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Li H, Li Q, Sun T, Zhou Y, Han ST. Recent advances in artificial neuromorphic applications based on perovskite composites. MATERIALS HORIZONS 2024. [PMID: 39140168 DOI: 10.1039/d4mh00574k] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 08/15/2024]
Abstract
High-performance perovskite materials with excellent physical, electronic, and optical properties play a significant role in artificial neuromorphic devices. However, the development of perovskites in microelectronics is inevitably hindered by their intrinsic non-ideal properties, such as high defect density, environmental sensitivity, and toxicity. By leveraging materials engineering, integrating various materials with perovskites to leverage their mutual strengths presents great potential to enhance ion migration, energy level alignment, photoresponsivity, and surface passivation, thereby advancing optoelectronic and neuromorphic device development. This review initially provides an overview of perovskite materials across different dimensions, highlighting their physical properties and detailing their applications and metrics in two- and three-terminal devices. Subsequently, we comprehensively summarize the application of perovskites in combination with other materials, including organics, nanomaterials, oxides, ferroelectrics, and crystalline porous materials (CPMs), to develop advanced devices such as memristors, transistors, photodetectors, sensors, light-emitting diodes (LEDs), and artificial neuromorphic systems. Lastly, we outline the challenges and future research directions in synthesizing perovskite composites for neuromorphic devices. Through the review and analysis, we aim to broaden the utilization of perovskites and their composites in neuromorphic research, offering new insights and approaches for grasping the intricate physical working mechanisms and functionalities of perovskites.
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Affiliation(s)
- Huaxin Li
- Institute of Microscale Optoelectronics, Shenzhen University, Shenzhen 518060, P. R. China
| | - Qingxiu Li
- Institute of Microscale Optoelectronics, Shenzhen University, Shenzhen 518060, P. R. China
| | - Tao Sun
- Institute of Microscale Optoelectronics, Shenzhen University, Shenzhen 518060, P. R. China
| | - Ye Zhou
- Institute for Advanced Study, Shenzhen University, Shenzhen 518060, P. R. China
| | - Su-Ting Han
- Department of Applied Biology and Chemical Technology, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong 999077, P. R. China.
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Kang S, Hong D, Das B, Lee SM, Park JS, Lee Y, Lee S. Ferroelectric Stochasticity in 2D CuInP 2S 6 and Its Application for True Random Number Generator. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024:e2406850. [PMID: 39011946 DOI: 10.1002/adma.202406850] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/14/2024] [Revised: 06/17/2024] [Indexed: 07/17/2024]
Abstract
True random number generators (TRNGs), which create cryptographically secure random bitstreams, hold great promise in addressing security concerns regarding hardware, communication, and authentication in the Internet of Things (IoT) realm. Recently, TRNGs based on nanoscale materials have gained considerable attention for avoiding conventional and predictable hardware circuitry designs that can be vulnerable to machine learning (ML) attacks. In this article, a low-power and low-cost TRNG developed by exploiting stochastic ferroelectric polarization switching in 2D ferroelectric CuInP2S6 (CIPS)-based capacitive structures, is reported. The stochasticity arises from the probabilistic switching of independent electrical dipoles. The TRNG exhibits enhanced stochastic variability with near-ideal entropy, uniformity, uniqueness, Hamming distance, and independence from autocorrelation variations. Its unclonability is systematically examined using device-to-device variations. The generated cryptographic bitstreams pass the National Institute of Standards and Technology (NIST) randomness tests. This nanoscale CIPS-based TRNG is circuit-integrable and exhibits potential for hardware security in edge devices with advanced data encryption.
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Affiliation(s)
- Seongkweon Kang
- Department of Semiconductor Convergence Engineering, Sungkyunkwan University, Suwon, 16419, South Korea
| | - Doojin Hong
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, 16419, South Korea
| | - Biswajit Das
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon, 16419, South Korea
- Department of Nano Science and Technology, Sungkyunkwan University, Suwon, 16419, South Korea
| | - Sang-Min Lee
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon, 16419, South Korea
- Department of Nano Science and Technology, Sungkyunkwan University, Suwon, 16419, South Korea
| | - Ji-Sang Park
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon, 16419, South Korea
- Department of Nano Science and Technology, Sungkyunkwan University, Suwon, 16419, South Korea
- Department of Nano Engineering, Sungkyunkwan University, Suwon, 16419, South Korea
| | - Yoonmyung Lee
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, 16419, South Korea
| | - Sungjoo Lee
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon, 16419, South Korea
- Department of Nano Science and Technology, Sungkyunkwan University, Suwon, 16419, South Korea
- Department of Nano Engineering, Sungkyunkwan University, Suwon, 16419, South Korea
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Zhang T, Fan C, Hu L, Zhuge F, Pan X, Ye Z. A Reconfigurable All-Optical-Controlled Synaptic Device for Neuromorphic Computing Applications. ACS NANO 2024; 18:16236-16247. [PMID: 38868857 DOI: 10.1021/acsnano.4c02278] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/14/2024]
Abstract
Retina-inspired visual sensors play a crucial role in the realization of neuromorphic visual systems. Nevertheless, significant obstacles persist in the pursuit of achieving bidirectional synaptic behavior and attaining high performance in the context of photostimulation. In this study, we propose a reconfigurable all-optical controlled synaptic device based on the IGZO/SnO/SnS heterostructure, which integrates sensing, storage and processing functions. Relying on the simple heterojunction stack structure and the role of energy band engineering, synaptic excitatory and inhibitory behaviors can be observed under the light stimulation of ultraviolet (266 nm) and visible light (405, 520 and 658 nm) without additional voltage modulation. In particular, junction field-effect transistors based on the IGZO/SnO/SnS heterostructure were fabricated to elucidate the underlying bidirectional photoresponse mechanism. In addition to optical signal processing, an artificial neural network simulator based on the optoelectrical synapse was trained and recognized handwritten numerals with a recognition rate of 91%. Furthermore, we prepared an 8 × 8 optoelectrical synaptic array and successfully demonstrated the process of perception and memory for image recognition in the human brain, as well as simulated the situation of damage to the retina by ultraviolet light. This work provides an effective strategy for the development of high-performance all-optical controlled optoelectronic synapses and a practical approach to the design of multifunctional artificial neural vision systems.
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Affiliation(s)
- Tao Zhang
- State Key Laboratory of Silicon and Advanced Semiconductor Materials, Cyrus Tang Center for Sensor Materials and Applications, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China
| | - Chao Fan
- Wenzhou Key Laboratory of Novel Optoelectronic and Nano Materials, Institute of Wenzhou, Zhejiang University, Wenzhou 325006, China
| | - Lingxiang Hu
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
| | - Fei Zhuge
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
| | - Xinhua Pan
- State Key Laboratory of Silicon and Advanced Semiconductor Materials, Cyrus Tang Center for Sensor Materials and Applications, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China
- Wenzhou Key Laboratory of Novel Optoelectronic and Nano Materials, Institute of Wenzhou, Zhejiang University, Wenzhou 325006, China
| | - Zhizhen Ye
- State Key Laboratory of Silicon and Advanced Semiconductor Materials, Cyrus Tang Center for Sensor Materials and Applications, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China
- Wenzhou Key Laboratory of Novel Optoelectronic and Nano Materials, Institute of Wenzhou, Zhejiang University, Wenzhou 325006, China
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Sakib NU, Karim Sadaf MU, Pannone A, Ghosh S, Zheng Y, Ravichandran H, Das S. A Crayfish-Inspired Sensor Fusion Platform for Super Additive Integration of Visual, Chemical, and Tactile Information. NANO LETTERS 2024; 24:6948-6956. [PMID: 38810209 DOI: 10.1021/acs.nanolett.4c01187] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/31/2024]
Abstract
The concept of cross-sensor modulation, wherein one sensor modality can influence another's response, is often overlooked in traditional sensor fusion architectures, leading to missed opportunities for enhancing data accuracy and robustness. In contrast, biological systems, such as aquatic animals like crayfish, demonstrate superior sensor fusion through multisensory integration. These organisms adeptly integrate visual, tactile, and chemical cues to perform tasks such as evading predators and locating prey. Drawing inspiration from this, we propose a neuromorphic platform that integrates graphene-based chemitransistors, monolayer molybdenum disulfide (MoS2) based photosensitive memtransistors, and triboelectric tactile sensors to achieve "Super-Additive" responses to weak chemical, visual, and tactile cues and demonstrate contextual response modulation, also referred to as the "Inverse Effectiveness Effect." We hold the view that integrating bio-inspired sensor fusion principles across various modalities holds promise for a wide range of applications.
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Affiliation(s)
- Najam U Sakib
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
| | - Muhtasim Ul Karim Sadaf
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
| | - Andrew Pannone
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
| | - Subir Ghosh
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
| | - Yikai Zheng
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
| | - Harikrishnan Ravichandran
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
| | - Saptarshi Das
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
- Electrical Engineering, Penn State University, University Park, Pennsylvania 16802, United States
- Materials Science and Engineering, Penn State University, University Park, Pennsylvania 16802, United States
- Materials Research Institute, Penn State University, University Park, Pennsylvania 16802, United States
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Chen C, Zhou Y, Tong L, Pang Y, Xu J. Emerging 2D Ferroelectric Devices for In-Sensor and In-Memory Computing. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024:e2400332. [PMID: 38739927 DOI: 10.1002/adma.202400332] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/08/2024] [Revised: 04/19/2024] [Indexed: 05/16/2024]
Abstract
The quantity of sensor nodes within current computing systems is rapidly increasing in tandem with the sensing data. The presence of a bottleneck in data transmission between the sensors, computing, and memory units obstructs the system's efficiency and speed. To minimize the latency of data transmission between units, novel in-memory and in-sensor computing architectures are proposed as alternatives to the conventional von Neumann architecture, aiming for data-intensive sensing and computing applications. The integration of 2D materials and 2D ferroelectric materials has been expected to build these novel sensing and computing architectures due to the dangling-bond-free surface, ultra-fast polarization flipping, and ultra-low power consumption of the 2D ferroelectrics. Here, the recent progress of 2D ferroelectric devices for in-sensing and in-memory neuromorphic computing is reviewed. Experimental and theoretical progresses on 2D ferroelectric devices, including passive ferroelectrics-integrated 2D devices and active ferroelectrics-integrated 2D devices, are reviewed followed by the integration of perception, memory, and computing application. Notably, 2D ferroelectric devices have been used to simulate synaptic weights, neuronal model functions, and neural networks for image processing. As an emerging device configuration, 2D ferroelectric devices have the potential to expand into the sensor-memory and computing integration application field, leading to new possibilities for modern electronics.
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Affiliation(s)
- Chunsheng Chen
- Department of Electronic Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Hong Kong SAR, China
| | - Yaoqiang Zhou
- Department of Electronic Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Hong Kong SAR, China
| | - Lei Tong
- Department of Electronic Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Hong Kong SAR, China
| | - Yue Pang
- Department of Electronic Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Hong Kong SAR, China
| | - Jianbin Xu
- Department of Electronic Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Hong Kong SAR, China
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Liu J, Wang Y, Liu Y, Wu Y, Bian B, Shang J, Li R. Recent Progress in Wearable Near-Sensor and In-Sensor Intelligent Perception Systems. SENSORS (BASEL, SWITZERLAND) 2024; 24:2180. [PMID: 38610389 PMCID: PMC11014300 DOI: 10.3390/s24072180] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/02/2024] [Revised: 03/25/2024] [Accepted: 03/27/2024] [Indexed: 04/14/2024]
Abstract
As the Internet of Things (IoT) becomes more widespread, wearable smart systems will begin to be used in a variety of applications in people's daily lives, not only requiring the devices to have excellent flexibility and biocompatibility, but also taking into account redundant data and communication delays due to the use of a large number of sensors. Fortunately, the emerging paradigms of near-sensor and in-sensor computing, together with the proposal of flexible neuromorphic devices, provides a viable solution for the application of intelligent low-power wearable devices. Therefore, wearable smart systems based on new computing paradigms are of great research value. This review discusses the research status of a flexible five-sense sensing system based on near-sensor and in-sensor architectures, considering material design, structural design and circuit design. Furthermore, we summarize challenging problems that need to be solved and provide an outlook on the potential applications of intelligent wearable devices.
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Affiliation(s)
- Jialin Liu
- CAS Key Laboratory of Magnetic Materials and Devices, Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, China Academy of Sciences, Ningbo 315201, China; (J.L.); (Y.W.); (Y.L.); (Y.W.); (B.B.)
- College of Materials Science and Opto-Electronic Technology, University of China Academy of Sciences, Beijing 100049, China
| | - Yitao Wang
- CAS Key Laboratory of Magnetic Materials and Devices, Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, China Academy of Sciences, Ningbo 315201, China; (J.L.); (Y.W.); (Y.L.); (Y.W.); (B.B.)
| | - Yiwei Liu
- CAS Key Laboratory of Magnetic Materials and Devices, Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, China Academy of Sciences, Ningbo 315201, China; (J.L.); (Y.W.); (Y.L.); (Y.W.); (B.B.)
- College of Materials Science and Opto-Electronic Technology, University of China Academy of Sciences, Beijing 100049, China
| | - Yuanzhao Wu
- CAS Key Laboratory of Magnetic Materials and Devices, Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, China Academy of Sciences, Ningbo 315201, China; (J.L.); (Y.W.); (Y.L.); (Y.W.); (B.B.)
- College of Materials Science and Opto-Electronic Technology, University of China Academy of Sciences, Beijing 100049, China
| | - Baoru Bian
- CAS Key Laboratory of Magnetic Materials and Devices, Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, China Academy of Sciences, Ningbo 315201, China; (J.L.); (Y.W.); (Y.L.); (Y.W.); (B.B.)
- College of Materials Science and Opto-Electronic Technology, University of China Academy of Sciences, Beijing 100049, China
| | - Jie Shang
- CAS Key Laboratory of Magnetic Materials and Devices, Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, China Academy of Sciences, Ningbo 315201, China; (J.L.); (Y.W.); (Y.L.); (Y.W.); (B.B.)
- College of Materials Science and Opto-Electronic Technology, University of China Academy of Sciences, Beijing 100049, China
- Materials and Optoelectronics Research Center, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Runwei Li
- CAS Key Laboratory of Magnetic Materials and Devices, Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, China Academy of Sciences, Ningbo 315201, China; (J.L.); (Y.W.); (Y.L.); (Y.W.); (B.B.)
- College of Materials Science and Opto-Electronic Technology, University of China Academy of Sciences, Beijing 100049, China
- Materials and Optoelectronics Research Center, University of Chinese Academy of Sciences, Beijing 100049, China
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Zhou H, Li S, Ang KW, Zhang YW. Recent Advances in In-Memory Computing: Exploring Memristor and Memtransistor Arrays with 2D Materials. NANO-MICRO LETTERS 2024; 16:121. [PMID: 38372805 PMCID: PMC10876512 DOI: 10.1007/s40820-024-01335-2] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/17/2023] [Accepted: 12/25/2023] [Indexed: 02/20/2024]
Abstract
The conventional computing architecture faces substantial challenges, including high latency and energy consumption between memory and processing units. In response, in-memory computing has emerged as a promising alternative architecture, enabling computing operations within memory arrays to overcome these limitations. Memristive devices have gained significant attention as key components for in-memory computing due to their high-density arrays, rapid response times, and ability to emulate biological synapses. Among these devices, two-dimensional (2D) material-based memristor and memtransistor arrays have emerged as particularly promising candidates for next-generation in-memory computing, thanks to their exceptional performance driven by the unique properties of 2D materials, such as layered structures, mechanical flexibility, and the capability to form heterojunctions. This review delves into the state-of-the-art research on 2D material-based memristive arrays, encompassing critical aspects such as material selection, device performance metrics, array structures, and potential applications. Furthermore, it provides a comprehensive overview of the current challenges and limitations associated with these arrays, along with potential solutions. The primary objective of this review is to serve as a significant milestone in realizing next-generation in-memory computing utilizing 2D materials and bridge the gap from single-device characterization to array-level and system-level implementations of neuromorphic computing, leveraging the potential of 2D material-based memristive devices.
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Affiliation(s)
- Hangbo Zhou
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore, 138632, Republic of Singapore
| | - Sifan Li
- Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore, 117583, Republic of Singapore
| | - Kah-Wee Ang
- Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore, 117583, Republic of Singapore.
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Singapore, 138634, Republic of Singapore.
| | - Yong-Wei Zhang
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore, 138632, Republic of Singapore.
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Liu A, Zhang X, Liu Z, Li Y, Peng X, Li X, Qin Y, Hu C, Qiu Y, Jiang H, Wang Y, Li Y, Tang J, Liu J, Guo H, Deng T, Peng S, Tian H, Ren TL. The Roadmap of 2D Materials and Devices Toward Chips. NANO-MICRO LETTERS 2024; 16:119. [PMID: 38363512 PMCID: PMC10873265 DOI: 10.1007/s40820-023-01273-5] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/30/2023] [Accepted: 10/30/2023] [Indexed: 02/17/2024]
Abstract
Due to the constraints imposed by physical effects and performance degradation, silicon-based chip technology is facing certain limitations in sustaining the advancement of Moore's law. Two-dimensional (2D) materials have emerged as highly promising candidates for the post-Moore era, offering significant potential in domains such as integrated circuits and next-generation computing. Here, in this review, the progress of 2D semiconductors in process engineering and various electronic applications are summarized. A careful introduction of material synthesis, transistor engineering focused on device configuration, dielectric engineering, contact engineering, and material integration are given first. Then 2D transistors for certain electronic applications including digital and analog circuits, heterogeneous integration chips, and sensing circuits are discussed. Moreover, several promising applications (artificial intelligence chips and quantum chips) based on specific mechanism devices are introduced. Finally, the challenges for 2D materials encountered in achieving circuit-level or system-level applications are analyzed, and potential development pathways or roadmaps are further speculated and outlooked.
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Affiliation(s)
- Anhan Liu
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100049, People's Republic of China
| | - Xiaowei Zhang
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100049, People's Republic of China
| | - Ziyu Liu
- School of Microelectronics, Fudan University, Shanghai, 200433, People's Republic of China
| | - Yuning Li
- School of Electronic and Information Engineering, Beijing Jiaotong University, Beijing, 100044, People's Republic of China
| | - Xueyang Peng
- High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, People's Republic of China
- School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing, 100049, People's Republic of China
| | - Xin Li
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China, Taiyuan, 030051, People's Republic of China
| | - Yue Qin
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China, Taiyuan, 030051, People's Republic of China
| | - Chen Hu
- High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, People's Republic of China
- School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing, 100049, People's Republic of China
| | - Yanqing Qiu
- High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, People's Republic of China
- School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing, 100049, People's Republic of China
| | - Han Jiang
- School of Microelectronics, Fudan University, Shanghai, 200433, People's Republic of China
| | - Yang Wang
- School of Microelectronics, Fudan University, Shanghai, 200433, People's Republic of China
| | - Yifan Li
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100049, People's Republic of China
| | - Jun Tang
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China, Taiyuan, 030051, People's Republic of China
| | - Jun Liu
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China, Taiyuan, 030051, People's Republic of China
| | - Hao Guo
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China, Taiyuan, 030051, People's Republic of China.
| | - Tao Deng
- School of Electronic and Information Engineering, Beijing Jiaotong University, Beijing, 100044, People's Republic of China.
| | - Songang Peng
- High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, People's Republic of China.
- IMECAS-HKUST-Joint Laboratory of Microelectronics, Beijing, 100029, People's Republic of China.
| | - He Tian
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100049, People's Republic of China.
| | - Tian-Ling Ren
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100049, People's Republic of China.
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Ansari S, Bianconi S, Kang CM, Mohseni H. From Material to Cameras: Low-Dimensional Photodetector Arrays on CMOS. SMALL METHODS 2024; 8:e2300595. [PMID: 37501320 DOI: 10.1002/smtd.202300595] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/08/2023] [Revised: 06/25/2023] [Indexed: 07/29/2023]
Abstract
The last two decades have witnessed a dramatic increase in research on low-dimensional material with exceptional optoelectronic properties. While low-dimensional materials offer exciting new opportunities for imaging, their integration in practical applications has been slow. In fact, most existing reports are based on single-pixel devices that cannot rival the quantity and quality of information provided by massively parallelized mega-pixel imagers based on complementary metal-oxide semiconductor (CMOS) readout electronics. The first goal of this review is to present new opportunities in producing high-resolution cameras using these new materials. New photodetection methods and materials in the field are presented, and the challenges involved in their integration on CMOS chips for making high-resolution cameras are discussed. Practical approaches are then presented to address these challenges and methods to integrate low-dimensional material on CMOS. It is also shown that such integrations could be used for ultra-low noise and massively parallel testing of new material and devices. The second goal of this review is to present the colossal untapped potential of low-dimensional material in enabling the next-generation of low-cost and high-performance cameras. It is proposed that low-dimensional materials have the natural ability to create excellent bio-inspired artificial imaging systems with unique features such as in-pixel computing, multi-band imaging, and curved retinas.
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Affiliation(s)
- Samaneh Ansari
- Electrical and Computer Engneering Department, Northwestern University, Evanston, IL, 60208, USA
| | - Simone Bianconi
- Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA, 91109, USA
| | - Chang-Mo Kang
- Photonic Semiconductor Research Center, Korea Photonics Technology Institute, Gwangju, 61007, Republic of Korea
| | - Hooman Mohseni
- Electrical and Computer Engneering Department, Northwestern University, Evanston, IL, 60208, USA
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Zheng Y, Ghosh S, Das S. A Butterfly-Inspired Multisensory Neuromorphic Platform for Integration of Visual and Chemical Cues. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023:e2307380. [PMID: 38069632 DOI: 10.1002/adma.202307380] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/25/2023] [Revised: 11/25/2023] [Indexed: 12/23/2023]
Abstract
Unisensory cues are often insufficient for animals to effectively engage in foraging, mating, and predatory activities. In contrast, integration of cues collected from multiple sensory organs enhances the overall perceptual experience and thereby facilitates better decision-making. Despite the importance of multisensory integration in animals, the field of artificial intelligence (AI) and neuromorphic computing has primarily focused on processing unisensory information. This lack of emphasis on multisensory integration can be attributed to the absence of a miniaturized hardware platform capable of co-locating multiple sensing modalities and enabling in-sensor and near-sensor processing. In this study, this limitation is addressed by utilizing the chemo-sensing properties of graphene and the photo-sensing capability of monolayer molybdenum disulfide (MoS2 ) to create a multisensory platform for visuochemical integration. Additionally, the in-memory-compute capability of MoS2 memtransistors is leveraged to develop neural circuits that facilitate multisensory decision-making. The visuochemical integration platform is inspired by intricate courtship of Heliconius butterflies, where female species rely on the integration of visual cues (such as wing color) and chemical cues (such as pheromones) generated by the male butterflies for mate selection. The butterfly-inspired visuochemical integration platform has significant implications in both robotics and the advancement of neuromorphic computing, going beyond unisensory intelligence and information processing.
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Affiliation(s)
- Yikai Zheng
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
| | - Subir Ghosh
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
| | - Saptarshi Das
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
- Electrical Engineering, Penn State University, University Park, PA, 16802, USA
- Materials Science and Engineering, Penn State University, University Park, PA, 16802, USA
- Materials Research Institute, Penn State University, University Park, PA, 16802, USA
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11
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Wu G, Zhang X, Feng G, Wang J, Zhou K, Zeng J, Dong D, Zhu F, Yang C, Zhao X, Gong D, Zhang M, Tian B, Duan C, Liu Q, Wang J, Chu J, Liu M. Ferroelectric-defined reconfigurable homojunctions for in-memory sensing and computing. NATURE MATERIALS 2023; 22:1499-1506. [PMID: 37770677 DOI: 10.1038/s41563-023-01676-0] [Citation(s) in RCA: 12] [Impact Index Per Article: 12.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/17/2023] [Accepted: 09/03/2023] [Indexed: 09/30/2023]
Abstract
Recently, the increasing demand for data-centric applications is driving the elimination of image sensing, memory and computing unit interface, thus promising for latency- and energy-strict applications. Although dedicated electronic hardware has inspired the development of in-memory computing and in-sensor computing, folding the entire signal chain into one device remains challenging. Here an in-memory sensing and computing architecture is demonstrated using ferroelectric-defined reconfigurable two-dimensional photodiode arrays. High-level cognitive computing is realized based on the multiplications of light power and photoresponsivity through the photocurrent generation process and Kirchhoff's law. The weight is stored and programmed locally by the ferroelectric domains, enabling 51 (>5 bit) distinguishable weight states with linear, symmetric and reversible manipulation characteristics. Image recognition can be performed without any external memory and computing units. The three-in-one paradigm, integrating high-level computing, weight memorization and high-performance sensing, paves the way for a computing architecture with low energy consumption, low latency and reduced hardware overhead.
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Affiliation(s)
- Guangjian Wu
- State Key Laboratory of Integrated Chips and Systems, Frontier Institute of Chip and System, Fudan University, Shanghai, China
- Shanghai Qi Zhi Institute, Xuhui District, Shanghai, China
- Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, China
| | - Xumeng Zhang
- State Key Laboratory of Integrated Chips and Systems, Frontier Institute of Chip and System, Fudan University, Shanghai, China
- Shanghai Qi Zhi Institute, Xuhui District, Shanghai, China
- Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, China
| | - Guangdi Feng
- Key Laboratory of Polar Materials and Devices (MOE), Ministry of Education, Shanghai Center of Brain-inspired Intelligent Materials and Devices, Department of Electronics, East China Normal University, Shanghai, China
| | - Jingli Wang
- State Key Laboratory of Integrated Chips and Systems, Frontier Institute of Chip and System, Fudan University, Shanghai, China
| | - Keji Zhou
- State Key Laboratory of Integrated Chips and Systems, Frontier Institute of Chip and System, Fudan University, Shanghai, China
| | - Jinhua Zeng
- State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, China
| | - Danian Dong
- Key Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China
| | - Fangduo Zhu
- State Key Laboratory of Integrated Chips and Systems, Frontier Institute of Chip and System, Fudan University, Shanghai, China
| | - Chenkai Yang
- Key Laboratory of Polar Materials and Devices (MOE), Ministry of Education, Shanghai Center of Brain-inspired Intelligent Materials and Devices, Department of Electronics, East China Normal University, Shanghai, China
| | - Xiaoming Zhao
- Key Laboratory of Polar Materials and Devices (MOE), Ministry of Education, Shanghai Center of Brain-inspired Intelligent Materials and Devices, Department of Electronics, East China Normal University, Shanghai, China
| | - Danni Gong
- Key Laboratory of Polar Materials and Devices (MOE), Ministry of Education, Shanghai Center of Brain-inspired Intelligent Materials and Devices, Department of Electronics, East China Normal University, Shanghai, China
| | - Mengru Zhang
- State Key Laboratory of Integrated Chips and Systems, Frontier Institute of Chip and System, Fudan University, Shanghai, China
| | - Bobo Tian
- Key Laboratory of Polar Materials and Devices (MOE), Ministry of Education, Shanghai Center of Brain-inspired Intelligent Materials and Devices, Department of Electronics, East China Normal University, Shanghai, China.
| | - Chungang Duan
- Key Laboratory of Polar Materials and Devices (MOE), Ministry of Education, Shanghai Center of Brain-inspired Intelligent Materials and Devices, Department of Electronics, East China Normal University, Shanghai, China
| | - Qi Liu
- State Key Laboratory of Integrated Chips and Systems, Frontier Institute of Chip and System, Fudan University, Shanghai, China.
- Shanghai Qi Zhi Institute, Xuhui District, Shanghai, China.
- Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, China.
| | - Jianlu Wang
- State Key Laboratory of Integrated Chips and Systems, Frontier Institute of Chip and System, Fudan University, Shanghai, China.
- Shanghai Qi Zhi Institute, Xuhui District, Shanghai, China.
- Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, China.
- Institute of Optoelectronics, Shanghai Frontier Base of Intelligent Optoelectronics and Perception, Fudan University, Shanghai, China.
| | - Junhao Chu
- Key Laboratory of Polar Materials and Devices (MOE), Ministry of Education, Shanghai Center of Brain-inspired Intelligent Materials and Devices, Department of Electronics, East China Normal University, Shanghai, China
- State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, China
- Institute of Optoelectronics, Shanghai Frontier Base of Intelligent Optoelectronics and Perception, Fudan University, Shanghai, China
| | - Ming Liu
- State Key Laboratory of Integrated Chips and Systems, Frontier Institute of Chip and System, Fudan University, Shanghai, China
- Shanghai Qi Zhi Institute, Xuhui District, Shanghai, China
- Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, China
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12
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Chen P, Li D, Li Z, Xu X, Wang H, Zhou X, Zhai T. Programmable Physical Unclonable Functions Using Randomly Anisotropic Two-Dimensional Flakes. ACS NANO 2023. [PMID: 37982379 DOI: 10.1021/acsnano.3c08740] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/21/2023]
Abstract
Physical unclonable functions (PUFs) have been developed as promising strategies for secure authentication. Conventional strategies of PUFs have a limitation in the aspect of security for their static single channel. The introduction of polarization will endow a static PUF with many dynamic transformations based on polarized properties. Herein, high-security PUFs based on the polarized luminescence of chaotic luminescent patterns are fabricated by anisotropic rare earth (RE) material Er3O4Cl flakes. These derivatives under different polarizations show strong randomness (with similarity of the same PUF as high as 97%, while that for different PUFs is as low as 44%), which further widens the security and capacity of PUFs. Polarized luminescence control of Er3O4Cl patterns gives freedom to the PUFs and ensures a high encoding capacity of 2380000. Furthermore, we build a convolutional neural network (CNN) to realize fast intelligent authentication by extracting image features for convolution operation with a very high accuracy of 99.8% and fast classification speed in only 5 epochs.
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Affiliation(s)
- Ping Chen
- State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology (HUST), Wuhan 430074, People's Republic of China
- School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, People's Republic of China
| | - Dongyan Li
- State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology (HUST), Wuhan 430074, People's Republic of China
| | - Zexin Li
- State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology (HUST), Wuhan 430074, People's Republic of China
| | - Xiang Xu
- State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology (HUST), Wuhan 430074, People's Republic of China
| | - Haoyun Wang
- State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology (HUST), Wuhan 430074, People's Republic of China
| | - Xing Zhou
- State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology (HUST), Wuhan 430074, People's Republic of China
| | - Tianyou Zhai
- State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology (HUST), Wuhan 430074, People's Republic of China
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13
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Feng C, Wu W, Liu H, Wang J, Wan H, Ma G, Wang H. Emerging Opportunities for 2D Materials in Neuromorphic Computing. NANOMATERIALS (BASEL, SWITZERLAND) 2023; 13:2720. [PMID: 37836361 PMCID: PMC10574516 DOI: 10.3390/nano13192720] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 09/06/2023] [Revised: 10/01/2023] [Accepted: 10/04/2023] [Indexed: 10/15/2023]
Abstract
Recently, two-dimensional (2D) materials and their heterostructures have been recognized as the foundation for future brain-like neuromorphic computing devices. Two-dimensional materials possess unique characteristics such as near-atomic thickness, dangling-bond-free surfaces, and excellent mechanical properties. These features, which traditional electronic materials cannot achieve, hold great promise for high-performance neuromorphic computing devices with the advantages of high energy efficiency and integration density. This article provides a comprehensive overview of various 2D materials, including graphene, transition metal dichalcogenides (TMDs), hexagonal boron nitride (h-BN), and black phosphorus (BP), for neuromorphic computing applications. The potential of these materials in neuromorphic computing is discussed from the perspectives of material properties, growth methods, and device operation principles.
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Affiliation(s)
- Chenyin Feng
- Hubei Yangtze Memory Laboratories, Wuhan 430070, China
- Institute of Microelectronics and Integrated Circuits, School of Microelectronics, Hubei University, Wuhan 430062, China
| | - Wenwei Wu
- Institute of Microelectronics and Integrated Circuits, School of Microelectronics, Hubei University, Wuhan 430062, China
| | - Huidi Liu
- Institute of Microelectronics and Integrated Circuits, School of Microelectronics, Hubei University, Wuhan 430062, China
| | - Junke Wang
- Institute of Microelectronics and Integrated Circuits, School of Microelectronics, Hubei University, Wuhan 430062, China
| | - Houzhao Wan
- Hubei Yangtze Memory Laboratories, Wuhan 430070, China
| | - Guokun Ma
- Hubei Yangtze Memory Laboratories, Wuhan 430070, China
| | - Hao Wang
- Hubei Yangtze Memory Laboratories, Wuhan 430070, China
- Institute of Microelectronics and Integrated Circuits, School of Microelectronics, Hubei University, Wuhan 430062, China
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14
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Ghosh S, Pannone A, Sen D, Wali A, Ravichandran H, Das S. An all 2D bio-inspired gustatory circuit for mimicking physiology and psychology of feeding behavior. Nat Commun 2023; 14:6021. [PMID: 37758750 PMCID: PMC10533903 DOI: 10.1038/s41467-023-41046-7] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/20/2023] [Accepted: 08/21/2023] [Indexed: 09/29/2023] Open
Abstract
Animal behavior involves complex interactions between physiology and psychology. However, most AI systems neglect psychological factors in decision-making due to a limited understanding of the physiological-psychological connection at the neuronal level. Recent advancements in brain imaging and genetics have uncovered specific neural circuits that regulate behaviors like feeding. By developing neuro-mimetic circuits that incorporate both physiology and psychology, a new emotional-AI paradigm can be established that bridges the gap between humans and machines. This study presents a bio-inspired gustatory circuit that mimics adaptive feeding behavior in humans, considering both physiological states (hunger) and psychological states (appetite). Graphene-based chemitransistors serve as artificial gustatory taste receptors, forming an electronic tongue, while 1L-MoS2 memtransistors construct an electronic-gustatory-cortex comprising a hunger neuron, appetite neuron, and feeding circuit. This work proposes a novel paradigm for emotional neuromorphic systems with broad implications for human health. The concept of gustatory emotional intelligence can extend to other sensory systems, benefiting future humanoid AI.
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Affiliation(s)
- Subir Ghosh
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
| | - Andrew Pannone
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
| | - Dipanjan Sen
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
| | - Akshay Wali
- Electrical Engineering, Penn State University, University Park, PA, 16802, USA
| | | | - Saptarshi Das
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA.
- Electrical Engineering, Penn State University, University Park, PA, 16802, USA.
- Materials Science and Engineering, Penn State University, University Park, PA, 16802, USA.
- Materials Research Institute, Penn State University, University Park, PA, 16802, USA.
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15
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Sadaf MUK, Sakib NU, Pannone A, Ravichandran H, Das S. A bio-inspired visuotactile neuron for multisensory integration. Nat Commun 2023; 14:5729. [PMID: 37714853 PMCID: PMC10504285 DOI: 10.1038/s41467-023-40686-z] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/14/2023] [Accepted: 08/03/2023] [Indexed: 09/17/2023] Open
Abstract
Multisensory integration is a salient feature of the brain which enables better and faster responses in comparison to unisensory integration, especially when the unisensory cues are weak. Specialized neurons that receive convergent input from two or more sensory modalities are responsible for such multisensory integration. Solid-state devices that can emulate the response of these multisensory neurons can advance neuromorphic computing and bridge the gap between artificial and natural intelligence. Here, we introduce an artificial visuotactile neuron based on the integration of a photosensitive monolayer MoS2 memtransistor and a triboelectric tactile sensor which minutely captures the three essential features of multisensory integration, namely, super-additive response, inverse effectiveness effect, and temporal congruency. We have also realized a circuit which can encode visuotactile information into digital spiking events, with probability of spiking determined by the strength of the visual and tactile cues. We believe that our comprehensive demonstration of bio-inspired and multisensory visuotactile neuron and spike encoding circuitry will advance the field of neuromorphic computing, which has thus far primarily focused on unisensory intelligence and information processing.
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Affiliation(s)
| | - Najam U Sakib
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
| | - Andrew Pannone
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
| | | | - Saptarshi Das
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA.
- Electrical Engineering, Penn State University, University Park, PA, 16802, USA.
- Materials Science and Engineering, Penn State University, University Park, PA, 16802, USA.
- Materials Research Institute, Penn State University, University Park, PA, 16802, USA.
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16
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Ravichandran H, Sen D, Wali A, Schranghamer TF, Trainor N, Redwing JM, Ray B, Das S. A Peripheral-Free True Random Number Generator Based on Integrated Circuits Enabled by Atomically Thin Two-Dimensional Materials. ACS NANO 2023; 17:16817-16826. [PMID: 37616285 DOI: 10.1021/acsnano.3c03581] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 08/26/2023]
Abstract
A true random number generator (TRNG) is essential to ensure information security for Internet of Things (IoT) edge devices. While pseudorandom number generators (PRNGs) have been instrumental, their deterministic nature limits their application in security-sensitive scenarios. In contrast, hardware-based TRNGs derived from physically unpredictable processes offer greater reliability. This study demonstrates a peripheral-free TRNG utilizing two cascaded three-stage inverters (TSIs) in conjunction with an XOR gate composed of monolayer molybdenum disulfide (MoS2) field-effect transistors (FETs) by exploiting the stochastic charge trapping and detrapping phenomena at and/or near the MoS2/dielectric interface. The entropy source passes the NIST SP800-90B tests with a minimum normalized entropy of 0.8780, while the generated bits pass the NIST SP800-22 randomness tests without any postprocessing. Moreover, the keys generated using these random bits are uncorrelated with near-ideal entropy, bit uniformity, and Hamming distances, exhibiting resilience against machine learning (ML) attacks, temperature variations, and supply bias fluctuations with a frugal energy expenditure of 30 pJ/bit. This approach offers an advantageous alternative to conventional silicon, memristive, and nanomaterial-based TRNGs as it obviates the need for extensive peripherals while harnessing the potential of atomically thin 2D materials in developing low-power TRNGs.
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Affiliation(s)
- Harikrishnan Ravichandran
- Engineering Science and Mechanics, Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Dipanjan Sen
- Engineering Science and Mechanics, Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Akshay Wali
- Electrical Engineering and Computer Science, Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Thomas F Schranghamer
- Engineering Science and Mechanics, Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Nicholas Trainor
- Materials Science and Engineering, Pennsylvania State University, University Park, Pennsylvania 16802, United States
- 2D Crystal Consortium, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Joan M Redwing
- Materials Science and Engineering, Pennsylvania State University, University Park, Pennsylvania 16802, United States
- 2D Crystal Consortium, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Biswajit Ray
- Department of Electrical and Computer Engineering, Colorado State University, Fort Collins, Colorado 80523, United States
| | - Saptarshi Das
- Engineering Science and Mechanics, Pennsylvania State University, University Park, Pennsylvania 16802, United States
- Materials Science and Engineering, Pennsylvania State University, University Park, Pennsylvania 16802, United States
- 2D Crystal Consortium, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania 16802, United States
- Electrical Engineering and Computer Science, Pennsylvania State University, University Park, Pennsylvania 16802, United States
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17
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Li C, Liao X, Peng ZK, Meng G, He Q. Highly sensitive and broadband meta-mechanoreceptor via mechanical frequency-division multiplexing. Nat Commun 2023; 14:5482. [PMID: 37673899 PMCID: PMC10482866 DOI: 10.1038/s41467-023-41222-9] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 09/30/2022] [Accepted: 08/25/2023] [Indexed: 09/08/2023] Open
Abstract
Bio-mechanoreceptors capable of micro-motion sensing have inspired mechanics-guided designs of micro-motion sensors in various fields. However, it remains a major challenge for mechanics-guided designs to simultaneously achieve high sensitivity and broadband sensing due to the nature of resonance effect. By mimicking rat vibrissae, here we report a metamaterial mechanoreceptor (MMR) comprised of piezoelectric resonators with distributed zero effective masses featuring a broad range of local resonances, leading to near-infinite sensitivity for micro-motion sensing within a broad bandwidth. We developed a mechanical frequency-division multiplexing mechanism for MMR, in which the measured micro-motion signal is mechanically modulated in non-overlapping frequency bands and reconstructed by a computational multi-channel demodulation approach. The maximum sensitivity of MMR is improved by two orders of magnitude compared to conventional mechanics-guided mechanoreceptors, and its bandwidth with high sensitivity is extendable towards both low-frequency and high-frequency ranges in 0-12 kHz through tuning the local resonance of each individual sensing cell. The MMR is a promising candidate for highly sensitive and broadband micro-motion sensing that was previously inaccessible for mechanics-guided mechanoreceptors, opening pathways towards spatio-temporal sensing, remote-vibration monitoring and smart-driving assistance.
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Affiliation(s)
- Chong Li
- State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, 200240, P. R. China
| | - Xinxin Liao
- State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, 200240, P. R. China
| | - Zhi-Ke Peng
- State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, 200240, P. R. China
- School of Mechanical Engineering, Ningxia University, Yinchuan, 750021, P. R. China
| | - Guang Meng
- State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, 200240, P. R. China
| | - Qingbo He
- State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, 200240, P. R. China.
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18
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Alabdulatif A, Thilakarathne NN. Bio-Inspired Internet of Things: Current Status, Benefits, Challenges, and Future Directions. Biomimetics (Basel) 2023; 8:373. [PMID: 37622978 PMCID: PMC10452281 DOI: 10.3390/biomimetics8040373] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/25/2023] [Revised: 08/14/2023] [Accepted: 08/15/2023] [Indexed: 08/26/2023] Open
Abstract
There is no doubt that the involvement of the Internet of Things (IoT) in our daily lives has changed the way we live and interact as a global community, as IoT enables intercommunication of digital objects around us, creating a pervasive environment. As of now, this IoT is found in almost every domain that is vital for human survival, such as agriculture, medical care, transportation, the military, and so on. Day by day, various IoT solutions are introduced to the market by manufacturers towards making our life easier and more comfortable. On the other hand, even though IoT now holds a key place in our lives, the IoT ecosystem has various limitations in efficiency, scalability, and adaptability. As such, biomimicry, which involves imitating the systems found in nature within human-made systems, appeared to be a potential remedy to overcome such challenges pertaining to IoT, which can also be referred to as bio-inspired IoT. In the simplest terms, bio-inspired IoT combines nature-inspired principles and IoT to create more efficient and adaptive IoT solutions, that can overcome most of the inherent challenges pertaining to traditional IoT. It is based on the idea that nature has already solved many challenging problems and that, by studying and mimicking biological systems, we might develop better IoT systems. As of now, this concept of bio-inspired IoT is applied to various fields such as medical care, transportation, cyber-security, agriculture, and so on. However, it is noted that only a few studies have been carried out on this new concept, explaining how these bio-inspired concepts are integrated with IoT. Thus, to fill in the gap, in this study, we provide a brief review of bio-inspired IoT, highlighting how it came into play, its ecosystem, its latest status, benefits, challenges, and future directions.
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Affiliation(s)
- Abdullah Alabdulatif
- Department of Computer, College of Sciences and Arts in Al-Rass, Qassim University, Al-Rass 720223, Saudi Arabia;
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19
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Ravichandran H, Knobloch T, Pannone A, Karl A, Stampfer B, Waldhoer D, Zheng Y, Sakib NU, Karim Sadaf MU, Pendurthi R, Torsi R, Robinson JA, Grasser T, Das S. Observation of Rich Defect Dynamics in Monolayer MoS 2. ACS NANO 2023. [PMID: 37490390 DOI: 10.1021/acsnano.2c12900] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 07/27/2023]
Abstract
Defects play a pivotal role in limiting the performance and reliability of nanoscale devices. Field-effect transistors (FETs) based on atomically thin two-dimensional (2D) semiconductors such as monolayer MoS2 are no exception. Probing defect dynamics in 2D FETs is therefore of significant interest. Here, we present a comprehensive insight into various defect dynamics observed in monolayer MoS2 FETs at varying gate biases and temperatures. The measured source-to-drain currents exhibit random telegraph signals (RTS) owing to the transfer of charges between the semiconducting channel and individual defects. Based on the modeled temperature and gate bias dependence, oxygen vacancies or aluminum interstitials are probable defect candidates. Several types of RTSs are observed including anomalous RTS and giant RTS indicating local current crowding effects and rich defect dynamics in monolayer MoS2 FETs. This study explores defect dynamics in large area-grown monolayer MoS2 with ALD-grown Al2O3 as the gate dielectric.
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Affiliation(s)
- Harikrishnan Ravichandran
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
| | - Theresia Knobloch
- Institute for Microelectronics (TU Wien), Gusshausstrasse 27-29, 1040 Vienna, Austria
| | - Andrew Pannone
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
| | - Alexander Karl
- Institute for Microelectronics (TU Wien), Gusshausstrasse 27-29, 1040 Vienna, Austria
| | - Bernhard Stampfer
- Institute for Microelectronics (TU Wien), Gusshausstrasse 27-29, 1040 Vienna, Austria
| | - Dominic Waldhoer
- Institute for Microelectronics (TU Wien), Gusshausstrasse 27-29, 1040 Vienna, Austria
| | - Yikai Zheng
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
| | - Najam U Sakib
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
| | - Muhtasim Ul Karim Sadaf
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
| | - Rahul Pendurthi
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
| | - Riccardo Torsi
- Materials Science and Engineering, Penn State University, University Park, Pennsylvania 16802, United States
| | - Joshua A Robinson
- Materials Science and Engineering, Penn State University, University Park, Pennsylvania 16802, United States
- Department of Chemistry, Penn State University, University Park, Pennsylvania 16802, United States
- Department of Physics, Penn State University, University Park, Pennsylvania 16802, United States
| | - Tibor Grasser
- Institute for Microelectronics (TU Wien), Gusshausstrasse 27-29, 1040 Vienna, Austria
| | - Saptarshi Das
- Engineering Science and Mechanics, Penn State University, University Park, Pennsylvania 16802, United States
- Materials Science and Engineering, Penn State University, University Park, Pennsylvania 16802, United States
- Materials Research Institute, Penn State University, University Park, Pennsylvania 16802, United States
- Electrical Engineering, Penn State University, University Park, Pennsylvania 16802, United States
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20
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Aitchison C, Halak B, Serb A, Prodromakis T. A memristor fingerprinting and characterisation methodology for hardware security. Sci Rep 2023; 13:9392. [PMID: 37296171 DOI: 10.1038/s41598-023-33051-z] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 11/01/2022] [Accepted: 04/06/2023] [Indexed: 06/12/2023] Open
Abstract
The modern IC supply chain encompasses a large number of steps and manufacturers. In many applications it is critically important that chips are of the right quality and are assured to have been obtained from the legitimate supply chain. To this end, it is necessary to be able to uniquely identify systems to aid in supply chain tracking and quality assurance. Many identifiers, however, can be cloned onto counterfeit devices and are therefore untrustworthy. This paper proposes a methodology for using post-CMOS memristor devices as a fingerprint to uniquely identify ICs. To achieve this, memristors' unique and variable I-V characteristics are exploited to produce a fingerprint that can be generally applicable to a wide variety of different memristor technologies and identifiable over time, even where cell retention is non-ideal. In doing so it aims to minimise the hardware required on-chip both to minimise cost and maximise the auditability of the system. The methodology is applied to a [Formula: see text] memristor technology, and shown to be able to identify cells in a set.
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Affiliation(s)
- Callum Aitchison
- Electronics and Computer Science, University of Southampton, University Road, Southampton, SO17 1BJ, UK.
| | - Basel Halak
- Electronics and Computer Science, University of Southampton, University Road, Southampton, SO17 1BJ, UK
| | - Alex Serb
- Centre for Electronics Frontiers, Institute for Integrated Micro and Nano Systems, School of Engineering, The University of Edinburgh, Edinburgh, UK
| | - Themis Prodromakis
- Centre for Electronics Frontiers, Institute for Integrated Micro and Nano Systems, School of Engineering, The University of Edinburgh, Edinburgh, UK
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21
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Wen H, Yang X, Huang R, Zheng D, Yuan J, Hong H, Duan J, Zi Y, Tang Q. Universal Energy Solution for Triboelectric Sensors Toward the 5G Era and Internet of Things. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2023:e2302009. [PMID: 37246274 PMCID: PMC10401095 DOI: 10.1002/advs.202302009] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/28/2023] [Revised: 05/02/2023] [Indexed: 05/30/2023]
Abstract
The launching of 5G technology provides excellent opportunity for the prosperous development of Internet of Things (IoT) devices and intelligent wireless sensor nodes. However, deploying of tremendous wireless sensor nodes network presents a great challenge to sustainable power supply and self-powered active sensing. Triboelectric nanogenerator (TENG) has shown great capability for powering wireless sensors and work as self-powered sensors since its discovery in 2012. Nevertheless, its inherent property of large internal impedance and pulsed "high-voltage and low-current" output characteristic seriously limit its direct application as stable power supply. Herein, a generic triboelectric sensor module (TSM) is developed toward managing the high output of TENG into signals that can be directly utilized by commercial electronics. Finally, an IoT-based smart switching system is realized by integrating the TSM with a typical vertical contact-separation mode TENG and microcontroller, which is able to monitor the real-time appliance status and location information. Such design of a universal energy solution for triboelectric sensors is applicable for managing and normalizing the wide output range generated from various working modes of TENGs and suitable for facile integration with IoT platform, representing a significant step toward scaling up TENG applications in future smart sensing.
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Affiliation(s)
- Haiyang Wen
- Institute of New Energy Technology, College of Information Science and Technology, Jinan University, Guangzhou, 510632, China
| | - Xiya Yang
- Institute of New Energy Technology, College of Information Science and Technology, Jinan University, Guangzhou, 510632, China
| | - Ruiyuan Huang
- Institute of New Energy Technology, College of Information Science and Technology, Jinan University, Guangzhou, 510632, China
| | - Duo Zheng
- Institute of New Energy Technology, College of Information Science and Technology, Jinan University, Guangzhou, 510632, China
| | - Jingbo Yuan
- Institute of New Energy Technology, College of Information Science and Technology, Jinan University, Guangzhou, 510632, China
| | - Hongxin Hong
- Institute of New Energy Technology, College of Information Science and Technology, Jinan University, Guangzhou, 510632, China
- School of Physics and Optoelectronics, South China University of Technology, Guangzhou, 510641, China
| | - Jialong Duan
- Institute of Carbon Neutrality, College of Chemical and Biological Engineering, Shandong University of Science and Technology, Qingdao, 266590, China
| | - Yunlong Zi
- Thrust of Sustainable Energy and Environment, The Hong Kong University of Science and Technology (Guangzhou), Nansha, Guangzhou, Guangdong, 511400, China
| | - Qunwei Tang
- Institute of New Energy Technology, College of Information Science and Technology, Jinan University, Guangzhou, 510632, China
- Institute of Carbon Neutrality, College of Chemical and Biological Engineering, Shandong University of Science and Technology, Qingdao, 266590, China
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22
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Shao B, Wan T, Liao F, Kim BJ, Chen J, Guo J, Ma S, Ahn JH, Chai Y. Highly Trustworthy In-Sensor Cryptography for Image Encryption and Authentication. ACS NANO 2023. [PMID: 37186522 DOI: 10.1021/acsnano.3c00487] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/17/2023]
Abstract
The prevailing transmission of image information over the Internet of Things demands trustworthy cryptography for high security and privacy. State-of-the-art security modules are usually physically separated from the sensory terminals that capture images, which unavoidably exposes image information to various attacks during the transmission process. Here we develop in-sensor cryptography that enables capturing images and producing security keys in the same hardware devices. The generated key inherently binds to the captured images, which gives rise to highly trustworthy cryptography. Using the intrinsic electronic and optoelectronic characteristics of the 256 molybdenum disulfide phototransistor array, we can harvest electronic and optoelectronic binary keys with a physically unclonable function and further upgrade them into multiple-state ternary and double-binary keys, exhibiting high uniformity, uniqueness, randomness, and coding capacity. This in-sensor cryptography enables highly trustworthy image encryption to avoid passive attacks and image authentication to prevent unauthorized editions.
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Affiliation(s)
- Bangjie Shao
- Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong 999077, People's Republic of China
| | - Tianqing Wan
- Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong 999077, People's Republic of China
| | - Fuyou Liao
- Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong 999077, People's Republic of China
- The Hong Kong Polytechnic University Shenzhen Research Institute, Shenzhen 518055, People's Republic of China
| | - Beom Jin Kim
- School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
| | - Jiewei Chen
- Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong 999077, People's Republic of China
| | - Jianmiao Guo
- Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong 999077, People's Republic of China
| | - Sijie Ma
- Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong 999077, People's Republic of China
| | - Jong-Hyun Ahn
- School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
| | - Yang Chai
- Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong 999077, People's Republic of China
- The Hong Kong Polytechnic University Shenzhen Research Institute, Shenzhen 518055, People's Republic of China
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23
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Wali A, Ravichandran H, Das S. Hardware Trojans based on two-dimensional memtransistors. NANOSCALE HORIZONS 2023; 8:603-615. [PMID: 37021644 DOI: 10.1039/d2nh00568a] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/03/2023]
Abstract
Hardware Trojans (HTs) have emerged as a major security threat for integrated circuits (ICs) owing to the involvement of untrustworthy actors in the globally distributed semiconductor supply chain. HTs are intentional malicious modifications, which remain undetectable through simple electrical measurements but can cause catastrophic failure in the functioning of ICs in mission critical applications. In this article, we show how two-dimensional (2D) material based in-memory computing elements such as memtransistors can be used as hardware Trojans. We found that logic gates based on 2D memtransistors can be made to malfunction by exploiting their inherent programming capabilities. While we use 2D memtransistor-based ICs as the testbed for our demonstration, the results are equally applicable to any state-of-the-art and emerging in-memory computing technologies.
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Affiliation(s)
- Akshay Wali
- Electrical Engineering and Computer Science, Penn State University, University Park, PA 16802, USA.
| | | | - Saptarshi Das
- Electrical Engineering and Computer Science, Penn State University, University Park, PA 16802, USA.
- Engineering Science and Mechanics, Penn State University, University Park, PA 16802, USA
- Materials Science and Engineering, Penn State University, University Park, PA 16802, USA
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24
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Wali A, Das S. Hardware and Information Security Primitives Based on 2D Materials and Devices. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2205365. [PMID: 36564174 DOI: 10.1002/adma.202205365] [Citation(s) in RCA: 4] [Impact Index Per Article: 4.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/14/2022] [Revised: 12/01/2022] [Indexed: 05/05/2023]
Abstract
Hardware security is a major concern for the entire semiconductor ecosystem that accounts for billions of dollars in annual losses. Similarly, information security is a critical need for the rapidly proliferating edge devices that continuously collect and communicate a massive volume of data. While silicon-based complementary metal-oxide-semiconductor technology offers security solutions, these are largely inadequate, inefficient, and often inconclusive, as well as resource intensive in time, energy, and cost, leading to tremendous room for innovation in this field. Furthermore, silicon-based security primitives have shown vulnerability to machine learning (ML) attacks. In recent years, 2D materials such as graphene and transition metal dichalcogenides have been intensely explored to mitigate these security challenges. In this review, 2D-materials-based hardware security solutions such as camouflaging, true random number generation, watermarking, anticounterfeiting, physically unclonable functions, and logic locking of integrated circuits (ICs) are summarized with accompanying discussion on their reliability and resilience to ML attacks. In addition, the role of native defects in 2D materials in developing high entropy hardware security primitives is also examined. Finally, the existing challenges for 2D materials, which must be overcome for large-scale deployment of 2D ICs to meet the security needs of the semiconductor industry, are discussed.
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Affiliation(s)
- Akshay Wali
- Electrical Engineering and Computer Science, Penn State University, University Park, PA, 16802, USA
| | - Saptarshi Das
- Electrical Engineering and Computer Science, Penn State University, University Park, PA, 16802, USA
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
- Materials Science and Engineering, Penn State University, University Park, PA, 16802, USA
- Materials Research Institute, Penn State University, University Park, PA, 16802, USA
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25
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Wang F, Hu F, Dai M, Zhu S, Sun F, Duan R, Wang C, Han J, Deng W, Chen W, Ye M, Han S, Qiang B, Jin Y, Chua Y, Chi N, Yu S, Nam D, Chae SH, Liu Z, Wang QJ. A two-dimensional mid-infrared optoelectronic retina enabling simultaneous perception and encoding. Nat Commun 2023; 14:1938. [PMID: 37024508 PMCID: PMC10079931 DOI: 10.1038/s41467-023-37623-5] [Citation(s) in RCA: 14] [Impact Index Per Article: 14.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/07/2023] [Accepted: 03/22/2023] [Indexed: 04/08/2023] Open
Abstract
Infrared machine vision system for object perception and recognition is becoming increasingly important in the Internet of Things era. However, the current system suffers from bulkiness and inefficiency as compared to the human retina with the intelligent and compact neural architecture. Here, we present a retina-inspired mid-infrared (MIR) optoelectronic device based on a two-dimensional (2D) heterostructure for simultaneous data perception and encoding. A single device can perceive the illumination intensity of a MIR stimulus signal, while encoding the intensity into a spike train based on a rate encoding algorithm for subsequent neuromorphic computing with the assistance of an all-optical excitation mechanism, a stochastic near-infrared (NIR) sampling terminal. The device features wide dynamic working range, high encoding precision, and flexible adaption ability to the MIR intensity. Moreover, an inference accuracy more than 96% to MIR MNIST data set encoded by the device is achieved using a trained spiking neural network (SNN).
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Affiliation(s)
- Fakun Wang
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Fangchen Hu
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
- Key Laboratory for Information Science of Electromagnetic Waves (MoE), Fudan University, Shanghai, 200433, China
| | - Mingjin Dai
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Song Zhu
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Fangyuan Sun
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Ruihuan Duan
- School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Chongwu Wang
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Jiayue Han
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Wenjie Deng
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Wenduo Chen
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Ming Ye
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Song Han
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Bo Qiang
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Yuhao Jin
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Yunda Chua
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Nan Chi
- Key Laboratory for Information Science of Electromagnetic Waves (MoE), Fudan University, Shanghai, 200433, China
| | - Shaohua Yu
- Peng Cheng Laboratory, Shenzhen, 518055, China
| | - Donguk Nam
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Sang Hoon Chae
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Zheng Liu
- School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Qi Jie Wang
- School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore.
- Centre for Disruptive Photonic Technologies, School of Physical and Mathematical Sciences, Nanyang Technological University, Singapore, 637371, Singapore.
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26
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Ravichandran H, Zheng Y, Schranghamer TF, Trainor N, Redwing JM, Das S. A Monolithic Stochastic Computing Architecture for Energy Efficient Arithmetic. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2206168. [PMID: 36308032 DOI: 10.1002/adma.202206168] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/13/2022] [Revised: 10/04/2022] [Indexed: 06/16/2023]
Abstract
As the energy and hardware investments necessary for conventional high-precision digital computing continue to explode in the era of artificial intelligence (AI), a change in paradigm that can trade precision for energy and resource efficiency is being sought for many computing applications. Stochastic computing (SC) is an attractive alternative since, unlike digital computers, which require many logic gates and a high transistor volume to perform basic arithmetic operations such as addition, subtraction, multiplication, sorting, etc., SC can implement the same using simple logic gates. While it is possible to accelerate SC using traditional silicon complementary metal-oxide-semiconductor (CMOS) technology, the need for extensive hardware investment to generate stochastic bits (s-bits), the fundamental computing primitive for SC, makes it less attractive. Memristor and spin-based devices offer natural randomness but depend on hybrid designs involving CMOS peripherals for accelerating SC, which increases area and energy burden. Here, the limitations of existing and emerging technologies are overcome, and a standalone SC architecture embedded in memory and based on 2D memtransistors is experimentally demonstrated. The monolithic and non-von-Neumann SC architecture occupies a small hardware footprint and consumes a miniscule amount of energy (<1 nJ) for both s-bit generation and arithmetic operations, highlighting the benefits of SC.
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Affiliation(s)
| | - Yikai Zheng
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
| | - Thomas F Schranghamer
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
| | - Nicholas Trainor
- Materials Science and Engineering, Penn State University, University Park, PA, 16802, USA
- Materials Research Institute, Penn State University, University Park, PA, 16802, USA
| | - Joan M Redwing
- Materials Science and Engineering, Penn State University, University Park, PA, 16802, USA
- Materials Research Institute, Penn State University, University Park, PA, 16802, USA
| | - Saptarshi Das
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
- Materials Science and Engineering, Penn State University, University Park, PA, 16802, USA
- Materials Research Institute, Penn State University, University Park, PA, 16802, USA
- Electrical Engineering and Computer Science, Penn State University, University Park, PA, 16802, USA
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27
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Subbulakshmi Radhakrishnan S, Dodda A, Das S. An All-in-One Bioinspired Neural Network. ACS NANO 2022; 16:20100-20115. [PMID: 36378680 DOI: 10.1021/acsnano.2c02172] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
In spite of recent advancements in artificial neural networks (ANNs), the energy efficiency, multifunctionality, adaptability, and integrated nature of biological neural networks remain largely unimitated by hardware neuromorphic computing systems. Here, we exploit optoelectronic, computing, and programmable memory devices based on emerging two-dimensional (2D) layered materials such as MoS2 to demonstrate a monolithically integrated, multipixel, and "all-in-one" bioinspired neural network (BNN) capable of sensing, encoding, learning, forgetting, and inferring at minuscule energy expenditure. We also demonstrate learning adaptability and simulate learning challenges under specific synaptic conditions to mimic biological learning. Our findings highlight the potential of in-memory computing and sensing based on emerging 2D materials, devices, and integrated circuits to not only overcome the bottleneck of von Neumann computing in conventional CMOS designs but also to aid in eliminating the peripheral components necessary for competing technologies such as memristors.
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Affiliation(s)
- Shiva Subbulakshmi Radhakrishnan
- Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, Pennsylvania16802, United States
| | - Akhil Dodda
- Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, Pennsylvania16802, United States
| | - Saptarshi Das
- Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, Pennsylvania16802, United States
- Department of Materials Science and Engineering, Pennsylvania State University, University Park, Pennsylvania16802, United States
- Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania16802, United States
- Department of Electrical Engineering and Computer Science, Pennsylvania State University, University Park, Pennsylvania16802, United States
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28
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Dodda A, Jayachandran D, Pannone A, Trainor N, Stepanoff SP, Steves MA, Radhakrishnan SS, Bachu S, Ordonez CW, Shallenberger JR, Redwing JM, Knappenberger KL, Wolfe DE, Das S. Active pixel sensor matrix based on monolayer MoS 2 phototransistor array. NATURE MATERIALS 2022; 21:1379-1387. [PMID: 36396961 DOI: 10.1038/s41563-022-01398-9] [Citation(s) in RCA: 33] [Impact Index Per Article: 16.5] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/14/2021] [Accepted: 10/06/2022] [Indexed: 06/16/2023]
Abstract
In-sensor processing, which can reduce the energy and hardware burden for many machine vision applications, is currently lacking in state-of-the-art active pixel sensor (APS) technology. Photosensitive and semiconducting two-dimensional (2D) materials can bridge this technology gap by integrating image capture (sense) and image processing (compute) capabilities in a single device. Here, we introduce a 2D APS technology based on a monolayer MoS2 phototransistor array, where each pixel uses a single programmable phototransistor, leading to a substantial reduction in footprint (900 pixels in ∼0.09 cm2) and energy consumption (100s of fJ per pixel). By exploiting gate-tunable persistent photoconductivity, we achieve a responsivity of ∼3.6 × 107 A W-1, specific detectivity of ∼5.6 × 1013 Jones, spectral uniformity, a high dynamic range of ∼80 dB and in-sensor de-noising capabilities. Further, we demonstrate near-ideal yield and uniformity in photoresponse across the 2D APS array.
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Affiliation(s)
- Akhil Dodda
- Engineering Science and Mechanics, Penn State University, University Park, PA, USA
| | - Darsith Jayachandran
- Engineering Science and Mechanics, Penn State University, University Park, PA, USA
| | - Andrew Pannone
- Engineering Science and Mechanics, Penn State University, University Park, PA, USA
| | - Nicholas Trainor
- Materials Science and Engineering, Penn State University, University Park, PA, USA
- Materials Research Institute, Penn State University, University Park, PA, USA
| | - Sergei P Stepanoff
- Materials Science and Engineering, Penn State University, University Park, PA, USA
| | - Megan A Steves
- Department of Chemistry, Penn State University, University Park, PA, USA
| | | | - Saiphaneendra Bachu
- Materials Science and Engineering, Penn State University, University Park, PA, USA
| | - Claudio W Ordonez
- Department of Chemistry, Penn State University, University Park, PA, USA
| | | | - Joan M Redwing
- Materials Science and Engineering, Penn State University, University Park, PA, USA
- Materials Research Institute, Penn State University, University Park, PA, USA
| | | | - Douglas E Wolfe
- Engineering Science and Mechanics, Penn State University, University Park, PA, USA
- Materials Science and Engineering, Penn State University, University Park, PA, USA
- Applied Research Laboratory, Penn State University, University Park, PA, USA
| | - Saptarshi Das
- Engineering Science and Mechanics, Penn State University, University Park, PA, USA.
- Materials Science and Engineering, Penn State University, University Park, PA, USA.
- Materials Research Institute, Penn State University, University Park, PA, USA.
- Applied Research Laboratory, Penn State University, University Park, PA, USA.
- Electrical Engineering and Computer Science, Penn State University, University Park, PA, USA.
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29
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Liu K, Wang X, Su H, Chen X, Wang D, Guo J, Shao L, Bao W, Chen H. Large-Scale MoS 2 Pixel Array for Imaging Sensor. NANOMATERIALS (BASEL, SWITZERLAND) 2022; 12:4118. [PMID: 36500741 PMCID: PMC9739261 DOI: 10.3390/nano12234118] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 10/28/2022] [Revised: 11/15/2022] [Accepted: 11/18/2022] [Indexed: 06/17/2023]
Abstract
Two-dimensional molybdenum disulfide (MoS2) has been extensively investigated in the field of optoelectronic devices. However, most reported MoS2 phototransistors are fabricated using the mechanical exfoliation method to obtain micro-scale MoS2 flakes, which is laboratory- feasible but not practical for the future industrial fabrication of large-scale pixel arrays. Recently, wafer-scale MoS2 growth has been rapidly developed, but few results of uniform large-scale photoelectric devices were reported. Here, we designed a 12 × 12 pixels pixel array image sensor fabricated on a 2 cm × 2 cm monolayer MoS2 film grown by chemical vapor deposition (CVD). The photogating effect induced by the formation of trap states ensures a high photoresponsivity of 364 AW-1, which is considerably superior to traditional CMOS sensors (≈0.1 AW-1). Experimental results also show highly uniform photoelectric properties in this array. Finally, the concatenated image obtained by laser lighting stencil and photolithography mask demonstrates the promising potential of 2D MoS2 for future optoelectrical applications.
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Affiliation(s)
- Kang Liu
- State Key Laboratory of ASIC and System, School of Microelectronics, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai 200433, China
| | - Xinyu Wang
- State Key Laboratory of ASIC and System, School of Microelectronics, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai 200433, China
| | - Hesheng Su
- State Key Laboratory of ASIC and System, School of Microelectronics, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai 200433, China
| | - Xinyu Chen
- State Key Laboratory of ASIC and System, School of Microelectronics, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai 200433, China
| | - Die Wang
- State Key Laboratory of ASIC and System, School of Microelectronics, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai 200433, China
| | - Jing Guo
- State Key Laboratory of ASIC and System, School of Microelectronics, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai 200433, China
| | - Lei Shao
- School of Electronic Information, Soochow University, Suzhou 215006, China
| | - Wenzhong Bao
- State Key Laboratory of ASIC and System, School of Microelectronics, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai 200433, China
| | - Honglei Chen
- Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
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30
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Chen Y, Li D, Ren H, Tang Y, Liang K, Wang Y, Li F, Song C, Guan J, Chen Z, Lu X, Xu G, Li W, Liu S, Zhu B. Highly Linear and Symmetric Synaptic Memtransistors Based on Polarization Switching in Two-Dimensional Ferroelectric Semiconductors. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2022; 18:e2203611. [PMID: 36156393 DOI: 10.1002/smll.202203611] [Citation(s) in RCA: 7] [Impact Index Per Article: 3.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/10/2022] [Revised: 09/01/2022] [Indexed: 06/16/2023]
Abstract
Brain-inspired neuromorphic computing hardware based on artificial synapses offers efficient solutions to perform computational tasks. However, the nonlinearity and asymmetry of synaptic weight updates in reported artificial synapses have impeded achieving high accuracy in neural networks. Here, this work develops a synaptic memtransistor based on polarization switching in a two-dimensional (2D) ferroelectric semiconductor (FES) of α-In2 Se3 for neuromorphic computing. The α-In2 Se3 memtransistor exhibits outstanding synaptic characteristics, including near-ideal linearity and symmetry and a large number of programmable conductance states, by taking the advantages of both memtransistor configuration and electrically configurable polarization states in the FES channel. As a result, the α-In2 Se3 memtransistor-type synapse reaches high accuracy of 97.76% for digit patterns recognition task in simulated artificial neural networks. This work opens new opportunities for using multiterminal FES memtransistors in advanced neuromorphic electronics.
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Affiliation(s)
- Yitong Chen
- School of Materials and Engineering, Zhejiang University, Hangzhou, 310027, China
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
| | - Dingwei Li
- School of Materials and Engineering, Zhejiang University, Hangzhou, 310027, China
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
| | - Huihui Ren
- School of Materials and Engineering, Zhejiang University, Hangzhou, 310027, China
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
| | - Yingjie Tang
- School of Materials and Engineering, Zhejiang University, Hangzhou, 310027, China
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
| | - Kun Liang
- School of Materials and Engineering, Zhejiang University, Hangzhou, 310027, China
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
| | - Yan Wang
- School of Materials and Engineering, Zhejiang University, Hangzhou, 310027, China
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
| | - Fanfan Li
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
| | - Chunyan Song
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
| | - Jiaqi Guan
- Instrumentation and Service Centre for Physical Sciences, Westlake University, Hangzhou, 310024, China
| | - Zhong Chen
- Instrumentation and Service Centre for Molecular Sciences, Westlake University, Hangzhou, 310024, China
| | - Xingyu Lu
- Instrumentation and Service Centre for Molecular Sciences, Westlake University, Hangzhou, 310024, China
| | - Guangwei Xu
- School of Microelectronics, University of Science and Technology of China, Hefei, 230026, China
| | - Wenbin Li
- Institute of Advanced Technology, Westlake Institute for Advanced Study, Hangzhou, 310024, China
| | - Shi Liu
- School of Science, Westlake University, Hangzhou, Zhejiang, 310024, China
| | - Bowen Zhu
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
- Institute of Advanced Technology, Westlake Institute for Advanced Study, Hangzhou, 310024, China
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Sebastian A, Pendurthi R, Kozhakhmetov A, Trainor N, Robinson JA, Redwing JM, Das S. Two-dimensional materials-based probabilistic synapses and reconfigurable neurons for measuring inference uncertainty using Bayesian neural networks. Nat Commun 2022; 13:6139. [PMID: 36253370 PMCID: PMC9576759 DOI: 10.1038/s41467-022-33699-7] [Citation(s) in RCA: 15] [Impact Index Per Article: 7.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/02/2022] [Accepted: 09/27/2022] [Indexed: 12/24/2022] Open
Abstract
Artificial neural networks have demonstrated superiority over traditional computing architectures in tasks such as pattern classification and learning. However, they do not measure uncertainty in predictions, and hence they can make wrong predictions with high confidence, which can be detrimental for many mission-critical applications. In contrast, Bayesian neural networks (BNNs) naturally include such uncertainty in their model, as the weights are represented by probability distributions (e.g. Gaussian distribution). Here we introduce three-terminal memtransistors based on two-dimensional (2D) materials, which can emulate both probabilistic synapses as well as reconfigurable neurons. The cycle-to-cycle variation in the programming of the 2D memtransistor is exploited to achieve Gaussian random number generator-based synapses, whereas 2D memtransistor based integrated circuits are used to obtain neurons with hyperbolic tangent and sigmoid activation functions. Finally, memtransistor-based synapses and neurons are combined in a crossbar array architecture to realize a BNN accelerator for a data classification task.
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Affiliation(s)
- Amritanand Sebastian
- grid.29857.310000 0001 2097 4281Deparment of Engineering Science and Mechanics, Penn State University, University Park, PA 16802 USA
| | - Rahul Pendurthi
- grid.29857.310000 0001 2097 4281Deparment of Engineering Science and Mechanics, Penn State University, University Park, PA 16802 USA
| | - Azimkhan Kozhakhmetov
- grid.29857.310000 0001 2097 4281Department of Materials Science and Engineering, Penn State University, University Park, PA 16802 USA
| | - Nicholas Trainor
- grid.29857.310000 0001 2097 4281Department of Materials Science and Engineering, Penn State University, University Park, PA 16802 USA ,grid.29857.310000 0001 2097 42812D Crystal Consortium Materials Innovation Platform, Penn State University, University Park, PA 16802 USA
| | - Joshua A. Robinson
- grid.29857.310000 0001 2097 4281Department of Materials Science and Engineering, Penn State University, University Park, PA 16802 USA ,grid.29857.310000 0001 2097 4281Department of Chemistry, Penn State University, University Park, PA USA ,grid.29857.310000 0001 2097 4281Department of Physics, Penn State University, University Park, PA USA
| | - Joan M. Redwing
- grid.29857.310000 0001 2097 4281Department of Materials Science and Engineering, Penn State University, University Park, PA 16802 USA ,grid.29857.310000 0001 2097 42812D Crystal Consortium Materials Innovation Platform, Penn State University, University Park, PA 16802 USA ,grid.29857.310000 0001 2097 4281Department of Electrical Engineering and Computer Science, Penn State University, University Park, PA USA
| | - Saptarshi Das
- grid.29857.310000 0001 2097 4281Deparment of Engineering Science and Mechanics, Penn State University, University Park, PA 16802 USA ,grid.29857.310000 0001 2097 4281Department of Materials Science and Engineering, Penn State University, University Park, PA 16802 USA ,grid.29857.310000 0001 2097 4281Department of Electrical Engineering and Computer Science, Penn State University, University Park, PA USA
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Zheng Y, Ravichandran H, Schranghamer TF, Trainor N, Redwing JM, Das S. Hardware implementation of Bayesian network based on two-dimensional memtransistors. Nat Commun 2022; 13:5578. [PMID: 36151079 PMCID: PMC9508127 DOI: 10.1038/s41467-022-33053-x] [Citation(s) in RCA: 19] [Impact Index Per Article: 9.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/13/2022] [Accepted: 08/31/2022] [Indexed: 11/30/2022] Open
Abstract
Bayesian networks (BNs) find widespread application in many real-world probabilistic problems including diagnostics, forecasting, computer vision, etc. The basic computing primitive for BNs is a stochastic bit (s-bit) generator that can control the probability of obtaining ‘1’ in a binary bit-stream. While silicon-based complementary metal-oxide-semiconductor (CMOS) technology can be used for hardware implementation of BNs, the lack of inherent stochasticity makes it area and energy inefficient. On the other hand, memristors and spintronic devices offer inherent stochasticity but lack computing ability beyond simple vector matrix multiplication due to their two-terminal nature and rely on extensive CMOS peripherals for BN implementation, which limits area and energy efficiency. Here, we circumvent these challenges by introducing a hardware platform based on 2D memtransistors. First, we experimentally demonstrate a low-power and compact s-bit generator circuit that exploits cycle-to-cycle fluctuation in the post-programmed conductance state of 2D memtransistors. Next, the s-bit generators are monolithically integrated with 2D memtransistor-based logic gates to implement BNs. Our findings highlight the potential for 2D memtransistor-based integrated circuits for non-von Neumann computing applications. Bayesian networks are applied to resolve several types of probabilistic problems. Here, Das et al. develop a stochastic computing hardware platform using two-dimensional memtransistors for the implementation of Bayesian network with high accuracy.
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Affiliation(s)
- Yikai Zheng
- Engineering Science and Mechanics, Penn State University, University Park, 16802, PA, USA
| | | | - Thomas F Schranghamer
- Engineering Science and Mechanics, Penn State University, University Park, 16802, PA, USA
| | - Nicholas Trainor
- Materials Science and Engineering, Penn State University, University Park, 16802, PA, USA.,Materials Research Institute, Penn State University, University Park, 16802, PA, USA
| | - Joan M Redwing
- Materials Science and Engineering, Penn State University, University Park, 16802, PA, USA.,Materials Research Institute, Penn State University, University Park, 16802, PA, USA
| | - Saptarshi Das
- Engineering Science and Mechanics, Penn State University, University Park, 16802, PA, USA. .,Materials Science and Engineering, Penn State University, University Park, 16802, PA, USA. .,Materials Research Institute, Penn State University, University Park, 16802, PA, USA. .,Electrical Engineering and Computer Science, Penn State University, University Park, 16802, PA, USA.
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Pendurthi R, Jayachandran D, Kozhakhmetov A, Trainor N, Robinson JA, Redwing JM, Das S. Heterogeneous Integration of Atomically Thin Semiconductors for Non-von Neumann CMOS. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2022; 18:e2202590. [PMID: 35843869 DOI: 10.1002/smll.202202590] [Citation(s) in RCA: 20] [Impact Index Per Article: 10.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/28/2022] [Revised: 06/21/2022] [Indexed: 06/15/2023]
Abstract
Atomically thin, 2D, and semiconducting transition metal dichalcogenides (TMDs) are seen as potential candidates for complementary metal oxide semiconductor (CMOS) technology in future nodes. While high-performance field effect transistors (FETs), logic gates, and integrated circuits (ICs) made from n-type TMDs such as MoS2 and WS2 grown at wafer scale have been demonstrated, realizing CMOS electronics necessitates integration of large area p-type semiconductors. Furthermore, the physical separation of memory and logic is a bottleneck of the existing CMOS technology and must be overcome to reduce the energy burden for computation. In this article, the existing limitations are overcome and for the first time, a heterogeneous integration of large area grown n-type MoS2 and p-type vanadium doped WSe2 FETs with non-volatile and analog memory storage capabilities to achieve a non-von Neumann 2D CMOS platform is introduced. This manufacturing process flow allows for precise positioning of n-type and p-type FETs, which is critical for any IC development. Inverters and a simplified 2-input-1-output multiplexers and neuromorphic computing primitives such as Gaussian, sigmoid, and tanh activation functions using this non-von Neumann 2D CMOS platform are also demonstrated. This demonstration shows the feasibility of heterogeneous integration of wafer scale 2D materials.
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Affiliation(s)
- Rahul Pendurthi
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
| | - Darsith Jayachandran
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
| | - Azimkhan Kozhakhmetov
- Materials Science and Engineering, Penn State University, University Park, PA, 16802, USA
| | - Nicholas Trainor
- Materials Science and Engineering, Penn State University, University Park, PA, 16802, USA
- 2D Crystal Consortium - Materials Innovation Platform (2DCC-MIP) Materials Research Institute, Penn State University, University Park, PA, 16802, USA
| | - Joshua A Robinson
- Materials Science and Engineering, Penn State University, University Park, PA, 16802, USA
- 2D Crystal Consortium - Materials Innovation Platform (2DCC-MIP) Materials Research Institute, Penn State University, University Park, PA, 16802, USA
| | - Joan M Redwing
- Materials Science and Engineering, Penn State University, University Park, PA, 16802, USA
- 2D Crystal Consortium - Materials Innovation Platform (2DCC-MIP) Materials Research Institute, Penn State University, University Park, PA, 16802, USA
| | - Saptarshi Das
- Engineering Science and Mechanics, Penn State University, University Park, PA, 16802, USA
- Materials Science and Engineering, Penn State University, University Park, PA, 16802, USA
- 2D Crystal Consortium - Materials Innovation Platform (2DCC-MIP) Materials Research Institute, Penn State University, University Park, PA, 16802, USA
- Electrical Engineering and Computer Science, Penn State University, University Park, PA, 16802, USA
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