Facile Exfoliation and Noncovalent Superacid Functionalization of Boron Nitride Nanosheets and Their Use for Highly Thermally Conductive and Electrically Insulating Polymer Nanocomposites

Synchronously enhancing thermal conductivity and dielectric properties in epoxy composites via incorporation of functionalized boron nitride

Polymer-like dielectrics with superb thermal conductivity as well as high dielectric properties hold great promise for the modern electronic field. Nevertheless, integrating these properties into a single material simultaneously remains problematic due to their mutually limited physical connotations. In this study, we developed high-quality thermally conductive epoxy composites with excellent dielectric properties. This was achieved by incorporating surface-functionalized microscale hexagonal boron nitride (BN) along with N-[3-(Trimethoxysilyl)propyl]ethylene diamine (DN) and N-[3-(Trimethoxysilyl)propyl]aniline (PN). In the resulting epoxy composite, microscale BN serves as the primary building block for establishing the thermally conductive network, while silica particles act as bridges to regulate heat transfer and reduce interfacial phonon-scattering. The prepared composites were thoroughly examined across various filler contents (ranging from 10 to 80 wt%). Among them, the DNBN/epoxy composite exhibited higher thermal conductivity (in-plane: 47.03 W m-1 K-1) at 60 wt% filler content compared to BN/epoxy (39.40 W m-1 K-1) and PNBN/epoxy (33 W m-1 K-1) composites. These results highlight the usefulness of surface modification of BN in improving compatibility between fillers and epoxy, ultimately reducing composite viscosity. Furthermore, the DNBN/epoxy composite at 60 wt% demonstrated superb dielectric constant (∼6.15) without compromising on dissipation loss (∼0.06). The strategy adopted in this study offers significant insights into designing dielectric thermally conductive composites with superior performance outcomes.

1D and 2D Boron Nitride Nano Structures: A Critical Analysis for Emerging Applications in the Field of Nanocomposites

Boron nitride (BN) with its 1D and 2D nano derivatives have gained immense popularity in both the field of research and applications. These nano derivatives have proved to be one of the most promising fillers which can be incorporated in polymers to form nanocomposites with excellent properties. These materials have been around for 25 years whereas significant research has been done in this field for only the past decade. There are many interesting properties which are imparted to the nanocomposites wherein thermal stability, large energy band gap, resistance to oxidation, excellent thermal conductivity, chemical inertness, and exceptional mechanical properties are just a few worthy of mention. Hexagonal boron nitride (h-BN) was selected as the parent material by most researchers reviewed in this paper through which 2D derivative Boron nitride nanosheets (BNNS) and 1D derivative Boron nitride nanotubes (BNNTs) are synthesized. This review will focus on the in-depth properties of h-BN and further will concisely focus on BNNS and BNNTs for their various properties. A detailed discussion of the addition of BNNS and BNNTs into polymers to form nanocomposites, their synthesis, properties, and applications is followed by a summary determining the most suitable synthesizing processes and the materials, keeping in mind the current challenges.

High Thermal Conductivity and Radiative Cooling Designed Boron Nitride Nanosheets/Silk Fibroin Films for Personal Thermal Management

The implementation of passive cooling strategies is crucial for transitioning from the current high-power- and energy-intensive thermal management practices to more environmentally friendly and carbon-neutral alternatives. Among the various approaches, developing thermal management materials with high thermal conductivity and emissivity for effective cooling of personal and wearable devices in both indoor and outdoor settings poses significant challenges. In this study, we successfully fabricated a cooling patch by combining biodegradable silk fibroin with boron nitride nanosheets. This patch exhibits consistent heat dissipation capabilities under different ambient conditions. Leveraging its excellent radiative cooling efficiency (Rsolar = 0.89 and εLWIR = 0.84) and high thermal conductivity (in-plane 27.58 W m-1 K-1 and out-plane 1.77 W m-1 K-1), the cooling patch achieves significant simulated skin temperature reductions of approximately 2.5 and 8.2 °C in outdoor and indoor conditions, respectively. Furthermore, the film demonstrates excellent biosafety and can be recycled and reused for at least three months. This innovative BNNS/SF film holds great potential for advancing the field of personal thermal management materials.

Thermal Conductivity Enhancement of Polymeric Composites Using Hexagonal Boron Nitride: Design Strategies and Challenges

With the integration and miniaturization of chips, there is an increasing demand for improved heat dissipation. However, the low thermal conductivity (TC) of polymers, which are commonly used in chip packaging, has seriously limited the development of chips. To address this limitation, researchers have recently shown considerable interest in incorporating high-TC fillers into polymers to fabricate thermally conductive composites. Hexagonal boron nitride (h-BN) has emerged as a promising filler candidate due to its high-TC and excellent electrical insulation. This review comprehensively outlines the design strategies for using h-BN as a high-TC filler and covers intrinsic TC and morphology effects, functionalization methods, and the construction of three-dimensional (3D) thermal conduction networks. Additionally, it introduces some experimental TC measurement techniques of composites and theoretical computational simulations for composite design. Finally, the review summarizes some effective strategies and possible challenges for the design of h-BN fillers. This review provides researchers in the field of thermally conductive polymeric composites with a comprehensive understanding of thermal conduction and constructive guidance on h-BN design.

Hexagonal boron nitride exfoliation and dispersion

Research on hexagonal boron nitride (hBN) 2-dimensional nanostructures has gained traction due to their unique chemical, thermal, and electronic properties. However, to make use of these exceptional properties and fabricate macroscopic materials, hBN often needs to be exfoliated and dispersed in a solvent. In this review, we provide an overview of the many different methods that have been used for dispersing hBN. The approaches that will be covered in this review include solvents, covalent functionalization, acids and bases, surfactants and polymers, biomolecules, intercalating agents, and thermal expansion. The properties of the exfoliated sheets obtained and the dispersions are discussed, and an overview of the work in the field throughout the years is provided.

Dopamine-Mediated Graphene Bridging Hexagonal Boron Nitride for Large-Scale Composite Films with Enhanced Thermal Conductivity and Electrical Insulation

Heat accumulation generated from confined space poses a threat to the service reliability and lifetime of electronic devices. To quickly remove the excess heat from the hot spot, it is highly desirable to enhance the heat dissipation in a specific direction. Herein, we report a facile route to fabricate the large-scale composite film with enhanced thermal conductivity and electrical insulation. The well-stacked composite films were constructed by the assembly of polydopamine (PDA)-modified graphene nanosheets (GNS_PDA) and hexagonal boron nitride (BN_PDA), as well as bacterial cellulose (BC). The introduction of the PDA layer greatly improves the interface compatibility between hybrid fillers and BC matrix, and the presence of GNS_PDA-bridging significantly increases the probability of effective contact with BN_PDA fillers, which is beneficial to form a denser and complete "BN-GNS-BN" heat conduction pathway and tight filler-matrix network, as supported by the Foygel model fitting and numerical simulation. The resulting BC/BN_PDA/GNS_PDA film shows the thermal conductivity and tensile strength of 34.9 W·m^-1·K^-1 and 30.9 MPa, which separately increases to 161% and 155% relative to the BC/BN_PDA film. It was found that the low electrically conductive and high thermal conductive properties can be well balanced by tuning the mass ratio of GNS_PDA at 5 wt%, and the electrical conductivity caused by GNS_PDA can be effectively blocked by the BN_PDA filler network, giving the low electrical conductivity of 1.8 × 10^-10 S·cm^-1. Meanwhile, the BC/BN_PDA/GNS_PDA composite films effectively transfer the heat and diminish the hot-spot temperature in cooling LED chip module application. Thus, the present study may pave the way to promoting the industrialization of scalable thermal management devices.

Formation Mechanisms of Hexagonal Boron Nitride Nanosheets in Solvothermal Exfoliation

Solvothermal techniques are widely used to exfoliate many two-dimensional materials, but the formation mechanisms of these nanomaterials have not been clearly revealed. Herein, we discovered the dissociation of hexagonal boron nitride (h-BN) in solvothermal exfoliation evidenced by the formation of B(OH)₃, NH₄B₅O₈·4H₂O, and (NH₄)₂B₁₀O₁₆·8H₂O. In the selected solvents, the lateral sizes of the formed boron nitride nanosheets (BNNSs) are increased in the order of N-methyl-2-pyrrolidone (NMP), N,N-dimethylformamide (DMF), acetonitrile (MeCN), and isopropanol (IPA), suggesting the decreased dissolving abilities of these solvents to h-BN in turn. The dissociation behaviors are the properties of solvents themselves, but the inclusion of lithium chloride (LiCl) and cetyltrimethylammonium bromide (CTAB) can elevate the dissociation degree and yield BNNSs with smaller lateral sizes due to the intercalating effects. The cation-π interactions make CTAB more effective in obtaining uniform BNNSs than using the neutral halogenated hydrocarbons as assistant reagents. The dissociation abilities of the solvents have strong relationships with the surface tension, Hansen solubility parameters distances (R_a), and polarities, whereas there is little relevance with the pressures. Meanwhile, we also observed the cracking of CTAB and the polymerization of MeCN in these reactions. Our findings indicate that the impurities are prone to be attached to the BNNSs exfoliated by the solvothermal route.

Thermally Conductive but Electrically Insulating Polybenzazole Nanofiber/Boron Nitride Nanosheets Nanocomposite Paper for Heat Dissipation of 5G Base Stations and Transformers

The rapid development of 5G equipment and high-power density electronic devices calls for high thermal conductivity materials for heat dissipation. Dielectric polymer composites are highly promising as the electrical insulation, mechanical property, thermal stability, and even fire retardance are also of great importance for electrical and electronic applications. However, the current thermal conductivity enhancement of dielectric polymer composites is usually at the cost of lowering the mechanical and electrical insulating properties. In this work, we report the facile preparation of highly thermally conductive and electrically insulating poly(p-phenylene benzobisoxazole) nanofiber (PBONF) composites by incorporating a low weight fraction of functionalized boron nitride nanosheets (BNNSs). With strong electrostatic interaction, the BNNSs are encapsulated by PBONFs, and the constructed robust interconnected network makes the nanocomposites exhibit a nacre-like structure. Accordingly, the nanocomposite paper has a high in-plane thermal conductivity of 21.34 W m^-1 K^-1 at a low loading of 10 wt % BNNSs and exhibits an ultrahigh strength of 206 MPa. Additionally, the nanocomposite paper exhibits superior electrical insulation properties up to higher than 350 °C and excellent fire retardance. The strong heat dissipation capability of the nanocomposite paper was demonstrated in 5G base stations and control transformers, showing wide potential applications in high power density electrical equipment and electronic devices.

h-BN Modification Using Several Hydroxylation and Grafting Methods and Their Incorporation into a PMMA/PA6 Polymer Blend

Hexagonal boron nitride (h-BN) has recently gained much attention due to its high thermal conductivity and low electrical conductivity. In this study, we proposed to evaluate the impact of the modification of h-BN for use in a polymethylmethacrylate/polyamide 6 (PMMA/PA6) polymer blend. Different methods to modify h-BN particles and improve their affinity with polymers were proposed. The modification was performed in two steps: (1) a hydroxylation step for which three different routes were used: calcination, acidic treatment, and ball milling using gallic acid; (2) a grafting step for which four different silane agents were used, carrying different molecular or macromolecular groups: the octadecyl group (Si-C18), propyl amine group (Si-NH2), polystyrene chain (Si-PS), and PMMA chain (Si-PMMA). The modified h-BN samples after hydroxylation and functionalization were characterized by FTIR and TGA. Py-GC/MS was also used to prove the successful graft with Si-C18 groups. Sedimentation tests and multiple light scattering were performed to assess the surface modification of h-BN. Granulometry and SEM observations were performed to evaluate the particle size distribution after hydroxylation. After the addition of Si-PMMA modified h-BN into a PMMA/PA6 co-continuous blend, the morphology of the polymer blend nanocomposites was characterized using SEM. The calculation of the wetting parameter based on the surface tension measurement using the liquid drop model showed that h-BN dispersed in the PA6 phase. Grafting PMMA chains onto hydroxylated h-BN particles combined with an adequate sequence mixing led to a successful localization of the grafted h-BN particles at the interface of the PMMA/PA6 blend.

Viscous Solvent-Assisted Planetary Ball Milling for the Scalable Production of Large Ultrathin Two-Dimensional Materials

Ball milling is a widely used method to produce graphene and other two-dimensional (2D) materials for both industry and research. Conventional ball milling generates strong impact forces, producing small and thick nanosheets that limit their applications. In this study, a viscous solvent-assisted planetary ball milling method has been developed to produce large thin 2D nanosheets. The viscous solvent simultaneously increases the exfoliation energy (E_e) and lowers the impact energy (E_i). Simulations show a giant ratio of η = E_e/E_i, for the viscous solvent, 2 orders of magnitude larger than that of water. The method provides both a high exfoliation yield of 74%, a high aspect ratio of the generated nanosheets of 571, and a high quality for a representative 2D material of boron nitride nanosheets (BNNSs). The large thin BNNSs can be assembled into high-performance functional films, such as separation membranes and thermally conductive flexible films with some performance parameters better than those 2D nanosheets produced by chemical exfoliation methods.

Enhanced thermal transportation across an electrostatic self-assembly of black phosphorene and boron nitride nanosheets in flexible composite films

For effective heat dissipation in portable electronics, there is a great demand for lightweight and flexible films with superior thermal transport properties. Despite extensive efforts, enhancing the intrinsic low thermal conductivity of polymers while simultaneously maintaining their flexibility is difficult to achieve due to the dilemma of quarrying appropriate filler loading. Herein, a cellulose nanofiber-based film with high in-plane thermal conductivity up to 72.53 W m^-1 K^-1 was obtained by harnessing the advantage of functionalized boron nitride nanosheets (f-BNNS) and black phosphorene (BP) via the vacuum filtration process. Besides, our unique design based on the electrostatic coupling of black phosphorene and functionalized boron nitride nanosheets significantly reduced the interfacial thermal resistance of the composite films. This work offers new insights into establishing a facile, yet efficient approach to preparing high thermal conductive heat spreaders.

Highly Anisotropic Thermal Conductivity of Three-Dimensional Printed Boron Nitride-Filled Thermoplastic Polyurethane Composites: Effects of Size, Orientation, Viscosity, and Voids

Extrusion-based three-dimensional (3D) printing techniques usually exhibit anisotropic thermal, mechanical, and electric properties due to the shearing-induced alignment during extrusion. However, the transformation from the extrusion to stacking process is always neglected and its influence on the final properties remains ambiguous. In this work, we adopt two different sized boron nitride (BN) sheets, namely, small-sized BN (S-BN) and large-sized BN (L-BN), to explore their impact on the orientation degree, morphology, and final anisotropic thermal conductivity (TC) of thermoplastic polyurethane (TPU) composites by fused deposition modeling. The transformation from one-dimensional axial alignment in the extruded filament to two-dimensional alignment (horizontal and vertical alignment) in the stacking filament of BN sheets is observed, and its impact on anisotropic TC in three directions is clarified. It is found that L-BN/TPU composites show a high TC of 6.45 W m^-1 K^-1 at 60 wt % BN content along the printing direction, while at a lower content (<40 wt %), S-BN/TPU composites exhibit a higher TC than L-BN/TPU composites. Effects of orientation, viscosity, and voids are comprehensively considered to elucidate such differences. Finally, heat dissipation tests demonstrate the great potential of 3D printed BN/TPU composites to be used in thermal management applications.

High-efficiency 2D nanosheet exfoliation by a solid suspension-improving method

Two-dimensional (2D) materials with mono or few layers have wide application prospects, including electronic, optoelectronic, and interface functional coatings in addition to energy conversion and storage applications. However, the exfoliation of such materials is still challenging due to their low yield, high cost, and poor ecological safety in preparation. Herein, a safe and efficient solid suspension-improving method was proposed to exfoliate hexagonal boron nitride nanosheets (hBNNSs) in a large yield. The method entails adding a permeation barrier layer in the solvothermal kettle, thus prolonging the contact time between the solvent and hexagonal boron nitride (hBN) nanosheet and improving the stripping efficiency without the need for mechanical agitation. In addition, the proposed method selectively utilizes a matching solvent that can reduce the stripping energy of the material and employs a high-temperature steam shearing process. Compared with other methods, the exfoliating yield ofhBNNSs is up to 42.3% at 150 °C for 12 h, and the strategy is applicable to other 2D materials. In application, the ionic conductivity of a PEO/hBNNSs composite electrolytes reached 2.18 × 10^-4S cm^-1at 60 °C. Overall, a versatile and effective method for stripping 2D materials in addition to a new safe energy management strategy were provided.

Fabrication of thermally conductive polymer composites based on hexagonal boron nitride: recent progresses and prospects

Hexagonal boron nitride (h-BN) and its nanomaterials are among the most promising candidates for use in thermal management applications because of their high thermal conductivity, thermal stability, and good electric insulation, and when used as the conductive fillers, they enhance the overall properties of polymer composites. In this review, the basic concepts of h-BN are introduced, followed by the synthesis of BN nanotubes and BN nanosheets. Then, various novel methods to fabricate h-BN polymer composites with improved thermally conductive paths are discussed. They can be classified into two categories: dispersion and compatibility reinforced and structure formation. In addition, the thermal conducting mechanisms of h-BN composites are proposed. Finally, the advantages and limitations of aforementioned strategies are summarized.

Advances in Studies of Boron Nitride Nanosheets and Nanocomposites for Thermal Transport and Related Applications

Hexagonal boron nitride (h-BN) and exfoliated nanosheets (BNNs) not only resemble their carbon counterparts graphite and graphene nanosheets in structural configurations and many excellent materials characteristics, especially the ultra-high thermal conductivity, but also offer other unique properties such as being electrically insulating and extreme chemical stability and oxidation resistance even at elevated temperatures. In fact, BNNs as a special class of 2-D nanomaterials have been widely pursued for technological applications that are beyond the reach of their carbon counterparts. Highlighted in this article are significant recent advances in the development of more effective and efficient exfoliation techniques for high-quality BNNs, the understanding of their characteristic properties, and the use of BNNs in polymeric nanocomposites for thermally conductive yet electrically insulating materials and systems. Major challenges and opportunities for further advances in the relevant research field are also discussed.

Methods of hexagonal boron nitride exfoliation and its functionalization: covalent and non-covalent approaches

The exfoliation of two-dimensional (2D) hexagonal boron nitride nanosheets (h-BNNSs) from bulk hexagonal boron nitride (h-BN) materials has received intense interest owing to their fascinating physical, chemical, and biological properties. Numerous exfoliation techniques offer scalable approaches for harvesting single-layer or few-layer h-BNNSs. Their structure is very comparable to graphite, and they have numerous significant applications owing to their superb thermal, electrical, optical, and mechanical performance. Exfoliation from bulk stacked h-BN is the most cost-effective way to obtain large quantities of few layer h-BN. Herein, numerous methods have been discussed to achieve the exfoliation of h-BN, each with advantages and disadvantages. Herein, we describe the existing exfoliation methods used to fabricate single-layer materials. Besides exfoliation methods, various functionalization methods, such as covalent, non-covalent, and Lewis acid-base approaches, including physical and chemical methods, are extensively described for the preparation of several h-BNNS derivatives. Moreover, the unique and potent characteristics of functionalized h-BNNSs, like enhanced solubility in water, improved thermal conductivity, stability, and excellent biocompatibility, lead to certain extensive applications in the areas of biomedical science, electronics, novel polymeric composites, and UV photodetectors, and these are also highlighted.

Thionyl Chloride Corrodes Hexagonal Boron Nitride to Generate Reactive Functional Groups

Two-dimensional hexagonal boron nitride (h-BN) has received much attention owing to its unique properties and wide range of applications. However, the lack of sufficient active functional groups on the surface coupled with the extremely stable structure restricts the wide application of h-BN. We find that thionyl chloride can corrode commercially available h-BN and generate many through-holes in the thickness direction. Both X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FT-IR) show that the corroded h-BN contains reactive hydroxyl and a lot of amino groups. The corrosion mechanism is proposed and we conclude that H⁺ and OH^- will affect the defect structure of the corroded h-BN by affecting the generation of boric acid. The thionyl chloride corroded h-BN could improve the thermal conductivity and DC breakdown strength of the composites because of the improved interface. This novel method about corroding h-BN through thionyl chloride is promising for the modification research of h-BN due to its simplicity and efficiency.

ReaxFF reactive molecular dynamics simulations to study the interfacial dynamics between defective h-BN nanosheets and water nanodroplets

In this work, the authors have developed a reactive force field (ReaxFF) to investigate the effect of water molecules on the interfacial interactions with vacancy defective hexagonal boron nitride (h-BN) nanosheets by introducing parameters suitable for the B/N/O/H chemistry. Initially, molecular dynamics simulations were performed to validate the structural stability and hydrophobic nature of h-BN nanosheets. The water molecule dissociation mechanism in the vicinity of vacancy defective h-BN nanosheets was investigated, and it was shown that the terminal nitrogen and boron atoms bond with a hydrogen atom and hydroxyl group, respectively. Furthermore, it is predicted that the water molecules arrange themselves in layers when compressed in between two h-BN nanosheets, and the h-BN nanosheet fracture nucleates from the vacancy defect site. Simulations at elevated temperatures were carried out to explore the water molecule trajectory near the functionalized h-BN pores, and it was observed that the intermolecular hydrogen bonds lead to agglomeration of water molecules near these pores when the temperature was lowered to room temperature. The study was extended to observe the effect of pore sizes and temperatures on the contact angle made by a water nanodroplet on h-BN nanosheets, and it was concluded that the contact angle would be less at higher temperatures and larger pore sizes. This study provides important information for the use of h-BN nanosheets in nanodevices for water desalination and underwater applications, as these h-BN nanosheets possess the desired adsorption capability and structural stability.

Ultrahigh-Aspect-Ratio Boron Nitride Nanosheets Leading to Superhigh In-Plane Thermal Conductivity of Foldable Heat Spreader

The rapid development of integrated circuits and electronic devices creates a strong demand for highly thermally conductive yet electrically insulating composites to efficiently solve "hot spot" problems during device operation. On the basis of these considerations, hexagonal boron nitride nanosheets (BNNS) have been regarded as promising fillers to fabricate polymer matrix composites. However, so far an efficient approach to prepare ultrahigh-aspect-ratio BNNS with large lateral size while maintaining an atomically thin nature is still lacking, seriously restricting further improvement of the thermal conductivity for BNNS/polymer composites. Here, a rapid and high-yield method based on a microfluidization technique is developed to obtain exfoliated BNNS with a record high aspect ratio of ≈1500 and a low degree of defects. A foldable and electrically insulating film made of such a BNNS and poly(vinyl alcohol) (PVA) matrix through filtration exhibits an in-plane thermal conductivity of 67.6 W m^-1 K^-1 at a BNNS loading of 83 wt %, leading to a record high value of thermal conductivity enhancement (≈35 500). The composite film then acts as a heat spreader for heat dissipation of high-power LED modules and shows superior cooling efficiency compared to commercial flexible copper clad laminate. Our findings provide a practical route to produce electrically insulating polymer composites with high thermal conductivity for thermal management applications in modern electronic devices.

Anisotropic heat transfer properties of two-dimensional materials

The anisotropic heat transfer properties of two-dimensional materials play an important role in controlled heat transfer and intelligent heat management. At present, there are many references on anisotropic heat transfer of two-dimensional materials, but less systematic review of their development status, problems, and future directions. In this paper, intrinsic anisotropic heat transfer of two-dimensional materials, influencing factors and control means are introduced. The preparation methods of thin film with two-dimensional material and the influence factors of macroscopic anisotropic thermal properties are summarized. The technology of two-dimensional material oriented arrangement in matrix and the influence factors of macroscopic anisotropic thermal properties of the composite are outlined.

Thermal interface materials with graphene fillers: review of the state of the art and outlook for future applications

We review the current state-of-the-art graphene-enhanced thermal interface materials for the management of heat in the next generation of electronics. Increased integration densities, speed and power of electronic and optoelectronic devices require thermal interface materials with substantially higher thermal conductivity, improved reliability, and lower cost. Graphene has emerged as a promising filler material that can meet the demands of future high-speed and high-powered electronics. This review describes the use of graphene as a filler in curing and non-curing polymer matrices. Special attention is given to strategies for achieving the thermal percolation threshold with its corresponding characteristic increase in the overall thermal conductivity. Many applications require high thermal conductivity of composites, while simultaneously preserving electrical insulation. A hybrid filler approach, using graphene and boron nitride, is presented as a possible technology providing for the independent control of electrical and thermal conduction. The reliability and lifespan performance of thermal interface materials is an important consideration towards the determination of appropriate practical applications. The present review addresses these issues in detail, demonstrating the promise of graphene-enhanced thermal interface materials compared to alternative technologies.

A Review on van der Waals Boron Nitride Quantum Dots

Boron nitride quantum dots (BNQDs) have gained increasing attention for their versatile fluorescent, optoelectronic, chemical, and biochemical properties. During the past few years, significant progress has been demonstrated, started from theoretical modeling to actual application. Many interesting properties and applications have been reported, such as excitation-dependent emission (and, in some cases, non-excitation dependent), chemical functionalization, bioimaging, phototherapy, photocatalysis, chemical, and biological sensing. An overview of this early-stage research development of BNQDs is presented in this article. We have prepared un-bias assessments on various synthesis methods, property analysis, and applications of BNQDs here, and provided our perspective on the development of these emerging nanomaterials for years to come.

Hypergravity-Induced Accumulation: A New, Efficient, and Simple Strategy to Improve the Thermal Conductivity of Boron Nitride Filled Polymer Composites

Thermal conductive polymer composites (filled type) consisting of thermal conductive fillers and a polymer matrix have been widely used in a range of areas. More than 10 strategies have been developed to improve the thermal conductivity of polymer composites. Here we report a new "hypergravity accumulation" strategy. Raw material mixtures of boron nitride/silicone rubber composites were treated in hypergravity fields (800-20,000 g, relative gravity acceleration) before heat-curing. A series of comparison studies were made. It was found that hypergravity treatments could efficiently improve the microstructures and thermal conductivity of the composites. When the hypergravity was about 20,000 g (relative gravity acceleration), the obtained spherical boron nitride/silicone rubber composites had highly compacted microstructures and high and isotropic thermal conductivity. The highest thermal conductivity reached 4.0 W/mK. Thermal interface application study showed that the composites could help to decrease the temperature on a light-emitting diode (LED) chip by 5 °C. The mechanism of the improved microstructure increased thermal conductivity, and the high viscosity problem in the preparation of boron nitride/silicone rubber composites, and the advantages and disadvantages of the hypergravity accumulation strategy, were discussed. Overall, this work has provided a new, efficient, and simple strategy to improve the thermal conductivity of boron nitride/silicone rubber and other polymer composites (filled type).

A Dual-Crosslinked and Anisotropic Regenerated Cellulose/Boron Nitride Nanosheets Film With High Thermal Conductivity, Mechanical Strength, and Toughness

The highly thermo-conductive but electrically insulating film, with desirable mechanical performances, is extremely demanded for thermal management of portable and wearable electronics. The integration of boron nitride nanosheets (BNNSs) with regenerated cellulose (RC) is a sustainable strategy to satisfy these requirements, while its practical application is still restricted by the brittle fracture and loss of toughness of the composite films especially at the high BNNS addition. Herein, a dual-crosslinked strategy accompanied with uniaxial pre-stretching treatment was introduced to engineer the artificial RC/BNNS film, in which partial chemical bonding interactions enable the effective interfiber slippage and prevent any mechanical fracture, while non-covalent hydrogen bonding interactions serve as the sacrifice bonds to dissipate the stress energy, resulting in a simultaneous high mechanical strength (103.4 MPa) and toughness (10.2 MJ/m³) at the BNNS content of 45 wt%. More importantly, attributed to the highly anisotropic configuration of BNNS, the RC/BNNS composite film also behaves as an extraordinary in-plane thermal conductivity of 15.2 W/m·K. Along with additional favorable water resistance and bending tolerance, this tactfully engineered film ensures promised applications for heat dissipation in powerful electronic devices.

Group IV nanodots: synthesis, surface engineering and application in bioimaging and biotherapy

Group IV nanodots (NDs) mainly including carbon (C), silicon (Si), germanium (Ge) have aroused much attention as one type of important nanomaterials that are widely studied in optoelectronics, semiconductors, sensors and biomedicine-related fields owing to the low cost of synthesis, good stability, excellent biocompatibility, and some attractive newly emerged properties. In this review, the synthesis, surface engineering and application in bioimaging and biotherapy of group IV NDs are summarized and discussed. The recent progress in the rational synthesis and functionalization, specific therapy-related properties, together with in vivo and in vitro bioimaging are highlighted. Their new applications in biotherapy such as photothermal therapy (PTT) and photodynamic therapy (PDT) are illustrated with respect to C, Si and Ge NDs. The current challenges and future applications of these emerging materials in bioimaging and biotherapy are presented. This review provides readers with a distinct perspective of the group IV NDs nanomaterials for synthesis and surface engineering, and newly emerging properties related to applications in biomedicine.

Artificial Nacre Epoxy Nanomaterials Based on Janus Graphene Oxide for Thermal Management Applications

Owing to the development of microelectronics, demands for excellent thermal dissipation materials have substantially increased. Learning from natural nacre, thermally conductive epoxy nanocomposites were prepared based on asymmetrically polydopamine-functionalized Janus graphene oxide (JPGO) scaffolds. The required highly oriented JPGO scaffolds were prepared via the bidirectional freeze-casting method. With the addition of epoxy resin, the resulting nanocomposite reveals anisotropic thermal properties. With the total content of the JPGO scaffold being 0.93 wt %, almost 35 times enhancement of in-plane thermal conductivity (perpendicular to the lamellar structure) (∼5.6 W m^-1 K^-1) has been obtained. The single-side-functionalized JPGO scaffolds play an important role in forming thermal conductive networks for the epoxy nanocomposites. Importantly, the nanocomposites present electrically insulating properties (>10¹⁴ Ω cm). Such high-performance nanocomposites have promising applications for thermal management in electronic devices.

Novel Functionalized BN Nanosheets/Epoxy Composites with Advanced Thermal Conductivity and Mechanical Properties

The effective dissipation of heat is critical to the performance and longevity of high-power electronics, so it is important to prepare highly thermally conductive polymer-based packaging materials for efficient thermal management. Due to the excellent thermal conductivity of boron nitride nanosheets (BNNSs), the hexagonal boron nitride (hBN) powder was dissolved in a mixed solution of isopropanol and deionized water for ultrasonic exfoliation to obtain hydroxylated BN nanosheets. Then, the prepared BNNS was functionalized with (3-aminopropyl)triethoxysilane (APTES) to enhance its dispersibility and interfacial compatibility in the epoxy resin, which play an important role in the improvement of the thermal conductivity of the composites. Finally, APTES-BNNS was uniformly dispersed in the epoxy resin by solvent mixing, and the oriented APTES-BNNS/epoxy composites were prepared through spin-coating and hot-pressing methods. It was found that APTES-BNNS/epoxy composites prepared herein exhibited significant anisotropic thermal conductivity. The results show that the thermal conductivity of APTES-BNNS/epoxy composites reached 5.86 W/mK at a filler content of 40 wt % and these composites have favorable thermal stability and mechanical properties. The APTES-BNNS/epoxy composite prepared in this paper has excellent thermal management capability and can be applied to the packaging of high-power electronic devices.

Highly Thermoconductive, Thermostable, and Super-Flexible Film by Engineering 1D Rigid Rod-Like Aramid Nanofiber/2D Boron Nitride Nanosheets

Polymer-based thermal management materials have many irreplaceable advantages not found in metals or ceramics, such as easy processing, low density, and excellent flexibility. However, their limited thermal conductivity and unsatisfactory resistance to elevated temperatures (<200 °C) still prevent effective heat dissipation during applications with high-temperature conditions or powerful operation. Therefore, herein highly thermoconductive and thermostable polymer nanocomposite films prepared by engineering 1D aramid nanofiber (ANF) with worm-like microscopic morphologies into rigid rod-like structures with 2D boron nitride nanosheets (BNNS) are reported. With no coils or entanglements, the rigid polymer chain enables a well-packed crystalline structure resulting in a 20-fold (or greater) increase in axial thermal conductivity. Additionally, strong interfacial interactions between the weaved ANF rod and the stacked BNNS facilitate efficient heat flux through the 1D/2D configuration. Hence, unprecedented in-plane thermal conductivities as high as 46.7 W m^-1 K^-1 can be achieved at only 30 wt% BNNS loading, a value of 137% greater than that of a worm-like ANF/BNNS counterpart. Moreover, the thermally stable nanocomposite films with light weight (28.9 W m^-1 K^-1 /10³ (kg m^-3 )) and high strength (>100 MPa, 450 °C) enable effective thermal management for microelectrodes operating at temperatures beyond 200 °C.

Epoxy Nanocomposites with Reduced Graphene Oxide-Constructed Three-Dimensional Networks of Single Wall Carbon Nanotube for Enhanced Thermal Management Capability with Low Filler Loading

Thermal management materials are solutions to heat dissipation issues in electronic devices, which are key to the device reliability and lifetime. Epoxy-based materials have been widely used but suffer from their intrinsically low thermal conductivity. In this work, we employ the combined hydrothermal reduction, ice-templated assembly, and vacuum-assisted infiltration methods to construct well-aligned rigid three-dimensional (3D) networks of reduced graphene oxide (RGO) walls bridged by (functional) single wall carbon nanotubes ((f)SWCNTs) in the epoxy resin. The 3D RGO/(f)SWCNT aerogel notably enhances thermal conductivity, reduces the coefficient of thermal expansion (CTE), and increases the glass-transition temperature (T_g) without deteriorating the electrical insulating property. Remarkably, the (RGO/fSWCNT)_1:2.5 epoxy nanocomposite reaches a thermal conductivity of 0.63 to 0.69 W m^-1 K^-1 from 300 to 390 K at a very low filler loading of 3.65 vol %, which is more than four times enhancement over the pure epoxy resin. The CTE decreases by 11.2 ppm K^-1 and T_g increases by 20 K. We also show that the functional groups associated with the 3D RGO/fSWCNT aerogel are beneficial for improvement in thermal conductivity, dimensional stability, and thermal stability. The epoxy nanocomposites reported by this work demonstrate strong potential for thermal management application in electronic packaging.

Increasing heat transfer performance of thermoplastic polyurethane by constructing thermal conduction channels of ultra-thin boron nitride nanosheets and carbon nanotubes

The TPU-based thermally conductive composite reaches a thermal conductivity of 1.35 W m⁻¹ K⁻¹ and increases the tensile strength by at least 300%.

Tree-inspired radially aligned, bimodal graphene frameworks for highly efficient and isotropic thermal transport

Highly-oriented, interconnected graphene frameworks have been considered as promising candidates to realize high-performance thermal management in microelectronics. However, the obvious thermal boundary resistance and anisotropic heat conduction still remain major bottlenecks for efficient heat dissipation. Herein, a biomimetic design enabled by radially aligned, bimodal graphene frameworks (RG-Fin) is proposed to achieve highly efficient and isotropic thermal transport. An interconnected RG skeleton is prepared via a radial ice-template method, serving as the primary expressway for isotropic heat conduction. Tree-leaf-like graphene nanofins are vertically grown on the RG surface to provide additional thermal pathways for bimodal phonon transportation, which can reduce the thermal boundary resistance without degrading the thermal properties of the skeleton. An RG-Fin composite exhibits a superior thermal conductivity of 4.01 W m^-1 K^-1 (almost 20 times that of a polymer) at an ultralow loading of 1.53 vol%, demonstrating an exceptionally large thermal conductivity enhancement efficiency of 1247%, which far exceeds those of graphene-based polymer composites. Further theoretical analysis and finite element simulations reveal the critical role of the nanofins in significantly decreasing the thermal boundary resistance (by almost 27-fold). Finally, the practical thermal management of running a CPU module is demonstrated, in which the heating-up rate of the RG-Fin composite is ∼2.0 times that of a pure polymer. This strategy provides an innovative avenue for designing radially aligned networks to realize isotropic and efficient thermoconductive composites for thermal management.

Insight into the Directional Thermal Transport of Hexagonal Boron Nitride Composites

Ideal dielectric materials for microelectronic devices should have high directionally tailored thermoconductivity with low dielectric constant and loss. Hexagonal boron nitride (hBN) with excellent thermal and dielectric properties shows a promise for the fabrication of thermoconductive dielectric polymer composites. Herein, a simple method for the fabrication of lightweight polymer/hBN composites with high directionally tailored thermoconductivity and excellent dielectric properties is presented. The solid polymer/hBN composites are manufactured by melt-compounding and injection molding. The porous composites are successfully manufactured in an injection molding process through supercritical fluid (SCF) foaming. X-ray tomography provides direct visualization of the internal microstructure and hBN orientation, leading to an in-depth understanding of the directionally dependent thermoconductivity of the polymer/hBN composite. Shear-induced orientation of hBN platelets in the solid HDPE/hBN composites leads to a significant anisotropic thermal conductivity. The solid HDPE/23.2 vol % hBN composites show an in-plane thermoconductivity as high as 10.1 W m^-1 K^-1, whereas the through-plane thermoconductivity is limited to 0.28 W m^-1 K^-1. However, the generation of a porous structure via SCF foaming imparts in situ exfoliation, random orientation, and interconnectivity of hBN platelets within the polymer matrix. This results in highly isotropic thermoconductivity with higher bulk thermal conductivity in the lightweight porous composites as compared to their solid counterparts. Furthermore, the electrically insulating composites developed in this study exhibit low dielectric constant and ultralow dielectric loss. Thus, this study presents a simple fabrication method to develop lightweight dielectric materials with tailored thermal conductivity for modern electronics.

3D Vertically Aligned BNNS Network with Long-Range Continuous Channels for Achieving a Highly Thermally Conductive Composite

Construction of a three-dimensional (3D) vertically aligned filler network in a polymer matrix has been believed to be an effective method to attain a large through-plane thermal conductivity enhancement at relatively low filler loading. However, it is still a challenge to construct a vertically aligned filler network composed of many long-range continuous pore channels in a polymer matrix for the high-flux heat-conduction. To address this problem, herein, nanofibrillated cellulose (NFCs) assisted unidirectional freeze-drying of a boron nitride nanosheets (BNNSs) slurry was used to prepare a novel epoxy composite containing a 3D vertically aligned BNNS network with long-range continuous pore channels. The vertically aligned and nacre-mimetic channels make the composite possess a high through-plane thermal conductivity of 1.56 W m^-1 K^-1 at an extremely low BNNSs loading of 4.4 vol %, and a significant thermal conductivity enhancement efficiency of 167.3 per 1 vol % filler. Therefore, we think this work is expected to give a significant insight into the preparation of polymer composite with high heat-conduction efficiency to address the heat dissipation of modern electronics.