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Xu K, Fu X, Wang X, Fu Z, Yang X, Chen S, Shi Y, Huang Y, Chen H. The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration. Materials (Basel) 2021; 15:ma15010108. [PMID: 35009255 PMCID: PMC8745900 DOI: 10.3390/ma15010108] [Citation(s) in RCA: 4] [Impact Index Per Article: 1.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 10/20/2021] [Revised: 12/04/2021] [Accepted: 12/12/2021] [Indexed: 11/24/2022]
Abstract
The grain orientation of Sn-based solder joints on copper pillars under the combined action of electron wind force and temperature gradient greatly affects their electromigration damage. The copper pillars with Sn-1.8Ag lead-free solder on the top was subjected to a current density of 1.5 × 104 A/cm2 at 125 °C to study the electromigration behaviors. The grain orientation was characterized by scanning electron microscopy (SEM) equipped with electron backscattered diffraction (EBSD) detector. Metal dissolution and voids formation in the cathode as well as massive intermetallic compounds(IMC) accumulation in the anode were observed after electromigration. Closer examination of solder joints revealed that the Sn grain whose c-axis perpendicular to electric current may have retarded Cu diffusion to anode and IMC accumulation. In addition, the newly formed Cu6Sn5 exhibited preferred orientation related to the electric current direction.
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Affiliation(s)
- Kexin Xu
- Department of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, China; (K.X.); (X.W.)
- Department of Reliability Design Research, China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou 510610, China; (Z.F.); (X.Y.); (S.C.); (Y.S.); (Y.H.)
- Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Xing Fu
- School of Electronics and Information, South China University of Technology, Guangzhou 510640, China
- Department of Reliability Design Research, China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou 510610, China; (Z.F.); (X.Y.); (S.C.); (Y.S.); (Y.H.)
- Correspondence: (X.F.); (H.C.)
| | - Xinjie Wang
- Department of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, China; (K.X.); (X.W.)
- Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Zhiwei Fu
- Department of Reliability Design Research, China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou 510610, China; (Z.F.); (X.Y.); (S.C.); (Y.S.); (Y.H.)
| | - Xiaofeng Yang
- Department of Reliability Design Research, China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou 510610, China; (Z.F.); (X.Y.); (S.C.); (Y.S.); (Y.H.)
| | - Si Chen
- Department of Reliability Design Research, China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou 510610, China; (Z.F.); (X.Y.); (S.C.); (Y.S.); (Y.H.)
| | - Yijun Shi
- Department of Reliability Design Research, China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou 510610, China; (Z.F.); (X.Y.); (S.C.); (Y.S.); (Y.H.)
| | - Yun Huang
- Department of Reliability Design Research, China Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, Guangzhou 510610, China; (Z.F.); (X.Y.); (S.C.); (Y.S.); (Y.H.)
| | - Hongtao Chen
- Department of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, China; (K.X.); (X.W.)
- Sauvage Laboratory for Smart Materials, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
- Correspondence: (X.F.); (H.C.)
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