1
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Nasser RA, Arya SS, Alshehhi KH, Teo JCM, Pitsalidis C. Conducting polymer scaffolds: a new frontier in bioelectronics and bioengineering. Trends Biotechnol 2024; 42:760-779. [PMID: 38184439 DOI: 10.1016/j.tibtech.2023.11.017] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/09/2023] [Revised: 11/30/2023] [Accepted: 11/30/2023] [Indexed: 01/08/2024]
Abstract
Conducting polymer (CP) scaffolds have emerged as a transformative tool in bioelectronics and bioengineering, advancing the ability to interface with biological systems. Their unique combination of electrical conductivity, tailorability, and biocompatibility surpasses the capabilities of traditional nonconducting scaffolds while granting them access to the realm of bioelectronics. This review examines recent developments in CP scaffolds, focusing on material and device advancements, as well as their interplay with biological systems. We highlight applications for monitoring, tissue stimulation, and drug delivery and discuss perspectives and challenges currently faced for their ultimate translation and clinical implementation.
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Affiliation(s)
- Rasha A Nasser
- Department of Biomedical Engineering, Khalifa University of Science and Technology, P.O. Box 127788, Abu Dhabi, UAE
| | - Sagar S Arya
- Department of Biomedical Engineering, Khalifa University of Science and Technology, P.O. Box 127788, Abu Dhabi, UAE
| | - Khulood H Alshehhi
- Department of Physics, Khalifa University of Science and Technology, P.O. Box 127788, Abu Dhabi, UAE
| | - Jeremy C M Teo
- Mechanical and Biomedical Engineering Department, New York University Abu Dhabi, P.O. Box 129188, Abu Dhabi, UAE
| | - Charalampos Pitsalidis
- Department of Physics, Khalifa University of Science and Technology, P.O. Box 127788, Abu Dhabi, UAE; Healthcare Engineering Innovation Center, Khalifa University of Science and Technology, P.O. Box 127788, Abu Dhabi, UAE.
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2
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Kang SB, Huang G, Singhal G, Xie D, Hsieh DH, Lee Y, Kulkarni AA, Smith JW, Chen Q, Thornton K, Sinha S, Braun PV. Highly Ordered Eutectic Mesostructures via Template-Directed Solidification within Thermally Engineered Templates. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2308720. [PMID: 38189549 DOI: 10.1002/adma.202308720] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/27/2023] [Revised: 01/03/2024] [Indexed: 01/09/2024]
Abstract
Template-directed self-assembly of solidifying eutectics results in emergence of unique microstructures due to diffusion constraints and thermal gradients imposed by the template. Here, the importance of selecting the template material based on its conductivity to control heat transfer between the template and the solidifying eutectic, and thus the thermal gradients near the solidification front, is demonstrated. Simulations elucidate the relationship between the thermal properties of the eutectic and template and the resultant microstructure. The overarching finding is that templates with low thermal conductivities are generally advantageous for forming highly organized microstructures. When electrochemically porosified silicon pillars (thermal conductivity < 0.3 Wm-1K-1) are used as the template into which an AgCl-KCl eutectic is solidified, 99% of the unit cells in the solidified structure exhibit the same pattern. In contrast, when higher thermal conductivity crystalline silicon pillars (≈100 Wm-1K-1) are utilized, the expected pattern is only present in 50% of the unit cells. The thermally engineered template results in mesostructures with tunable optical properties and reflectances nearly identical to the simulated reflectances of perfect structures, indicating highly ordered patterns are formed over large areas. This work highlights the importance of controlling heat flows in template-directed self-assembly of eutectics.
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Affiliation(s)
- Sung Bum Kang
- Department of Materials Science and Engineering, University of Illinois, Urbana, IL, 61801, USA
- Materials Research Laboratory, University of Illinois, Urbana, IL, 61801, USA
| | - Guanglong Huang
- Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI, 48109, USA
| | - Gaurav Singhal
- Department of Materials Science and Engineering, University of Illinois, Urbana, IL, 61801, USA
- Materials Research Laboratory, University of Illinois, Urbana, IL, 61801, USA
| | - Dajie Xie
- Department of Materials Science and Engineering, University of Illinois, Urbana, IL, 61801, USA
- Materials Research Laboratory, University of Illinois, Urbana, IL, 61801, USA
| | - Daniel H Hsieh
- Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL, 61801, USA
| | - Youngmun Lee
- Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL, 61801, USA
| | - Ashish A Kulkarni
- Center for Functional Nanomaterials, Brookhaven National Laboratory, Upton, NY, 11973, USA
| | - John W Smith
- Department of Materials Science and Engineering, University of Illinois, Urbana, IL, 61801, USA
- Materials Research Laboratory, University of Illinois, Urbana, IL, 61801, USA
| | - Qian Chen
- Department of Materials Science and Engineering, University of Illinois, Urbana, IL, 61801, USA
- Materials Research Laboratory, University of Illinois, Urbana, IL, 61801, USA
- Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL, 61801, USA
- Department of Chemistry, University of Illinois, Urbana, IL, 61801, USA
- Beckman Institute for Advanced Science and Technology, University of Illinois, Urbana, IL, 61801, USA
| | - Katsuyo Thornton
- Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI, 48109, USA
| | - Sanjiv Sinha
- Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL, 61801, USA
| | - Paul V Braun
- Department of Materials Science and Engineering, University of Illinois, Urbana, IL, 61801, USA
- Materials Research Laboratory, University of Illinois, Urbana, IL, 61801, USA
- Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL, 61801, USA
- Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL, 61801, USA
- Department of Chemistry, University of Illinois, Urbana, IL, 61801, USA
- Beckman Institute for Advanced Science and Technology, University of Illinois, Urbana, IL, 61801, USA
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3
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Park H, Kim DC. Structural and Material-Based Approaches for the Fabrication of Stretchable Light-Emitting Diodes. MICROMACHINES 2023; 15:66. [PMID: 38258185 PMCID: PMC10821428 DOI: 10.3390/mi15010066] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/03/2023] [Revised: 12/22/2023] [Accepted: 12/27/2023] [Indexed: 01/24/2024]
Abstract
Stretchable displays, capable of freely transforming their shapes, have received significant attention as alternatives to conventional rigid displays, and they are anticipated to provide new opportunities in various human-friendly electronics applications. As a core component of stretchable displays, high-performance stretchable light-emitting diodes (LEDs) have recently emerged. The approaches to fabricate stretchable LEDs are broadly categorized into two groups, namely "structural" and "material-based" approaches, based on the mechanisms to tolerate strain. While structural approaches rely on specially designed geometries to dissipate applied strain, material-based approaches mainly focus on replacing conventional rigid components of LEDs to soft and stretchable materials. Here, we review the latest studies on the fabrication of stretchable LEDs, which is accomplished through these distinctive strategies. First, we introduce representative device designs for efficient strain distribution, encompassing island-bridge structures, wavy buckling, and kirigami-/origami-based structures. For the material-based approaches, we discuss the latest studies for intrinsically stretchable (is-) electronic/optoelectronic materials, including the formation of conductive nanocomposite and polymeric blending with various additives. The review also provides examples of is-LEDs, focusing on their luminous performance and stretchability. We conclude this review with a brief outlook on future technologies.
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Affiliation(s)
- Hamin Park
- Department of Electronic Engineering, Kwangwoon University, 20, Gwangun-ro, Nowon-gu, Seoul 01897, Republic of Korea
| | - Dong Chan Kim
- Department of Chemical and Biological Engineering, Gachon University, 1342 Seongnam-daero, Sujeong-gu, Seongnam-si 13120, Republic of Korea
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4
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Dong K, Liu WC, Su Y, Lyu Y, Huang H, Zheng N, Rogers JA, Nan K. Scalable Electrophysiology of Millimeter-Scale Animals with Electrode Devices. BME FRONTIERS 2023; 4:0034. [PMID: 38435343 PMCID: PMC10907027 DOI: 10.34133/bmef.0034] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 09/22/2023] [Accepted: 11/08/2023] [Indexed: 03/05/2024] Open
Abstract
Millimeter-scale animals such as Caenorhabditis elegans, Drosophila larvae, zebrafish, and bees serve as powerful model organisms in the fields of neurobiology and neuroethology. Various methods exist for recording large-scale electrophysiological signals from these animals. Existing approaches often lack, however, real-time, uninterrupted investigations due to their rigid constructs, geometric constraints, and mechanical mismatch in integration with soft organisms. The recent research establishes the foundations for 3-dimensional flexible bioelectronic interfaces that incorporate microfabricated components and nanoelectronic function with adjustable mechanical properties and multidimensional variability, offering unique capabilities for chronic, stable interrogation and stimulation of millimeter-scale animals and miniature tissue constructs. This review summarizes the most advanced technologies for electrophysiological studies, based on methods of 3-dimensional flexible bioelectronics. A concluding section addresses the challenges of these devices in achieving freestanding, robust, and multifunctional biointerfaces.
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Affiliation(s)
- Kairu Dong
- College of Pharmaceutical Sciences,
Zhejiang University, Hangzhou 310058, China
- National Key Laboratory of Advanced Drug Delivery and Release Systems,
Zhejiang University, Hangzhou 310058, China
- College of Biomedical Engineering & Instrument Science,
Zhejiang University, Hangzhou, 310027, China
| | - Wen-Che Liu
- College of Pharmaceutical Sciences,
Zhejiang University, Hangzhou 310058, China
- National Key Laboratory of Advanced Drug Delivery and Release Systems,
Zhejiang University, Hangzhou 310058, China
| | - Yuyan Su
- College of Pharmaceutical Sciences,
Zhejiang University, Hangzhou 310058, China
- Department of Gastroenterology, Brigham and Women’s Hospital,
Harvard Medical School, Boston, MA 02115, USA
| | - Yidan Lyu
- College of Pharmaceutical Sciences,
Zhejiang University, Hangzhou 310058, China
| | - Hao Huang
- College of Pharmaceutical Sciences,
Zhejiang University, Hangzhou 310058, China
- College of Chemical and Biological Engineering,
Zhejiang University, Hangzhou 310058, China
| | - Nenggan Zheng
- Qiushi Academy for Advanced Studies,
Zhejiang University, Hangzhou 310027, China
- College of Computer Science and Technology,
Zhejiang University, Hangzhou 310027, China
- State Key Lab of Brain-Machine Intelligence,
Zhejiang University, Hangzhou 310058, China
- CCAI by MOE and Zhejiang Provincial Government (ZJU), Hangzhou 310027, China
| | - John A. Rogers
- Querrey Simpson Institute for Bioelectronics,
Northwestern University, Evanston, IL 60208, USA
- Department of Biomedical Engineering,
Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering,
Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering,
Northwestern University, Evanston, IL 60208, USA
| | - Kewang Nan
- College of Pharmaceutical Sciences,
Zhejiang University, Hangzhou 310058, China
- National Key Laboratory of Advanced Drug Delivery and Release Systems,
Zhejiang University, Hangzhou 310058, China
- Jinhua Institute of Zhejiang University, Jinhua 321299, China
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5
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Astratov VN, Sahel YB, Eldar YC, Huang L, Ozcan A, Zheludev N, Zhao J, Burns Z, Liu Z, Narimanov E, Goswami N, Popescu G, Pfitzner E, Kukura P, Hsiao YT, Hsieh CL, Abbey B, Diaspro A, LeGratiet A, Bianchini P, Shaked NT, Simon B, Verrier N, Debailleul M, Haeberlé O, Wang S, Liu M, Bai Y, Cheng JX, Kariman BS, Fujita K, Sinvani M, Zalevsky Z, Li X, Huang GJ, Chu SW, Tzang O, Hershkovitz D, Cheshnovsky O, Huttunen MJ, Stanciu SG, Smolyaninova VN, Smolyaninov II, Leonhardt U, Sahebdivan S, Wang Z, Luk’yanchuk B, Wu L, Maslov AV, Jin B, Simovski CR, Perrin S, Montgomery P, Lecler S. Roadmap on Label-Free Super-Resolution Imaging. LASER & PHOTONICS REVIEWS 2023; 17:2200029. [PMID: 38883699 PMCID: PMC11178318 DOI: 10.1002/lpor.202200029] [Citation(s) in RCA: 6] [Impact Index Per Article: 6.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/17/2022] [Indexed: 06/18/2024]
Abstract
Label-free super-resolution (LFSR) imaging relies on light-scattering processes in nanoscale objects without a need for fluorescent (FL) staining required in super-resolved FL microscopy. The objectives of this Roadmap are to present a comprehensive vision of the developments, the state-of-the-art in this field, and to discuss the resolution boundaries and hurdles which need to be overcome to break the classical diffraction limit of the LFSR imaging. The scope of this Roadmap spans from the advanced interference detection techniques, where the diffraction-limited lateral resolution is combined with unsurpassed axial and temporal resolution, to techniques with true lateral super-resolution capability which are based on understanding resolution as an information science problem, on using novel structured illumination, near-field scanning, and nonlinear optics approaches, and on designing superlenses based on nanoplasmonics, metamaterials, transformation optics, and microsphere-assisted approaches. To this end, this Roadmap brings under the same umbrella researchers from the physics and biomedical optics communities in which such studies have often been developing separately. The ultimate intent of this paper is to create a vision for the current and future developments of LFSR imaging based on its physical mechanisms and to create a great opening for the series of articles in this field.
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Affiliation(s)
- Vasily N. Astratov
- Department of Physics and Optical Science, University of North Carolina at Charlotte, Charlotte, North Carolina 28223-0001, USA
| | - Yair Ben Sahel
- Department of Computer Science and Applied Mathematics, Weizmann Institute of Science, Rehovot 7610001, Israel
| | - Yonina C. Eldar
- Department of Computer Science and Applied Mathematics, Weizmann Institute of Science, Rehovot 7610001, Israel
| | - Luzhe Huang
- Electrical and Computer Engineering Department, University of California, Los Angeles, California 90095, USA
- Bioengineering Department, University of California, Los Angeles, California 90095, USA
- California Nano Systems Institute (CNSI), University of California, Los Angeles, California 90095, USA
| | - Aydogan Ozcan
- Electrical and Computer Engineering Department, University of California, Los Angeles, California 90095, USA
- Bioengineering Department, University of California, Los Angeles, California 90095, USA
- California Nano Systems Institute (CNSI), University of California, Los Angeles, California 90095, USA
- David Geffen School of Medicine, University of California, Los Angeles, California 90095, USA
| | - Nikolay Zheludev
- Optoelectronics Research Centre, University of Southampton, Southampton, SO17 1BJ, UK
- Centre for Disruptive Photonic Technologies, The Photonics Institute, School of Physical and Mathematical Sciences, Nanyang Technological University, 637371, Singapore
| | - Junxiang Zhao
- Department of Electrical and Computer Engineering, University of California, San Diego, 9500 Gilman Drive, La Jolla, California 92093, USA
| | - Zachary Burns
- Department of Electrical and Computer Engineering, University of California, San Diego, 9500 Gilman Drive, La Jolla, California 92093, USA
| | - Zhaowei Liu
- Department of Electrical and Computer Engineering, University of California, San Diego, 9500 Gilman Drive, La Jolla, California 92093, USA
- Material Science and Engineering, University of California, San Diego, 9500 Gilman Drive, La Jolla, California 92093, USA
| | - Evgenii Narimanov
- School of Electrical Engineering, and Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907, USA
| | - Neha Goswami
- Quantitative Light Imaging Laboratory, Beckman Institute of Advanced Science and Technology, University of Illinois at Urbana-Champaign, Illinois 61801, USA
| | - Gabriel Popescu
- Quantitative Light Imaging Laboratory, Beckman Institute of Advanced Science and Technology, University of Illinois at Urbana-Champaign, Illinois 61801, USA
| | - Emanuel Pfitzner
- Department of Chemistry, University of Oxford, Oxford OX1 3QZ, United Kingdom
| | - Philipp Kukura
- Department of Chemistry, University of Oxford, Oxford OX1 3QZ, United Kingdom
| | - Yi-Teng Hsiao
- Institute of Atomic and Molecular Sciences (IAMS), Academia Sinica 1, Roosevelt Rd. Sec. 4, Taipei 10617 Taiwan
| | - Chia-Lung Hsieh
- Institute of Atomic and Molecular Sciences (IAMS), Academia Sinica 1, Roosevelt Rd. Sec. 4, Taipei 10617 Taiwan
| | - Brian Abbey
- Australian Research Council Centre of Excellence for Advanced Molecular Imaging, La Trobe University, Melbourne, Victoria, Australia
- Department of Chemistry and Physics, La Trobe Institute for Molecular Science (LIMS), La Trobe University, Melbourne, Victoria, Australia
| | - Alberto Diaspro
- Optical Nanoscopy and NIC@IIT, CHT, Istituto Italiano di Tecnologia, Via Enrico Melen 83B, 16152 Genoa, Italy
- DIFILAB, Department of Physics, University of Genoa, Via Dodecaneso 33, 16146 Genoa, Italy
| | - Aymeric LeGratiet
- Optical Nanoscopy and NIC@IIT, CHT, Istituto Italiano di Tecnologia, Via Enrico Melen 83B, 16152 Genoa, Italy
- Université de Rennes, CNRS, Institut FOTON - UMR 6082, F-22305 Lannion, France
| | - Paolo Bianchini
- Optical Nanoscopy and NIC@IIT, CHT, Istituto Italiano di Tecnologia, Via Enrico Melen 83B, 16152 Genoa, Italy
- DIFILAB, Department of Physics, University of Genoa, Via Dodecaneso 33, 16146 Genoa, Italy
| | - Natan T. Shaked
- Tel Aviv University, Faculty of Engineering, Department of Biomedical Engineering, Tel Aviv 6997801, Israel
| | - Bertrand Simon
- LP2N, Institut d’Optique Graduate School, CNRS UMR 5298, Université de Bordeaux, Talence France
| | - Nicolas Verrier
- IRIMAS UR UHA 7499, Université de Haute-Alsace, Mulhouse, France
| | | | - Olivier Haeberlé
- IRIMAS UR UHA 7499, Université de Haute-Alsace, Mulhouse, France
| | - Sheng Wang
- School of Physics and Technology, Wuhan University, China
- Wuhan Institute of Quantum Technology, China
| | - Mengkun Liu
- Department of Physics and Astronomy, Stony Brook University, USA
- National Synchrotron Light Source II, Brookhaven National Laboratory, USA
| | - Yeran Bai
- Boston University Photonics Center, Boston, MA 02215, USA
| | - Ji-Xin Cheng
- Boston University Photonics Center, Boston, MA 02215, USA
| | - Behjat S. Kariman
- Optical Nanoscopy and NIC@IIT, CHT, Istituto Italiano di Tecnologia, Via Enrico Melen 83B, 16152 Genoa, Italy
- DIFILAB, Department of Physics, University of Genoa, Via Dodecaneso 33, 16146 Genoa, Italy
| | - Katsumasa Fujita
- Department of Applied Physics and the Advanced Photonics and Biosensing Open Innovation Laboratory (AIST); and the Transdimensional Life Imaging Division, Institute for Open and Transdisciplinary Research Initiatives, Osaka University, Osaka, Japan
| | - Moshe Sinvani
- Faculty of Engineering and the Nano-Technology Center, Bar-Ilan University, Ramat Gan, 52900 Israel
| | - Zeev Zalevsky
- Faculty of Engineering and the Nano-Technology Center, Bar-Ilan University, Ramat Gan, 52900 Israel
| | - Xiangping Li
- Guangdong Provincial Key Laboratory of Optical Fiber Sensing and Communications, Institute of Photonics Technology, Jinan University, Guangzhou 510632, China
| | - Guan-Jie Huang
- Department of Physics and Molecular Imaging Center, National Taiwan University, Taipei 10617, Taiwan
- Brain Research Center, National Tsing Hua University, Hsinchu 30013, Taiwan
| | - Shi-Wei Chu
- Department of Physics and Molecular Imaging Center, National Taiwan University, Taipei 10617, Taiwan
- Brain Research Center, National Tsing Hua University, Hsinchu 30013, Taiwan
| | - Omer Tzang
- School of Chemistry, The Sackler faculty of Exact Sciences, and the Center for Light matter Interactions, and the Tel Aviv University Center for Nanoscience and Nanotechnology, Tel Aviv 69978, Israel
| | - Dror Hershkovitz
- School of Chemistry, The Sackler faculty of Exact Sciences, and the Center for Light matter Interactions, and the Tel Aviv University Center for Nanoscience and Nanotechnology, Tel Aviv 69978, Israel
| | - Ori Cheshnovsky
- School of Chemistry, The Sackler faculty of Exact Sciences, and the Center for Light matter Interactions, and the Tel Aviv University Center for Nanoscience and Nanotechnology, Tel Aviv 69978, Israel
| | - Mikko J. Huttunen
- Laboratory of Photonics, Physics Unit, Tampere University, FI-33014, Tampere, Finland
| | - Stefan G. Stanciu
- Center for Microscopy – Microanalysis and Information Processing, Politehnica University of Bucharest, 313 Splaiul Independentei, 060042, Bucharest, Romania
| | - Vera N. Smolyaninova
- Department of Physics Astronomy and Geosciences, Towson University, 8000 York Rd., Towson, MD 21252, USA
| | - Igor I. Smolyaninov
- Department of Electrical and Computer Engineering, University of Maryland, College Park, MD 20742, USA
| | - Ulf Leonhardt
- Weizmann Institute of Science, Rehovot 7610001, Israel
| | - Sahar Sahebdivan
- EMTensor GmbH, TechGate, Donau-City-Strasse 1, 1220 Wien, Austria
| | - Zengbo Wang
- School of Computer Science and Electronic Engineering, Bangor University, Bangor, LL57 1UT, United Kingdom
| | - Boris Luk’yanchuk
- Faculty of Physics, Lomonosov Moscow State University, Moscow 119991, Russia
| | - Limin Wu
- Department of Materials Science and State Key Laboratory of Molecular Engineering of Polymers, Fudan University, Shanghai 200433, China
| | - Alexey V. Maslov
- Department of Radiophysics, University of Nizhny Novgorod, Nizhny Novgorod, 603022, Russia
| | - Boya Jin
- Department of Physics and Optical Science, University of North Carolina at Charlotte, Charlotte, North Carolina 28223-0001, USA
| | - Constantin R. Simovski
- Department of Electronics and Nano-Engineering, Aalto University, FI-00076, Espoo, Finland
- Faculty of Physics and Engineering, ITMO University, 199034, St-Petersburg, Russia
| | - Stephane Perrin
- ICube Research Institute, University of Strasbourg - CNRS - INSA de Strasbourg, 300 Bd. Sébastien Brant, 67412 Illkirch, France
| | - Paul Montgomery
- ICube Research Institute, University of Strasbourg - CNRS - INSA de Strasbourg, 300 Bd. Sébastien Brant, 67412 Illkirch, France
| | - Sylvain Lecler
- ICube Research Institute, University of Strasbourg - CNRS - INSA de Strasbourg, 300 Bd. Sébastien Brant, 67412 Illkirch, France
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6
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Bo R, Xu S, Yang Y, Zhang Y. Mechanically-Guided 3D Assembly for Architected Flexible Electronics. Chem Rev 2023; 123:11137-11189. [PMID: 37676059 PMCID: PMC10540141 DOI: 10.1021/acs.chemrev.3c00335] [Citation(s) in RCA: 7] [Impact Index Per Article: 7.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/22/2023] [Indexed: 09/08/2023]
Abstract
Architected flexible electronic devices with rationally designed 3D geometries have found essential applications in biology, medicine, therapeutics, sensing/imaging, energy, robotics, and daily healthcare. Mechanically-guided 3D assembly methods, exploiting mechanics principles of materials and structures to transform planar electronic devices fabricated using mature semiconductor techniques into 3D architected ones, are promising routes to such architected flexible electronic devices. Here, we comprehensively review mechanically-guided 3D assembly methods for architected flexible electronics. Mainstream methods of mechanically-guided 3D assembly are classified and discussed on the basis of their fundamental deformation modes (i.e., rolling, folding, curving, and buckling). Diverse 3D interconnects and device forms are then summarized, which correspond to the two key components of an architected flexible electronic device. Afterward, structure-induced functionalities are highlighted to provide guidelines for function-driven structural designs of flexible electronics, followed by a collective summary of their resulting applications. Finally, conclusions and outlooks are given, covering routes to achieve extreme deformations and dimensions, inverse design methods, and encapsulation strategies of architected 3D flexible electronics, as well as perspectives on future applications.
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Affiliation(s)
- Renheng Bo
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Shiwei Xu
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Youzhou Yang
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Yihui Zhang
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
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7
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Won SM, Cai L, Gutruf P, Rogers JA. Wireless and battery-free technologies for neuroengineering. Nat Biomed Eng 2023; 7:405-423. [PMID: 33686282 PMCID: PMC8423863 DOI: 10.1038/s41551-021-00683-3] [Citation(s) in RCA: 96] [Impact Index Per Article: 96.0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/21/2020] [Accepted: 12/28/2020] [Indexed: 12/16/2022]
Abstract
Tethered and battery-powered devices that interface with neural tissues can restrict natural motions and prevent social interactions in animal models, thereby limiting the utility of these devices in behavioural neuroscience research. In this Review Article, we discuss recent progress in the development of miniaturized and ultralightweight devices as neuroengineering platforms that are wireless, battery-free and fully implantable, with capabilities that match or exceed those of wired or battery-powered alternatives. Such classes of advanced neural interfaces with optical, electrical or fluidic functionality can also combine recording and stimulation modalities for closed-loop applications in basic studies or in the practical treatment of abnormal physiological processes.
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Affiliation(s)
- Sang Min Won
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, South Korea
| | - Le Cai
- Biomedical Engineering, College of Engineering, The University of Arizona, Tucson, AZ, USA
| | - Philipp Gutruf
- Biomedical Engineering, College of Engineering, The University of Arizona, Tucson, AZ, USA.
- Bio5 Institute and Neuroscience GIDP, University of Arizona, Tucson, AZ, USA.
- Department of Electrical and Computer Engineering, University of Arizona, Tucson, AZ, USA.
| | - John A Rogers
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.
- Center for Advanced Molecular Imaging, Northwestern University, Evanston, IL, USA.
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
- Department of Chemistry, Northwestern University, Evanston, IL, USA.
- Department of Neurological Surgery, Northwestern University, Evanston, IL, USA.
- Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA.
- Simpson Querrey Institute for BioNanotechnology, Northwestern University, Evanston, IL, USA.
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8
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Sun R, Song X, Zhou K, Zuo Y, Wang R, Rifaie-Graham O, Peeler DJ, Xie R, Leng Y, Geng H, Brachi G, Ma Y, Liu Y, Barron L, Stevens MM. Assembly of Fillable Microrobotic Systems by Microfluidic Loading with Dip Sealing. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2207791. [PMID: 36502366 PMCID: PMC7615483 DOI: 10.1002/adma.202207791] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/25/2022] [Revised: 12/02/2022] [Indexed: 06/17/2023]
Abstract
Microrobots can provide spatiotemporally well-controlled cargo delivery that can improve therapeutic efficiency compared to conventional drug delivery strategies. Robust microfabrication methods to expand the variety of materials or cargoes that can be incorporated into microrobots can greatly broaden the scope of their functions. However, current surface coating or direct blending techniques used for cargo loading result in inefficient loading and poor cargo protection during transportation, which leads to cargo waste, degradation and non-specific release. Herein, a versatile platform to fabricate fillable microrobots using microfluidic loading and dip sealing (MLDS) is presented. MLDS enables the encapsulation of different types of cargoes within hollow microrobots and protection of cargo integrity. The technique is supported by high-resolution 3D printing with an integrated microfluidic loading system, which realizes a highly precise loading process and improves cargo loading capacity. A corresponding dip sealing strategy is developed to encase and protect the loaded cargo whilst maintaining the geometric and structural integrity of the loaded microrobots. This dip sealing technique is suitable for different materials, including thermal and light-responsive materials. The MLDS platform provides new opportunities for microrobotic systems in targeted drug delivery, environmental sensing, and chemically powered micromotor applications.
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Affiliation(s)
- Rujie Sun
- Department of Materials, Imperial College London, London SW7 2AZ, UK
| | - Xin Song
- Department of Materials, Imperial College London, London SW7 2AZ, UK
| | - Kun Zhou
- Department of Materials, Imperial College London, London SW7 2AZ, UK
| | - Yuyang Zuo
- Department of Bioengineering, Imperial College London, London SW7 2AZ, UK
| | - Richard Wang
- Department of Materials, Imperial College London, London SW7 2AZ, UK
| | | | - David J. Peeler
- Department of Materials, Imperial College London, London SW7 2AZ, UK
| | - Ruoxiao Xie
- Department of Materials, Imperial College London, London SW7 2AZ, UK
| | - Yixuan Leng
- Department of Materials, Imperial College London, London SW7 2AZ, UK
| | - Hongya Geng
- Institute of Biopharmaceutical and Health Engineering, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, China
| | - Giulia Brachi
- Department of Materials, Imperial College London, London SW7 2AZ, UK
| | - Yun Ma
- Department of Materials, Imperial College London, London SW7 2AZ, UK
| | - Yutong Liu
- Department of Metabolism, Digestion and Reproduction, Imperial College London, London SW7 2AZ, UK
| | - Lorna Barron
- Department of Materials, Imperial College London, London SW7 2AZ, UK
| | - Molly M. Stevens
- Department of Materials, Imperial College London, London SW7 2AZ, UK
- Department of Bioengineering, Imperial College London, London SW7 2AZ, UK
- Institute of Biomedical Engineering, Imperial College London, London SW7 2AZ, UK
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9
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Zhang L, Zhang Z, Weisbecker H, Yin H, Liu Y, Han T, Guo Z, Berry M, Yang B, Guo X, Adams J, Xie Z, Bai W. 3D morphable systems via deterministic microfolding for vibrational sensing, robotic implants, and reconfigurable telecommunication. SCIENCE ADVANCES 2022; 8:eade0838. [PMID: 36542721 PMCID: PMC9770994 DOI: 10.1126/sciadv.ade0838] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 07/23/2022] [Accepted: 11/07/2022] [Indexed: 06/17/2023]
Abstract
DNA and proteins fold in three dimensions (3D) to enable functions that sustain life. Emulation of such folding schemes for functional materials can unleash enormous potential in advancing a wide range of technologies, especially in robotics, medicine, and telecommunication. Here, we report a microfolding strategy that enables formation of 3D morphable microelectronic systems integrated with various functional materials, including monocrystalline silicon, metallic nanomembranes, and polymers. By predesigning folding hosts and configuring folding pathways, 3D microelectronic systems in freestanding forms can transform across various complex configurations with modulated functionalities. Nearly all transitional states of 3D microelectronic systems achieved via the microfolding assembly can be easily accessed and modulated in situ, offering functional versatility and adaptability. Advanced morphable microelectronic systems including a reconfigurable microantenna for customizable telecommunication, a 3D vibration sensor for hand-tremor monitoring, and a bloomable robot for cardiac mapping demonstrate broad utility of these assembly schemes to realize advanced functionalities.
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Affiliation(s)
- Lin Zhang
- Department of Applied Physical Sciences, University of North Carolina, Chapel Hill, NC 27514, USA
| | - Zongwen Zhang
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, DUT-BSU Joint Institute, Dalian University, Dalian 116024, P.R. China
- Ningbo Institute of Dalian University of Technology, Ningbo 315016, P.R. China
| | - Hannah Weisbecker
- Department of Biology, University of North Carolina, Chapel Hill, NC 27514, USA
| | - Haifeng Yin
- MCAllister Heart Institute Core, University of North Carolina, Chapel Hill, NC 27514, USA
| | - Yihan Liu
- Department of Applied Physical Sciences, University of North Carolina, Chapel Hill, NC 27514, USA
| | - Tianhong Han
- Joint Department of Biomedical Engineering, North Carolina State University, Raleigh, NC 27606, USA
| | - Ziheng Guo
- Department of Chemistry, University of North Carolina, Chapel Hill, NC 27514, USA
| | - Matt Berry
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC 27606, USA
| | - Binbin Yang
- Department of Electrical and Computer Engineering, North Carolina Agricultural and Technical State University, Greensboro, NC 27411, USA
| | - Xu Guo
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, DUT-BSU Joint Institute, Dalian University, Dalian 116024, P.R. China
- Ningbo Institute of Dalian University of Technology, Ningbo 315016, P.R. China
| | - Jacob Adams
- Department of Electrical and Computer Engineering, North Carolina State University, Raleigh, NC 27606, USA
| | - Zhaoqian Xie
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, DUT-BSU Joint Institute, Dalian University, Dalian 116024, P.R. China
- Ningbo Institute of Dalian University of Technology, Ningbo 315016, P.R. China
| | - Wubin Bai
- Department of Applied Physical Sciences, University of North Carolina, Chapel Hill, NC 27514, USA
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10
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Han M, Guo X, Chen X, Liang C, Zhao H, Zhang Q, Bai W, Zhang F, Wei H, Wu C, Cui Q, Yao S, Sun B, Yang Y, Yang Q, Ma Y, Xue Z, Kwak JW, Jin T, Tu Q, Song E, Tian Z, Mei Y, Fang D, Zhang H, Huang Y, Zhang Y, Rogers JA. Submillimeter-scale multimaterial terrestrial robots. Sci Robot 2022; 7:eabn0602. [PMID: 35613299 DOI: 10.1126/scirobotics.abn0602] [Citation(s) in RCA: 29] [Impact Index Per Article: 14.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/11/2022]
Abstract
Robots with submillimeter dimensions are of interest for applications that range from tools for minimally invasive surgical procedures in clinical medicine to vehicles for manipulating cells/tissues in biology research. The limited classes of structures and materials that can be used in such robots, however, create challenges in achieving desired performance parameters and modes of operation. Here, we introduce approaches in manufacturing and actuation that address these constraints to enable untethered, terrestrial robots with complex, three-dimensional (3D) geometries and heterogeneous material construction. The manufacturing procedure exploits controlled mechanical buckling to create 3D multimaterial structures in layouts that range from arrays of filaments and origami constructs to biomimetic configurations and others. A balance of forces associated with a one-way shape memory alloy and the elastic resilience of an encapsulating shell provides the basis for reversible deformations of these structures. Modes of locomotion and manipulation span from bending, twisting, and expansion upon global heating to linear/curvilinear crawling, walking, turning, and jumping upon laser-induced local thermal actuation. Photonic structures such as retroreflectors and colorimetric sensing materials support simple forms of wireless monitoring and localization. These collective advances in materials, manufacturing, actuation, and sensing add to a growing body of capabilities in this emerging field of technology.
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Affiliation(s)
- Mengdi Han
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
| | - Xiaogang Guo
- Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China.,Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Xuexian Chen
- National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
| | - Cunman Liang
- Department of Electronic Engineering, The Chinese University of Hong Kong, New Territories, Hong Kong 999077, China
| | - Hangbo Zhao
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA 90089, USA
| | - Qihui Zhang
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Wubin Bai
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Fan Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Heming Wei
- Key Laboratory of Specialty Fiber Optics and Optical Access Networks, Joint International Research Laboratory of Specialty Fiber Optics and Advanced Communication, Shanghai University, Shanghai 200444, China
| | - Changsheng Wu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Qinghong Cui
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
| | - Shenglian Yao
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Bohan Sun
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,Department of Mechanical Engineering, Johns Hopkins University, Baltimore, MD 21218, USA
| | - Yiyuan Yang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Quansan Yang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Yuhang Ma
- School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072, China
| | - Zhaoguo Xue
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Jean Won Kwak
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Tianqi Jin
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Qing Tu
- Department of Materials Science and Engineering, Texas A&M University, College Station, TX 77843, USA
| | - Enming Song
- Shanghai Frontiers Science Research Base of Intelligent Optoelectronics and Perception, Institute of Optoelectronics, Fudan University, Shanghai 200433, China
| | - Ziao Tian
- State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China
| | - Yongfeng Mei
- Department of Materials Science, Fudan University, Shanghai 200433, China
| | - Daining Fang
- Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China
| | - Haixia Zhang
- National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
| | - Yonggang Huang
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Neurological Surgery, Northwestern University, Evanston, IL 60208, USA.,Department of Chemistry, Northwestern University, Evanston, IL 60208, USA.,Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208, USA
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11
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Brooks AK, Chakravarty S, Ali M, Yadavalli VK. Kirigami-Inspired Biodesign for Applications in Healthcare. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2109550. [PMID: 35073433 DOI: 10.1002/adma.202109550] [Citation(s) in RCA: 16] [Impact Index Per Article: 8.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/23/2021] [Revised: 01/04/2022] [Indexed: 06/14/2023]
Abstract
Mechanically flexible and conformable materials and integrated devices have found diverse applications in personalized healthcare as diagnostics and therapeutics, tissue engineering and regenerative medicine constructs, surgical tools, secure systems, and assistive technologies. In order to impart optimal mechanical properties to the (bio)materials used in these applications, various strategies have been explored-from composites to structural engineering. In recent years, geometric cuts inspired by the art of paper-cutting, referred to as kirigami, have provided innovative opportunities for conferring precise mechanical properties via material removal. Kirigami-based approaches have been used for device design in areas ranging from soft bioelectronics to energy storage. In this review, the principles of kirigami-inspired engineering specifically for biomedical applications are discussed. Factors pertinent to their design, including cut geometry, materials, and fabrication, and the effect these parameters have on their properties and configurations are covered. Examples of kirigami designs in healthcare are presented, such as, various form factors of sensors (on skin, wearable), implantable devices, therapeutics, surgical procedures, and cellular scaffolds for regenerative medicine. Finally, the challenges and future scope for the successful translation of these biodesign concepts to broader deployment are discussed.
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Affiliation(s)
- Anne Katherine Brooks
- Department of Chemical and Life Science Engineering, Virginia Commonwealth University, Richmond, VA, 23284, USA
| | - Sudesna Chakravarty
- Department of Chemical and Life Science Engineering, Virginia Commonwealth University, Richmond, VA, 23284, USA
| | - Maryam Ali
- Department of Chemical and Life Science Engineering, Virginia Commonwealth University, Richmond, VA, 23284, USA
| | - Vamsi K Yadavalli
- Department of Chemical and Life Science Engineering, Virginia Commonwealth University, Richmond, VA, 23284, USA
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12
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Taylor JM, Luan H, Lewis JA, Rogers JA, Nuzzo RG, Braun PV. Biomimetic and Biologically Compliant Soft Architectures via 3D and 4D Assembly Methods: A Perspective. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2108391. [PMID: 35233865 DOI: 10.1002/adma.202108391] [Citation(s) in RCA: 19] [Impact Index Per Article: 9.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/19/2021] [Revised: 01/08/2022] [Indexed: 06/14/2023]
Abstract
Recent progress in soft material chemistry and enabling methods of 3D and 4D fabrication-emerging programmable material designs and associated assembly methods for the construction of complex functional structures-is highlighted. The underlying advances in this science allow the creation of soft material architectures with properties and shapes that programmably vary with time. The ability to control composition from the molecular to the macroscale is highlighted-most notably through examples that focus on biomimetic and biologically compliant soft materials. Such advances, when coupled with the ability to program material structure and properties across multiple scales via microfabrication, 3D printing, or other assembly techniques, give rise to responsive (4D) architectures. The challenges and prospects for progress in this emerging field in terms of its capacities for integrating chemistry, form, and function are described in the context of exemplary soft material systems demonstrating important but heretofore difficult-to-realize biomimetic and biologically compliant behaviors.
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Affiliation(s)
- Jay M Taylor
- Department of Materials Science and Engineering, Materials Research Laboratory, Beckman Institute for Advanced Science and Technology, University of Illinois Urbana-Champaign, 104 South Goodwin Ave., Urbana, IL, 61801, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Jennifer A Lewis
- John A. Paulson School of Engineering and Applied Sciences Wyss Institute for Biologically Inspired Engineering, Harvard University, 29 Oxford Street, Cambridge, MA, 02138, USA
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Departments of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical and Computer Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Ralph G Nuzzo
- Department of Chemistry, University of Illinois Urbana-Champaign, 600 S Mathews Avenue, Urbana, IL, 61801, USA
- Surface and Corrosion Science, School of Engineering Sciences in Chemistry, Biotechnology and Health, KTH Royal Institute of Technology, Drottning Kristinasväg 51, Stockholm, 10044, Sweden
| | - Paul V Braun
- Department of Materials Science and Engineering, Materials Research Laboratory, Beckman Institute for Advanced Science and Technology, University of Illinois Urbana-Champaign, 104 South Goodwin Ave., Urbana, IL, 61801, USA
- Department of Chemistry, University of Illinois Urbana-Champaign, 600 S Mathews Avenue, Urbana, IL, 61801, USA
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13
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Li K, Shuai Y, Cheng X, Luan H, Liu S, Yang C, Xue Z, Huang Y, Zhang Y. Island Effect in Stretchable Inorganic Electronics. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2022; 18:e2107879. [PMID: 35307953 DOI: 10.1002/smll.202107879] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/19/2021] [Revised: 02/28/2022] [Indexed: 06/14/2023]
Abstract
Island-bridge architectures represent a widely used structural design in stretchable inorganic electronics, where deformable interconnects that form the bridge provide system stretchability, and functional components that reside on the islands undergo negligible deformations. These device systems usually experience a common strain concentration phenomenon, i.e., "island effect", because of the modulus mismatch between the soft elastomer substrate and its on-top rigid components. Such an island effect can significantly raise the surrounding local strain, therefore increasing the risk of material failure for the interconnects in the vicinity of the islands. In this work, a systematic study of such an island effect through combined theoretical analysis, numerical simulations and experimental measurements is presented. To relieve the island effect, a buffer layer strategy is proposed as a generic route to enhanced stretchabilities of deformable interconnects. Both experimental and numerical results illustrate the applicability of this strategy to 2D serpentine and 3D helical interconnects, as evidenced by the increased stretchabilities (e.g., by 1.5 times with a simple buffer layer, and 2 times with a ring buffer layer, both for serpentine interconnects). The application of the patterned buffer layer strategy in a stretchable light emitting diodes system suggests promising potentials for uses in other functional device systems.
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Affiliation(s)
- Kan Li
- State Key Laboratory of Digital Manufacture Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
| | - Yumeng Shuai
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Xu Cheng
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Haiwen Luan
- Departments of Mechanical Engineering, Civil and Environmental Engineering, and Materials Science and Engineering and Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Siyi Liu
- Center for Mechanics of Solids, Structures and Materials, Department of Aerospace Engineering and Engineering Mechanics, University of Texas at Austin, Austin, TX, 78712, USA
| | - Ce Yang
- Department of Mechanical Engineering, Tsinghua University, Beijing, 100084, P. R. China
| | - Zhaoguo Xue
- Institute of Solid Mechanics, Beihang University (BUAA), Beijing, 100191, P. R. China
| | - Yonggang Huang
- Departments of Mechanical Engineering, Civil and Environmental Engineering, and Materials Science and Engineering and Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Yihui Zhang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
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14
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Zhao H, Cheng X, Wu C, Liu TL, Zhao Q, Li S, Ni X, Yao S, Han M, Huang Y, Zhang Y, Rogers JA. Mechanically Guided Hierarchical Assembly of 3D Mesostructures. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2109416. [PMID: 35067974 DOI: 10.1002/adma.202109416] [Citation(s) in RCA: 8] [Impact Index Per Article: 4.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/19/2021] [Revised: 01/01/2022] [Indexed: 06/14/2023]
Abstract
3D, hierarchical micro/nanostructures formed with advanced functional materials are of growing interest due to their broad potential utility in electronics, robotics, battery technology, and biomedical engineering. Among various strategies in 3D micro/nanofabrication, a set of methods based on compressive buckling offers wide-ranging material compatibility, fabrication scalability, and precise process control. Previously reports on this type of approach rely on a single, planar prestretched elastomeric platform to transform thin-film precursors with 2D layouts into 3D architectures. The simple planar configuration of bonding sites between these precursors and their assembly substrates prevents the realization of certain types of complex 3D geometries. In this paper, a set of hierarchical assembly concepts is reported that leverage multiple layers of prestretched elastomeric substrates to induce not only compressive buckling of 2D precursors bonded to them but also of themselves, thereby creating 3D mesostructures mounted at multiple levels of 3D frameworks with complex, elaborate configurations. Control over strains used in these processes provides reversible access to multiple different 3D layouts in a given structure. Examples to demonstrate these ideas through both experimental and computational results span vertically aligned helices to closed 3D cages, selected for their relevance to 3D conformal bio-interfaces and multifunctional microsystems.
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Affiliation(s)
- Hangbo Zhao
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA, 90089, USA
| | - Xu Cheng
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
| | - Changsheng Wu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Tzu-Li Liu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Qinai Zhao
- Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA, 90089, USA
| | - Shuo Li
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Xinchen Ni
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Shenglian Yao
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China
| | - Mengdi Han
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
| | - Yonggang Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Chemistry, Northwestern University, Evanston, IL, 60208, USA
- Department of Neurological Surgery, Northwestern University, Evanston, IL, 60208, USA
- Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, 60208, USA
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15
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Research Progress on the Flexibility of an Implantable Neural Microelectrode. MICROMACHINES 2022; 13:mi13030386. [PMID: 35334680 PMCID: PMC8954487 DOI: 10.3390/mi13030386] [Citation(s) in RCA: 5] [Impact Index Per Article: 2.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 08/03/2021] [Revised: 12/25/2021] [Accepted: 01/16/2022] [Indexed: 12/22/2022]
Abstract
Neural microelectrode is the important bridge of information exchange between the human body and machines. By recording and transmitting nerve signals with electrodes, people can control the external machines. At the same time, using electrodes to electrically stimulate nerve tissue, people with long-term brain diseases will be safely and reliably treated. Young’s modulus of the traditional rigid electrode probe is not matched well with that of biological tissue, and tissue immune rejection is easy to generate, resulting in the electrode not being able to achieve long-term safety and reliable working. In recent years, the choice of flexible materials and design of electrode structures can achieve modulus matching between electrode and biological tissue, and tissue damage is decreased. This review discusses nerve microelectrodes based on flexible electrode materials and substrate materials. Simultaneously, different structural designs of neural microelectrodes are reviewed. However, flexible electrode probes are difficult to implant into the brain. Only with the aid of certain auxiliary devices, can the implant be safe and reliable. The implantation method of the nerve microelectrode is also reviewed.
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16
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Ling Y, Pang W, Liu J, Page M, Xu Y, Zhao G, Stalla D, Xie J, Zhang Y, Yan Z. Bioinspired elastomer composites with programmed mechanical and electrical anisotropies. Nat Commun 2022; 13:524. [PMID: 35082331 PMCID: PMC8791960 DOI: 10.1038/s41467-022-28185-z] [Citation(s) in RCA: 11] [Impact Index Per Article: 5.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/29/2021] [Accepted: 01/04/2022] [Indexed: 12/26/2022] Open
Abstract
Concepts that draw inspiration from soft biological tissues have enabled significant advances in creating artificial materials for a range of applications, such as dry adhesives, tissue engineering, biointegrated electronics, artificial muscles, and soft robots. Many biological tissues, represented by muscles, exhibit directionally dependent mechanical and electrical properties. However, equipping synthetic materials with tissue-like mechanical and electrical anisotropies remains challenging. Here, we present the bioinspired concepts, design principles, numerical modeling, and experimental demonstrations of soft elastomer composites with programmed mechanical and electrical anisotropies, as well as their integrations with active functionalities. Mechanically assembled, 3D structures of polyimide serve as skeletons to offer anisotropic, nonlinear mechanical properties, and crumpled conductive surfaces provide anisotropic electrical properties, which can be used to construct bioelectronic devices. Finite element analyses quantitatively capture the key aspects that govern mechanical anisotropies of elastomer composites, providing a powerful design tool. Incorporation of 3D skeletons of thermally responsive polycaprolactone into elastomer composites allows development of an active artificial material that can mimic adaptive mechanical behaviors of skeleton muscles at relaxation and contraction states. Furthermore, the fabrication process of anisotropic elastomer composites is compatible with dielectric elastomer actuators, indicating potential applications in humanoid artificial muscles and soft robots.
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Affiliation(s)
- Yun Ling
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Wenbo Pang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084, Beijing, China.,Center for Flexible Electronics Technology, Tsinghua University, 100084, Beijing, China
| | - Jianxing Liu
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084, Beijing, China.,Center for Flexible Electronics Technology, Tsinghua University, 100084, Beijing, China
| | - Margaret Page
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Yadong Xu
- Department of Biomedical, Biological and Chemical Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Ganggang Zhao
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - David Stalla
- Electron Microscopy Core, University of Missouri, Columbia, MO, 65211, USA
| | - Jingwei Xie
- Department of Surgery-Transplant and Mary and Dick Holland Regenerative Medicine Program, College of Medicine, University of Nebraska Medical Center, Omaha, NE, 68130, USA
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084, Beijing, China. .,Center for Flexible Electronics Technology, Tsinghua University, 100084, Beijing, China.
| | - Zheng Yan
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA. .,Department of Biomedical, Biological and Chemical Engineering, University of Missouri, Columbia, MO, 65211, USA.
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17
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Truong TA, Nguyen TK, Zhao H, Nguyen NK, Dinh T, Park Y, Nguyen T, Yamauchi Y, Nguyen NT, Phan HP. Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2022; 18:e2105748. [PMID: 34874620 DOI: 10.1002/smll.202105748] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 09/20/2021] [Revised: 10/23/2021] [Indexed: 06/13/2023]
Abstract
Transformation of conventional 2D platforms into unusual 3D configurations provides exciting opportunities for sensors, electronics, optical devices, and biological systems. Engineering material properties or controlling and modulating stresses in thin films to pop-up 3D structures out of standard planar surfaces has been a highly active research topic over the last decade. Implementation of 3D micro and nanoarchitectures enables unprecedented functionalities including multiplexed, monolithic mechanical sensors, vertical integration of electronics components, and recording of neuron activities in 3D organoids. This paper provides an overview on stress engineering approaches to developing 3D functional microsystems. The paper systematically presents the origin of stresses generated in thin films and methods to transform a 2D design into an out-of-plane configuration. Different types of 3D micro and nanostructures, along with their applications in several areas are discussed. The paper concludes with current technical challenges and potential approaches and applications of this fast-growing research direction.
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Affiliation(s)
- Thanh-An Truong
- Queensland Micro and Nanotechnology Centre, Griffith University, Nathan, Queensland, 4111, Australia
| | - Tuan-Khoa Nguyen
- Queensland Micro and Nanotechnology Centre, Griffith University, Nathan, Queensland, 4111, Australia
| | - Hangbo Zhao
- Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA, 90089, USA
| | - Nhat-Khuong Nguyen
- Queensland Micro and Nanotechnology Centre, Griffith University, Nathan, Queensland, 4111, Australia
| | - Toan Dinh
- Centre for Future Materials, University of Southern Queensland, Ipswich, Queensland, 4305, Australia
| | - Yoonseok Park
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Thanh Nguyen
- Centre for Future Materials, University of Southern Queensland, Ipswich, Queensland, 4305, Australia
| | - Yusuke Yamauchi
- Australian Institute for Bioengineering and Nanotechnology, The University of Queensland, Brisbane, Queensland, 4072, Australia
| | - Nam-Trung Nguyen
- Queensland Micro and Nanotechnology Centre, Griffith University, Nathan, Queensland, 4111, Australia
| | - Hoang-Phuong Phan
- Queensland Micro and Nanotechnology Centre, Griffith University, Nathan, Queensland, 4111, Australia
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18
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Xu J, Ma Y, Xuan C, Ma C, Wang J. Three‐dimensional electrodes for oxygen electrocatalysis. ChemElectroChem 2021. [DOI: 10.1002/celc.202101522] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/06/2022]
Affiliation(s)
- Jinxiao Xu
- Qingdao Agricultural University College of Life Science CHINA
| | - Yingjun Ma
- Qingdao Agricultural University College of Life Science CHINA
| | - Cuijuan Xuan
- Qingdao Agricultural University College of Life Science CHINA
| | - Chuanli Ma
- Qingdao Agricultural University College of Life Science CHINA
| | - Jie Wang
- Qingdao Agricultural University 700#, Chengyang District 266109 Qingdao CHINA
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19
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Pitsalidis C, Pappa AM, Boys AJ, Fu Y, Moysidou CM, van Niekerk D, Saez J, Savva A, Iandolo D, Owens RM. Organic Bioelectronics for In Vitro Systems. Chem Rev 2021; 122:4700-4790. [PMID: 34910876 DOI: 10.1021/acs.chemrev.1c00539] [Citation(s) in RCA: 27] [Impact Index Per Article: 9.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 02/07/2023]
Abstract
Bioelectronics have made strides in improving clinical diagnostics and precision medicine. The potential of bioelectronics for bidirectional interfacing with biology through continuous, label-free monitoring on one side and precise control of biological activity on the other has extended their application scope to in vitro systems. The advent of microfluidics and the considerable advances in reliability and complexity of in vitro models promise to eventually significantly reduce or replace animal studies, currently the gold standard in drug discovery and toxicology testing. Bioelectronics are anticipated to play a major role in this transition offering a much needed technology to push forward the drug discovery paradigm. Organic electronic materials, notably conjugated polymers, having demonstrated technological maturity in fields such as solar cells and light emitting diodes given their outstanding characteristics and versatility in processing, are the obvious route forward for bioelectronics due to their biomimetic nature, among other merits. This review highlights the advances in conjugated polymers for interfacing with biological tissue in vitro, aiming ultimately to develop next generation in vitro systems. We showcase in vitro interfacing across multiple length scales, involving biological models of varying complexity, from cell components to complex 3D cell cultures. The state of the art, the possibilities, and the challenges of conjugated polymers toward clinical translation of in vitro systems are also discussed throughout.
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Affiliation(s)
- Charalampos Pitsalidis
- Department of Physics, Khalifa University of Science and Technology, P.O. Box 127788, Abu Dhabi 127788, UAE.,Department of Chemical Engineering and Biotechnology, University of Cambridge Philippa Fawcett Drive, Cambridge CB3 0AS, U.K
| | - Anna-Maria Pappa
- Department of Biomedical Engineering, Khalifa University of Science and Technology, P.O. Box 127788, Abu Dhabi 127788, UAE
| | - Alexander J Boys
- Department of Chemical Engineering and Biotechnology, University of Cambridge Philippa Fawcett Drive, Cambridge CB3 0AS, U.K
| | - Ying Fu
- Department of Chemical Engineering and Biotechnology, University of Cambridge Philippa Fawcett Drive, Cambridge CB3 0AS, U.K.,Department of Pure and Applied Chemistry, Technology and Innovation Centre, University of Strathclyde, Glasgow G1 1RD, U.K
| | - Chrysanthi-Maria Moysidou
- Department of Chemical Engineering and Biotechnology, University of Cambridge Philippa Fawcett Drive, Cambridge CB3 0AS, U.K
| | - Douglas van Niekerk
- Department of Chemical Engineering and Biotechnology, University of Cambridge Philippa Fawcett Drive, Cambridge CB3 0AS, U.K
| | - Janire Saez
- Department of Chemical Engineering and Biotechnology, University of Cambridge Philippa Fawcett Drive, Cambridge CB3 0AS, U.K.,Microfluidics Cluster UPV/EHU, BIOMICs Microfluidics Group, Lascaray Research Center, University of the Basque Country UPV/EHU, Avenida Miguel de Unamuno, 3, 01006 Vitoria-Gasteiz, Spain.,Ikerbasque, Basque Foundation for Science, E-48011 Bilbao, Spain
| | - Achilleas Savva
- Department of Chemical Engineering and Biotechnology, University of Cambridge Philippa Fawcett Drive, Cambridge CB3 0AS, U.K
| | - Donata Iandolo
- INSERM, U1059 Sainbiose, Université Jean Monnet, Mines Saint-Étienne, Université de Lyon, 42023 Saint-Étienne, France
| | - Róisín M Owens
- Department of Chemical Engineering and Biotechnology, University of Cambridge Philippa Fawcett Drive, Cambridge CB3 0AS, U.K
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20
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Park Y, Chung TS, Lee G, Rogers JA. Materials Chemistry of Neural Interface Technologies and Recent Advances in Three-Dimensional Systems. Chem Rev 2021; 122:5277-5316. [PMID: 34739219 DOI: 10.1021/acs.chemrev.1c00639] [Citation(s) in RCA: 18] [Impact Index Per Article: 6.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/28/2022]
Abstract
Advances in materials chemistry and engineering serve as the basis for multifunctional neural interfaces that span length scales from individual neurons to neural networks, neural tissues, and complete neural systems. Such technologies exploit electrical, electrochemical, optical, and/or pharmacological modalities in sensing and neuromodulation for fundamental studies in neuroscience research, with additional potential to serve as routes for monitoring and treating neurodegenerative diseases and for rehabilitating patients. This review summarizes the essential role of chemistry in this field of research, with an emphasis on recently published results and developing trends. The focus is on enabling materials in diverse device constructs, including their latest utilization in 3D bioelectronic frameworks formed by 3D printing, self-folding, and mechanically guided assembly. A concluding section highlights key challenges and future directions.
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Affiliation(s)
- Yoonseok Park
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
| | - Ted S Chung
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States.,Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, United States
| | - Geumbee Lee
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States.,Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, United States.,Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States.,Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, Illinois 60208, United States.,Department of Chemistry, Northwestern University, Evanston, Illinois 60208, United States.,Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208, United States.,Department of Neurological Surgery, Northwestern University, Evanston, Illinois 60208, United States
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21
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Zhang L, Zhang C, Tan Z, Tang J, Yao C, Hao B. Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing. MICROMACHINES 2021; 12:mi12111358. [PMID: 34832770 PMCID: PMC8619378 DOI: 10.3390/mi12111358] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 10/11/2021] [Accepted: 10/28/2021] [Indexed: 12/24/2022]
Abstract
In recent years, with the rapid development of the flexible electronics industry, there is an urgent need for a large-area, multilayer, and high-production integrated manufacturing technology for scalable and flexible electronic products. To solve this technical demand, researchers have proposed and developed microtransfer printing technology, which picks up and prints inks in various material forms from the donor substrate to the target substrate, successfully realizing the integrated manufacturing of flexible electronic products. This review retrospects the representative research progress of microtransfer printing technology for the production of flexible electronic products and emphasizes the summary of seal materials, the basic principles of various transfer technology and fracture mechanics models, and the influence of different factors on the transfer effect. In the end, the unique functions, technical features, and related printing examples of each technology are concluded and compared, and the prospects of further research work on microtransfer printing technology is finally presented.
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22
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Cheng X, Zhang F, Bo R, Shen Z, Pang W, Jin T, Song H, Xue Z, Zhang Y. An Anti-Fatigue Design Strategy for 3D Ribbon-Shaped Flexible Electronics. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2021; 33:e2102684. [PMID: 34342056 DOI: 10.1002/adma.202102684] [Citation(s) in RCA: 15] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/08/2021] [Revised: 06/03/2021] [Indexed: 06/13/2023]
Abstract
Three-dimensional (3D) flexible electronics represent an emerging area of intensive attention in recent years, owing to their broad-ranging applications in wearable electronics, flexible robots, tissue/cell scaffolds, among others. The widely adopted 3D conductive mesostructures in the functional device systems would inevitably undergo repetitive out-of-plane compressions during practical operations, and thus, anti-fatigue design strategies are of great significance to improve the reliability of 3D flexible electronics. Previous studies mainly focused on the fatigue failure behavior of planar ribbon-shaped geometries, while anti-fatigue design strategies and predictive failure criteria addressing 3D ribbon-shaped mesostructures are still lacking. This work demonstrates an anti-fatigue strategy to significantly prolong the fatigue life of 3D ribbon-shaped flexible electronics by switching the metal-dominated failure to desired polymer-dominated failure. Combined in situ measurements and computational studies allow the establishment of a failure criterion capable of accurately predicting fatigue lives under out-of-plane compressions, thereby providing useful guidelines for the design of anti-fatigue mesostructures with diverse 3D geometries. Two mechanically reliable 3D devices, including a resistance-type vibration sensor and a janus sensor capable of decoupled temperature measurements, serve as two demonstrative examples to highlight potential applications in long-term health monitoring and human-like robotic perception, respectively.
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Affiliation(s)
- Xu Cheng
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Fan Zhang
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Renheng Bo
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Zhangming Shen
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Wenbo Pang
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Tianqi Jin
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Honglie Song
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Zhaoguo Xue
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Yihui Zhang
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
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23
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Park Y, Chung TS, Rogers JA. Three dimensional bioelectronic interfaces to small-scale biological systems. Curr Opin Biotechnol 2021; 72:1-7. [PMID: 34358775 DOI: 10.1016/j.copbio.2021.07.023] [Citation(s) in RCA: 8] [Impact Index Per Article: 2.7] [Reference Citation Analysis] [Abstract] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/05/2021] [Revised: 07/06/2021] [Accepted: 07/17/2021] [Indexed: 11/26/2022]
Abstract
Recent advances in bio-interface technologies establish a rich range of electronic, optoelectronic, thermal, and chemical options for probing and modulating the behaviors of small-scale three dimensional (3D) biological constructs (e.g. organoids, spheroids, and assembloids). These approaches represent qualitative advances over traditional alternatives due to their ability to extend broadly into volumetric spaces and/or to wrap tightly curved surfaces of natural or artificial tissues. Thin deformable sheets, filamentary penetrating pins, open mesh structures and 3D interconnected networks represent some of the most effective design strategies in this emerging field of bioelectronics. This review focuses on recent developments, with an emphasis on multimodal interfaces in the form of tissue-embedding scaffolds and tissue-surrounding frameworks.
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Affiliation(s)
- Yoonseok Park
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Ted S Chung
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA; Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA; Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA; Department of Materials Science and Engineering, Northwestern, University, Evanston, IL 60208, USA; Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208, USA; Department of Chemistry, Northwestern University, Evanston, IL 60208, USA; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA; Department of Neurological Surgery, Northwestern University, Evanston, IL 60208, United States.
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24
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Hou K, Yang C, Shi J, Kuang B, Tian B. Nano- and Microscale Optical and Electrical Biointerfaces and Their Relevance to Energy Research. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2021; 17:e2100165. [PMID: 34142435 DOI: 10.1002/smll.202100165] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/10/2021] [Revised: 03/13/2021] [Indexed: 06/12/2023]
Abstract
Different research fields in energy sciences, such as photovoltaics for solar energy conversion, supercapacitors for energy storage, electrocatalysis for clean energy conversion technologies, and materials-bacterial hybrid for CO2 fixation have been under intense investigations over the past decade. In recent years, new platforms for biointerface designs have emerged from the energy conversion and storage principles. This paper reviews recent advances in nano- and microscale materials/devices for optical and electrical biointerfaces. First, a connection is drawn between biointerfaces and energy science, and how these two distinct research fields can be connected is summarized. Then, a brief overview of current available tools for biointerface studies is presented. Third, three representative biointerfaces are reviewed, including neural, cardiac, and bacterial biointerfaces, to show how to apply these tools and principles to biointerface design and research. Finally, two possible future research directions for nano- and microscale biointerfaces are proposed.
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Affiliation(s)
- Kun Hou
- Department of Chemistry, The University of Chicago, Chicago, IL, 60637, USA
| | - Chuanwang Yang
- Department of Chemistry, The University of Chicago, Chicago, IL, 60637, USA
| | - Jiuyun Shi
- Department of Chemistry, The University of Chicago, Chicago, IL, 60637, USA
| | - Boya Kuang
- Department of Chemistry, The University of Chicago, Chicago, IL, 60637, USA
| | - Bozhi Tian
- Department of Chemistry, The University of Chicago, Chicago, IL, 60637, USA
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25
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Chen X, Kandel ME, Popescu G. Spatial light interference microscopy: principle and applications to biomedicine. ADVANCES IN OPTICS AND PHOTONICS 2021; 13:353-425. [PMID: 35494404 PMCID: PMC9048520 DOI: 10.1364/aop.417837] [Citation(s) in RCA: 27] [Impact Index Per Article: 9.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/03/2023]
Abstract
In this paper, we review spatial light interference microscopy (SLIM), a common-path, phase-shifting interferometer, built onto a phase-contrast microscope, with white-light illumination. As one of the most sensitive quantitative phase imaging (QPI) methods, SLIM allows for speckle-free phase reconstruction with sub-nanometer path-length stability. We first review image formation in QPI, scattering, and full-field methods. Then, we outline SLIM imaging from theory and instrumentation to diffraction tomography. Zernike's phase-contrast microscopy, phase retrieval in SLIM, and halo removal algorithms are discussed. Next, we discuss the requirements for operation, with a focus on software developed in-house for SLIM that enables high-throughput acquisition, whole slide scanning, mosaic tile registration, and imaging with a color camera. We introduce two methods for solving the inverse problem using SLIM, white-light tomography, and Wolf phase tomography. Lastly, we review the applications of SLIM in basic science and clinical studies. SLIM can study cell dynamics, cell growth and proliferation, cell migration, mass transport, etc. In clinical settings, SLIM can assist with cancer studies, reproductive technology, blood testing, etc. Finally, we review an emerging trend, where SLIM imaging in conjunction with artificial intelligence brings computational specificity and, in turn, offers new solutions to outstanding challenges in cell biology and pathology.
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26
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Kwak JW, Han M, Xie Z, Chung HU, Lee JY, Avila R, Yohay J, Chen X, Liang C, Patel M, Jung I, Kim J, Namkoong M, Kwon K, Guo X, Ogle C, Grande D, Ryu D, Kim DH, Madhvapathy S, Liu C, Yang DS, Park Y, Caldwell R, Banks A, Xu S, Huang Y, Fatone S, Rogers JA. Wireless sensors for continuous, multimodal measurements at the skin interface with lower limb prostheses. Sci Transl Med 2021; 12:12/574/eabc4327. [PMID: 33328330 DOI: 10.1126/scitranslmed.abc4327] [Citation(s) in RCA: 57] [Impact Index Per Article: 19.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/24/2020] [Accepted: 11/17/2020] [Indexed: 12/16/2022]
Abstract
Precise form-fitting of prosthetic sockets is important for the comfort and well-being of persons with limb amputations. Capabilities for continuous monitoring of pressure and temperature at the skin-prosthesis interface can be valuable in the fitting process and in monitoring for the development of dangerous regions of increased pressure and temperature as limb volume changes during daily activities. Conventional pressure transducers and temperature sensors cannot provide comfortable, irritation-free measurements because of their relatively rigid construction and requirements for wired interfaces to external data acquisition hardware. Here, we introduce a millimeter-scale pressure sensor that adopts a soft, three-dimensional design that integrates into a thin, flexible battery-free, wireless platform with a built-in temperature sensor to allow operation in a noninvasive, imperceptible fashion directly at the skin-prosthesis interface. The sensor system mounts on the surface of the skin of the residual limb, in single or multiple locations of interest. A wireless reader module attached to the outside of the prosthetic socket wirelessly provides power to the sensor and wirelessly receives data from it, for continuous long-range transmission to a standard consumer electronic device such as a smartphone or tablet computer. Characterization of both the sensor and the system, together with theoretical analysis of the key responses, illustrates linear, accurate responses and the ability to address the entire range of relevant pressures and to capture skin temperature accurately, both in a continuous mode. Clinical application in two prosthesis users demonstrates the functionality and feasibility of this soft, wireless system.
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Affiliation(s)
- Jean Won Kwak
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, IL 60611, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Mengdi Han
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, IL 60611, USA
| | - Zhaoqian Xie
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, International Research Center for Computational Mechanics, Dalian University of Technology, Dalian 116023, China
| | | | | | - Raudel Avila
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Jessica Yohay
- Prosthetics-Orthotics Center, Northwestern University, Chicago, IL 60611, USA
| | - Xuexian Chen
- Academy for Advanced Interdisciplinary Studies, Peking University, Beijing, China
| | - Cunman Liang
- Key Laboratory of Mechanism Theory and Equipment Design of Ministry of Education, School of Mechanical Engineering, Tianjin University, Tianjin, China
| | - Manish Patel
- University of Illinois College of Medicine at Chicago, Chicago, IL 60612, USA
| | - Inhwa Jung
- Department of Mechanical Engineering, Kyung Hee University, Yongin 17104, South Korea
| | - Jongwon Kim
- Department of Mechanical Engineering, Kyung Hee University, Yongin 17104, South Korea.,Photo-Electronic Hybrids Research Center, Korea Institute of Science and Technology (KIST), Seoul 136-791, South Korea
| | - Myeong Namkoong
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, IL 60611, USA.,Department of Biomedical Engineering, Texas A&M University, College Station, TX 77843, USA
| | - Kyeongha Kwon
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, IL 60611, USA
| | - Xu Guo
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, International Research Center for Computational Mechanics, Dalian University of Technology, Dalian 116023, China
| | | | | | | | | | - Surabhi Madhvapathy
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, IL 60611, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Claire Liu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, IL 60611, USA.,Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Da Som Yang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, IL 60611, USA
| | - Yoonseok Park
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, IL 60611, USA
| | - Ryan Caldwell
- Prosthetics-Orthotics Center, Northwestern University, Chicago, IL 60611, USA.,Scheck & Siress Prosthetics and Orthotics, Schaumburg, IL 60173, USA
| | - Anthony Banks
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, IL 60611, USA
| | - Shuai Xu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, IL 60611, USA.,Sibel Inc., Evanston, IL 60208, USA.,Department of Dermatology, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
| | - Yonggang Huang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Stefania Fatone
- Prosthetics-Orthotics Center, Northwestern University, Chicago, IL 60611, USA
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, IL 60611, USA. .,Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
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27
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Sunwoo SH, Ha KH, Lee S, Lu N, Kim DH. Wearable and Implantable Soft Bioelectronics: Device Designs and Material Strategies. Annu Rev Chem Biomol Eng 2021; 12:359-391. [PMID: 34097846 DOI: 10.1146/annurev-chembioeng-101420-024336] [Citation(s) in RCA: 42] [Impact Index Per Article: 14.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/09/2022]
Abstract
High-performance wearable and implantable devices capable of recording physiological signals and delivering appropriate therapeutics in real time are playing a pivotal role in revolutionizing personalized healthcare. However, the mechanical and biochemical mismatches between rigid, inorganic devices and soft, organic human tissues cause significant trouble, including skin irritation, tissue damage, compromised signal-to-noise ratios, and limited service time. As a result, profuse research efforts have been devoted to overcoming these issues by using flexible and stretchable device designs and soft materials. Here, we summarize recent representative research and technological advances for soft bioelectronics, including conformable and stretchable device designs, various types of soft electronic materials, and surface coating and treatment methods. We also highlight applications of these strategies to emerging soft wearable and implantable devices. We conclude with some current limitations and offer future prospects of this booming field.
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Affiliation(s)
- Sung-Hyuk Sunwoo
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea; .,School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, Seoul 08826, Republic of Korea
| | - Kyoung-Ho Ha
- Department of Mechanical Engineering, The University of Texas at Austin, Texas 78712, USA;
| | - Sangkyu Lee
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea;
| | - Nanshu Lu
- Department of Mechanical Engineering, The University of Texas at Austin, Texas 78712, USA; .,Center for Mechanics of Solids, Structures and Materials, Department of Aerospace Engineering and Engineering Mechanics, Department of Biomedical Engineering, and Texas Material Institute, The University of Texas at Austin, Texas 78712, USA
| | - Dae-Hyeong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea; .,School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, Seoul 08826, Republic of Korea.,Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
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28
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Compliant 3D frameworks instrumented with strain sensors for characterization of millimeter-scale engineered muscle tissues. Proc Natl Acad Sci U S A 2021; 118:2100077118. [PMID: 33941674 DOI: 10.1073/pnas.2100077118] [Citation(s) in RCA: 18] [Impact Index Per Article: 6.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/21/2022] Open
Abstract
Tissue-on-chip systems represent promising platforms for monitoring and controlling tissue functions in vitro for various purposes in biomedical research. The two-dimensional (2D) layouts of these constructs constrain the types of interactions that can be studied and limit their relevance to three-dimensional (3D) tissues. The development of 3D electronic scaffolds and microphysiological devices with geometries and functions tailored to realistic 3D tissues has the potential to create important possibilities in advanced sensing and control. This study presents classes of compliant 3D frameworks that incorporate microscale strain sensors for high-sensitivity measurements of contractile forces of engineered optogenetic muscle tissue rings, supported by quantitative simulations. Compared with traditional approaches based on optical microscopy, these 3D mechanical frameworks and sensing systems can measure not only motions but also contractile forces with high accuracy and high temporal resolution. Results of active tension force measurements of engineered muscle rings under different stimulation conditions in long-term monitoring settings for over 5 wk and in response to various chemical and drug doses demonstrate the utility of such platforms in sensing and modulation of muscle and other tissues. Possibilities for applications range from drug screening and disease modeling to biohybrid robotic engineering.
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29
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Phan HP. Implanted Flexible Electronics: Set Device Lifetime with Smart Nanomaterials. MICROMACHINES 2021; 12:mi12020157. [PMID: 33562545 PMCID: PMC7915962 DOI: 10.3390/mi12020157] [Citation(s) in RCA: 10] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 01/14/2021] [Revised: 01/30/2021] [Accepted: 02/01/2021] [Indexed: 11/22/2022]
Abstract
Flexible electronics is one of the most attractive and anticipated markets in the internet-of-things era, covering a broad range of practical and industrial applications from displays and energy harvesting to health care devices. The mechanical flexibility, combined with high performance electronics, and integrated on a soft substrate offer unprecedented functionality for biomedical applications. This paper presents a brief snapshot on the materials of choice for niche flexible bio-implanted devices that address the requirements for both biodegradable and long-term operational streams. The paper also discusses potential future research directions in this rapidly growing field.
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Affiliation(s)
- Hoang-Phuong Phan
- Queensland Micro and Nanotechnology Centre, Griffith University, Brisbane, QLD 4111, Australia
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30
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Zhang X, Medina L, Cai H, Aksyuk V, Espinosa HD, Lopez D. Kirigami Engineering-Nanoscale Structures Exhibiting a Range of Controllable 3D Configurations. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2021; 33:e2005275. [PMID: 33349995 DOI: 10.1002/adma.202005275] [Citation(s) in RCA: 8] [Impact Index Per Article: 2.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/03/2020] [Revised: 11/03/2020] [Indexed: 06/12/2023]
Abstract
Kirigami structures provide a promising approach to transform flat films into 3D complex structures that are difficult to achieve by conventional fabrication approaches. By designing the cutting geometry, it is shown that distinct buckling-induced out-of-plane configurations can be obtained, separated by a sharp transition characterized by a critical geometric dimension of the structures. In situ electron microscopy experiments reveal the effect of the ratio between the in-plane cut size and film thickness on out-of-plane configurations. Moreover, geometrically nonlinear finite element analyses (FEA) accurately predict the out-of-plane modes measured experimentally, their transition as a function of cut geometry, and provide the stress-strain response of the kirigami structures. The combined computational-experimental approach and results reported here represent a step forward in the characterization of thin films experiencing buckling-induced out-of-plane shape transformations and provide a path to control 3D configurations of micro- and nanoscale buckling-induced kirigami structures. The out-of-plane configurations promise great utility in the creation of micro- and nanoscale systems that can harness such structural behavior, such as optical scanning micromirrors, novel actuators, and nanorobotics. This work is of particular significance as the kirigami dimensions approach the sub-micrometer scale which is challenging to achieve with conventional micro-electromechanical system technologies.
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Affiliation(s)
- Xu Zhang
- Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213, USA
| | - Lior Medina
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Theoretical and Applied Mechanics, Northwestern University, Evanston, IL, 60208, USA
| | - Haogang Cai
- Tech4Health Institute and Department of Radiology, NYU Langone Health, New York, NY, 10016, USA
| | - Vladimir Aksyuk
- Microsystems and Nanotechnology Division, National Institute of Standards and Technology, Gaithersburg, MD, 20899, USA
| | - Horacio D Espinosa
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Theoretical and Applied Mechanics, Northwestern University, Evanston, IL, 60208, USA
| | - Daniel Lopez
- Department of Electrical Engineering and Materials Research Institute, Penn State University, University Park, PA, 16802, USA
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31
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Ji W, Zhu J, Wu W, Wang N, Wang J, Wu J, Wu Q, Wang X, Yu C, Wei G, Li L, Huo F. Wearable Sweat Biosensors Refresh Personalized Health/Medical Diagnostics. RESEARCH (WASHINGTON, D.C.) 2021; 2021:9757126. [PMID: 34778790 PMCID: PMC8557357 DOI: 10.34133/2021/9757126] [Citation(s) in RCA: 14] [Impact Index Per Article: 4.7] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/04/2021] [Accepted: 09/18/2021] [Indexed: 04/14/2023]
Abstract
Sweat contains a broad range of critical biomarkers including ions, small molecules, and macromolecules that may indirectly or directly reflect the health status of the human body and thereby help track disease progression. Wearable sweat biosensors enable the collection and analysis of sweat in situ, achieving real-time, continuous, and noninvasive monitoring of human biochemical parameters at the molecular level. This review summarizes the physiological/pathological information of sweat and wearable sweat biosensors. First, the production of sweat pertaining to various electrolytes, metabolites, and proteins is described. Then, the compositions of the wearable sweat biosensors are summarized, and the design of each subsystem is introduced in detail. The latest applications of wearable sweat biosensors for outdoor, hospital, and family monitoring are highlighted. Finally, the review provides a summary and an outlook on the future developments and challenges of wearable sweat biosensors with the aim of advancing the field of wearable sweat monitoring technology.
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Affiliation(s)
- Wenhui Ji
- Key Laboratory of Flexible Electronics & Institute of Advanced Materials, Nanjing Tech University, Nanjing 211816, China
| | - Jingyu Zhu
- Key Laboratory of Flexible Electronics & Institute of Advanced Materials, Nanjing Tech University, Nanjing 211816, China
| | - Wanxia Wu
- Key Laboratory of Flexible Electronics & Institute of Advanced Materials, Nanjing Tech University, Nanjing 211816, China
| | - Nanxiang Wang
- Key Laboratory of Flexible Electronics & Institute of Advanced Materials, Nanjing Tech University, Nanjing 211816, China
| | - Jiqing Wang
- Key Laboratory of Flexible Electronics & Institute of Advanced Materials, Nanjing Tech University, Nanjing 211816, China
| | - Jiansheng Wu
- Key Laboratory of Flexible Electronics & Institute of Advanced Materials, Nanjing Tech University, Nanjing 211816, China
| | - Qiong Wu
- Key Laboratory of Flexible Electronics & Institute of Advanced Materials, Nanjing Tech University, Nanjing 211816, China
| | - Xuewen Wang
- Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, Xi'an 710072, China
| | - Changmin Yu
- Key Laboratory of Flexible Electronics & Institute of Advanced Materials, Nanjing Tech University, Nanjing 211816, China
| | - Gaofeng Wei
- Naval Medical Department, Naval Medical University, Shanghai 200433, China
| | - Lin Li
- Key Laboratory of Flexible Electronics & Institute of Advanced Materials, Nanjing Tech University, Nanjing 211816, China
- Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, Xi'an 710072, China
- The Institute of Flexible Electronics (IFE, Future Technologies), Xiamen University, Xiamen 361005, China
| | - Fengwei Huo
- Key Laboratory of Flexible Electronics & Institute of Advanced Materials, Nanjing Tech University, Nanjing 211816, China
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32
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Li H, Liu H, Sun M, Huang Y, Xu L. 3D Interfacing between Soft Electronic Tools and Complex Biological Tissues. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2021; 33:e2004425. [PMID: 33283351 DOI: 10.1002/adma.202004425] [Citation(s) in RCA: 30] [Impact Index Per Article: 10.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/29/2020] [Revised: 08/08/2020] [Indexed: 06/12/2023]
Abstract
Recent developments in soft functional materials have created opportunities for building bioelectronic devices with tissue-like mechanical properties. Their integration with the human body could enable advanced sensing and stimulation for medical diagnosis and therapies. However, most of the available soft electronics are constructed as planar sheets, which are difficult to interface with the target organs and tissues that have complex 3D structures. Here, the recent approaches are highlighted to building 3D interfaces between soft electronic tools and complex biological organs and tissues. Examples involve mesh devices for conformal contact, imaging-guided fabrication of organ-specific electronics, miniaturized probes for neurointerfaces, instrumented scaffold for tissue engineering, and many other soft 3D systems. They represent diverse routes for reconciling the interfacial mismatches between electronic tools and biological tissues. The remaining challenges include device scaling to approach the complexity of target organs, biological data acquisition and processing, 3D manufacturing techniques, etc., providing a range of opportunities for scientific research and technological innovation.
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Affiliation(s)
- Hegeng Li
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, 999077, China
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Hongzhen Liu
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, 999077, China
| | - Mingze Sun
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, 999077, China
| | - YongAn Huang
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Lizhi Xu
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, 999077, China
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33
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Li H, Wang J, Fang Y. Bioinspired flexible electronics for seamless neural interfacing and chronic recording. NANOSCALE ADVANCES 2020; 2:3095-3102. [PMID: 36134275 PMCID: PMC9417495 DOI: 10.1039/d0na00323a] [Citation(s) in RCA: 7] [Impact Index Per Article: 1.8] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/24/2020] [Accepted: 05/29/2020] [Indexed: 05/27/2023]
Abstract
Implantable neural probes are among the most widely applied tools for the understanding of neural circuit functions and the treatment of neurological disorders. Despite remarkable progress in recent years, it is still challenging for conventional rigid probes to achieve stable neural recording over long periods of time. Recently, flexible electronics with biomimetic structures and mechanical properties have been demonstrated for the formation of seamless probe-neural interfaces, enabling long-term recording stability. In this review, we provide an overview of bioinspired flexible electronics, from their structural design to probe-brain interfaces and chronic neural recording applications. Opportunities of bioinspired flexible electronics in fundamental neuroscience and clinical studies are also discussed.
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Affiliation(s)
- Hongbian Li
- CAS Key Laboratory for Biomedical Effects of Nanomaterials and Nanosafety, CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology Beijing 100190 China
| | - Jinfen Wang
- CAS Key Laboratory for Biomedical Effects of Nanomaterials and Nanosafety, CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology Beijing 100190 China
| | - Ying Fang
- CAS Key Laboratory for Biomedical Effects of Nanomaterials and Nanosafety, CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology Beijing 100190 China
- CAS Center for Excellence in Brain Science and Intelligence Technology, Institute of Neuroscience, Chinese Academy of Sciences Shanghai 200031 China
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34
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Qiao L, Benzigar MR, Subramony JA, Lovell NH, Liu G. Advances in Sweat Wearables: Sample Extraction, Real-Time Biosensing, and Flexible Platforms. ACS APPLIED MATERIALS & INTERFACES 2020; 12:34337-34361. [PMID: 32579332 DOI: 10.1021/acsami.0c07614] [Citation(s) in RCA: 45] [Impact Index Per Article: 11.3] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/24/2023]
Abstract
Wearable biosensors for sweat-based analysis are gaining wide attention due to their potential use in personal health monitoring. Flexible wearable devices enable sweat analysis at the molecular level, facilitating noninvasive monitoring of physiological states via real-time monitoring of chemical biomarkers. Advances in sweat extraction technology, real-time biosensors, stretchable materials, device integration, and wireless digital technologies have led to the development of wearable sweat-biosensing devices that are light, flexible, comfortable, aesthetic, affordable, and informative. Herein, we summarize recent advances of sweat wearables from the aspects of sweat extraction, fabrication of stretchable biomaterials, and design of biosensing modules to enable continuous biochemical monitoring, which are essential for a biosensing device. Key chemical components of sweat, sweat capture methodologies, and considerations of flexible substrates for integrating real-time biosensors with electronics to bring innovations in the art of wearables are elaborated. The strategies and challenges involved in improving the wearable biosensing performance and the perspectives for designing sweat-based wearable biosensing devices are discussed.
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Affiliation(s)
- Laicong Qiao
- Graduate School of Biomedical Engineering, University of New South Wales, Sydney, NSW 2052, Australia
| | - Mercy Rose Benzigar
- Graduate School of Biomedical Engineering, University of New South Wales, Sydney, NSW 2052, Australia
| | - J Anand Subramony
- Antibody Discovery and Protein Engineering, BioPharmaceuticals R&D, AstraZeneca, Gaithersburg, Maryland 20878, United States
| | - Nigel H Lovell
- Graduate School of Biomedical Engineering, University of New South Wales, Sydney, NSW 2052, Australia
| | - Guozhen Liu
- Graduate School of Biomedical Engineering, University of New South Wales, Sydney, NSW 2052, Australia
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35
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Chen X, Shehzad K, Gao L, Long M, Guo H, Qin S, Wang X, Wang F, Shi Y, Hu W, Xu Y, Wang X. Graphene Hybrid Structures for Integrated and Flexible Optoelectronics. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2020; 32:e1902039. [PMID: 31282020 DOI: 10.1002/adma.201902039] [Citation(s) in RCA: 47] [Impact Index Per Article: 11.8] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/31/2019] [Revised: 05/03/2019] [Indexed: 05/13/2023]
Abstract
Graphene (Gr) has many unique properties including gapless band structure, ultrafast carrier dynamics, high carrier mobility, and flexibility, making it appealing for ultrafast, broadband, and flexible optoelectronics. To overcome its intrinsic limit of low absorption, hybrid structures are exploited to improve the device performance. Particularly, van der Waals heterostructures with different photosensitive materials and photonic structures are very effective for improving photodetection and modulation efficiency. With such hybrid structures, Gr hybrid photodetectors can operate from ultraviolet to terahertz, with significantly improved R (up to 109 A W-1 ) and bandwidth (up to 128 GHz). Furthermore, integration of Gr with silicon (Si) complementary metal-oxide-semiconductor (CMOS) circuits, the human body, and soft tissues is successfully demonstrated, opening promising opportunities for wearable sensors and biomedical electronics. Here, the recent progress in using Gr hybrid structures toward high-performance photodetectors and integrated optoelectronic applications is reviewed.
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Affiliation(s)
- Xiaoqing Chen
- School of Microelectronics, Xidian University, Xian, 710071, China
- National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China
| | - Khurram Shehzad
- College of Information Science and Electronic Engineering, College of Microelectronics, ZJU-UIUC Joint Institute, State Key Laboratory of Silicon Materials, Zhejiang University, Hangzhou, Zhejiang, 310027, China
| | - Li Gao
- Key Laboratory for Organic Electronics and Information Displays (KLOEID), Institute of Advanced Materials (IAM), School of Materials Science and Engineering, Nanjing University of Posts and Telecommunications, Nanjing, 210046, China
| | - Mingsheng Long
- National Laboratory for Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, 500 Yu Tian Road, Shanghai, 200083, China
| | - Hui Guo
- School of Microelectronics, Xidian University, Xian, 710071, China
| | - Shuchao Qin
- National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China
| | - Xiaomu Wang
- National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China
| | - Fengqiu Wang
- National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China
| | - Yi Shi
- National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China
| | - Weida Hu
- National Laboratory for Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, 500 Yu Tian Road, Shanghai, 200083, China
| | - Yang Xu
- College of Information Science and Electronic Engineering, College of Microelectronics, ZJU-UIUC Joint Institute, State Key Laboratory of Silicon Materials, Zhejiang University, Hangzhou, Zhejiang, 310027, China
| | - Xinran Wang
- National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China
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36
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Song E, Li J, Won SM, Bai W, Rogers JA. Materials for flexible bioelectronic systems as chronic neural interfaces. NATURE MATERIALS 2020; 19:590-603. [PMID: 32461684 DOI: 10.1038/s41563-020-0679-7] [Citation(s) in RCA: 170] [Impact Index Per Article: 42.5] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/14/2019] [Accepted: 04/09/2020] [Indexed: 05/03/2023]
Abstract
Engineered systems that can serve as chronically stable, high-performance electronic recording and stimulation interfaces to the brain and other parts of the nervous system, with cellular-level resolution across macroscopic areas, are of broad interest to the neuroscience and biomedical communities. Challenges remain in the development of biocompatible materials and the design of flexible implants for these purposes, where ulimate goals are for performance attributes approaching those of conventional wafer-based technologies and for operational timescales reaching the human lifespan. This Review summarizes recent advances in this field, with emphasis on active and passive constituent materials, design architectures and integration methods that support necessary levels of biocompatibility, electronic functionality, long-term stable operation in biofluids and reliability for use in vivo. Bioelectronic systems that enable multiplexed electrophysiological mapping across large areas at high spatiotemporal resolution are surveyed, with a particular focus on those with proven chronic stability in live animal models and scalability to thousands of channels over human-brain-scale dimensions. Research in materials science will continue to underpin progress in this field of study.
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Affiliation(s)
- Enming Song
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
| | - Jinghua Li
- Department of Materials Science and Engineering, The Ohio State University, Columbus, OH, USA
- Center for Chronic Brain Injury, The Ohio State University, Columbus, OH, USA
| | - Sang Min Won
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea
| | - Wubin Bai
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - John A Rogers
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.
- Department of Neurological Surgery, Northwestern University, Evanston, IL, USA.
- Department of Chemistry, Northwestern University, Evanston, IL, USA.
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
- Department of Electrical Engineering, Northwestern University, Evanston, IL, USA.
- Department of Computer Science, Northwestern University, Evanston, IL, USA.
- Feinberg School of Medicine, Northwestern University, Evanston, IL, USA.
- Querrey-Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
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37
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Karnaushenko D, Kang T, Bandari VK, Zhu F, Schmidt OG. 3D Self-Assembled Microelectronic Devices: Concepts, Materials, Applications. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2020; 32:e1902994. [PMID: 31512308 DOI: 10.1002/adma.201902994] [Citation(s) in RCA: 35] [Impact Index Per Article: 8.8] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/10/2019] [Revised: 06/17/2019] [Indexed: 06/10/2023]
Abstract
Modern microelectronic systems and their components are essentially 3D devices that have become smaller and lighter in order to improve performance and reduce costs. To maintain this trend, novel materials and technologies are required that provide more structural freedom in 3D over conventional microelectronics, as well as easier parallel fabrication routes while maintaining compatability with existing manufacturing methods. Self-assembly of initially planar membranes into complex 3D architectures offers a wealth of opportunities to accommodate thin-film microelectronic functionalities in devices and systems possessing improved performance and higher integration density. Existing work in this field, with a focus on components constructed from 3D self-assembly, is reviewed, and an outlook on their application potential in tomorrow's microelectronics world is provided.
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Affiliation(s)
- Daniil Karnaushenko
- Institute for Integrative Nanosciences, Leibniz IFW Dresden, Dresden, 01069, Germany
| | - Tong Kang
- Institute for Integrative Nanosciences, Leibniz IFW Dresden, Dresden, 01069, Germany
| | - Vineeth K Bandari
- Institute for Integrative Nanosciences, Leibniz IFW Dresden, Dresden, 01069, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz, 09107, Germany
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Rosenbergstraße 6, TU Chemnitz, Chemnitz, 09126, Germany
| | - Feng Zhu
- Institute for Integrative Nanosciences, Leibniz IFW Dresden, Dresden, 01069, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz, 09107, Germany
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Rosenbergstraße 6, TU Chemnitz, Chemnitz, 09126, Germany
| | - Oliver G Schmidt
- Institute for Integrative Nanosciences, Leibniz IFW Dresden, Dresden, 01069, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz, 09107, Germany
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Rosenbergstraße 6, TU Chemnitz, Chemnitz, 09126, Germany
- School of Science, TU Dresden, Dresden, 01062, Germany
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38
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Won SM, Song E, Reeder JT, Rogers JA. Emerging Modalities and Implantable Technologies for Neuromodulation. Cell 2020; 181:115-135. [DOI: 10.1016/j.cell.2020.02.054] [Citation(s) in RCA: 63] [Impact Index Per Article: 15.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/09/2020] [Revised: 02/23/2020] [Accepted: 02/25/2020] [Indexed: 02/08/2023]
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39
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Wang Y, Kandel ME, Fanous MJ, Hu C, Chen H, Lu X, Popescu G. Harmonically decoupled gradient light interference microscopy (HD-GLIM). OPTICS LETTERS 2020; 45:1487-1490. [PMID: 32163998 PMCID: PMC7716386 DOI: 10.1364/ol.379732] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/04/2019] [Accepted: 02/01/2020] [Indexed: 06/10/2023]
Abstract
Differential phase sensitive methods, such as Nomarski microscopy, play an important role in quantitative phase imaging due to their compatibility with partially coherent illumination and excellent optical sectioning ability. In this Letter, we propose a new system, to the best of our knowledge, to retrieve differential phase information from transparent samples. It is based on a 4f optical system with an amplitude-type spatial light modulator (SLM), which removes the need for traditional differential interference contrast (DIC) optics and specialized phase-only SLMs. We demonstrate the principle of harmonically decoupled gradient light interference microscopy using standard samples, as well as static and dynamic biospecimens.
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Affiliation(s)
- Yi Wang
- Quantitative Light Imaging Laboratory, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
- Guangdong Provincial Key Laboratory of Nanophotonic Functional Materials and Devices, South China Normal University, Guangzhou 510006, China
| | - Mikhail E. Kandel
- Quantitative Light Imaging Laboratory, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
- Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Michael J. Fanous
- Quantitative Light Imaging Laboratory, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
- Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Chenfei Hu
- Quantitative Light Imaging Laboratory, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
- Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
| | - HsuanYu Chen
- Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Xiaoxu Lu
- Guangdong Provincial Key Laboratory of Nanophotonic Functional Materials and Devices, South China Normal University, Guangzhou 510006, China
| | - Gabriel Popescu
- Quantitative Light Imaging Laboratory, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
- Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
- Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
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40
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Feiner R, Dvir T. Engineering Smart Hybrid Tissues with Built-In Electronics. iScience 2020; 23:100833. [PMID: 31982781 PMCID: PMC6994631 DOI: 10.1016/j.isci.2020.100833] [Citation(s) in RCA: 10] [Impact Index Per Article: 2.5] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/15/2019] [Revised: 12/05/2019] [Accepted: 01/08/2020] [Indexed: 02/08/2023] Open
Abstract
One of the major hurdles faced in tissue engineering is the inability to monitor and control the function of an engineered tissue following transplantation. Recent years have seen major developments in the field by integrating electronics within engineered tissues. Previously, the most common types of devices integrated into the body used to be pacemakers and deep brain stimulation electrodes that are stiff and non-compliant; the advent of ultra-thin and flexible electronics has brought forth a significant expansion of the field. Recent developments have enabled interfacing electronics onto, into, and within all tissues and organs with minimal adverse reactions. These have introduced the ability to engineer tissues with built-in electronics that allow for remote monitoring and regulation of tissue function. In this review, we discuss the development of technologies that allowed for the formation of tissue-electronics hybrids and give an overview of the existing examples of these hybrid "cyborg" tissues.
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Affiliation(s)
- Ron Feiner
- The School for Molecular Cell Biology and Biotechnology, Faculty of Life Sciences, Tel Aviv University, Tel Aviv 69978, Israel; The Center for Nanoscience and Nanotechnology, Tel Aviv University, Tel Aviv 69978, Israel
| | - Tal Dvir
- The School for Molecular Cell Biology and Biotechnology, Faculty of Life Sciences, Tel Aviv University, Tel Aviv 69978, Israel; The Center for Nanoscience and Nanotechnology, Tel Aviv University, Tel Aviv 69978, Israel; Department of Materials Science and Engineering, Faculty of Engineering, Tel Aviv University, Tel Aviv 69978, Israel; Sagol School of Neuroscience, Tel Aviv University, Tel Aviv 69978, Israel; Sagol Center for Regenerative Biotechnology, Tel Aviv University, Tel Aviv 69978, Israel.
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Deng H, Xu X, Zhang C, Su JW, Huang G, Lin J. Reprogrammable 3D Shaping from Phase Change Microstructures in Elastic Composites. ACS APPLIED MATERIALS & INTERFACES 2020; 12:4014-4021. [PMID: 31872759 DOI: 10.1021/acsami.9b20818] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/10/2023]
Abstract
Herein, we demonstrate reprogrammable 3D structures that are assembled from elastic composite sheets made from elastic materials and phase change microparticles. By controlling the phase change of the microparticles by localized thermal patterning, anisotropic residual strain is generated in the pre-stretched composite sheets and then triggers 3D structure assembly when the composite sheets are released from the external stress. Modulation of the geometries and location of the thermal patterns leads to complex 2D-3D shaping behaviors such as bending, folding, buckling, and wrinkling. Because of the reversible phase change of the microparticles, these programmed 3D structures can later be recovered to 2D sheets once they are heated for reprogramming different 3D structures. To predict the 3D structures assembled from the 2D composite sheets, finite element modeling was employed, which showed reasonable agreement with the experiments. The demonstrated strategy of reversibly programming 3D shapes by controlling the phase change microstructures in the elastic composites offers unique capabilities in fabricating functional devices such as a rewritable "paper" and a shape reconfigurable pneumatic actuator.
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Archimedean lattices emerge in template-directed eutectic solidification. Nature 2020; 577:355-358. [PMID: 31942052 DOI: 10.1038/s41586-019-1893-9] [Citation(s) in RCA: 5] [Impact Index Per Article: 1.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/01/2019] [Accepted: 10/11/2019] [Indexed: 11/08/2022]
Abstract
Template-directed assembly has been shown to yield a broad diversity of highly ordered mesostructures1,2, which in a few cases exhibit symmetries not present in the native material3-5. However, this technique has not yet been applied to eutectic materials, which underpin many modern technologies ranging from high-performance turbine blades to solder alloys. Here we use directional solidification of a simple AgCl-KCl lamellar eutectic material within a pillar template to show that interactions of the material with the template lead to the emergence of a set of microstructures that are distinct from the eutectic's native lamellar structure and the template's hexagonal lattice structure. By modifying the solidification rate of this material-template system, trefoil, quatrefoil, cinquefoil and hexafoil mesostructures with submicrometre-size features are realized. Phase-field simulations suggest that these mesostructures appear owing to constraints imposed on diffusion by the hexagonally arrayed pillar template. We note that the trefoil and hexafoil patterns resemble Archimedean honeycomb and square-hexagonal-dodecagonal lattices6, respectively. We also find that by using monolayer colloidal crystals as templates, a variety of eutectic mesostructures including trefoil and hexafoil are observed, the former resembling the Archimedean kagome lattice. Potential emerging applications for the structures provided by templated eutectics include non-reciprocal metasurfaces7, magnetic spin-ice systems8,9, and micro- and nano-lattices with enhanced mechanical properties10,11.
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Zhang C, Deng H, Xie Y, Zhang C, Su JW, Lin J. Stimulus Responsive 3D Assembly for Spatially Resolved Bifunctional Sensors. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2019; 15:e1904224. [PMID: 31724819 DOI: 10.1002/smll.201904224] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/31/2019] [Revised: 10/26/2019] [Indexed: 05/21/2023]
Abstract
3D electronic/optoelectronic devices have shown great potentials for various applications due to their unique properties inherited not only from functional materials, but also from 3D architectures. Although a variety of fabrication methods including mechanically guided assembly have been reported, the resulting 3D devices show no stimuli-responsive functions or are not free standing, thereby limiting their applications. Herein, the stimulus responsive assembly of complex 3D structures driven by temperature-responsive hydrogels is demonstrated for applications in 3D multifunctional sensors. The assembly driving force, compressive buckling, arises from the volume shrinkage of the responsive hydrogel substrates when they are heated above the lower critical solution temperature. Driven by the compressive buckling force, the 2D-formed membrane materials, which are pre-defined and selectively bonded to the substrates, are then assembled to 3D structures. They include "tent," "tower," "two-floor pavilion," "dome," "basket," and "nested-cages" with delicate geometries. Moreover, the demonstrated 3D bifunctional sensors based on laser induced graphene show capability of spatially resolved tactile sensing and temperature sensing. These multifunctional 3D sensors would open new applications in soft robotics, bioelectronics, micro-electromechanical systems, and others.
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Affiliation(s)
- Cheng Zhang
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Heng Deng
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Yunchao Xie
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Chi Zhang
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Jheng-Wun Su
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Jian Lin
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
- Department of Electrical Engineering and Computer Science, Department of Physics and Astronomy, University of Missouri, Columbia, MO, 65211, USA
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Amor-Coarasa A, Kelly JM, Babich JW. 3D-printed automation for optimized PET radiochemistry. SCIENCE ADVANCES 2019; 5:eaax4762. [PMID: 31548988 PMCID: PMC6744267 DOI: 10.1126/sciadv.aax4762] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 03/26/2019] [Accepted: 08/13/2019] [Indexed: 06/10/2023]
Abstract
Reproducible batch synthesis of radioligands for imaging by positron emission tomography (PET) in a manner that maximizes ligand yield, purity, and molar activity, and minimizes cost and exposure to radiation, remains a challenge, as new and synthetically complex radioligands become available. Commercially available automated synthesis units (ASUs) solve many of these challenges but are costly to install and cannot always accommodate diverse chemistries. Through a reiterative design process, we exploit the proliferation of three-dimensional (3D) printing technologies to translate optimized reaction conditions into ASUs composed of 3D-printed, electronic, and robotic parts. Our units are portable and robust and reduce radiation exposure, shorten synthesis time, and improve the yield of the final radiopharmaceutical for a fraction of the cost of a commercial ASU. These 3D-printed ASUs highlight the gains that can be made by designing a fit-for-purpose ASU to accommodate a synthesis over accommodating a synthesis to an unfit ASU.
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Affiliation(s)
- Alejandro Amor-Coarasa
- Division of Radiopharmaceutical Sciences and Molecular Imaging Innovations Institute (MI), Department of Radiology, Weill Cornell Medicine, New York, NY 10021, USA
| | - James M. Kelly
- Division of Radiopharmaceutical Sciences and Molecular Imaging Innovations Institute (MI), Department of Radiology, Weill Cornell Medicine, New York, NY 10021, USA
| | - John W. Babich
- Division of Radiopharmaceutical Sciences and Molecular Imaging Innovations Institute (MI), Department of Radiology, Weill Cornell Medicine, New York, NY 10021, USA
- Sandra and Edward Meyer Cancer Center, Weill Cornell Medicine, New York, NY 10021, USA
- Citigroup Biomedical Imaging Center, Weill Cornell Medicine, New York, NY 10021, USA
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Yi N, Cui H, Zhang LG, Cheng H. Integration of biological systems with electronic-mechanical assemblies. Acta Biomater 2019; 95:91-111. [PMID: 31004844 PMCID: PMC6710161 DOI: 10.1016/j.actbio.2019.04.032] [Citation(s) in RCA: 18] [Impact Index Per Article: 3.6] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 11/01/2018] [Revised: 04/10/2019] [Accepted: 04/11/2019] [Indexed: 02/06/2023]
Abstract
Biological systems continuously interact with the surrounding environment because they are dynamically evolving. The interaction is achieved through mechanical, electrical, chemical, biological, thermal, optical, or a synergistic combination of these cues. To provide a fundamental understanding of the interaction, recent efforts that integrate biological systems with the electronic-mechanical assemblies create unique opportunities for simultaneous monitoring and eliciting the responses to the biological system. Recent innovations in materials, fabrication processes, and device integration approaches have created the enablers to yield bio-integrated devices to interface with the biological system, ranging from cells and tissues to organs and living individual. In this short review, we will provide a brief overview of the recent development on the integration of the biological systems with electronic-mechanical assemblies across multiple scales, with applications ranging from healthcare monitoring to therapeutic options such as drug delivery and rehabilitation therapies. STATEMENT OF SIGNIFICANCE: An overview of the recent progress on the integration of the biological system with both electronic and mechanical assemblies is discussed. The integration creates the unique opportunity to simultaneously monitor and elicit the responses to the biological system, which provides a fundamental understanding of the interaction between the biological system and the electronic-mechanical assemblies. Recent innovations in materials, fabrication processes, and device integration approaches have created the enablers to yield bio-integrated devices to interface with the biological system, ranging from cells and tissues to organs and living individual.
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Affiliation(s)
- Ning Yi
- Department of Materials Science and Engineering, The Pennsylvania State University, University Park, PA 16802, USA
| | - Haitao Cui
- Department of Mechanical and Aerospace Engineering, The George Washington University, Washington, DC 20052, USA
| | - Lijie Grace Zhang
- Department of Mechanical and Aerospace Engineering, The George Washington University, Washington, DC 20052, USA; Departments of Electrical and Computer Engineering, Biomedical Engineering, and Medicine, The George Washington University, Washington DC 20052, USA
| | - Huanyu Cheng
- Department of Materials Science and Engineering, The Pennsylvania State University, University Park, PA 16802, USA; Department of Engineering Science and Mechanics, and Materials Research Institute, The Pennsylvania State University, University Park, PA 16802, USA.
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Cheng X, Zhang Y. Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2019; 31:e1901895. [PMID: 31265197 DOI: 10.1002/adma.201901895] [Citation(s) in RCA: 47] [Impact Index Per Article: 9.4] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/26/2019] [Revised: 05/03/2019] [Indexed: 06/09/2023]
Abstract
The miniaturization of electronics has been an important topic of study for several decades. The established roadmaps following Moore's Law have encountered bottlenecks in recent years, as planar processing techniques are already close to their physical limits. To bypass some of the intrinsic challenges of planar technologies, more and more efforts have been devoted to the development of 3D electronics, through either direct 3D fabrication or indirect 3D assembly. Recent research efforts into direct 3D fabrication have focused on the development of 3D transistor technologies and 3D heterogeneous integration schemes, but these technologies are typically constrained by the accessible range of sophisticated 3D geometries and the complexity of the fabrication processes. As an alternative route, 3D assembly methods make full use of mature planar technologies to form predefined 2D precursor structures in the desired materials and sizes, which are then transformed into targeted 3D mesostructures by mechanical deformation. The latest progress in the area of micro/nanoscale 3D assembly, covering the various classes of methods through rolling, folding, curving, and buckling assembly, is discussed, focusing on the design concepts, principles, and applications of different methods, followed by an outlook on the remaining challenges and open opportunities.
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Affiliation(s)
- Xu Cheng
- AML, Department of Engineering Mechanics, Beijing, 100084, China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
| | - Yihui Zhang
- AML, Department of Engineering Mechanics, Beijing, 100084, China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
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Kim B, Jeon J, Zhang Y, Wie DS, Hwang J, Lee SJ, Walker DE, Abeysinghe DC, Urbas A, Xu B, Ku Z, Lee CH. Deterministic Nanoassembly of Quasi-Three-Dimensional Plasmonic Nanoarrays with Arbitrary Substrate Materials and Structures. NANO LETTERS 2019; 19:5796-5805. [PMID: 31348661 DOI: 10.1021/acs.nanolett.9b02598] [Citation(s) in RCA: 6] [Impact Index Per Article: 1.2] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/10/2023]
Abstract
Guided manipulation of light through periodic nanoarrays of three-dimensional (3D) metal-dielectric patterns provides remarkable opportunities to harness light in a way that cannot be obtained with conventional optics yet its practical implementation remains hindered by a lack of effective methodology. Here we report a novel 3D nanoassembly method that enables deterministic integration of quasi-3D plasmonic nanoarrays with a foreign substrate composed of arbitrary materials and structures. This method is versatile to arrange a variety of types of metal-dielectric composite nanoarrays in lateral and vertical configurations, providing a route to generate heterogeneous material compositions, complex device layouts, and tailored functionalities. Experimental, computational, and theoretical studies reveal the essential design features of this approach and, taken together with implementation of automated equipment, provide a technical guidance for large-scale manufacturability. Pilot assembly of specifically engineered quasi-3D plasmonic nanoarrays with a model hybrid pixel detector for deterministic enhancement of the detection performances demonstrates the utility of this method.
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Affiliation(s)
- Bongjoong Kim
- School of Mechanical Engineering , Purdue University , West Lafayette , Indiana 47907 , United States
| | - Jiyeon Jeon
- Division of Industrial Metrology , Korea Research Institute of Standards and Science , Daejeon 34113 , Korea
| | - Yue Zhang
- Department of Mechanical and Aerospace Engineering , University of Virginia , Charlottesville , Virginia 22903 , United States
| | - Dae Seung Wie
- School of Mechanical Engineering , Purdue University , West Lafayette , Indiana 47907 , United States
| | - Jehwan Hwang
- Division of Industrial Metrology , Korea Research Institute of Standards and Science , Daejeon 34113 , Korea
| | - Sang Jun Lee
- Division of Industrial Metrology , Korea Research Institute of Standards and Science , Daejeon 34113 , Korea
| | - Dennis E Walker
- Sensors Directorate , Air Force Research Laboratory , Wright-Patterson AFB 45433 , United States
| | - Don C Abeysinghe
- Materials and Manufacturing Directorate , Air Force Research Laboratory , Wright-Patterson AFB 45433 , United States
| | - Augustine Urbas
- Materials and Manufacturing Directorate , Air Force Research Laboratory , Wright-Patterson AFB 45433 , United States
| | - Baoxing Xu
- Department of Mechanical and Aerospace Engineering , University of Virginia , Charlottesville , Virginia 22903 , United States
| | - Zahyun Ku
- Materials and Manufacturing Directorate , Air Force Research Laboratory , Wright-Patterson AFB 45433 , United States
| | - Chi Hwan Lee
- School of Mechanical Engineering , Purdue University , West Lafayette , Indiana 47907 , United States
- Weldon School of Biomedical Engineering , Purdue University , West Lafayette , Indiana 47907 , United States
- Department of Speech, Language, and Hearing Sciences , Purdue University , West Lafayette , Indiana 47907 , United States
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Abstract
Biological systems have evolved biochemical, electrical, mechanical, and genetic networks to perform essential functions across various length and time scales. High-aspect-ratio biological nanowires, such as bacterial pili and neurites, mediate many of the interactions and homeostasis in and between these networks. Synthetic materials designed to mimic the structure of biological nanowires could also incorporate similar functional properties, and exploiting this structure-function relationship has already proved fruitful in designing biointerfaces. Semiconductor nanowires are a particularly promising class of synthetic nanowires for biointerfaces, given (1) their unique optical and electronic properties and (2) their high degree of synthetic control and versatility. These characteristics enable fabrication of a variety of electronic and photonic nanowire devices, allowing for the formation of well-defined, functional bioelectric interfaces at the biomolecular level to the whole-organ level. In this Focus Review, we first discuss the history of bioelectric interfaces with semiconductor nanowires. We next highlight several important, endogenous biological nanowires and use these as a framework to categorize semiconductor nanowire-based biointerfaces. Within this framework we then review the fundamentals of bioelectric interfaces with semiconductor nanowires and comment on both material choice and device design to form biointerfaces spanning multiple length scales. We conclude with a discussion of areas with the potential for greatest impact using semiconductor nanowire-enabled biointerfaces in the future.
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Affiliation(s)
- Bozhi Tian
- Department of Chemistry, the University of Chicago, Chicago, IL USA
- The James Franck Institute, the University of Chicago, Chicago, IL USA
- The Institute for Biophysical Dynamics, Chicago, IL USA
| | - Charles M. Lieber
- Department of Chemistry and Chemical Biology, Harvard University, Cambridge, MA, USA
- Center for Brain Science, Harvard University, Cambridge, MA, USA
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Cambridge, MA, USA
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Harnessing the interface mechanics of hard films and soft substrates for 3D assembly by controlled buckling. Proc Natl Acad Sci U S A 2019; 116:15368-15377. [PMID: 31315983 DOI: 10.1073/pnas.1907732116] [Citation(s) in RCA: 41] [Impact Index Per Article: 8.2] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/21/2022] Open
Abstract
Techniques for forming sophisticated, 3D mesostructures in advanced, functional materials are of rapidly growing interest, owing to their potential uses across a broad range of fundamental and applied areas of application. Recently developed approaches to 3D assembly that rely on controlled buckling mechanics serve as versatile routes to 3D mesostructures in a diverse range of high-quality materials and length scales of relevance for 3D microsystems with unusual function and/or enhanced performance. Nonlinear buckling and delamination behaviors in materials that combine both weak and strong interfaces are foundational to the assembly process, but they can be difficult to control, especially for complex geometries. This paper presents theoretical and experimental studies of the fundamental aspects of adhesion and delamination in this context. By quantifying the effects of various essential parameters on these processes, we establish general design diagrams for different material systems, taking into account 4 dominant delamination states (wrinkling, partial delamination of the weak interface, full delamination of the weak interface, and partial delamination of the strong interface). These diagrams provide guidelines for the selection of engineering parameters that avoid interface-related failure, as demonstrated by a series of examples in 3D helical mesostructures and mesostructures that are reconfigurable based on the control of loading-path trajectories. Three-dimensional micromechanical resonators with frequencies that can be selected between 2 distinct values serve as demonstrative examples.
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Flexible electronic/optoelectronic microsystems with scalable designs for chronic biointegration. Proc Natl Acad Sci U S A 2019; 116:15398-15406. [PMID: 31308234 DOI: 10.1073/pnas.1907697116] [Citation(s) in RCA: 27] [Impact Index Per Article: 5.4] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/10/2023] Open
Abstract
Flexible biocompatible electronic systems that leverage key materials and manufacturing techniques associated with the consumer electronics industry have potential for broad applications in biomedicine and biological research. This study reports scalable approaches to technologies of this type, where thin microscale device components integrate onto flexible polymer substrates in interconnected arrays to provide multimodal, high performance operational capabilities as intimately coupled biointerfaces. Specificially, the material options and engineering schemes summarized here serve as foundations for diverse, heterogeneously integrated systems. Scaled examples incorporate >32,000 silicon microdie and inorganic microscale light-emitting diodes derived from wafer sources distributed at variable pitch spacings and fill factors across large areas on polymer films, at full organ-scale dimensions such as human brain, over ∼150 cm2 In vitro studies and accelerated testing in simulated biofluids, together with theoretical simulations of underlying processes, yield quantitative insights into the key materials aspects. The results suggest an ability of these systems to operate in a biologically safe, stable fashion with projected lifetimes of several decades without leakage currents or reductions in performance. The versatility of these combined concepts suggests applicability to many classes of biointegrated semiconductor devices.
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