Micromechanics and advanced designs for curved photodetector arrays in hemispherical electronic-eye cameras

Silicon-based transient electronics: principles, devices and applications

Recent advances in materials science, device designs and advanced fabrication technologies have enabled the rapid development of transient electronics, which represents a class of devices or systems that their functionalities and constitutions can be partially/completely degraded via chemical reaction or physical disintegration over a stable operation. Therefore, numerous potentials, including zero/reduced waste electronics, bioresorbable electronic implants, hardware security, and others, are expected. In particular, transient electronics with biocompatible and bioresorbable properties could completely eliminate the secondary retrieval surgical procedure after their in-body operation, thus offering significant potentials for biomedical applications. In terms of material strategies for the manufacturing of transient electronics, silicon nanomembranes (SiNMs) are of great interest because of their good physical/chemical properties, modest mechanical flexibility (depending on their dimensions), robust and outstanding device performances, and state-of-the-art manufacturing technologies. As a result, continuous efforts have been made to develop silicon-based transient electronics, mainly focusing on designing manufacturing strategies, fabricating various devices with different functionalities, investigating degradation or failure mechanisms, and exploring their applications. In this review, we will summarize the recent progresses of silicon-based transient electronics, with an emphasis on the manufacturing of SiNMs, devices, as well as their applications. After a brief introduction, strategies and basics for utilizing SiNMs for transient electronics will be discussed. Then, various silicon-based transient electronic devices with different functionalities are described. After that, several examples regarding on the applications, with an emphasis on the biomedical engineering, of silicon-based transient electronics are presented. Finally, summary and perspectives on transient electronics are exhibited.

Flexible and Stretchable Light-Emitting Diodes and Photodetectors for Human-Centric Optoelectronics

Optoelectronic devices with unconventional form factors, such as flexible and stretchable light-emitting or photoresponsive devices, are core elements for the next-generation human-centric optoelectronics. For instance, these deformable devices can be utilized as closely fitted wearable sensors to acquire precise biosignals that are subsequently uploaded to the cloud for immediate examination and diagnosis, and also can be used for vision systems for human-interactive robotics. Their inception was propelled by breakthroughs in novel optoelectronic material technologies and device blueprinting methodologies, endowing flexibility and mechanical resilience to conventional rigid optoelectronic devices. This paper reviews the advancements in such soft optoelectronic device technologies, honing in on various materials, manufacturing techniques, and device design strategies. We will first highlight the general approaches for flexible and stretchable device fabrication, including the appropriate material selection for the substrate, electrodes, and insulation layers. We will then focus on the materials for flexible and stretchable light-emitting diodes, their device integration strategies, and representative application examples. Next, we will move on to the materials for flexible and stretchable photodetectors, highlighting the state-of-the-art materials and device fabrication methods, followed by their representative application examples. At the end, a brief summary will be given, and the potential challenges for further development of functional devices will be discussed as a conclusion.

Nanomaterial-Based Artificial Vision Systems: From Bioinspired Electronic Eyes to In-Sensor Processing Devices

High-performance robotic vision empowers mobile and humanoid robots to detect and identify their surrounding objects efficiently, which enables them to cooperate with humans and assist human activities. For error-free execution of these robots' tasks, efficient imaging and data processing capabilities are essential, even under diverse and complex environments. However, conventional technologies fall short of meeting the high-standard requirements of robotic vision under such circumstances. Here, we discuss recent progress in artificial vision systems with high-performance imaging and data processing capabilities enabled by distinctive electrical, optical, and mechanical characteristics of nanomaterials surpassing the limitations of traditional silicon technologies. In particular, we focus on nanomaterial-based electronic eyes and in-sensor processing devices inspired by biological eyes and animal visual recognition systems, respectively. We provide perspectives on key nanomaterials, device components, and their functionalities, as well as explain the remaining challenges and future prospects of the artificial vision systems.

Mechanically-Guided 3D Assembly for Architected Flexible Electronics

Architected flexible electronic devices with rationally designed 3D geometries have found essential applications in biology, medicine, therapeutics, sensing/imaging, energy, robotics, and daily healthcare. Mechanically-guided 3D assembly methods, exploiting mechanics principles of materials and structures to transform planar electronic devices fabricated using mature semiconductor techniques into 3D architected ones, are promising routes to such architected flexible electronic devices. Here, we comprehensively review mechanically-guided 3D assembly methods for architected flexible electronics. Mainstream methods of mechanically-guided 3D assembly are classified and discussed on the basis of their fundamental deformation modes (i.e., rolling, folding, curving, and buckling). Diverse 3D interconnects and device forms are then summarized, which correspond to the two key components of an architected flexible electronic device. Afterward, structure-induced functionalities are highlighted to provide guidelines for function-driven structural designs of flexible electronics, followed by a collective summary of their resulting applications. Finally, conclusions and outlooks are given, covering routes to achieve extreme deformations and dimensions, inverse design methods, and encapsulation strategies of architected 3D flexible electronics, as well as perspectives on future applications.

Recent progress in construction methods and applications of perovskite photodetector arrays

Metal halide perovskites are considered promising materials for next-generation optoelectronic devices due to their excellent optoelectronic performances and simple solution preparation process. Precise micro/nano-scale patterning techniques enable perovskite materials to be used for array integration of photodetectors. In this review, the device types of perovskite-based photodetectors are introduced and the structural characteristics and corresponding device performances are analyzed. Then, the typical construction methods suitable for the fabrication of perovskite photodetector arrays are highlighted, including surface treatment technology, template-assisted construction, inkjet printing technology, and modified photolithography. Furthermore, the current development trends and their applications in image sensing of perovskite photodetector arrays are summarized. Finally, major challenges are presented to guide the development of perovskite photodetector arrays.

A Hemispherical Image Sensor Array Fabricated with Organic Photomemory Transistors

Hemispherical image sensors simplify lens designs, reduce optical aberrations, and improve image resolution for compact wide-field-of-view cameras. To achieve hemispherical image sensors, organic materials are promising candidates due to the following advantages: tunability of optoelectronic/spectral response and low-temperature low-cost processes. Here, a photolithographic process is developed to prepare a hemispherical image sensor array using organic thin film photomemory transistors with a density of 308 pixels per square centimeter. This design includes only one photomemory transistor as a single active pixel, in contrast to the conventional pixel architecture, consisting of select/readout/reset transistors and a photodiode. The organic photomemory transistor, comprising light-sensitive organic semiconductor and charge-trapping dielectric, is able to achieve a linear photoresponse (light intensity range, from 1 to 50 W m^-2 ), along with a responsivity as high as 1.6 A W^-1 (wavelength = 465 nm) for a dark current of 0.24 A m^-2 (drain voltage = -1.5 V). These observed values represent the best responsivity for similar dark currents among all the reported hemispherical image sensor arrays to date. A transfer method was further developed that does not damage organic materials for hemispherical organic photomemory transistor arrays. These developed techniques are scalable and are amenable for other high-resolution 3D organic semiconductor devices.

Flexible Sensory Systems: Structural Approaches

Biology is characterized by smooth, elastic, and nonplanar surfaces; as a consequence, soft electronics that enable interfacing with nonplanar surfaces allow applications that could not be achieved with the rigid and integrated circuits that exist today. Here, we review the latest examples of technologies and methods that can replace elasticity through a structural approach; these approaches can modify mechanical properties, thereby improving performance, while maintaining the existing material integrity. Furthermore, an overview of the recent progress in wave/wrinkle, stretchable interconnect, origami/kirigami, crack, nano/micro, and textile structures is provided. Finally, potential applications and expected developments in soft electronics are discussed.

Well-rounded devices: the fabrication of electronics on curved surfaces - a review

With the arrival of the internet of things and the rise of wearable computing, electronics are playing an increasingly important role in our everyday lives. Until recently, however, the rigid angular nature of traditional electronics has prevented them from being integrated into many of the organic, curved shapes that interface with our bodies (such as ergonomic equipment or medical devices) or the natural world (such as aerodynamic or optical components). In the past few years, many groups working in advanced manufacturing and soft robotics have endeavored to develop strategies for fabricating electronics on these curved surfaces. This is their story. In this work, we describe the motivations, challenges, methodologies, and applications of curved electronics, and provide a outlook for this promising field.

Biomimetic models of the human eye, and their applications

Replicating the functionality of the human eye has been a challenge for more than a century, creating a great wealth of biomimetic and bioinspired devices, and providing ever improving models of the eye for myriad research purposes. As improvements in microelectronics have proceeded, individual components of the eye have been replicated, and models of the optical behaviour of the eye have improved. This review explores both work developed for improving medical components, with an ultimate aim of a fully functioning prosthetic eye, and work looking at improving existing devices through biomimetic means. It is hoped that this holistic approach to the subject will aid in the cross pollination of ideas between the two research foci. The review starts by summarising the reported measurements of optical parameters of various components of the eye. It then charts the development of individual bionic components. Particular focus is put on the development of bionic and biomimetic forms of the two main adaptive components of the eye, namely the lens and the iris, and the challenges faced in modelling the light sensitive retina. Work on each of these components is thoroughly reviewed, including an overview of the principles behind the many different approaches used to mimic the functionality, and discussion of the pros and cons of each approach. This is concluded by an overview of several reported models of the complete or semi-complete eye, including details of the components used and a summary of the models' functionality. Finally, some consideration is given to the direction of travel of this field of research, and which existing approaches are likely to bring us closer to the long term goal of a fully functional analogue of the eye.

Bioinspired design and assembly of a multilayer cage-shaped sensor capable of multistage load bearing and collapse prevention

Flexible bioinspired mesostructures and electronic devices have recently attracted intense attention because of their widespread application in microelectromechanical systems (MEMS), reconfigurable electronics, health-monitoring systems, etc. Among various geometric constructions, 3D flexible bioinspired architectures are of particular interest, since they can provide new functions and capabilities, compared to their 2D counterparts. However, 3D electronic device systems usually undergo complicated mechanical loading in practical operation, resulting in complex deformation modes and elusive failure mechanisms. The development of mechanically robust flexible 3D electronics that can undergo extreme compression without irreversible collapse or fracture remains a challenge. Here, inspired by the multilayer mesostructure of Enhydra lutris fur, we introduce the design and assembly of multilayer cage architectures capable of multistage load bearing and collapse prevention under large out-of-plane compression. Combined in situ experiments and mechanical modeling show that the multistage mechanical responses of the developed bionic architectures can be fine-tuned by tailoring the microstructural geometries. The integration of functional layers of gold and piezoelectric polymer allows the development of a flexible multifunctional sensor that can simultaneously achieve the dynamic sensing of compressive forces and temperatures. The demonstrated capabilities and performances of fast response speed, tunable measurement range, excellent flexibility, and reliability suggest potential uses in MEMS, robotics and biointegrated electronics.

Bioinspired Multiscale Wrinkling Patterns on Curved Substrates: An Overview

The surface wrinkling of biological tissues is ubiquitous in nature. Accumulating evidence suggests that the mechanical force plays a significant role in shaping the biological morphologies. Controlled wrinkling has been demonstrated to be able to spontaneously form rich multiscale patterns, on either planar or curved surfaces. The surface wrinkling on planar substrates has been investigated thoroughly during the past decades. However, most wrinkling morphologies in nature are based on the curved biological surfaces and the research of controllable patterning on curved substrates still remains weak. The study of wrinkling on curved substrates is critical for understanding the biological growth, developing three-dimensional (3D) or four-dimensional (4D) fabrication techniques, and creating novel topographic patterns. In this review, fundamental wrinkling mechanics and recent advances in both fabrications and applications of the wrinkling patterns on curved substrates are summarized. The mechanics behind the wrinkles is compared between the planar and the curved cases. Beyond the film thickness, modulus ratio, and mismatch strain, the substrate curvature is one more significant parameter controlling the surface wrinkling. Curved substrates can be both solid and hollow with various 3D geometries across multiple length scales. Up to date, the wrinkling morphologies on solid/hollow core-shell spheres and cylinders have been simulated and selectively produced. Emerging applications of the curved topographic patterns have been found in smart wetting surfaces, cell culture interfaces, healthcare materials, and actuators, which may accelerate the development of artificial organs, stimuli-responsive devices, and micro/nano fabrications with higher dimensions.

Mechanically-Guided Structural Designs in Stretchable Inorganic Electronics

Over the past decade, the area of stretchable inorganic electronics has evolved very rapidly, in part because the results have opened up a series of unprecedented applications with broad interest and potential for impact, especially in bio-integrated systems. Low modulus mechanics and the ability to accommodate extreme mechanical deformations, especially high levels of stretching, represent key defining characteristics. Most existing studies exploit structural material designs to achieve these properties, through the integration of hard inorganic electronic components configured into strategic 2D/3D geometries onto patterned soft substrates. The diverse structural geometries developed for stretchable inorganic electronics are summarized, covering the designs of functional devices and soft substrates, with a focus on fundamental principles, design approaches, and system demonstrations. Strategies that allow spatial integration of 3D stretchable device layouts are also highlighted. Finally, perspectives on the remaining challenges and open opportunities are provided.

Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches

The miniaturization of electronics has been an important topic of study for several decades. The established roadmaps following Moore's Law have encountered bottlenecks in recent years, as planar processing techniques are already close to their physical limits. To bypass some of the intrinsic challenges of planar technologies, more and more efforts have been devoted to the development of 3D electronics, through either direct 3D fabrication or indirect 3D assembly. Recent research efforts into direct 3D fabrication have focused on the development of 3D transistor technologies and 3D heterogeneous integration schemes, but these technologies are typically constrained by the accessible range of sophisticated 3D geometries and the complexity of the fabrication processes. As an alternative route, 3D assembly methods make full use of mature planar technologies to form predefined 2D precursor structures in the desired materials and sizes, which are then transformed into targeted 3D mesostructures by mechanical deformation. The latest progress in the area of micro/nanoscale 3D assembly, covering the various classes of methods through rolling, folding, curving, and buckling assembly, is discussed, focusing on the design concepts, principles, and applications of different methods, followed by an outlook on the remaining challenges and open opportunities.

Bioinspired Electronics for Artificial Sensory Systems

Humans have a myriad of sensory receptors in different sense organs that form the five traditionally recognized senses of sight, hearing, smell, taste, and touch. These receptors detect diverse stimuli originating from the world and turn them into brain-interpretable electrical impulses for sensory cognitive processing, enabling us to communicate and socialize. Developments in biologically inspired electronics have led to the demonstration of a wide range of electronic sensors in all five traditional categories, with the potential to impact a broad spectrum of applications. Here, recent advances in bioinspired electronics that can function as potential artificial sensory systems, including prosthesis and humanoid robots are reviewed. The mechanisms and demonstrations in mimicking biological sensory systems are individually discussed and the remaining future challenges that must be solved for their versatile use are analyzed. Recent progress in bioinspired electronic sensors shows that the five traditional senses are successfully mimicked using novel electronic components and the performance regarding sensitivity, selectivity, and accuracy have improved to levels that outperform human sensory organs. Finally, neural interfacing techniques for connecting artificial sensors to the brain are discussed.

Towards Infrared Electronic Eyes: Flexible Colloidal Quantum Dot Photovoltaic Detectors Enhanced by Resonant Cavity

Electronic eye cameras are receiving increasing interest due to their unique advantages such as wide field of view, low aberrations, and simple imaging optics compared to conventional planar focal plane arrays. However, the spectral sensing ranges of most electronic eyes are confined to the visible, which is limited by the energy gaps of the sensing materials and by fabrication obstacles. Here, a potential route leading to infrared electronic eyes is demonstrated by exploring flexible colloidal quantum dot (CQD) photovoltaic detectors. Benefitting from their tunable optical response and the ease of fabrication as solution processable materials, mercury telluride (HgTe) CQD detectors with mechanical flexibility, wide spectral sensing range, fast response, and high detectivity are demonstrated. A strategy is provided to further enhance the light absorption in flexible detectors by integrating a Fabry-Perot resonant cavity. Integrated short-wave IR detectors on flexible substrates have peak D^* of 7.5 × 10¹⁰ Jones at 2.2 µm at room temperature and promise the development of infrared electronic eyes with high-resolution imaging capability. Finally, infrared images are captured with the flexible CQD detectors at varying bending conditions, showing a practical approach to sensitive infrared electronic eyes beyond the visible range.

Materials and Structures toward Soft Electronics

Soft electronics are intensively studied as the integration of electronics with dynamic nonplanar surfaces has become necessary. Here, a discussion of the strategies in materials innovation and structural design to build soft electronic devices and systems is provided. For each strategy, the presentation focuses on the fundamental materials science and mechanics, and example device applications are highlighted where possible. Finally, perspectives on the key challenges and future directions of this field are presented.

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors

Flexible photodetectors have been intensely studied for the use of curved image sensors, which are a crucial component in bio-inspired imaging systems, but several challenging points remain, such as a low absorption efficiency due to a thin active layer and low flexibility. We present an advanced method to fabricate a flexible phototransistor array with an improved electrical performance. The outstanding electrical performance is driven by a low dark current owing to deep impurity doping. Stretchable and flexible metal interconnectors simultaneously offer electrical and mechanical stabilities in a highly deformed state. The protocol explicitly describes the fabrication process of the phototransistor using a thin silicon membrane. By measuring I-V characteristics of the completed device in deformed states, we demonstrate that this approach improves the mechanical and electrical stabilities of the phototransistor array. We expect that this approach to a flexible phototransistor can be widely used for the applications of not only next-generation imaging systems/optoelectronics but also wearable devices such as tactile/pressure/temperature sensors and health monitors.

THEORETICAL AND EXPERIMENTAL STUDY OF TAPE TRANSFER PRINTING FOR STRETCHABLE ELECTRONIC FABRICATION

Transfer printing is an effective way to assemble a soft stamp to transfer solid components from one substrate to a soft target substrate. The critical parameter in transfer printing is the adhesion force at the electronic devices/silicon interface. This paper proposes an improved transfer printing method based on polyvinyl alcohol (PVA) water-soluble tape for reducing the interfacial energy at stretchable electronics/glass interface. Whether the stretchable electronics are peeled off successfully or not, depends on the peeling energy release rate, which is obtained by the home-made peeling experiment platform for stretchable electronics delaminated from the rigid glass. Compared with polydimethylsiloxane (PDMS) substrate, the critical energy release rate is reduced by 60% via PVA tape transfer printing which is helpful to delaminate the stretchable electronics from the glass surface. The improved transfer printing method provides an effective way for the stretchable electronics to be directly printed to the soft target tissues.

A Flexible High-Performance Photoimaging Device Based on Bioinspired Hierarchical Multiple-Patterned Plasmonic Nanostructures

In insect eyes, ommatidia with hierarchical structured cornea play a critical role in amplifying and transferring visual signals to the brain through optic nerves, enabling the perception of various visual signals. Here, inspired by the structure and functions of insect ommatidia, a flexible photoimaging device is reported that can simultaneously detect and record incoming photonic signals by vertically stacking an organic photodiode and resistive memory device. A single-layered, hierarchical multiple-patterned back reflector that can exhibit various plasmonic effects is incorporated into the organic photodiode. The multiple-patterned flexible organic photodiodes exhibit greatly enhanced photoresponsivity due to the increased light absorption in comparison with the flat systems. Moreover, the flexible photoimaging device shows a well-resolved spatiotemporal mapping of optical signals with excellent operational and mechanical stabilities at low driving voltages below half of the flat systems. Theoretical calculation and scanning near-field optical microscopy analyses clearly reveal that multiple-patterned electrodes have much stronger surface plasmon coupling than flat and single-patterned systems. The developed methodology provides a versatile and effective route for realizing high-performance optoelectronic and photonic systems.

Parametric Optimization of Lateral NIPIN Phototransistors for Flexible Image Sensors

Curved image sensors, which are a key component in bio-inspired imaging systems, have been widely studied because they can improve an imaging system in various aspects such as low optical aberrations, small-form, and simple optics configuration. Many methods and materials to realize a curvilinear imager have been proposed to address the drawbacks of conventional imaging/optical systems. However, there have been few theoretical studies in terms of electronics on the use of a lateral photodetector as a flexible image sensor. In this paper, we demonstrate the applicability of a Si-based lateral phototransistor as the pixel of a high-efficiency curved photodetector by conducting various electrical simulations with technology computer aided design (TCAD). The single phototransistor is analyzed with different device parameters: the thickness of the active cell, doping concentration, and structure geometry. This work presents a method to improve the external quantum efficiency (EQE), linear dynamic range (LDR), and mechanical stability of the phototransistor. We also evaluated the dark current in a matrix form of phototransistors to estimate the feasibility of the device as a flexible image sensor. Moreover, we fabricated and demonstrated an array of phototransistors based on our study. The theoretical study and design guidelines of a lateral phototransistor create new opportunities in flexible image sensors.

Gyrification-Inspired Highly Convoluted Graphene Oxide Patterns for Ultralarge Deforming Actuators

Gyrification in the human brain is driven by the compressive stress induced by the tangential expansion of the cortical layer, while similar topographies can also be induced by the tangential shrinkage of the spherical substrate. Herein we introduce a simple three-dimensional (3D) shrinking method to generate the cortex-like patterns using two-dimensional (2D) graphene oxide (GO) as the building blocks. By rotation-dip-coating a GO film on an air-charged latex balloon and then releasing the air slowly, a highly folded hydrophobic GO surface can be induced. Wrinkling-to-folding transition was observed and the folding state can be easily regulated by varying the prestrain of the substrate and the thickness of the GO film. Driven by the residue stresses stored in the system, sheet-to-tube actuating occurs rapidly once the bilayer system is cut into slices. In response to some organic solvents, however, the square bilayer actuator exhibits excellent reversible, bidirectional, large-deformational curling properties on wetting and drying. An ultralarge curvature of 2.75 mm^-1 was observed within 18 s from the original negative bending to the final positive bending in response to tetrahydrofuran (THF). In addition to a mechanical hand, a swimming worm, a smart package, a bionic mimosa, and two bionic flowers, a crude oil collector has been designed and demonstrated, aided by the superhydrophobic and superoleophilic modified GO surface and the solvent-responsive bilayer system.

Highly curved image sensors: a practical approach for improved optical performance

The significant optical and size benefits of using a curved focal surface for imaging systems have been well studied yet never brought to market for lack of a high-quality, mass-producible, curved image sensor. In this work we demonstrate that commercial silicon CMOS image sensors can be thinned and formed into accurate, highly curved optical surfaces with undiminished functionality. Our key development is a pneumatic forming process that avoids rigid mechanical constraints and suppresses wrinkling instabilities. A combination of forming-mold design, pressure membrane elastic properties, and controlled friction forces enables us to gradually contact the die at the corners and smoothly press the sensor into a spherical shape. Allowing the die to slide into the concave target shape enables a threefold increase in the spherical curvature over prior approaches having mechanical constraints that resist deformation, and create a high-stress, stretch-dominated state. Our process creates a bridge between the high precision and low-cost but planar CMOS process, and ideal non-planar component shapes such as spherical imagers for improved optical systems. We demonstrate these curved sensors in prototype cameras with custom lenses, measuring exceptional resolution of 3220 line-widths per picture height at an aperture of f/1.2 and nearly 100% relative illumination across the field. Though we use a 1/2.3" format image sensor in this report, we also show this process is generally compatible with many state of the art imaging sensor formats. By example, we report photogrammetry test data for an APS-C sized silicon die formed to a 30° subtended spherical angle. These gains in sharpness and relative illumination enable a new generation of ultra-high performance, manufacturable, digital imaging systems for scientific, industrial, and artistic use.

Adhesiveless Transfer Printing of Ultrathin Microscale Semiconductor Materials by Controlling the Bending Radius of an Elastomeric Stamp

High-performance electronic devices integrated onto unconventional substrates provide opportunities for use in diverse applications, such as wearable or implantable forms of electronic devices. However, the interlayer adhesives between the electronic devices and substrates often limit processing temperature or cause electrical or thermal resistance at the interface. This paper introduces a very simple but effective transfer printing method that does not require an interlayer adhesive. Controlling the bending radius of a simple flat stamp enables picking up or printing of microscale semiconductor materials onto rigid, curvilinear, or flexible surfaces without the aid of a liquid adhesive. Theoretical and experimental studies reveal the underlying mechanism of the suggested approach. Adhesiveless printing of thin Si plates onto diverse substrates demonstrates the capability of this method.

Stretchable Active Matrix Temperature Sensor Array of Polyaniline Nanofibers for Electronic Skin

A stretchable polyaniline nanofiber temperature sensor array with an active matrix consisting of single-walled carbon nanotube thin-film transistors is demonstrated. The integrated temperature sensor array gives mechanical stability under biaxial stretching of 30%, and the resultant spatial temperature mapping does not show any mechanical or electrical degradation.

Photoresistless fabrication of periodic patterns on GaAs by laser interference photochemical lithography

SEM images of (a) two-beam and (b) three-beam interference patterns formed on GaAs wafers by photochemical etching with an incident angle of 17°.

Analysis of deformation of flexible hemispherical lens arrays based on soft elastomers

In this paper, flexible hemispherical lens arrays based on soft elastomers were fabricated. Then, the effects of various geometric parameters on the deformation (i.e., hemispherical deformation and radial extension) of these lens arrays were investigated experimentally and were verified by finite element analysis. We focused on determining the relationship between the geometric parameters and the radius of curvature of the lens. We found that the height of the lens support post plays an important role in minimizing changes in the radius of curvature of the lens. The results of this research offer valuable design principles for flexible lens arrays, which can be used as an optical component of various flexible optoelectronic devices.

Geckoprinting: assembly of microelectronic devices on unconventional surfaces by transfer printing with isolated gecko setal arrays

Developing electronics in unconventional forms provides opportunities to expand the use of electronics in diverse applications including bio-integrated or implanted electronics. One of the key challenges lies in integrating semiconductor microdevices onto unconventional substrates without glue, high pressure or temperature that may cause damage to microdevices, substrates or interfaces. This paper describes a solution based on natural gecko setal arrays that switch adhesion mechanically on and off, enabling pick and place manipulation of thin microscale semiconductor materials onto diverse surfaces including plants and insects whose surfaces are usually rough and irregular. A demonstration of functional 'geckoprinted' microelectronic devices provides a proof of concept of our results in practical applications.

25th anniversary article: The evolution of electronic skin (e-skin): a brief history, design considerations, and recent progress

Human skin is a remarkable organ. It consists of an integrated, stretchable network of sensors that relay information about tactile and thermal stimuli to the brain, allowing us to maneuver within our environment safely and effectively. Interest in large-area networks of electronic devices inspired by human skin is motivated by the promise of creating autonomous intelligent robots and biomimetic prosthetics, among other applications. The development of electronic networks comprised of flexible, stretchable, and robust devices that are compatible with large-area implementation and integrated with multiple functionalities is a testament to the progress in developing an electronic skin (e-skin) akin to human skin. E-skins are already capable of providing augmented performance over their organic counterpart, both in superior spatial resolution and thermal sensitivity. They could be further improved through the incorporation of additional functionalities (e.g., chemical and biological sensing) and desired properties (e.g., biodegradability and self-powering). Continued rapid progress in this area is promising for the development of a fully integrated e-skin in the near future.

Fabrication of a stretchable solid-state micro-supercapacitor array

We fabricated a stretchable micro-supercapacitor array with planar SWCNT electrodes and an ionic liquid-based triblock copolymer electrolyte. The mechanical stability of the entire supercapacitor array upon stretching was obtained by adopting strategic design concepts. First, the narrow and long serpentine metallic interconnections were encapsulated with polyimide thin film to ensure that they were within the mechanical neutral plane. Second, an array of two-dimensional planar micro-supercapacitor with SWCNT electrodes and an ion-gel-type electrolyte was made to achieve all-solid-state energy storage devices. The formed micro-supercapacitor array showed excellent performances which were stable over stretching up to 30% without any noticeable degradation. This work shows the strong potential of a stretchable micro-supercapacitor array in applications such as wearable computers, power dressing, electronic newspapers, paper-like mobile phones, and other easily collapsible gadgets.

High performance stretchable UV sensor arrays of SnO2 nanowires

A high performance, stretchable UV sensor array was fabricated based on an active matrix (AM) device that combined field effect transistors of SWCNTs and SnO2 nanowires. The AM devices provided spatial UV sensing via the individual sensors in the array. SnO2 NW UV sensors showed an average photosensitivity of ∼10(5) and a photoconductive gain of ∼10(6) under very low UV (λ = 254 nm) power intensities of 0.02-0.04 mW cm(-2). The UV sensing performance was not deteriorated by a prestrain of up to 23% induced by radial deformation, consistent with the mechanical analysis.

Controlled morphology of thin film silicon integrated with environmentally responsive hydrogels

Environmentally responsive hydrogels hold multiple important applications. However, the functionality of these materials alone is often limited in comparison to other materials like silicon; thus, there is a need to integrate soft and hard materials for the advancement of environmentally sensitive materials. Here we demonstrate the capability of integrating a thermoresponsive hydrogel, poly(N-isopropylacrylamide), with thin film silicon ribbons, enabling the stiff silicon ribbons to become adaptive and drivable by the soft environmentally sensitive substrate. This integration provides a means of mechanical buckling of the thin silicon film due to changes in environmental stimuli (e.g., temperature, pH). We also investigate how advanced lithographic techniques can be used to generate patterned deformation on the aforementioned integrated structures. Furthermore, we explore multilayer hybrid hydrogel structures formed by the integration of different types of hydrogels that have tunable curvatures under the influence of different stimuli. Silicon thin film integration on such tunable curvature substrates reveal characteristic reversible buckling of the thin film in the presence of multiple stimuli. These results open new opportunities for developing stretchable and intelligent devices for multiple applications.

Buckling in serpentine microstructures and applications in elastomer-supported ultra-stretchable electronics with high areal coverage

Lithographically defined electrical interconnects with thin, filamentary serpentine layouts have been widely explored for use in stretchable electronics supported by elastomeric substrates. We present a systematic and thorough study of buckling physics in such stretchable serpentine microstructures, and a strategic design of serpentine layout for ultra-stretchable electrode, via analytical models, finite element method (FEM) computations, and quantitative experiments. Both the onset of buckling and the postbuckling behaviors are examined, to determine scaling laws for the critical buckling strain and the limits of elastic behavior. Two buckling modes, namely the symmetric and anti-symmetric modes, are identified and analyzed, with experimental images and numerical results that show remarkable levels of agreement for the associated postbuckling processes. Based on these studies and an optimization in design layout, we demonstrate routes for application of serpentine interconnects in an ultra-stretchable electrode that offer, simultaneously, an areal coverage as high as 81%, and a biaxial stretchability as large as ~170%.

Fatigue-free, electrically reliable copper electrode with nanohole array

Design and fabrication of reliable electrodes is one of the most important challenges in flexible devices, which undergo repeated deformation. In conventional approaches, mechanical and electrical properties of continuous metal films degrade gradually because of the fatigue damage. The designed incorporation of nanoholes into Cu electrodes can enhance the reliability. In this study, the electrode shows extremely low electrical resistance change during bending fatigue because the nanoholes suppress crack initiation by preventing protrusion formation and damage propagation by crack tip blunting. This concept provides a key guideline for developing fatigue-free flexible electrodes.

Transfer printing techniques for materials assembly and micro/nanodevice fabrication

Transfer printing represents a set of techniques for deterministic assembly of micro-and nanomaterials into spatially organized, functional arrangements with two and three-dimensional layouts. Such processes provide versatile routes not only to test structures and vehicles for scientific studies but also to high-performance, heterogeneously integrated functional systems, including those in flexible electronics, three-dimensional and/or curvilinear optoelectronics, and bio-integrated sensing and therapeutic devices. This article summarizes recent advances in a variety of transfer printing techniques, ranging from the mechanics and materials aspects that govern their operation to engineering features of their use in systems with varying levels of complexity. A concluding section presents perspectives on opportunities for basic and applied research, and on emerging use of these methods in high throughput, industrial-scale manufacturing.

Stretchable semiconductor technologies with high areal coverages and strain-limiting behavior: demonstration in high-efficiency dual-junction GaInP/GaAs photovoltaics

Notched islands on a thin elastomeric substrate serve as a platform for dual-junction GaInP/GaAs solar cells with microscale dimensions and ultrathin forms for stretchable photovoltaic modules. These designs allow for a high degree of stretchability and areal coverage, and they provide a natural form of strain-limiting behavior, helping to avoid destructive effects of extreme deformations.

Pitch reduction lithography by pressure-assisted selective wetting and thermal reflow

We report on a new pitch reduction lithographic technique by utilizing pressure-assisted selective wetting and thermal reflow. The primary line-and-space pattern of low molecular weight polystyrene (PS) (Mw=17,300) was formed by solvent-assisted capillary force lithography (CFL), on which a diluted photoresist (PR) solution was selectively filled into the spaces by the application of a slight pressure (200 g cm(-2)). Subsequent removal of the PS pattern by toluene and ashing process led to a line pattern with approximately 50% pitch reduction. It was observed that the size reduction and space to width ratios were controllable by changing PR concentration and ashing time.

SnO2 nanowire logic devices on deformable nonplanar substrates

Logic inverters consisting of n-type FETs and resistors with SnO(2) nanowire channels were fabricated on films of the elastomer polydimethylsiloxane, prestrained and flattened into planar sheets from initial, preformed hemispherical shapes. Upon release, thin and narrow interconnects between individual devices in the arrays absorb induced strain by buckling into nonplanar sinusoidal shapes, to allow full recovery of the surfaces to their original convex geometries. The same physics allows deformation of convex shapes into concave ones, as well as more complex surfaces of coexisting convex and concave areas, and small regions with extremely stretched, locally tapered forms, all nondestructively achieved while maintaining electrical performance, enhanced by use of air gap gate dielectrics. This work shows, more generally, that nanowire devices with both conventional and unusual designs can be integrated into overall systems with irregular, nonplanar layouts, easily deformed in reversible fashion without any measurable alteration in electrical characteristics. The results suggest potential applicability of nanowire technologies in systems of tissue-matched implantable electronics for mounting directly on human organs or of sensor skins for integration with robotic manipulators.

Freeform manufacturing of a microoptical lens array on a steep curved substrate by use of a voice coil fast tool servo

We report what is to our knowledge the first approach to diamond turn microoptical lens array on a steep curved substrate by use of a voice coil fast tool servo. In recent years ultraprecision machining has been employed to manufacture accurate optical components with 3D structure for beam shaping, imaging and nonimaging applications. As a result, geometries that are difficult or impossible to manufacture using lithographic techniques might be fabricated using small diamond tools with well defined cutting edges. These 3D structures show no rotational symmetry, but rather high frequency asymmetric features thus can be treated as freeform geometries. To transfer the 3D surface data with the high frequency freeform features into a numerical control code for machining, the commonly piecewise differentiable surfaces are represented as a cloud of individual points. Based on this numeric data, the tool radius correction is calculated to account for the cutting-edge geometry. Discontinuities of the cutting tool locations due to abrupt slope changes on the substrate surface are bridged using cubic spline interpolation.When superimposed with the trajectory of the rotationally symmetric substrate the complete microoptical geometry in 3D space is established. Details of the fabrication process and performance evaluation are described.

Dynamically tunable hemispherical electronic eye camera system with adjustable zoom capability

Imaging systems that exploit arrays of photodetectors in curvilinear layouts are attractive due to their ability to match the strongly nonplanar image surfaces (i.e., Petzval surfaces) that form with simple lenses, thereby creating new design options. Recent work has yielded significant progress in the realization of such "eyeball" cameras, including examples of fully functional silicon devices capable of collecting realistic images. Although these systems provide advantages compared to those with conventional, planar designs, their fixed detector curvature renders them incompatible with changes in the Petzval surface that accompany variable zoom achieved with simple lenses. This paper describes a class of digital imaging device that overcomes this limitation, through the use of photodetector arrays on thin elastomeric membranes, capable of reversible deformation into hemispherical shapes with radii of curvature that can be adjusted dynamically, via hydraulics. Combining this type of detector with a similarly tunable, fluidic plano-convex lens yields a hemispherical camera with variable zoom and excellent imaging characteristics. Systematic experimental and theoretical studies of the mechanics and optics reveal all underlying principles of operation. This type of technology could be useful for night-vision surveillance, endoscopic imaging, and other areas that require compact cameras with simple zoom optics and wide-angle fields of view.

Experimental and modeling studies of imaging with curvilinear electronic eye cameras

Model calculations and the experimental measurements of the imaging properties of planar, hemispherical, and elliptic parabolic electronic eye cameras are compared. Numerical methods for comprehensive full field calculations of image formation are enabled by use computationally efficient modes. Quantitative agreement between these calculations and experimentally measured images of test patterns reveals advantages of curvilinear camera systems, and provides guidelines for future designs.