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Zhan H, Wen B, Tian B, Zheng K, Li Q, Wu W. Printed Self-Healing Stretchable Electronics for Bio-signal Monitoring and Intelligent Packaging. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2024:e2400740. [PMID: 38693082 DOI: 10.1002/smll.202400740] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/29/2024] [Revised: 03/27/2024] [Indexed: 05/03/2024]
Abstract
Integrating self-healing capabilities into printed stretchable electronic devices is important for improving performance and extending device life. However, achieving printed self-healing stretchable electronic devices with excellent device-level healing ability and stretchability while maintaining outstanding electrical performance remains challenging. Herein, a series of printed device-level self-healing stretchable electronic devices is achieved by depositing liquid metal/silver fractal dendrites/polystyrene-block-polyisoprene-block-polystyrene (LM/Ag FDs/SIS) conductive inks onto a self-healing thermoplastic polyurethane (TPU) film via screen printing method. Owing to the fluidic properties of the LM and the interfacial hydrogen bonding and disulfide bonds of TPU, the as-obtained stretchable electronic devices maintain good electronic properties under strain and exhibit device-level self-healing properties without external stimulation. Printed self-healing stretchable electrodes possess high electrical conductivity (1.6 × 105 S m-1), excellent electromechanical properties, and dynamic stability, with only a 2.5-fold increase in resistance at 200% strain, even after a complete cut and re-healing treatment. The printed self-healing capacitive stretchable strain sensor shows good linearity (R2 ≈0.9994) in a wide sensing range (0%-200%) and is successfully applied to bio-signal detection. Furthermore, the printed self-healing electronic smart label is designed and can be used for real-time environmental monitoring, which exhibits promising potential for practical application in food preservation packaging.
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Affiliation(s)
- Haoye Zhan
- Laboratory of Printable Functional Materials and Printed Electronics, School of Physics and Technology, Wuhan University, Wuhan, 430072, P. R. China
| | - Bo Wen
- Laboratory of Printable Functional Materials and Printed Electronics, School of Physics and Technology, Wuhan University, Wuhan, 430072, P. R. China
| | - Bin Tian
- Laboratory of Printable Functional Materials and Printed Electronics, School of Physics and Technology, Wuhan University, Wuhan, 430072, P. R. China
| | - Ke Zheng
- Laboratory of Printable Functional Materials and Printed Electronics, School of Physics and Technology, Wuhan University, Wuhan, 430072, P. R. China
| | - Quancai Li
- Laboratory of Printable Functional Materials and Printed Electronics, School of Physics and Technology, Wuhan University, Wuhan, 430072, P. R. China
| | - Wei Wu
- Laboratory of Printable Functional Materials and Printed Electronics, School of Physics and Technology, Wuhan University, Wuhan, 430072, P. R. China
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Wang Y, Wang Y, Mushtaq RT, Wei Q. Advancements in Soft Robotics: A Comprehensive Review on Actuation Methods, Materials, and Applications. Polymers (Basel) 2024; 16:1087. [PMID: 38675005 PMCID: PMC11054840 DOI: 10.3390/polym16081087] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/19/2024] [Revised: 04/10/2024] [Accepted: 04/11/2024] [Indexed: 04/28/2024] Open
Abstract
The flexibility and adaptability of soft robots enable them to perform various tasks in changing environments, such as flower picking, fruit harvesting, in vivo targeted treatment, and information feedback. However, these fulfilled functions are discrepant, based on the varied working environments, driving methods, and materials. To further understand the working principle and research emphasis of soft robots, this paper summarized the current research status of soft robots from the aspects of actuating methods (e.g., humidity, temperature, PH, electricity, pressure, magnetic field, light, biological, and hybrid drive), materials (like hydrogels, shape-memory materials, and other flexible materials) and application areas (camouflage, medical devices, electrical equipment, and grippers, etc.). Finally, we provided some opinions on the technical difficulties and challenges of soft robots to comprehensively comprehend soft robots, lucubrate their applications, and improve the quality of our lives.
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Affiliation(s)
- Yanmei Wang
- Industry Engineering Department, School of Mechanical Engineering, Northwestern Polytechnical University, Xi’an 710072, China; (R.T.M.); (Q.W.)
| | - Yanen Wang
- Industry Engineering Department, School of Mechanical Engineering, Northwestern Polytechnical University, Xi’an 710072, China; (R.T.M.); (Q.W.)
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3
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Liang Y, Zhao N, Gao W, Bai H. Mechanically and Thermally Guided, Honeycomb-like Nanocomposites with Strain-Insensitive High Thermal Conductivity for Stretchable Electronics. ACS NANO 2024; 18:8199-8208. [PMID: 38457331 DOI: 10.1021/acsnano.3c12233] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 03/10/2024]
Abstract
Thermal management materials have become increasingly crucial for stretchable electronic devices and systems. Drastically different from conventional thermally conductive materials, which are applied at static conditions, thermal management materials for stretchable electronics additionally require strain-insensitive thermal conductivity, as they generally undergo cyclic deformation. However, realizing such a property remains challenging mainly because conventional thermally conductive polymer composites generally lack a mechanically guided design. Here, we report a honeycomb-like nanocomposite with a three-dimensional (3D) thermally conductive network fabricated by an arrayed ice-templating technique followed by elastomer infiltration. The hexagonal honeycomb-like structure with thin, compact walls (≈ 40 μm) endows our composite with a high through-plane thermal conductivity (≈ 1.54 W m-1 K-1) at an ultralow boron nitride nanosheet (BNNS) loading (≈ 0.85 vol %), with an enhancement factor of thermal conductivity up to 820% and thermal-insensitive strain up to 200%, which are 2.7 and 2 times higher than those reported in the literature. We report an intelligent strategy for the development of advanced thermal management materials for high-performance stretchable electronics.
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Affiliation(s)
- Yahui Liang
- State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou 310027, China
| | - Nifang Zhao
- State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou 310027, China
- Institute of Zhejiang University-Quzhou, Quzhou 324000, China
- Shanxi-Zheda Institute of Advanced Materials and Chemical Engineering, Taiyuan 030000, China
| | - Weiwei Gao
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Zhejiang University, Hangzhou 310027, China
| | - Hao Bai
- State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou 310027, China
- Institute of Zhejiang University-Quzhou, Quzhou 324000, China
- Shanxi-Zheda Institute of Advanced Materials and Chemical Engineering, Taiyuan 030000, China
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Wang Z, Chen Z, Ma L, Wang Q, Wang H, Leal-Junior A, Li X, Marques C, Min R. Optical Microfiber Intelligent Sensor: Wearable Cardiorespiratory and Behavior Monitoring with a Flexible Wave-Shaped Polymer Optical Microfiber. ACS APPLIED MATERIALS & INTERFACES 2024; 16:8333-8345. [PMID: 38321958 DOI: 10.1021/acsami.3c16165] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 02/08/2024]
Abstract
With the advantages of high flexibility, strong real-time monitoring capabilities, and convenience, wearable devices have shown increasingly powerful application potential in medical rehabilitation, health monitoring, the Internet of Things, and human-computer interaction. In this paper, we propose a novel and wearable optical microfiber intelligent sensor based on a wavy-shaped polymer optical microfiber (WPOMF) for cardiorespiratory and behavioral monitoring of humans. The optical fibers based on polymer materials are prepared into optical microfibers, fully using the advantages of the polymer material and optical microfibers. The prepared polymer optical microfiber is designed into a flexible wave-shaped structure, which enables the WPOMF sensor to have higher tensile properties and detection sensitivity. Cardiorespiratory and behavioral detection experiments based on the WPOMF sensor are successfully performed, which demonstrates the high sensitivity and stability potential of the WPOMF sensor when performing wearable tasks. Further, the success of the AI-assisted medical keyword pronunciation recognition experiment fully demonstrates the feasibility of integrating AI technology with the WPOMF sensor, which can effectively improve the intelligence of the sensor as a wearable device. As an optical microfiber intelligent sensor, the WPOMF sensor offers broad application prospects in disease monitoring, rehabilitation medicine, the Internet of Things, and other fields.
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Affiliation(s)
- Zhuo Wang
- State Key Laboratory of Cognitive Neuroscience and Learning, Center for Cognition and Neuroergonomics, Beijing Normal University, Zhuhai 519087, China
| | - Ziyang Chen
- State Key Laboratory of Cognitive Neuroscience and Learning, Center for Cognition and Neuroergonomics, Beijing Normal University, Zhuhai 519087, China
| | - Lin Ma
- College of Science, Shenyang Aerospace University, Shenyang 110136, China
| | - Qi Wang
- State Key Laboratory of Cognitive Neuroscience and Learning, Center for Cognition and Neuroergonomics, Beijing Normal University, Zhuhai 519087, China
| | - Heng Wang
- College of Science, Shenyang Aerospace University, Shenyang 110136, China
| | - Arnaldo Leal-Junior
- Graduate Program in Electrical Engineering, Federal University of Espírito Santo (UFES), Fernando Ferrari Avenue, Vitória 29075-910, Brazil
| | - Xiaoli Li
- State Key Laboratory of Cognitive Neuroscience and Learning, Center for Cognition and Neuroergonomics, Beijing Normal University, Zhuhai 519087, China
| | - Carlos Marques
- CICECO - Aveiro Institute of Materials and I3N, Physics Department, University of Aveiro, Aveiro 3810-193, Portugal
| | - Rui Min
- State Key Laboratory of Cognitive Neuroscience and Learning, Center for Cognition and Neuroergonomics, Beijing Normal University, Zhuhai 519087, China
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Chang S, Koo JH, Yoo J, Kim MS, Choi MK, Kim DH, Song YM. Flexible and Stretchable Light-Emitting Diodes and Photodetectors for Human-Centric Optoelectronics. Chem Rev 2024; 124:768-859. [PMID: 38241488 DOI: 10.1021/acs.chemrev.3c00548] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/21/2024]
Abstract
Optoelectronic devices with unconventional form factors, such as flexible and stretchable light-emitting or photoresponsive devices, are core elements for the next-generation human-centric optoelectronics. For instance, these deformable devices can be utilized as closely fitted wearable sensors to acquire precise biosignals that are subsequently uploaded to the cloud for immediate examination and diagnosis, and also can be used for vision systems for human-interactive robotics. Their inception was propelled by breakthroughs in novel optoelectronic material technologies and device blueprinting methodologies, endowing flexibility and mechanical resilience to conventional rigid optoelectronic devices. This paper reviews the advancements in such soft optoelectronic device technologies, honing in on various materials, manufacturing techniques, and device design strategies. We will first highlight the general approaches for flexible and stretchable device fabrication, including the appropriate material selection for the substrate, electrodes, and insulation layers. We will then focus on the materials for flexible and stretchable light-emitting diodes, their device integration strategies, and representative application examples. Next, we will move on to the materials for flexible and stretchable photodetectors, highlighting the state-of-the-art materials and device fabrication methods, followed by their representative application examples. At the end, a brief summary will be given, and the potential challenges for further development of functional devices will be discussed as a conclusion.
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Affiliation(s)
- Sehui Chang
- School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology (GIST), Gwangju 61005, Republic of Korea
| | - Ja Hoon Koo
- Department of Semiconductor Systems Engineering, Sejong University, Seoul 05006, Republic of Korea
- Institute of Semiconductor and System IC, Sejong University, Seoul 05006, Republic of Korea
| | - Jisu Yoo
- Department of Materials Science and Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, Republic of Korea
| | - Min Seok Kim
- School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology (GIST), Gwangju 61005, Republic of Korea
| | - Moon Kee Choi
- Department of Materials Science and Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, Republic of Korea
- Graduate School of Semiconductor Materials and Devices Engineering, Center for Future Semiconductor Technology (FUST), UNIST, Ulsan 44919, Republic of Korea
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea
| | - Dae-Hyeong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea
- School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University (SNU), Seoul 08826, Republic of Korea
- Department of Materials Science and Engineering, SNU, Seoul 08826, Republic of Korea
- Interdisciplinary Program for Bioengineering, SNU, Seoul 08826, Republic of Korea
| | - Young Min Song
- School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology (GIST), Gwangju 61005, Republic of Korea
- Department of Materials Science and Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, Republic of Korea
- Artificial Intelligence (AI) Graduate School, GIST, Gwangju 61005, Republic of Korea
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Jia J, Peng Y, Ke K, Liu ZY, Yang W. Achieving a Wide-Range Linear Piezoresistive Response in Electrowritten Soft-Hard Polymer Blends via Salami-Inspired Heterostructure Design. ACS APPLIED MATERIALS & INTERFACES 2024; 16:7939-7949. [PMID: 38300761 DOI: 10.1021/acsami.3c18967] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 02/03/2024]
Abstract
Flexible electronics capable of acquiring high-precision signals are in great demand for the development of the internet of things and intelligent artificial. However, it is currently a challenge to simultaneously achieve high signal linearity and sensitivity for stretchable resistive sensors over a wide strain range toward advanced application scenarios requiring high signal accuracy, e.g., sophisticated physiological signal discrimination and displacement measurement. Herein, a film strain sensor, which has an electrical and mechanical dual heterostructure, was fabricated via a direct near-field electrowriting and molecule-guided in situ growth of silver nanoparticles with different concentrations on high-modulus polystyrene domains and low-modulus styrene-butadiene copolymers with a salami-like morphology. Mechanism analyses from both theoretical and experimental investigations reveal that the salami-like heteromodulus microstructure regulates microcrack propagation routes, while the heteroconductivity changes the electron transport paths and amplifies the resistance increase during crack propagation. Therefore, the as-designed strain sensor shows a linear resistive response within ca. 70% strain with a gauge factor of 25, unveiling a simple and scalable strategy for trading off signal linearity and sensitivity over a wide strain range for the fabrication of high-performance linear strain sensors.
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Affiliation(s)
- Jin Jia
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan 610065, China
| | - Yan Peng
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan 610065, China
| | - Kai Ke
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan 610065, China
- Key Laboratory of Basalt Fiber and Composites of Sichuan Province, Dazhou, Sichuan 635756, China
| | - Zheng-Ying Liu
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan 610065, China
| | - Wei Yang
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan 610065, China
- Key Laboratory of Basalt Fiber and Composites of Sichuan Province, Dazhou, Sichuan 635756, China
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7
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Li X, Chen L, Yu G, Song L, Weng D, Ma Y, Wang J. Rapid Fabrication of High-Resolution Flexible Electronics via Nanoparticle Self-Assembly and Transfer Printing. NANO LETTERS 2024; 24:1332-1340. [PMID: 38232321 DOI: 10.1021/acs.nanolett.3c04316] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 01/19/2024]
Abstract
Printed electronic technology serves as a key component in flexible electronics and wearable devices, yet achieving compatibility with both high resolution and high efficiency remains a significant challenge. Here, we propose a rapid fabrication method of high-resolution nanoparticle microelectronics via self-assembly and transfer printing. The tension gradient-electrostatic attraction composite-induced nanoparticle self-assembly strategy is constructed, which can significantly enhance the self-assembly efficiency, stability, and coverage by leveraging the meniscus Marangoni effect and the electric double-layer effect. The close-packed nanoparticle self-assembly layer can be rapidly formed on microstructure surfaces over a large area. Inspired by ink printing, a transfer printing strategy is further proposed to transform the self-assembly layer into conformal micropatterns. Large-area, high-resolution (2 μm), and ultrathin (1 μm) nanoparticle microelectronics can be stably fabricated, yielding a significant improvement over fluid printing methods. The unique deformability, recoverability, and scalability of nanoparticle microelectronics are revealed, providing promising opportunities for various academic and real applications.
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Affiliation(s)
- Xuan Li
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Lei Chen
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Guoxu Yu
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Lele Song
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Ding Weng
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Yuan Ma
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Jiadao Wang
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084, P. R. China
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8
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Yu S, Zhang J, Zhou H, Sun Y, Ni Y. Coexistence and Coevolution of Wrinkle and Ridge Patterns in the Film-Substrate System by Uniaxial Compression. LANGMUIR : THE ACS JOURNAL OF SURFACES AND COLLOIDS 2024; 40:403-412. [PMID: 38153298 DOI: 10.1021/acs.langmuir.3c02655] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 12/29/2023]
Abstract
Homogeneous wrinkles and localized patterns are ubiquitous in nature and are useful for a wide range of practical applications. Although various strain-driven surface instability modes have been extensively investigated in the past decades, understanding the coexistence, coevolution, and interaction of wrinkles and localized patterns is still a great challenge. Here, we report on the formation and evolution of coexisting wrinkle and ridge patterns in metal films deposited on poly(dimethylsiloxane) (PDMS) substrates by uniaxial compression. It is found that the evolving surface patterns show unique features of morphological transition from stages I to III: namely, transition from localized ridges to coexisting wrinkles and ridges, and finally to sinusoidal-like structures, as the compression increases. Based on the compressive strain-driven surface instability theory and finite element numerical simulation, the morphological features, transition behaviors, and underlying mechanisms of such complex patterns are investigated in detail, and the changes of amplitude and wavelength versus the strain are consistent with our experiments. This work could promote a better understanding of the effect of strain localization and the interaction of multiple surface patterns in hard film-soft substrate systems.
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Affiliation(s)
- Senjiang Yu
- Key Laboratory of Novel Materials for Sensor of Zhejiang Province, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou 310018, P.R. China
| | - Jiahui Zhang
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China, Hefei 230026, P.R. China
| | - Hong Zhou
- Department of Physics, China Jiliang University, Hangzhou 310018, P.R. China
| | - Yadong Sun
- Department of Physics, China Jiliang University, Hangzhou 310018, P.R. China
| | - Yong Ni
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China, Hefei 230026, P.R. China
- State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Science, Beijing 100190, P.R. China
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Yu A, Zhu M, Chen C, Li Y, Cui H, Liu S, Zhao Q. Implantable Flexible Sensors for Health Monitoring. Adv Healthc Mater 2024; 13:e2302460. [PMID: 37816513 DOI: 10.1002/adhm.202302460] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/31/2023] [Revised: 10/05/2023] [Indexed: 10/12/2023]
Abstract
Flexible sensors, as a significant component of flexible electronics, have attracted great interest the realms of human-computer interaction and health monitoring due to their high conformability, adjustable sensitivity, and excellent durability. In comparison to wearable sensor-based in vitro health monitoring, the use of implantable flexible sensors (IFSs) for in vivo health monitoring offers more accurate and reliable vital sign information due to their ability to adapt and directly integrate with human tissue. IFSs show tremendous promise in the field of health monitoring, with unique advantages such as robust signal reading capabilities, lightweight design, flexibility, and biocompatibility. Herein, a review of IFSs for vital signs monitoring is detailly provided, highlighting the essential conditions for in vivo applications. As the prerequisites of IFSs, the stretchability and wireless self-powered properties of the sensor are discussed, with a special attention paid to the sensing materials which can maintain prominent biosafety (i.e., biocompatibility, biodegradability, bioresorbability). Furthermore, the applications of IFSs monitoring various parts of the body are described in detail, with a summary in brain monitoring, eye monitoring, and blood monitoring. Finally, the challenges as well as opportunities in the development of next-generation IFSs are presented.
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Affiliation(s)
- Aoxi Yu
- College of Electronic and Optical Engineering, and College of Flexible Electronics (Future Technology), Nanjing University of Posts and Telecommunications, 9 Wenyuan, Nanjing, 210023, P. R. China
| | - Mingye Zhu
- State Key Laboratory of Organic Electronics and Information Displays, and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing, 210023, P. R. China
| | - Congkai Chen
- State Key Laboratory of Organic Electronics and Information Displays, and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing, 210023, P. R. China
| | - Yang Li
- College of Electronic and Optical Engineering, and College of Flexible Electronics (Future Technology), Nanjing University of Posts and Telecommunications, 9 Wenyuan, Nanjing, 210023, P. R. China
| | - Haixia Cui
- State Key Laboratory of Organic Electronics and Information Displays, and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing, 210023, P. R. China
| | - Shujuan Liu
- State Key Laboratory of Organic Electronics and Information Displays, and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing, 210023, P. R. China
| | - Qiang Zhao
- College of Electronic and Optical Engineering, and College of Flexible Electronics (Future Technology), Nanjing University of Posts and Telecommunications, 9 Wenyuan, Nanjing, 210023, P. R. China
- State Key Laboratory of Organic Electronics and Information Displays, and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing, 210023, P. R. China
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Park H, Kim DC. Structural and Material-Based Approaches for the Fabrication of Stretchable Light-Emitting Diodes. MICROMACHINES 2023; 15:66. [PMID: 38258185 PMCID: PMC10821428 DOI: 10.3390/mi15010066] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/03/2023] [Revised: 12/22/2023] [Accepted: 12/27/2023] [Indexed: 01/24/2024]
Abstract
Stretchable displays, capable of freely transforming their shapes, have received significant attention as alternatives to conventional rigid displays, and they are anticipated to provide new opportunities in various human-friendly electronics applications. As a core component of stretchable displays, high-performance stretchable light-emitting diodes (LEDs) have recently emerged. The approaches to fabricate stretchable LEDs are broadly categorized into two groups, namely "structural" and "material-based" approaches, based on the mechanisms to tolerate strain. While structural approaches rely on specially designed geometries to dissipate applied strain, material-based approaches mainly focus on replacing conventional rigid components of LEDs to soft and stretchable materials. Here, we review the latest studies on the fabrication of stretchable LEDs, which is accomplished through these distinctive strategies. First, we introduce representative device designs for efficient strain distribution, encompassing island-bridge structures, wavy buckling, and kirigami-/origami-based structures. For the material-based approaches, we discuss the latest studies for intrinsically stretchable (is-) electronic/optoelectronic materials, including the formation of conductive nanocomposite and polymeric blending with various additives. The review also provides examples of is-LEDs, focusing on their luminous performance and stretchability. We conclude this review with a brief outlook on future technologies.
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Affiliation(s)
- Hamin Park
- Department of Electronic Engineering, Kwangwoon University, 20, Gwangun-ro, Nowon-gu, Seoul 01897, Republic of Korea
| | - Dong Chan Kim
- Department of Chemical and Biological Engineering, Gachon University, 1342 Seongnam-daero, Sujeong-gu, Seongnam-si 13120, Republic of Korea
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11
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Wu SJ, Zhao X. Bioadhesive Technology Platforms. Chem Rev 2023; 123:14084-14118. [PMID: 37972301 DOI: 10.1021/acs.chemrev.3c00380] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/19/2023]
Abstract
Bioadhesives have emerged as transformative and versatile tools in healthcare, offering the ability to attach tissues with ease and minimal damage. These materials present numerous opportunities for tissue repair and biomedical device integration, creating a broad landscape of applications that have captivated clinical and scientific interest alike. However, fully unlocking their potential requires multifaceted design strategies involving optimal adhesion, suitable biological interactions, and efficient signal communication. In this Review, we delve into these pivotal aspects of bioadhesive design, highlight the latest advances in their biomedical applications, and identify potential opportunities that lie ahead for bioadhesives as multifunctional technology platforms.
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Affiliation(s)
- Sarah J Wu
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
| | - Xuanhe Zhao
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
- Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
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12
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Abstract
Efforts to design devices emulating complex cognitive abilities and response processes of biological systems have long been a coveted goal. Recent advancements in flexible electronics, mirroring human tissue's mechanical properties, hold significant promise. Artificial neuron devices, hinging on flexible artificial synapses, bioinspired sensors, and actuators, are meticulously engineered to mimic the biological systems. However, this field is in its infancy, requiring substantial groundwork to achieve autonomous systems with intelligent feedback, adaptability, and tangible problem-solving capabilities. This review provides a comprehensive overview of recent advancements in artificial neuron devices. It starts with fundamental principles of artificial synaptic devices and explores artificial sensory systems, integrating artificial synapses and bioinspired sensors to replicate all five human senses. A systematic presentation of artificial nervous systems follows, designed to emulate fundamental human nervous system functions. The review also discusses potential applications and outlines existing challenges, offering insights into future prospects. We aim for this review to illuminate the burgeoning field of artificial neuron devices, inspiring further innovation in this captivating area of research.
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Affiliation(s)
- Ke He
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
| | - Cong Wang
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
| | - Yongli He
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
| | - Jiangtao Su
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
| | - Xiaodong Chen
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
- Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore
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13
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Gu J, Shen Y, Tian S, Xue Z, Meng X. Recent Advances in Nanowire-Based Wearable Physical Sensors. BIOSENSORS 2023; 13:1025. [PMID: 38131785 PMCID: PMC10742341 DOI: 10.3390/bios13121025] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/01/2023] [Revised: 12/06/2023] [Accepted: 12/08/2023] [Indexed: 12/23/2023]
Abstract
Wearable electronics is a technology that closely integrates electronic devices with the human body or clothing, which can realize human-computer interaction, health monitoring, smart medical, and other functions. Wearable physical sensors are an important part of wearable electronics. They can sense various physical signals from the human body or the surrounding environment and convert them into electrical signals for processing and analysis. Nanowires (NW) have unique properties such as a high surface-to-volume ratio, high flexibility, high carrier mobility, a tunable bandgap, a large piezoresistive coefficient, and a strong light-matter interaction. They are one of the ideal candidates for the fabrication of wearable physical sensors with high sensitivity, fast response, and low power consumption. In this review, we summarize recent advances in various types of NW-based wearable physical sensors, specifically including mechanical, photoelectric, temperature, and multifunctional sensors. The discussion revolves around the structural design, sensing mechanisms, manufacture, and practical applications of these sensors, highlighting the positive role that NWs play in the sensing process. Finally, we present the conclusions with perspectives on current challenges and future opportunities in this field.
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Affiliation(s)
| | | | | | - Zhaoguo Xue
- National Key Laboratory of Strength and Structural Integrity, School of Aeronautic Science and Engineering, Beihang University, Beijing 100191, China
| | - Xianhong Meng
- National Key Laboratory of Strength and Structural Integrity, School of Aeronautic Science and Engineering, Beihang University, Beijing 100191, China
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14
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Jiao R, Wang R, Wang Y, Cheung YK, Chen X, Wang X, Deng Y, Yu H. Vertical serpentine interconnect-enabled stretchable and curved electronics. MICROSYSTEMS & NANOENGINEERING 2023; 9:149. [PMID: 38025886 PMCID: PMC10679150 DOI: 10.1038/s41378-023-00625-w] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 06/11/2023] [Revised: 09/30/2023] [Accepted: 10/25/2023] [Indexed: 12/01/2023]
Abstract
Stretchable and curved electronic devices are a promising technology trend due to their remarkable advantages. Many approaches have been developed to manufacture stretchable and curved electronics. Here, to allow such electronics to better serve practical applications, ranging from wearable devices to soft robotics, we propose a novel vertical serpentine conductor (VSC) with superior electrical stability to interconnect functional devices through a silicon-based microfabrication process. Conformal vacuum transfer printing (CVTP) technology was developed to transfer the networked platform onto complex curved surfaces to demonstrate feasibility. The mechanical and electrical performance were investigated numerically and experimentally. The VSC interconnected network provides a new approach for stretchable and curved electronics with high stretchability and reliability.
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Affiliation(s)
- Rui Jiao
- Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong SAR, 999077 China
| | - Ruoqin Wang
- Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong SAR, 999077 China
| | - Yixin Wang
- Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong SAR, 999077 China
| | - Yik Kin Cheung
- Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong SAR, 999077 China
| | - Xingru Chen
- Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong SAR, 999077 China
| | - Xiaoyi Wang
- Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong SAR, 999077 China
| | - Yang Deng
- Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong SAR, 999077 China
| | - Hongyu Yu
- Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong SAR, 999077 China
- HKUST Shenzhen-Hong Kong Collaborative Innovation Research Institute, Shenzhen, Guangdong 518045 China
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15
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Hu H, Zhang C, Ding Y, Chen F, Huang Q, Zheng Z. A Review of Structure Engineering of Strain-Tolerant Architectures for Stretchable Electronics. SMALL METHODS 2023; 7:e2300671. [PMID: 37661591 DOI: 10.1002/smtd.202300671] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/29/2023] [Revised: 08/01/2023] [Indexed: 09/05/2023]
Abstract
Stretchable electronics possess significant advantages over their conventional rigid counterparts and boost game-changing applications such as bioelectronics, flexible displays, wearable health monitors, etc. It is, nevertheless, a formidable task to impart stretchability to brittle electronic materials such as silicon. This review provides a concise but critical discussion of the prevailing structural engineering strategies for achieving strain-tolerant electronic devices. Not only the more commonly discussed lateral designs of structures such as island-bridge, wavy structures, fractals, and kirigami, but also the less discussed vertical architectures such as strain isolation and elastoplastic principle are reviewed. Future opportunities are envisaged at the end of the paper.
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Affiliation(s)
- Hong Hu
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Chi Zhang
- Department of Applied Biology and Chemical Technology, Faculty of Science, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Yichun Ding
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Fan Chen
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Qiyao Huang
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
- Research Institute for Intelligent Wearable Systems, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Zijian Zheng
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
- Department of Applied Biology and Chemical Technology, Faculty of Science, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
- Research Institute for Intelligent Wearable Systems, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
- Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
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16
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Wang Q, Wang W, Lu C, Hu L, Ni Y, Yu S. Retraction of "Three-Axial Strain-Triggered Multimode Wrinkles with Tuneable Frictional and Optical Performances". ACS APPLIED MATERIALS & INTERFACES 2023; 15:45538. [PMID: 37390007 DOI: 10.1021/acsami.3c06867] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 07/02/2023]
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17
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Bo R, Xu S, Yang Y, Zhang Y. Mechanically-Guided 3D Assembly for Architected Flexible Electronics. Chem Rev 2023; 123:11137-11189. [PMID: 37676059 PMCID: PMC10540141 DOI: 10.1021/acs.chemrev.3c00335] [Citation(s) in RCA: 7] [Impact Index Per Article: 7.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/22/2023] [Indexed: 09/08/2023]
Abstract
Architected flexible electronic devices with rationally designed 3D geometries have found essential applications in biology, medicine, therapeutics, sensing/imaging, energy, robotics, and daily healthcare. Mechanically-guided 3D assembly methods, exploiting mechanics principles of materials and structures to transform planar electronic devices fabricated using mature semiconductor techniques into 3D architected ones, are promising routes to such architected flexible electronic devices. Here, we comprehensively review mechanically-guided 3D assembly methods for architected flexible electronics. Mainstream methods of mechanically-guided 3D assembly are classified and discussed on the basis of their fundamental deformation modes (i.e., rolling, folding, curving, and buckling). Diverse 3D interconnects and device forms are then summarized, which correspond to the two key components of an architected flexible electronic device. Afterward, structure-induced functionalities are highlighted to provide guidelines for function-driven structural designs of flexible electronics, followed by a collective summary of their resulting applications. Finally, conclusions and outlooks are given, covering routes to achieve extreme deformations and dimensions, inverse design methods, and encapsulation strategies of architected 3D flexible electronics, as well as perspectives on future applications.
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Affiliation(s)
- Renheng Bo
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Shiwei Xu
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Youzhou Yang
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Yihui Zhang
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
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18
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Geng B, Zeng H, Luo H, Wu X. Construction of Wearable Touch Sensors by Mimicking the Properties of Materials and Structures in Nature. Biomimetics (Basel) 2023; 8:372. [PMID: 37622977 PMCID: PMC10452172 DOI: 10.3390/biomimetics8040372] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/25/2023] [Revised: 08/14/2023] [Accepted: 08/15/2023] [Indexed: 08/26/2023] Open
Abstract
Wearable touch sensors, which can convert force or pressure signals into quantitative electronic signals, have emerged as essential smart sensing devices and play an important role in various cutting-edge fields, including wearable health monitoring, soft robots, electronic skin, artificial prosthetics, AR/VR, and the Internet of Things. Flexible touch sensors have made significant advancements, while the construction of novel touch sensors by mimicking the unique properties of biological materials and biogenetic structures always remains a hot research topic and significant technological pathway. This review provides a comprehensive summary of the research status of wearable touch sensors constructed by imitating the material and structural characteristics in nature and summarizes the scientific challenges and development tendencies of this aspect. First, the research status for constructing flexible touch sensors based on biomimetic materials is summarized, including hydrogel materials, self-healing materials, and other bio-inspired or biomimetic materials with extraordinary properties. Then, the design and fabrication of flexible touch sensors based on bionic structures for performance enhancement are fully discussed. These bionic structures include special structures in plants, special structures in insects/animals, and special structures in the human body. Moreover, a summary of the current issues and future prospects for developing wearable sensors based on bio-inspired materials and structures is discussed.
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Affiliation(s)
| | | | - Hua Luo
- School of Mechanical Engineering, Sichuan University, Chengdu 610065, China
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19
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Yao G, Mo X, Liu S, Wang Q, Xie M, Lou W, Chen S, Pan T, Chen K, Yao D, Lin Y. Snowflake-inspired and blink-driven flexible piezoelectric contact lenses for effective corneal injury repair. Nat Commun 2023; 14:3604. [PMID: 37330515 PMCID: PMC10276863 DOI: 10.1038/s41467-023-39315-6] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/30/2022] [Accepted: 06/06/2023] [Indexed: 06/19/2023] Open
Abstract
The cornea is a tissue susceptible to various injuries and traumas with a complicated cascade repair process, in which conserving its integrity and clarity is critical to restoring visual function. Enhancing the endogenous electric field is recognized as an effective method of accelerating corneal injury repair. However, current equipment limitations and implementation complexities hinder its widespread adoption. Here, we propose a snowflake-inspired, blink-driven flexible piezoelectric contact lens that can convert mechanical blink motions into a unidirectional pulsed electric field for direct application to moderate corneal injury repair. The device is validated on mouse and rabbit models with different relative corneal alkali burn ratios to modulate the microenvironment, alleviate stromal fibrosis, promote orderly epithelial arrangement and differentiation, and restore corneal clarity. Within an 8-day intervention, the corneal clarity of mice and rabbits improves by more than 50%, and the repair rate of mouse and rabbit corneas increases by over 52%. Mechanistically, the device intervention is advantageous in blocking growth factors' signaling pathways specifically involved in stromal fibrosis whilst preserving and harnessing the signaling pathways required for indispensable epithelial metabolism. This work put forward an efficient and orderly corneal therapeutic technology utilizing artificial endogenous-strengthened signals generated by spontaneous body activities.
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Affiliation(s)
- Guang Yao
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China.
- State Key Laboratory of Electronic Thin films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China.
- Shenzhen Institute for Advanced Study, University of Electronic Science and Technology of China, Shenzhen, 518110, China.
| | - Xiaoyi Mo
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China
| | - Shanshan Liu
- MOE Key Laboratory for Neuroinformation, The Clinical Hospital of Chengdu Brain Sciences Institute, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China
| | - Qian Wang
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China
| | - Maowen Xie
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China
| | - Wenhao Lou
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China
| | - Shiyan Chen
- Department of Ophthalmology, Sichuan Academy of Medical Sciences and Sichuan Provincial People's Hospital, Medical School, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China
| | - Taisong Pan
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China
| | - Ke Chen
- MOE Key Laboratory for Neuroinformation, The Clinical Hospital of Chengdu Brain Sciences Institute, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China.
- Department of Ophthalmology, Sichuan Academy of Medical Sciences and Sichuan Provincial People's Hospital, Medical School, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China.
| | - Dezhong Yao
- MOE Key Laboratory for Neuroinformation, The Clinical Hospital of Chengdu Brain Sciences Institute, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China
| | - Yuan Lin
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China.
- State Key Laboratory of Electronic Thin films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China.
- Medico-Engineering Cooperation on Applied Medicine Research Center, University of Electronic Science and Technology of China, Chengdu, 610054, Sichuan, China.
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20
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Sun Y, Yao Q, Xing W, Jiang H, Li Y, Xiong W, Zhu W, Zheng Y. Residual Strain Evolution Induced by Crystallization Kinetics During Anti-Solvent Spin Coating in Organic-Inorganic Hybrid Perovskite. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2023:e2205986. [PMID: 37096861 DOI: 10.1002/advs.202205986] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/30/2022] [Revised: 02/03/2023] [Indexed: 05/03/2023]
Abstract
Organic-inorganic hybrid perovskite (OIHP) polycrystalline thin films are attractive due to their outstanding photoelectronic properties. The anti-solvent spin coating method is the most widely used to synthesize these thin films, and the residual strain is inevitably originates and evolves during the process. However, this residual strain evolution induced by crystallization kinetics is still poorly understood. In this work, the in situ and ex situ synchrotron grazing-incidence wide-angle X-ray scattering (GIWAXS) are utilized to characterize the evolution and distribution of the residual strain in the OIHP polycrystalline thin film during the anti-solvent spin coating process. A mechanical model is established and the mechanism of the crystallization kinetics-induced residual strain evolution process is discussed. This work reveals a comprehensive understanding of the residual strain evolution during the anti-solvent spin coating process in the OIHP polycrystalline thin films and provides important guidelines for the residual strain-related strain engineering, morphology control, and performance enhancement.
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Affiliation(s)
- Y Sun
- Guangdong Provincial Key Laboratory of Magnetoelectric Physics and Devices, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- State Key Laboratory of Optoelectronic Materials and Technologies, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- Centre for Physical Mechanics and Biophysics, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
| | - Q Yao
- Guangdong Provincial Key Laboratory of Magnetoelectric Physics and Devices, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- State Key Laboratory of Optoelectronic Materials and Technologies, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- Centre for Physical Mechanics and Biophysics, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
| | - W Xing
- Guangdong Provincial Key Laboratory of Magnetoelectric Physics and Devices, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- State Key Laboratory of Optoelectronic Materials and Technologies, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- Centre for Physical Mechanics and Biophysics, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
| | - H Jiang
- Guangdong Provincial Key Laboratory of Magnetoelectric Physics and Devices, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- State Key Laboratory of Optoelectronic Materials and Technologies, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- Centre for Physical Mechanics and Biophysics, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
| | - Y Li
- Guangdong Provincial Key Laboratory of Magnetoelectric Physics and Devices, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- State Key Laboratory of Optoelectronic Materials and Technologies, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- Centre for Physical Mechanics and Biophysics, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
| | - W Xiong
- Guangdong Provincial Key Laboratory of Magnetoelectric Physics and Devices, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- State Key Laboratory of Optoelectronic Materials and Technologies, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- Centre for Physical Mechanics and Biophysics, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
| | - W Zhu
- Guangdong Provincial Key Laboratory of Magnetoelectric Physics and Devices, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- State Key Laboratory of Optoelectronic Materials and Technologies, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- Centre for Physical Mechanics and Biophysics, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
| | - Y Zheng
- Guangdong Provincial Key Laboratory of Magnetoelectric Physics and Devices, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- State Key Laboratory of Optoelectronic Materials and Technologies, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
- Centre for Physical Mechanics and Biophysics, School of Physics, Sun Yat-sen University, Guangzhou, 510275, China
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21
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Lahcen AA, Caprio A, Hsue W, Tschabrunn C, Liu C, Mosadegh B, Dunham S. Creating Stretchable Electronics from Dual Layer Flex-PCB for Soft Robotic Cardiac Mapping Catheters. MICROMACHINES 2023; 14:884. [PMID: 37421117 DOI: 10.3390/mi14040884] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/17/2023] [Revised: 04/15/2023] [Accepted: 04/18/2023] [Indexed: 07/09/2023]
Abstract
The authors present in this study the development of a novel method for creating stretchable electronics from dual-layer flex printed circuit boards (flex-PCBs) as a platform for soft robotic sensor arrays (SRSAs) for cardiac voltage mapping applications. There is a crucial need for devices that utilize multiple sensors and provide high performance signal acquisition for cardiac mapping. Previously, our group demonstrated how single-layer flex-PCB can be postprocessed to create a stretchable electronic sensing array. In this work, a detailed fabrication process for creating a dual-layer multielectrode flex-PCB SRSA is presented, along with relevant parameters to achieve optimal postprocessing with a laser cutter. The dual-layer flex-PCB SRSA's ability to acquire electrical signals is demonstrated both in vitro as well as in vivo on a Leporine cardiac surface. These SRSAs could be extended into full-chamber cardiac mapping catheter applications. Our results show a significant contribution towards the scalable use of dual-layer flex-PCB for stretchable electronics.
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Affiliation(s)
- Abdellatif Ait Lahcen
- Dalio Institute for Cardiovascular Imaging, Department of Radiology, Weill Cornell Medicine, New York, NY 10021, USA
| | - Alexandre Caprio
- Dalio Institute for Cardiovascular Imaging, Department of Radiology, Weill Cornell Medicine, New York, NY 10021, USA
| | - Weihow Hsue
- Department of Clinical Sciences, College of Veterinary Medicine, Cornell University, Ithaca, NY 14853, USA
| | - Cory Tschabrunn
- Electrophysiology Section, Cardiovascular Division, Hospital of the University of Pennsylvania, Philadelphia, PA 19104, USA
| | - Christopher Liu
- Department of Cardiology, Weill Cornell Medicine, New York, NY 10021, USA
| | - Bobak Mosadegh
- Dalio Institute for Cardiovascular Imaging, Department of Radiology, Weill Cornell Medicine, New York, NY 10021, USA
| | - Simon Dunham
- Dalio Institute for Cardiovascular Imaging, Department of Radiology, Weill Cornell Medicine, New York, NY 10021, USA
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22
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Deng Y, Guo X, Lin Y, Huang Z, Li Y. Dual-Phase Inspired Soft Electronic Sensors with Programmable and Tunable Mechanical Properties. ACS NANO 2023; 17:6423-6434. [PMID: 36861640 DOI: 10.1021/acsnano.2c11245] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Wearable and stretchable sensors are important components to strictly monitor the behavior and health of humans and attract extensive attention. However, traditional sensors are designed with pure horseshoes or chiral metamaterials, which restrict the biological tissue engineer applications due to their narrow regulation ranges of the elastic modulus and the poorly adjustable Poisson's ratio. Inspired by the biological spiral microstructure, a dual-phase metamaterial (chiral-horseshoes) is designed and fabricated in this work, which possesses wide and programmable mechanical properties by tailoring the geometrical parameters. Experimental, numerical, and theoretical studies are conducted, which reveal that the designed microstructures can reproduce mechanical properties of most natural animals such as frogs, snakes, and rabbits skin. Furthermore, a flexible strain sensor with the gauge factor reaching 2 under 35% strain is fabricated, which indicates that the dual-phase metamaterials have a stable monitoring ability and can be potentially applied in the electronic skin. Finally, the flexible strain sensor is attached on the human skin, and it can successfully monitor the physiological behavior signals under various actions. In addition, the dual-phase metamaterial could combine with artificial intelligence algorithms to fabricate a flexible stretchable display. The dual-phase metamaterial with negative Poisson's ratio could decrease the lateral shrinkage and image distortion during the stretching process. This study offers a strategy for designing the flexible strain sensors with programmable, tunable mechanical properties, and the fabricated soft and high-precision wearable strain sensor can accurately monitor the skin signals under different human motions and potentially be applied for flexible display.
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23
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Luo Y, Abidian MR, Ahn JH, Akinwande D, Andrews AM, Antonietti M, Bao Z, Berggren M, Berkey CA, Bettinger CJ, Chen J, Chen P, Cheng W, Cheng X, Choi SJ, Chortos A, Dagdeviren C, Dauskardt RH, Di CA, Dickey MD, Duan X, Facchetti A, Fan Z, Fang Y, Feng J, Feng X, Gao H, Gao W, Gong X, Guo CF, Guo X, Hartel MC, He Z, Ho JS, Hu Y, Huang Q, Huang Y, Huo F, Hussain MM, Javey A, Jeong U, Jiang C, Jiang X, Kang J, Karnaushenko D, Khademhosseini A, Kim DH, Kim ID, Kireev D, Kong L, Lee C, Lee NE, Lee PS, Lee TW, Li F, Li J, Liang C, Lim CT, Lin Y, Lipomi DJ, Liu J, Liu K, Liu N, Liu R, Liu Y, Liu Y, Liu Z, Liu Z, Loh XJ, Lu N, Lv Z, Magdassi S, Malliaras GG, Matsuhisa N, Nathan A, Niu S, Pan J, Pang C, Pei Q, Peng H, Qi D, Ren H, Rogers JA, Rowe A, Schmidt OG, Sekitani T, Seo DG, Shen G, Sheng X, Shi Q, Someya T, Song Y, Stavrinidou E, Su M, Sun X, Takei K, Tao XM, Tee BCK, Thean AVY, Trung TQ, Wan C, Wang H, Wang J, Wang M, Wang S, Wang T, Wang ZL, Weiss PS, Wen H, Xu S, Xu T, Yan H, Yan X, Yang H, Yang L, Yang S, Yin L, Yu C, Yu G, Yu J, Yu SH, Yu X, Zamburg E, Zhang H, Zhang X, Zhang X, Zhang X, Zhang Y, Zhang Y, Zhao S, Zhao X, Zheng Y, Zheng YQ, Zheng Z, Zhou T, Zhu B, Zhu M, Zhu R, Zhu Y, Zhu Y, Zou G, Chen X. Technology Roadmap for Flexible Sensors. ACS NANO 2023; 17:5211-5295. [PMID: 36892156 PMCID: PMC11223676 DOI: 10.1021/acsnano.2c12606] [Citation(s) in RCA: 171] [Impact Index Per Article: 171.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity.
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Affiliation(s)
- Yifei Luo
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Mohammad Reza Abidian
- Department of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States
| | - Jong-Hyun Ahn
- School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
| | - Deji Akinwande
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Anne M Andrews
- Department of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Markus Antonietti
- Colloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany
| | - Zhenan Bao
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Magnus Berggren
- Laboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden
- Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC), SE-100 44 Stockholm, Sweden
| | - Christopher A Berkey
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Christopher John Bettinger
- Department of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States
| | - Jun Chen
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Peng Chen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Wenlong Cheng
- Nanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800
- Monash Institute of Medical Engineering, Monash University, Clayton, Australia3800
| | - Xu Cheng
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Seon-Jin Choi
- Division of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea
| | - Alex Chortos
- School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Canan Dagdeviren
- Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
| | - Reinhold H Dauskardt
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Chong-An Di
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States
| | - Xiangfeng Duan
- Department of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Antonio Facchetti
- Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States
| | - Zhiyong Fan
- Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
| | - Yin Fang
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Jianyou Feng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Xue Feng
- Laboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
| | - Huajian Gao
- School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Wei Gao
- Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States
| | - Xiwen Gong
- Department of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States
| | - Chuan Fei Guo
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China
| | - Xiaojun Guo
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
| | - Martin C Hartel
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Zihan He
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - John S Ho
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore
| | - Youfan Hu
- School of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China
| | - Qiyao Huang
- School of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Yu Huang
- Department of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Fengwei Huo
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China
| | - Muhammad M Hussain
- mmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Ali Javey
- Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States
- Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States
| | - Unyong Jeong
- Department of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea
| | - Chen Jiang
- Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
| | - Xingyu Jiang
- Department of Biomedical Engineering, Southern University of Science and Technology, No 1088, Xueyuan Road, Xili, Nanshan District, Shenzhen, Guangdong 518055, PR China
| | - Jiheong Kang
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Daniil Karnaushenko
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
| | | | - Dae-Hyeong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Il-Doo Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea
| | - Dmitry Kireev
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Lingxuan Kong
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Chengkuo Lee
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
- NUS Graduate School-Integrative Sciences and Engineering Programme (ISEP), National University of Singapore, Singapore 119077, Singapore
| | - Nae-Eung Lee
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Pooi See Lee
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Singapore-HUJ Alliance for Research and Enterprise (SHARE), Campus for Research Excellence and Technological Enterprise (CREATE), Singapore 138602, Singapore
| | - Tae-Woo Lee
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
- School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
- Institute of Engineering Research, Research Institute of Advanced Materials, Seoul National University, Soft Foundry, Seoul 08826, Republic of Korea
- Interdisciplinary Program in Bioengineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Fengyu Li
- College of Chemistry and Materials Science, Jinan University, Guangzhou, Guangdong 510632, China
| | - Jinxing Li
- Department of Biomedical Engineering, Department of Electrical and Computer Engineering, Neuroscience Program, BioMolecular Science Program, and Institute for Quantitative Health Science and Engineering, Michigan State University, East Lansing, Michigan 48823, United States
| | - Cuiyuan Liang
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Chwee Teck Lim
- Department of Biomedical Engineering, National University of Singapore, Singapore 117583, Singapore
- Mechanobiology Institute, National University of Singapore, Singapore 117411, Singapore
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 119276, Singapore
| | - Yuanjing Lin
- School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
| | - Darren J Lipomi
- Department of Nano and Chemical Engineering, University of California, San Diego, La Jolla, California 92093-0448, United States
| | - Jia Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Kai Liu
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Nan Liu
- Beijing Key Laboratory of Energy Conversion and Storage Materials, College of Chemistry, Beijing Normal University, Beijing 100875, PR China
| | - Ren Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Yuxin Liu
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Biomedical Engineering, N.1 Institute for Health, Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore 119077, Singapore
| | - Yuxuan Liu
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Zhiyuan Liu
- Neural Engineering Centre, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 518055
| | - Zhuangjian Liu
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xian Jun Loh
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Nanshu Lu
- Department of Aerospace Engineering and Engineering Mechanics, Department of Electrical and Computer Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Zhisheng Lv
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Shlomo Magdassi
- Institute of Chemistry and the Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
| | - George G Malliaras
- Electrical Engineering Division, Department of Engineering, University of Cambridge CB3 0FA, Cambridge United Kingdom
| | - Naoji Matsuhisa
- Institute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan
| | - Arokia Nathan
- Darwin College, University of Cambridge, Cambridge CB3 9EU, United Kingdom
| | - Simiao Niu
- Department of Biomedical Engineering, Rutgers University, Piscataway, New Jersey 08854, United States
| | - Jieming Pan
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
| | - Changhyun Pang
- School of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea
| | - Qibing Pei
- Department of Materials Science and Engineering, Department of Mechanical and Aerospace Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Huisheng Peng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Dianpeng Qi
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Huaying Ren
- Department of Chemistry and Biochemistry, University of California, Los Angeles, Los Angeles, California, 90095, United States
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
- Department of Materials Science and Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Departments of Electrical and Computer Engineering and Chemistry, and Department of Neurological Surgery, Northwestern University, Evanston, Illinois 60208, United States
| | - Aaron Rowe
- Becton, Dickinson and Company, 1268 N. Lakeview Avenue, Anaheim, California 92807, United States
- Ready, Set, Food! 15821 Ventura Blvd #450, Encino, California 91436, United States
| | - Oliver G Schmidt
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz 09107, Germany
- Nanophysics, Faculty of Physics, TU Dresden, Dresden 01062, Germany
| | - Tsuyoshi Sekitani
- The Institute of Scientific and Industrial Research (SANKEN), Osaka University, Osaka, Japan 5670047
| | - Dae-Gyo Seo
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Guozhen Shen
- School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China
| | - Xing Sheng
- Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Center for Flexible Electronics Technology, and IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, China
| | - Qiongfeng Shi
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
| | - Takao Someya
- Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan
| | - Yanlin Song
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Eleni Stavrinidou
- Laboratory of Organic Electronics, Department of Science and Technology, Linköping University, SE-601 74 Norrkoping, Sweden
| | - Meng Su
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Xuemei Sun
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Kuniharu Takei
- Department of Physics and Electronics, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan
| | - Xiao-Ming Tao
- Research Institute for Intelligent Wearable Systems, School of Fashion and Textiles, Hong Kong Polytechnic University, Hong Kong, China
| | - Benjamin C K Tee
- Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore
- iHealthtech, National University of Singapore, Singapore 119276, Singapore
| | - Aaron Voon-Yew Thean
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Tran Quang Trung
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Changjin Wan
- School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
| | - Huiliang Wang
- Department of Biomedical Engineering, University of Texas at Austin, Austin, Texas 78712, United States
| | - Joseph Wang
- Department of Nanoengineering, University of California, San Diego, California 92093, United States
| | - Ming Wang
- Frontier Institute of Chip and System, State Key Laboratory of Integrated Chip and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China
- the Shanghai Qi Zhi Institute, 41th Floor, AI Tower, No.701 Yunjin Road, Xuhui District, Shanghai 200232, China
| | - Sihong Wang
- Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, 60637, United States
| | - Ting Wang
- State Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Zhong Lin Wang
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China
- Georgia Institute of Technology, Atlanta, Georgia 30332-0245, United States
| | - Paul S Weiss
- California NanoSystems Institute, Department of Chemistry and Biochemistry, Department of Bioengineering, and Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Hanqi Wen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
- Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, China 314000
| | - Sheng Xu
- Department of Nanoengineering, Department of Electrical and Computer Engineering, Materials Science and Engineering Program, and Department of Bioengineering, University of California San Diego, La Jolla, California, 92093, United States
| | - Tailin Xu
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong, 518060, PR China
| | - Hongping Yan
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Xuzhou Yan
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Hui Yang
- Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Tianjin, China, 300072
| | - Le Yang
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Materials Science and Engineering, National University of Singapore (NUS), 9 Engineering Drive 1, #03-09 EA, Singapore 117575, Singapore
| | - Shuaijian Yang
- School of Biomedical Sciences, Faculty of Biological Sciences, University of Leeds, Leeds, LS2 9JT, United Kingdom
| | - Lan Yin
- School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, and Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
| | - Cunjiang Yu
- Department of Engineering Science and Mechanics, Department of Biomedical Engineering, Department of Material Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, 16802, United States
| | - Guihua Yu
- Materials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, 78712, United States
| | - Jing Yu
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Shu-Hong Yu
- Department of Chemistry, Institute of Biomimetic Materials and Chemistry, Hefei National Research Center for Physical Science at the Microscale, University of Science and Technology of China, Hefei 230026, China
| | - Xinge Yu
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Evgeny Zamburg
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Haixia Zhang
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Xiangyu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Xiaosheng Zhang
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
| | - Xueji Zhang
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong 518060, PR China
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Yu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Siyuan Zhao
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Xuanhe Zhao
- Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, United States
| | - Yuanjin Zheng
- Center for Integrated Circuits and Systems, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
| | - Yu-Qing Zheng
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Zijian Zheng
- Department of Applied Biology and Chemical Technology, Faculty of Science, Research Institute for Intelligent Wearable Systems, Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Tao Zhou
- Center for Neural Engineering, Department of Engineering Science and Mechanics, The Huck Institutes of the Life Sciences, Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Bowen Zhu
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou 310024, China
| | - Ming Zhu
- Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore
| | - Rong Zhu
- Department of Precision Instrument, Tsinghua University, Beijing 100084, China
| | - Yangzhi Zhu
- Terasaki Institute for Biomedical Innovation, Los Angeles, California, 90064, United States
| | - Yong Zhu
- Department of Mechanical and Aerospace Engineering, Department of Materials Science and Engineering, and Department of Biomedical Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Guijin Zou
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xiaodong Chen
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
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Wang Y, Ping X, Chen X, Wang D. Flexible Electrodes as a Measuring System of Electrical Impedance Imaging. MATERIALS (BASEL, SWITZERLAND) 2023; 16:1901. [PMID: 36903016 PMCID: PMC10004451 DOI: 10.3390/ma16051901] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 02/01/2023] [Revised: 02/17/2023] [Accepted: 02/22/2023] [Indexed: 06/18/2023]
Abstract
Electrical Impedance Tomography (EIT) is a detection imaging technology developed 30 years ago. When the conventional EIT measurement system is used, the electrode and the excitation measurement terminal are connected with a long wire, which is easily affected by external interference, and the measurement result is unstable. In this paper, we developed a flexible electrode device based on flexible electronics technology, which can be softly attached to the skin surface for real-time physiological monitoring. The flexible equipment includes an excitation measuring circuit and electrode, which eliminates the adverse effects of connecting long wires and improves the effectiveness of measuring signals. At the same time, the design also uses flexible electronic technology to make the system structure achieve ultra-low modulus and high tensile strength so that the electronic equipment has soft mechanical properties. Experiments have shown that when the flexible electrode is deformed, its function is completely unaffected, the measurement results remain stable, and the static and fatigue performances are satisfactory. The flexible electrode has high system accuracy and good anti-interference.
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Affiliation(s)
- Yi Wang
- College of Mechanical Engineering, Tianjin University of Science and Technology, Tianjin 300222, China
- Tianjin Key Laboratory of Integrated Design and On-Line Monitoring for Light Industry & Food Machinery and Equipment, Tianjin 300222, China
| | - Xuecheng Ping
- College of Mechanical Engineering, Tianjin University of Science and Technology, Tianjin 300222, China
- Tianjin Key Laboratory of Integrated Design and On-Line Monitoring for Light Industry & Food Machinery and Equipment, Tianjin 300222, China
| | - Xiaoyan Chen
- College of Electronic Information and Automation, Tianjin University of Science and Technology, Tianjin 300222, China
| | - Di Wang
- College of Electronic Information and Automation, Tianjin University of Science and Technology, Tianjin 300222, China
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25
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Hu Y, Zheng L, Li J, Huang Y, Wang Z, Lu X, Yu L, Wang S, Sun Y, Ding S, Ji D, Lei Y, Chen X, Li L, Hu W. Organic Phase-Change Memory Transistor Based on an Organic Semiconductor with Reversible Molecular Conformation Transition. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2023; 10:e2205694. [PMID: 36461698 PMCID: PMC9896068 DOI: 10.1002/advs.202205694] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 09/30/2022] [Revised: 11/11/2022] [Indexed: 06/17/2023]
Abstract
Phase-change semiconductor is one of the best candidates for designing nonvolatile memory, but it has never been realized in organic semiconductors until now. Here, a phase-changeable and high-mobility organic semiconductor (3,6-DATT) is first synthesized. Benefiting from the introduction of electrostatic hydrogen bond (S···H), the molecular conformation of 3,6-DATT crystals can be reversibly modulated by the electric field and ultraviolet irradiation. Through experimental and theoretical verification, the tiny difference in molecular conformation leads to crystalline polymorphisms and dramatically distinct charge transport properties, based on which a high-performance organic phase-change memory transistor (OPCMT) is constructed. The OPCMT exhibits a quick programming/erasing rate (about 3 s), long retention time (more than 2 h), and large memory window (i.e., large threshold voltage shift over 30 V). This work presents a new molecule design concept for organic semiconductors with reversible molecular conformation transition and opens a novel avenue for memory devices and other functional applications.
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Affiliation(s)
- Yongxu Hu
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
- Shenzhen Key Laboratory of Polymer Science and Technology College of Materials Science and EngineeringCollege of Physics and Optoeletronic EngineeringShenzhen UniversityShenzhen518060China
| | - Lei Zheng
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
| | - Jie Li
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
- Haihe Laboratory of Sustainable Chemical TransformationsTianjin300192China
| | - Yinan Huang
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
| | - Zhongwu Wang
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
| | - Xueying Lu
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
| | - Li Yu
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
| | - Shuguang Wang
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
| | - Yajing Sun
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
| | - Shuaishuai Ding
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
| | - Deyang Ji
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
- Haihe Laboratory of Sustainable Chemical TransformationsTianjin300192China
| | - Yong Lei
- Fachgebiet Angewandte NanophysikInstitut für Physik & IMN MacroNanoTechnische Universität Ilmenau98693IlmenauGermany
| | - Xiaosong Chen
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
- Haihe Laboratory of Sustainable Chemical TransformationsTianjin300192China
| | - Liqiang Li
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
- Haihe Laboratory of Sustainable Chemical TransformationsTianjin300192China
- Joint School of National University of Singapore and Tianjin UniversityInternational Campus of Tianjin UniversityFuzhou350207China
| | - Wenping Hu
- Tianjin Key Laboratory of Molecular Optoelectronic SciencesDepartment of ChemistryInstitute of Molecular Aggregation ScienceTianjin UniversityTianjin300072China
- Haihe Laboratory of Sustainable Chemical TransformationsTianjin300192China
- Joint School of National University of Singapore and Tianjin UniversityInternational Campus of Tianjin UniversityFuzhou350207China
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Wang X, Huang J, Liu Y, Tan J, Chen S, Avila R, Xie Z. Design of protective and high sensitivity encapsulation layers in wearable devices. SCIENCE CHINA. TECHNOLOGICAL SCIENCES 2022; 66:223-232. [PMID: 36593863 PMCID: PMC9798368 DOI: 10.1007/s11431-022-2034-y] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/08/2022] [Accepted: 03/17/2022] [Indexed: 06/17/2023]
Abstract
UNLABELLED Elastomeric encapsulation layers are widely used in soft, wearable devices to physically isolate rigid electronic components from external environmental stimuli (e.g., stress) and facilitate device sterilization for reusability. In devices experiencing large deformations, the stress-isolation effect of the top encapsulation layer can eliminate the damage to the electronic components caused by external forces. However, for health monitoring and sensing applications, the strain-isolation effect of the bottom encapsulation layer can partially block the physiological signals of interest and degrade the measurement accuracy. Here, an analytic model is developed for the strain- and stress-isolation effects present in wearable devices with elastomeric encapsulation layers. The soft, elastomeric encapsulation layers and main electronic components layer are modeled as transversely isotropic-elastic mediums and the strain- and stress-isolation effects are described using isolation indexes. The analysis and results show that the isolation effects strongly depend on the thickness, density, and elastic modulus of both the elastomeric encapsulation layers and the main electronic component layer. These findings, combined with the flexible mechanics design strategies of wearable devices, provide new design guidelines for future wearable devices to protect them from external forces while capturing the relevant physiological signals underneath the skin. ELECTRONIC SUPPLEMENTARY MATERIAL Supplementary material is available in the online version of this article at 10.1007/s11431-022-2034-y.
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Affiliation(s)
- XiuFeng Wang
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - JieLong Huang
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - YangChengYi Liu
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - JinYuan Tan
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - ShangDa Chen
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - Raudel Avila
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208 USA
| | - ZhaoQian Xie
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, 116024 China
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27
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Jiang S, Liu X, Liu J, Ye D, Duan Y, Li K, Yin Z, Huang Y. Flexible Metamaterial Electronics. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2200070. [PMID: 35325478 DOI: 10.1002/adma.202200070] [Citation(s) in RCA: 22] [Impact Index Per Article: 11.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/04/2022] [Revised: 03/14/2022] [Indexed: 06/14/2023]
Abstract
Over the last decade, extensive efforts have been made on utilizing advanced materials and structures to improve the properties and functionalities of flexible electronics. While the conventional ways are approaching their natural limits, a revolutionary strategy, namely metamaterials, is emerging toward engineering structural materials to break the existing fetters. Metamaterials exhibit supernatural physical behaviors, in aspects of mechanical, optical, thermal, acoustic, and electronic properties that are inaccessible in natural materials, such as tunable stiffness or Poisson's ratio, manipulating electromagnetic or elastic waves, and topological and programmable morphability. These salient merits motivate metamaterials as a brand-new research direction and have inspired extensive innovative applications in flexible electronics. Here, such a groundbreaking interdisciplinary field is first coined as "flexible metamaterial electronics," focusing on enhancing and innovating functionalities of flexible electronics via the design of metamaterials. Herein, the latest progress and trends in this infant field are reviewed while highlighting their potential value. First, a brief overview starts with introducing the combination of metamaterials and flexible electronics. Then, the developed applications are discussed, such as self-adaptive deformability, ultrahigh sensitivity, and multidisciplinary functionality, followed by the discussion of potential prospects. Finally, the challenges and opportunities facing flexible metamaterial electronics to advance this cutting-edge field are summarized.
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Affiliation(s)
- Shan Jiang
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Xuejun Liu
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Jianpeng Liu
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Dong Ye
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Yongqing Duan
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Kan Li
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Zhouping Yin
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - YongAn Huang
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
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28
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Jang S, Shim H, Yu C. Fully rubbery Schottky diode and integrated devices. SCIENCE ADVANCES 2022; 8:eade4284. [PMID: 36417509 PMCID: PMC9683705 DOI: 10.1126/sciadv.ade4284] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 08/17/2022] [Accepted: 10/25/2022] [Indexed: 06/16/2023]
Abstract
A fully rubbery stretchable diode, particularly entirely based on stretchy materials, is a crucial device for stretchable integrated electronics in a wide range of applications, ranging from energy to biomedical, to integrated circuits, and to robotics. However, its development has been very nascent. Here, we report a fully rubbery Schottky diode constructed all based on stretchable electronic materials, including a liquid metal cathode, a rubbery semiconductor, and a stretchable anode. The rubbery Schottky diode exhibited a forward current density of 6.99 × 10-3 A/cm2 at 5 V and a rectification ratio of 8.37 × 104 at ±5 V. Stretchy rectifiers and logic gates based on the rubbery Schottky diodes were developed and could retain their electrical performance even under 30% tensile stretching. With the rubbery diodes, fully rubbery integrated electronics, including an active matrix multiplexed tactile sensor and a triboelectric nanogenerator-based power management system, are further demonstrated.
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Affiliation(s)
- Seonmin Jang
- Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, PA 16802, USA
- Materials Science and Engineering Program, University of Houston, Houston, TX 77204, USA
| | - Hyunseok Shim
- Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, PA 16802, USA
- Materials Science and Engineering Program, University of Houston, Houston, TX 77204, USA
| | - Cunjiang Yu
- Department of Engineering Science and Mechanics, Pennsylvania State University, University Park, PA 16802, USA
- Materials Science and Engineering Program, University of Houston, Houston, TX 77204, USA
- Department of Mechanical Engineering, Texas Center for Superconductivity, University of Houston, Houston, TX 77204, USA
- Department of Biomedical Engineering, Department of Materials Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, PA 16802, USA
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29
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Jia S, Gao H, Xue Z, Meng X. Recent Advances in Multifunctional Wearable Sensors and Systems: Design, Fabrication, and Applications. BIOSENSORS 2022; 12:bios12111057. [PMID: 36421175 PMCID: PMC9688294 DOI: 10.3390/bios12111057] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/21/2022] [Revised: 11/14/2022] [Accepted: 11/18/2022] [Indexed: 05/24/2023]
Abstract
Multifunctional wearable sensors and systems are of growing interest over the past decades because of real-time health monitoring and disease diagnosis capability. Owing to the tremendous efforts of scientists, wearable sensors and systems with attractive advantages such as flexibility, comfort, and long-term stability have been developed, which are widely used in temperature monitoring, pulse wave detection, gait pattern analysis, etc. Due to the complexity of human physiological signals, it is necessary to measure multiple physiological information simultaneously to evaluate human health comprehensively. This review summarizes the recent advances in multifunctional wearable sensors, including single sensors with various functions, planar integrated sensors, three-dimensional assembled sensors, and stacked integrated sensors. The design strategy, manufacturing method, and potential application of each type of sensor are discussed. Finally, we offer an outlook on future developments and provide perspectives on the remaining challenges and opportunities of wearable multifunctional sensing technology.
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30
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Improved performance of stretchable piezoelectric energy harvester based on stress rearrangement. Sci Rep 2022; 12:19149. [PMID: 36352018 PMCID: PMC9646885 DOI: 10.1038/s41598-022-23005-2] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/23/2022] [Accepted: 10/21/2022] [Indexed: 11/11/2022] Open
Abstract
With the development of wearable devices and soft electronics, the demand for stretchable piezoelectric energy harvesters (SPEHs) has increased. Energy harvesting can provide energy when large batteries or power sources cannot be employed, and stretchability provides a user-friendly experience. However, the performance of SPEHs remains low, which limits their application. In this study, a wearable SPEH is developed by adopting a kirigami structure on a polyvinylidene fluoride film. The performance of the SPEH is improved by rearranging the stress distribution throughout the film. This is conducted using two approaches: topological depolarization, which eliminates the opposite charge generation by thermal treatment, and optimization of the neutral axis, which maximizes the stress applied at the surface of the piezoelectric film. The SPEH performance is experimentally measured and compared with that of existing SPEHs. Using these two approaches, the stress was rearranged in both the x-y plane and z-direction, and the output voltage increased by 21.57% compared with that of the original film with the same stretching motion. The generated energy harvester was successfully applied to smart transmittance-changing contact lenses.
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31
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Yu S, Zhang J, Li H, Li L, Ni Y. Controllable Buckle Delaminations in Polymer-Supported Periodic Gradient Films by Mechanical Compression. LANGMUIR : THE ACS JOURNAL OF SURFACES AND COLLOIDS 2022; 38:13469-13476. [PMID: 36302725 DOI: 10.1021/acs.langmuir.2c01939] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
Surface instabilities including wrinkles and buckle-delaminations are widespread in nature and can be found in a wide range of practical applications. Compared with the homogeneous wrinkle mode, the buckle-delaminations are spontaneously stress-localized, and their initiation positions and geometrical parameters are hardly precisely controlled by a simple method. Here, we report on the controllable buckle-delaminations in periodic thickness-gradient metal films on polydimethylsiloxane (PDMS) substrates by uniaxial mechanical compression. It is found that a periodic thickness-gradient film is spontaneously formed by masking a copper grid during deposition. The released mechanical strain tends to concentrate in thinner film regions, resulting in the restricted growth of buckle-delaminations. The geometrical features, evolutional behaviors, and underlying physical mechanisms of such buckle-delaminations are analyzed and discussed in detail based on the buckling model and finite element simulations. This work would provide a better understanding of the restricted buckle-delaminations in heterogeneous film-substrate systems and controllable fabrication of ordered structural arrays by copper grid masking and mechanical loading.
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Affiliation(s)
- Senjiang Yu
- Key Laboratory of Novel Materials for Sensor of Zhejiang Province, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou310018, P. R. China
| | - Jiahui Zhang
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China, Hefei230026, P. R. China
| | - Huihua Li
- Key Laboratory of Novel Materials for Sensor of Zhejiang Province, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou310018, P. R. China
| | - Lingwei Li
- Key Laboratory of Novel Materials for Sensor of Zhejiang Province, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou310018, P. R. China
| | - Yong Ni
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China, Hefei230026, P. R. China
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32
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Li R, Zhang C, Li J, Zhang Y, Liu S, Hu Y, Jiang S, Chen C, Xin C, Tao Y, Dong B, Wu D, Chu J. Magnetically encoded 3D mesostructure with high-order shape morphing and high-frequency actuation. Natl Sci Rev 2022; 9:nwac163. [PMID: 36381211 PMCID: PMC9647007 DOI: 10.1093/nsr/nwac163] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/07/2022] [Revised: 07/05/2022] [Accepted: 07/14/2022] [Indexed: 09/08/2023] Open
Abstract
Inspired by origami/kirigami, three-dimensional (3D) mesostructures assembled via a mechanics-guided approach, with reversible and maneuverable shape-morphing capabilities, have attracted great interest with regard to a broad range of applications. Despite intensive studies, the development of morphable 3D mesostructures with high-order (multi-degree-of-freedom) deformation and untethered high-frequency actuation remains challenging. This work introduces a scheme for a magnetically encoded transferable 3D mesostructure, with polyethylene terephthalate (PET) film as the skeleton and discrete magnetic domains as actuation units, to address this challenge. The high-order deformation, including hierarchical, multidirectional and blending shape morphing, is realized by encoding 3D discrete magnetization profiles on the architecture through ultraviolet curing. Reconfigurable 3D mesostructures with a modest structural modulus (∼3 GPa) enable both high-frequency (∼55 Hz) and large-deformation (∼66.8%) actuation under an alternating magnetic field. Additionally, combined with the shape-retention and adhesion property of PET, these 3D mesostructures can be readily transferred and attached to many solid substrates. On this basis, diverse functional devices, including a switchable colour letter display, liquid mixer, sequential flashlight and biomimetic sliding robot, are demonstrated to offer new perspectives for robotics and microelectronics.
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Affiliation(s)
- Rui Li
- Hefei National Laboratory for Physical Sciences at the Microscale, CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China
| | - Cong Zhang
- Hefei National Laboratory for Physical Sciences at the Microscale, CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China
| | - Jiawen Li
- Hefei National Laboratory for Physical Sciences at the Microscale, CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China
| | - Yachao Zhang
- Hefei National Laboratory for Physical Sciences at the Microscale, CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China
| | - Shunli Liu
- Hefei National Laboratory for Physical Sciences at the Microscale, CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China
| | - Yanlei Hu
- Hefei National Laboratory for Physical Sciences at the Microscale, CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China
| | - Shaojun Jiang
- Hefei National Laboratory for Physical Sciences at the Microscale, CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China
| | - Chao Chen
- Hefei National Laboratory for Physical Sciences at the Microscale, CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China
| | - Chen Xin
- Hefei National Laboratory for Physical Sciences at the Microscale, CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China
| | - Yuan Tao
- Hefei National Laboratory for Physical Sciences at the Microscale, CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China
| | - Bin Dong
- Hefei National Laboratory for Physical Sciences at the Microscale, CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China
| | - Dong Wu
- Hefei National Laboratory for Physical Sciences at the Microscale, CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China
| | - Jiaru Chu
- Hefei National Laboratory for Physical Sciences at the Microscale, CAS Key Laboratory of Mechanical Behavior and Design of Materials, Key Laboratory of Precision Scientific Instrumentation of Anhui Higher Education Institutes, Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230027, China
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33
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Bioinspired Strategies for Stretchable Conductors. Chem Res Chin Univ 2022. [DOI: 10.1007/s40242-022-2236-1] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/03/2022]
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34
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Lee G, Zarei M, Wei Q, Zhu Y, Lee SG. Surface Wrinkling for Flexible and Stretchable Sensors. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2022; 18:e2203491. [PMID: 36047645 DOI: 10.1002/smll.202203491] [Citation(s) in RCA: 24] [Impact Index Per Article: 12.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/05/2022] [Revised: 08/07/2022] [Indexed: 06/15/2023]
Abstract
Recent advances in nanolithography, miniaturization, and material science, along with developments in wearable electronics, are pushing the frontiers of sensor technology into the large-scale fabrication of highly sensitive, flexible, stretchable, and multimodal detection systems. Various strategies, including surface engineering, have been developed to control the electrical and mechanical characteristics of sensors. In particular, surface wrinkling provides an effective alternative for improving both the sensing performance and mechanical deformability of flexible and stretchable sensors by releasing interfacial stress, preventing electrical failure, and enlarging surface areas. In this study, recent developments in the fabrication strategies of wrinkling structures for sensor applications are discussed. The fundamental mechanics, geometry control strategies, and various fabricating methods for wrinkling patterns are summarized. Furthermore, the current state of wrinkling approaches and their impacts on the development of various types of sensors, including strain, pressure, temperature, chemical, photodetectors, and multimodal sensors, are reviewed. Finally, existing wrinkling approaches, designs, and sensing strategies are extrapolated into future applications.
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Affiliation(s)
- Giwon Lee
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC, 27695, USA
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, NC, 27695, USA
| | - Mohammad Zarei
- Department of Chemistry, University of Ulsan, Ulsan, 44776, South Korea
| | - Qingshan Wei
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC, 27695, USA
| | - Yong Zhu
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, NC, 27695, USA
| | - Seung Goo Lee
- Department of Chemistry, University of Ulsan, Ulsan, 44776, South Korea
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35
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Mishra S, Mohanty S, Ramadoss A. Functionality of Flexible Pressure Sensors in Cardiovascular Health Monitoring: A Review. ACS Sens 2022; 7:2495-2520. [PMID: 36036627 DOI: 10.1021/acssensors.2c00942] [Citation(s) in RCA: 13] [Impact Index Per Article: 6.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/28/2023]
Abstract
As the highest percentage of global mortality is caused by several cardiovascular diseases (CVD), maintenance and monitoring of a healthy cardiovascular condition have become the primary concern of each and every individual. Simultaneously, recent progress and advances in wearable pressure sensor technology have provided many pathways to monitor and detect underlying cardiovascular illness in terms of irregularities in heart rate, blood pressure, and blood oxygen saturation. These pressure sensors can be comfortably attached onto human skin or can be implanted on the surface of vascular grafts for uninterrupted monitoring of arterial blood pressure. While the traditional monitoring systems are time-consuming, expensive, and not user-friendly, flexible sensor technology has emerged as a promising and dynamic practice to collect important health information at a comparatively low cost in a reliable and user-friendly way. This Review explores the importance and necessity of cardiovascular health monitoring while emphasizing the role of flexible pressure sensors in monitoring patients' health conditions to avoid adverse effects. A comprehensive discussion on the current research progress along with the real-time impact and accessibility of pressure sensors developed for cardiovascular health monitoring applications has been provided.
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Affiliation(s)
- Suvrajyoti Mishra
- School for Advanced Research in Petrochemicals: Laboratory for Advanced Research in Polymeric Materials (LARPM), Central Institute of Petrochemicals Engineering and Technology (CIPET), Bhubaneswar-751024, India
| | - Smita Mohanty
- School for Advanced Research in Petrochemicals: Laboratory for Advanced Research in Polymeric Materials (LARPM), Central Institute of Petrochemicals Engineering and Technology (CIPET), Bhubaneswar-751024, India
| | - Ananthakumar Ramadoss
- School for Advanced Research in Petrochemicals: Laboratory for Advanced Research in Polymeric Materials (LARPM), Central Institute of Petrochemicals Engineering and Technology (CIPET), Bhubaneswar-751024, India
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36
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Wang M, Wang K, Ma C, Uzabakiriho PC, Chen X, Zhao G. Mechanical Gradients Enable Highly Stretchable Electronics Based on Nanofiber Substrates. ACS APPLIED MATERIALS & INTERFACES 2022; 14:35997-36006. [PMID: 35894160 DOI: 10.1021/acsami.2c10245] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
Stretchable electronics play a pivotal role in the age of information and intelligence. Integrated circuit components are an integral part of high-performance and multifunctional stretchable electronic devices. Therefore, it is an ideal design concept for stretchable electronic devices to not only ensure the reliability of the connection between rigid inorganic electronic components and stretchable circuits but also maintain the stretchability of the device. In this work, we constructed a mechanical gradient strategy to fabricate high-performance stretchable electronic devices. Briefly, polyvinyl alcohol glue is used to fix integrated circuits on stretchable circuits, which are fabricated by printing liquid metal on a thermoplastic polyurethane nanofiber membrane. The strategy of integrated circuits (rigid)-polyvinyl alcohol glue (high elastic modulus)-thermoplastic polyurethane nanofiber membrane (low elastic modulus)-liquid metal (liquid) realizes the strain gradient during the stretching process of the device, thus ensuring the stability and reliability. Moreover, we explored the mechanism through experiments and finite element analysis. The flexible electronic devices fabricated by this scheme are not only ultra-stretchable (900%) but also have good stability and comfort. As proof, the application in stretchable sensors, human-computer interaction devices, and displays was realized.
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Affiliation(s)
- Meng Wang
- Department of Electronic Engineering and Information Science, University of Science and Technology of China, Hefei 230027, China
| | - Kai Wang
- Department of Electronic Engineering and Information Science, University of Science and Technology of China, Hefei 230027, China
| | - Chao Ma
- Department of Electronic Engineering and Information Science, University of Science and Technology of China, Hefei 230027, China
| | - Pierre Claver Uzabakiriho
- Department of Electronic Engineering and Information Science, University of Science and Technology of China, Hefei 230027, China
| | - Xi Chen
- College of Mathematics, Physics and Information Science and Engineering, Zhejiang Normal University, Jinhua 321004, China
| | - Gang Zhao
- Department of Electronic Engineering and Information Science, University of Science and Technology of China, Hefei 230027, China
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37
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Zhang W, Zhang R, Shi M, Ma L, Huang Y. Hierarchical polygon Co3O4 flakes/N,O-dual doped porous carbon frameworks for flexible hybrid supercapacitors. Electrochim Acta 2022. [DOI: 10.1016/j.electacta.2022.140631] [Citation(s) in RCA: 7] [Impact Index Per Article: 3.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/27/2022]
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38
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Jiang S, Liu J, Xiong W, Yang Z, Yin L, Li K, Huang Y. A Snakeskin-Inspired, Soft-Hinge Kirigami Metamaterial for Self-Adaptive Conformal Electronic Armor. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2204091. [PMID: 35680159 DOI: 10.1002/adma.202204091] [Citation(s) in RCA: 10] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/06/2022] [Revised: 06/03/2022] [Indexed: 06/15/2023]
Abstract
A majority of soft-body creatures evolve armor or shells to protect themselves. Similar protection demand is for flexible electronics working in complex environments. Existing works mainly focus on improving the sensing capabilities such as electronic skin (E-skin). Inspired by snakeskin, a novel electronic armor (E-armor) is proposed, which not only possesses mechanical flexibility and electronic functions similar to E-skin, but is also able to protect itself and the underlying soft body from external physical damage. The geometry of the kirigami mechanical metamaterial (Kiri-MM) ensures auxetic stretchability and meanwhile large areal coverage for sufficient protection. Moreover, to suppress the inherent but undesired out-of-plane buckling of conventional Kiri-MMs for conformal applications, soft hinges are used to form a distinct soft (hinges)-rigid (tiles) configuration. Analytical, computational, and experimental studies of the mechanical behaviors of the soft-hinge Kiri-MM E-armor demonstrate the merits of this design, i.e., stretchability, conformability, and protectability, as applied to flexible electronics. Deploying a conductive soft material at the hinges enables facile wiring strategies for large-scale circuit arrays. Functional E-armor systems for controllable display and sensing purposes provide simple examples of a wide spectrum of applications of this concept.
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Affiliation(s)
- Shan Jiang
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Jianpeng Liu
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Wennan Xiong
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Zhaoxi Yang
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Liting Yin
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Kan Li
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - YongAn Huang
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
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39
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Wang T, Liu Q, Liu H, Xu B, Xu H. Printable and Highly Stretchable Viscoelastic Conductors with Kinematically Reconstructed Conductive Pathways. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2202418. [PMID: 35523721 DOI: 10.1002/adma.202202418] [Citation(s) in RCA: 11] [Impact Index Per Article: 5.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/16/2022] [Revised: 04/19/2022] [Indexed: 06/14/2023]
Abstract
Printable and stretchable conductors based on metallic-filler-reinforced polymer composites that can maintain high electrical conductivity at large strains are essential for emerging applications in wearable electronics, soft robotics, and bio-integrated devices. Regulating microstructures of conductive fillers during mechanical deformations is the key to reconstructing the conductive pathway and retaining high electrical conductivity, which has proven to be challenging. Here, it is reported that Ag flakes can spontaneously reorganize inside a viscoelastic, liquid-like polymer matrix by cyclic mechanical stretching, resulting in reconstructed microstructures and forming highly efficient and stable conductive pathways. Consequently, the electrical conductivities of the resultant composites can be dramatically enhanced by ≈4-8 orders of magnitude and reach ≈104 S cm-1 . The stretch-induced kinematic movements of Ag flakes inside the polymer matrix, together with the reorganization and stabilization mechanisms, are unraveled and validated by the dissipative particle dynamics simulations. This unique phenomenon enables high-performance stretchable conductors to be fabricated with significantly reduced conductive fillers. The printable and stretchable composites presented here hold great promise for use in soft and stretchable electronics, as demonstrated in stretchable light-emitting diode arrays and wearable electronics.
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Affiliation(s)
- Tao Wang
- Department of Polymer Science and Engineering, University of Science and Technology of China, Hefei, Anhui, 230026, China
| | - Qingchang Liu
- Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA, 22904, USA
| | - Haitao Liu
- Center for Micro and Nanoscale Research and Fabrication, University of Science and Technology of China, Hefei, Anhui, 230026, China
| | - Baoxing Xu
- Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA, 22904, USA
| | - Hangxun Xu
- Department of Polymer Science and Engineering, University of Science and Technology of China, Hefei, Anhui, 230026, China
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40
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Stress concentration-relocating interposer in electronic textile packaging using thermoplastic elastic polyurethane film with via holes for bearing textile stretch. Sci Rep 2022; 12:9269. [PMID: 35660783 PMCID: PMC9166807 DOI: 10.1038/s41598-022-13493-7] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/04/2022] [Accepted: 05/25/2022] [Indexed: 11/08/2022] Open
Abstract
Electronic textile (e-textile) devices require mechanically reliable packaging that can bear up to 30% stretch induced by textile crimp stretch, because the boundary between the rigid electronic components and the soft fabric circuit in the e-textile is prone to rupture due to mismatch of their mechanical properties. Here, we describe a thin stress-concentration-relocating interposer that can sustain a textile stretch of up to 36%, which is greater than the 16% stretch of conventional packaging. The stress-concentration-relocating interposer consists of thin soft thermoplastic polyurethane film with soft via holes and is inserted between the electronic components and fabric circuit in order to move the area of stress concentration from the wiring area of the fabric circuit to the film. A finite element method (FEM) simulation showed that when the fabric is stretched by 30%, the boundary between the electrical components and the insulation layer is subjected to 90% strain and 2.5 MPa stress, whereas, at 30% strain, the boundary between the devices and the wiring is subjected to only 1.5 MPa stress, indicating that the concentration of stress in the wiring is reduced. Furthermore, it is shown that an optimal interposer structure that can bear a 30% stretch needs insulating polyurethane film in excess of 100 μm thick. Our thin soft interposer structure will enable LEDs and MEMS sensors to withstand stretching in several types of fabric.
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41
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Brooks AK, Chakravarty S, Ali M, Yadavalli VK. Kirigami-Inspired Biodesign for Applications in Healthcare. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2109550. [PMID: 35073433 DOI: 10.1002/adma.202109550] [Citation(s) in RCA: 16] [Impact Index Per Article: 8.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/23/2021] [Revised: 01/04/2022] [Indexed: 06/14/2023]
Abstract
Mechanically flexible and conformable materials and integrated devices have found diverse applications in personalized healthcare as diagnostics and therapeutics, tissue engineering and regenerative medicine constructs, surgical tools, secure systems, and assistive technologies. In order to impart optimal mechanical properties to the (bio)materials used in these applications, various strategies have been explored-from composites to structural engineering. In recent years, geometric cuts inspired by the art of paper-cutting, referred to as kirigami, have provided innovative opportunities for conferring precise mechanical properties via material removal. Kirigami-based approaches have been used for device design in areas ranging from soft bioelectronics to energy storage. In this review, the principles of kirigami-inspired engineering specifically for biomedical applications are discussed. Factors pertinent to their design, including cut geometry, materials, and fabrication, and the effect these parameters have on their properties and configurations are covered. Examples of kirigami designs in healthcare are presented, such as, various form factors of sensors (on skin, wearable), implantable devices, therapeutics, surgical procedures, and cellular scaffolds for regenerative medicine. Finally, the challenges and future scope for the successful translation of these biodesign concepts to broader deployment are discussed.
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Affiliation(s)
- Anne Katherine Brooks
- Department of Chemical and Life Science Engineering, Virginia Commonwealth University, Richmond, VA, 23284, USA
| | - Sudesna Chakravarty
- Department of Chemical and Life Science Engineering, Virginia Commonwealth University, Richmond, VA, 23284, USA
| | - Maryam Ali
- Department of Chemical and Life Science Engineering, Virginia Commonwealth University, Richmond, VA, 23284, USA
| | - Vamsi K Yadavalli
- Department of Chemical and Life Science Engineering, Virginia Commonwealth University, Richmond, VA, 23284, USA
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42
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Chen S, Wu Z, Chu C, Ni Y, Neisiany RE, You Z. Biodegradable Elastomers and Gels for Elastic Electronics. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2022; 9:e2105146. [PMID: 35212474 PMCID: PMC9069371 DOI: 10.1002/advs.202105146] [Citation(s) in RCA: 21] [Impact Index Per Article: 10.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/10/2021] [Revised: 01/05/2022] [Indexed: 05/30/2023]
Abstract
Biodegradable electronics are considered as an important bio-friendly solution for electronic waste (e-waste) management, sustainable development, and emerging implantable devices. Elastic electronics with higher imitative mechanical characteristics of human tissues, have become crucial for human-related applications. The convergence of biodegradability and elasticity has emerged a new paradigm of next-generation electronics especially for wearable and implantable electronics. The corresponding biodegradable elastic materials are recognized as a key to drive this field toward the practical applications. The review first clarifies the relevant concepts including biodegradable and elastic electronics along with their general design principles. Subsequently, the crucial mechanisms of the degradation in polymeric materials are discussed in depth. The diverse types of biodegradable elastomers and gels for electronics are then summarized. Their molecular design, modification, processing, and device fabrication especially the structure-properties relationship as well as recent advanced are reviewed in detail. Finally, the current challenges and the future directions are proposed. The critical insights of biodegradability and elastic characteristics in the elastomers and gel allows them to be tailored and designed more effectively for electronic applications.
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Affiliation(s)
- Shuo Chen
- State Key Laboratory for Modification of Chemical Fibers and Polymer MaterialsCollege of Materials Science and EngineeringInstitute of Functional MaterialsShanghai Engineering Research Center of Nano‐Biomaterials and Regenerative Medicine Institute of Functional MaterialsDonghua UniversityResearch Base of Textile Materials for Flexible Electronics and Biomedical Applications (China Textile Engineering Society)Shanghai201620P. R. China
| | - Zekai Wu
- State Key Laboratory for Modification of Chemical Fibers and Polymer MaterialsCollege of Materials Science and EngineeringInstitute of Functional MaterialsShanghai Engineering Research Center of Nano‐Biomaterials and Regenerative Medicine Institute of Functional MaterialsDonghua UniversityResearch Base of Textile Materials for Flexible Electronics and Biomedical Applications (China Textile Engineering Society)Shanghai201620P. R. China
| | - Chengzhen Chu
- State Key Laboratory for Modification of Chemical Fibers and Polymer MaterialsCollege of Materials Science and EngineeringInstitute of Functional MaterialsShanghai Engineering Research Center of Nano‐Biomaterials and Regenerative Medicine Institute of Functional MaterialsDonghua UniversityResearch Base of Textile Materials for Flexible Electronics and Biomedical Applications (China Textile Engineering Society)Shanghai201620P. R. China
| | - Yufeng Ni
- State Key Laboratory for Modification of Chemical Fibers and Polymer MaterialsCollege of Materials Science and EngineeringInstitute of Functional MaterialsShanghai Engineering Research Center of Nano‐Biomaterials and Regenerative Medicine Institute of Functional MaterialsDonghua UniversityResearch Base of Textile Materials for Flexible Electronics and Biomedical Applications (China Textile Engineering Society)Shanghai201620P. R. China
| | - Rasoul Esmaeely Neisiany
- Department of Materials and Polymer EngineeringFaculty of EngineeringHakim Sabzevari UniversitySabzevar9617976487Iran
| | - Zhengwei You
- State Key Laboratory for Modification of Chemical Fibers and Polymer MaterialsCollege of Materials Science and EngineeringInstitute of Functional MaterialsShanghai Engineering Research Center of Nano‐Biomaterials and Regenerative Medicine Institute of Functional MaterialsDonghua UniversityResearch Base of Textile Materials for Flexible Electronics and Biomedical Applications (China Textile Engineering Society)Shanghai201620P. R. China
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43
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Lan L, Ping J, Xiong J, Ying Y. Sustainable Natural Bio-Origin Materials for Future Flexible Devices. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2022; 9:e2200560. [PMID: 35322600 PMCID: PMC9130888 DOI: 10.1002/advs.202200560] [Citation(s) in RCA: 21] [Impact Index Per Article: 10.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/28/2022] [Revised: 02/27/2022] [Indexed: 05/12/2023]
Abstract
Flexible devices serve as important intelligent interfaces in various applications involving health monitoring, biomedical therapies, and human-machine interfacing. To address the concern of electronic waste caused by the increasing usage of electronic devices based on synthetic polymers, bio-origin materials that possess environmental benignity as well as sustainability offer new opportunities for constructing flexible electronic devices with higher safety and environmental adaptivity. Herein, the bio-source and unique molecular structures of various types of natural bio-origin materials are briefly introduced. Their properties and processing technologies are systematically summarized. Then, the recent progress of these materials for constructing emerging intelligent flexible electronic devices including energy harvesters, energy storage devices, and sensors are introduced. Furthermore, the applications of these flexible electronic devices including biomedical implants, artificial e-skin, and environmental monitoring are summarized. Finally, future challenges and prospects for developing high-performance bio-origin material-based flexible devices are discussed. This review aims to provide a comprehensive and systematic summary of the latest advances in the natural bio-origin material-based flexible devices, which is expected to offer inspirations for exploitation of green flexible electronics, bridging the gap in future human-machine-environment interactions.
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Affiliation(s)
- Lingyi Lan
- Laboratory of Agricultural Information Intelligent SensingSchool of Biosystems Engineering and Food ScienceZhejiang UniversityHangzhouZhejiang310058China
- Key Laboratory of Intelligent Equipment and Robotics for Agriculture of Zhejiang ProvinceHangzhouZhejiang310058China
| | - Jianfeng Ping
- Laboratory of Agricultural Information Intelligent SensingSchool of Biosystems Engineering and Food ScienceZhejiang UniversityHangzhouZhejiang310058China
- Key Laboratory of Intelligent Equipment and Robotics for Agriculture of Zhejiang ProvinceHangzhouZhejiang310058China
| | - Jiaqing Xiong
- Innovation Center for Textile Science and TechnologyDonghua University2999 North Renmin RoadShanghai201620China
| | - Yibin Ying
- Laboratory of Agricultural Information Intelligent SensingSchool of Biosystems Engineering and Food ScienceZhejiang UniversityHangzhouZhejiang310058China
- Key Laboratory of Intelligent Equipment and Robotics for Agriculture of Zhejiang ProvinceHangzhouZhejiang310058China
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44
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Li K, Shuai Y, Cheng X, Luan H, Liu S, Yang C, Xue Z, Huang Y, Zhang Y. Island Effect in Stretchable Inorganic Electronics. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2022; 18:e2107879. [PMID: 35307953 DOI: 10.1002/smll.202107879] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/19/2021] [Revised: 02/28/2022] [Indexed: 06/14/2023]
Abstract
Island-bridge architectures represent a widely used structural design in stretchable inorganic electronics, where deformable interconnects that form the bridge provide system stretchability, and functional components that reside on the islands undergo negligible deformations. These device systems usually experience a common strain concentration phenomenon, i.e., "island effect", because of the modulus mismatch between the soft elastomer substrate and its on-top rigid components. Such an island effect can significantly raise the surrounding local strain, therefore increasing the risk of material failure for the interconnects in the vicinity of the islands. In this work, a systematic study of such an island effect through combined theoretical analysis, numerical simulations and experimental measurements is presented. To relieve the island effect, a buffer layer strategy is proposed as a generic route to enhanced stretchabilities of deformable interconnects. Both experimental and numerical results illustrate the applicability of this strategy to 2D serpentine and 3D helical interconnects, as evidenced by the increased stretchabilities (e.g., by 1.5 times with a simple buffer layer, and 2 times with a ring buffer layer, both for serpentine interconnects). The application of the patterned buffer layer strategy in a stretchable light emitting diodes system suggests promising potentials for uses in other functional device systems.
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Affiliation(s)
- Kan Li
- State Key Laboratory of Digital Manufacture Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
| | - Yumeng Shuai
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Xu Cheng
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Haiwen Luan
- Departments of Mechanical Engineering, Civil and Environmental Engineering, and Materials Science and Engineering and Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Siyi Liu
- Center for Mechanics of Solids, Structures and Materials, Department of Aerospace Engineering and Engineering Mechanics, University of Texas at Austin, Austin, TX, 78712, USA
| | - Ce Yang
- Department of Mechanical Engineering, Tsinghua University, Beijing, 100084, P. R. China
| | - Zhaoguo Xue
- Institute of Solid Mechanics, Beihang University (BUAA), Beijing, 100191, P. R. China
| | - Yonggang Huang
- Departments of Mechanical Engineering, Civil and Environmental Engineering, and Materials Science and Engineering and Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Yihui Zhang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
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45
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Flexible Sensory Systems: Structural Approaches. Polymers (Basel) 2022; 14:polym14061232. [PMID: 35335562 PMCID: PMC8955130 DOI: 10.3390/polym14061232] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/25/2022] [Revised: 03/14/2022] [Accepted: 03/14/2022] [Indexed: 11/25/2022] Open
Abstract
Biology is characterized by smooth, elastic, and nonplanar surfaces; as a consequence, soft electronics that enable interfacing with nonplanar surfaces allow applications that could not be achieved with the rigid and integrated circuits that exist today. Here, we review the latest examples of technologies and methods that can replace elasticity through a structural approach; these approaches can modify mechanical properties, thereby improving performance, while maintaining the existing material integrity. Furthermore, an overview of the recent progress in wave/wrinkle, stretchable interconnect, origami/kirigami, crack, nano/micro, and textile structures is provided. Finally, potential applications and expected developments in soft electronics are discussed.
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46
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Song H, Luo G, Ji Z, Bo R, Xue Z, Yan D, Zhang F, Bai K, Liu J, Cheng X, Pang W, Shen Z, Zhang Y. Highly-integrated, miniaturized, stretchable electronic systems based on stacked multilayer network materials. SCIENCE ADVANCES 2022; 8:eabm3785. [PMID: 35294232 PMCID: PMC8926335 DOI: 10.1126/sciadv.abm3785] [Citation(s) in RCA: 47] [Impact Index Per Article: 23.5] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/07/2023]
Abstract
Elastic stretchability and function density represent two key figures of merits for stretchable inorganic electronics. Various design strategies have been reported to provide both high levels of stretchability and function density, but the function densities are mostly below 80%. While the stacked device layout can overcome this limitation, the soft elastomers used in previous studies could highly restrict the deformation of stretchable interconnects. Here, we introduce stacked multilayer network materials as a general platform to incorporate individual components and stretchable interconnects, without posing any essential constraint to their deformations. Quantitative analyses show a substantial enhancement (e.g., by ~7.5 times) of elastic stretchability of serpentine interconnects as compared to that based on stacked soft elastomers. The proposed strategy allows demonstration of a miniaturized electronic system (11 mm by 10 mm), with a moderate elastic stretchability (~20%) and an unprecedented areal coverage (~110%), which can serve as compass display, somatosensory mouse, and physiological-signal monitor.
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Affiliation(s)
- Honglie Song
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Guoquan Luo
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
- National Key Laboratory of Science and Technology on Advanced Composite in Special Environments, Harbin Institute of Technology, Harbin 150080, P. R. China
| | - Ziyao Ji
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Renheng Bo
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Zhaoguo Xue
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Dongjia Yan
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Fan Zhang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Ke Bai
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Jianxing Liu
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Xu Cheng
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Wenbo Pang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Zhangming Shen
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Yihui Zhang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
- Corresponding author.
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47
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Yu S, Guo Y, Li H, Lu C, Zhou H, Li L. Tailoring Ordered Wrinkle Arrays for Tunable Surface Performances by Template-Modulated Gradient Films. ACS APPLIED MATERIALS & INTERFACES 2022; 14:11989-11998. [PMID: 35192316 DOI: 10.1021/acsami.2c00926] [Citation(s) in RCA: 9] [Impact Index Per Article: 4.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/14/2023]
Abstract
Complex wrinkled microstructures are ubiquitous in natural systems and living bodies. Although homogeneous wrinkles in film-substrate bilayers have been extensively investigated in the past 2 decades, tailoring heterogeneous wrinkles by a facile method is still a challenge. Here, we report on the controllable heterogeneous wrinkles in template-modulated thickness-gradient metal films sputter-deposited on polydimethylsiloxane substrates. It is found that the stress of the gradient film is strongly position-dependent and the wrinkles are always restricted in thinner film regions. The morphological characteristic and formation mechanism of the heterogeneous wrinkles are analyzed and discussed in detail based on the stress theory. Ordered wrinkle arrays are achieved by adjusting the deposition time, copper grid period, template shape, and lifting height. The surface performances (e.g., the friction property) are well controlled by the wrinkle arrays. This work could promote better understanding of the spontaneously heterogeneous wrinkles in template-modulated gradient films and controllable fabrication of various wrinkle arrays by independently tuning film deposition conditions and template parameters.
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Affiliation(s)
- Senjiang Yu
- Key Laboratory of Novel Materials for Sensor of Zhejiang Province, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou 310018, P. R. China
| | - Yongjie Guo
- Key Laboratory of Novel Materials for Sensor of Zhejiang Province, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou 310018, P. R. China
| | - Huihua Li
- Key Laboratory of Novel Materials for Sensor of Zhejiang Province, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou 310018, P. R. China
| | - Chenxi Lu
- Key Laboratory of Novel Materials for Sensor of Zhejiang Province, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou 310018, P. R. China
| | - Hong Zhou
- Department of Physics, China Jiliang University, Hangzhou 310018, P. R. China
| | - Lingwei Li
- Key Laboratory of Novel Materials for Sensor of Zhejiang Province, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou 310018, P. R. China
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48
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Digital synthesis of free-form multimaterial structures for realization of arbitrary programmed mechanical responses. Proc Natl Acad Sci U S A 2022; 119:e2120563119. [PMID: 35235446 PMCID: PMC8915977 DOI: 10.1073/pnas.2120563119] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/18/2023] Open
Abstract
SignificanceCreating structures to realize function-oriented mechanical responses is desired for many applications. Yet, the use of a single material phase and heuristics-based designs may fail to attain specific target behaviors. Here, through a deterministic algorithmic procedure, multiple materials with dissimilar properties are intelligently synthesized into composite structures to achieve arbitrary prescribed responses. Created structures possess unconventional geometry and seamless integration of multiple materials. Despite geometric complexity and varied material phases, these structures are fabricated by multimaterial manufacturing, and tested to demonstrate that wide-ranging nonlinear responses are physically and accurately realized. Upon heteroassembly, resulting structures provide architectures that exhibit highly complex yet navigable responses. The proposed strategy can benefit the design of function-oriented nonlinear mechanical devices, such as actuators and energy absorbers.
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49
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Wang T, Cui Z, Liu Y, Lu D, Wang M, Wan C, Leow WR, Wang C, Pan L, Cao X, Huang Y, Liu Z, Tok AIY, Chen X. Mechanically Durable Memristor Arrays Based on a Discrete Structure Design. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2106212. [PMID: 34738253 DOI: 10.1002/adma.202106212] [Citation(s) in RCA: 11] [Impact Index Per Article: 5.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/09/2021] [Revised: 10/19/2021] [Indexed: 06/13/2023]
Abstract
Memristors constitute a promising functional component for information storage and in-memory computing in flexible and stretchable electronics including wearable devices, prosthetics, and soft robotics. Despite tremendous efforts made to adapt conventional rigid memristors to flexible and stretchable scenarios, stretchable and mechanical-damage-endurable memristors, which are critical for maintaining reliable functions under unexpected mechanical attack, have never been achieved. Here, the development of stretchable memristors with mechanical damage endurance based on a discrete structure design is reported. The memristors possess large stretchability (40%) and excellent deformability (half-fold), and retain stable performances under dynamic stretching and releasing. It is shown that the memristors maintain reliable functions and preserve information after extreme mechanical damage, including puncture (up to 100 times) and serious tearing situations (fully diagonally cut). The structural strategy offers new opportunities for next-generation stretchable memristors with mechanical damage endurance, which is vital to achieve reliable functions for flexible and stretchable electronics even in extreme and highly dynamic environments.
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Affiliation(s)
- Ting Wang
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Zequn Cui
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Yaqing Liu
- Key Laboratory of Colloid and Interface Chemistry of the Ministry of Education, School of Chemistry and Chemical Engineering, Shandong University, Jinan, Shandong, 250100, China
| | - Dingjie Lu
- Institute of High Performance Computing, Agency for Science Technology and Research, 1 Fusionopolis Way, Singapore, 138632, Singapore
| | - Ming Wang
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Changjin Wan
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Wan Ru Leow
- Institute of Materials Research and Engineering (IMRE), Agency for Science Technology and Research, 2 Fusionopolis Way, Innovis, #08-03, Singapore, 138634, Singapore
| | - Changxian Wang
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Liang Pan
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Xun Cao
- School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Yizhong Huang
- School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Zhuangjian Liu
- Institute of High Performance Computing, Agency for Science Technology and Research, 1 Fusionopolis Way, Singapore, 138632, Singapore
| | - Alfred Iing Yoong Tok
- School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Xiaodong Chen
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
- Institute of Materials Research and Engineering (IMRE), Agency for Science Technology and Research, 2 Fusionopolis Way, Innovis, #08-03, Singapore, 138634, Singapore
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Wang Y, Wang G, Li X, Yin J, Zhu J. Research Progress of Flexible Piezoresistive Sensors Prepared by Solution-Based Processing. ACTA CHIMICA SINICA 2022. [DOI: 10.6023/a21080414] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/24/2022]
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