of toxic elements contained in their material composition. So far, less attention has been paid to their responsible recycling compared to that of bare printed circuit boards. Combined with other materials recovery process, proper dismantling of PCBAs is beneficial to conserve scarce resources, reuse the components, and eliminate or safely dispose of hazardous materials. In analyzing the generation, resources potential and hazardous risk of scrap PCBAs, technologies used for the dismantling of waste PCBAs have been widely investigated and reviewed from the aspects of both industrial application and laboratory-scale studies. In addition, the feasibility of PCBA dismantling has been discussed, the determinants of which, including the heating conditions and mechanical properties have been identified. Moreover, this paper evaluates the environmental consequences caused by the dismantling of PCBAs.

Thermal degradation behavior of waste video cards using thermogravimetric analysis and pyrolysis gas chromatography/mass spectrometry techniques

The thermal degradation characteristics of a printed circuit board assembly (PCBA), specifically video cards from waste computers, was studied using pyrolysis-gas chromatography-mass spectrometry (Py-GC/MS) and thermogravimetric analysis (TGA). The video-card waste was dismantled into substrate, integrated circuits (ICs), and plastic slots for comparable investigation. The results by TGA revealed that the initial temperature at which degradation began was 300 degrees C for substrate, but it was 330 degrees C for ICs and plastic slots. For a given type of scrap, the initial temperature leading to degradation is the same under air and N2 atmosphere. However, the degradation rate was lower using air than N2 during the weight-loss stage. Further Py-GC/MS application revealed that pyrolysis products derived from substrate consisted mainly of acetone, bromotoluene, and phenol that came from the brominated epoxy resins present in substrate. Unlike substrate, the relative amounts of some products (e.g., phenol) were higher in the ICs, and cyclotetrasiloxane was released; these were released from the phenolic resins and Si mixture present in that type of waste. Benzoic acid, rather than acetone or phenol, was the main product released from plastic slots. It was proved that this scrap was a mixture of various polyesters, cracking of which predicatively generated aromatic products. The results will be useful in developing pyrolysis or starved-air incineration systems for thermosetting plastic and PCBA waste and helpful to control pollution during the treatment of this waste.

Recycling of non-metallic fractions from waste printed circuit boards: a review

The major economic driving force for recycling of waste printed circuit boards (PCBs) is the value of the metallic fractions (MFs) of PCBs. The non-metallic fractions (NMFs), which take up almost 70wt% of waste PCBs, were treated by combustion or land filling in the past. However, combustion of the NMFs will cause the formation of highly toxic polybrominated dibenzodioxins and dibenzofurans (PBDD/Fs) while land filling of the NMFs will lead to secondary pollution caused by heavy metals and brominated flame retardants (BFRs) leaching to the groundwater. Therefore, recycling of the NMFs from waste PCBs is drawing more and more attention from the public and the governments. Currently, how to recycle the NMFs environmental soundly has become a significant topic in recycling of waste PCBs. In order to fulfill the better resource utilization of the NMFs, the compositions and characteristics of the NMFs, methods and outcomes of recycling the NMFs from waste PCBs and analysis and treatment for the hazardous substances contained in the NMFs were reviewed in this paper. Thermosetting resin matrix composites, thermoplastic matrix composites, concrete and viscoelastic materials are main applications for physical recycling of the NMFs. Chemical recycling methods consisting of pyrolysis, gasification, supercritical fluids depolymerization and hydrogenolytic degradation can be used to convert the NMFs to chemical feedstocks and fuels. The toxicity characteristic leaching procedure (TCLP) and synthetic precipitation leaching procedure (SPLP) can be used to determine the toxicity characteristic (TC) of the NMFs and to evaluate the environmental safety of products made from the recycled NMFs. It is believed that physical recycling of the NMFs has been a promising recycling method. Much more work should be done to develop comprehensive and industrialized usage of the NMFs recycled by physical methods. Chemical recycling methods have the advantages in eliminating hazardous substances in the NMFs. The trend in chemical recycling of the NMFs is to make the best of advantages over physical recycling of the NMFs to compensate its higher cost. Removing and treating the hazardous substances in the NMFs is an ultimate method to eliminate the pollution.

Asphalt modified with nonmetals separated from pulverized waste printed circuit boards

Nonmetals separated from pulverized waste printed circuit boards (PCBs) were reused as a new modifier to improve the performance of asphalt. The classical and rheological properties of unmodified asphalt and non-metal-modified asphalt (NMA) were determined. Specifically, the influence of nonmetals content and particle size on these properties has been studied. When the nonmetals content was 25 wt% and the particle size group was 0.07-0.09 mm, the NMA had a viscosity of 1225 cP at 135 degrees C, a penetration of 53.7 dmm at 15 degrees C, a ring and ball softening point of 54 degrees C, a ductility of 43.5 cm at 15 degrees C, a G*/sin delta of 3995.27 Pa at 60 degrees C, and an upper limit temperature (G*/sin delta = 1 kPa) of 69.4 degrees C, all of which showed that the high temperature performance of asphalt was improved significantly. Therefore, this study gives a fundamental understanding of NMA and represents a novel attempt to deal with the fast increasing quantities of nonmetals from waste PCBs, which is significant from an environmental and economic standpoint.

Characterization of shredded television scrap and implications for materials recovery

Characterization of TV scrap was carried out by using a variety of methods, such as chemical analysis, particle size and shape analysis, liberation degree analysis, thermogravimetric analysis, sink-float test, and IR spectrometry. A comparison of TV scrap, personal computer scrap, and printed circuit board scrap shows that the content of non-ferrous metals and precious metals in TV scrap is much lower than that in personal computer scrap or printed circuit board scrap. It is expected that recycling of TV scrap will not be cost-effective by utilizing conventional manual disassembly. The result of particle shape analysis indicates that the non-ferrous metal particles in TV scrap formed as a variety of shapes; it is much more heterogeneous than that of plastics and printed circuit boards. Furthermore, the separability of TV scrap using density-based techniques was evaluated by the sink-float test. The result demonstrates that a high recovery of copper could be obtained by using an effective gravity separation process. Identification of plastics shows that the major plastic in TV scrap is high impact polystyrene. Gravity separation of plastics may encounter some challenges in separation of plastics from TV scrap because of specific density variations.