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Liang K, Li D, Ren H, Zhao M, Wang H, Ding M, Xu G, Zhao X, Long S, Zhu S, Sheng P, Li W, Lin X, Zhu B. Fully Printed High-Performance n-Type Metal Oxide Thin-Film Transistors Utilizing Coffee-Ring Effect. NANO-MICRO LETTERS 2021; 13:164. [PMID: 34342729 PMCID: PMC8333237 DOI: 10.1007/s40820-021-00694-4] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 05/25/2021] [Accepted: 07/13/2021] [Indexed: 06/13/2023]
Abstract
Metal oxide thin-films transistors (TFTs) produced from solution-based printing techniques can lead to large-area electronics with low cost. However, the performance of current printed devices is inferior to those from vacuum-based methods due to poor film uniformity induced by the "coffee-ring" effect. Here, we report a novel approach to print high-performance indium tin oxide (ITO)-based TFTs and logic inverters by taking advantage of such notorious effect. ITO has high electrical conductivity and is generally used as an electrode material. However, by reducing the film thickness down to nanometers scale, the carrier concentration of ITO can be effectively reduced to enable new applications as active channels in transistors. The ultrathin (~10-nm-thick) ITO film in the center of the coffee-ring worked as semiconducting channels, while the thick ITO ridges (>18-nm-thick) served as the contact electrodes. The fully inkjet-printed ITO TFTs exhibited a high saturation mobility of 34.9 cm2 V-1 s-1 and a low subthreshold swing of 105 mV dec-1. In addition, the devices exhibited excellent electrical stability under positive bias illumination stress (PBIS, ΔVth = 0.31 V) and negative bias illuminaiton stress (NBIS, ΔVth = -0.29 V) after 10,000 s voltage bias tests. More remarkably, fully printed n-type metal-oxide-semiconductor (NMOS) inverter based on ITO TFTs exhibited an extremely high gain of 181 at a low-supply voltage of 3 V, promising for advanced electronics applications.
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Affiliation(s)
- Kun Liang
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
- Zhejiang University, Hangzhou, 310027, China
| | - Dingwei Li
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
- Zhejiang University, Hangzhou, 310027, China
| | - Huihui Ren
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
- Zhejiang University, Hangzhou, 310027, China
| | - Momo Zhao
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
- Key Laboratory of Wide Band Gap Semiconductor Technology, School of Microelectronics, Xidian University, Xian, 710071, China
| | - Hong Wang
- Key Laboratory of Wide Band Gap Semiconductor Technology, School of Microelectronics, Xidian University, Xian, 710071, China
| | - Mengfan Ding
- School of Microelectronics, University of Science and Technology of China, Hefei, 230026, China
| | - Guangwei Xu
- School of Microelectronics, University of Science and Technology of China, Hefei, 230026, China
| | - Xiaolong Zhao
- School of Microelectronics, University of Science and Technology of China, Hefei, 230026, China
| | - Shibing Long
- School of Microelectronics, University of Science and Technology of China, Hefei, 230026, China
| | - Siyuan Zhu
- Instrumentation and Service Center for Physical Sciences, Westlake University, Hangzhou, 310024, China
| | - Pei Sheng
- Instrumentation and Service Center for Physical Sciences, Westlake University, Hangzhou, 310024, China
| | - Wenbin Li
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China
- Institute of Advanced Technology, Westlake Institute for Advanced Study, Hangzhou, 310024, China
| | - Xiao Lin
- School of Science, Westlake University, Hangzhou, 310024, China
| | - Bowen Zhu
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou, 310024, China.
- Institute of Advanced Technology, Westlake Institute for Advanced Study, Hangzhou, 310024, China.
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Fruncillo S, Su X, Liu H, Wong LS. Lithographic Processes for the Scalable Fabrication of Micro- and Nanostructures for Biochips and Biosensors. ACS Sens 2021; 6:2002-2024. [PMID: 33829765 PMCID: PMC8240091 DOI: 10.1021/acssensors.0c02704] [Citation(s) in RCA: 25] [Impact Index Per Article: 8.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/14/2022]
Abstract
Since the early 2000s, extensive research has been performed to address numerous challenges in biochip and biosensor fabrication in order to use them for various biomedical applications. These biochips and biosensor devices either integrate biological elements (e.g., DNA, proteins or cells) in the fabrication processes or experience post fabrication of biofunctionalization for different downstream applications, including sensing, diagnostics, drug screening, and therapy. Scalable lithographic techniques that are well established in the semiconductor industry are now being harnessed for large-scale production of such devices, with additional development to meet the demand of precise deposition of various biological elements on device substrates with retained biological activities and precisely specified topography. In this review, the lithographic methods that are capable of large-scale and mass fabrication of biochips and biosensors will be discussed. In particular, those allowing patterning of large areas from 10 cm2 to m2, maintaining cost effectiveness, high throughput (>100 cm2 h-1), high resolution (from micrometer down to nanometer scale), accuracy, and reproducibility. This review will compare various fabrication technologies and comment on their resolution limit and throughput, and how they can be related to the device performance, including sensitivity, detection limit, reproducibility, and robustness.
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Affiliation(s)
- Silvia Fruncillo
- Manchester Institute of Biotechnology, University of Manchester, 131 Princess Street, Manchester, M1 7DN, United Kingdom
- Department of Chemistry, University of Manchester, Oxford Road, Manchester M13 9PL, United Kingdom
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03, Innovis, Singapore 138634, Singapore
| | - Xiaodi Su
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03, Innovis, Singapore 138634, Singapore
- Department of Chemistry, National University of Singapore, Block S8, Level 3, 3 Science Drive, Singapore 117543, Singapore
| | - Hong Liu
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03, Innovis, Singapore 138634, Singapore
| | - Lu Shin Wong
- Manchester Institute of Biotechnology, University of Manchester, 131 Princess Street, Manchester, M1 7DN, United Kingdom
- Department of Chemistry, University of Manchester, Oxford Road, Manchester M13 9PL, United Kingdom
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Zavanelli N, Kim J, Yeo WH. Recent Advances in High-Throughput Nanomaterial Manufacturing for Hybrid Flexible Bioelectronics. MATERIALS (BASEL, SWITZERLAND) 2021; 14:2973. [PMID: 34072779 PMCID: PMC8197924 DOI: 10.3390/ma14112973] [Citation(s) in RCA: 8] [Impact Index Per Article: 2.7] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 04/29/2021] [Revised: 05/27/2021] [Accepted: 05/27/2021] [Indexed: 12/02/2022]
Abstract
Hybrid flexible bioelectronic systems refer to integrated soft biosensing platforms with tremendous clinical impact. In this new paradigm, electrical systems can stretch and deform with the skin while previously hidden physiological signals can be continuously recorded. However, hybrid flexible bioelectronics will not receive wide clinical adoption until these systems can be manufactured at industrial scales cost-effectively. Therefore, new manufacturing approaches must be discovered and studied under the same innovative spirit that led to the adoption of novel materials and soft structures. Recent works have taken mature manufacturing approaches from the graphics industry, such as gravure, flexography, screen, and inkjet printing, and applied them to fully printed bioelectronics. These applications require the cohesive study of many disparate parts. For instance, nanomaterials with optimal properties for each specific application must be dispersed in printable inks with rheology suited to each printing method. This review summarizes recent advances in printing technologies, key nanomaterials, and applications of the manufactured hybrid bioelectronics. We also discuss the existing challenges of the available nanomanufacturing methods and the areas that need immediate technological improvements.
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Affiliation(s)
- Nathan Zavanelli
- George W. Woodruff School of Mechanical Engineering, Center for Human-Centric Interfaces and Engineering at the Institute for Electronics and Nanotechnology, Georgia Institute of Technology, Atlanta, GA 30332, USA; (N.Z.); (J.K.)
| | - Jihoon Kim
- George W. Woodruff School of Mechanical Engineering, Center for Human-Centric Interfaces and Engineering at the Institute for Electronics and Nanotechnology, Georgia Institute of Technology, Atlanta, GA 30332, USA; (N.Z.); (J.K.)
| | - Woon-Hong Yeo
- George W. Woodruff School of Mechanical Engineering, Center for Human-Centric Interfaces and Engineering at the Institute for Electronics and Nanotechnology, Georgia Institute of Technology, Atlanta, GA 30332, USA; (N.Z.); (J.K.)
- Wallace H. Coulter Department of Biomedical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
- Parker H. Petit Institute for Bioengineering and Biosciences, Neural Engineering Center, Institute for Materials, Institute for Robotics and Intelligent Machines, Georgia Institute of Technology, Atlanta, GA 30332, USA
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Lee JI, Kim M, Park JH, Kang B, Lee CY, Park YD. Metal-Organic Framework as a Functional Analyte Channel of Organic-Transistor-Based Air Pollution Sensors. ACS APPLIED MATERIALS & INTERFACES 2021; 13:24005-24012. [PMID: 33999613 DOI: 10.1021/acsami.1c04570] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/12/2023]
Abstract
Air pollution sensors based on organic transistors have attracted much interest recently; however, the devices suffer from low responsivity and slow response and recovery rates for gas analytes. These shortcomings are attributed to the low charge-carrier mobility of organic semiconductors and to a structural limitation resulting from the use of a thick and continuous active layer. In the present work, we investigated the material properties of a multiscale porous zeolitic imidazolate framework, [Zn(2-methylimidazole)2]n (ZIF-8), and examined its potential as an analyte channel material inserted at an organic-transistor active layer. A series of carbonized zeolitic imidazolate frameworks (ZIFs) were prepared by thermal conversion of ZIF-8 and also studied for comparison. The microstructures, morphologies, and optical/electrical characteristics of polythiophene/ZIF-8 hybrid films were systematically investigated. Organic-transistor-type nitrogen dioxide sensors based on the polythiophene/ZIF-8 hybrid films showed substantially improved sensing properties, including responsivity, response rate, and recovery rate. The electrical conductivity of the carbonized ZIF-8s enhanced the field-effect mobility of the organic transistors; however, the sensing performance was not improved, because of the closed pore structures resulting from the carbonization. These results provide invaluable information and useful insights into the design of transistor-type gas sensors based on organic semiconductor/metal-organic framework hybrid films.
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Affiliation(s)
- Jeong Ik Lee
- Department of Energy and Chemical Engineering, Incheon National University, Incheon 22012, Republic of Korea
| | - Miyeon Kim
- Department of Energy and Chemical Engineering, Incheon National University, Incheon 22012, Republic of Korea
| | - Jun Hwa Park
- Department of Energy and Chemical Engineering, Incheon National University, Incheon 22012, Republic of Korea
| | - Boseok Kang
- SKKU Advanced Institute of Nanotechnology (SAINT) and Department of Nano Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Chang Yeon Lee
- Department of Energy and Chemical Engineering, Incheon National University, Incheon 22012, Republic of Korea
| | - Yeong Don Park
- Department of Energy and Chemical Engineering, Incheon National University, Incheon 22012, Republic of Korea
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Wen D, Wang X, Liu L, Hu C, Sun C, Wu Y, Zhao Y, Zhang J, Liu X, Ying G. Inkjet Printing Transparent and Conductive MXene (Ti 3C 2Tx) Films: A Strategy for Flexible Energy Storage Devices. ACS APPLIED MATERIALS & INTERFACES 2021; 13:17766-17780. [PMID: 33843188 DOI: 10.1021/acsami.1c00724] [Citation(s) in RCA: 28] [Impact Index Per Article: 9.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/28/2023]
Abstract
MXene is a generic name for a large family of two-dimensional transition metal carbides or nitrides, which show great promise in the field of transparent supercapacitors. However, the manufacturing of supercapacitor electrodes with a high charge storage capacity and desirable transmittance is a challenging task. Herein, a low-cost, large-scale, and rapid preparation of flexible and transparent MXene films via inkjet printing is reported. The MXene films realized the sheet resistance (Rs) of 1.66 ± 0.16 MΩ sq-1 to 1.47 ± 0.1 kΩ sq-1 at the transmissivity of 87-24% (λ = 550 nm), respectively, corresponding to the figure of merit (the ratio of electronic to optical conductivity, σDC/σOP) of ∼0.0012 to 0.13. Furthermore, the potential of inkjet-printed transparent MXene films in transparent supercapacitors was assessed by electrochemical characterization. The MXene film, with a transmittance of 24%, exhibited a superior areal capacitance of 887.5 μF cm-2 and retained 85% of the initial capacitance after 10,000 charge/discharge cycles at the scan rate of 10 mV s-1. Interestingly, the areal capacitance (192 μF cm-2) of an assembled symmetric MXene transparent supercapacitor, with a high transmittance of 73%, still surpasses the performance of previously reported graphene and single-walled carbon nanotube (SWCNT)-based transparent electrodes. The convenient manufacturing and superior electrochemical performance of inkjet-printed flexible and transparent MXene films widen the application horizon of this strategy for flexible energy storage devices.
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Affiliation(s)
- Dong Wen
- Key Laboratory of Superlight Material and Surface Technology, Ministry of Education, Harbin Engineering University, Harbin 150001, P. R. China
- Department of Materials Science and Engineering, College of Mechanics and Materials, Hohai University, Nanjing 211100, China
| | - Xiang Wang
- Key Laboratory of Superlight Material and Surface Technology, Ministry of Education, Harbin Engineering University, Harbin 150001, P. R. China
| | - Lu Liu
- Department of Materials Science and Engineering, College of Mechanics and Materials, Hohai University, Nanjing 211100, China
| | - Cong Hu
- Department of Materials Science and Engineering, College of Mechanics and Materials, Hohai University, Nanjing 211100, China
| | - Cheng Sun
- Department of Materials Science and Engineering, College of Mechanics and Materials, Hohai University, Nanjing 211100, China
| | - Yiran Wu
- Department of Materials Science and Engineering, College of Mechanics and Materials, Hohai University, Nanjing 211100, China
| | - Yinlong Zhao
- Department of Materials Science and Engineering, College of Mechanics and Materials, Hohai University, Nanjing 211100, China
| | - Jianxin Zhang
- Department of Materials Science and Engineering, College of Mechanics and Materials, Hohai University, Nanjing 211100, China
| | - Xudong Liu
- Key Laboratory of Superlight Material and Surface Technology, Ministry of Education, Harbin Engineering University, Harbin 150001, P. R. China
| | - Guobing Ying
- Department of Materials Science and Engineering, College of Mechanics and Materials, Hohai University, Nanjing 211100, China
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Jang S, Kang J, Kwak S, Seol ML, Meyyappan M, Nam I. Methodologies for Fabricating Flexible Supercapacitors. MICROMACHINES 2021; 12:163. [PMID: 33562424 PMCID: PMC7915198 DOI: 10.3390/mi12020163] [Citation(s) in RCA: 7] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 01/05/2021] [Revised: 01/24/2021] [Accepted: 02/02/2021] [Indexed: 11/16/2022]
Abstract
The spread of wearable and flexible electronics devices has been accelerating in recent years for a wide range of applications. Development of an appropriate flexible power source to operate these flexible devices is a key challenge. Supercapacitors are attractive for powering portable lightweight consumer devices due to their long cycle stability, fast charge-discharge cycle, outstanding power density, wide operating temperatures and safety. Much effort has been devoted to ensure high mechanical and electrochemical stability upon bending, folding or stretching and to develop flexible electrodes, substrates and overall geometrically-flexible structures. Supercapacitors have attracted considerable attention and shown many applications on various scales. In this review, we focus on flexible structural design under six categories: paper-like, textile-like, wire-like, origami, biomimetics based design and micro-supercapacitors. Finally, we present our perspective of flexible supercapacitors and emphasize current technical difficulties to stimulate further research.
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Affiliation(s)
- Seohyeon Jang
- School of Chemical Engineering and Materials Science, Department of Intelligent Energy and Industry, Institute of Energy Converting Soft Materials, Chung-Ang University, Seoul 06974, Korea; (S.J.); (J.K.); (S.K.)
| | - Jihyeon Kang
- School of Chemical Engineering and Materials Science, Department of Intelligent Energy and Industry, Institute of Energy Converting Soft Materials, Chung-Ang University, Seoul 06974, Korea; (S.J.); (J.K.); (S.K.)
| | - Soyul Kwak
- School of Chemical Engineering and Materials Science, Department of Intelligent Energy and Industry, Institute of Energy Converting Soft Materials, Chung-Ang University, Seoul 06974, Korea; (S.J.); (J.K.); (S.K.)
| | - Myeong-Lok Seol
- Center for Nanotechnology, NASA Ames Research Center, Moffett Field, CA 94035, USA; (M.-L.S.); (M.M.)
- Universities Space Research Association, NASA Ames Research Center, Moffett Field, CA 94035, USA
| | - M. Meyyappan
- Center for Nanotechnology, NASA Ames Research Center, Moffett Field, CA 94035, USA; (M.-L.S.); (M.M.)
| | - Inho Nam
- School of Chemical Engineering and Materials Science, Department of Intelligent Energy and Industry, Institute of Energy Converting Soft Materials, Chung-Ang University, Seoul 06974, Korea; (S.J.); (J.K.); (S.K.)
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Tang X, Kwon HJ, Li Z, Wang R, Kim SJ, Park CE, Jeong YJ, Kim SH. Strategy for Selective Printing of Gate Insulators Customized for Practical Application in Organic Integrated Devices. ACS APPLIED MATERIALS & INTERFACES 2021; 13:1043-1056. [PMID: 33356127 DOI: 10.1021/acsami.0c18477] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/12/2023]
Abstract
Direct drawing techniques have contributed to the ease of patterning soft electronic materials, which are the building blocks of analog and digital integrated circuits. In parallel with the printing of semiconductors and electrodes, selective deposition of gate insulators (GI) is an equally important factor in simplifying the fabrication of integrated devices, such as NAND and NOR gates, and memory devices. This study demonstrates the fabrication of six types of printed GI layers (high/low-k polymer and organic-inorganic hybrid material), which are utilized as GIs in organic field-effect transistors (OFETs), using the electrostatic-force-assisted dispensing printing technique. The selective printing of GIs on the gate electrodes enables us to develop practical integrated devices that go beyond unit OFET devices, exhibiting robust switching performances, non-destructive operations, and high gain values. Moreover, the flexible integrated devices fabricated using this technique exhibit excellent operational behavior. Therefore, this facile fabrication technique can pave a new path for the production of practical integrated device arrays for next-generation devices.
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Affiliation(s)
- Xiaowu Tang
- Department of Advanced Organic Materials Engineering, Yeungnam University, Gyeongsan 38541, Republic of Korea
| | - Hyeok-Jin Kwon
- Department of Chemical Engineering, Pohang University of Science and Technology, Pohang 37673, Republic of Korea
| | - Zhijun Li
- Department of Advanced Organic Materials Engineering, Yeungnam University, Gyeongsan 38541, Republic of Korea
| | - Rixuan Wang
- Department of Advanced Organic Materials Engineering, Yeungnam University, Gyeongsan 38541, Republic of Korea
| | - Se Jin Kim
- Department of Materials Science & Engineering, Korea National University of Transportation, Chungju 27469, Republic of Korea
| | - Chan Eon Park
- Department of Chemical Engineering, Pohang University of Science and Technology, Pohang 37673, Republic of Korea
| | - Yong Jin Jeong
- Department of Materials Science & Engineering, Korea National University of Transportation, Chungju 27469, Republic of Korea
| | - Se Hyun Kim
- Department of Advanced Organic Materials Engineering, Yeungnam University, Gyeongsan 38541, Republic of Korea
- School of Chemical Engineering, Yeungnam University, Gyeongsan 38541, Republic of Korea
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Recent Advanced on the MXene-Organic Hybrids: Design, Synthesis, and Their Applications. NANOMATERIALS 2021; 11:nano11010166. [PMID: 33440847 PMCID: PMC7826894 DOI: 10.3390/nano11010166] [Citation(s) in RCA: 25] [Impact Index Per Article: 8.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 12/21/2020] [Revised: 01/06/2021] [Accepted: 01/07/2021] [Indexed: 11/23/2022]
Abstract
With increasing research interest in the field of flexible electronics and wearable devices, intensive efforts have been paid to the development of novel inorganic-organic hybrid materials. As a newly developed two-dimensional (2D) material family, MXenes present many advantages compared with other 2D analogs, especially the variable surface terminal groups, thus the infinite possibility for the regulation of surface physicochemical properties. However, there is still less attention paid to the interfacial compatibility of the MXene-organic hybrids. To this end, this review will briefly summarize the recent progress on MXene-organic hybrids, offers a deeper understanding of the interaction and collaborative mechanism between the MXenes and organic component. After the discussion of the structure and surface characters of MXenes, strategies towards MXene-organic hybrids are introduced based on the interfacial interactions. Based on different application scenarios, the advantages of MXene-organic hybrids in constructing flexible devices are then discussed. The challenges and outlook on MXene-organic hybrids are also presented.
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Organic Thin-Film Transistors as Gas Sensors: A Review. MATERIALS 2020; 14:ma14010003. [PMID: 33375044 PMCID: PMC7792760 DOI: 10.3390/ma14010003] [Citation(s) in RCA: 12] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 10/30/2020] [Revised: 12/02/2020] [Accepted: 12/04/2020] [Indexed: 01/16/2023]
Abstract
Organic thin-film transistors (OTFTs) are miniaturized devices based upon the electronic responses of organic semiconductors. In comparison to their conventional inorganic counterparts, organic semiconductors are cheaper, can undergo reversible doping processes and may have electronic properties chiefly modulated by molecular engineering approaches. More recently, OTFTs have been designed as gas sensor devices, displaying remarkable performance for the detection of important target analytes, such as ammonia, nitrogen dioxide, hydrogen sulfide and volatile organic compounds (VOCs). The present manuscript provides a comprehensive review on the working principle of OTFTs for gas sensing, with concise descriptions of devices’ architectures and parameter extraction based upon a constant charge carrier mobility model. Then, it moves on with methods of device fabrication and physicochemical descriptions of the main organic semiconductors recently applied to gas sensors (i.e., since 2015 but emphasizing even more recent results). Finally, it describes the achievements of OTFTs in the detection of important gas pollutants alongside an outlook toward the future of this exciting technology.
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Smith LW, Batey JO, Alexander-Webber JA, Fan Y, Hsieh YC, Fung SJ, Jevtics D, Robertson J, Guilhabert BJE, Strain MJ, Dawson MD, Hurtado A, Griffiths JP, Beere HE, Jagadish C, Burton OJ, Hofmann S, Chen TM, Ritchie DA, Kelly M, Joyce HJ, Smith CG. High-Throughput Electrical Characterization of Nanomaterials from Room to Cryogenic Temperatures. ACS NANO 2020; 14:15293-15305. [PMID: 33104341 DOI: 10.1021/acsnano.0c05622] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/11/2023]
Abstract
We present multiplexer methodology and hardware for nanoelectronic device characterization. This high-throughput and scalable approach to testing large arrays of nanodevices operates from room temperature to milli-Kelvin temperatures and is universally compatible with different materials and integration techniques. We demonstrate the applicability of our approach on two archetypal nanomaterials-graphene and semiconductor nanowires-integrated with a GaAs-based multiplexer using wet or dry transfer methods. A graphene film grown by chemical vapor deposition is transferred and patterned into an array of individual devices, achieving 94% yield. Device performance is evaluated using data fitting methods to obtain electrical transport metrics, showing mobilities comparable to nonmultiplexed devices fabricated on oxide substrates using wet transfer techniques. Separate arrays of indium-arsenide nanowires and micromechanically exfoliated monolayer graphene flakes are transferred using pick-and-place techniques. For the nanowire array mean values for mobility μFE = 880/3180 cm2 V-1 s-1 (lower/upper bound), subthreshold swing 430 mV dec-1, and on/off ratio 3.1 decades are extracted, similar to nonmultiplexed devices. In another array, eight mechanically exfoliated graphene flakes are transferred using techniques compatible with fabrication of two-dimensional superlattices, with 75% yield. Our results are a proof-of-concept demonstration of a versatile platform for scalable fabrication and cryogenic characterization of nanomaterial device arrays, which is compatible with a broad range of nanomaterials, transfer techniques, and device integration strategies from the forefront of quantum technology research.
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Affiliation(s)
- Luke W Smith
- Department of Physics, Cavendish Laboratory, University of Cambridge, Cambridge CB3 0HE, U.K
| | - Jack O Batey
- Department of Physics, Cavendish Laboratory, University of Cambridge, Cambridge CB3 0HE, U.K
| | - Jack A Alexander-Webber
- Electrical Engineering Division, Department of Engineering, University of Cambridge, Cambridge CB3 0FA, U.K
| | - Ye Fan
- Electrical Engineering Division, Department of Engineering, University of Cambridge, Cambridge CB3 0FA, U.K
| | - Yu-Chiang Hsieh
- Department of Physics, National Cheng Kung University, Tainan 701, Taiwan
| | - Shin-Jr Fung
- Department of Physics, National Cheng Kung University, Tainan 701, Taiwan
| | - Dimitars Jevtics
- Institute of Photonics, Department of Physics, University of Strathclyde, Technology and Innovation Centre, 99 George Street, G1 1RD, Glasgow, U.K
| | - Joshua Robertson
- Institute of Photonics, Department of Physics, University of Strathclyde, Technology and Innovation Centre, 99 George Street, G1 1RD, Glasgow, U.K
| | - Benoit J E Guilhabert
- Institute of Photonics, Department of Physics, University of Strathclyde, Technology and Innovation Centre, 99 George Street, G1 1RD, Glasgow, U.K
| | - Michael J Strain
- Institute of Photonics, Department of Physics, University of Strathclyde, Technology and Innovation Centre, 99 George Street, G1 1RD, Glasgow, U.K
| | - Martin D Dawson
- Institute of Photonics, Department of Physics, University of Strathclyde, Technology and Innovation Centre, 99 George Street, G1 1RD, Glasgow, U.K
| | - Antonio Hurtado
- Institute of Photonics, Department of Physics, University of Strathclyde, Technology and Innovation Centre, 99 George Street, G1 1RD, Glasgow, U.K
| | - Jonathan P Griffiths
- Department of Physics, Cavendish Laboratory, University of Cambridge, Cambridge CB3 0HE, U.K
| | - Harvey E Beere
- Department of Physics, Cavendish Laboratory, University of Cambridge, Cambridge CB3 0HE, U.K
| | - Chennupati Jagadish
- Department of Electronic Materials Engineering and Australian Research Council Centre of Excellence on Tranformative Meta-Optical Systems, Research School of Physics, The Australian National University, Canberra, ACT 2601, Australia
| | - Oliver J Burton
- Electrical Engineering Division, Department of Engineering, University of Cambridge, Cambridge CB3 0FA, U.K
| | - Stephan Hofmann
- Electrical Engineering Division, Department of Engineering, University of Cambridge, Cambridge CB3 0FA, U.K
| | - Tse-Ming Chen
- Department of Physics, National Cheng Kung University, Tainan 701, Taiwan
| | - David A Ritchie
- Department of Physics, Cavendish Laboratory, University of Cambridge, Cambridge CB3 0HE, U.K
| | - Michael Kelly
- Department of Physics, Cavendish Laboratory, University of Cambridge, Cambridge CB3 0HE, U.K
- Electrical Engineering Division, Department of Engineering, University of Cambridge, Cambridge CB3 0FA, U.K
| | - Hannah J Joyce
- Electrical Engineering Division, Department of Engineering, University of Cambridge, Cambridge CB3 0FA, U.K
| | - Charles G Smith
- Department of Physics, Cavendish Laboratory, University of Cambridge, Cambridge CB3 0HE, U.K
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Dahiya AS, Shakthivel D, Kumaresan Y, Zumeit A, Christou A, Dahiya R. High-performance printed electronics based on inorganic semiconducting nano to chip scale structures. NANO CONVERGENCE 2020; 7:33. [PMID: 33034776 PMCID: PMC7547062 DOI: 10.1186/s40580-020-00243-6] [Citation(s) in RCA: 19] [Impact Index Per Article: 4.8] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/13/2020] [Accepted: 09/15/2020] [Indexed: 05/05/2023]
Abstract
The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.
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Affiliation(s)
- Abhishek Singh Dahiya
- Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, Glasgow, G12 8QQ, UK
| | - Dhayalan Shakthivel
- Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, Glasgow, G12 8QQ, UK
| | - Yogeenth Kumaresan
- Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, Glasgow, G12 8QQ, UK
| | - Ayoub Zumeit
- Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, Glasgow, G12 8QQ, UK
| | - Adamos Christou
- Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, Glasgow, G12 8QQ, UK
| | - Ravinder Dahiya
- Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, Glasgow, G12 8QQ, UK.
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62
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Wan T, Guan P, Guan X, Hu L, Wu T, Cazorla C, Chu D. Facile Patterning of Silver Nanowires with Controlled Polarities via Inkjet-Assisted Manipulation of Interface Adhesion. ACS APPLIED MATERIALS & INTERFACES 2020; 12:34086-34094. [PMID: 32643927 DOI: 10.1021/acsami.0c07950] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/11/2023]
Abstract
Facile patterning technologies of silver nanowires (AgNWs) with low-cost, high-resolution, designable, scalable, substrate-independent, and transferable characteristics are highly desired. However, it remains a grand challenge for any material processing method to fulfil all desirable features. Herein, a new patterning method is introduced by combining inkjet printing with adhesion manipulation of substrate interfaces. Both positive and negative patterns (i.e., AgNW grid and rectangular patterns) have been simultaneously achieved, and the pattern polarity can be reversed through adhesion modification with judiciously selected supporting layers. The electrical performance of the AgNW grids depends on the AgNW interlocking structure, manifesting a strong structure-property correlation. High-resolution and complex AgNW patterns with line width and spacing as small as 10 μm have been demonstrated through selective deposition of poly(methyl methacrylate) layers. In addition, customized AgNW patterns, such as logos and words, can be fabricated onto A4-size samples and subsequently transferred to targeted substrates, including Si wafers, a curved glass vial, and a beaker. This reported inkjet-assisted process therefore offers a new effective route to manipulate AgNWs for advanced device applications.
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Affiliation(s)
- Tao Wan
- School of Materials Science and Engineering, The University of New South Wales (UNSW), Sydney, New South Wales 2052, Australia
| | - Peiyuan Guan
- School of Materials Science and Engineering, The University of New South Wales (UNSW), Sydney, New South Wales 2052, Australia
| | - Xinwei Guan
- School of Materials Science and Engineering, The University of New South Wales (UNSW), Sydney, New South Wales 2052, Australia
| | - Long Hu
- School of Materials Science and Engineering, The University of New South Wales (UNSW), Sydney, New South Wales 2052, Australia
| | - Tom Wu
- School of Materials Science and Engineering, The University of New South Wales (UNSW), Sydney, New South Wales 2052, Australia
| | - Claudio Cazorla
- School of Materials Science and Engineering, The University of New South Wales (UNSW), Sydney, New South Wales 2052, Australia
| | - Dewei Chu
- School of Materials Science and Engineering, The University of New South Wales (UNSW), Sydney, New South Wales 2052, Australia
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63
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Jo J, Kang S, Heo JS, Kim Y, Park SK. Flexible Metal Oxide Semiconductor Devices Made by Solution Methods. Chemistry 2020; 26:9126-9156. [DOI: 10.1002/chem.202000090] [Citation(s) in RCA: 15] [Impact Index Per Article: 3.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/08/2020] [Indexed: 01/22/2023]
Affiliation(s)
- Jeong‐Wan Jo
- School of Electrical and Electronics EngineeringChung-Ang University Seoul 06980 Republic of Korea
- School of Advanced Materials Science and EngineeringSungkyunkwan University Suwon 16419 Republic of Korea
| | - Seung‐Han Kang
- School of Electrical and Electronics EngineeringChung-Ang University Seoul 06980 Republic of Korea
| | - Jae Sang Heo
- Department of MedicineUniversity of Connecticut School of Medicine Farmington CT 06030 USA
| | - Yong‐Hoon Kim
- School of Advanced Materials Science and EngineeringSungkyunkwan University Suwon 16419 Republic of Korea
- SKKU Advanced Institute of Nanotechnology (SAINT)Sungkyunkwan University Suwon 16419 Republic of Korea
| | - Sung Kyu Park
- School of Electrical and Electronics EngineeringChung-Ang University Seoul 06980 Republic of Korea
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64
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Wang C, Fu B, Zhang X, Li R, Dong H, Hu W. Solution-Processed, Large-Area, Two-Dimensional Crystals of Organic Semiconductors for Field-Effect Transistors and Phototransistors. ACS CENTRAL SCIENCE 2020; 6:636-652. [PMID: 32490182 PMCID: PMC7256937 DOI: 10.1021/acscentsci.0c00251] [Citation(s) in RCA: 20] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 03/01/2020] [Indexed: 06/11/2023]
Abstract
Organic electronics with π-conjugated organic semiconductors are promising candidates for the next electronics revolution. For the conductive channel, the large-area two-dimensional (2D) crystals of organic semiconductors (2DCOS) serve as useful scaffolds for modern organic electronics, benefiting not only from long-range order and low defect density nature but also from unique charge transport characteristic and photoelectrical properties. Meanwhile, the solution process with advantages of cost-effectiveness and room temperature compatibility is the foundation of high-throughput print electrical devices. Herein, we will give an insightful overview to witness the huge advances in 2DCOS over the past decade. First, the typical influencing factors and state-of-the-art assembly strategies of the solution-process for large-area 2DCOS over sub-millimeter even to wafer size are discussed accompanying rational evaluation. Then, the charge transport characteristics and contact resistance of 2DCOS-based transistors are explored. Following this, beyond single transistors, the p-n junction devices and planar integrated circuits based on 2DCOS are also emphasized. Furthermore, the burgeoning phototransistors (OPTs) based on crystals in the 2D limits are elaborated. Next, we emphasized the unique and enhanced photoelectrical properties based on a hybrid system with other 2D van der Waals solids. Finally, frontier insights and opportunities are proposed, promoting further research in this field.
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Affiliation(s)
- Cong Wang
- Tianjin
Key Laboratory of Molecular Optoelectronic Sciences, Department of
Chemistry, School of Science, Tianjin University
and Collaborative Innovation Center of Chemical Science and Engineering
(Tianjin), Tianjin 300072, China
| | - Beibei Fu
- Tianjin
Key Laboratory of Molecular Optoelectronic Sciences, Department of
Chemistry, School of Science, Tianjin University
and Collaborative Innovation Center of Chemical Science and Engineering
(Tianjin), Tianjin 300072, China
| | - Xiaotao Zhang
- Tianjin
Key Laboratory of Molecular Optoelectronic Sciences, Department of
Chemistry, School of Science, Tianjin University
and Collaborative Innovation Center of Chemical Science and Engineering
(Tianjin), Tianjin 300072, China
| | - Rongjin Li
- Tianjin
Key Laboratory of Molecular Optoelectronic Sciences, Department of
Chemistry, School of Science, Tianjin University
and Collaborative Innovation Center of Chemical Science and Engineering
(Tianjin), Tianjin 300072, China
| | - Huanli Dong
- Beijing
National Laboratory for Molecular Sciences, Key Laboratory of Organic
Solids, Institute of Chemistry, Chinese
Academy of Sciences, Beijing 100190, China
| | - Wenping Hu
- Tianjin
Key Laboratory of Molecular Optoelectronic Sciences, Department of
Chemistry, School of Science, Tianjin University
and Collaborative Innovation Center of Chemical Science and Engineering
(Tianjin), Tianjin 300072, China
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65
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Hahm D, Park J, Jeong I, Rhee S, Lee T, Lee C, Chung S, Bae WK, Lee S. Surface Engineered Colloidal Quantum Dots for Complete Green Process. ACS APPLIED MATERIALS & INTERFACES 2020; 12:10563-10570. [PMID: 32048828 DOI: 10.1021/acsami.9b23265] [Citation(s) in RCA: 13] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/10/2023]
Abstract
The rising demand for eradicating hazardous substances in the workplace has motivated vigorous researches on environmentally sustainable manufacturing processes of colloidal quantum dots (QDs) for their optoelectronic applications. Despite remarkable achievements witnessed in QD materials (e.g., Pb- or Cd-free QDs), the progress in the eco-friendly process is far falling behind and thus the practical use of QDs. Herein, a complete "green" process of QDs, which excludes environmentally unfriendly elements from QDs, ligands, or solvents, is presented. The implant of mono-2-(methacryloyloxy)ethyl succinate (MMES) ligands renders InP/ZnSexS1-x QDs dispersed in eco-friendly polar solvents that are widely accepted in the industry while keeping the photophysical properties of QDs unchanged. The MMES-capped QDs show exceptional colloidal stabilities in a range of green polar solvents that permit uniform inkjet printing of QD dispersion. In addition, MMES-capped QDs are also compatible with commercially available photo-patternable resins, and the cross-linkable moiety within MMES further facilitates the achievement in the formation of well-defined, micrometer-scale patterning of QD optical films. The presented materials, all composed of simple, scalable, and environmentally safe compounds, promise low environmental impact during the processing of QDs and thus will catalyze the practicable use of QDs in a variety of optoelectronic devices.
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Affiliation(s)
- Donghyo Hahm
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
| | - Jisoo Park
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
| | - Inho Jeong
- Photo-Electronic Hybrids Research Center, Korea Institute of Science and Technology, Hwarang-ro 14-gil 5, Seongbuk-gu, Seoul 02792, South Korea
| | - Seunghyun Rhee
- School of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul 08826, Republic of Korea
| | - Taesoo Lee
- School of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul 08826, Republic of Korea
| | - Changhee Lee
- School of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul 08826, Republic of Korea
| | - Seunjun Chung
- Photo-Electronic Hybrids Research Center, Korea Institute of Science and Technology, Hwarang-ro 14-gil 5, Seongbuk-gu, Seoul 02792, South Korea
| | - Wan Ki Bae
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon-si, Gyeonggi-do 16419, Republic of Korea
| | - Seonwoo Lee
- School of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University, Seoul 08826, Republic of Korea
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66
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Soni M, Dahiya R. Soft eSkin: distributed touch sensing with harmonized energy and computing. PHILOSOPHICAL TRANSACTIONS. SERIES A, MATHEMATICAL, PHYSICAL, AND ENGINEERING SCIENCES 2020; 378:20190156. [PMID: 31865882 PMCID: PMC6939237 DOI: 10.1098/rsta.2019.0156] [Citation(s) in RCA: 15] [Impact Index Per Article: 3.8] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/03/2023]
Abstract
Inspired by biology, significant advances have been made in the field of electronic skin (eSkin) or tactile skin. Many of these advances have come through mimicking the morphology of human skin and by distributing few touch sensors in an area. However, the complexity of human skin goes beyond mimicking few morphological features or using few sensors. For example, embedded computing (e.g. processing of tactile data at the point of contact) is centric to the human skin as some neuroscience studies show. Likewise, distributed cell or molecular energy is a key feature of human skin. The eSkin with such features, along with distributed and embedded sensors/electronics on soft substrates, is an interesting topic to explore. These features also make eSkin significantly different from conventional computing. For example, unlike conventional centralized computing enabled by miniaturized chips, the eSkin could be seen as a flexible and wearable large area computer with distributed sensors and harmonized energy. This paper discusses these advanced features in eSkin, particularly the distributed sensing harmoniously integrated with energy harvesters, storage devices and distributed computing to read and locally process the tactile sensory data. Rapid advances in neuromorphic hardware, flexible energy generation, energy-conscious electronics, flexible and printed electronics are also discussed. This article is part of the theme issue 'Harmonizing energy-autonomous computing and intelligence'.
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67
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Yuvaraja S, Nawaz A, Liu Q, Dubal D, Surya SG, Salama KN, Sonar P. Organic field-effect transistor-based flexible sensors. Chem Soc Rev 2020; 49:3423-3460. [DOI: 10.1039/c9cs00811j] [Citation(s) in RCA: 126] [Impact Index Per Article: 31.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/18/2022]
Abstract
Flexible transistors are the next generation sensing technology, due to multiparametric analysis, reduced complexity, biocompatibility, lightweight with tunable optoelectronic properties. We summarize multitude of applications realized with OFETs.
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Affiliation(s)
- Saravanan Yuvaraja
- Sensors Lab
- Advanced Membranes and Porous Materials Center
- Computer, Electrical and Mathematical Science and Engineering Division
- King Abdullah University of Science and Technology
- Saudi Arabia
| | - Ali Nawaz
- Departamento de Física
- Universidade Federal do Paraná
- Caixa Postal 19044
- Curitiba
- Brazil
| | - Qian Liu
- School of Chemistry and Physics
- Queensland University of Technology (QUT)
- Brisbane
- Australia
| | - Deepak Dubal
- School of Chemistry and Physics
- Queensland University of Technology (QUT)
- Brisbane
- Australia
- Centre for Materials Science
| | - Sandeep G. Surya
- Sensors Lab
- Advanced Membranes and Porous Materials Center
- Computer, Electrical and Mathematical Science and Engineering Division
- King Abdullah University of Science and Technology
- Saudi Arabia
| | - Khaled N. Salama
- Sensors Lab
- Advanced Membranes and Porous Materials Center
- Computer, Electrical and Mathematical Science and Engineering Division
- King Abdullah University of Science and Technology
- Saudi Arabia
| | - Prashant Sonar
- School of Chemistry and Physics
- Queensland University of Technology (QUT)
- Brisbane
- Australia
- Centre for Materials Science
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68
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Teo MY, RaviChandran N, Kim N, Kee S, Stuart L, Aw KC, Stringer J. Direct Patterning of Highly Conductive PEDOT:PSS/Ionic Liquid Hydrogel via Microreactive Inkjet Printing. ACS APPLIED MATERIALS & INTERFACES 2019; 11:37069-37076. [PMID: 31533420 DOI: 10.1021/acsami.9b12069] [Citation(s) in RCA: 29] [Impact Index Per Article: 5.8] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/07/2023]
Abstract
The gelation of poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) has gained popularity for its potential applications in three dimensions, while possessing tissue-like mechanical properties, high conductivity, and biocompatibility. However, the fabrication of arbitrary structures, especially via inkjet printing, is challenging because of the inherent gel formation. Here, microreactive inkjet printing (MRIJP) is utilized to pattern various 2D and 3D structures of PEDOT:PSS/IL hydrogel by in-air coalescence of PEDOT:PSS and ionic liquid (IL). By controlling the in-air position and Marangoni-driven encapsulation, single droplets of the PEDOT:PSS/IL hydrogel as small as a diameter of ≈260 μm are fabricated within ≈600 μs. Notably, this MRIJP-based PEDOT:PSS/IL has potential for freeform patterning while maintaining identical performance to those fabricated by the conventional spin-coating method. Through controlled deposition achieved via MRIJP, PEDOT:PSS/IL can be transformed into different 3D structures without the need for molding, potentially leading to substantial progress in next-generation bioelectronics devices.
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Affiliation(s)
- Mei Ying Teo
- Department of Mechanical Engineering , The University of Auckland , Symonds Street , Auckland 1010 , New Zealand
| | - Narrendar RaviChandran
- Department of Mechanical Engineering , The University of Auckland , Symonds Street , Auckland 1010 , New Zealand
| | - Nara Kim
- Department of Science and Technology , Linköping University , Norrköping 601 74 , Sweden
| | - Seyoung Kee
- Physical Sciences and Engineering Division, KAUST Solar Center (KSC) , King Abdullah University of Science and Technology (KAUST) , Thuwal 23955-6900 , Saudi Arabia
| | - Logan Stuart
- Department of Mechanical Engineering , The University of Auckland , Symonds Street , Auckland 1010 , New Zealand
| | - Kean C Aw
- Department of Mechanical Engineering , The University of Auckland , Symonds Street , Auckland 1010 , New Zealand
| | - Jonathan Stringer
- Department of Mechanical Engineering , The University of Auckland , Symonds Street , Auckland 1010 , New Zealand
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69
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Choi S, Kim KT, Park SK, Kim YH. High-Mobility Inkjet-Printed Indium-Gallium-Zinc-Oxide Thin-Film Transistors Using Sr-Doped Al₂O₃ Gate Dielectric. MATERIALS 2019; 12:ma12060852. [PMID: 30871272 PMCID: PMC6472027 DOI: 10.3390/ma12060852] [Citation(s) in RCA: 8] [Impact Index Per Article: 1.6] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 02/08/2019] [Revised: 03/06/2019] [Accepted: 03/12/2019] [Indexed: 11/19/2022]
Abstract
In this paper, we demonstrate high-mobility inkjet-printed indium-gallium-zinc-oxide (IGZO) thin-film transistors (TFTs) using a solution-processed Sr-doped Al2O3 (SAO) gate dielectric. Particularly, to enhance to the electrical properties of inkjet-printed IGZO TFTs, a linear-type printing pattern was adopted for printing the IGZO channel layer. Compared to dot array printing patterns (4 × 4 and 5 × 5 dot arrays), the linear-type pattern resulted in the formation of a relatively thin and uniform IGZO channel layer. Also, to improve the subthreshold characteristics and low-voltage operation of the device, a high-k and thin (~10 nm) SAO film was used as the gate dielectric layer. Compared to the devices with SiO2 gate dielectric, the inkjet-printed IGZO TFTs with SAO gate dielectric exhibited substantially high field-effect mobility (30.7 cm2/Vs). Moreover, the subthreshold slope and total trap density of states were also significantly reduced to 0.14 V/decade and 8.4 × 1011/cm2·eV, respectively.
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Affiliation(s)
- Seungbeom Choi
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon 16419, Korea.
| | - Kyung-Tae Kim
- School of Electrical and Electronic Engineering, Chung-Ang University, Seoul 06974, Korea.
| | - Sung Kyu Park
- School of Electrical and Electronic Engineering, Chung-Ang University, Seoul 06974, Korea.
| | - Yong-Hoon Kim
- SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon 16419, Korea.
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Korea.
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70
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Senthil Kumar K, Chen PY, Ren H. A Review of Printable Flexible and Stretchable Tactile Sensors. RESEARCH (WASHINGTON, D.C.) 2019; 2019:3018568. [PMID: 31912031 PMCID: PMC6944518 DOI: 10.34133/2019/3018568] [Citation(s) in RCA: 49] [Impact Index Per Article: 9.8] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 06/01/2019] [Accepted: 09/11/2019] [Indexed: 12/22/2022]
Abstract
Flexible and stretchable tactile sensors that are printable, nonplanar, and dynamically morphing are emerging to enable proprioceptive interactions with the unstructured surrounding environment. Owing to its varied range of applications in the field of wearable electronics, soft robotics, human-machine interaction, and biomedical devices, it is required of these sensors to be flexible and stretchable conforming to the arbitrary surfaces of their stiff counterparts. The challenges in maintaining the fundamental features of these sensors, such as flexibility, sensitivity, repeatability, linearity, and durability, are tackled by the progress in the fabrication techniques and customization of the material properties. This review is aimed at summarizing the recent progress of rapid prototyping of sensors, printable material preparation, required printing properties, flexible and stretchable mechanisms, and promising applications and highlights challenges and opportunities in this research paradigm.
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Affiliation(s)
- Kirthika Senthil Kumar
- Department of Biomedical Engineering, Medical Mechatronics Laboratory, National University of Singapore, Singapore 117583
| | - Po-Yen Chen
- Department of Chemical and Biomolecular Engineering, National University of Singapore, Singapore 117585
| | - Hongliang Ren
- Department of Biomedical Engineering, Medical Mechatronics Laboratory, National University of Singapore, Singapore 117583
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