Optimisation of Thiourea Concentration in a Decorative Copper Plating Acid Bath Based on Methanesulfonic Electrolyte

Analytic procedure for the evaluation of copper intermetallic diffusion in electroplated gold coatings with energy dispersive X-ray microanalysis

A method for the determination of the intermetallic diffusion coefficient in the Cu-Au system is described based on energy dispersive X-ray techniques. XRF and EDS analysis were used to measure the thickness of the electroplated gold coating and the copper diffused through it, respectively. This information was used to obtain the diffusion coefficient through an equation based on Fick's law. Colour measurements and metallographic section analysis of the samples were also performed to evaluate alternative methods for a qualitative determination of diffusion rate. The thickness of the gold layer was chosen in agreement with what is used in decorative and functional applications (<1 μm). The measurements were performed on samples heated in a range of temperatures between 100 °C and 200 °C from 12 to 96 h. The results obtained follow a linear trend between the logarithm of the diffusion coefficient and the inverse of the temperature and are in line with the values found in the literature.

SPECIFIC ION EFFECTS ON COPPER ELECTROPLATING

The main goal of this work is to open new perspectives in the field of electrodeposition and provide green alternatives to the electroplating industry. The effect of different anions (SO₄^2-, ClO₃^-, NO₃^-, ClO₄^-, BF₄^-, PF₆^-) in solution on the electrodeposition of copper was investigated. The solutions, containing only the copper precursor and the background electrolyte, were tailored to minimize the environmental impact and reduce the use of organic additives and surfactants. The study is based on electrochemical measurements carried out to verify that no metal complexation takes place. We assessed the nucleation and growth mechanism, we performed a morphological characterization through scanning electron microscopy and deposition efficiency by measuring the film thickness through X-ray fluorescence spectroscopy. Significant differences in the growth mechanism and in the morphology of the electrodeposited films, were observed as a function of the background electrolyte.