Preparation of hyperbranched polymeric ionic liquids for epoxy resin with simultaneous improvement of strength and toughness

Closed-loop recycling of tough epoxy supramolecular thermosets constructed with hyperbranched topological structure

The regulation of topological structure of covalent adaptable networks (CANs) remains a challenge for epoxy CANs. Here, we report a strategy to develop strong and tough epoxy supramolecular thermosets with rapid reprocessability and room-temperature closed-loop recyclability. These thermosets were constructed from vanillin-based hyperbranched epoxy resin (VanEHBP) through the introduction of intermolecular hydrogen bonds and dual dynamic covalent bonds, as well as the formation of intramolecular and intermolecular cavities. The supramolecular structures confer remarkable energy dissipation capability of thermosets, leading to high toughness and strength. Due to the dynamic imine exchange and reversible noncovalent crosslinks, the thermosets can be rapidly and effectively reprocessed at 120 °C within 30 s. Importantly, the thermosets can be efficiently depolymerized at room temperature, and the recovered materials retain the structural integrity and mechanical properties of the original samples. This strategy may be employed to design tough, closed-loop recyclable epoxy thermosets for practical applications.

Smart materials for flexible electronics and devices: hydrogel

In recent years, flexible conductive materials have attracted considerable attention for their potential use in flexible energy storage devices, touch panels, sensors, memristors, and other applications. The outstanding flexibility, electricity, and tunable mechanical properties of hydrogels make them ideal conductive materials for flexible electronic devices. Various synthetic strategies have been developed to produce conductive and environmentally friendly hydrogels for high-performance flexible electronics. In this review, we discuss the state-of-the-art applications of hydrogels in flexible electronics, such as energy storage, touch panels, memristor devices, and sensors like temperature, gas, humidity, chemical, strain, and textile sensors, and the latest synthesis methods of hydrogels. Describe the process of fabricating sensors as well. Finally, we discussed the challenges and future research avenues for flexible and portable electronic devices based on hydrogels.

Strong and Ultra-tough Ionic Hydrogel Based on Hyperbranched Macro-Cross-linker: Influence of Topological Structure on Properties

The application of hydrogels often suffers from their inherent limitation of poor mechanical properties. Here, a carboxyl-functionalized and acryloyl-terminated hyperbranched polycaprolactone (PCL) was synthesized and used as a macro-cross-linker to fabricate a super strong and ultra-tough ionic hydrogel. The terminal acryloyl groups of hyperbranched PCL are chemically incorporated into the network to form covalent cross-links, which contribute to robust networks. Meanwhile, the hydrophobic domains formed by the spontaneous aggregation of PCL chains and coordination bonds between Fe3+ and COO- groups serve as dynamic non-covalent cross-links, which enhance the energy dissipation ability. Especially, the influence of the hyperbranched topological structure of PCL on hydrogel properties has been well investigated, exhibiting superior strengthening and toughening effects compared to the linear one. Moreover, the hyperbranched PCL cross-linker also endowed the ionic hydrogel with higher sensitivity than the linear one when used as a strain sensor. As a result, this well-designed ionic hydrogel possesses high mechanical strength, superior toughness, and well ionic conductivity, exhibiting potential applications in the field of flexible strain sensors.

Ionic Liquids Facilitate the Dispersion of Branched Polyethylenimine Grafted ZIF-8 for Reinforced Epoxy Composites

Metal-organic frameworks (MOFs) have been previously shown as an emerging modified class of epoxy resin. In this work, we report a simple strategy for preventing zeolitic imidazolate framework (ZIF-8) nanoparticles from agglomerating in epoxy resin (EP). Branched polyethylenimine grafted ZIF-8 in ionic liquid (BPEI-ZIF-8) nanofluid with good dispersion was prepared successfully using an ionic liquid as both the dispersant and curing agent. Results indicated that the thermogravimetric curve of the composite material had no noticeable change with increasing BPEI-ZIF-8/IL content. The glass transition temperature (T_g) of the epoxy composite was reduced with the addition of BPEI-ZIF-8/IL. The addition of 2 wt% BPEI-ZIF-8/IL into EP effectively improved the flexural strength to about 21.7%, and the inclusion of 0.5 wt% of BPEI-ZIF-8/IL EP composites increased the impact strength by about 83% compared to pure EP. The effect of adding BPEI-ZIF-8/IL on the T_g of epoxy resin was explored, and its toughening mechanism was analyzed in combination with SEM images showing fractures in the EP composites. Moreover, the damping and dielectric properties of the composites were improved by adding BPEI-ZIF-8/IL.

Binary Resin-Curing Agent Systems for Fabricating Epoxy and Graphene Oxide-loaded Epoxy Films

In this research, diglycidyl ethers of bisphenol-A (BADGE) and polyethylene glycol (PEGDGE) were binarily cured with a mixture of diamine curing agents including isophorone diamine and polyethylene glycol diamine (PEGDA) in the absence/presence of aminated graphene oxide nanoplatelets (AGNPs, 0.5 wt.%). Four molar ratios of diglycidyl ethers and curing agents were used stoichiometrically in isothermal curing systems. The films prepared from the epoxy networks were entirely strong and pliable. All epoxy thermosets were evaluated using field emission-scanning electron microscopy (FE-SEM), Fourier transform infrared (FT-IR) spectroscopy, X-ray diffraction (XRD), and diffuse reflectance-ultraviolet/visible spectroscopy (DR-UV/vis). The absorption coefficients of the epoxy and AGNPs-loaded epoxy materials decreased with increasing the molar ratio of PEGDGE resin and polyethylene glycol diamine curing agent. According to dynamic mechanical analysis no phase heterogeneity occurred in the structure of the prepared thermostats. When the thermoset materials were loaded by AGNPs filler, the peaks associated with alpha relaxations shifted to higher temperatures. Moreover, thermogravimetric analysis demonstrated that the thermal stability of the prepared epoxy thermosets slightly increased after the addition of the nanoplatelets. In addition, the thermal resistance of the prepared thermosets decreased to some extent by increasing the participation rate of monomers containing polyoxyethylene.

Bio-macromolecular design roadmap towards tough bioadhesives

Emerging sutureless wound-closure techniques have led to paradigm shifts in wound management. State-of-the-art biomaterials offer biocompatible and biodegradable platforms enabling high cohesion (toughness) and adhesion for rapid bleeding control as well as robust attachment of implantable devices. Tough bioadhesion stems from the synergistic contributions of cohesive and adhesive interactions. This Review provides a biomacromolecular design roadmap for the development of tough adhesive surgical sealants. We discuss a library of materials and methods to introduce toughness and adhesion to biomaterials. Intrinsically tough and elastic polymers are leveraged primarily by introducing strong but dynamic inter- and intramolecular interactions either through polymer chain design or using crosslink regulating additives. In addition, many efforts have been made to promote underwater adhesion via covalent/noncovalent bonds, or through micro/macro-interlock mechanisms at the tissue interfaces. The materials settings and functional additives for this purpose and the related characterization methods are reviewed. Measurements and reporting needs for fair comparisons of different materials and their properties are discussed. Finally, future directions and further research opportunities for developing tough bioadhesive surgical sealants are highlighted.

A review on the features, performance and potential applications of hydrogel-based wearable strain/pressure sensors

Over the past few years, development of wearable devices has gained increasing momentum. Notably, the demand for stretchable strain sensors has significantly increased due to many potential and emerging applications such as human motion monitoring, prosthetics, robotic systems, and touch panels. Recently, hydrogels have been developed to overcome the drawbacks of the elastomer-based wearable strain sensors, caused by insufficient biocompatibility, brittle mechanical properties, complicated fabrication process, as the hydrogels can provide a combination of various exciting properties such as intrinsic electrical conductivity, suitable mechanical properties, and biocompatibility. There are numerous research works reported in the literature which consider various aspects as preparation approaches, design strategies, properties control, and applications of hydrogel-based strain sensors. This article aims to present a review on this exciting topic with a new insight on the hydrogel-based wearable strain sensors in terms of their features, strain sensory performance, and prospective applications. In this respect, we first briefly review recent advances related to designing the materials and the methods for promoting hydrogels' intrinsic features. Then, strain (both tensile and pressure) sensing performance of prepared hydrogels is critically studied, and alternative approaches for their high-performance sensing are proposed. Subsequently, this review provides several promising applications of hydrogel-based strain sensors, including bioapplications and human-machine interface devices. Finally, challenges and future outlooks of conductive and stretchable hydrogels employed in the wearable strain sensors are discussed.

A liquid phosphorus-containing imidazole derivative as flame-retardant curing agent for epoxy resin with enhanced thermal latency, mechanical, and flame-retardant performances

The development of phosphorus-containing flame retardants combining good compatibility with matrix, low curing temperature, and mechanically reinforcing effect has remained a major challenge. Herein, we reported the synthesis of a liquid flame-retardant curing agent (DA) via the nucleophilic substitution between diphenylphosphinic chloride and 1-(3-aminopropyl)-imidazole (AI). DA exhibited good blending and latency towards epoxy resin (EP) at room temperature. According to DSC studies, DA could rapidly cure EP at moderate temperature. Compared with EP/AI sample, EP/DA samples displayed comparable or higher glass transition temperature (T_g) and enhanced mechanical properties due to the introduction of rigid diphenylphosphinyl group and improved cross-linking density. Moreover, DA improved the flame-retardant performances of EP thermoset. For instance, the LOI and UL94 rating of EP/DA-16 sample achieved 37.2 % and V-0, respectively. In addition, the peak of heat release rate (PHRR), average of heat release rate (AHRR), fire growth rate (FIGRA), and total heat release (THR) for EP/DA-16 sample reduced by 32 %, 42 %, 28 % and 27 % in comparison to EP/AI sample, respectively. DA was characterized by its good compatibility with EP, moderate curing temperature, fast curing rate, suitable thermal latency, mechanical reinforcing and flame-retardant effects, and thus it had a broad application prospect in various industrial fields.

Synthesis of poly(ionic liquid) for trifunctional epoxy resin with simultaneously enhancing the toughness, thermal and dielectric performances

Poly(ionic liquid) (PIL), integrating the characteristics of both polymers and ionic liquid, is synthesized and employed to modify diglycidyl-4,5-epoxy-cyclohexane-1,2-dicarboxylate (TDE-85). With the addition of PIL, the fracture toughness, and thermal and dielectric performances of TDE-85 were discovered to be simultaneously improved, meanwhile the tensile modulus and strength is increased. Upon an optimal loading of 3 wt% PIL, the critical stress intensity factor (K _IC), tensile modulus and strength are raised by 92.9%, 13.3% and 10.7%, respectively. Multi-toughening mechanisms due to spherical domains of PIL formed in TDE-85 during curing are responsible for the improved toughness. Moreover, the dielectric and thermal properties of TDE-85 are also enhanced by adding PIL. With the optimal addition of 5 wt% PIL, the dielectric constant of the composites is enhanced by 62.5%, the glass transition temperature is increased by 16.58 °C and the residual weight of carbon is increased by 59%.