Two-micron-wavelength germanium-tin photodiodes with low dark current and gigahertz bandwidth

Efficient and high-speed coupling modulation of silicon racetrack ring resonators at 2 µm waveband

Significantly increased interests have been witnessed for the 2 µm waveband which is considered to be a promising alternative window for fiber and free-space optical communications. However, the less mature device technology at this wavelength range is one of the primary obstacles toward practical applications. In this work, we demonstrate an efficient and high-speed silicon modulator based on carrier depletion in a coupling tunable resonator. A benchmark high modulation efficiency of 0.75 V·cm is achieved. The 3-dB electro-optic bandwidth is measured to be 26 GHz allowing for up to 34 Gbit/s on-off keying modulation with a low energy consumption of ∼0.24 pJ/bit. It provides a solution for the silicon modulator with high-speed and low power consumption in the 2-µm waveband.

On-chip germanium photodetector with interleaved junctions for the 2-µm wave band

Recently, the 2-µm wave band has gained increased interest due to its potential application for the next-generation optical communication. As a proven integration platform, silicon photonics also benefit from the lower nonlinear absorption and larger electro-optic coefficient. However, this spectral range is far beyond the photodetection range of germanium, which places an ultimate limit for on-chip applications. In this work, we demonstrate a waveguide-coupled photodetector enabled by a tensile strain-induced absorption in germanium. Responsivity is greatly enhanced by the proposed interleaved junction structure. The device is designed on a 220-nm silicon-on-insulator and is fabricated via a standard silicon photonic foundry process. By utilizing different interleaved PN junction spacing configurations, we were able to measure a responsivity of 0.107 A/W at 1950 nm with a low bias voltage of -6.4 V for the 500-μm-long device. Additionally, the 3-dB bandwidth of the device was measured to be up to 7.1 GHz. Furthermore, we successfully achieved data transmission at a rate of 20 Gb/s using non-return-to-zero on-off keying modulation.

Sn component gradient GeSn photodetector with 3 dB bandwidth over 50 GHz for extending L band telecommunication

In this work, high-performance GeSn photodetectors with a Sn content gradient GeSn layer were fabricated on SOI substrate by CMOS-compatible process for C and L band telecommunication. The active GeSn layer has a Sn component increased from 9 to 10.7% with the controlled relaxation degree up to 84%. The responsivities of GeSn detectors at 1550 nm and 1630 nm are 0.47 A/W and 0.32 A/W under -4 V bias, respectively. Over 50 GHz 3 dB bandwidth with the eye pattern about 70 Gb/s was also evidenced at 1630 nm. These results indicate that the GeSn photodetectors have a promising application for extending the silicon photonics from C band to L band.

High-Speed Carbon Nanotube Photodetectors for 2 μm Communications

In the era of big data, the growing demand for data transmission capacity requires the communication band to expand from the traditional optical communication windows (∼1.3-1.6 μm) to the 2 μm band (1.8-2.1 μm). However, the largest bandwidth (∼30 GHz) of the current high-speed photodetectors for the 2 μm window is considerably less than the developed 1.55 μm band photodetectors based on III-V materials or germanium (>100 GHz). Here, we demonstrate a high-performance carbon nanotube (CNT) photodetector that can operate in both the 2 and 1.55 μm wavelength bands based on high-density CNT arrays on a quartz substrate. The CNT photodetector exhibits a high responsivity of 0.62 A/W and a large 3 dB bandwidth of 40 GHz (setup-limited) at 2 μm. The bandwidth is larger than that of existing photodetectors working in this wavelength range. Moreover, the CNT photodetector operating at 1.55 μm exhibits a setup-limited 3 dB bandwidth over 67 GHz at zero bias. Our work indicates that CNT photodetectors with high performance and low cost have great potential for future high-speed optical communication at both the 2 and 1.55 μm bands.

Transfer-printing-enabled GeSn flexible resonant-cavity-enhanced photodetectors with strain-amplified mid-infrared optical responses

Mid-infrared (MIR) flexible photodetectors (FPDs) constitute an essential element for wearable applications, including health-care monitoring and biomedical detection. Compared with organic materials, inorganic semiconductors are promising candidates for FPDs owing to their superior performance as well as optoelectronic properties. Herein, for the first time, we present the use of transfer-printing techniques to enable a cost-effective, nontoxic GeSn MIR resonant-cavity-enhanced FPDs (RCE-FPDs) with strain-amplified optical responses. A narrow bandgap nontoxic GeSn nanomembrane was employed as the active layer, which was grown on a silicon-on-insulator substrate and then transfer-printed onto a polyethylene terephthalate (PET) substrate, eliminating the unwanted defects and residual compressive strain, to yield the MIR RCE-FPDs. In addition, a vertical cavity was created for the GeSn active layer to enhance the optical responsivity. Under bending conditions, significant tensile strain up to 0.274% was introduced into the GeSn active layer to effectively modulate the band structure, extend the photodetection in the MIR region, and substantially enhance the optical responsivity to 0.292 A W^-1 at λ = 1770 nm, corresponding to an enhancement of 323% compared with the device under flat conditions. Moreover, theoretical simulations were performed to confirm the strain effect on the device performance. The results demonstrated high-performance, nontoxic MIR RCE-FPDs for applications in flexible photodetection.

An Ultra-Broadband Polarization Beam Splitter Based on the Digital Meta-Structure at the 2 µm Waveband

The 2 μm waveband is considered to have great potential in optical communications. Driven by the demands on high-performance functional devices in this spectral band, various integrated photonic components have been demonstrated. In this work, an analog and digital topology optimization method is proposed to design an ultra-broadband polarization beam splitter at the 2 μm waveband. Within an optical bandwidth of 213 nm, the excess losses of TE and TM modes are <0.53 dB and 0.3 dB, respectively. The corresponding polarization extinction ratios are >16.5 dB and 18.1 dB. The device has a very compact footprint of only 2.52 µm × 5.4 µm. According to our best knowledge, this is a benchmark demonstration of an ultra-broadband and ultra-compact polarization beam splitter enabled by the proposed optimization method.

Transferable single-layer GeSn nanomembrane resonant-cavity-enhanced photodetectors for 2 μm band optical communication and multi-spectral short-wave infrared sensing

Semiconductor nanomembranes (NMs) have emerged as an attractive nanomaterial for advanced electronic and photonic devices with attractive features such as transferability and flexibility, enabling heterogeneous integration of multi-functional components. Here, we demonstrate transferable single-layer GeSn NM resonant-cavity-enhanced photodetectors for 2 μm optical communication and multi-spectral short-wave infrared sensing/imaging applications. The single-layer strain-free GeSn NMs with an Sn concentration of 10% are released from a high-quality GeSn-on-insulator (GSOI) substrate with the defective interface regions removed. By transferring the GeSn NMs onto a predesigned distribution Bragg reflector (DBR)/Si substrate, a vertical microcavity is integrated into the device to enhance the light-matter interaction in the GeSn NM. With the integrated cavity and high-quality single-layer GeSn NM, a record responsivity of 0.51 A W^-1 at 2 μm wavelength at room temperature is obtained, which is more than two orders of magnitude higher than the reported values of the multiple-layer GeSn membrane photodetectors without cavities. The potential of the device for multi-spectral photodetection is demonstrated by tuning the responsivity spectrum with different NM thicknesses. Theoretical simulations are utilized to analyze and verify the mechanisms of responsivity enhancement. The approach can be applied to other GeSn-NM-based active devices, such as electro-absorption modulators or light emitters, presenting a new pathway towards heterogeneous group-IV photonic integrated circuits with miniaturized devices.

Silicon photonic arrayed waveguide grating with 64 channels for the 2 µm spectral range

Driven by the demand to extend optical fiber communications wavelengths beyond the C + L band, the 2 µm wave band has proven to be a promising candidate. Extensive efforts have been directed into developing high-performance and functional photonic devices. Here we report an integrated silicon photonic arrayed waveguide grating (AWG) fabricated in a commercial foundry. The device has 64 channels with a spacing of approximately 50 GHz (0.7 nm), covering the bandwidth from 1967 nm to 2012 nm. The on-chip insertion loss of the AWG is measured to be approximately 5 dB. By implementing a TiN metal layer, the AWG spectrum can be thermally tuned with an efficiency of 0.27 GHz/mW. The device has a very compact configuration with a footprint of 2.3 mm × 2 mm. The demonstrated AWG can potentially be used for dense wavelength division multiplexing in the 2 µm spectral band.

Optical Interconnects Finally Seeing the Light in Silicon Photonics: Past the Hype

Electrical interconnects are becoming a bottleneck in the way towards meeting future performance requirements of integrated circuits. Moore's law, which observes the doubling of the number of transistors in integrated circuits every couple of years, can no longer be maintained due to reaching a physical barrier for scaling down the transistor's size lower than 5 nm. Heading towards multi-core and many-core chips, to mitigate such a barrier and maintain Moore's law in the future, is the solution being pursued today. However, such distributed nature requires a large interconnect network that is found to consume more than 80% of the microprocessor power. Optical interconnects represent one of the viable future alternatives that can resolve many of the challenges faced by electrical interconnects. However, reaching a maturity level in optical interconnects that would allow for the transition from electrical to optical interconnects for intra-chip and inter-chip communication is still facing several challenges. A review study is required to compare the recent developments in the optical interconnects with the performance requirements needed to reach the required maturity level for the transition to happen. This review paper dissects the optical interconnect system into its components and explains the foundational concepts behind the various passive and active components along with the performance metrics. The performance of different types of on-chip lasers, grating and edge couplers, modulators, and photodetectors are compared. The potential of a slot waveguide is investigated as a new foundation since it allows for guiding and confining light into low index regions of a few tens of nanometers in cross-section. Additionally, it can be tuned to optimize transmissions over 90° bends. Hence, high-density opto-electronic integrated circuits with optical interconnects reaching the dimensions of their electrical counterparts are becoming a possibility. The latest complete optical interconnect systems realized so far are reviewed as well.

GeSn-based Multiple-Quantum-Well Photodetectors for Mid-Infrared Sensing Applications

Silicon (Si)-based mid-infrared (MIR) photonics has promising potential for realizing next-generation ultra-compact spectroscopic systems for various applications such as label-free and damage-free gas sensing, medical diagnosis, and defense. The epitaxial growth of Ge1-xSnx alloy on Si substrate provides the promising technique to extend the cut-off wavelength of Si photonics to MIR range by Sn alloying. Here, we present the theory and simulation of heterojunction p-i-n MIR photodetectors (PDs) with Ge0.87Sn0.13/Ge0.92Sn0.08 quantum-wells with an additional Ge0.91Sn0.09 layer to elongate the photoabsorption path in the MIR spectrum. The incorporation of QW pairs (N) enables the light-matter interaction due to the carrier and optical confinement in the active region. As a result, the spectral response of the device is enhanced in the MIR range. Devices with varying N were compared in terms of various figure-of merits including dark-current, a photocurrent-to-dark current ratio, detectivity, spectral responsivity, and noise equivalent power (NEP). Additionally, parasitic capacitance-dependent RC and 3dB bandwidth were also studied using a small-signal equivalent circuit model. The proposed device exhibited the extended photodetection wavelength at ~3370 nm and Iph/Idark up to ~7.3 × 103 with a dark current of ~56.3 nA for N = 8 at 300 K. At a bias of -3V, the proposed device achieved the spectral responsivity of 0.86 A/W at 2870 nm and 0.55 A/W at 3300 nm, detectivity more than 2.5 × 109 Jones and a NEP less than 2.1 × 10-13 WHz-0.5 for N = 8 at 3250 3250 nm The calculated 3dB bandwidth of 47.8 GHz, the signal-to-noise ratio (SNR), and linear dynamic range (LDR) of 93 dB and 74 dB were achieved at 3300 nm for N = 8. Thus, these results indicate that the proposed GeSn-based QW p-i-n PDs pave the pathway towards the realization of new and high-performance detectors for sensing in the MIR regime.

Room-temperature bandwidth of 2-μm AlInAsSb avalanche photodiodes

We investigate the room-temperature bandwidth performance of AlInAsSb avalanche photodiodes under 2-μm illumination. Parameter characterization denotes RC-limited performance. While measurements indicate a maximum gain-bandwidth product of 44 GHz for a 60-μm-diameter device, we scale this performance to smaller device sizes based on the RC response. For a 15-μm-diameter device, we predict a maximum gain-bandwidth product of approximately 144 GHz based on the reported measurements.

GeSn-on-insulator dual-waveband resonant-cavity-enhanced photodetectors at the 2 µm and 1.55 µm optical communication bands

Germanium-tin-on-insulator (GSOI) has emerged as a new platform for three-dimensional (3D) photonic-integrated circuits (PICs). We report, to our knowledge, the first demonstration of GeSn dual-waveband resonant-cavity-enhanced photodetectors (RCE PDs) on GSOI platforms with resonance-enhanced responsivity at both 2 µm and 1.55 µm bands. 10% Sn is introduced to the GeSn absorbing layer to extend the detection wavelength to the 2 µm band. A vertical Fabry-Perot cavity is designed to enhance the responsivity. The measured responsivity spectra show resonance peaks that cover a wide wavelength range near both the 2 µm and conventional telecommunication bands. This work demonstrates that GeSn dual-waveband RCE PDs on a GSOI platform are promising for CMOS-compatible 3D PICs for optoelectronic applications in 2 µm and telecommunication bands.

High-speed and high-responsivity p-i-n waveguide photodetector at a 2 µm wavelength with a Ge0.92Sn0.08/Ge multiple-quantum-well active layer

We report on p-i-n waveguide photodetectors with a ${{\rm Ge}_{0.92}}{{\rm Sn}_{0.08}}/{\rm Ge}$ multiple-quantum-well (MQW) active layer on a strain-relaxed Ge-buffered silicon substrate. The waveguide-photodetector structure is used to elongate the photo-absorption path and keeps a short photo-generated carrier transmission path. In addition, the double-mesa structure with a low substrate doping concentration is implemented, which minimizes the parasitic capacitance. As a result, a high responsivity of 119 mA/W at ${-}{1}\;{\rm V}$ and a high bandwidth of more than 10 GHz at ${-}{7}\;{\rm V}$ were achieved at a 2 µm wavelength. Compared with the surface-illuminated photodetector, the responsivity was improved by ${\sim}{8}$ times at a 2 µm wavelength, while keeping the comparable bandwidth.

Surface plasmon enhanced GeSn photodetectors operating at 2 µm

Au-hole array and Au-GeSn grating structures were designed and incorporated in GeSn metal-semiconductor-metal (MSM) photodetectors for enhanced photo detection at 2 µm. Both plasmonic structures are beneficial for effective optical confinement near the surface due to surface plasmon resonance (SPR), contributing to an enhanced responsivity. The responsivity enhancement for Au hole-array structure is insensitive to the polarization direction, while the enhancement for Au-GeSn grating structure depends on the polarization direction. The responsivity for GeSn photodetector with Au hole-array structure has ∼50% reinforcement compared with reference photodetector. On the other hand, Au-GeSn grating structure benefits a 3× enhanced responsivity of 0.455 A/W at 1.5V under TM-polarized illumination. The achieved responsivity is among the highest values for GeSn photodetectors operating at 2 µm. The plasmonic GeSn photodetectors in this work offer an alternative solution for high-efficiency photo detection, manifesting their great potentials as candidates for 2 µm optical communication and other emerging applications.

GeSn lateral p-i-n waveguide photodetectors for mid-infrared integrated photonics

In this Letter, we demonstrate mid-infrared (MIR) lateral p-i-n GeSn waveguide photodetectors (WGPDs) on silicon, to the best of our knowledge for the first time, as a key enabler of MIR electronic-photonic integrated circuits (EPICs). Narrow-bandgap GeSn alloys were employed as the active material to enable efficient photodetection in the MIR region. A lateral p-i-n homojunction diode was designed and fabricated to significantly enhance the optical confinement factor of the guided modes and thus enhance the optical responsivity. Thus, a photodetection range of up to 1950 nm and a good responsivity of 0.292 A/W at 1800 nm were achieved. These results demonstrate the feasibility of planar GeSn WGPDs for monolithic MIR EPICs on silicon.

Recent Advances in High Speed Photodetectors for eSWIR/MWIR/LWIR Applications

High speed photodetectors operating at a telecommunication band (from 1260 to 1625 nm) have been well studied with the development of an optical fiber communication system. Recent innovations of photonic systems have raised new requirements on the bandwidth of photodetectors with cutoff wavelengths from extended short wavelength infrared (eSWIR) to long wavelength infrared (LWIR). However, the frequency response performance of photodetectors in these longer wavelength bands is less studied, and the performances of the current high-speed photodetectors in these bands are still not comparable with those in the telecommunication band. In this paper, technical routes to achieve high response speed performance of photodetectors in the extended short wavelength infrared/mid wavelength infrared/long wavelength infrared (eSWIR/MWIR/LWIR) band are discussed, and the state-of-the-art performances are reviewed.

Photo detection and modulation from 1,550 to 2,000 nm realized by a GeSn/Ge multiple-quantum-well photodiode on a 300-mm Si substrate

A GeSn/Ge multiple-quantum-well (MQW) p-i-n photodiode structure was proposed for simultaneously realizing high detectivity photo detection with low dark current and effective optical modulation based on the quantum confined Stark (QCSE) effect. The MQW stacks were grown on a 300-mm Ge-buffered Si substrate using reduced pressure chemical vapor deposition (RPCVD). GeSn/Ge MQW p-i-n photodiodes with varying mesa diameters were fabricated and characterized. An ultralow dark current density of 16.3 mA/cm² at -1 V was achieved as expected due to the low threading dislocation density (TDD) in pseudomorphic GeSn layer. Owing to the ultralow dark current density and high responsivity of 0.307 A/W, a high specific detectivity of 1.37×10¹⁰ cm·Hz^1/2/W was accomplished at 1,550 nm, which is comparable with commercial Ge and extended-InGaAs photodetectors. Meanwhile, the bias voltage-dependent photo response was investigated from 1,700 to 2,200 nm. The extracted effective absorption coefficient of GeSn/Ge MQW shows a QCSE behavior with electric field-dependent exciton peaks from 0.688 to 0.690 eV. An absorption ratio of 1.81 under -2 V was achieved at 2 μm, which shows early promise for effective optical modulation. The high frequency response was calculated theoretically, and the predicted 3-dB bandwidth for the photodiode with a mesa diameter of 30 μm could reach 12 GHz at -2 V.

Strain-free GeSn nanomembranes enabled by transfer-printing techniques for advanced optoelectronic applications

GeSn alloys have emerged as promising materials for silicon-based optoelectronic devices. However, the epitaxy of pseudomorphic GeSn layers on a Ge buffer is susceptible to a significant compressive strain that significantly hinders the performance of GeSn-based photonic devices. Herein, we report on a new strategy to produce strain-free GeSn nanomembranes for advanced optoelectronic applications. The GeSn alloy was grown on a silicon-on-insulator substrate using Ge buffers, and it has a residual compressive strain. By transfer-printing the GeSn/Ge/Si multi-layers, followed by etching the Si template and the Ge buffer layers, respectively, the residual compressive strain was completely removed to achieve strain-free GeSn layers. A bandgap reduction was also observed as a result of strain relaxation. Furthermore, theoretical analysis was performed to evaluate the effect of strain relaxation on the GeSn-based optoelectronic devices. The proposed approach offers a practical and viable method for preparing strain-free GeSn alloys for advanced optoelectronic applications.

Design of Ge1-xSnx-on-Si waveguide photodetectors featuring high-speed high-sensitivity photodetection in the C- to U-bands

We present the design of Ge_1-xSn_x-on-Si waveguide photodetectors for the applications in the C- to U-bands. The GeSn photodetectors have been studied in respect to responsivity, dark current, and bandwidth, with light butt- or evanescent-coupled from an Si waveguide. With the introduction of 4.5% Sn into Ge, the GeSn waveguide PD with evanescent-coupling exhibits high responsivity of 1.25 A/W and 3 dB bandwidth of 123.1 GHz at 1.675 µm. Further increasing the Sn composition cannot improve the absorption in the U-band significantly but does lead to poorer thermal stability and higher dark current. This work suggests a promising avenue for future high-speed high-responsivity photodetection in the C- to U-bands.

Silicon Waveguide Integrated with Germanium Photodetector for a Photonic-Integrated FBG Interrogator

We report a vertically coupled germanium (Ge) waveguide detector integrated on silicon-on-insulator waveguides and an optimized device structure through the analysis of the optical field distribution and absorption efficiency of the device. The photodetector we designed is manufactured by IMEC, and the tests show that the device has good performance. This study theoretically and experimentally explains the structure of Ge PIN and the effect of the photodetector (PD) waveguide parameters on the performance of the device. Simulation and optimization of waveguide detectors with different structures are carried out. The device’s structure, quantum efficiency, spectral response, response current, changes with incident light strength, and dark current of PIN-type Ge waveguide detector are calculated. The test results show that approximately 90% of the light is absorbed by a Ge waveguide with 20 μm Ge length and 500 nm Ge thickness. The quantum efficiency of the PD can reach 90.63%. Under the reverse bias of 1 V, 2 V and 3 V, the detector’s average responsiveness in C-band reached 1.02 A/W, 1.09 A/W and 1.16 A/W and the response time is 200 ns. The dark current is only 3.7 nA at the reverse bias voltage of −1 V. The proposed silicon-based Ge PIN PD is beneficial to the integration of the detector array for photonic integrated arrayed waveguide grating (AWG)-based fiber Bragg grating (FBG) interrogators.

High-speed performance of a TDFA-band micro-ring resonator modulator and detector

We demonstrate a silicon-on-insulator micro-ring resonator (MRR) modulator and defect-mediated (DM) detector operating at a wavelength near 2 µm for use in the thulium doped fiber amplifier wavelength band. The MRR modulator was critically coupled with an unbiased notch-depth of 20 dB and Q-factor of 4700. The resonance shift under reverse bias was 23 pm/V with a calculated V_πL_π of 2.2 to 2.6 V·cm from -1 to -8 V, respectively. Simulations are in good agreement with the measured data. The experimental modulation bandwidth was 12.5 GHz, limited by the response of the commercial external detector used for this measurement. The DM detector was operated in avalanche mode, had 1.97 µm wavelength responsivities of 0.04 and 0.14 A/W, and had bandwidths greater than 16 and 7.5 GHz at -15 and -30 V biases, respectively. Large-signal measurement demonstrated open eye-diagrams at 5, 10, and 12.5 Gbps for the DM detector and also for an optical link consisting of the modulator and detector integrated on the same silicon chip.

High-efficiency GeSn/Ge multiple-quantum-well photodetectors with photon-trapping microstructures operating at 2 µm

We introduced photon-trapping microstructures into GeSn-based photodetectors for the first time, and achieved high-efficiency photo detection at 2 µm with a responsivity of 0.11 A/W. The demonstration was realized by a GeSn/Ge multiple-quantum-well (MQW) p-i-n photodiode on a GeOI architecture. Compared with the non-photon-trapping counterparts, the patterning and etching of photon-trapping microstructure can be processed in the same step with mesa structure at no additional cost. A four-fold enhancement of photo response was achieved at 2 µm. Although the incorporation of photo-trapping microstructure degrades the dark current density which increases from 31.5 to 45.2 mA/cm² at -1 V, it benefits an improved 3-dB bandwidth of 2.7 GHz at bias voltage at -5 V. The optical performance of GeSn/Ge MQW photon-trapping photodetector manifests its great potential as a candidate for efficient 2 µm communication. Additionally, the underlying GeOI platform enables its feasibility of monolithic integration with other photonic components such as waveguide, modulator and (de)multiplexer for optoelectronic integrated circuits (OEICs) operating at 2 µm.

GeSn resonant-cavity-enhanced photodetectors for efficient photodetection at the 2 µm wavelength band

The 2 µm wavelength band has recently gained increased attention for potential applications in next-generation optical communication. However, it is still challenging to achieve effective photodetection in the 2 µm wavelength band using group-IV-based semiconductors. Here we present an investigation of GeSn resonant-cavity-enhanced photodetectors (RCEPDs) on silicon-on-insulator substrates for efficient photodetection in the 2 µm wavelength band. Narrow-bandgap GeSn alloys are used as the active layer to extend the photodetection range to cover the 2 µm wavelength band, and the optical responsivity is significantly enhanced by the resonant cavity effect as compared to a reference GeSn photodetector. Temperature-dependent experiments demonstrate that the GeSn RCEPDs can have a wider photodetection range and higher responsivity in the 2 µm wavelength band at higher temperatures because of the bandgap shrinkage. These results suggest that our GeSn RCEPDs are promising for complementary metal-oxide-semiconductor-compatible, efficient, uncooled optical receivers in the 2 µm wavelength band for a wide range of applications.

Integrating GeSn photodiode on a 200 mm Ge-on-insulator photonics platform with Ge CMOS devices for advanced OEIC operating at 2 μm band

High-performance GeSn multiple-quantum-well (MQW) photodiode is demonstrated on a 200 mm Ge-on-insulator (GeOI) photonics platform for the first time. Both GeSn MQW active layer stack and Ge layer (top Ge layer of GeOI after bonding) were grown using a single epitaxy step on a standard (001)-oriented Si substrate (donor wafer) using a reduced pressure chemical vapor deposition (RPCVD). Direct wafer bonding and layer transfer technique were then employed to transfer the GeSn MQW device layers and Ge layer to a 200 mm SiO₂-terminated Si handle substrate. The surface illuminated GeSn MQW photodiode realized on this platform exhibits an ultra-low leakage current density of 25 mA/cm² at room temperature and an enhanced photo sensitivity at 2 μm of 30 mA/W as compared to a GeSn MQW photodiode on Si at 2 μm. The underlying GeOI platform enables monolithic integration of a complete suite of photonics devices operating at 2 μm band, including GeOI strip waveguides, grating couplers, micro-ring modulators, Mach-Zehnder interferometer modulators, etc. In addition, Ge CMOS circuits can also be realized on this common platform using a "photonic-first and electronic-last" processing approach. In this work, as prototype demonstration, both Ge p- and n-channel fin field-effect transistors (FinFETs) were realized on GeOI simultaneously with decent static electrical characteristics. Subthreshold swings of 150 and 99 mV/decade at |VD| = 0.1 V and drive currents of 91 and 10.3 μA/μm at |VG-VTH| = 1 V and |VD| = 0.75 V were achieved for p- and n-FinFETs, respectively. This works illustrates the potential of integrating GeSn (as photo detection material) on GeOI platform for Ge-based optoelectronics integrated circuits (OEICs) targeting communication applications at 2 μm band.

High-speed photo detection at two-micron-wavelength: technology enablement by GeSn/Ge multiple-quantum-well photodiode on 300 mm Si substrate

We report high-speed photo detection at two-micron-wavelength achieved by a GeSn/Ge multiple-quantum-well (MQW) p-i-n photodiode, exhibiting a 3-dB bandwidth (f3-dB) above 10 GHz for the first time. The epitaxy of device layer stacks was performed on a standard (001)-oriented 300 mm Si substrate by using reduced pressure chemical vapor deposition (RPCVD). The results showed promise for large-scale manufacturing. To our knowledge, this is also the first photodiodes-on-Si with direct radio-frequency (RF) measurement to quantitatively confirm high-speed functionality with tens of GHz f3-dB at 2 µm, which is considered as a promising candidate for the next data communication window. This work illustrates the potential for using GeSn to extend the utility of Si photonics in 2 µm band integrated optical transceivers for communication applications.

High-performance GeSn photodetector and fin field-effect transistor (FinFET) on an advanced GeSn-on-insulator platform

We report the first demonstration of high-performance GeSn metal-semiconductor-metal (MSM) photodetector and GeSn p-type fin field-effect transistor (pFinFET) on an advanced GeSn-on-insulator (GeSnOI) platform by complementary metal-oxide-semiconductor (CMOS) compatible processes. The detection range of GeSn photodetector is extended beyond 2 µm, with responsivities of 0.39 and 0.10 A/W at 1550 nm and 2003 nm, respectively. Through the insertion of an ultrathin Al₂O₃ Schottky-barrier-enhancement layer, the dark current IDark of the GeSn photodetector is suppressed by more than 2 orders of magnitude. An impressive IDark of ~65 nA was achieved at an operating voltage of 1.0 V. A frequency response measurement reveals the achievement of a 3-dB bandwidth of ~1.4 GHz at an illumination wavelength of 2 µm. GeSn pFinFET with fin width (Wfin) scaled down to 15 nm was also fabricated on the GeSnOI platform, exhibiting a small subthreshold swing (S) of 93 mV/decade, a high drive current of 176 µA/µm, and good control of short channel effects (SCEs). This work paves the way for realizing compact, low-cost, and multi-functional GeSn-on-insulator opto-electronic integrated circuits.