Peel-and-stick: fabricating thin film solar cell on universal substrates

Motion Sensing by a Highly Sensitive Nanogold Strain Sensor in a Biomimetic 3D Environment

Recent advancements in flexible electronics have highlighted their potential in biomedical applications, primarily due to their human-friendly nature. This study introduces a new flexible electronic system designed for motion sensing in a biomimetic three-dimensional (3D) environment. The system features a self-healing gel matrix (chitosan-based hydrogel) that effectively mimics the dynamics of the extracellular matrix (ECM), and is integrated with a highly sensitive thin-film resistive strain sensor, which is fabricated by incorporating a cross-linked gold nanoparticle (GNP) thin film as the active conductive layer onto a biocompatible microphase-separated polyurethane (PU) substrate through a clean, rapid, and high-precision contact printing method. The GNP-PU strain sensor demonstrates high sensitivity (a gauge factor of ∼50), good stability, and waterproofing properties. The feasibility of detecting small motion was evaluated by sensing the beating of human induced pluripotent stem cell (hiPSC)-derived cardiomyocyte spheroids embedded in the gel matrix. The integration of these components exemplifies a proof-of-concept for using flexible electronics comprising self-healing hydrogel and thin-film nanogold in cardiac sensing and offers promising insights into the development of next-generation biomimetic flexible electronic devices.

Advances in Smart Photovoltaic Textiles

Energy harvesting textiles have emerged as a promising solution to sustainably power wearable electronics. Textile-based solar cells (SCs) interconnected with on-body electronics have emerged to meet such needs. These technologies are lightweight, flexible, and easy to transport while leveraging the abundant natural sunlight in an eco-friendly way. In this Review, we comprehensively explore the working mechanisms, diverse types, and advanced fabrication strategies of photovoltaic textiles. Furthermore, we provide a detailed analysis of the recent progress made in various types of photovoltaic textiles, emphasizing their electrochemical performance. The focal point of this review centers on smart photovoltaic textiles for wearable electronic applications. Finally, we offer insights and perspectives on potential solutions to overcome the existing limitations of textile-based photovoltaics to promote their industrial commercialization.

Fabrication of Eco-Friendly Wearable Strain Sensor Arrays via Facile Contact Printing for Healthcare Applications

Wearable flexible strain sensors with spatial resolution enable the acquisition and analysis of complex actions for noninvasive personalized healthcare applications. To provide secure contact with skin and to avoid environmental pollution after usage, sensors with biocompatibility and biodegradability are highly desirable. Herein, wearable flexible strain sensors composed of crosslinked gold nanoparticle (GNP) thin films as the active conductive layer and transparent biodegradable polyurethane (PU) films as the flexible substrate are developed. The patterned GNP films (micrometer- to millimeter-scale square and rectangle geometry, alphabetic characters, and wave and array patterns) are transferred onto the biodegradable PU film via a facile, clean, rapid and high-precision contact printing method, without the need of a sacrificial polymer carrier or organic solvents. The GNP-PU strain sensor with low Young's modulus (≈17.8 MPa) and high stretchability showed good stability and durability (10 000 cycles) as well as degradability (42% weight loss after 17 days at 74 °C in water). The GNP-PU strain sensor arrays with spatiotemporal strain resolution are applied as wearable eco-friendly electronics for monitoring subtle physiological signals (e.g., mapping of arterial lines and sensing pulse waveforms) and large-strain actions (e.g., finger bending).

Overview of the Current State of Flexible Solar Panels and Photovoltaic Materials

The rapid growth and evolution of solar panel technology have been driven by continuous advancements in materials science. This review paper provides a comprehensive overview of the diverse range of materials employed in modern solar panels, elucidating their roles, properties, and contributions to overall performance. The discussion encompasses both traditional crystalline silicon-based panels and emerging thin-film technologies. A detailed examination of photovoltaic materials, including monocrystalline and polycrystalline silicon as well as alternative materials such as cadmium telluride (CdTe), copper indium gallium selenide (CIGS), and emerging perovskite solar cells, is presented. Furthermore, the impact of transparent conductive materials, encapsulation polymers, and antireflective coatings on solar panel efficiency and durability is explored. The review delves into the synergistic interplay between material properties, manufacturing processes, and environmental considerations. Through a comprehensive survey of materials utilized in modern solar panels, this paper provides insights into the current state of the field, highlighting avenues for future advancements and sustainable solar energy solutions.

An Aerial-Wall Robotic Insect That Can Land, Climb, and Take Off from Vertical Surfaces

Insects that can perform flapping-wing flight, climb on a wall, and switch smoothly between the 2 locomotion regimes provide us with excellent biomimetic models. However, very few biomimetic robots can perform complex locomotion tasks that combine the 2 abilities of climbing and flying. Here, we describe an aerial-wall amphibious robot that is self-contained for flying and climbing, and that can seamlessly move between the air and wall. It adopts a flapping/rotor hybrid power layout, which realizes not only efficient and controllable flight in the air but also attachment to, and climbing on, the vertical wall through a synergistic combination of the aerodynamic negative pressure adsorption of the rotor power and a climbing mechanism with bionic adhesion performance. On the basis of the attachment mechanism of insect foot pads, the prepared biomimetic adhesive materials of the robot can be applied to various types of wall surfaces to achieve stable climbing. The longitudinal axis layout design of the rotor dynamics and control strategy realize a unique cross-domain movement during the flying-climbing transition, which has important implications in understanding the takeoff and landing of insects. Moreover, it enables the robot to cross the air-wall boundary in 0.4 s (landing), and cross the wall-air boundary in 0.7 s (taking off). The aerial-wall amphibious robot expands the working space of traditional flying and climbing robots, which can pave the way for future robots that can perform autonomous visual monitoring, human search and rescue, and tracking tasks in complex air-wall environments.

Fabrication of a 100 × 100 mm2 nanometer-thick graphite pellicle for extreme ultraviolet lithography by a peel-off and camphor-supported transfer approach

An extreme ultraviolet (EUV) lithography pellicle is used to physically protect a mask from contaminants during the EUV exposure process and needs to have a high EUV transmittance. The EUV pellicle should be fabricated using a freestanding thin film with several tens of nanometer thickness in an area of 110 × 142 mm², which is a challenging task. Here, we propose a peel-off approach to directly detach the nanometer-thick graphite film (NGF)/Ni film from SiO₂/Si wafer and significantly shorten the etching time of the Ni film. Combined with the residue-damage-free transfer method that used camphor as a supporting layer, we successfully fabricated a large-area (100 × 100 mm²) NGF pellicle with a thickness of ∼20 nm, and an EUV transmittance of ∼87.2%.

Silicon-Based Technologies for Flexible Photovoltaic (PV) Devices: From Basic Mechanism to Manufacturing Technologies

Over the past few decades, silicon-based solar cells have been used in the photovoltaic (PV) industry because of the abundance of silicon material and the mature fabrication process. However, as more electrical devices with wearable and portable functions are required, silicon-based PV solar cells have been developed to create solar cells that are flexible, lightweight, and thin. Unlike flexible PV systems (inorganic and organic), the drawbacks of silicon-based solar cells are that they are difficult to fabricate as flexible solar cells. However, new technologies have emerged for flexible solar cells with silicon. In this paper, we describe the basic energy-conversion mechanism from light and introduce various silicon-based manufacturing technologies for flexible solar cells. In addition, for high energy-conversion efficiency, we deal with various technologies (process, structure, and materials).

State of the Art of Telecommunication Systems in Isolated and Constrained Areas

Smart objects are deployed globally, contributing to improved communications and the growth of industrial systems' performances. Unfortunately, isolated territories are generally excluded from this progress. Remote areas in Canada are no exception. Thus, about two hundred thousand people are living in isolated regions in Canadian territory. The development of these communities is slowed down not only by an outdated energy supply, but they are also dependent on telecommunication systems not fully deployed in those regions, thus contributing to the amplification of those populations' isolation. Furthermore, the magnetic field in some regions of the planet and very often in isolated areas undergoes partial or total absorption, known as white areas, making the propagation of the signal very delicate. As a part of this article, a state of the art of telecommunication solutions available in an isolated environment is applied with a critical analysis based on several criteria. It shows the ability to use an original approach based on a captive balloon. Despite the proposed solution's feasibility, several challenges need to be addressed before formally adopting it. These challenges include: (i) controlling the height of the balloon; (ii) stabilization of the balloon; and (iii) powering the system. The list of references given at the end of the paper should offer aids for the industry and for researchers working in this field.

Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review

Hetero-integration of functional semiconductor layers and devices has received strong research interest from both academia and industry. While conventional techniques such as pick-and-place and wafer bonding can partially address this challenge, a variety of new layer transfer and chip-scale transfer technologies have been developed. In this review, we summarize such transfer techniques for heterogeneous integration of ultrathin semiconductor layers or chips to a receiving substrate for many applications, such as microdisplays and flexible electronics. We showed that a wide range of materials, devices, and systems with expanded functionalities and improved performance can be demonstrated by using these technologies. Finally, we give a detailed analysis of the advantages and disadvantages of these techniques, and discuss the future research directions of layer transfer and chip transfer techniques.

Printing Flexible and Hybrid Electronics for Human Skin and Eye-Interfaced Health Monitoring Systems

Advances in printing materials and techniques for flexible and hybrid electronics in the domain of connected healthcare have enabled rapid development of innovative body-interfaced health monitoring systems at a tremendous pace. Thin, flexible, and stretchable biosensors that are printed on a biocompatible soft substrate provide the ability to noninvasively and unobtrusively integrate with the human body for continuous monitoring and early detection of diseases and other conditions affecting health and well being. Hybrid integration of such biosensors with extremely well-established silicon-based microcircuit chips offers a viable route for in-sensor data processing and wireless transmission in many medical and clinical settings. Here, a set of advanced and hybrid printing techniques is summarized, covering diverse aspects ranging from active electronic materials to process capability, for their use in human skin and eye-interfaced health monitoring systems with different levels of complexity. Essential components of the devices, including constituent biomaterials, structural layouts, assembly methods, and power and data processing configurations, are outlined and discussed in a categorized manner tailored to specific clinical needs. Perspectives on the benefits and challenges of these systems in basic and applied biomedical research are presented and discussed.

Transfer Printing and its Applications in Flexible Electronic Devices

Flexible electronic systems have received increasing attention in the past few decades because of their wide-ranging applications that include the flexible display, eyelike digital camera, skin electronics, and intelligent surgical gloves, among many other health monitoring devices. As one of the most widely used technologies to integrate rigid functional devices with elastomeric substrates for the manufacturing of flexible electronic devices, transfer printing technology has been extensively studied. Though primarily relying on reversible interfacial adhesion, a variety of advanced transfer printing methods have been proposed and demonstrated. In this review, we first summarize the characteristics of a few representative methods of transfer printing. Next, we will introduce successful demonstrations of each method in flexible electronic devices. Moreover, the potential challenges and future development opportunities for transfer printing will then be briefly discussed.

Water-Assisted Transfer Patterning of Nanomaterials

We introduce a straightforward and cost-effective water-assisted approach to transfer patterns of nanomaterials onto diverse substrates. The transfer method relies on the hydrophobic effect and utilizes a water-soluble polymer film as a carrier to transfer hydrophobic nanomaterials from a patterned source substrate onto a target substrate. Using this approach, nanomaterials are transferred readily from solutions onto surfaces of various shapes and compositions with high fidelity for feature sizes approaching 10 microns.

Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics

Transfer printing of thin-film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice of wafer but is also limited by defects with a low yield. Here, we introduce a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics from their fabrication wafer in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature. The physically liberated thin-film nanoelectronics can be then pasted onto arbitrary places of interest, thereby endowing the particular surface with desirable add-on electronic features. Systematic experimental, theoretical, and computational studies reveal the underlying mechanics mechanism and guide manufacturability for the transfer printing process in terms of scalability, controllability, and reproducibility.

Charge Transfer from Carbon Nanotubes to Silicon in Flexible Carbon Nanotube/Silicon Solar Cells

Mechanical fragility and insufficient light absorption are two major challenges for thin flexible crystalline Si-based solar cells. Flexible hybrid single-walled carbon nanotube (SWNT)/Si solar cells are demonstrated by applying scalable room-temperature processes for the fabrication of solar-cell components (e.g., preparation of SWNT thin films and SWNT/Si p-n junctions). The flexible SWNT/Si solar cells present an intrinsic efficiency ≈7.5% without any additional light-trapping structures. By using these solar cells as model systems, the charge transport mechanisms at the SWNT/Si interface are investigated using femtosecond transient absorption. Although primary photon absorption occurs in Si, transient absorption measurements show that SWNTs also generate and inject excited charge carriers to Si. Such effects can be tuned by controlling the thickness of the SWNTs. Findings from this study could open a new pathway for designing and improving the efficiency of photocarrier generation and absorption for high-performance ultrathin hybrid SWNT/Si solar cells.

Combining light-harvesting with detachability in high-efficiency thin-film silicon solar cells

Efforts to realize thin-film solar cells on unconventional substrates face several obstacles in achieving good energy-conversion efficiency and integrating light-management into the solar cell design. In this report a technique to circumvent these obstacles is presented: transferability and an efficient light-harvesting scheme are combined for thin-film silicon solar cells by the incorporation of a NaCl layer. Amorphous silicon solar cells in p-i-n configuration are fabricated on reusable glass substrates coated with an interlayer of NaCl. Subsequently, the solar cells are detached from the substrate by dissolution of the sacrificial NaCl layer in water and then transferred onto a plastic sheet, with a resultant post-transfer efficiency of 9%. The light-trapping effect of the surface nanotextures originating from the NaCl layer on the overlying solar cell is studied theoretically and experimentally. The enhanced light absorption in the solar cells on NaCl-coated substrates leads to significant improvement in the photocurrent and energy-conversion efficiency in solar cells with both 350 and 100 nm thick absorber layers, compared to flat-substrate solar cells. Efficient transferable thin-film solar cells hold a vast potential for widespread deployment of off-grid photovoltaics and cost reduction.

Optimally Functionalized Adhesion for Contact Transfer Printing of Plasmonic Nanostructures on Flexible Substrate

This paper demonstrates a facile method to achieve high yield and uniform fabrication for the transfer printing of nanoplasmonic structures on a flexible substrate by providing novel understanding on adhesion layers. The mercapto alkyl carboxylic acids and the alkyl dithiols are used as functionalized adhesion layers and further optimized by controlling the terminal group as well as the length and composition of the functionalization on flat and nanostructured gold surfaces. Our approach of optimized adhesion has been successfully implemented to the transfer printing of functionalized gold nanostructure arrays, thus producing much higher yield of 97.6% and uniform fabrication of nanostructures on a flexible substrate and enabling applications such as flexible nanoplasmonic devices and biosensing platforms.

Mechanically Reinforced Skin-Electronics with Networked Nanocomposite Elastomer

Mechanically reinforced skin-electronics are presented by exploiting networked nanocomposite elastomers where high quality metal nanowires serve as conducting paths. Theoretical and experimental studies show that the established skin-electronics exhibit superior mechanical enhancements against crack and delamination phenomena. Device applications include a class of biomedical devices that offers the ability of thermotherapeutic stimulation and electrophysiological monitoring, all via the skin.

Flexible Lamination-Fabricated Ultra-High Frequency Diodes Based on Self-Supporting Semiconducting Composite Film of Silicon Micro-Particles and Nano-Fibrillated Cellulose

Low cost and flexible devices such as wearable electronics, e-labels and distributed sensors will make the future "internet of things" viable. To power and communicate with such systems, high frequency rectifiers are crucial components. We present a simple method to manufacture flexible diodes, operating at GHz frequencies, based on self-adhesive composite films of silicon micro-particles (Si-μPs) and glycerol dispersed in nanofibrillated cellulose (NFC). NFC, Si-μPs and glycerol are mixed in a water suspension, forming a self-supporting nanocellulose-silicon composite film after drying. This film is cut and laminated between a flexible pre-patterned Al bottom electrode and a conductive Ni-coated carbon tape top contact. A Schottky junction is established between the Al electrode and the Si-μPs. The resulting flexible diodes show current levels on the order of mA for an area of 2 mm(2), a current rectification ratio up to 4 × 10(3) between 1 and 2 V bias and a cut-off frequency of 1.8 GHz. Energy harvesting experiments have been demonstrated using resistors as the load at 900 MHz and 1.8 GHz. The diode stack can be delaminated away from the Al electrode and then later on be transferred and reconfigured to another substrate. This provides us with reconfigurable GHz-operating diode circuits.

A facile chemical-mechanical polishing lift-off transfer process toward large scale Cu(In,Ga)Se2 thin-film solar cells on arbitrary substrates

The fabrication of Cu(In,Ga)Se2 (CIGS) solar cells on flexible substrates is a non-trivial task due to thermal and ion diffusion related issues. In order to circumvent these issues, we have developed a chemical-mechanical polishing lift-off (CMPL) transfer process, enabling the direct transfer of CIGS solar cells from conventional soda-lime glass (SLG) onto arbitrary flexible substrates up to 4 cm(2) in size. The structural and compositional nature of the pre- and post-transferred films is examined using electron microscopy, X-ray diffraction analysis, Raman and photoluminescence spectroscopy. We demonstrate the fabrication of solar cells on a range of flexible substrates while being able to maintain 75% cell efficiency (η) when compared to pre-transferred solar cells. The results obtained in this work suggest that our transfer process offers a highly promising approach toward large scale fabrication of CIGS-based solar cells on a wide variety of flexible substrates, suitable for use in the large scale CIGS photovoltaic industry.

A forest of SiO2 nanowires covered by a TiO2 thin film for an efficient photocatalytic water treatment

Disordered TiO₂/SiO₂ nanowires possess enhanced photocatalytic activity due to the synergy of morphology and light trapping properties of the NW forest.

Large-Scale Nanophotonic Solar Selective Absorbers for High-Efficiency Solar Thermal Energy Conversion

An omnidirectional nanophotonic solar selective absorber is fabricated on a large scale using a template-stripping method. The nanopyramid nickel structure achieves an average absorptance of 95% at a wavelength range below 1.3 μm and a low emittance less than 10% at wavelength >2.5 μm.

Completely transparent conducting oxide-free and flexible dye-sensitized solar cells fabricated on plastic substrates

To achieve commercialization and widespread application of next-generation photovoltaics, it is important to develop flexible and cost-effective devices. Given this, the elimination of expensive transparent conducting oxides (TCO) and replacement of conventional glass substrates with flexible plastic substrates presents a viable strategy to realize extremely low-cost photovoltaics with a potentially wide applicability. To this end, we report a completely TCO-free and flexible dye-sensitized solar cell (DSSC) fabricated on a plastic substrate using a unique transfer method and back-contact architecture. By adopting unique transfer techniques, the working and counter electrodes were fabricated by transferring high-temperature-annealed TiO2 and Pt/carbon films, respectively, onto flexible plastic substrates without any exfoliation. The fabricated working electrode with the conventional counter electrode exhibited a record efficiency for flexible DSSCs of 8.10%, despite its TCO-free structure. In addition, the completely TCO-free and flexible DSSC exhibited a remarkable efficiency of 7.27%. Furthermore, by using an organic hole-transporting material (spiro-MeOTAD) with the same transfer method, solid-state flexible TCO-free DSSCs were also successfully fabricated, yielding a promising efficiency of 3.36%.

Transfer printing methods for flexible thin film solar cells: basic concepts and working principles

Fabricating thin film solar cells (TFSCs) on flexible substrates will not only broaden the applications of solar cells, but also potentially reduce the installation cost. However, a critical challenge for fabricating flexible TFSCs on flexible substrates is the incompatibility issues between the thermal, mechanical, and chemical properties of these substrates and the fabrication conditions. Transfer printing methods, which use conventional substrates for the fabrication and then deliver the TFSCs onto flexible substrates, play a key role to overcome these challenges. In this review, we discuss the basic concepts and working principles of four major transfer printing methods associated with (1) transfer by sacrificial layers, (2) transfer by porous Si layer, (3) transfer by controlled crack, and (4) transfer by water-assisted thin film delamination. We also discuss the challenges and opportunities for implementing these methods for practical solar cell manufacture.

A universal, rapid method for clean transfer of nanostructures onto various substrates

Transfer and integration of nanostructures onto target substrates is the prerequisite for their fundamental studies and practical applications. Conventional transfer techniques that involve stamping, lift-off, and/or striping suffer from the process-specific drawbacks, such as the requirement for chemical etchant or high-temperature annealing and the introduction of surface discontinuities and/or contaminations that can greatly hinder the properties and functions of the transferred materials. Herein, we report a universal and rapid transfer method implementable at mild conditions. Nanostructures with various dimensionalities (i.e., nanoparticles, nanowires, and nanosheets) and surface properties (i.e., hydrophilic and hydrophobic) can be easily transferred to diverse substrates including hydrophilic, hydrophobic, and flexible surfaces with good fidelity. Importantly, our method ensures the rapid and clean transfer of two-dimensional materials and allows for the facile fabrication of vertical heterostructures with various compositions used for electronic devices. We believe that our method can facilitate the development of nanoelectronics by accelerating the clean transfer and integration of low-dimensional materials into multidimensional structures.

Peel-and-stick: mechanism study for efficient fabrication of flexible/transparent thin-film electronics

Peel-and-stick process, or water-assisted transfer printing (WTP), represents an emerging process for transferring fully fabricated thin-film electronic devices with high yield and fidelity from a SiO2/Si wafer to various non-Si based substrates, including papers, plastics and polymers. This study illustrates that the fundamental working principle of the peel-and-stick process is based on the water-assisted subcritical debonding, for which water reduces the critical adhesion energy of metal-SiO2 interface by 70 ~ 80%, leading to clean and high quality transfer of thin-film electronic devices. Water-assisted subcritical debonding is applicable for a range of metal-SiO2 interfaces, enabling the peel-and-stick process as a general and tunable method for fabricating flexible/transparent thin-film electronic devices.

Novel planar-structure electrochemical devices for highly flexible semitransparent power generation/storage sources

Flexible and transparent power sources are highly desirable in realizing next-generation all-in-one bendable, implantable, and wearable electronic systems. The developed power sources are either flexible but opaque or semitransparent but lack of flexibility. Therefore, there is increasing recognition of the need for a new concept of electrochemical device structure design that allows both high flexibility and transparency. In this paper, we present a new concept for electrochemical device design--a two-dimensional planar comb-teeth architecture on PET substrate--to achieve both high mechanical flexibility and light transparency. Two types of prototypes--dye-sensitized solar cells and supercapacitors--have been fabricated as planar devices and demonstrated excellent device performance, such as good light transparency, excellent flexibility, outstanding multiple large bending tolerance, light weight, effective prevention of short circuits during bending, and high device integration with up-date microelectronics, compared to conventional sandwich structure devices. Our planar design provides an attractive strategy toward the development of flexible, semitransparent electrochemical devices for fully all-in-one elegant and wearable energy management.