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Cheema SS, Shanker N, Wang LC, Hsu CH, Hsu SL, Liao YH, San Jose M, Gomez J, Chakraborty W, Li W, Bae JH, Volkman SK, Kwon D, Rho Y, Pinelli G, Rastogi R, Pipitone D, Stull C, Cook M, Tyrrell B, Stoica VA, Zhang Z, Freeland JW, Tassone CJ, Mehta A, Saheli G, Thompson D, Suh DI, Koo WT, Nam KJ, Jung DJ, Song WB, Lin CH, Nam S, Heo J, Parihar N, Grigoropoulos CP, Shafer P, Fay P, Ramesh R, Mahapatra S, Ciston J, Datta S, Mohamed M, Hu C, Salahuddin S. Ultrathin ferroic HfO 2-ZrO 2 superlattice gate stack for advanced transistors. Nature 2022; 604:65-71. [PMID: 35388197 DOI: 10.1038/s41586-022-04425-6] [Citation(s) in RCA: 32] [Impact Index Per Article: 16.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/11/2021] [Accepted: 01/14/2022] [Indexed: 11/09/2022]
Abstract
With the scaling of lateral dimensions in advanced transistors, an increased gate capacitance is desirable both to retain the control of the gate electrode over the channel and to reduce the operating voltage1. This led to a fundamental change in the gate stack in 2008, the incorporation of high-dielectric-constant HfO2 (ref. 2), which remains the material of choice to date. Here we report HfO2-ZrO2 superlattice heterostructures as a gate stack, stabilized with mixed ferroelectric-antiferroelectric order, directly integrated onto Si transistors, and scaled down to approximately 20 ångströms, the same gate oxide thickness required for high-performance transistors. The overall equivalent oxide thickness in metal-oxide-semiconductor capacitors is equivalent to an effective SiO2 thickness of approximately 6.5 ångströms. Such a low effective oxide thickness and the resulting large capacitance cannot be achieved in conventional HfO2-based high-dielectric-constant gate stacks without scavenging the interfacial SiO2, which has adverse effects on the electron transport and gate leakage current3. Accordingly, our gate stacks, which do not require such scavenging, provide substantially lower leakage current and no mobility degradation. This work demonstrates that ultrathin ferroic HfO2-ZrO2 multilayers, stabilized with competing ferroelectric-antiferroelectric order in the two-nanometre-thickness regime, provide a path towards advanced gate oxide stacks in electronic devices beyond conventional HfO2-based high-dielectric-constant materials.
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Affiliation(s)
- Suraj S Cheema
- Department of Materials Science and Engineering, University of California, Berkeley, Berkeley, CA, USA.
| | - Nirmaan Shanker
- Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA
| | - Li-Chen Wang
- Department of Materials Science and Engineering, University of California, Berkeley, Berkeley, CA, USA
| | - Cheng-Hsiang Hsu
- Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA
| | - Shang-Lin Hsu
- Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA
| | - Yu-Hung Liao
- Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA
| | - Matthew San Jose
- Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, USA
| | - Jorge Gomez
- Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, USA
| | - Wriddhi Chakraborty
- Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, USA
| | - Wenshen Li
- Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA
| | - Jong-Ho Bae
- Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA
| | - Steve K Volkman
- Applied Science and Technology, University of California, Berkeley, CA, USA
| | - Daewoong Kwon
- Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA
| | - Yoonsoo Rho
- Laser Thermal Laboratory, Department of Mechanical Engineering, University of California, Berkeley, CA, USA
| | - Gianni Pinelli
- Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, MA, USA
| | - Ravi Rastogi
- Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, MA, USA
| | - Dominick Pipitone
- Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, MA, USA
| | - Corey Stull
- Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, MA, USA
| | - Matthew Cook
- Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, MA, USA
| | - Brian Tyrrell
- Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, MA, USA
| | - Vladimir A Stoica
- Department of Materials Science and Engineering, Pennsylvania State University, University Park, PA, USA
| | - Zhan Zhang
- Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA
| | - John W Freeland
- Advanced Photon Source, Argonne National Laboratory, Lemont, IL, USA
| | - Christopher J Tassone
- Stanford Synchrotron Radiation Lightsource, SLAC National Accelerator Laboratory, Menlo Park, CA, USA
| | - Apurva Mehta
- Stanford Synchrotron Radiation Lightsource, SLAC National Accelerator Laboratory, Menlo Park, CA, USA
| | | | | | - Dong Ik Suh
- Research & Development Division, SK hynix, Icheon, Korea
| | - Won-Tae Koo
- Research & Development Division, SK hynix, Icheon, Korea
| | - Kab-Jin Nam
- Semiconductor R&D Center, Samsung Electronics, Gyeonggi-do, Korea
| | - Dong Jin Jung
- Semiconductor R&D Center, Samsung Electronics, Gyeonggi-do, Korea
| | - Woo-Bin Song
- Semiconductor R&D Center, Samsung Electronics, Gyeonggi-do, Korea
| | - Chung-Hsun Lin
- Logic Technology Development, Intel Corporation, Hillsboro, OR, USA
| | - Seunggeol Nam
- Samsung Advanced Institute of Technology, Samsung Electronics, Suwon, Korea
| | - Jinseong Heo
- Samsung Advanced Institute of Technology, Samsung Electronics, Suwon, Korea
| | - Narendra Parihar
- Department of Electrical Engineering, Indian Institute of Technology Bombay, Mumbai, India
| | - Costas P Grigoropoulos
- Laser Thermal Laboratory, Department of Mechanical Engineering, University of California, Berkeley, CA, USA
| | - Padraic Shafer
- Advanced Light Source, Lawrence Berkeley National Laboratory, Berkeley, CA, USA
| | - Patrick Fay
- Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, USA
| | - Ramamoorthy Ramesh
- Department of Materials Science and Engineering, University of California, Berkeley, Berkeley, CA, USA.,Department of Physics, University of California, Berkeley, Berkeley, CA, USA.,Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA
| | - Souvik Mahapatra
- Department of Electrical Engineering, Indian Institute of Technology Bombay, Mumbai, India
| | - Jim Ciston
- National Center for Electron Microscopy, Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, CA, USA
| | - Suman Datta
- Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, USA
| | - Mohamed Mohamed
- Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, MA, USA
| | - Chenming Hu
- Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA
| | - Sayeef Salahuddin
- Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA. .,Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, USA.
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Goyal N, Parihar N, Jawa H, Mahapatra S, Lodha S. Accurate Threshold Voltage Reliability Evaluation of Thin Al 2O 3 Top-Gated Dielectric Black Phosphorous FETs Using Ultrafast Measurement Pulses. ACS Appl Mater Interfaces 2019; 11:23673-23680. [PMID: 31252490 DOI: 10.1021/acsami.9b04069] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/09/2023]
Abstract
Few-layer black phosphorus (BP) has attracted significant interest in recent years due to electrical and photonic properties that are far superior to those of other two-dimensional layered semiconductors. The study of long term electrical stability and reliability of black phosphorus field effect transistors (BP-FETs) with technologically relevant thin, and device-selective, gate dielectrics, stressed under realistic (closer to operation) bias and measured using state-of-the-art ultrafast reliability characterization techniques, is essential for their qualification and use in different applications. In this work, air-stable BP-FETs with a thin top-gated dielectric (15 nm Al2O3, SiO2 equivalent thickness of 5 nm) were fabricated and comprehensively characterized for threshold voltage ( Vth) instability under negative gate bias stress at various measurement delays ( tm), stress biases ( VGSTR), temperatures ( T), and stress times ( tstr) for the first time. Thin top-gated oxide enables low VGSTR that is closer to the operating condition and ultrafast Vth measurements with low delay ( tm = 10 μs, due to high drain current) that ensure minimal recovery. The resultant time kinetics of Vth degradation (Δ Vth) shows fast saturation at longer stress times and low-temperature activation energy. Vth instability in these top-gated devices is suggested to be dominated by hole trapping, which is modeled using first-order equations at different VGSTR and T. It is shown that measurements using larger tm show lower degradation magnitude that do not saturate due to recovery artifacts and give inaccurate estimation of hole trap densities. Conventional, thick, and global back-gated oxide BP-FETs were also fabricated and characterized for varying tm (1 ms being the lowest due to a low drain current level for thick oxide), VGSTR, and T to benchmark our top-gated results. Nonsaturating Δ Vth in the back-gated devices is shown to result from recovery artifacts due to the large tm (1 ms and greater) values. Finally, using a VGSTR and T-dependent first-order model, we show that the top-gated Al2O3 BP-FETs with scaled gate oxide thickness can match state-of-the-art Si reliability specifications at operating voltage and room/elevated temperature.
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Affiliation(s)
- Natasha Goyal
- Department of Electrical Engineering , IIT Bombay , Mumbai 400076 , India
| | - Narendra Parihar
- Department of Electrical Engineering , IIT Bombay , Mumbai 400076 , India
| | - Himani Jawa
- Department of Electrical Engineering , IIT Bombay , Mumbai 400076 , India
| | - Souvik Mahapatra
- Department of Electrical Engineering , IIT Bombay , Mumbai 400076 , India
| | - Saurabh Lodha
- Department of Electrical Engineering , IIT Bombay , Mumbai 400076 , India
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Jat SL, Parihar CM, Singh AK, Kumar B, Choudhary M, Nayak HS, Parihar MD, Parihar N, Meena BR. Energy auditing and carbon footprint under long-term conservation agriculture-based intensive maize systems with diverse inorganic nitrogen management options. Sci Total Environ 2019; 664:659-668. [PMID: 30763846 DOI: 10.1016/j.scitotenv.2019.01.425] [Citation(s) in RCA: 16] [Impact Index Per Article: 3.2] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/25/2018] [Revised: 01/20/2019] [Accepted: 01/31/2019] [Indexed: 05/12/2023]
Abstract
A greater energy grant in diesel-fed machinery driven farming substantiate the higher GHGs emission along with improper input (fertilizer, pesticide and irrigation) use and intensive soil management. Practicing conservation tillage, residue retention and diversified crop rotations were advocated because of their multiple benefits. Hence we explored the energy requirement and carbon footprint of conservation agriculture (CA) based maize production systems. Coated N fertilizer [sulphur coated urea (SCU) and neem coated urea (NCU)] were compared with unfertilized and uncoated prilled urea (PU) in the scenario of with and without residue retention on permanent beds (PB) under diversified maize systems [MMuMb, maize-mustard-mungbean and MWMb, maize-wheat-mungbean] in search of a sustainable and energy efficient production system with lesser C-footprint. Results of the 4-year study showed that crops planted on permanent bed with crop residue (PB+R) registered 11.7% increase in system productivity compared to PB without residue (PB-R). N management through Neem coated urea (NCU) recorded 2.3 and 10.9% higher system productivity compared with non-coated prilled urea plot under PB-R and PB+R, respectively. MMuMb was marginally superior than MWMb system in terms of cropping sequence yield, profitability, and energy and carbon use efficiency. Crop residue retention in zero tilled PB increased cost of cultivation by 125 and 147 USD/ha in MMuMb and MWMb systems, respectively. The quantified carbon footprint value was higher in MWMb system. In CA-based practices, crop residues management contributed the highest energy input (61.5-68.4%) followed by fertilizer application (17-20%). Among N management practices, neem coated urea (NCU) significantly improved system productivity and profitability in all the residue applied plots compared to un-fertilized and prilled urea (PU) applied plots. Similarly, higher energy output was also observed in NCU treated plots. However, carbon footprint value was higher in PU (268-285 CO2-e kg/Mg) plots than NCU (259-264 CO2-e kg/Mg) treated plots. Thus, the study supports and recommends that the CA-based MMuMb system with efficient N management through NCU is an environmentally safe, clean and energy efficient one, hence can reduce carbon footprint, will ensure food security and will mitigate climate change.
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Affiliation(s)
- S L Jat
- ICAR-Indian Institute of Maize Research (IIMR), New Delhi 110012, India
| | - C M Parihar
- ICAR-Indian Institute of Maize Research (IIMR), New Delhi 110012, India; ICAR-Indian Agricultural Research Institute (IARI), New Delhi 110012, India.
| | - A K Singh
- ICAR-Indian Institute of Maize Research (IIMR), New Delhi 110012, India
| | - B Kumar
- ICAR-Indian Institute of Maize Research (IIMR), New Delhi 110012, India
| | - M Choudhary
- ICAR-Indian Grassland and Fodder Research Institute (IGFRI), Jhansi 284003, India
| | - H S Nayak
- ICAR-Indian Agricultural Research Institute (IARI), New Delhi 110012, India.
| | - M D Parihar
- Chaudhary Charan Singh Haryana Agricultural University (CCSHAU), Hisar 125004, India
| | - N Parihar
- Delhi Technological University, Delhi 110 042, India
| | - B R Meena
- ICAR-Indian Agricultural Research Institute (IARI), New Delhi 110012, India
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