Improving the toughness of thermosetting epoxy resins via blending triblock copolymers

Next-Generation Structural Adhesives Composed of Epoxy Resins and Hydrogen-Bonded Styrenic Block Polymer-Based Thermoplastic Elastomers

Structural adhesives are currently applied in the assembly of automobiles, aircraft, and buildings. In particular, epoxy adhesives are widely used due to their excellent mechanical strength and durability. However, cured epoxy resins are typically rigid and inflexible; thus, they have low peel and impact strength. In this study, tough cured epoxy adhesives were developed by mixing a liquid epoxy prepolymer (EP) and polystyrene-b-polyisoprene-b-polystyrene (SIS). SIS is a block polymer-based thermoplastic elastomer (TPE) composed of polystyrene (S) soluble in liquid EP and polyisoprene (I) insoluble in liquid EP, where S and I have a glass transition temperature that is higher and lower than room temperature, respectively. In addition, cured adhesives tougher than the cured adhesives containing SIS were prepared by mixing liquid EP and SIS with hydrogen-bonding groups in the I block (h-SIS). Transmission electron microscopy (TEM) observations revealed mixed S/cured EP domains, with a d-spacing of several tens of nanometers, and cured EP domains, with diameters of one hundred to several hundred nanometers, that were macroscopically dispersed in the I or hydrogen-bonded I matrix of the cured adhesive containing SIS or h-SIS. The lap shear, peel, and impact strength of cured neat EP (EP*) were 23 MPa, 45 N/25 mm, and 0.62 kN/m, respectively. Meanwhile, the cured adhesive containing 16.5 wt % SIS exhibited the slightly lower lap shear strength of 17 MPa compared to that of cured EP*, whereas the peel and impact strength of the cured adhesive with SIS were 61 N/25 mm and 7.1 kN/m, respectively, both higher than those of EP*. Furthermore, the lap shear strength of the cured adhesive containing 15.5 wt % h-SIS was 21 MPa, which was similar to that of cured EP*. The cured adhesive with h-SIS also exhibited an excellent peel strength of 97 N/25 mm and an impact strength of 14 kN/m which was 22 times higher than that of cured EP*. Therefore, mixing liquid EP and SIS improved the cured adhesive properties and flexibility of the cured epoxy adhesives compared to the cured adhesive composed of neat EP, and further enhancement of the adhesive properties was achieved by mixing liquid EP and h-SIS with hydrogen-bonding groups instead of mixing with SIS.

Effects of Block Copolymer Terminal Groups on Toughening Epoxy-Based Composites: Microstructures and Toughening Mechanisms

Despite the considerable research attention paid to block copolymer (BCP)-toughened epoxy resins, the effects of their terminal groups on their phase structure are not thoroughly understood. This study fills this gap by closely examining the effects of amino and carboxyl groups on the fracture toughness of epoxy resins at different temperatures. Through the combination of scanning electron microscopy and digital image correlation (DIC), it was found that the amino-terminated BCP was capable of forming a stress-distributing network in pure epoxy resin, resulting in better toughening effects at room temperature. In a 60 wt.% silica-filled epoxy composite system, the addition of a carboxyl-terminated BCP showed little toughening effect due to the weaker filler/matrix interface caused by the random dispersion of the microphase of BCPs and distributed silica. The fracture toughness of the epoxy system at high temperatures was not affected by the terminal groups, regardless of the addition of silica. Their dynamic mechanical properties and thermal expansion coefficients are also reported in this article.

Fabrication and characterization of microfluidic devices based on boron-modified epoxy resin using CO2 laser ablation for bio-analytical applications

CO2 laser ablation is a rapid and precise technique for machining microfluidic devices. And also, low-cost epoxy resin (ER) proved the great feasibility of fabricating these devices using the CO2 laser ablation technique in our previous studies. However, such a technique has shown negative impacts on such ER-based microfluidics as rough surface microchannels, and thermal defects. Therefore, incorporating different proportions of boric acid (BA) into epoxy resin formulation was proposed to obviate the genesis of these drawbacks in ER-based microfluidics. The structural and optical properties of plain ER- and B-doped ER-based chips were characterized by Fourier transform infrared (FT-IR) and UV/Vis spectral analyses. Furthermore, their thermal properties were studied by thermo-gravimetric (TGA) and differential scanning calorimetric (DSC) analysis. A CO2 laser ablation machine was used in vector mode to draw the designed micro-channel pattern onto plain ER- and B-doped ER-based chips. The quality of microchannels engraved onto these chips was assessed using 3D laser microscopy. This microscopic examination showed a noticeable reduction in the surface roughness and negligible bulge heights in the laser-ablated micro-channels. On the other hand, overall and specific migration using gravimetric methods and gas chromatography-mass spectrometry (GC-MS), respectively, and PCR compatibility test were performed to explore the convenience of these micro-plates for the biological reactions. These findings validated the applicability of B-doped ER-based microfluidics in bio-analytical applications as a result of the effective role of boric acid in enhancing the thermal properties of these chips leading to get micro-channels with higher quality with no effect on the biological reactions.

Improvements in Temperature Uniformity in Carbon Fiber Composites during Microwave-Curing Processes via a Recently Developed Microwave Equipped with a Three-Dimensional Motion System

Curing processes for carbon-fiber-reinforced polymer composites via microwave heating are promising alternatives to conventional thermal curing because this technology results in nonhomogeneous temperature distributions, which hinder its further development in industries. This paper proposes a novel method for improving heating homogeneities by employing three-dimensional motion with respect to the prepreg laminate used in the microwave field by using a recently developed microwave system. The maximum temperature deviation on the surface of the laminate can be controlled within 8.7 °C during the entire curing process, and it produces an average heating rate of 1.42 °C/min. The FT-IR analyses indicate that microwave heating would slightly influence hydroxyl and methylene contents in the cured laminate. The DMA measurements demonstrate that the glass transition temperatures can be improved by applying proper microwave-curing processes. Optical microscopy and mechanical tests reveal that curing the prepreg laminate by using a multistep curing process that initially cures the laminate at the resin's lowest viscosity for 10 min followed by curing the laminate at a high temperature for a short period of time would be favorable for yielding a sample with low void contents and the desired mechanical properties. All these analyses are supposed to prove the feasibility of controlling the temperature difference during microwave-curing processes within a reasonable range and provide a cured laminate with improved properties compared with conventional thermally cured products.

Thermomechanical Properties and Fracture Toughness Improvement of Thermosetting Vinyl Ester Using Liquid Metal and Graphene Nanoplatelets

In this study, a eutectic gallium-indium (EGaIn) alloy and graphene nanoplatelets (GnPs) were employed as reinforcements for a comonomer vinyl ester (cVE) resin at different weight fractions up to 2% via a direct polymerization process. First, the effect of EGaIn on the curing kinetics of cVE was evaluated. The thermal and mechanical properties, and the fracture toughness of two types of cVE composites consisting of EGaIn and GnPs were then studied. The results showed that sub-micron sized EGaIn (≤1 wt.%) could promote the curing reaction of cVE without changing the curing mechanism. However, with further increases in EGaIn loading between 1 and 2 wt.%, the curing reaction rate tends to decrease. Both EGaIn and GnPs showed a significant enhancement in strengthening and toughening the cVE matrix with the presence of filler loading up to 1 wt.%. EGaIn was more effective than GnPs in promoting the flexural and impact strength. An increase of up to 50% and 32% were recorded for these mechanical properties, when EGaln was used, as compared to 46%, and 18% for GnPs, respectively. In contrast, the GnPs/cVE composites exhibited a greater improvement in the fracture toughness and fracture energy by up to 50% and 56% in comparison with those of the EGaIn/cVE ones by up to 32% and 39%, respectively. Furthermore, the stiffness of both the EgaIn/cVE and GnPs/cVE composites showed a significant improvement with an increase of up to 1.76 and 1.83 times in the normalized storage modulus, respectively, while the glass transition temperature (T_g) values remained relatively constant. This work highlights the potential of EGaIn being employed as a filler in creating high-performance thermoset composites, which facilitates its widening applications in many structural and engineering fields, where both higher toughness and stiffness are required.

High Thermal Resistance of Epoxy/Cyanate Ester Hybrids Incorporating an Inorganic Double-Decker-Shaped Polyhedral Silsesquioxane Nanomaterial

In this study, we prepared a difunctionalized cyanate ester double-decker silsesquioxane (DDSQ-OCN) cage with a char yield and thermal decomposition temperature (T_d) which were both much higher than those of a typical bisphenol A dicyanate ester (BADCy, without the DDSQ cage) after thermal polymerization. Here, the inorganic DDSQ nanomaterial improved the thermal behavior through a nano-reinforcement effect. Blending the inorganic DDSQ-OCN cage into the epoxy resin improved its thermal and mechanical stabilities after the ring-opening polymerization of the epoxy units during thermal polymerization. The enhancement in the physical properties arose from the copolymerization of the epoxy and OCN units to form the organic/inorganic covalently bonded network structure, as well as the hydrogen bonding of the OH groups of the epoxy with the SiOSi moieties of the DDSQ units. For example, the epoxy/DDSQ-OCN = 1/1 hybrid, prepared without Cu(II)-acac as a catalyst, exhibited a glass transition temperature, thermal decomposition temperature (T_d), and char yield (166 °C, 427 °C, and 51.0 wt%, respectively) that were significantly higher than those obtained when applying typical organic curing agents in the epoxy resin. The addition of Cu(II)-acac into the epoxy/BADCy and epoxy/DDSQ-OCN hybrids decreased the thermal stability (as characterized by the values of T_d and the char yields) because the crosslinking density and post-hardening also decreased during thermal polymerization; nevertheless, it accelerated the thermal polymerization to a lower curing peak temperature, which is potentially useful for real applications as epoxy molding compounds.

Preparation of environment-friendly solid epoxy resin with high-toughness via one-step banburying

Solid epoxy resin is highly desired in adhesives, electronic materials and coatings due to the attractive characteristics of solvent-free, highly efficient utilization and convenient storage and transportation. However, the challenges remain in fabricating high-toughness solid epoxy resin through a facile and efficient way. Here, a high-performance environment-friendly solid epoxy resin was fabricated by employing maleic anhydride grafted ethylene-vinyl acetate copolymer (EVA-g-MAH) as the flexibilizer via one-step banburying method. The results showed that the modified epoxy resin maintained a high glass transition temperature (T_g) and thermal stability, while its impact strength, tensile toughness and flexural toughness were significantly increased compared with the neat epoxy resin. The impact strength, tensile toughness and flexural toughness of R-EM10 are improved 138%, 195% and 149%, respectively. The EVA-g-MAH was introduced in the epoxy matrix as a separate phase to increase toughness via transfer stress and dissipated energy. The attractive properties of this facile fabrication process and the high-toughness, as well as the environment-friendly performance make this solid epoxy highly promising for large-scale industrial application.

High-toughness and environment-friendly solvent free solid epoxy resin through a low-cost, facile and large-scale fabrication process.

Toughening Shape-Memory Epoxy Resins via Sacrificial Hydrogen Bond

The long fatigue life and stable performance in extreme environment of composites have been putting forward requirements for both high strength and toughness of epoxy matrix. However, for thermosets, promoting...

Experimental and Numerical Analysis of High-Temperature Superconducting Tapes Modified by Composite Thermal Stabilization Subjected to Thermomechanical Loading

The strain behavior of SiC/Stycast 2850 FT composites under thermomechanical loading using a finite element analysis (FEA) was studied. These composites can serve as thermal stabilizers of high-temperature superconducting (HTS) tapes during limitation event in resistive superconducting fault current limiter (R-SCFCL) applications. For this purpose, the thermomechanical properties of four composite systems with different filler content were studied experimentally. The FEA was calculated using an ANSYS software and it delivered useful information about the strain distribution in the composite coating, as well as in particular layers of the modified HTS tapes. The tapes were subjected to bending over a 25 cm core, cooled in a liquid nitrogen (LN2) bath, and finally, quenched from this temperature to various temperatures up to 150 °C for a very short time, simulating real limitation conditions. The outputs from simulations were also correlated with the experiments. The most promising of all investigated systems was SB11-SiC20 composite in form of 100 µm thick coating, withstanding a temperature change from LN2 up to 120 °C.

Qualitative and quantitative evaluation of epoxy systems by Fourier transform infrared spectroscopy and the flexibilizing effect of mercaptans

Epoxy systems are widely applied as adhesives in the aerospace industry. They have excellent adhesion properties, however, being thermosetting, epoxy systems show fracture brittleness characteristics. Polysulfide and polymercaptans are good options to increase the flexibility of the epoxy adhesive. Thermal analysis techniques are generally used to evaluate the curing degree of epoxy systems. In most cases, when infrared (IR) analysis is used, it is employed qualitatively. This paper presents the reaction study of a DGEBA epoxy prepolymer with diethylenetriamine (DETA) and linear and branched dodecyl mercaptans as flexibilizers. Conversion data and curing time were assessed qualitatively and quantitatively by Fourier Transform Infrared Spectroscopy (FT-IR) in the medium infrared region (MIR) and in the near infrared region, using near infrared reflectance accessory (NIRA). NIRA methodology showed satisfactory results, with errors between 3 and 7%, especially in samples with lower amine contents. Mechanical tests confirmed the flexibilization of the cured epoxy system by the addition of mercaptans, indicating a lower crosslinking degree in the matrix. Young's modulus (E) significantly decreased from 2017 MPa to 578 MPa with the addition of approximately 20 wt% of normal dodecyl mercaptan to the epoxy system.

Using Dihydrazides as Thermal Latent Curing Agents in Epoxy-Based Sealing Materials for Liquid Crystal Displays

In this study, highly adhesive epoxy-based sealing materials for liquid crystal (LC) displays were fabricated using different types of dihydrazides as thermal latent curing agents. Their curing characteristics, mechanical properties, LC contamination levels, and electro-optical characteristics were investigated depending on the chemical structure of dihydrazides. The epoxy-based sealing material containing a dihydrazide derivative with a bulky heterocyclic ring afforded a high heat curing conversion of 90.4%, high adhesion strength of 54.3 kgf cm-2, and a high elongation of 57.3% due to the relatively low melting characteristic under heat treatment compared to those involving dihydrazides with short aliphatic or aromatic spacers. In addition, the proposed sealing material exhibited an extremely low LC contamination level of 9 µm, which is essential to the successful operation of LC displays. With respect to electro-optical properties of the LC device, it was found that a dihydrazide derivative with a bulky heterocyclic ring afforded a normal voltage-dependent transmittance curve and fast response time due to the prevention of abnormal homogeneous LC alignment. This study developed highly adhesive and robust epoxy-based sealing materials based on the use of dihydrazides as thermal latent curing agents for advanced LC displays.