Enhancement of the Mechanical Properties of Polyimide Film by Microwave Irradiation

Exploring the Impact of Blend and Graft of Quinoline Derivative in Low-Temperature Curable Polyimides

The utilization of accelerators has been a common approach to prepare low-temperature curable polyimide (PI). However, the accelerators have gradually fallen out of favor because of their excessive dosages and negative effect on the properties of PI. In this work, a new strategy of introducing accelerators by grafting to eliminate these disadvantages is presented. A novel quinoline derivative named 6-([1,1'-biphenyl]-4-yl)-4-chloroquinoline (NQL) is designed for this purpose, and an ultralow dosage of only 2.5 mol% is sufficient to prepare low-temperature curable PI. The favorable low-temperature curing effect of NQL is attributed to its strong alkalinity (pKa = 18.47) and electron-donating ability. At a curing temperature of 200 °C, the PI with 2.5 mol% NQL showed outstanding properties (Young's modulus of 5.73 GPa, elongation of 37.3%, tensile strength of 237 MPa, and coefficient of thermal expansion of 16 ppm K-1 ). In particular, NQL can even lower the curing temperature to 180 °C and the ultralow temperature curable PI film still retains excellent properties. These results demonstrate that introducing low-temperature curable accelerators by partial grafting instead of blending is a promising way to furnish low-temperature curable PI, and provide insights into the preparation of polyimide with high performance in advanced packaging.

Enhancing the Toughness of Free-Standing Polyimide Films for Advanced Electronics Applications: A Study on the Impact of Film-Forming Processes

High-quality and free-standing polyimide (PI) film with desirable mechanical properties and uniformity is in high demand due to its widespread applications in highly precise flexible and chip-integrated sensors. In this study, a free-standing PI film with high toughness was successfully prepared using a diamine monomer with ether linkages. The prepared PI films exhibited significantly superior mechanical properties compared to PI films of the same molecular structure, which can be attributed to the systematic exploration of the film-forming process. The exploration of the film-forming process includes the curing procedures, film-forming substrates, and annealing treatments. Additionally, the thickness uniformity and surface homogeneity of free-standing films were crucial for toughness. Increasing the crystallinity of the PI films by eliminating residual stress also contributed to their high strength. The results demonstrate that by adjusting the above-mentioned factors, the prepared PI films possess excellent mechanical properties, with tensile strength and elongation at break of 194.71 MPa and 130.13%, respectively.

Preparation of a Crosslinked Poly(imide-siloxane) for Application to Transistor Insulation

Insulated gate bipolar transistor (IGBT) is an important power device for the conversion, control, and transmission of semiconductor power, and is used in various industrial fields. The IGBT module currently uses silicone gel as an insulating layer. Since higher power density and more severe temperature applications have become the trend according to the development of electronic device industry, insulating materials with improved heat resistance and insulation performances should be developed. In this study, we intended to synthesize a new insulating material with enhanced thermal stability and reduced thermal conductivity. Poly(imide-siloxane) (PIS) was prepared and crosslinked through a hydrosilylation reaction to obtain a semi-solid Crosslinked PIS. Thermal decomposition temperature, thermal conductivity, optical transparency, dielectric constant, and rheological property of the Crosslinked PIS were investigated and compared to those of a commercial silicone gel. The Crosslinked PIS showed high thermal stability and low thermal conductivity, along with other desirable properties, and so could be useful as an IGBT-insulating material.

Fabrication and mechanical, electrical properties study of polyimide films curing at low-temperature condition assisted by microwave

Polyimide (PI) films with excellent mechanical and electrical properties were produced at a low temperature assisted by microwave. Depending on the reciprocating movement of dipole molecules excited by microwave, even though under a low temperature, the rotation and conformational changes of functional groups could also be promoted. Thus, reaction between N-H bond and -OH in carboxyl which could realize dehydration and cyclization of polyamic acid proceeded normally. Results revealed that the combination between ambient temperature only at 70°C and microwave power at 2000 W or higher could also produce PI films with imidization degree of 100%. For PI-2000W, compared with traditional PI film (PI-300°C) that generated only at temperature of 300°C, even though on the basis of no any change in molecular structure and addition of filler, the tensile strength, elastic modulus, crystallinity, and apparent density increased by about 21%, 51%, 37%, and 5%, respectively. For electrical properties, conductivity enhanced by one to two orders of magnitude comparing with PI-300°C. Results indicated that while keeping the original molecular structure of PI films unchanged, this work provided a new and effective method to assist the enhancement in mechanical and electrical properties of PI films.

Improved Melt Processabilities of Thermosetting Polyimide Matrix Resins for High Temperature Carbon Fiber Composite Applications

With the goal of improving processability of imide oligomers and achieving of high temperature carbon fiber composite, a series of Thermosetting Matrix Resin solutions (TMR) were prepared by polycondensation of aromatic diamine (3,4′-oxybisbenzenamine, 3,4-ODA) and diester of biphenylene diacid (BPDE) using monoester of 4-phenylethynylphthalic acid (PEPE) as end-capping agent in ethyl alcohol as solvent to afford phenylethynyl-endcapped poly(amic ester) resins with calculated molecular weight (Calc’d M_w) of 1500–10,000. Meanwhile, a series of reactive diluent solutions (RDm) with Calc’d M_w of 600–2100 were also prepared derived from aromatic diamine (4,4′-oxybisbenzenamine, 4,4-ODA), diester of asymmetrical biphenylene diacid (α-BPDE) and monoester of 4-phenylethynylphthalic acid (PEPE) in ethyl alcohol. Then, the TMR solution was mixed with the RDm solution at different weight ratios to afford a series of A-staged thermosetting blend resin (TMR/RDm) solutions for carbon fiber composites. Experimental results demonstrated that the thermosetting blend resins exhibited improved melt processability and excellent thermal stability. After being thermally treated at 200 °C/1 h, the B-staged TMR/RDm showed very low melt viscosities and wider processing window. The minimum melt viscosities of ≤50 Pa·s was measured at ≤368 °C and the temperature scale at melt viscosities of ≤100 Pa·s were detected at 310–390 °C, respectively. The thermally cured neat resins at 380 °C/2 h showed a great combination of mechanical and thermal properties, including tensile strength of 84.0 MPa, elongation at breakage of 4.1%, and glass transition temperature (T_g) of 423 °C, successively. The carbon fiber reinforced polyimide composite processed by autoclave technique exhibited excellent mechanical properties both at room temperature and 370 °C. This study paved the way for the development of high-temperature resistant carbon fiber resin composites for use in complicated aeronautical structures.

Resin Transfer Moldable Fluorinated Phenylethynyl-Terminated Imide Oligomers with High Tg: Structure-Melt Stability Relationship

Phenylethynyl-terminated aromatic polyimides meet requirements of resin transfer molding (RTM) and exhibits high glass transition temperature (T_g) were prepared. Moreover, the relationship between the polyimide backbones structure and their melting stability was investigated. The phenylethynyl-terminated polyimides were based on 4,4′-(hexafluorosiopropylidene)-diphthalic anhydride (6FDA) and different diamines of 3,4′-oxydianiline (3,4′-ODA), m-phenylenediamine (m-PDA) and 2,2′-bis(trifluoromethyl)benzidine (TFDB) were prepared. These oligoimides exhibit excellent melting flowability with wide processing temperature window and low minimum melt viscosities (<1 Pa·s). Two of the oligoimides display good melting stability at 280–290 °C, which meet the requirements of resin transfer molding (RTM) process. After thermally cured, all resins show high glass transition temperatures (T_gs, 363–391 °C) and good tensile strength (51–66 MPa). The cure kinetics studied by the differential scanning calorimetry (DSC), ¹³C nuclear magnetic resonance (¹³C NMR) characterization and density functional theory (DFT) definitely confirmed that the electron-withdrawing ability of oligoimide backbone can tremendously affect the curing reactivity of terminated phenylethynyl groups. The replacement of 3,4′-ODA units by m-PDA or TFDB units increase the electron-withdrawing ability of the backbone, which increase the curing rate of terminated phenylethynyl groups at processing temperatures, hence results in the worse melting stability.