Thermal conductivity of polymer-based composites: Fundamentals and applications

Diamond-Reinforced Al(H2PO4)3@Epoxy Hybrid Thermal Adhesive With Ultra-High Thermal Conductivity and Bonding Strength

The miniaturization, integration, and increased power of electronic devices have exacerbated serious heat dissipation issues. Thermally conductive adhesives, which effectively transfer heat and firmly bond components, are critical for addressing these challenges. This paper innovatively proposed a composite comprising inorganic phosphate/alumina as a matrix and diamond as filler. The composite achieved an isotropic thermal conductivity (TC) of up to 18.96 W m-1 K-1, significantly surpassing existing reports while maintaining electrical insulation. First-principles calculations and experimental tests confirmed that the high TC of phosphate and excellent interface contact ensured efficient heat transfer. To optimize bonding performance, a modified-diamond/Al(H2PO4)3@epoxy hybrid composite is subsequently developed using an organic modification method. The unique hybrid structure, combining inorganic thermal pathways and an organic adhesive network, enabled the hybrid composite to simultaneously possess a high TC (3.23 W m-1 K-1) and strong adhesion (14.35 MPa). Compared to previous reports, the comprehensive performance of this hybrid thermally conductive adhesive is exceptionally remarkable. The superior heat dissipation capability of the hybrid thermal adhesive is demonstrated in chip cooling scenarios. This organic/inorganic hybrid approach offered a new direction for obtaining advanced thermal interface materials, demonstrating significant application potential in chip soldering, packaging, and heat dissipation.

Unraveling the Impact of Boron Nitride and Silicon Nitride Nanoparticles on Thermoplastic Polyurethane Fibers and Mats for Advanced Heat Management

The urgent challenges posed by the energy crisis, alongside the heat dissipation of advanced electronics, have embarked on a rising demand for the development of highly thermally conductive polymer composites. Electrospun composite mats, known for their flexibility, permeability, high concentration and orientational degree of conductive fillers, stand out as one of the prime candidates for addressing this need. This study explores the efficacy of boron nitride (BN) and its potential alternative, silicon nitride (SiN) nanoparticles, in enhancing the thermal performance of the electrospun composite thermoplastic polyurethane (TPU) fibers and mats. The 3D reconstructed models obtained from FIB-SEM imaging provided valuable insights into the morphology of the composite fibers, aiding the interpretation of the measured thermal performance through scanning thermal microscopy for the individual composite fibers and infrared thermography for the composite mats. Notably, we found that TPU-SiN fibers exhibit superior heat conduction compared to TPU-BN fibers, with up to a 6 °C higher surface temperature observed in mats coated on copper pipes. Our results underscore the crucial role of arrangement of nanoparticles and fiber morphology in improving heat conduction in the electrospun composites. Moreover, SiN nanoparticles are introduced as a more suitable filler for heat conduction enhancement of electrospun TPU fibers and mats, suggesting immense potential for smart textiles and thermal management applications.

Decoding thermal properties in polymer-inorganic heat dissipators: a data-driven approach using pyrolysis mass spectrometry

Polymeric materials can boost their performances by strategically incorporating inorganic substances. Heat dissipators are a representative class of such composite materials, where inorganic fillers and matrix polymers contribute to high thermal conductivity and strong adhesion, respectively, resulting in excellent heat dissipation performance. However, due to the complex interaction between fillers and polymers, even slight differences in structural parameters, e.g. dispersion/aggregation degree of fillers and crosslink density of polymers, may significantly impact material performance, complicating the quality management and guidelines for material developments. Therefore, we introduce pyrolysis mass spectra (MS) as material descriptors. On the basis of these spectra, we construct prediction models using a data-driven approach, specifically focusing on thermal conductivity and adhesion, which are key indicators for heat dissipating performance. Pyrolysis-MS observes thermally decomposable polymers, which occupy only 0.1 volume fraction of the heat dissipators; nevertheless, the physical states of non-decomposable inorganic fillers are implicitly reflected in the pyrolyzed fragment patterns of the matrix polymers. Consequently, pyrolysis-MS provides sufficient information to construct accurate models for predicting heat dissipation performance, simplifying quality management by substituting time-consuming performance evaluations with rapid pyrolysis-MS measurements. Furthermore, we elucidate that higher crosslinking density of the matrix polymers enhances thermal conductivity. This data-driven method promises to streamline the identification of key functional factors in complex composite materials.

Evaluation of thermal conductivity models and dielectric properties in metal oxide-filled poly(butylene succinate-co-adipate) composites

This study examines how various nanofillers impact thermal conductivity, dielectric characteristics, and electromagnetic interference (EMI) shielding potential of bio-based and biodegradable poly(butylene succinate-co-adipate) (PBSA). TiO2, NiFe2O4, Fe2O3, and Fe3O4 were selected as fillers for nanocomposites at 4-50 vol.% (12-81 wt.%). The nanocomposites were analyzed in three domains: structural (scanning electron microscopy, energy dispersive X-ray spectroscopy mapping, density, tensile testing), thermal (light flash analysis, literature models), and dielectric (AC conductivity, permittivity, EM shielding effectiveness (SE)). The investigated fillers showed good dispersion and compatibility with the PBSA matrix. LFA was analyzed according to literature models, where Bruggeman and Agari models showed the best fit at high concentrations. The dielectric analysis revealed that most of the nanocomposites did not reach percolation; thus, producing thermally conductive plastics that are electrically insulating. EMI shielding was limited to frequencies below 10 Hz, with the notable exception of Fe3O4 (100 nm and loading of > 25 vol.%), which showed shielding at frequencies up to 105 Hz. The investigated composites based on a biodegradable polyester and abundant metal oxide nanofillers are suitable for the production of cheap, ecological, and electrically insulating heat dissipation solutions required for modern and lightweight applications.

2D Materials-Based Thermal Interface Materials: Structure, Properties, and Applications

The challenges associated with heat dissipation in high-power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high-performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat sinks. Recently, emerging 2D materials, such as graphene and boron nitride, renowned for their ultrahigh basal-plane thermal conductivity and the capacity to facilitate cross-scale, multi-morphic structural design, have found widespread use as thermal fillers in the production of high-performance TIMs. To deepen the understanding of 2D material-based TIMs, this review focuses primarily on graphene and boron nitride-based TIMs, exploring their structures, properties, and applications. Building on this foundation, the developmental history of these TIMs is emphasized and a detailed analysis of critical challenges and potential solutions is provided. Additionally, the preparation and application of some other novel 2D materials-based TIMs are briefly introduced, aiming to offer constructive guidance for the future development of high-performance TIMs.

Enhancement of Mechanical Properties of High-Thermal-Conductivity Composites Comprising Boron Nitride and Poly(methyl methacrylate) Resin through Material Design Utilizing Hansen Solubility Parameters

Materials for heat sinks in automotive heat dissipation systems must demonstrate both high thermal conductivity and stress resistance during assembly. This research proposes a composite material, comprised of thermally conductive ceramic fillers and matrix resins, as a suitable option for such application. The strategy for designing this material interface is directed with Hansen solubility parameters (HSP). A composite material featuring a honeycomb-like structure made of poly(methyl methacrylate) (PMMA) and boron nitride (BN) particles was successfully fabricated through press molding. This yielded a continuous BN network exhibiting high thermal conductivity and moderate mechanical strength. The HSP evaluation led to the suggestion of introducing highly polar functional groups into the matrix resin to enhance the affinity between PMMA resin and BN fillers. In line with this recommendation, a nitrile (CN) group─a highly polar group─was introduced to PMMA (CN-PMMA), significantly enhancing the composite's maximum bending stress without noticeably degrading other properties. Surface HSP evaluation through contact angle measurements revealed an "interface enrichment effect", with the CN groups concentrating at the resin-filler interface and effectively interacting with the surface functional groups on the BN particles, which resulted in an increase in the maximum bending stress. These findings emphasize the advantage of employing HSP methodologies in designing high-performance composite materials.

3D-Networks Based Polymer Composites for Multifunctional Thermal Management and Electromagnetic Protection: A Mini Review

The rapid development of miniaturized, high-frequency, and highly integrated microelectronic devices has brought about critical issues in electromagnetic compatibility and thermal management. In recent years, there has been significant interest in lightweight polymer-based composites that offer both electromagnetic interference (EMI) shielding and thermal conductivity. One promising approach involves constructing three-dimensional (3D) interconnection networks using functional fillers in the polymer matrix. These networks have been proven effective in enhancing the thermal and electrical conductivity of the composites. This mini-review focuses on the preparation and properties of 3D network-reinforced polymer composites, specifically those incorporating metal, carbon, ceramic, and hybrid networks. By comparing the effects of different filler types and distribution on the composite materials, the advantages of 3D interconnected conductive networks in polymer composites are highlighted. Additionally, this review addresses the challenges faced in the field of multifunctional thermal management and electromagnetic protection materials and provides insights into future development trends and application prospects of 3D structured composites.

Higher-Order Structural Analysis of a Transparent and Flexible High Thermal Conductive Liquid Crystalline Elastomer Sheet and Its Composite

Transparency, flexibility, and high thermal conductivity are trade-offs. Specifically, we have investigated a cross-linked acrylic liquid crystal elastomer (LCE) that exhibits both transparency and flexibility while maintaining a high level of thermal conductivity. The transparent monodomain LCE sheet was achieved through a process of stretching an initially opaque polydomain sheet to 80% elongation and subsequently subjecting it to photocuring. The thermal conductivity in the stretching direction (x) of the monodomain LCE sheet was found to be 1.8 times higher than that of the prestretched polydomain sheet, consistent with findings from previous studies. However, in the orthogonal direction (y) to the stretching (x) direction, the thermal conductivity exhibited an even higher value, being 1.7 times greater than in the x-direction, with a value of 3.0 W/(m·K). This unique observation prompted us to conduct further investigation through higher-order structural analysis of these LCE sheets using 2D wide-angle X-ray scattering (WAXS) analysis. In the transparent sheet, the LCE molecules were aligned in the sheet in the stretching x-direction (monodomain structure) for the out-of-plane direction. However, in the in-plane x-direction, the molecular plane spacing exhibited random orientation at a period of 0.45 nm. In contrast, within the y-direction of the inner layer, the molecular plane spacing exhibited a uniaxial horizontal orientation at the same period length as in the x-direction. The heat energy entering into the y-direction once spreads to the x-direction, but it was considered that the reason for the higher thermal conductivity to the y-direction would be forming covalent bonds that function as new heat transmission paths, in the direction intersecting to the x-direction during photocuring. Therefore, we concluded that the synergistic effect of the high level of the ordered inner structure and covalent bonding structure due to cross-linking in the y-direction contributes to its higher thermal conductivity compared to that in the x-direction, which exhibits a random in-plane structure. Additionally, we have fabricated an LCE composite sheet filled with 75 vol % of alumina particles using a polydomain-type LCE as the base material. The composite sheet exhibits remarkable thermal conductivity in the thickness direction, measuring at 9.8 W/(m·K), while maintaining a flexibility characterized by an elastic modulus of 70 MPa. This thermal conductivity surpasses that of a nonmesogenic acrylic composite sheet with identical alumina particle filling, which measured at 3.9 W/(m·K), more than twice as much. The presence of the mesogen skeleton has been demonstrated to enhance heat transfer, even within soft composites, by facilitating the formation of an ordered structure.

SiO2 bridged AlN/methylphenyl silicone resin composite with integrated superior insulating property, high-temperature resistance, and high thermal conductivity

A high-temperature-resistance insulating layer with high thermal conductivity is the key component for fabricating the instant metal-based electric heating tube. However, it is still a challenge for materials to possess excellent high-temperature resistance, superior insulating property, and high thermal conductivity at the same time. Here, a novel SiO2 bridged AlN/MSR composite based on methylphenyl silicone resin (MSR) and AlN filler was reported. MSR with a high thermal decomposition temperature of 452.0 °C and a high withstand voltage of 5.6 kV was first synthesized by adjusting the contents of alkyl and phenyl groups. The superior high-temperature resistant insulating property is 3.7 and 2.4 times higher than the national standard requirement of 1.5 kV and commercial silicone resin, respectively. The hydrogen bonds formed between SiO2, AlN, and MSR and the electrostatic adsorption between SiO2 and AlN can remarkably improve the uniform dispersion of AlN in MSR and thus enhance the insulating property, thermal conductivity, and thermal stability. With the addition of 2 wt% SiO2 and 50 wt% AlN, the SiO2-AlN/MSR composite exhibits an extremely high withstand voltage of 7.3 kV, a high thermal conductivity of 0.553 W·m-1·K-1, and an enhanced decomposition temperature of 475 °C. The superior insulating property and thermal conductivity are 4.9 and 1.3 times higher than the national standard requirement and pure MSR, respectively. This novel composite shows great potential for application in the fields requiring integrated superior insulating property, high-temperature resistance, and high thermal conductivity.

Computational Requirements for Modeling Thermal Conduction in Polymeric Phase-Change Materials: Periodic Hard Spheres Case

This research focuses on modeling heat transfer in heterogeneous media composed of stacked spheres of paraffin as a perspective polymeric phase-change material. The main goal is to study the requirements of the numerical scheme to correctly predict the thermal conductivity in a periodic system composed of an indefinitely repeated configuration of spherical particles subjected to a temperature gradient. Based on OpenFOAM, a simulation platform is created with which the resolution requirements for accurate heat transfer predictions were inferred systematically. The approach is illustrated for unit cells containing either a single sphere or a configuration of two spheres. Asymptotic convergence rates confirming the second-order accuracy of the method are established in case the grid is fine enough to have eight or more grid cells covering the distance of the diameter of a sphere. Configurations with two spheres can be created in which small gaps remain between these spheres. It was found that even the under-resolution of these small gaps does not yield inaccurate numerical solutions for the temperature field in the domain, as long as one adheres to using eight or more grid cells per sphere diameter. Overlapping and (barely) touching spheres in a configuration can be simulated with high fidelity and realistic computing costs. This study further extends to examine the effective thermal conductivity of the unit cell, particularly focusing on the volume fraction of paraffin in cases with unit cells containing a single sphere. Finally, we explore the dependence of the effective thermal conductivity for unit cells containing two spheres at different distances between them.

Dressing Paraffin Wax/Boron Nitride Phase Change Composite with a Polyethylene "Underwear" for the Reliable Battery Safety Management

Phase change material (PCM) can provide a battery system with a buffer platform to respond to thermal failure problems. However, current PCMs through compositing inorganics still suffer from insufficient thermal-transport behavior and safety reliability against external force. Herein, a best-of-both-worlds method is reported to allow the PCM out of this predicament. It is conducted by combining a traditional PCM (i.e., paraffin wax/boron nitride) with a spirally weaved polyethylene fiber fabric, just like the traditional PCM is wearing functional underwear. On the one hand, the spirally continuous thermal pathways of polyethylene fibers in the fabric collaborate with the boron nitride network in the PCM, enhancing the through-plane and in-plane thermal conductivity to 10.05 and 7.92 W m-1 K, respectively. On the other, strong polyethylene fibers allow the PCM to withstand a high puncture strength of 47.13 N and tensile strength of 18.45 MPa although above the phase transition temperature. After this typical PCM packs a triple Li-ion battery system, the battery can be promised reliable safety management against both thermal and mechanical abuse. An obvious temperature drop of >10 °C is observed in the battery electrode during the cycling charging and discharging process.

Playing with Low Amounts of Expanded Graphite for Melt-Processed Polyamide and Copolyester Nanocomposites to Achieve Control of Mechanical, Tribological, Thermal and Dielectric Properties

Polyamide 11 (PA11) and copolyester (TPC-E) were compounded through melt extrusion with low levels (below 10%) of expanded graphite (EG), aiming at the manufacturing of a thermally and electrically conductive composite resistant to friction and with acceptable mechanical properties. Thermal characterisation showed that the EG presence had no influence on the onset degradation temperature or melting temperature. While the specific density of the produced composite materials increased linearly with increasing levels of EG, the tensile modulus and flexural modulus showed a significant increase already at the introduction of 1 wt% EG. However, the elongation at break decreased significantly for higher loadings, which is typical for composite materials. We observed the increase in the dielectric and thermal conductivity, and the dissipated power displayed a much larger increase where high frequencies (e.g., 10 GHz) were taken into account. The tribological results showed significant changes at 4 wt% for the PA11 composite and 6 wt% for the TPC-E composite. Morphological analysis of the wear surfaces indicated that the main wear mechanism changed from abrasive wear to adhesive wear, which contributes to the enhanced wear resistance of the developed materials. Overall, we manufactured new composite materials with enhanced dielectric properties and superior wear resistance while maintaining good processability, specifically upon using 4-6 wt% of EG.

Review of sustainable, eco-friendly, and conductive polymer nanocomposites for electronic and thermal applications: current status and future prospects

Biodegradable polymer nanocomposites (BPNCs) are advanced materials that have gained significant attention over the past 20 years due to their advantages over conventional polymers. BPNCs are eco-friendly, cost-effective, contamination-resistant, and tailorable for specific applications. Nevertheless, their usage is limited due to their unsatisfactory physical and mechanical properties. To improve these properties, nanofillers are incorporated into natural polymer matrices, to enhance mechanical durability, biodegradability, electrical conductivity, dielectric, and thermal properties. Despite the significant advances in the development of BPNCs over the last decades, our understanding of their dielectric, thermal, and electrical conductivity is still far from complete. This review paper aims to provide comprehensive insights into the fundamental principles behind these properties, the main synthesis, and characterization methods, and their functionality and performance. Moreover, the role of nanofillers in strength, permeability, thermal stability, biodegradability, heat transport, and electrical conductivity is discussed. Additionally, the paper explores the applications, challenges, and opportunities of BPNCs for electronic devices, thermal management, and food packaging. Finally, this paper highlights the benefits of BPNCs as biodegradable and biodecomposable functional materials to replace traditional plastics. Finally, the contemporary industrial advances based on an overview of the main stakeholders and recently commercialized products are addressed.

Fillers and methods to improve the effective (out-plane) thermal conductivity of polymeric thermal interface materials - A review

The internet of things and growing demand for smaller and more advanced devices has created the problem of high heat production in electronic equipment, which greatly reduces the work performance and life of the electronic instruments. Thermal interface material (TIM) is placed in between heat generating micro-chip and the heat dissipater to conduct all the produced heat to the heat sink. The development of suitable TIM with excellent thermal conductivity (TC) in both in-plane and through-plane directions is a very important need at present. For efficient thermal management, polymer composites are potential candidates. But in general, their thermal conductivity is low compared to that of metals. The filler integration into the polymer matrix is one of the two approaches used to increase the thermal conductivity of polymer composites and is also easy to scale up for industrial production. Another way to achieve this is to change the structure of polymer chains, which fall out of the scope of this work. In this review, considering the first approach, the authors have summarized recent developments in many types of fillers with different scenarios by providing multiple cases with successful strategies to improve through-plane thermal conductivity (TPTC) (k⊥). For a better understanding of TC, a comprehensive background is presented. Several methods to improve the effective (out-plane) thermal conductivity of polymer composites and different theoretical models for the calculation of TC are also discussed. In the end, it is given a detailed conclusion that provides drawbacks of some fillers, multiple significant routes recommended by other researchers to build thermally conductive polymer composites, future aspects along with direction so that the researchers can get a guideline to design an effective polymer-based thermal interface material.

Thermal Conductivity Enhancement of Polymeric Composites Using Hexagonal Boron Nitride: Design Strategies and Challenges

With the integration and miniaturization of chips, there is an increasing demand for improved heat dissipation. However, the low thermal conductivity (TC) of polymers, which are commonly used in chip packaging, has seriously limited the development of chips. To address this limitation, researchers have recently shown considerable interest in incorporating high-TC fillers into polymers to fabricate thermally conductive composites. Hexagonal boron nitride (h-BN) has emerged as a promising filler candidate due to its high-TC and excellent electrical insulation. This review comprehensively outlines the design strategies for using h-BN as a high-TC filler and covers intrinsic TC and morphology effects, functionalization methods, and the construction of three-dimensional (3D) thermal conduction networks. Additionally, it introduces some experimental TC measurement techniques of composites and theoretical computational simulations for composite design. Finally, the review summarizes some effective strategies and possible challenges for the design of h-BN fillers. This review provides researchers in the field of thermally conductive polymeric composites with a comprehensive understanding of thermal conduction and constructive guidance on h-BN design.

Dual-Effect Coupling for Superior Dielectric and Thermal Conductivity of Polyimide Composite Films Featuring "Crystal-Like Phase" Structure

To match the increasing miniaturization and integration of electronic devices, higher requirements are put on the dielectric and thermal properties of the dielectrics to overcome the problems of delayed signal transmission and heat accumulation. Here, a 3D  porous thermal conductivity network is successfully constructed inside the polyimide (PI) matrix by the combination of ionic liquids (IL) and calcium fluoride (CaF2 ) nanofillers, motivated by the bubble-hole forming orientation force. Benefiting from the 3D thermal network formed by IL as a porogenic template and "crystal-like phase" structures induced by CaF2 - polyamide acid charge transfer, IL-10 vol% CaF2 /PI porous film exhibits a low permittivity of 2.14 and a thermal conductivity of 7.22 W m-1 K-1 . This design strategy breaks the bottleneck that low permittivity and high thermal conductivity in microelectronic systems are difficult to be jointly controlled, and provides a feasible solution for the development of intelligent microelectronics.

Reaction-Induced Liquid Crystalline Polybenzoxazine Bearing Aromatic Amide Side Branches

In this study, a nematic phase structure is incorporated into polybenzoxazine to increase its thermal conductivity. A simple route for the synthesis of a thermally conductive polybenzoxazine containing liquid crystalline (LC) structure by grafting oligomeric p-sulfophenylene-terephthalamide (PSTA) is offered. Benzoxazine monomer of pHBA-da is synthesized via Mannich reaction of p-hydroxy benzoic acid, p-formaldehyde, and dodecyl amine. After ring-opening polymerization, the oligomer benzoxazine of OBZ─COOH is obtained. The OBZ─COOH/PSTA mixture is prepared by mixing PSTA with OBZ─COOH. Afterward, the grafted copolymer is named OBZ─PSTA copolymer. The liquid crystalline behavior of OBZ─COOH/PSTA is studied by polarized optical microscopy and small angle X-ray scattering analysis. The results show that the OBZ─PSTA forms the LC structure during isothermal and non-isothermal curing. The LC structure displays a floral textured nematic phase. The phase formation is induced by an amidation reaction. Due to the grafts of LC PSTA, the thermal conductivity of OBZ─PSTA is 0.296 W m-1 K-1 , which is 26% greater than OBZ─COOH. The glass transition temperature (Tg ) of OBZ─PSTA is 241 °C. The 5% (Td5 ) and 10% weight loss temperatures (Td10 ) of OBZ─PSTA are 346 and 362 °C, respectively.

Vitrimer Nanocomposites for Highly Thermal Conducting Materials with Sustainability

Vitrimers, as dynamic covalent network polymers, represent a groundbreaking advancement in materials science. They excel in their applications, such as advanced thermal-conductivity composite materials, providing a sustainable alternative to traditional polymers. The incorporation of vitrimers into composite fillers enhances alignment and heat passway broadly, resulting in superior thermal conductivity compared to conventional thermosetting polymers. Their dynamic exchange reactions enable straightforward reprocessing, fostering the easy reuse of damaged composite materials and opening possibilities for recycling both matrix and filler components. We review an overview of the present advancements in utilizing vitrimers for highly thermally conductive composite materials.

Enhanced Thermal Conductivity of High-Density Polyethylene Composites with Hybrid Fillers of Flaky and Spherical Boron Nitride Particles

The synergistic effect between different fillers plays a crucial role in determining the performance of composites. In this work, spherical boron nitride (BN) and flaky BN are used as hybrid fillers to improve the thermal conductivity (TC) of high-density polyethylene (HDPE) composites. A series of HDPE composites were prepared by adjusting the mass ratio (1:0, 4:1, 2:1, 1:1, 1:2, 1:4, and 0:1) of spherical BN and flaky BN. The SEM results indicate that the spherical BN (with a particle size of 3 μm) effectively filled the gaps between the flaky BN (with a particle size of 30 μm), leading to the formation of more continuous heat conduction paths with the composite. Remarkably, when the mass ratio of spherical BN to flaky BN was set to 1:4 (with a total BN filling amount of 30 wt%), the TC of the composite could reach up to 1.648 Wm-1K-1, which is obviously higher than that of the composite containing a single filler, realizing the synergistic effect of the hybrid fillers. In addition, the synergistic effect of fillers also affects the thermal stability and crystallization behavior of composites. This work is of great significance for optimizing the application of hybrid BN fillers in the field of thermal management.

Application and Development of Smart Thermally Conductive Fiber Materials

In recent years, with the rapid advancement in various high-tech technologies, efficient heat dissipation has become a key issue restricting the further development of high-power-density electronic devices and components. Concurrently, the demand for thermal comfort has increased; making effective personal thermal management a current research hotspot. There is a growing demand for thermally conductive materials that are diversified and specific. Therefore, smart thermally conductive fiber materials characterized by their high thermal conductivity and smart response properties have gained increasing attention. This review provides a comprehensive overview of emerging materials and approaches in the development of smart thermally conductive fiber materials. It categorizes them into composite thermally conductive fibers filled with high thermal conductivity fillers, electrically heated thermally conductive fiber materials, thermally radiative thermally conductive fiber materials, and phase change thermally conductive fiber materials. Finally, the challenges and opportunities faced by smart thermally conductive fiber materials are discussed and prospects for their future development are presented.

Bridging a Gap in Thermal Conductivity and Heat Transfer in Hybrid Fibers and Yarns via Polyimide and Silicon Nitride Composites

The pressing issues of the energy crisis and rapid electronics development have sparked a growing interest in the production of highly thermally conductive polymer composites. Due to the challenges related to the poor processability of hybrid materials and filler distribution to achieve high thermal conductivity, electrospinning is employed to create composite nanofibers and yarns using polyimide (PI) and thermally conductive silicon nitride (SiN) nanoparticles. The thermal performance of the individual nanofibers is evaluated using scanning thermal microscopy (SThM), providing significant insights into their heat transfer performance. Next, the nanofibers are applied as coatings on resistance wires to assess the thermal conductivity and insulation properties. Notably, the samples containing 35 wt.% of SiN exhibit a 25% increase in surface temperature. These innovative materials hold great promise as exceptional candidates for smart textiles and thermal management applications, addressing the growing demand for effective heat dissipation and regulation.

High-Performance Graphene Biocomposite Enabled by Fe3+ Coordination for Thermal Management

Emerging biocomposites with excellent heat dissipation capabilities and inherent sustainability are urgently needed to address the cooling issues of modern electronics and growing environmental concerns. However, the moisture stability, mechanical performance, thermal conductivity, and even flame retardancy of biomass-based materials are generally insufficient for practical thermal management applications. Herein, we present a high-performance graphene biocomposite consisting of carboxylated cellulose nanofibers and graphene nanosheets through an evaporation-induced self-assembly and subsequent Fe3+ cross-linking strategy. The Fe3+ coordination plays a critical role in stabilizing the material structure, thereby improving the mechanical strength and water stability of the biocomposite films, and its effect is revealed by density functional theory calculations. The hierarchical structure of the biocomposite films also leads to a high in-plane thermal conductivity of 42.5 W m-1 K-1, enabling a superior heat transfer performance. Furthermore, the resultant biocomposite films exhibit outstanding Joule heating performance with a fast thermal response and long-term stability, improved thermal stability, and flame retardancy. Therefore, such a general strategy and the desired overall properties of the biocomposite films offer wide application prospects for functional and safe thermal management.

In Situ Construction of High-Thermal-Conductivity and Negative-Permittivity Epoxy/Carbon Fiber@Carbon Composites with a 3D Network by High-Temperature Chemical Vapor Deposition

Modern highly integrated microelectronic devices are unable to dissipate heat over time, which greatly affects the operating efficiency and service life of electronic equipment. Constructing high-thermal-conductivity composites with 3D network structures is a hot research topic. In this article, carbon fiber felt (CFF) was prepared by airflow netting forming technology and needle punching combined with stepped heat treatment. Then, carbon-coated carbon fiber felt (C@CFF) with a three-dimensional network structure was constructed in situ by high-temperature chemical vapor deposition (CVD). Finally, high-temperature treatment was used to improve the degree of crystallinity of C@CFF and further enhance its graphitization. The epoxy (EP) composites were prepared by simple vacuum infiltration-molding curing. The test results showed that the in-plane thermal conductivity (K∥) and through-plane thermal conductivity (K⊥) of EP/C@CFF-2300 °C could reach up to 13.08 and 2.78 W/mK, respectively, where the deposited carbon content was 11.76 vol %. The in-plane thermal conductivity enhancement (TCE) of EP/C@CFF-2300 °C was improved by 6440 and 808% compared to those of pure EP and EP/CFF, respectively. The high-temperature treatment greatly provides an improvement in thermal conductivity for the in-plane and the through-plane. Infrared imaging showed excellent thermal management properties of the prepared epoxy composites. EP/C@CFF-2300 °C owned an in-plane AC conductivity of up to 0.035 S/cm at 10 kHz, and Lorentz-Drude-type negative permittivity behaviors were observed at the tested frequency region. The CFF thermally conductive composites prepared by the above method have a broad application prospect in the field of advanced thermal management and electromagnetics.

Highly Thermoconductive, Strong Graphene-Based Composite Films by Eliminating Nanosheets Wrinkles

Graphene-based thermally conductive composites have been proposed as effective thermal management materials for cooling high-power electronic devices. However, when flexible graphene nanosheets are assembled into macroscopic thermally conductive composites, capillary forces induce shrinkage of graphene nanosheets to form wrinkles during solution-based spontaneous drying, which greatly reduces the thermal conductivity of the composites. Herein, graphene nanosheets/aramid nanofiber (GNS/ANF) composite films with high thermal conductivity were prepared by in-plane stretching of GNS/ANF composite hydrogel networks with hydrogen bonds and π-π interactions. The in-plane mechanical stretching eliminates graphene nanosheets wrinkles by suppressing inward shrinkage due to capillary forces during drying and achieves a high in-plane orientation of graphene nanosheets, thereby creating a fast in-plane heat transfer channel. The composite films (GNS/ANF-60 wt%) with eliminated graphene nanosheets wrinkles showed a significant increase in thermal conductivity (146 W m-1 K-1) and tensile strength (207 MPa). The combination of these excellent properties enables the GNS/ANF composite films to be effectively used for cooling flexible LED chips and smartphones, showing promising applications in the thermal management of high-power electronic devices.

Oriented Three-Dimensional Skeletons Assembled by Si3N4 Nanowires/AlN Particles as Fillers for Improving Thermal Conductivity of Epoxy Composites

With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have become of increasing interest. Traditionally, higher filler fractions are required to obtain a high thermal conductivity, but this leads to a decrease in the mechanical properties of the composites and increases the cost. In this study, silicon nitride nanowires (Si3N4NWs) with high aspect ratios were successfully prepared by a modified carbothermal reduction method, which was further combined with AlN particles to prepare the epoxy-based composites. The results showed that the Si3N4NWs were beneficial for constructing a continuous thermal conductive pathway as a connecting bridge. On this basis, an aligned three-dimensional skeleton was constructed by the ice template method, which further favored improving the thermal conductivity of the composites. When the mass fraction of Si3N4NWs added was 1.5 wt% and the mass fraction of AlN was 65 wt%, the composites prepared by ice templates reached a thermal conductivity of 1.64 W·m-1·K-1, which was ~ 720% of the thermal conductivity of the pure EP (0.2 W·m-1·K-1). The enhancement effect of Si3N4NWs and directional filler skeletons on the composite thermal conductivity were further demonstrated through the actual heat transfer process and finite element simulations. Furthermore, the thermal stability and mechanical properties of the composites were also improved by the introduction of Si3N4NWs, suggesting that prepared composites exhibit broad prospects in the field of thermal management.

Thermal Interface Engineering in a 3D-Structured Carbon Framework for a Phase-Change Composite with High Thermal Conductivity

Phase-change materials (PCMs) are promising thermal storage medium for thermal management due to their efficient thermal energy harvesting capabilities. However, the low thermal conductivity (TC) and poor shape stability of PCMs have hindered their practical applications. Construction of an interconnected three-dimensional (3D) heat-conductive structure is an effective way to build phonon conduits and provide PCM confinement. Phonon scattering at the interface is an unavoidable effect that undermines the TC improvement in the PCM composite and necessitates careful engineering. This study focuses on creating a highly thermally conductive 3D carbon-bonded graphite fiber (CBGF) network to enhance the TC of the PCM, with attention especially on thermal interface engineering considering both filler-matrix (F-M) and filler-filler (F-F) interfaces. The composite with an optimized proportion of F-M and F-F interface area achieves the highest TC of 45.48 W·m-1·K-1, which is 188.5 times higher than that of the pure PCM, and a high TC enhancement per volume fraction of the filler (TCEF) of 831% per 1 vol % loading. This also results in an enhanced spatial construction for PCM confinement during the phase change. The results emphasize the significance of interface engineering in creating high-TC and form-stable phase-change composites, providing insightful guidance for rational structural design.

Effect of membrane thermal conductivity on ion current rectification in conical nanochannels under asymmetric temperature

Nowadays, there have been extensively theoretical studies on the phenomenon of ion current rectification (ICR) induced by the asymmetric electrical double layer (EDL). As a key factor influencing the behavior of ion transport, temperature is given high priority by researchers. The thermal conductivity of the material commonly employed to prepare nanopores is 2-3 times higher than that of liquid solutions, which may affect ion transport within the nanochannel. However, it is often neglected in previous studies. Thus, we investigate the effect of membrane thermal conductivity on the ICR in conical nanochannels under asymmetric temperature. Based on the PNP-NS theoretical model, the ion current, the rectification ratio, as well as the temperature and ion concentration distributions along the nanochannel are calculated. It is found that the thermal conductivity of the solid membrane noticeably affects the temperature distribution across the nanochannel, altering the ion transport behavior. Larger membrane thermal conductivity tends to homogenize the temperature distribution in the nanochannel, leading to a decline of ionic thermal down-diffusion by a positive temperature difference and ionic thermal up-diffusion by a negative temperature difference, with the former promoting and the latter inhibiting ion current. As a result, the rectification ratio decreases under the positive temperature difference and increases under the negative temperature difference as the thermal conductivity of the membrane increases. These studies will be instructive for the design of nanofluidic diodes and biosensors.

Effect of the alumina micro-particle sizes on the thermal conductivity and dynamic mechanical property of epoxy resin

Epoxy thermal conductive adhesives with high thermal conductivity and dynamic mechanical properties are important thermally conductive materials for fabricating highly integrated electronic devices. In this paper, micro-Al2O3 is used as a thermally conductive filler for the epoxy resin composite and investigated the effect of micron-sized alumina particle size on the thermal conductivity and dynamic mechanical property of epoxy resin by the transient planar hot plate method and DMA (Dynamic mechanical analysis). The experimental results show that with the same amount of alumina filling, the thermal conductivity and Tg (glass transition temperature) of epoxy/Al2O3 composite material decrease with the increase of alumina particle size. The maximum thermal conductivity of the composite material is 0.679 (W/mK), while the energy storage modulus of epoxy/Al2O3 composite material increases with the increase of alumina particle size, and the maximum energy storage modulus of the composite material is 160MPa. Compared with pure epoxy resin, the thermal conductivity and energy storage modulus have increased by 2.7 and 3.2 times, respectively. The epoxy/Al2O3 composite was applied to the COB (Chips On Board) type LED package, and the substrate temperature of the LED dropped to the lowest after 1.5 hours of operation using EP-A5 composite, and the temperature was stabilized at 38.2°C, indicating that the addition of 5-micron alumina composite has the best heat dissipation in the COB type LED package. These results are critical for the implementation of particulate-filled polymer composites in practical applications because relaxed material specifications and handling procedures can be incorporated in production environments to improve efficiency.

Ladder-like Poly(methacryloxypropyl) silsesquioxane-Al2O3-polybutadiene Flexible Nanocomposites with High Thermal Conductivity

Ladder-like poly(methacryloxypropyl)-silsesquioxanes (LPMASQ) are photocurable Si-based gels characterized by a double-stranded structure that ensures superior thermal stability and mechanical properties than common organic polymers. In this work, these attractive features were exploited to produce, in combination with alumina nanoparticles (NPs), both unmodified and functionalized with methacryloxypropyl-trimethoxysilane (MPTMS), LPMASQ/Al2O3 composites displaying remarkable thermal conductivity. Additionally, we combined LPMASQ with polybutadiene (PB) to produce hybrid nanocomposites with the addition of functionalized Al2O3 NPs. The materials underwent thermal stability, structural, and morphological evaluations via thermogravimetric analysis (TGA), scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDXS), Fourier transform infrared spectroscopy (FTIR), and solid-state nuclear magnetic resonance (NMR). Both blending PB with LPMASQ and surface functionalization of nanoparticles proved to be effective strategies for incorporating a higher ceramic filler amount in the matrices, resulting in significant increases in thermal conductivity. Specifically, a 113.6% increase in comparison to the bare matrix was achieved at relatively low filler content (11.2 vol%) in the presence of 40 wt% LPMASQ. Results highlight the potential of ladder-like silsesquioxanes in the field of thermally conductive polymers and their applications in heat dissipation for flexible electronic devices.

Enhancing Dielectric Properties, Thermal Conductivity, and Mechanical Properties of Poly(lactic acid)-Thermoplastic Polyurethane Blend Composites by Using a SiC-BaTiO3 Hybrid Filler

A composite of polymer blends-thermoplastic polyurethane (TPU) and poly(lactic acid) (PLA)-and BaTiO3-SiC was fabricated. BaTiO3 particles were used to improve the dielectric properties of the composite materials, whereas SiC was used to enhance thermal conductivity without altering the dielectric properties; notably, SiC has a good dielectric constant. The surfaces of the filler particles, BaTiO3 and SiC particles, were activated; BaTiO3 was treated with methylene diphenyl diisocyanate (MDI) and SiC's surface was subjected to calcination and acid treatment, and hybrid fillers were prepared via solution mixing. The surface modifications were verified using Fourier transform infrared spectroscopy (the appearance of OH showed acid treatment of SiC, and the presence of NH, CH2, and OH groups indicated the functionalization of BaTiO3 particles). After the extruded products were cooled and dried, the specimens were fabricated using minimolding. The thermal stability of the final composites showed improvement. The dielectric constant improved relative to the main matrix at constant and variable frequencies, being about fivefold for 40% BaTiO3-SiC-TPU-PLA composites. Upon inclusion of 40 wt.% MDI functionalized BaTiO3-SiC particles, an improvement of 232% in thermal conductivity was attained, in comparison to neat TPU-PLA blends.

Heat transfer mechanism in graphene reinforced PEEK nanocomposites

The thermal conductivity of graphene is in the range of 3000-5000 W m-1 K-1, showing great potential in high thermal conductivity devices. However, the thermal conductivity of graphene-reinforced polymer is typically lower than 10 W m-1 K-1, which is far from theoretical expectations. To understand the mechanisms of heat transfer in graphene-reinforced polymers, this work investigated the effect of graphene addition on the thermal conductive performance of polyetheretherketone (PEEK) matrix. The study examined the number of layers, deflection angles, and interlayer distances using molecular dynamics (MD) simulations. The results showed that the improvement of thermal conductivity of PEEK nanocomposite was not only related to the content of graphene but also to the angle between the benzene ring in the molecular chain of PEEK and the transfer direction of heat flow. Increasing the number of graphene layers is more beneficial to the enhancement of thermal conductivity. In particular, the enhancement of thermal conductivity is most significant when the number of graphene layers is the same, and the interlayer distance is less than the truncation radius.

3D Printing Soft Magnet: Binder Study for Vat Photopolymerization of Ferrosilicon Magnetic Composites

Liquid Crystal Display (LCD) masking is a 3D printing technique that can produce soft magnetic composite parts to high resolution and complexity for robotics and energy electronics applications. This additive manufacturing technique has the potential to produce larger, lighter-weight, more efficient, and more durable parts for automotive and mechanical applications. This study conducted a binder study to create a low-viscosity and stiff binder capable of loading at least 60 v/v% Fe-6.5 wt%Si particles. Percolation Theory was applied to anticipate the magnetic interaction of suspended particles. A series of binders were formulated, with adjustments to diluent ratios. The behavior of the binders was assessed by studying their rheological properties, conversion rates, and mechanical properties. A post-cure study was conducted across various energy settings using UV, thermal, and a combination of both energy sources to find the combination that provided the best mechanical properties. As a result, 64 v/v% Fe-6.5 wt%Si loading was achieved and cured using UV light of 405 nm wavelength. Vibrating Sample Spectroscopy (VSM) was used to characterize the composite's magnetic behavior, and a significant increase in saturation magnetization and negligible change in coercivity was observed when the added load exceeded the percolation threshold.

Cerium Methacrylate Assisted Preparation of Highly Thermally Conductive and Anticorrosive Multifunctional Coatings for Heat Conduction Metals Protection

Preparing polymeric coatings with well corrosion resistance and high thermal conductivity (TC) to prolong operational life and ensure service reliability of heat conductive metallic materials has long been a substantive and urgent need while a difficult task. Here we report a multifunctional epoxy composite coating (F-CB/CEP) by synthesizing cerium methacrylate and ingeniously using it as a novel curing agent with corrosion inhibit for epoxy resin and modifier for boron nitride through "cation-π" interaction. The prepared F-CB/CEP coating presents a high TC of 4.29 W m-1 K-1, which is much higher than other reported anti-corrosion polymer coatings and thereby endowing metal materials coated by this coating with outstanding thermal management performance compared with those coated by pure epoxy coating. Meanwhile, the low-frequency impedance remains at 5.1 × 1011 Ω cm2 even after 181 days of immersion in 3.5 wt% NaCl solution. Besides, the coating also exhibits well hydrophobicity, self-cleaning properties, temperature resistance and adhesion. This work provides valuable insights for the preparation of high-performance composite coatings with potential to be used as advanced multifunctional thermal management materials, especially for heat conduction metals protection.

Impact of the Processing-Induced Orientation of Hexagonal Boron Nitride and Graphite on the Thermal Conductivity of Polyethylene Composites

Emergent heat transfer and thermal management applications require polymer composites with enhanced thermal conductivity (κ). Composites filled with non-spherical fillers, such as hexagonal boron nitride (hBN) and Graphite (Gr), suffer from processing-induced filler orientations, resulting in anisotropic κ, commonly low in the through-plane direction. Here, the effects of extrusion and compression molding-induced orientations on κ of hBN- and Gr-filled polyethylene composites were investigated. The effect of extrusion on the hBN orientation was studied using dies of various shapes. The shaped extrudates exhibited hBN orientations parallel to the extrusion flow direction, which prompted additional hBN orientation during compression molding. κ of the composites produced with shaped extrudates varied from 0.95 to 1.67 W m-1 K-1. Pelletizing and crushing the extrudates improved κ, by exploiting and eliminating the effect of extrusion-induced hBN orientations. Gr-filled composites showed better κ than hBN composites due to the higher intrinsic conductivity and bigger particle sizes. A maximum κ of 5.1 and 11.8 W m-1 K-1 was achieved in composites with oriented hBN and Gr through a thin rectangular die and stacking the sheets to fabricate composites with highly oriented fillers.

Enhanced Thermal Conductivity and Dielectric Properties of Epoxy Composites with Fluorinated Graphene Nanofillers

The demand for high-performance dielectrics has increased due to the rapid development of modern electric power and electronic technology. Composite dielectrics, which can overcome the limitations of traditional single polymers in thermal conductivity, dielectric properties and mechanical performance, have received considerable attention. In this study, we report a multifunctional nanocomposite material fabricated by blending fluorinated graphene (F-graphene) with epoxy resin. The F-graphene/epoxy composite exhibited a high thermal conductivity of 0.3304 W·m-1·K-1 at a low filler loading of 1.0 wt.%, which was 67.63% higher than that of pure epoxy. The composite dielectric also showed high breakdown strength (78.60 kV/mm), high dielectric constant (8.23), low dielectric loss (<0.015) and low AC conductivity (<10-11 S·m-1). Moreover, the composite demonstrated high thermal stability and strong mechanical strength. It is believed that the F-graphene/epoxy composite has outstanding performance in various aspects and can enable the development and manufacturing of advanced electric power and electronic equipment devices.

Improved thermal conductivity and excellent electrical insulation properties of polysiloxane nanocomposite-incorporated functional boron nitride sheets via in situ polymerization

Benefiting from its high thermal conductivity (κ) and superior insulation, the boron nitride nanosheet (BNNS) is widely investigated as a promising filler for thermal nanocomposites. However, poor dispersibility and weak interaction with polymer matrix hinder the further improvement of BNNS-based thermal composites. Here, inspired by side-chain liquid crystal polysiloxane (SCLCP) with good mesomorphic structures, highly thermoconductive nanocomposites prepared via in situ polymerization using SCLCP with 2D BNNS are reported. The surface of BNNS is silanized with γ-(methacryloxy)propyltrimethoxysilane (KH-570) to introduce double bonds (defined as f-BNNS), and it is directly linked with SCLCP chains during polymerization. Therefore, the alternating stacking of f-BNNS and microscopic ordered structure of SCLCP yielded a high κ of 2.463 W m-1 K-1 at only 30 wt% f-BNNS content, improving dramatically the κ of pure SCLCP by ∼9 times. Further, the volume electrical resistivity reached 2.11 × 1014 Ω cm, which is five orders of magnitude higher than the critical resistance for electrical insulation (109 Ω cm). Also, the f-BNNS/SCLCP composites as thermal management materials decreased the temperature of the LED chip by 17.5 °C, exhibiting superior thermal management performance. Along with high κ and excellent electrical resistance, this type of nanocomposites displays great advantages in thermal properties for electronic packaging and thermal management of electronics.

Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires

Owing to the increasing demand for the miniaturization and integration of electronic devices, thermal interface materials (TIMs) are crucial components for removing heat and improving the lifetime and safety of electronic devices. Among these, thermal pads are reusable alternatives to thermal paste-type TIMs; however, conventional thermal pads comprise a homogeneous polymer with low thermal conductivity. Composite materials of thermally conducting fillers and polymer matrices are considered suitable alternatives to high-performance pad materials owing to their controllable thermal properties. However, they degrade the thermal performance of the filler materials at high loading ratios via aggregation. In this study, we propose novel nanocomposites using densely aligned MgO nanowire fillers and polydimethylsiloxane (PDMS) matrices. The developed nanocomposites ensured the enhanced thermal conducting properties, while maintaining mechanical flexibility. The three-step preparation process involves the (i) fabrication of the MgO structure using a freeze dryer; (ii) compression of the MgO structure; and (iii) the infiltration of PDMS in the structure. The resulting aligned composites exhibited a superior thermal conductivity (approximately 1.18 W m^-1K^-1) to that of pure PDMS and composites with the same filler ratios of randomly distributed MgO fillers. Additionally, the MgO/PDMS composites exhibited adequate electrical insulating properties, with a room-temperature resistivity of 7.92 × 10¹⁵ Ω∙cm.

Enhancement of Isotropic Heat Dissipation of Polymer Composites by Using Ternary Filler Systems Consisting of Boron Nitride Nanotubes, h-BN, and Al2O3

In this research article, a poly(dimethylsiloxane) (PDMS)-based composite was postulated adapting an interactive ternary filler system consisting of Al₂O₃, hexagonal boron nitride (h-BN), and boron nitride nanotubes (BNNT) to construct a continuous three-dimensional (3D) structure for thermal attenuation. Al₂O₃ was imposed as a main filler, while h-BN and BNNT were assimilated to form interconnected heat conduction pathways for effective thermal dissipation. The structured framework articulates a profound improvement in isotropic thermal conductivity considering both axial and radial heat dissipation. The presence of h-BN entails uniform heat distribution in a planar mode, eliminating the occurrence of hotspots, while BNNT constructed a connecting phonon pathway in various directions, which insinuates effective overall thermal transport. The generated ternary filler composites attained an isotropic ratio of 1.35 and a thermal conductivity of 7.50 W/mK, which is a 36-fold (∼3650%) increase compared to neat PDMS resin and almost 3-fold (∼297%) that of the Al₂O₃ unary filler composite and ∼53% that of its binary counterpart, partaking interfacial thermal gaps of ∼36.15 and ∼62.24% on practical heating performance relative to its counterparts. Moreover, the incorporation of BNNT on a traditional spherical and planar filler offers an advantage not only in thermal conductivity but also in thermal and structural stability. Improvement in thermal stability is stipulated due to a melting point (T_m) shift of ∼11 °C upon the assimilation of BNNT. Mechanical permeance reinforcement was also observed with the presence of BNNT, showcasing a 31.5% increase in tensile strength and a 53% increase in Young's modulus relative to the singular filler composite. This exploration administers a new insight into heat dissipation phenomena in polymeric composites and proposes a simple approach to their design and assembly.

The Effect of Mechanical Elongation on the Thermal Conductivity of Amorphous and Semicrystalline Thermoplastic Polyimides: Atomistic Simulations

Over the past few decades, the enhancement of polymer thermal conductivity has attracted considerable attention in the scientific community due to its potential for the development of new thermal interface materials (TIM) for both electronic and electrical devices. The mechanical elongation of polymers may be considered as an appropriate tool for the improvement of heat transport through polymers without the necessary addition of nanofillers. Polyimides (PIs) in particular have some of the best thermal, dielectric, and mechanical properties, as well as radiation and chemical resistance. They can therefore be used as polymer binders in TIM without compromising their dielectric properties. In the present study, the effects of uniaxial deformation on the thermal conductivity of thermoplastic PIs were examined for the first time using atomistic computer simulations. We believe that this approach will be important for the development of thermal interface materials based on thermoplastic PIs with improved thermal conductivity properties. Current research has focused on the analysis of three thermoplastic PIs: two semicrystalline, namely BPDA-P3 and R-BAPB; and one amorphous, ULTEM^TM. To evaluate the impact of uniaxial deformation on the thermal conductivity, samples of these PIs were deformed up to 200% at a temperature of 600 K, slightly above the melting temperatures of BPDA-P3 and R-BAPB. The thermal conductivity coefficients of these PIs increased in the glassy state and above the glass transition point. Notably, some improvement in the thermal conductivity of the amorphous polyimide ULTEM^TM was achieved. Our study demonstrates that the thermal conductivity coefficient is anisotropic in different directions with respect to the deformation axis and shows a significant increase in both semicrystalline and amorphous PIs in the direction parallel to the deformation. Both types of structural ordering (self-ordering of semicrystalline PI and mechanical elongation) led to the same significant increase in thermal conductivity coefficient.

Recent Progress on Multifunctional Thermally Conductive Epoxy Composite

In last years, the requirements for materials and devices have increased exponentially. Greater competitiveness; cost and weight reduction for structural materials; greater power density for electronic devices; higher design versatility; materials customizing and tailoring; lower energy consumption during the manufacturing, transport, and use; among others, are some of the most common market demands. A higher operational efficiency together with long service life claimed. Particularly, high thermally conductive in epoxy resins is an important requirement for numerous applications, including energy and electrical and electronic industry. Over time, these materials have evolved from traditional single-function to multifunctional materials to satisfy the increasing demands of applications. Considering the complex application contexts, this review aims to provide insight into the present state of the art and future challenges of thermally conductive epoxy composites with various functionalities. Firstly, the basic theory of thermally conductive epoxy composites is summarized. Secondly, the review provides a comprehensive description of five types of multifunctional thermally conductive epoxy composites, including their fabrication methods and specific behavior. Furthermore, the key technical problems are proposed, and the major challenges to developing multifunctional thermally conductive epoxy composites are presented. Ultimately, the purpose of this review is to provide guidance and inspiration for the development of multifunctional thermally conductive epoxy composites to meet the increasing demands of the next generation of materials.

3D-Printed Polyamide 12/Styrene-Acrylic Copolymer-Boron Nitride (PA12/SA-BN) Composite with Macro and Micro Double Anisotropic Thermally Conductive Structures

Anisotropic thermally conductive composites are very critical for precise thermal management of electronic devices. In this work, in order to prepare a composite with significant anisotropic thermal conductivity, polyamide 12/styrene-acrylic copolymer-boron nitride (PA12/SA-BN) composites with macro and micro double anisotropic structures were fabricated successfully using 3D printing and micro-shear methods. The morphologies and thermally conductive properties of composites were systematically characterized via SEM, XRD, and the laser flash method. Experimental results indicate that the through-plane thermal conductivity of the composite is 4.2 W/(m·K) with only 21.4 wt% BN, which is five times higher than that of the composite with randomly oriented BN. Simulation results show that the macro-anisotropic structure of the composite (caused by the selective distribution of BN) as well as the micro-anisotropic structure (caused by the orientation structure of BN) both play critical roles in spreading heat along the specified direction. Therefore, as-obtained composites with double anisotropic structures possess great potential for the application inefficient and controllable thermal management in various fields.

Recent Advances in Flexible Piezoresistive Arrays: Materials, Design, and Applications

Spatial distribution perception has become an important trend for flexible pressure sensors, which endows wearable health devices, bionic robots, and human-machine interactive interfaces (HMI) with more precise tactile perception capabilities. Flexible pressure sensor arrays can monitor and extract abundant health information to assist in medical detection and diagnosis. Bionic robots and HMI with higher tactile perception abilities will maximize the freedom of human hands. Flexible arrays based on piezoresistive mechanisms have been extensively researched due to the high performance of pressure-sensing properties and simple readout principles. This review summarizes multiple considerations in the design of flexible piezoresistive arrays and recent advances in their development. First, frequently used piezoresistive materials and microstructures are introduced in which various strategies to improve sensor performance are presented. Second, pressure sensor arrays with spatial distribution perception capability are discussed emphatically. Crosstalk is a particular concern for sensor arrays, where mechanical and electrical sources of crosstalk issues and the corresponding solutions are highlighted. Third, several processing methods are also introduced, classified as printing, field-assisted and laser-assisted fabrication. Next, the representative application works of flexible piezoresistive arrays are provided, including human-interactive systems, healthcare devices, and some other scenarios. Finally, outlooks on the development of piezoresistive arrays are given.

Tetris-Style Stacking Process to Tailor the Orientation of Carbon Fiber Scaffolds for Efficient Heat Dissipation

As the miniaturization of electronic devices and complication of electronic packaging, there are growing demands for thermal interfacial materials with enhanced thermal conductivity and the capability to direct the heat toward heat sink for highly efficient heat dissipation. Pitch-based carbon fiber (CF) with ultrahigh axial thermal conductivity and aspect ratios exhibits great potential for developing thermally conductive composites as TIMs. However, it is still hard to fabricate composites with aligned carbon fiber in a general approach to fully utilize its excellent axial thermal conductivity in specific direction. Here, three types of CF scaffolds with different oriented structure were developed via magnetic field-assisted Tetris-style stacking and carbonization process. By regulating the magnetic field direction and initial stacking density, the self-supporting CF scaffolds with horizontally aligned (HCS), diagonally aligned and vertically aligned (VCS) fibers were constructed. After embedding the polydimethylsiloxane (PDMS), the three composites exhibited unique heat transfer properties, and the HCS/PDMS and VCS/PDMS composites presented a high thermal conductivity of 42.18 and 45.01 W m-1 K-1 in fiber alignment direction, respectively, which were about 209 and 224 times higher than that of PDMS. The excellent thermal conductivity is mainly ascribed that the oriented CF scaffolds construct effective phonon transport pathway in the matrix. In addition, fishbone-shaped CF scaffold was also produced by multiple stacking and carbonization process, and the prepared composites exhibited a controlled heat transfer path, which can allow more versatility in the design of thermal management system.

Thermal Conductivity of Polyvinylidene Fluoride Films with a Multi-Scale Framework

The orientation of amorphous regions in pure polymers has been noted to be critical to the enhancement of thermal conductivity (TC), but the available reports are still rather few. Here, we propose to prepare a polyvinylidene fluoride (PVDF) film with a multi-scale framework by introducing anisotropic amorphous nanophases in the form of cross-planar alignments among the in-planar oriented extended-chain crystals (ECCs) lamellae, which show an enhanced TC of 1.99 Wm-1 K-1 in the through-plane direction (K⟂) and 4.35 Wm-1 K-1 in the in-plane direction (K∥). Structural characterization determination using scanning electron microscopy and high-resolution synchrotron X-ray scattering showed that shrinking the dimension of the amorphous nanophases can effectively reduce entanglement and lead to alignments formation. Moreover, the thermal anisotropy of the amorphous region is quantitatively discussed with the aid of the two-phase model. Superior thermal dissipation performances are intuitively displayed by means of finite element numerical analysis and heat exchanger applications. Moreover, such unique multi-scale architecture also results in significant benefit in the improvement of dimensional stability and thermal stability. This paper provides a reasonable solution for fabricating inexpensive thermal conducting polymer films from the perspective of practical applications.

Molecular Weight Segregation and Thermal Conductivity of Polydisperse Wax-Graphene Nanocomposites

Paraffin waxes are a promising material for heat storage with high energy density. Their low thermal conductivity, which limits the speed of charging and discharging in heat buffers, was previously shown to be improved by adding graphene nanofillers. In the present study, using molecular dynamics simulations, the segregation by molecular weight of polydisperse paraffin near graphene flakes is investigated. In liquid bidisperse paraffin composed of decane and triacontane, an aligned layer containing mainly triacontane was observed next to the graphene. Upon slow cooling, the wax crystallised into distinct layers parallel to the graphene sheet, with much stronger segregation by molecular weight than in the crystallised bidisperse wax without graphene. For polydisperse wax, the segregation effect was much less pronounced. The molten paraffin had a somewhat higher concentration of the longest chains in the first layers next to the graphene, but during crystallisation, the molecular weight segregation was only slightly increased. Measurements of crystallinity using an alternative version of the method developed by Yamamoto showed that the layers of wax were highly aligned parallel to the graphene, both in the solid state with all wax crystallised and in the liquid state with one layer of aligned wax above and below the graphene. Thermal conductivity was increased in planes parallel to the graphene flakes. The strong segregation of chain lengths in the bidisperse wax resulted in clear differences in thermal conductivity in the segregated regions. The less segregated polydisperse wax showed less variation in thermal conductivity.

Exploiting Enzyme in the Polymer Synthesis for a Remarkable Increase in Thermal Conductivity

The interest in polymers with high thermal conductivity increased much because of their inherent properties such as low density, low cost, flexibility, and good chemical resistance. However, it is challenging to engineer plastics with good heat transfer characteristics, processability, and required strength. Improving the degree of the chain alignment and forming a continuous thermal conduction network is expected to enhance thermal conductivity. This research aimed to develop polymers with a high thermal conductivity that can be interesting for several applications. Two polymers, namely poly(benzofuran-co-arylacetic acid) and poly(tartronic-co-glycolic acid), with high thermal conductivity containing microscopically ordered structures were prepared by performing enzyme-catalyzed (Novozyme-435) polymerization of the corresponding α-hydroxy acids 4-hydroxymandelic acid and tartronic acid, respectively. A comparison between the polymer's structure and heat transfer obtained by mere thermal polymerization before and enzyme-catalyzed polymerization will now be discussed, revealing a dramatic increase in thermal conductivity in the latter case. The polymer structures were investigated by FTIR spectroscopy, nuclear magnetic resonance (NMR) spectroscopy in liquid- and solid-state (ss-NMR), and powder X-ray diffraction. The thermal conductivity and diffusivity were measured using the transient plane source technique.

Hydroxy silicone oil modified boron nitride for high thermal conductivity and low dielectric loss silicone rubber composites: experimental and molecular simulation studies

Polymer-based composites are widely used in microelectronics and wireless communications, which require high thermal conductivity and low dielectric loss for effective heat dispersion and signal transmission. Different lengths of hydroxyl silicone oil chains modified boron nitride/silicone rubber composites were explored and prepared in this work. Experiments demonstrate that the long-chain modified BN improves the thermal conductivity and decreases the dielectric loss of composites. A molecular dynamics simulation was employed to study the mechanism and affecting variables. The calculated results indicated that the improvement of the thermal and dielectric properties is mainly related to the interfacial behavior, including interfacial compatibility, interfacial bond strength, and phonon matching. Based on the simulated interfacial behavior and thermal conductivity, the thermal and dielectric properties of different chain-length modified boron nitride/silicone rubber composites have been anticipated. The results show that the longer-chain modified boron nitride/silicone rubber composites have better thermal and dielectric properties. This research may give a theoretical foundation for the development of materials with designable performance for electronic devices.

Fabricating Well-Dispersed Poly(Vinylidene Fluoride)/Expanded Graphite Composites with High Thermal Conductivity by Melt Mixing with Maleic Anhydride Directly

Maleic anhydride (MA) is introduced to fabricate poly(vinylidene fluoride)/expanded graphite (PVDF/EG) composites via one-step melt mixing. SEM micrographs and WAXD results have demonstrated that the addition of MA helps to exfoliate and disperse the EG well in the PVDF matrix by promoting the mobility of PVDF molecular chains and enhancing the interfacial adhesion between the EG layers and the PVDF. Thus, much higher thermal conductivities are obtained for the PVDF/MA/EG composites compared to the PVDF/EG composites that are lacking MA. For instance, The PVDF/MA/EG composite prepared with a mass ratio of 93:14:7 exhibits a high thermal conductivity of up to 0.73 W/mK. It is 32.7% higher than the thermal conductivity of the PVDF/EG composite that is prepared with a mass ratio of 93:7. Moreover, the introduction of MA leads to an increased melting peak temperature and crystallinity due to an increased nucleation site provided by the uniformly dispersed EG in the PVDF matrix. This study provides an efficient preparation method for PVDF/EG composites with a high thermal conductivity.