Fabrication of Micro-Optics Elements with Arbitrary Surface Profiles Based on One-Step Maskless Grayscale Lithography

Grayscale Lithography and a Brief Introduction to Other Widely Used Lithographic Methods: A State-of-the-Art Review

Lithography serves as a fundamental process in the realms of microfabrication and nanotechnology, facilitating the transfer of intricate patterns onto a substrate, typically in the form of a wafer or a flat surface. Grayscale lithography (GSL) is highly valued in precision manufacturing and research endeavors because of its unique capacity to create intricate and customizable patterns with varying depths and intensities. Unlike traditional binary lithography, which produces discrete on/off features, GSL offers a spectrum of exposure levels. This enables the production of complex microstructures, diffractive optical elements, 3D micro-optics, and other nanoscale designs with smooth gradients and intricate surface profiles. GSL plays a crucial role in sectors such as microelectronics, micro-optics, MEMS/NEMS manufacturing, and photonics, where precise control over feature depth, shape, and intensity is critical for achieving advanced functionality. Its versatility and capacity to generate tailored structures make GSL an indispensable tool in various cutting-edge applications. This review will delve into several lithographic techniques, with a particular emphasis on masked and maskless GSL methods. As these technologies continue to evolve, the future of 3D micro- and nanostructure manufacturing will undoubtedly assume even greater significance in various applications.

Design considerations for digital light processing bioprinters

With the rapid development and popularization of additive manufacturing, different technologies, including, but not limited to, extrusion-, droplet-, and vat-photopolymerization-based fabrication techniques, have emerged that have allowed tremendous progress in three-dimensional (3D) printing in the past decades. Bioprinting, typically using living cells and/or biomaterials conformed by different printing modalities, has produced functional tissues. As a subclass of vat-photopolymerization bioprinting, digital light processing (DLP) uses digitally controlled photomasks to selectively solidify liquid photocurable bioinks to construct complex physical objects in a layer-by-layer manner. DLP bioprinting presents unique advantages, including short printing times, relatively low manufacturing costs, and decently high resolutions, allowing users to achieve significant progress in the bioprinting of tissue-like complex structures. Nevertheless, the need to accommodate different materials while bioprinting and improve the printing performance has driven the rapid progress in DLP bioprinters, which requires multiple pieces of knowledge ranging from optics, electronics, software, and materials beyond the biological aspects. This raises the need for a comprehensive review to recapitulate the most important considerations in the design and assembly of DLP bioprinters. This review begins with analyzing unique considerations and specific examples in the hardware, including the resin vat, optical system, and electronics. In the software, the workflow is analyzed, including the parameters to be considered for the control of the bioprinter and the voxelizing/slicing algorithm. In addition, we briefly discuss the material requirements for DLP bioprinting. Then, we provide a section with best practices and maintenance of a do-it-yourself DLP bioprinter. Finally, we highlight the future outlooks of the DLP technology and their critical role in directing the future of bioprinting. The state-of-the-art progress in DLP bioprinter in this review will provide a set of knowledge for innovative DLP bioprinter designs.

Tuning Surface Adhesion Using Grayscale Electron-beam Lithography

Surface texturing of manufactured products tailors their properties, such as friction, adhesion, biocompatibility, or fluid interactions. However, advancements in this area are largely the result of trial-and-effort testing and generally lack a science-guided framework for determining the surface topography that will optimize performance. The present investigation explores grayscale electron-beam lithography as a means to create multiscale surface patterns to control surface performance. Here, we created and characterized a set of surface textures on a silicon wafer; the textures were superpositions of sine waves of varying wavelengths and amplitudes. First, the multiscale topography of the patterned surface was characterized, using profilometry and atomic force microscopy, to understand its fidelity to the designed-in pattern. The results of this analysis demonstrated how grayscale lithography accurately controlled the lateral size of features but was less precise on the vertical height of the surface, and also introduced inherent roughness below the scale of patterning. Second, a micromechanical tester was used to characterize the adhesion of the surfaces with large-scale polished silicon spheres. The results showed that adhesion could be tailored, with significant contribution from all of the designed-in length scales of topography. The strength of adhesion did not correlate with conventional roughness parameters but could be accurately modeled using simple numerical integration. Taken together, this investigation demonstrates the promise and challenges of grayscale e-beam lithography with multiscale patterns as a method for the tailoring of surface performance.

Substrate-Independent Maskless Writing of Functionalized Microstructures Using CHic Chemistry and Digital Light Processing

Maskless photolithography based on digital light processing (DLP) is an attractive technique for the rapid, flexible, and cost-effective fabrication of complex structures with arbitrary surface profiles on the microscale. In this work, we introduce a new material system for structure formation by DLP that is based on photoreactive polymers for the local and light-induced C,H-insertion cross-linking (CHic). This approach allows a simple and versatile generation of microstructures with a broad spectrum of geometries and chemistries irrespective of the nature of the chosen substrates and thus allows direct writing of surface functionalization patterns with high spatial control. The CHicable prepolymer is first coated on a substrate to form a solvent-free (glassy) film, and then the DLP system patterns the light with arbitrary shape to induce local cross-linking of the prepolymer. Using this method, the desired structures with complex features with a lateral resolution of several microns and a topography of tens of nanometers could be fabricated within 30 s. Furthermore, the universal applicability of the CHic reaction enables the printing on a wide variety of substrates, which greatly broadens the using scenarios of this printing approach.

A novel hardmask-to-substrate pattern transfer method for creating 3D, multi-level, hierarchical, high aspect-ratio structures for applications in microfluidics and cooling technologies

This letter solves a major hurdle that mars photolithography-based fabrication of micro-mesoscale structures in silicon. Conventional photolithography is usually performed on smooth, flat wafer surfaces to lay a 2D design and subsequently etch it to create single-level features. It is, however, unable to process non-flat surfaces or already etched wafers and create more than one level in the structure. In this study, we have described a novel cleanroom-based process flow that allows for easy creation of such multi-level, hierarchical 3D structures in a substrate. This is achieved by introducing an ultra-thin sacrificial silicon dioxide hardmask layer on the substrate which is first 3D patterned via multiple rounds of lithography. This 3D pattern is then scaled vertically by a factor of 200–300 and transferred to the substrate underneath via a single shot deep etching step. The proposed method is also easily characterizable—using features of different topographies and dimensions, the etch rates and selectivities were quantified; this characterization information was later used while fabricating specific target structures. Furthermore, this study comprehensively compares the novel pattern transfer technique to already existing methods of creating multi-level structures, like grayscale lithography and chip stacking. The proposed process was found to be cheaper, faster, and easier to standardize compared to other methods—this made the overall process more reliable and repeatable. We hope it will encourage more research into hybrid structures that hold the key to dramatic performance improvements in several micro-mesoscale devices.

Origination of free-form micro-optical elements using one- and two-photon grayscale laser lithography

We discuss and describe the development of an origination process for planar free-form micro-optical elements from a given optical design. The targeted masters serve as origination structures for a roll-to-roll mass fabrication process. Specifically targeted are complex, optically smooth, surface relief structures with variable structure heights in the range of 1-20 µm, with typical lateral sizes of more than 5 µm. The area of the targeted masters is in the range of 1cm². The main part of the paper is devoted to the description of a self-developed grayscale laser direct-write platform enabling one- and two-photon absorption lithography, also in combination on one and the same sample. In the following, we describe both methods and show that both lead to excellent structural quality of surface micro-relief structures. As a showcase of what the system can do in principle, we designed and fabricated free-form micro-optical elements to project light from an LED as a defined light pattern onto a wall. The proper optical functionality of the fabricated element was shown within a demonstrator setup.

Rapid Prototyping of Organ-on-a-Chip Devices Using Maskless Photolithography

Organ-on-a-chip (OoC) and microfluidic devices are conventionally produced using microfabrication procedures that require cleanrooms, silicon wafers, and photomasks. The prototyping stage often requires multiple iterations of design steps. A simplified prototyping process could therefore offer major advantages. Here, we describe a rapid and cleanroom-free microfabrication method using maskless photolithography. The approach utilizes a commercial digital micromirror device (DMD)-based setup using 375 nm UV light for backside exposure of an epoxy-based negative photoresist (SU-8) on glass coverslips. We show that microstructures of various geometries and dimensions, microgrooves, and microchannels of different heights can be fabricated. New SU-8 molds and soft lithography-based polydimethylsiloxane (PDMS) chips can thus be produced within hours. We further show that backside UV exposure and grayscale photolithography allow structures of different heights or structures with height gradients to be developed using a single-step fabrication process. Using this approach: (1) digital photomasks can be designed, projected, and quickly adjusted if needed; and (2) SU-8 molds can be fabricated without cleanroom availability, which in turn (3) reduces microfabrication time and costs and (4) expedites prototyping of new OoC devices.

Direct-write microsphere photolithography of hierarchical infrared metasurfaces

A direct-write configuration of microsphere photolithography (MPL) is investigated for the patterning of IR metasurfaces at large scales. MPL uses a self-assembled hexagonal close-packed array of microspheres as an optical element to generate photonic nanojets within a photoresist layer. The photonic jets can be positioned within the microsphere-defined unit cells by controlling the illumination's angle of incidence (AOI). This allows the definition of complex antenna elements. A digital micromirror device is used to provide spatial modulation across the microsphere arrays and coordinated with a set of stages providing AOI control. This provides hierarchical patterning at the sub- and super-unit cell levels and is suitable for a range of metasurfaces. The constraints of this approach are analyzed and demonstrated with a polarization-dependent infrared perfect absorber/emitter, which agrees well with modeling.

Spherical concave micro-mirror fabricated using gray-tone optical lithography for vertical coupling

Based on gray-tone optical lithography technology combined with the overlay alignment method, a spherical concave micro-mirror is fabricated at the end of a rectangular optical waveguide (ROW) for low vertical coupling loss. The optimal structures of the spherical concave micro-mirrors were designed through ray-tracing simulation. The results indicate that the minimal vertical coupling loss is only 1.02 dB for the ROW core size of 20 μm × 20 μm. The surface roughness of the micro-mirror is considered, and it should be less than 106 nm to ensure that the vertical coupling loss is less than 1.5 dB. The radius of the fabricated spherical concave micro-mirror was measured as 263.3 μm and the surface roughness of the micro-mirror is 29.19 nm. The vertical coupling loss induced by the micro-mirror was measured as 1.39 dB. 1-dB tolerances in the direction of x-, y-, and z-axes are calculated to be ± 6.9 μm, ± 6.3 μm, and 46.2 μm, respectively.

An on-demand bench-top fabrication process for fluidic chips based on cross-diffusion through photopolymerization

In this paper, we propose a novel approach to fabricate fluidic chips. The method utilizes molecular cross-diffusion, induced by photopolymerization under ultraviolet (UV) irradiation in a channel pattern, to form the channel structures. During channel structure formation, the photopolymer layer still contains many uncured molecules. Subsequently, a top substrate is attached to the channel structure under adequate pressure, and the entire chip is homogenously irradiated by UV light. Immediately thereafter, a sufficiently sealed fluidic chip is formed. Using this fabrication process, the channel pattern of a chip can be designed quickly by a computer as binary images, and practical chips can be produced on demand at a benchtop, instead of awaiting production in specialized factories.

Grayscale Nanopixel Printing at Sub-10-nanometer Vertical Resolution via Light-Controlled Nanocapillarity

Nanotextures play increasingly important roles in nanotechnology. Recent studies revealed that their functionalities can be further enhanced by spatially modulating the height of their nanoscale pixels. Realizing the concept, however, is very challenging as it requires "grayscale" printing of the nanopixels in which their height is controlled within a few nanometers as a micrometric function of position. This work demonstrates such a high vertical and lateral resolution grayscale printing of polymeric nanopixels. We realize the height modulation by exploiting the discovery that the capillary rise of certain photopolymers can be optically controlled to stop at a predetermined height with sub-10-nm accuracy. Microscale spatial patterning of the control light directly extends the height modulation into a two-dimensionally patterned, grayscale nanopixel printing. Its utility is verified through readily reconfigurable, maskless printing of grayscale nanopixel arrays in dielectric and metallo-dielectric forms. This work also reveals the highly nonlinear and unstable nature of the polymeric nanocapillary effect, expanding its understanding and application scope.

Projection lithography patterned high-resolution quantum dots/thiol-ene photo-polymer pixels for color down conversion

Pixelated color converters are envisioned to achieve full-color high-resolution display through down conversion of blue/ultraviolet(UV) micro-LEDs. Quantum dots (QDs) are promising narrow-band converters of high quantum efficiency and brightness enabling saturated colors with wide color gamut in displays. Here we demonstrate high-resolution pixelated red and green QDs/thiol-ene photo-polymer converters (single pixel down to 6 µm; converters array of 21 µm pixel, 30 µm pitch and sub 10 µm thickness) patterned through projection lithography. QDs capped with amine surface group are uniformly dispersed in thiol-ene photo-polymer matrix at high concentrations (up to 100 mg/mL), which reduces aggregation and improves conversion efficiency by 0.5-1 times compared to drop-cast QDs. Color cross-talk is also reduced through patterning light blocking walls between converter pixels.

Rapid optical μ-printing of polymer top-lensed microlens array

Microlenses have wide applications for light beam focusing or shaping in micro-optical systems. However, it remains challenging for conventional microfabrication methods to rapidly fabricate arrays of microlenses with complex profiles like lens-on-lens structures. In this paper, we present the rapid fabrication of polymer microlenses with lens-on-lens structures by using a digital optical μ-printing technology. An improved dynamic optical exposure method is developed to directly and precisely fabricate polymer top-lensed microlenses (TLMLs). Arrays of TLMLs with either elongated focal depth or two separate foci have been numerically investigated and experimentally demonstrated.

Grey-scale silicon diffractive optics for selective laser ablation of thin conductive films

Laser beam shaping can play a crucial role in improving many laser processes, especially in selective laser patterning of thin films for display devices and solar cells. Typical Gaussian spatial energy distributions can increase damage to the substrate and lead to large crater edge ridges, which are sub-optimal for typical industrial thin film processes. We report on the design, fabrication, and testing of reflective silicon diffractive optics developed for spatial beam shaping at a wavelength of 355 nm. The application of the elements for laser-selective removal of 20 nm indium tin oxide thin films on glass substrates is demonstrated. The design of the phase profile is first generated using the numerical method of computer-generated holography. The phase profiles are realized on a silicon substrate using a novel two-step fabrication technique consisting of a calibrated focused ion beam and an inductively coupled plasma etch. This results in truly grey-scale, blazed diffractive optics, which were analyzed using white light interferometry and atomic force microscopy. Using the diffractive elements with 355 nm nanosecond pulses shows excellent focused spot profiles with a good reproduction of the intended design with a first-order off-axis diffractive efficiency of approximately 80% at a 45 deg angle of incidence.

Editorial for the Special Issue on MEMS Mirrors

MEMS mirrors can steer, modulate, and switch light, as well as control the wavefront for focusing or phase modulation.[...].