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Yang W, Mu Y, Chen X, Jin N, Song J, Chen J, Dong L, Liu C, Xuan W, Zhou C, Cong C, Shang J, He S, Wang G, Li J. CVD growth of large-area monolayer WS 2 film on sapphire through tuning substrate environment and its application for high-sensitive strain sensor. Nanoscale Res Lett 2023; 18:13. [PMID: 36795193 DOI: 10.1186/s11671-023-03782-z] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/22/2022] [Accepted: 01/28/2023] [Indexed: 05/24/2023]
Abstract
Large-area, continuous monolayer WS2 exhibits great potential for future micro-nanodevice applications due to its special electrical properties and mechanical flexibility. In this work, the front opening quartz boat is used to increase the amount of sulfur (S) vapor under the sapphire substrate, which is critical for achieving large-area films during the chemical vapor deposition processes. COMSOL simulations reveal that the front opening quartz boat will significantly introduce gas distribute under the sapphire substrate. Moreover, the gas velocity and height of substrate away from the tube bottom will also affect the substrate temperature. By carefully optimizing the gas velocity, temperature, and height of substrate away from the tube bottom, a large-scale continues monolayered WS2 film was achieved. Field-effect transistor based on the as-grown monolayer WS2 showed a mobility of 3.76 cm2V-1 s-1 and ON/OFF ratio of 106. In addition, a flexible WS2/PEN strain sensor with a gauge factor of 306 was fabricated, showing great potential for applications in wearable biosensors, health monitoring, and human-computer interaction.
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Affiliation(s)
- Weihuang Yang
- Engineering Research Center of Smart Microsensors and Microsystems, Ministry of Education, College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, 310018, China.
| | - Yuanbin Mu
- Engineering Research Center of Smart Microsensors and Microsystems, Ministry of Education, College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, 310018, China
| | - Xiangshuo Chen
- Engineering Research Center of Smart Microsensors and Microsystems, Ministry of Education, College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, 310018, China
| | - Ningjing Jin
- Engineering Research Center of Smart Microsensors and Microsystems, Ministry of Education, College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, 310018, China
| | - Jiahao Song
- Engineering Research Center of Smart Microsensors and Microsystems, Ministry of Education, College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, 310018, China
| | - Jiajun Chen
- State Key Laboratory of ASIC and System, School of Information Science and Technology, Fudan University, Shanghai, 200433, China
| | - Linxi Dong
- Engineering Research Center of Smart Microsensors and Microsystems, Ministry of Education, College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, 310018, China.
| | - Chaoran Liu
- Engineering Research Center of Smart Microsensors and Microsystems, Ministry of Education, College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, 310018, China
| | - Weipeng Xuan
- Engineering Research Center of Smart Microsensors and Microsystems, Ministry of Education, College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, 310018, China
| | - Changjie Zhou
- Department of Physics, School of Science, Jimei University, Xiamen, 361021, China.
| | - Chunxiao Cong
- State Key Laboratory of ASIC and System, School of Information Science and Technology, Fudan University, Shanghai, 200433, China.
- High Tech Center for New Materials, Novel Devices and Cutting Edge Manufacturing, Yiwu Research Institute of Fudan University, Chengbei Road, Yiwu City, 322000, Zhejiang, China.
| | - Jingzhi Shang
- Institute of Flexible Electronics (IFE), Northwestern Polytechnical University (NPU), 1 Dongxiang Road, Chang'an District, Xi'an, 710129, China
| | - Silin He
- Institute of Flexible Electronics (IFE), Northwestern Polytechnical University (NPU), 1 Dongxiang Road, Chang'an District, Xi'an, 710129, China
| | - Gaofeng Wang
- Engineering Research Center of Smart Microsensors and Microsystems, Ministry of Education, College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, 310018, China
| | - Jing Li
- Collaborative Innovation Center for Optoelectronic Semiconductors and Efficient Devices, Pen-Tung Sah Institute of Micro-Nano Science and Technology, Xiamen, 361005, China
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