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Han S, Kim JS, Park E, Meng Y, Xu Z, Foucher AC, Jung GY, Roh I, Lee S, Kim SO, Moon JY, Kim SI, Bae S, Zhang X, Park BI, Seo S, Li Y, Shin H, Reidy K, Hoang AT, Sundaram S, Vuong P, Kim C, Zhao J, Hwang J, Wang C, Choi H, Kim DH, Kwon J, Park JH, Ougazzaden A, Lee JH, Ahn JH, Kim J, Mishra R, Kim HS, Ross FM, Bae SH. High energy density in artificial heterostructures through relaxation time modulation. Science 2024; 384:312-317. [PMID: 38669572 DOI: 10.1126/science.adl2835] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/10/2023] [Accepted: 03/06/2024] [Indexed: 04/28/2024]
Abstract
Electrostatic capacitors are foundational components of advanced electronics and high-power electrical systems owing to their ultrafast charging-discharging capability. Ferroelectric materials offer high maximum polarization, but high remnant polarization has hindered their effective deployment in energy storage applications. Previous methodologies have encountered problems because of the deteriorated crystallinity of the ferroelectric materials. We introduce an approach to control the relaxation time using two-dimensional (2D) materials while minimizing energy loss by using 2D/3D/2D heterostructures and preserving the crystallinity of ferroelectric 3D materials. Using this approach, we were able to achieve an energy density of 191.7 joules per cubic centimeter with an efficiency greater than 90%. This precise control over relaxation time holds promise for a wide array of applications and has the potential to accelerate the development of highly efficient energy storage systems.
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Affiliation(s)
- Sangmoon Han
- Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Justin S Kim
- Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO 63130, USA
- The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Eugene Park
- Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
| | - Yuan Meng
- Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Zhihao Xu
- Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO 63130, USA
- The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Alexandre C Foucher
- Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
| | - Gwan Yeong Jung
- Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO 63130, USA
- The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Ilpyo Roh
- Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO 63130, USA
- M.O.P. Materials, Seoul 07285, Republic of Korea
| | - Sangho Lee
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
| | - Sun Ok Kim
- Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO 63130, USA
- Precision Biology Research Center, Sungkyunkwan University, Suwon 16419, Republic of Korea
| | - Ji-Yun Moon
- Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Seung-Il Kim
- Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Sanggeun Bae
- Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO 63130, USA
- The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Xinyuan Zhang
- Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
| | - Bo-In Park
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
| | - Seunghwan Seo
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea
| | - Yimeng Li
- Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Heechang Shin
- School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
| | - Kate Reidy
- Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
| | - Anh Tuan Hoang
- School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
| | - Suresh Sundaram
- CNRS, Georgia Tech - CNRS IRL 2958, GT-Europe, 57070 Metz, France
| | - Phuong Vuong
- CNRS, Georgia Tech - CNRS IRL 2958, GT-Europe, 57070 Metz, France
| | - Chansoo Kim
- The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
- Department of Electrical and System Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Junyi Zhao
- The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
- Department of Electrical and System Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Jinyeon Hwang
- Energy Storage Research Center, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea
| | - Chuan Wang
- The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
- Department of Electrical and System Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Hyungil Choi
- M.O.P. Materials, Seoul 07285, Republic of Korea
| | - Dong-Hwan Kim
- Precision Biology Research Center, Sungkyunkwan University, Suwon 16419, Republic of Korea
- School of Chemical Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea
| | - Jimin Kwon
- Department of Electrical Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, Republic of Korea
| | - Jin-Hong Park
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon 16419, Republic of Korea
| | - Abdallah Ougazzaden
- CNRS, Georgia Tech - CNRS IRL 2958, GT-Europe, 57070 Metz, France
- School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
| | - Jae-Hyun Lee
- Department of Materials Science and Engineering and Department of Energy Systems Research, Ajou University, Suwon 16499, Republic of Korea
| | - Jong-Hyun Ahn
- School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
| | - Jeehwan Kim
- Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
| | - Rohan Mishra
- Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO 63130, USA
- The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Hyung-Seok Kim
- Energy Storage Research Center, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea
- KHU-KIST Department of Converging Science and Technology, Kyung Hee University, Seoul 02447, Republic of Korea
| | - Frances M Ross
- Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
| | - Sang-Hoon Bae
- Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO 63130, USA
- The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
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2
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Kang JH, Shin H, Kim KS, Song MK, Lee D, Meng Y, Choi C, Suh JM, Kim BJ, Kim H, Hoang AT, Park BI, Zhou G, Sundaram S, Vuong P, Shin J, Choe J, Xu Z, Younas R, Kim JS, Han S, Lee S, Kim SO, Kang B, Seo S, Ahn H, Seo S, Reidy K, Park E, Mun S, Park MC, Lee S, Kim HJ, Kum HS, Lin P, Hinkle C, Ougazzaden A, Ahn JH, Kim J, Bae SH. Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions. Nat Mater 2023:10.1038/s41563-023-01704-z. [PMID: 38012388 DOI: 10.1038/s41563-023-01704-z] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/06/2023] [Accepted: 09/27/2023] [Indexed: 11/29/2023]
Abstract
Three-dimensional (3D) hetero-integration technology is poised to revolutionize the field of electronics by stacking functional layers vertically, thereby creating novel 3D circuity architectures with high integration density and unparalleled multifunctionality. However, the conventional 3D integration technique involves complex wafer processing and intricate interlayer wiring. Here we demonstrate monolithic 3D integration of two-dimensional, material-based artificial intelligence (AI)-processing hardware with ultimate integrability and multifunctionality. A total of six layers of transistor and memristor arrays were vertically integrated into a 3D nanosystem to perform AI tasks, by peeling and stacking of AI processing layers made from bottom-up synthesized two-dimensional materials. This fully monolithic-3D-integrated AI system substantially reduces processing time, voltage drops, latency and footprint due to its densely packed AI processing layers with dense interlayer connectivity. The successful demonstration of this monolithic-3D-integrated AI system will not only provide a material-level solution for hetero-integration of electronics, but also pave the way for unprecedented multifunctional computing hardware with ultimate parallelism.
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Affiliation(s)
- Ji-Hoon Kang
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
- Department of Electronic Engineering, Inha University, Incheon, Republic of Korea
| | - Heechang Shin
- School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea
| | - Ki Seok Kim
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Min-Kyu Song
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Doyoon Lee
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Yuan Meng
- Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, MO, USA
| | - Chanyeol Choi
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
- Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Jun Min Suh
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Beom Jin Kim
- School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea
| | - Hyunseok Kim
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Anh Tuan Hoang
- School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea
| | - Bo-In Park
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Guanyu Zhou
- Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, USA
| | - Suresh Sundaram
- School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA
- CNRS, Georgia Tech - CNRS IRL 2958, GT-Europe, Metz, France
| | - Phuong Vuong
- CNRS, Georgia Tech - CNRS IRL 2958, GT-Europe, Metz, France
| | - Jiho Shin
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Jinyeong Choe
- School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea
| | - Zhihao Xu
- Institute of Materials Science and Engineering, Washington University in Saint Louis, Saint Louis, MO, USA
| | - Rehan Younas
- Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, USA
| | - Justin S Kim
- Institute of Materials Science and Engineering, Washington University in Saint Louis, Saint Louis, MO, USA
| | - Sangmoon Han
- Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, MO, USA
| | - Sangho Lee
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Sun Ok Kim
- Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, MO, USA
| | - Beomseok Kang
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Seungju Seo
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Hyojung Ahn
- Future Innovation Research Center, Korea Aerospace Research Institute, Daejeon, Republic of Korea
- Aerospace System Engineering, University of Science and Technology, Daejeon, Republic of Korea
| | - Seunghwan Seo
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Kate Reidy
- Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Eugene Park
- Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Sungchul Mun
- Department of Industrial Engineering, Jeonju University, Jeonju, Republic of Korea
- Convergence Institute of Human Data Technology, Jeonju University, Jeonju, Republic of Korea
| | - Min-Chul Park
- Post-Silicon Semiconductor Institute, Korea Institute of Science and Technology, Seoul, Republic of Korea
| | - Suyoun Lee
- Post-Silicon Semiconductor Institute, Korea Institute of Science and Technology, Seoul, Republic of Korea
| | - Hyung-Jun Kim
- Post-Silicon Semiconductor Institute, Korea Institute of Science and Technology, Seoul, Republic of Korea
| | - Hyun S Kum
- School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea
| | - Peng Lin
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA
- College of Computer Science and Technology, Zhejiang University, Hangzhou, China
| | - Christopher Hinkle
- Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, USA
| | - Abdallah Ougazzaden
- School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA
- CNRS, Georgia Tech - CNRS IRL 2958, GT-Europe, Metz, France
| | - Jong-Hyun Ahn
- School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea.
| | - Jeehwan Kim
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.
- Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
| | - Sang-Hoon Bae
- Department of Mechanical Engineering and Materials Science, Washington University in Saint Louis, Saint Louis, MO, USA.
- Institute of Materials Science and Engineering, Washington University in Saint Louis, Saint Louis, MO, USA.
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3
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Zaiter A, Nikitskiy N, Nemoz M, Vuong P, Ottapilakkal V, Sundaram S, Ougazzaden A, Brault J. (Al, Ga)N-Based Quantum Dots Heterostructures on h-BN for UV-C Emission. Nanomaterials (Basel) 2023; 13:2404. [PMID: 37686912 PMCID: PMC10489961 DOI: 10.3390/nano13172404] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/23/2023] [Revised: 07/27/2023] [Accepted: 08/22/2023] [Indexed: 09/10/2023]
Abstract
Aluminium Gallium Nitride (AlyGa1-yN) quantum dots (QDs) with thin sub-µm AlxGa1-xN layers (with x > y) were grown by molecular beam epitaxy on 3 nm and 6 nm thick hexagonal boron nitride (h-BN) initially deposited on c-sapphire substrates. An AlN layer was grown on h-BN and the surface roughness was investigated by atomic force microscopy for different deposited thicknesses. It was shown that for thicker AlN layers (i.e., 200 nm), the surface roughness can be reduced and hence a better surface morphology is obtained. Next, AlyGa1-yN QDs embedded in Al0.7Ga0.3N cladding layers were grown on the AlN and investigated by atomic force microscopy. Furthermore, X-ray diffraction measurements were conducted to assess the crystalline quality of the AlGaN/AlN layers and examine the impact of h-BN on the subsequent layers. Next, the QDs emission properties were studied by photoluminescence and an emission in the deep ultra-violet, i.e., in the 275-280 nm range was obtained at room temperature. Finally, temperature-dependent photoluminescence was performed. A limited decrease in the emission intensity of the QDs with increasing temperatures was observed as a result of the three-dimensional confinement of carriers in the QDs.
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Affiliation(s)
- Aly Zaiter
- Université Côte d’Azur, Centre National de la Recherche Scientifique (CNRS), Centre de Recherche sur l’Hétéro-Epitaxie et ses Applications (CRHEA), 06560 Valbonne, France;
| | - Nikita Nikitskiy
- Université Côte d’Azur, Centre National de la Recherche Scientifique (CNRS), Centre de Recherche sur l’Hétéro-Epitaxie et ses Applications (CRHEA), 06560 Valbonne, France;
| | - Maud Nemoz
- Université Côte d’Azur, Centre National de la Recherche Scientifique (CNRS), Centre de Recherche sur l’Hétéro-Epitaxie et ses Applications (CRHEA), 06560 Valbonne, France;
| | - Phuong Vuong
- CNRS, IRL 2958 Georgia Tech-CNRS, 2 rue Marconi, 57070 Metz, France; (P.V.); (V.O.); (S.S.); (A.O.)
- Georgia Tech-Europe, 2 rue Marconi, 57070 Metz, France
| | - Vishnu Ottapilakkal
- CNRS, IRL 2958 Georgia Tech-CNRS, 2 rue Marconi, 57070 Metz, France; (P.V.); (V.O.); (S.S.); (A.O.)
| | - Suresh Sundaram
- CNRS, IRL 2958 Georgia Tech-CNRS, 2 rue Marconi, 57070 Metz, France; (P.V.); (V.O.); (S.S.); (A.O.)
- Georgia Tech-Europe, 2 rue Marconi, 57070 Metz, France
- Georgia Institute of Technology, School of Electrical and Computer Engineering, Atlanta, GA 30332-0250, USA
| | - Abdallah Ougazzaden
- CNRS, IRL 2958 Georgia Tech-CNRS, 2 rue Marconi, 57070 Metz, France; (P.V.); (V.O.); (S.S.); (A.O.)
- Georgia Institute of Technology, School of Electrical and Computer Engineering, Atlanta, GA 30332-0250, USA
| | - Julien Brault
- Université Côte d’Azur, Centre National de la Recherche Scientifique (CNRS), Centre de Recherche sur l’Hétéro-Epitaxie et ses Applications (CRHEA), 06560 Valbonne, France;
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4
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Zaiter A, Michon A, Nemoz M, Courville A, Vennéguès P, Ottapilakkal V, Vuong P, Sundaram S, Ougazzaden A, Brault J. Crystalline Quality and Surface Morphology Improvement of Face-to-Face Annealed MBE-Grown AlN on h-BN. Materials (Basel) 2022; 15:8602. [PMID: 36500097 PMCID: PMC9736891 DOI: 10.3390/ma15238602] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 11/10/2022] [Revised: 11/28/2022] [Accepted: 11/29/2022] [Indexed: 06/17/2023]
Abstract
In this study, AlN epilayers were grown by ammonia-assisted molecular beam epitaxy on 3 nm h-BN grown on c-sapphire substrates. Their structural properties were investigated by comparing as-grown and postgrowth annealed layers. The role of annealing on the crystalline quality and surface morphology was studied as a function of AlN thickness and the annealing duration and temperature. Optimum annealing conditions were identified. The results of X-ray diffraction showed that optimization of the annealing recipe led to a significant reduction in the symmetric (0 0 0 2) and skew symmetric (1 0 -1 1) reflections, which was associated with a reduction in edge and mixed threading dislocation densities (TDDs). Furthermore, the impact on the crystalline structure of AlN and its surface was studied, and the results showed a transition from a surface with high roughness to a smoother surface morphology with a significant reduction in roughness. In addition, the annealing duration was increased at 1650 °C to further understand the impact on both AlN and h-BN, and the results showed a diffusion interplay between AlN and h-BN. Finally, an AlN layer was regrown on the top of an annealed template, which led to large terraces with atomic steps and low roughness.
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Affiliation(s)
- Aly Zaiter
- Université Côte d’Azur, CNRS-CRHEA, French National Center for Scientific Research, 06560 Valbonne, France; (A.M.); (M.N.); (A.C.); (P.V.)
| | - Adrien Michon
- Université Côte d’Azur, CNRS-CRHEA, French National Center for Scientific Research, 06560 Valbonne, France; (A.M.); (M.N.); (A.C.); (P.V.)
| | - Maud Nemoz
- Université Côte d’Azur, CNRS-CRHEA, French National Center for Scientific Research, 06560 Valbonne, France; (A.M.); (M.N.); (A.C.); (P.V.)
| | - Aimeric Courville
- Université Côte d’Azur, CNRS-CRHEA, French National Center for Scientific Research, 06560 Valbonne, France; (A.M.); (M.N.); (A.C.); (P.V.)
| | - Philippe Vennéguès
- Université Côte d’Azur, CNRS-CRHEA, French National Center for Scientific Research, 06560 Valbonne, France; (A.M.); (M.N.); (A.C.); (P.V.)
| | - Vishnu Ottapilakkal
- French National Center for Scientific Research, IRL 2958 Georgia Tech, 2 rue Marconi, 57070 Metz, France; (V.O.); (P.V.); (S.S.); (A.O.)
| | - Phuong Vuong
- French National Center for Scientific Research, IRL 2958 Georgia Tech, 2 rue Marconi, 57070 Metz, France; (V.O.); (P.V.); (S.S.); (A.O.)
| | - Suresh Sundaram
- French National Center for Scientific Research, IRL 2958 Georgia Tech, 2 rue Marconi, 57070 Metz, France; (V.O.); (P.V.); (S.S.); (A.O.)
- Georgia Institute of Technology, School of Electrical and Computer Engineering, Atlanta, GA 30332-0250, USA
- Georgia Tech-Lorraine, 2 rue Marconi, 57070 Metz, France
| | - Abdallah Ougazzaden
- French National Center for Scientific Research, IRL 2958 Georgia Tech, 2 rue Marconi, 57070 Metz, France; (V.O.); (P.V.); (S.S.); (A.O.)
- Georgia Institute of Technology, School of Electrical and Computer Engineering, Atlanta, GA 30332-0250, USA
| | - Julien Brault
- Université Côte d’Azur, CNRS-CRHEA, French National Center for Scientific Research, 06560 Valbonne, France; (A.M.); (M.N.); (A.C.); (P.V.)
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5
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Mballo A, Ahaitouf A, Sundaram S, Srivastava A, Ottapilakkal V, Gujrati R, Vuong P, Karrakchou S, Kumar M, Li X, Halfaya Y, Gautier S, Voss PL, Salvestrini JP, Ougazzaden A. Natural Boron and 10B-Enriched Hexagonal Boron Nitride for High-Sensitivity Self-Biased Metal-Semiconductor-Metal Neutron Detectors. ACS Omega 2022; 7:804-809. [PMID: 35036747 PMCID: PMC8757347 DOI: 10.1021/acsomega.1c05458] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 10/01/2021] [Accepted: 12/14/2021] [Indexed: 06/14/2023]
Abstract
Metal-semiconductor-metal (MSM) detectors based on Ti/Au and Ni/Au interdigitated structures were fabricated using 2.5 micrometer thick hexagonal boron nitride (h-BN) layer with both natural and 10B-enriched boron. Current-voltage (I-V) and current-time (I-t) curves of the fabricated detectors were recorded with (I N) and without (I d) neutron irradiation, allowing the determination of their sensitivity (S = (I N - I d)/I d = ΔI/I d). Natural and 10B-enriched h-BN detectors exhibited high neutron sensitivities of 233 and 367% at 0 V bias under a flux of 3 × 104 n/cm2/s, respectively. An imbalance in the distribution of filled traps between the two electric contacts could explain the self-biased operation of the MSM detectors. Neutron sensitivity is further enhanced with electrical biasing, reaching 316 and 1192% at 200 V and a flux of 3 × 104 n/cm2/s for natural and 10B-enriched h-BN detectors, respectively, with dark current as low as 2.5 pA at 200 V. The increased performance under bias has been attributed to a gain mechanism based on neutron-induced charge carrier trapping at the semiconductor/metal interface. The response of the MSM detectors under thermal neutron flux and bias voltages was linear. These results clearly indicate that the thin-film monocrystal BN MSM neutron detectors can be optimized to operate sensitively with the absence of external bias and generate stronger signal detection using 10B-enriched boron.
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Affiliation(s)
- Adama Mballo
- CNRS,
IRL 2958, GT−CNRS, 2 rue Marconi, 57070 Metz, France
| | - Ali Ahaitouf
- CNRS,
IRL 2958, GT−CNRS, 2 rue Marconi, 57070 Metz, France
- Georgia
Tech-Lorraine, 2 rue Marconi, 57070 Metz, France
| | - Suresh Sundaram
- CNRS,
IRL 2958, GT−CNRS, 2 rue Marconi, 57070 Metz, France
- Georgia
Tech-Lorraine, 2 rue Marconi, 57070 Metz, France
| | - Ashutosh Srivastava
- CNRS,
IRL 2958, GT−CNRS, 2 rue Marconi, 57070 Metz, France
- School
of Electrical and Computer Engineering, GT-Lorraine, Georgia Institute of Technology, 57070 Metz, France
| | | | - Rajat Gujrati
- CNRS,
IRL 2958, GT−CNRS, 2 rue Marconi, 57070 Metz, France
- School
of Electrical and Computer Engineering, GT-Lorraine, Georgia Institute of Technology, 57070 Metz, France
| | - Phuong Vuong
- CNRS,
IRL 2958, GT−CNRS, 2 rue Marconi, 57070 Metz, France
| | | | - Mritunjay Kumar
- Advanced
Semiconductor Laboratory, King Abdullah
University of Science and Technology (KAUST), Thuwal 23955, Saudi Arabia
| | - Xiaohang Li
- Advanced
Semiconductor Laboratory, King Abdullah
University of Science and Technology (KAUST), Thuwal 23955, Saudi Arabia
| | | | - Simon Gautier
- Institut
Lafayette, 2 rue Marconi, 57070 Metz, France
| | - Paul L. Voss
- CNRS,
IRL 2958, GT−CNRS, 2 rue Marconi, 57070 Metz, France
- School
of Electrical and Computer Engineering, GT-Lorraine, Georgia Institute of Technology, 57070 Metz, France
| | - Jean Paul Salvestrini
- CNRS,
IRL 2958, GT−CNRS, 2 rue Marconi, 57070 Metz, France
- Georgia
Tech-Lorraine, 2 rue Marconi, 57070 Metz, France
- School
of Electrical and Computer Engineering, GT-Lorraine, Georgia Institute of Technology, 57070 Metz, France
| | - Abdallah Ougazzaden
- CNRS,
IRL 2958, GT−CNRS, 2 rue Marconi, 57070 Metz, France
- School
of Electrical and Computer Engineering, GT-Lorraine, Georgia Institute of Technology, 57070 Metz, France
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6
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Karrakchou S, Sundaram S, Ayari T, Mballo A, Vuong P, Srivastava A, Gujrati R, Ahaitouf A, Patriarche G, Leichlé T, Gautier S, Moudakir T, Voss PL, Salvestrini JP, Ougazzaden A. Effectiveness of selective area growth using van der Waals h-BN layer for crack-free transfer of large-size III-N devices onto arbitrary substrates. Sci Rep 2020; 10:21709. [PMID: 33303773 PMCID: PMC7728776 DOI: 10.1038/s41598-020-77681-z] [Citation(s) in RCA: 7] [Impact Index Per Article: 1.8] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 09/07/2020] [Accepted: 11/11/2020] [Indexed: 11/09/2022] Open
Abstract
Selective Area van der Waals Epitaxy (SAVWE) of III-Nitride device has been proposed recently by our group as an enabling solution for h-BN-based device transfer. By using a patterned dielectric mask with openings slightly larger than device sizes, pick-and-place of discrete LEDs onto flexible substrates was achieved. A more detailed study is needed to understand the effect of this selective area growth on material quality, device performance and device transfer. Here we present a study performed on two types of LEDs (those grown on h-BN on patterned and unpatterned sapphire) from the epitaxial growth to device performance and thermal dissipation measurements before and after transfer. Millimeter-size LEDs were transferred to aluminum tape and to silicon substrates by van der Waals liquid capillary bonding. It is shown that patterned samples lead to a better material quality as well as improved electrical and optical device performances. In addition, patterned structures allowed for a much better transfer yield to silicon substrates than unpatterned structures. We demonstrate that SAVWE, combined with either transfer processes to soft or rigid substrates, offers an efficient, robust and low-cost heterogenous integration capability of large-size devices to silicon for photonic and electronic applications.
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Affiliation(s)
- Soufiane Karrakchou
- Georgia Tech Lorraine, UMI 2958, Georgia Tech-CNRS, 2 rue Marconi, 57070, Metz, France.,Georgia Institute of Technology (School of Electrical and Computer Engineering), UMI 2958, Georgia Tech-CNRS, Atlanta, GA, 30332-0250, USA
| | - Suresh Sundaram
- Georgia Tech Lorraine, UMI 2958, Georgia Tech-CNRS, 2 rue Marconi, 57070, Metz, France.,Georgia Institute of Technology (School of Electrical and Computer Engineering), UMI 2958, Georgia Tech-CNRS, Atlanta, GA, 30332-0250, USA
| | - Taha Ayari
- Georgia Tech Lorraine, UMI 2958, Georgia Tech-CNRS, 2 rue Marconi, 57070, Metz, France.,Georgia Institute of Technology (School of Electrical and Computer Engineering), UMI 2958, Georgia Tech-CNRS, Atlanta, GA, 30332-0250, USA
| | - Adama Mballo
- CNRS, UMI 2958, Georgia Tech-CNRS, 2 rue Marconi, 57070, Metz, France
| | - Phuong Vuong
- CNRS, UMI 2958, Georgia Tech-CNRS, 2 rue Marconi, 57070, Metz, France
| | - Ashutosh Srivastava
- Georgia Tech Lorraine, UMI 2958, Georgia Tech-CNRS, 2 rue Marconi, 57070, Metz, France.,Georgia Institute of Technology (School of Electrical and Computer Engineering), UMI 2958, Georgia Tech-CNRS, Atlanta, GA, 30332-0250, USA
| | - Rajat Gujrati
- Georgia Tech Lorraine, UMI 2958, Georgia Tech-CNRS, 2 rue Marconi, 57070, Metz, France.,Georgia Institute of Technology (School of Electrical and Computer Engineering), UMI 2958, Georgia Tech-CNRS, Atlanta, GA, 30332-0250, USA
| | - Ali Ahaitouf
- Georgia Tech Lorraine, UMI 2958, Georgia Tech-CNRS, 2 rue Marconi, 57070, Metz, France
| | - Gilles Patriarche
- Centre de Nanosciences et de Nanotechnologies, Université Paris-Saclay, C2N-Site de Marcoussis, Route de Nozay, 91460, Marcoussis, France
| | - Thierry Leichlé
- CNRS, UMI 2958, Georgia Tech-CNRS, 2 rue Marconi, 57070, Metz, France
| | - Simon Gautier
- Institut Lafayette, 2 rue Marconi, 57070, Metz, France
| | | | - Paul L Voss
- Georgia Institute of Technology (School of Electrical and Computer Engineering), UMI 2958, Georgia Tech-CNRS, Atlanta, GA, 30332-0250, USA
| | - Jean Paul Salvestrini
- Georgia Tech Lorraine, UMI 2958, Georgia Tech-CNRS, 2 rue Marconi, 57070, Metz, France.,Georgia Institute of Technology (School of Electrical and Computer Engineering), UMI 2958, Georgia Tech-CNRS, Atlanta, GA, 30332-0250, USA
| | - Abdallah Ougazzaden
- Georgia Institute of Technology (School of Electrical and Computer Engineering), UMI 2958, Georgia Tech-CNRS, Atlanta, GA, 30332-0250, USA.
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7
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Vuong P, Sundaram S, Mballo A, Patriarche G, Leone S, Benkhelifa F, Karrakchou S, Moudakir T, Gautier S, Voss PL, Salvestrini JP, Ougazzaden A. Control of the Mechanical Adhesion of III-V Materials Grown on Layered h-BN. ACS Appl Mater Interfaces 2020; 12:55460-55466. [PMID: 33237738 DOI: 10.1021/acsami.0c16850] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/11/2023]
Abstract
Hexagonal boron nitride (h-BN) can be used as a p-doped material in wide-bandgap optoelectronic heterostructures or as a release layer to allow lift-off of grown three-dimensional (3D) GaN-based devices. To date, there have been no studies of factors that lead to or prevent lift-off and/or spontaneous delamination of layers. Here, we report a unique approach of controlling the adhesion of this layered material, which can result in both desired lift-off layered h-BN and mechanically inseparable robust h-BN layers. This is accomplished by controlling the diffusion of Al atoms into h-BN from AlN buffers grown on h-BN/sapphire. We present evidence of Al diffusion into h-BN for AlN buffers grown at high temperatures compared to conventional-temperature AlN buffers. Further evidence that the Al content in BN controls lift-off is provided by comparison of two alloys, Al0.03B0.97N/sapphire and Al0.17B0.83N/sapphire. Moreover, we tested that management of Al diffusion controls the mechanical adhesion of high-electron-mobility transistor (HEMT) devices grown on AlN/h-BN/sapphire. The results extend the control of two-dimensional (2D)/3D hetero-epitaxy and bring h-BN closer to industrial application in optoelectronics.
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Affiliation(s)
- Phuong Vuong
- Georgia Tech-CNRS, UMI 2958, Georgia Tech Lorraine, 57070 Metz, France
| | - Suresh Sundaram
- Georgia Tech-CNRS, UMI 2958, Georgia Tech Lorraine, 57070 Metz, France
- School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Adama Mballo
- Georgia Tech-CNRS, UMI 2958, Georgia Tech Lorraine, 57070 Metz, France
| | - Gilles Patriarche
- Centre de Nanosciences et de Nanotechnologies, Université Paris-Saclay, C2N-Site de Marcoussis, Route de Nozay, F-91460 Marcoussis, France
| | - Stefano Leone
- Fraunhofer IAF, Fraunhofer Institute for Applied Solid State Physics, Tullastrasse 72, 79108 Freiburg, Germany
| | - Fouad Benkhelifa
- Fraunhofer IAF, Fraunhofer Institute for Applied Solid State Physics, Tullastrasse 72, 79108 Freiburg, Germany
| | - Soufiane Karrakchou
- Georgia Tech-CNRS, UMI 2958, Georgia Tech Lorraine, 57070 Metz, France
- School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | | | - Simon Gautier
- Institut Lafayette, 2 rue Marconi, 57070 Metz, France
| | - Paul L Voss
- Georgia Tech-CNRS, UMI 2958, Georgia Tech Lorraine, 57070 Metz, France
- School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Jean-Paul Salvestrini
- Georgia Tech-CNRS, UMI 2958, Georgia Tech Lorraine, 57070 Metz, France
- School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Abdallah Ougazzaden
- Georgia Tech-CNRS, UMI 2958, Georgia Tech Lorraine, 57070 Metz, France
- School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
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8
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Ducos J, Chantanumat P, Vuong P, Lambot C, Pétiard V. MASS PROPAGATION OF ROBUSTA CLONES: DISPOSABLE PLASTIC BAGS FOR PREGERMINATION OF SOMATIC EMBRYOS BY TEMPORARY IMMERSION. ACTA ACUST UNITED AC 2007. [DOI: 10.17660/actahortic.2007.764.3] [Citation(s) in RCA: 12] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
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9
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Amiot F, Vuong P, Defontaines M, Pater C, Dautry F, Liance M. Secondary alveolar echinococcosis in lymphotoxin-alpha and tumour necrosis factor-alpha deficient mice: exacerbation of Echinococcus multilocularis larval growth is associated with cellular changes in the periparasitic granuloma. Parasite Immunol 1999; 21:475-83. [PMID: 10476056 DOI: 10.1046/j.1365-3024.1999.00245.x] [Citation(s) in RCA: 35] [Impact Index Per Article: 1.4] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/20/2022]
Abstract
The availability of mice carrying a deletion of LT-alpha and tumour necrosis factor (TNF)-alpha genes enabled us to investigate the role of the TNF during alveolar echinococcosis. We compared the growth rate of Echinococcus multilocularis in LT-alphaTNF-alpha +/+ mice to that of mice having either no or only one LT-alphaTNF-alpha functionnal allele. LT-alphaTNF-alpha -/- mice harboured a significantly higher parasite burden than did the other two populations at 5, 10, and 15 weeks of infection, and they did not survive thereafter. Liver metacestodes removed from these mice were alive and the dehydrogenase activities of peritoneal metacestodes were decreased. Liver lesions regressed in most wild-type mice. Indeed, dead parasites were cordoned by granulomas containing numerous macrophages and lymphocytes leading to focal liver fibrosis at an early stage of infection. In contrast, most of LT-alphaTNF-alpha -/- mice harboured metacestodes interspersed with leucocytes, realising purulent abscesses with secondary extensive irregular fibrosis at a late stage of infection. Heterozygous mice had behavioural characteristics intermediate between homozygous mutants and wild-type mice. Levels of E. multilocularis-specific delayed-type hypersensitivity and serum antibodies were slightly decreased in LT-alphaTNF-alpha -/- mice. This study shows that TNF-alpha and/or LT-alpha genes play an essential role in the immune protection mechanisms against E. multilocularis at the site of infection.
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Affiliation(s)
- F Amiot
- UPR 1983, Institut de Recherches sur le Cancer, Villejuif, France
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10
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Mora-Silvera E, Coquelin F, Vuong P, Deharo E, Gautret P, Renia L, Chabaud A, Landau I. Role of macrophages as possible transporters of Plasmodium yoelii nigeriensis merozoites through the lymphatic system. Preliminary note. Parasite 1997; 4:83-5. [PMID: 9208034 DOI: 10.1051/parasite/1997041083] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.1] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 02/04/2023] Open
Abstract
Vesicles containing apparently healthy merozoites from mature schizonts were observed in the spleen and lymph nodes of mice parasitized by Plasmodium yoelii nigeriensis. They differed from all parasitic stages undergoing digestion by the macrophage and from mature schizonts of the blood. Up to 40 merozoites from three mature schizonts may be seen in the same compartment. They are thought to be accumulations of latent merozoites.
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Affiliation(s)
- E Mora-Silvera
- Laboratoire de Biologie Parasitaire, Helminthologie, Protozoologie (CNRS ERS 156), Muséum National d'Histoire Naturelle, Paris
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11
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Sachs RN, Vuong P, Beaudet B, Fischbein L, Nitenberg A, Lanfranchi J. [Identification of prognostic criteria of dilated cardiomyopathies associated with chronic alcoholism. 22 cases]. Presse Med 1988; 17:1251-4. [PMID: 2969565] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Journal Information] [Submit a Manuscript] [Subscribe] [Scholar Register] [Indexed: 01/03/2023] Open
Abstract
Between November, 1978 and August, 1983, 22 patients aged from 28 to 65 years with idiopathic dilated cardiomyopathy diagnosed on the basis of clinical and haemodynamic criteria were investigated. All these patients, who consumed alcohol in excessive amounts, were followed up for 1 to 58 months. The overall mortality rate was 10 p. 100 at 4 months and 25 p. 100 at 58 months. Six patients were clinically improved with reduction of heart size (group A); 10 patients showed deterioration with 3 deaths (group C) and 6 patients followed an intermediate course (group B). When the characteristics of the groups were evaluated, it was found that compared to group C patients those in groups A and B had a lower cardiothoracic ratio: 0.56 +/- 0.04 (B) vs 0.64 +/- 0.06 (C) (P less than 0.02), a lower indexed end-diastolic diameter and systolic diameter on TM echo: 3.20 +/- 0.50 cm/m2 (A) vs 4.13 +/- 0.39 cm/m2 (C) (P less than 0.02), and 2.72 +/- 0.37 cm/m2 (A) vs 3.57 +/- 0.47 cm/m2 (C) (P less than 0.02) respectively, and a lower indexed end-diastolic volume as evaluated by angiography: 121 +/- 61 ml/m2 (A) vs 202 +/- 65 ml/m2 (C) (P less than 0.06). Dilated cardiomyopathy associated with excessive alcohol consumption has a better prognosis when the patients stop drinking and when their heart dilatation is mild to moderate.
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Affiliation(s)
- R N Sachs
- Service de Médecine interne et cardiovasculaire, Hôpital Avicenne, Bobigny
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