Toughening of dicyandiamide-cured DGEBA-based epoxy resins by CTBN liquid rubber

Synergistic Effects of Liquid Rubber and Thermoplastic Particles for Toughening Epoxy Resin

This study aims to investigate the toughening effects of rubber and thermoplastic particles on epoxy resin (EP), and to understand the mechanism underlying their synergistic effect. For this purpose, three EP systems were prepared using diglycidyl ether of bisphenol-A (DGEBA) epoxy resin (E-54) and 4,4-Diamino diphenyl methane (Ag-80) as matrix resin, 4,4-diaminodiphenyl sulfone (DDS) as a curing agent, and phenolphthalein poly (aryl ether ketone) particles (PEK-C) and carboxyl-terminated butyl liquid rubber (CTBN) as toughening agents. These systems are classified as an EP/PEK-C toughening system, EP/CTBN toughening system, and EP/PEK-C/CTBN synergistic toughening system. The curing behavior, thermal properties, mechanical properties, and phase structure of the synergistic-toughened EP systems were comprehensively investigated. The results showed that PEK-C did not react with EP, while CTBN reacted with EP to form a flexible block polymer. The impact toughness of EP toughened by PEK-C/CTBN was improved obviously without significantly increasing viscosity or decreasing thermal stability, flexural strength, and modulus, and the synergistic toughening effect was significantly higher than that of the single toughening system. The notable improvement in toughness is believed to be due to the synergistic energy dissipation effect of PEK-C/CTBN.

Enhancement of Mechanical Properties and Bonding Properties of Flake-Zinc-Powder-Modified Epoxy Resin Composites

As a typical brittle material, epoxy resin cannot meet its application requirements in specific fields by only considering a single toughening method. In this paper, the effects of carboxyl-terminated polybutylene adipate (CTPBA) and zinc powder on the mechanical properties, adhesion properties, thermodynamic properties and medium resistance of epoxy resin were studied. A silane coupling agent (KH-550) was used to modify zinc powder. It was found that KH-550 could significantly improve the mechanical properties and bonding properties of epoxy resin, and the modification effect of flake zinc powder (f-Zn) was significantly better than that of spherical zinc powder (s-Zn). When the addition amount of f-Zn was 5 phr, the tensile shear strength and peel strength of the composites reached a maximum value of 13.16 MPa and 0.124 kN/m, respectively, which were 15.95% and 55% higher than those without filler. The tensile strength and impact strength reached a maximum value of 43.09 MPa and 7.09 kJ/m², respectively, which were 40.54% and 91.11% higher than those without filler. This study provides scientific support for the preparation of f-Zn-modified epoxy resin.

Preparation and research of epoxy modified by carboxyl-terminated polybutylene adipate at room temperature

In this study, carboxyl-terminated polybutylene adipate (CTPBA) was used to modify epoxy resin, and the modified epoxy resin was cured by a room temperature rapid curing agent (T-31). The effects of CTPBA modification on bonding properties and mechanical properties of epoxy resin adhesive at room temperature were carefully studied. Epoxy-terminated prepolymer was synthesized by pre-polymerization and its structure was characterized. Compared with the addition method of direct blending, the bonding properties and mechanical properties of pre-polymerized epoxy resin adhesive were significantly better. Compared with unmodified epoxy resin, CTPBA modification significantly improved the bonding strength. Furthermore, with the increase of CTPBA content, the shear strength of the material increased first and then decreased, and reached the maximum when the addition amount was 40 phr. This shows that the tensile strength of the material decreased with the increase of CTPBA content, and the elongation at break increased with the increase of CTPBA content. Dynamic mechanical analyzer (DMA) test results showed that the addition of CTPBA reduced the glass transition temperature, but broadened the damping temperature range. TG analysis showed that the thermal stability of the modified epoxy resin was good, and compared with pure epoxy resin, the initial temperature of thermal weight loss and the maximum thermal decomposition rate decreased, but the overall thermal stability was not significantly different. In summary, CTPBA modification of epoxy resin is expected to improve the comprehensive mechanical properties at room temperature.

Efficient Improvement in Fracture Toughness of Laminated Composite by Interleaving Functionalized Nanofibers

Functionalized polyacrylonitrile (PAN) nanofibers were used in the present investigation to enhance the fracture behavior of carbon epoxy composite in order to prevent delamination if any crack propagates in the resin rich area. The main intent of this investigation was to analyze the efficiency of PAN nanofiber as a reinforcing agent for the carbon fiber-based epoxy structural composite. The composites were fabricated with stacked unidirectional carbon fibers and the PAN powder was functionalized with glycidyl methacrylate (GMA) and then used as reinforcement. The fabricated composites’ fracture behavior was analyzed through a double cantilever beam test and the energy release rate of the composites was investigated. The neat PAN and functionalized PAN-reinforced samples had an 18% and a 50% increase in fracture energy, respectively, compared to the control composite. In addition, the samples reinforced with functionalized PAN nanofibers had 27% higher interlaminar strength compared to neat PAN-reinforced composite, implying more efficient stress transformation as well as stress distribution from the matrix phase (resin-rich area) to the reinforcement phase (carbon/phase) of the composites. The enhancement of fracture toughness provides an opportunity to alleviate the prevalent issues in laminated composites for structural operations and facilitate their adoption in industries for critical applications.

Investigating the relationship between tack and degree of conversion in DGEBA-based epoxy resin cured with dicyandiamide and diuron

The purpose behind this research was to determine the optimum formulation and investigate the cure kinetics of a diglycidyl ether of bisphenol-A (DGEBA)-based epoxy resin cured by dicyandiamide and diuron for use in prepregs. First, all formulations were examined by the tensile test, and then, the specimens with higher mechanical properties were further investigated by viscometry and tack tests. The cure kinetics of the best formulation (based on tack test) in nonisothermal mode was investigated using differential scanning calorimetry at different heating rates. Kissinger and Ozawa method was used for determining the kinetic parameters of the curing process. The activation energy obtained by this method was 71.43 kJ/mol. The heating rate had no significant effect on the reaction order and the total reaction order was approximately constant ( m + n ≅ 2.1 $m+n\cong 2.1$ ). By comparing the experimental data and the theoretical data obtained by Kissinger and Ozawa method, a good agreement was seen between them. By increasing the degree of conversion, the viscosity decreased; as the degree of conversion increased, so did the slope of viscosity. The results of the tack test also indicated that the highest tack could be obtained with 25% progress of curing.

Comparative Study of the Impact Wedge-Peel Performance of Epoxy Structural Adhesives Modified with Functionalized Silica Nanoparticles

Epoxy structural adhesives have strong adhesion, minimal shrinkage and high thermal and chemical resistance. However, despite these excellent properties, their high-energy impact resistance should be improved to satisfy the increasing demands of the automotive industry. For this reason, we used four types of silica nanoparticles with different surface groups, such as polydimethylsiloxane (PDMS), hydroxyl, epoxy and amine groups, as toughening agents and examined their effect on the glass transition temperature (T_g), crosslinking density and phase separation of epoxy structural adhesives. High-energy impact resistance, mode I fracture toughness and lap shear strength were also measured to explain the effect of surface functional groups. Silica nanoparticles with reactive functional groups increased the mode I fracture toughness of epoxy structural adhesives without sacrificing the crosslinking density. Although the mode I fracture toughness of epoxy structural adhesives could not clearly show the effect of surface functional groups, the dynamic resistance to cleavage obtained by impact wedge-peel tests showed quite different values. At a 0.3 vol% content, epoxy-functionalized silica nanoparticles induced the highest value (40.2 N/mm) compared to PDMS (34.1 N/m), hydroxyl (34.9 N/mm), and amine (36.1 N/m). All of these values were significantly higher than those of pristine epoxy structural adhesive (27.7 N/mm).

Comparative Study on the Impact Wedge-Peel Performance of Epoxy-Based Structural Adhesives Modified with Different Toughening Agents

Epoxy adhesives are widely used in various industries because of their high heat and chemical resistance, high cohesion, and minimal shrinkage. Recently, epoxy adhesives have been applied in the automotive industry as structural adhesives for lightweight vehicles. However, the brittleness of the epoxy is an obstacle for this application, since the automotive industry requires epoxy-based structural adhesives to have a high level of high-speed impact resistance. Hence, we used phenol-terminated polyurethane (PTPU) as a toughening agent for epoxy adhesives and compared the results with those that were obtained with carboxyl-terminated butadiene acrylonitrile copolymer (CTBN). The high-energy impact resistance of the epoxy adhesives was measured by the impact wedge-peel (IWP) test, and the shear strength was measured by the single lap joint test. As a result, the 20 wt % PTPU-modified epoxy adhesive showed remarkably higher total absorbed energy (25.8 J) during the IWP test and shear strength (32.3 MPa) as compared with the control epoxy adhesive (4.1 J and 20.6 MPa, respectively). In particular, the total absorbed energy of the PTPU-modified epoxy adhesive was much larger than that of the CTBN-modified epoxy adhesive (5.8 J). When more than 10 wt % PTPU was added, the modified epoxy adhesives showed stable crack growth and effectively transferred external stress to the substrate. These results were explained by changes in the glass transition temperature, crosslinking density, and morphology due to the toughening agents.

Dynamic Cure Kinetics and Physical-Mechanical Properties of PEG/Nanosilica/Epoxy Composites

This study investigated the effect of polyethylene glycol (PEG) and nanosilica (NS) on the physical-mechanical properties and cure kinetics of diglycidyl ether of bisphenol-A-based epoxy (DGEBA-based EP) resin. For this purpose, tensile and viscometry tests, dynamic mechanical thermal analysis (DMTA), and differential scanning calorimetry (DSC) were carried out under dynamic conditions. The results showed that adding NS and PEG enhances the maximum cure temperature as well as the heat of cure reaction (ΔH) in EP-NS, while it decreases in EP-PEG and EP-PEG-NS. The cure kinetic parameters of EP-PEG-NS were calculated by Kissinger, Ozawa, and KSA methods and compared with each other. The Ea calculated from the Kissinger method (96.82 kJ/mol) was found to be lower than that of the Ozawa method (98.69 kJ/mol). Also, according to the KAS method, the apparent Ea was approximately constant within the 10-90% conversion range. Tensile strength and modulus increased by adding NS, while tensile strength diminished slightly by adding PEG to EP-NS. The glass transition temperature (Tg) was calculated using DMTA which was increased and decreased by the addition of NS and PEG, respectively. The results of the viscometry test showed that the viscosity increased with the presence of both PEG and NS and it prevented the deposition of solid particles.

Study of Hybrid Nanoparticles Modified Epoxy Resin Used in Filament Winding Composite

Hybrid nanoparticles modified bisphenol A type epoxy/acid anhydride resin system applicable for filament winding forming process was studied using elastic core-shell rubber (CSR) nanoparticles with a large particle size (nearly 100 nm) and rigid nano-SiO₂ particles with a small particle size (about 16 nm). The formulation, process properties, mechanical properties, thermal properties and microstructure of modified resin and its wound composite were studied. The results suggested that at the content of 10 phr CSR and 2 phr nano-SiO₂, the resin system achieved optimum comprehensive performance. The viscosity of modified resin system was nearly 1000 mPa·s at 25 °C and service life was over 6 h. The resin tensile strength and modulus were 89 MPa and 3.5 GPa, while flexural strength and modulus reached 128 MPa and 3.2 GPa, respectively. The impact strength was 26.6 kJ·m⁻², and the glass transition temperature (Tg) reached 145.9 °C. Modified epoxy resin enhanced the mechanical properties of carbon fiber reinforced wound composite. The tensile strength, tensile modulus and interlaminar shear strength were enhanced by 14.0%, 4.56% and 18.9%, respectively, compared with a composite based on unmodified resin. The above test results and scanning electron microscopy (SEM) analysis suggest that the hybrid nanoparticles modified resin system was suitable for carbon fiber wet filament winding products.

Mechanical, Thermal, and Electrical Properties of BN-Epoxy Composites Modified with Carboxyl-Terminated Butadiene Nitrile Liquid Rubber

Filled high thermal conductivity epoxy composite solves the problem of the low thermal conductivity of the epoxy resin itself, but the addition of the thermal conductive filler reduces the mechanical properties of the composite, which limits its application in the field of high voltage insulation. In this work, carboxyl-terminated butadiene nitrile liquid rubber (CTBN) was used to toughen the boron nitride-epoxy hybrid system, and the effects of different contents of CTBN on the mechanical properties, thermal conductivity, glass transition temperature, thermal stability, and dielectric properties of the composites were investigated. The results showed that when the content of CTBN was 5-15 wt.%, the CTBN formed a dispersed island structure in the epoxy resin matrix. The toughness of the composite increased by about 32%, the breakdown strength was improved, and the thermal conductivity was about 160% higher than that of pure epoxy resin. As the CTBN content increased, the glass transition temperature and thermal stability of the composite decreased and the dielectric constant and the dielectric loss increased. When the CTBN content is 10-15 wt.%, a toughened epoxy composite material with better comprehensive properties is obtained.

Synthesis of Benzene Tetracarboxamide Polyamine and Its Effect on Epoxy Resin Properties

Epoxy resins have found various industrial applications in high-performance thermosetting resins, high-performance composites, electronic-packaging materials, adhesives, protective coatings, etc., due to their outstanding performance, including high toughness, high-temperature performance, chemical and environmental resistance, versatile processability and adhesive properties. However, cured epoxy resins are very brittle, which limits their applications. In this work, we attempted to enhance the toughness of cured epoxy resins by introducing benzene tetracarboxamide polyamine (BTCP), synthesized from pyromellitic dianhydride (PMDA) and diamines in N-methyl-2-pyrrolidone (NMP) solvent. During this reaction, increased viscosity and formation of amic acid could be confirmed. The chemical reactions were monitored and evidenced using ¹H-NMR spectroscopy, FT-IR spectroscopy, water gel-phase chromatography (GPC) analysis, amine value determination and acid value determination. We also studied the effect of additives on thermomechanical properties using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamical mechanical analysis (DMA), thermomechanical analysis (TMA) and by measuring mechanical properties. The BTCP-containing epoxy resin exhibited high mechanical strength and adhesion strength proportional to the amount of BTCP. Furthermore, field-emission scanning electron microscopy images were obtained for examining the cross-sectional morphology changes of the epoxy resin specimens with varying amounts of BTCP.

Mechanical Properties and Morphologies of Carboxyl-Terminated Butadiene Acrylonitrile Liquid Rubber/Epoxy Blends Compatibilized by Pre-Crosslinking

In order to enhance the compatibilization and interfacial adhesion between epoxy and liquid carboxyl-terminated butadiene acrylonitrile (CTBN) rubber, an initiator was introduced into the mixture and heated to initiate the cross-linking reaction of CTBN. After the addition of curing agents, the CTBN/epoxy blends with a localized interpenetrating network structure were prepared. The mechanical properties and morphologies of pre-crosslinked and non-crosslinked CTBN/epoxy blends were investigated. The results show that the tensile strength, elongation at break and impact strength of pre-crosslinked CTBN/epoxy blends are significantly higher than those of non-crosslinked CTBN/epoxy blends, which is primarily due to the enhanced interfacial strength caused by the chemical bond between the two phases and the localized interpenetrating network structure. Both pre-crosslinked and non-crosslinked CTBN/epoxy blends show a bimodal distribution of micron- and nano-sized rubber particles. However, pre-crosslinked CTBN/epoxy blends have smaller micron-sized rubber particles and larger nano-sized rubber particles than non-crosslinked CTBN/epoxy blends. The dynamic mechanical analysis shows that the storage modulus of pre-crosslinked CTBN/epoxy blends is higher than that of non-crosslinked CTBN/epoxy blends. The glass transition temperature of the CTBN phase in pre-crosslinked CTBN/epoxy blends increases slightly compared with the CTBN/epoxy system. The pre-crosslinking of rubber is a promising method for compatibilization and controlling the morphology of rubber-modified epoxy materials.