Mechanically Assembled, Three-Dimensional Hierarchical Structures of Cellular Graphene with Programmed Geometries and Outstanding Electromechanical Properties

Reversible Solar Heating and Radiative Cooling Devices via Mechanically Guided Assembly of 3D Macro/Microstructures

Solar heating and radiative cooling are promising solutions for decreasing global energy consumption because these strategies use the Sun (≈5800 K) as a heating source and outer space (≈3 K) as a cooling source. Although high-performance thermal management can be achieved using these eco-friendly methods, they are limited by daily temperature fluctuations and seasonal changes because of single-mode actuation. Herein, reversible solar heating and radiative cooling devices formed via the mechanically guided assembly of 3D architectures are demonstrated. The fabricated devices exhibit the following properties: i) The devices reversibly change between solar heating and radiative cooling under uniaxial strain, called dual-mode actuation. ii) The 3D platforms in the devices can use rigid/soft materials for functional layers owing to the optimized designs. iii) The devices can be used for dual-mode thermal management on a macro/microscale. The devices use black paint-coated polyimide (PI) films as solar absorbers with multilayered films comprising thin layers of polydimethylsiloxane/silver/PI, achieving heating and cooling temperatures of 59.5 and -11.9 °C, respectively. Moreover, mode changes according to the angle of the 3D structures are demonstrated and the heating/cooling performance with skin, glass, steel, aluminum, copper, and PI substrates is investigated.

Flexible piezo-resistive strain sensors using all-polydimethylsiloxane based hybrid nanocomposites for wearable electronics

We report flexible piezo-resistive strain sensors composed of silver nanoparticle (Ag NP), graphene nanoplatelet (GNP), and multi walled carbon nanotube (MWCNT)-based ternary conductive hybrid nanocomposites as an active sensing layer fabricated using a simple solution processing method on flexible polydimethylsiloxane (PDMS) substrates. The electrical characteristics have been studied in PDMS-based flexible devices having three different kinds of structures, namely Ag NPs/MWCNT/PDMS, GNP/PDMS and Ag NPs/GNP/PDMS. The microscopic analysis of the hybrid nanocomposites is undertaken using field emission scanning electron microscopy. The diameter of the CNTs is found to be in the range of 20-40 nm, whereas the length is determined to be 100-800 nm. The average diameter and length of the GNPs are observed to be 30-50 nm and 100-500 nm, respectively. The crystallite size of the silver nanoparticles in the Ag NPs/MWCNT/PDMS and Ag NPs/GNP/PDMS-based nanocomposites is determined to be 22.8 nm and 29.1 nm, respectively. The prepared sample of Ag NPs shows four distinct peaks in the X-ray diffraction pattern, which correspond to the (111), (200), (220), and (311) face-centered cubic (FCC) crystalline planes. Raman spectroscopy is undertaken to study the fundamental physical properties and chemical analysis of the nanocomposites. Ag NPs/GNP/PDMS-based sensors exhibit superior performance in terms of sensitivity, response and recovery time during breathing/unbreathing analysis. The large surface area of the Ag NPs and GNPs promotes uniform distribution of Ag NPs to fill into the porous GNP surface, thereby facilitating high contact area along with better electron transport in the Ag NPs/GNP/PDMS hybrid nanocomposite-based sensors. The gauge factor (GF), response and recovery time of the Ag NPs/GNP/PDMS hybrid nanocomposite-based sensors are determined to be 221, 130 ms and 119 ms, respectively. The ternary conductive nanocomposite-based sensors are free from the drawbacks of binary nanocomposite-based sensors where the high percolation threshold and poor mechanical behaviour lead to the degradation of the device performance.

Mechanically-Guided 3D Assembly for Architected Flexible Electronics

Architected flexible electronic devices with rationally designed 3D geometries have found essential applications in biology, medicine, therapeutics, sensing/imaging, energy, robotics, and daily healthcare. Mechanically-guided 3D assembly methods, exploiting mechanics principles of materials and structures to transform planar electronic devices fabricated using mature semiconductor techniques into 3D architected ones, are promising routes to such architected flexible electronic devices. Here, we comprehensively review mechanically-guided 3D assembly methods for architected flexible electronics. Mainstream methods of mechanically-guided 3D assembly are classified and discussed on the basis of their fundamental deformation modes (i.e., rolling, folding, curving, and buckling). Diverse 3D interconnects and device forms are then summarized, which correspond to the two key components of an architected flexible electronic device. Afterward, structure-induced functionalities are highlighted to provide guidelines for function-driven structural designs of flexible electronics, followed by a collective summary of their resulting applications. Finally, conclusions and outlooks are given, covering routes to achieve extreme deformations and dimensions, inverse design methods, and encapsulation strategies of architected 3D flexible electronics, as well as perspectives on future applications.

Conformational deformation of a multi-jointed elastic loop

A new class of deformation is presented for a planar loop structure made up of slender elastic bodies and joints. In demonstrating the circumferential shortening of the multi-jointed elastic loop, diverse three-dimensional (3D) deformations emerge through piecewise deflections and discrete rotations. These 3D morphologies correspond to conformations of molecular ring systems. Through image processing, the 3D reconstructions of the deformed structures are characterized by number, geometry, and initial imperfections of the body segments. We elucidate from measurements that the conformational deformation without self-stress results from a cyclical assembly of compressive bending of elastic bodies with high shear rigidity. The mechanical insights gained may apply in controlling the polymorphism exhibited by the cyclical structures across scales.

Recent Advances in Flexible RF MEMS

Microelectromechanical systems (MEMS) that are based on flexible substrates are widely used in flexible, reconfigurable radio frequency (RF) systems, such as RF MEMS switches, phase shifters, reconfigurable antennas, phased array antennas and resonators, etc. When attempting to accommodate flexible deformation with the movable structures of MEMS, flexible RF MEMS are far more difficult to structurally design and fabricate than rigid MEMS devices or other types of flexible electronics. In this review, we survey flexible RF MEMS with different functions, their flexible film materials and their fabrication process technologies. In addition, a fabrication process for reconfigurable three-dimensional (3D) RF devices based on mechanically guided assembly is introduced. The review is very helpful to understand the overall advances in flexible RF MEMS, and serves the purpose of providing a reference source for innovative researchers working in this field.

Mechanically Guided Hierarchical Assembly of 3D Mesostructures

3D, hierarchical micro/nanostructures formed with advanced functional materials are of growing interest due to their broad potential utility in electronics, robotics, battery technology, and biomedical engineering. Among various strategies in 3D micro/nanofabrication, a set of methods based on compressive buckling offers wide-ranging material compatibility, fabrication scalability, and precise process control. Previously reports on this type of approach rely on a single, planar prestretched elastomeric platform to transform thin-film precursors with 2D layouts into 3D architectures. The simple planar configuration of bonding sites between these precursors and their assembly substrates prevents the realization of certain types of complex 3D geometries. In this paper, a set of hierarchical assembly concepts is reported that leverage multiple layers of prestretched elastomeric substrates to induce not only compressive buckling of 2D precursors bonded to them but also of themselves, thereby creating 3D mesostructures mounted at multiple levels of 3D frameworks with complex, elaborate configurations. Control over strains used in these processes provides reversible access to multiple different 3D layouts in a given structure. Examples to demonstrate these ideas through both experimental and computational results span vertically aligned helices to closed 3D cages, selected for their relevance to 3D conformal bio-interfaces and multifunctional microsystems.

A Phase Inversion-Based Microfluidic Fabrication of Helical Microfibers towards Versatile Artificial Abdominal Skin

Microfluidic spinning technology (MST), incorporating microfluidics with chemical reactions, has gained considerable interest for constructing anisotropic advanced microfibers, especially helical microfibers. However, these efforts suffer from the limited material choices, restricting their applications. Here, a new phase inversion-based microfluidic spinning (PIMS) method is proposed for producing helical microfibers. This method undergoes a physicochemical phase inversion process, which is capable of efficiently manufacturing strong (tensile stress of more than 25 MPa), stretchable, flexible and biocompatible helical microfibers. The helical microfibers can be used to fabricate bi-oriented stretchable artificial abdominal skin, preventing incisional hernia formation and promoting the wound healing without conglutination. This research not only offers a universal approach to design helical microfibers but also provides a new insight into artificial skin.

Nanocellulose-Graphene Derivative Hybrids: Advanced Structure-Based Functionality from Top-down Synthesis to Bottom-up Assembly

There is an emerging endeavor of advanced structure-based functionality in the next-generation advanced functional materials inspired by hierarchical architecture for future technical applications. This review provides an impressive range roadmap for constructing advanced functional materials based on the nanocellulose-graphene derivative hybrids, from the top-down synthesis of their hierarchical materials to the bottom-up assembly of their nanoscale building blocks. First, the roadmap started from the top-down synthesis routes of nanocellulose-graphene hierarchical materials into their derivatives, where the pristine properties of nanoscale building blocks are still accessible and processable. Then, the stable-strong synergistic interfacial interactions between nanocellulose chains and graphene derivative nanosheets are uniquely well-suited in this roadmap for constructing scalable hybrid materials with interesting emergent properties. After that, the roadmap presented the bottom-up assembly approaches of these versatile nanoscale building blocks through self-assembly, templating, and mimicking of the bioinspired hierarchical structures toward advanced functional materials. Thereafter, toward understanding the specificity, superiority, and functionality of such hybrid materials, the roadmap discussed the properties and potential applications so far. Finally, the roadmap pointed out the key challenges and future outlooks, paving the way for comprehensive understanding and ideal designing of hybrid structures from nanocellulose and graphene derivatives.

Material innovation and mechanics design for substrates and encapsulation of flexible electronics: a review

Advances in materials and mechanics designs have led to the development of flexible electronics, which have important applications to human healthcare due to their good biocompatibility and conformal integration with biological tissue. Material innovation and mechanics design have played a key role in designing the substrates and encapsulations of flexible electronics for various bio-integrated systems. This review first introduces the inorganic materials and novel organic materials used for the substrates and encapsulation of flexible electronics, and summarizes their mechanics properties, permeability and optical transmission properties. The structural designs of the substrates are then introduced to ensure the reliability of flexible electronics, including the patterned and pre-strained designs to improve the stretchability, and the strain-isolation and -limiting substrates to reduce the deformation. Some emerging encapsulations are presented to protect the flexible electronics from degradation, environmental erosion or contamination, though they may slightly reduce the stretchability of flexible electronics.

Laser-induced graphene for bioelectronics and soft actuators

Laser-assisted process can enable facile, mask-free, large-area, inexpensive, customizable, and miniaturized patterning of laser-induced porous graphene (LIG) on versatile carbonaceous substrates (e.g., polymers, wood, food, textiles) in a programmed manner at ambient conditions. Together with high tailorability of its porosity, morphology, composition, and electrical conductivity, LIG can find wide applications in emerging bioelectronics (e.g., biophysical and biochemical sensing) and soft robots (e.g., soft actuators). In this review paper, we first introduce the methods to make LIG on various carbonaceous substrates and then discuss its electrical, mechanical, and antibacterial properties and biocompatibility that are critical for applications in bioelectronics and soft robots. Next, we overview the recent studies of LIG-based biophysical (e.g., strain, pressure, temperature, hydration, humidity, electrophysiological) sensors and biochemical (e.g., gases, electrolytes, metabolites, pathogens, nucleic acids, immunology) sensors. The applications of LIG in flexible energy generators and photodetectors are also introduced. In addition, LIG-enabled soft actuators that can respond to chemicals, electricity, and light stimulus are overviewed. Finally, we briefly discuss the future challenges and opportunities of LIG fabrications and applications.

Laser reprogramming magnetic anisotropy in soft composites for reconfigurable 3D shaping

Responsive soft materials capable of exhibiting various three-dimensional (3D) shapes under the same stimulus are desirable for promising applications including adaptive and reconfigurable soft robots. Here, we report a laser rewritable magnetic composite film, whose responsive shape-morphing behaviors induced by a magnetic field can be digitally and repeatedly reprogrammed by a facile method of direct laser writing. The composite film is made from an elastomer and magnetic particles encapsulated by a phase change polymer. Once the phase change polymer is temporarily melted by transient laser heating, the orientation of the magnetic particles can be re-aligned upon change of a programming magnetic field. By the digital laser writing on selective areas, magnetic anisotropies can be encoded in the composite film and then reprogrammed by repeating the same procedure, thus leading to multimodal 3D shaping under the same actuation magnetic field. Furthermore, we demonstrated their functional applications in assembling multistate 3D structures driven by the magnetic force-induced buckling, fabricating multistate electrical switches for electronics, and constructing reconfigurable magnetic soft robots with locomotion modes of peristalsis, crawling, and rolling.

Responsive soft materials which can exhibit various three-dimensional (3D) shapes under the same stimulus are desirable for applications in adaptive and reconfigurable soft robots. Here, the authors report a laser rewritable magnetic composite film, whose responsive shape-morphing behaviors induced by a magnetic field can be digitally and repeatedly reprogrammed by a facile method of direct laser writing.

Stretchable and Skin-Conformable Conductors Based on Polyurethane/Laser-Induced Graphene

The conversion of various polymer substrates into laser-induced graphene (LIG) with a CO₂ laser in ambient condition is recently emerging as a simple method for obtaining patterned porous graphene conductors, with a myriad of applications in sensing, actuation, and energy. In this paper, a method is presented for embedding porous LIG (LIG-P) or LIG fibers (LIG-F) into a thin (about 50 μm) and soft medical grade polyurethane (MPU) providing excellent conformal adhesion on skin, stretchability, and maximum breathability to boost the development of various unperceivable monitoring systems on skin. The effect of varying laser fluence and geometry of the laser scribing on the LIG micro-nanostructure morphology and on the electrical and electromechanical properties of LIG/MPU composites is investigated. A peculiar and distinct behavior is observed for either LIG-P or LIG-F. Excellent stretchability without permanent impairment of conductive properties is revealed up to 100% strain and retained after hundreds of cycles of stretching tests. A distinct piezoresistive behavior, with an average gauge factor of 40, opens the way to various potential strain/pressure sensing applications. A novel method based on laser scribing is then introduced for providing vertical interconnect access (VIA) into LIG/MPU conformable epidermal sensors. Such VIA enables stable connections to an external measurement device, as this represents a typical weakness of many epidermal devices so far. Three examples of minimally invasive LIG/MPU epidermal sensing proof of concepts are presented: as electrodes for electromyographic recording on limb and as piezoresistive sensors for touch and respiration detection on skin. Long-term wearability and functioning up to several days and under repeated stretching tests is demonstrated.

Mechanically-Guided Structural Designs in Stretchable Inorganic Electronics

Over the past decade, the area of stretchable inorganic electronics has evolved very rapidly, in part because the results have opened up a series of unprecedented applications with broad interest and potential for impact, especially in bio-integrated systems. Low modulus mechanics and the ability to accommodate extreme mechanical deformations, especially high levels of stretching, represent key defining characteristics. Most existing studies exploit structural material designs to achieve these properties, through the integration of hard inorganic electronic components configured into strategic 2D/3D geometries onto patterned soft substrates. The diverse structural geometries developed for stretchable inorganic electronics are summarized, covering the designs of functional devices and soft substrates, with a focus on fundamental principles, design approaches, and system demonstrations. Strategies that allow spatial integration of 3D stretchable device layouts are also highlighted. Finally, perspectives on the remaining challenges and open opportunities are provided.

Reprogrammable 3D Shaping from Phase Change Microstructures in Elastic Composites

Herein, we demonstrate reprogrammable 3D structures that are assembled from elastic composite sheets made from elastic materials and phase change microparticles. By controlling the phase change of the microparticles by localized thermal patterning, anisotropic residual strain is generated in the pre-stretched composite sheets and then triggers 3D structure assembly when the composite sheets are released from the external stress. Modulation of the geometries and location of the thermal patterns leads to complex 2D-3D shaping behaviors such as bending, folding, buckling, and wrinkling. Because of the reversible phase change of the microparticles, these programmed 3D structures can later be recovered to 2D sheets once they are heated for reprogramming different 3D structures. To predict the 3D structures assembled from the 2D composite sheets, finite element modeling was employed, which showed reasonable agreement with the experiments. The demonstrated strategy of reversibly programming 3D shapes by controlling the phase change microstructures in the elastic composites offers unique capabilities in fabricating functional devices such as a rewritable "paper" and a shape reconfigurable pneumatic actuator.

Stimulus Responsive 3D Assembly for Spatially Resolved Bifunctional Sensors

3D electronic/optoelectronic devices have shown great potentials for various applications due to their unique properties inherited not only from functional materials, but also from 3D architectures. Although a variety of fabrication methods including mechanically guided assembly have been reported, the resulting 3D devices show no stimuli-responsive functions or are not free standing, thereby limiting their applications. Herein, the stimulus responsive assembly of complex 3D structures driven by temperature-responsive hydrogels is demonstrated for applications in 3D multifunctional sensors. The assembly driving force, compressive buckling, arises from the volume shrinkage of the responsive hydrogel substrates when they are heated above the lower critical solution temperature. Driven by the compressive buckling force, the 2D-formed membrane materials, which are pre-defined and selectively bonded to the substrates, are then assembled to 3D structures. They include "tent," "tower," "two-floor pavilion," "dome," "basket," and "nested-cages" with delicate geometries. Moreover, the demonstrated 3D bifunctional sensors based on laser induced graphene show capability of spatially resolved tactile sensing and temperature sensing. These multifunctional 3D sensors would open new applications in soft robotics, bioelectronics, micro-electromechanical systems, and others.

Electro-mechanically controlled assembly of reconfigurable 3D mesostructures and electronic devices based on dielectric elastomer platforms

The manufacture of 3D mesostructures is receiving rapidly increasing attention, because of the fundamental significance and practical applications across wide-ranging areas. The recently developed approach of buckling-guided assembly allows deterministic formation of complex 3D mesostructures in a broad set of functional materials, with feature sizes spanning nanoscale to centimeter-scale. Previous studies mostly exploited mechanically controlled assembly platforms using elastomer substrates, which limits the capabilities to achieve on-demand local assembly, and to reshape assembled mesostructures into distinct 3D configurations. This work introduces a set of design concepts and assembly strategies to utilize dielectric elastomer actuators as powerful platforms for the electro-mechanically controlled 3D assembly. Capabilities of sequential, local loading with desired strain distributions allow access to precisely tailored 3D mesostructures that can be reshaped into distinct geometries, as demonstrated by experimental and theoretical studies of ∼30 examples. A reconfigurable inductive–capacitive radio-frequency circuit consisting of morphable 3D capacitors serves as an application example.

Challenges and Opportunities of Carbon Nanomaterials for Biofuel Cells and Supercapacitors: Personalized Energy for Futuristic Self-Sustainable Devices

Various carbon allotropes are fundamental components in electrochemical energy-conversion and energy-storage devices, e.g., biofuel cells (BFCs) and supercapacitors. Recently, biodevices, particularly wearable and implantable devices, are of distinct interest in biomedical, fitness, academic, and industrial fields due to their new fascinating capabilities for personalized applications. However, all biodevices require a sustainable source of energy, bringing widespread attention to energy research. In this review, we detail the progress in BFCs and supercapacitors attributed to carbon materials. Self-powered biosensors for futuristic biomedical applications are also featured. To develop these energy devices, many challenges needed to be addressed. For this reason, there is a need to: optimize the electron transfer between the enzymatic site and electrode; enhance the power efficiency of the device in fluctuating oxygen conditions; strengthen the efficacy of enzymatic reactions at the carbon-based electrodes; increase the electrochemically accessible surface area of the porous electrode materials; and refine the flexibility of traditional devices by introducing a mechanical resiliency of electrochemical devices to withstand daily multiplexed movements. This article will also feature carbon nanomaterial research alongside opportunities to enhance energy technology and address the challenges facing the field of personalized applications. Carbon-based energy devices have proved to be sustainable and compatible energy alternatives for biodevices within the human body, serving as attractive options for further developing diverse domains, including individual biomedical applications.

Suspended-Template Electric-Assisted Nanoimprinting for Hierarchical Micro-Nanostructures on a Fragile Substrate

Coating hierarchical micro-nanostructures on the surface of optoelectronic devices has been demonstrated to improve the overall performance. However, fabricating desired structures on a fragile optoelectronic device substrate is still challenging. A suspended-template electric-assisted nanoimprinting technique is proposed herein to controllably fabricate hierarchical micro-nanostructures on a fragile substrate. The suspension design of the template ensures that it conveniently deforms to fully fit the surface fluctuation of the substrate. The deformation of template and the filling of liquid polymer in the micro/nanocavities of the template are both driven by the powerful surface/interface force generated by an electric field applied between the template and substrate surface, thus protecting the fragile substrate from squeezing damage. Different morphologies of hierarchical micro-nanostructures are fabricated by changing the electric field. Based on suspended-template electric-assisted nanoimprinting, the environmentally adaptable fully covering hierarchical micro-nanostructures are encapsulated on the surface of flip-film light-emitting diode chips, thus significantly enhancing their light management in complex environments.

Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches

The miniaturization of electronics has been an important topic of study for several decades. The established roadmaps following Moore's Law have encountered bottlenecks in recent years, as planar processing techniques are already close to their physical limits. To bypass some of the intrinsic challenges of planar technologies, more and more efforts have been devoted to the development of 3D electronics, through either direct 3D fabrication or indirect 3D assembly. Recent research efforts into direct 3D fabrication have focused on the development of 3D transistor technologies and 3D heterogeneous integration schemes, but these technologies are typically constrained by the accessible range of sophisticated 3D geometries and the complexity of the fabrication processes. As an alternative route, 3D assembly methods make full use of mature planar technologies to form predefined 2D precursor structures in the desired materials and sizes, which are then transformed into targeted 3D mesostructures by mechanical deformation. The latest progress in the area of micro/nanoscale 3D assembly, covering the various classes of methods through rolling, folding, curving, and buckling assembly, is discussed, focusing on the design concepts, principles, and applications of different methods, followed by an outlook on the remaining challenges and open opportunities.

Deterministic Assembly of Three-Dimensional Suspended Nanowire Structures

Controlled assembly of nanowire three-dimensional (3D) geometry in an addressable way can lead to advanced 3D device integration and application. By combining a deterministic planar nanowire assembly and a transfer process, we show here a versatile method to construct vertically protruding and suspending nanowire structures. The method harnesses the merits from both processes to yield positional and geometric control in individual nanowires. Multiple transfers can further lead to hierarchical multiwire 3D structures. Assembled 3D nanowire structures have well-defined on-substrate terminals that allow scalable addressing and integration. Proof-of-concept nanosenors based on assembled 3D nanowire structures can achieve high sensitivity in force detection.

Cellular Carbon-Film-Based Flexible Sensor and Waterproof Supercapacitors

A highly sensitive portable piezoresistive sensor with a fast response time in an extended linear working range is urgently needed to meet the rapid development of artificial intelligence, interactive human-machine interfaces, and ubiquitous flexible electronics. However, it is a challenge to rationally couple these figures of merit (sensitivity, response time, and working range) together as they typically show functionally correlative behavior in the sensor. Here, we aim at introducing the hierarchical pores across several size orders from micro- to larger scale into the intrinsically flexible graphene-based electrode materials that overcome this limitation of the sensor. We achieved a flexible sensor with a prominent sensitivity of 11.9 kPa^-1 in the linear range of 3 Pa to ∼21 kPa and a rapid response time of 20 ms to positively monitor the pulse rate, voice recognition, and true force value for biomedical and interactive human-machine interface application assisted by an analog-digital converter. More interesting is the carbon-nanotube-doped graphene that also served as the electrode in the waterproof supercapacitor to actively drive the sensor as a whole flexible system. We believe our findings not only offer a general strategy for the graphene-based platform in flexible electronics but also possess other intriguing potential in functional application such as the heat dissipation component in electron devices or seawater filtration in environment application.

Harnessing the interface mechanics of hard films and soft substrates for 3D assembly by controlled buckling

Techniques for forming sophisticated, 3D mesostructures in advanced, functional materials are of rapidly growing interest, owing to their potential uses across a broad range of fundamental and applied areas of application. Recently developed approaches to 3D assembly that rely on controlled buckling mechanics serve as versatile routes to 3D mesostructures in a diverse range of high-quality materials and length scales of relevance for 3D microsystems with unusual function and/or enhanced performance. Nonlinear buckling and delamination behaviors in materials that combine both weak and strong interfaces are foundational to the assembly process, but they can be difficult to control, especially for complex geometries. This paper presents theoretical and experimental studies of the fundamental aspects of adhesion and delamination in this context. By quantifying the effects of various essential parameters on these processes, we establish general design diagrams for different material systems, taking into account 4 dominant delamination states (wrinkling, partial delamination of the weak interface, full delamination of the weak interface, and partial delamination of the strong interface). These diagrams provide guidelines for the selection of engineering parameters that avoid interface-related failure, as demonstrated by a series of examples in 3D helical mesostructures and mesostructures that are reconfigurable based on the control of loading-path trajectories. Three-dimensional micromechanical resonators with frequencies that can be selected between 2 distinct values serve as demonstrative examples.

Kirigami-inspired multiscale patterning of metallic structures via predefined nanotrench templates

Reliable fabrication of multiscale metallic patterns with precise geometry and size at both the nanoscale and macroscale is of importance for various applications in electronic and optical devices. The existing fabrication processes, which usually involve film deposition in combination with electron-beam patterning, are either time-consuming or offer limited precision. Inspired by the kirigami, an ancient handicraft art of paper cutting, this work demonstrates an electron-beam patterning process for multiscale metallic structures with significantly enhanced efficiency and precision. Similar to the kirigami, in which the final pattern is defined by cutting its contour in a paper and then removing the unwanted parts, we define the target multiscale structures by first creating nanotrench contours in a metallic film via an electron-beam-based process and then selectively peeling the separated film outside the contours. Compared with the conventional approach, which requires the exposure of the whole pattern, much less exposure area is needed for nanotrench contours, thus enabling reduced exposure time and enhanced geometric precision due to the mitigated proximity effect. A theoretical model based on interface mechanics allows a clear understanding of the nanotrench-assisted selective debonding behaviour in the peeling process. By using this fabrication process, multiscale metallic structures with sub-10-nm up to submillimetre features can be reliably achieved, having potential applications for anti-counterfeiting and gap-plasmon-enhanced spectroscopy.