Thermally Conductive but Electrically Insulating Polybenzazole Nanofiber/Boron Nitride Nanosheets Nanocomposite Paper for Heat Dissipation of 5G Base Stations and Transformers

Thermally Conductive Polydimethylsiloxane-Based Composite with a Three-Dimensional Vertically Aligned Thermal Network Incorporating Hexagonal Boron Nitride Nanosheets and Nanodiamonds

Thermal interface materials play a pivotal role in efficiently transferring heat from heating devices to thermal management components, thereby reducing the risk of component degradation due to overheating. In this study, we propose a strategy for enhancing the out-of-plane thermal conductivity (TC) of composite materials by fabricating a three-dimensional (3D) thermal network within a polydimethylsiloxane (PDMS) matrix. Specifically, the composite material was designed to incorporate a dense thermal network comprising hexagonal boron nitride nanosheets (BNNSs) and nanodiamonds (NDs). The fabrication process commenced with the preparation of BNNSs through liquid-phase exfoliation, followed by the creation of a 3D BNNSs-NDs/polyimide aerogel thermal framework using a unidirectional solidification ice templating method and subsequent heat treatment. Vacuum impregnation and curing were then employed to finalize the production of the 3D BNNSs-NDs/PDMS composite material. Characterization analyses indicated that the addition of NDs filled the voids between BNNSs, leading to the densification of the thermal framework pore walls and the establishment of additional thermal pathways. Impressively, with concentrations of BNNSs and NDs of 17.99 and 7.71 wt %, respectively, the out-of-plane TC of the 3D BNNSs-NDs/PDMS composite material reached 1.623 W m-1 K-1, marking notable enhancements of 754.21% and 256.70% compared to those of pure PDMS and composites prepared via direct blending with randomly distributed BNNSs and NDs, respectively. Furthermore, the 3D BNNSs-NDs thermal framework improved the compressive strength and the dimensional stability of the composite material. Finite element simulations additionally confirmed the synergistic improvement of the TC achieved through the combination of BNNSs and NDs, demonstrating that the 3D BNNSs-NDs/PDMS composite material displayed superior heat conduction and a greater density of thermal pathways compared to those of its counterparts, including 3D BNNSs/PDMS and 3D NDs/PDMS composite materials. In summary, this work presents a strategy for enhancing the out-of-plane TC of polymer-based composite materials by incorporating vertically aligned thermal networks.

Natural Deep Eutectic Solvent-Assisted Construction of Silk Nanofibrils/Boron Nitride Nanosheets Membranes with Enhanced Heat-Dissipating Efficiency

Natural polymer-derived nanofibrils have gained significant interest in diverse fields. However, production of bio-nanofibrils with the hierarchical structures such as fibrillar structures and crystalline features remains a great challenge. Herein, an all-natural strategy for simple, green, and scalable top-down exfoliation silk nanofibrils (SNFs) in novel renewable deep eutectic solvent (DES) composed by amino acids and D-sorbitol is innovatively developed. The DES-exfoliated SNFs with a controllable fibrillar structures and intact crystalline features, novelty preserving the hierarchical structure of natural silk fibers. Owing to the amphiphilic nature, the DES-exfoliated SNFs show excellent capacity of assisting the exfoliation of several 2D-layered materials, i.e., h-BN, MoS2, and WS2. More importantly, the SNFs-assisted dispersion of BNNSs with a concentration of 59.3% can be employed to construct SNFs/BNNSs nanocomposite membranes with excellent mechanical properties (tensile strength of 416.7 MPa, tensile modulus of 3.86 GPa and toughness of 1295.4 KJ·m-3) and thermal conductivity (in-plane thermal conductivity coefficient of 3.84 W·m-1·K-1), enabling it to possess superior cooling efficiency compared with the commercial silicone pad.

Highly oriented BN-based TIMs with high through-plane thermal conductivity and low compression modulus

In the pursuit of effective thermal management for electronic devices, it is crucial to develop insulation thermal interface materials (TIMs) that exhibit exceptional through-plane thermal conductivity, low thermal resistance, and minimal compression modulus. Boron nitride (BN), given its outstanding thermal conduction and insulation properties, has garnered significant attention as a potential material for this purpose. However, previously reported BN-based composites have consistently demonstrated through-plane thermal conductivity below 10 W m-1 K-1 and high compression modulus, whilst also presenting challenges in terms of mass production. In this study, low molecular weight polydimethylsiloxane (PDMS) and large-size BN were utilized as the foundational materials. Utilizing a rolling-curing integrated apparatus, we successfully accomplished the continuous preparation of large-sized, high-adhesion BN films. Subsequent implementation of stacking, cold pressing, and vertical cutting techniques enabled the attainment of a remarkable BN-based TIM, characterized by an unprecedented through-plane thermal conductivity of up to 12.11 W m-1 K-1, remarkably low compression modulus (55 kPa), and total effective thermal resistance (0.16 °C in2 W-1, 50 Psi). During the TIMs performance evaluation, our TIMs demonstrated superior heat dissipation capabilities compared with commercial TIMs. At a heating power density of 40 W cm-2, the steady-state temperature of the ceramic heating element was found to be 7 °C lower than that of the commercial TIMs. This pioneering feat not only contributes valuable technical insights for the development of high-performance insulating TIMs but also establishes a solid foundation for widespread implementation in thermal management applications across a range of electronic devices.

Soft and Damping Thermal Interface Materials with Honeycomb-Board-Mimetic Filler Network for Electronic Heat Dissipation

High-power-density electronic devices under vibrations call for soft and damping thermal interface materials (TIMs) for efficient heat dissipation. However, integrating low hardness, high damping, and superior heat transfer capability into one TIM is highly challenging. Herein, soft, damping, and thermally conductive TIMs are designed and prepared by constructing a honeycomb-board-mimetic boron nitride nanosheet (BNNS) network in a dynamic polyimine via one-step horizontal centrifugal casting. The unique filler network makes the TIMs perform a high through-plane thermal conductivity (> 7.69 W m-1 K-1) and a uniform heat transfer process. Meanwhile, the hierarchical dynamic bonding of the polyimine endows the TIMs with low compressive strength (2.16 MPa at 20% strain) and excellent damping performance (tan δ > ≈0.3 at 10-2-102 Hz). The resulting TIMs also exhibit electrical insulation and remarkable recycling ability. Compared with the commercial ones, the TIMs provide better heat dissipation (4.1 °C) for a high-power 5G base station and less temperature fluctuation (1.8 °C) for an automotive insulated gate bipolar transistor (IGBT) under vibrations. This rational design offers a viable approach to prepare soft and damping TIMs for effective heat dissipation of high-power-density electronic devices under vibrations.

Polymeric Nanocomposites of Boron Nitride Nanosheets for Enhanced Directional or Isotropic Thermal Transport Performance

Polymeric composites with boron nitride nanosheets (BNNs), which are thermally conductive yet electrically insulating, have been pursued for a variety of technological applications, especially those for thermal management in electronic devices and systems. Highlighted in this review are recent advances in the effort to improve in-plane thermal transport performance in polymer/BNNs composites and also the growing research activities aimed at composites of enhanced cross-plane or isotropic thermal conductivity, for which various filler alignment strategies during composite fabrication have been explored. Also highlighted and discussed are some significant challenges and major opportunities for further advances in the development of thermally conductive composite materials and their mechanistic understandings.

Constructing Heterostructured MWCNT-BN Hybrid Fillers in Electrospun TPU Films to Achieve Superior Thermal Conductivity and Electrical Insulation Properties

The development of thermally conductive polymer/boron nitride (BN) composites with excellent electrically insulating properties is urgently demanded for electronic devices. However, the method of constructing an efficient thermally conductive network is still challenging. In the present work, heterostructured multi-walled carbon nanotube-boron nitride (MWCNT-BN) hybrids were easily prepared using an electrostatic self-assembly method. The thermally conductive network of the MWCNT-BN in the thermoplastic polyurethane (TPU) matrix was achieved by the electrospinning and stack-molding process. As a result, the in-plane thermal conductivity of TPU composite films reached 7.28 W m-1 K-1, an increase of 959.4% compared to pure TPU films. In addition, the Foygel model showed that the MWCNT-BN hybrid filler could largely decrease thermal resistance compared to that of BN filler and further reduce phonon scattering. Finally, the excellent electrically insulating properties (about 1012 Ω·cm) and superior flexibility of composite film make it a promising material in electronic equipment. This work offers a new idea for designing BN-based hybrids, which have broad prospects in preparing thermally conductive composites for further practical thermal management fields.

Guidelines derived from biomineralized tissues for design and construction of high-performance biomimetic materials: from weak to strong

Living organisms in nature have undergone continuous evolution over billions of years, resulting in the formation of high-performance fracture-resistant biomineralized tissues such as bones and teeth to fulfill mechanical and biological functions, despite the fact that most inorganic biominerals that constitute biomineralized tissues are weak and brittle. During the long-period evolution process, nature has evolved a number of highly effective and smart strategies to design chemical compositions and structures of biomineralized tissues to enable superior properties and to adapt to surrounding environments. Most biomineralized tissues have hierarchically ordered structures consisting of very small building blocks on the nanometer scale (nanoparticles, nanofibers or nanoflakes) to reduce the inherent weaknesses and brittleness of corresponding inorganic biominerals, to prevent crack initiation and propagation, and to allow high defect tolerance. The bioinspired principles derived from biomineralized tissues are indispensable for designing and constructing high-performance biomimetic materials. In recent years, a large number of high-performance biomimetic materials have been prepared based on these bioinspired principles with a large volume of literature covering this topic. Therefore, a timely and comprehensive review on this hot topic is highly important and contributes to the future development of this rapidly evolving research field. This review article aims to be comprehensive, authoritative, and critical with wide general interest to the science community, summarizing recent advances in revealing the formation processes, composition, and structures of biomineralized tissues, providing in-depth insights into guidelines derived from biomineralized tissues for the design and construction of high-performance biomimetic materials, and discussing recent progress, current research trends, key problems, future main research directions and challenges, and future perspectives in this exciting and rapidly evolving research field.

Application-Driven High-Thermal-Conductivity Polymer Nanocomposites

Polymer nanocomposites combine the merits of polymer matrices and the unusual effects of nanoscale reinforcements and have been recognized as important members of the material family. Being a fundamental material property, thermal conductivity directly affects the molding and processing of materials as well as the design and performance of devices and systems. Polymer nanocomposites have been used in numerous industrial fields; thus, high demands are placed on the thermal conductivity feature of polymer nanocomposites. In this Perspective, we first provide roadmaps for the development of polymer nanocomposites with isotropic, in-plane, and through-plane high thermal conductivities, demonstrating the great effect of nanoscale reinforcements on thermal conductivity enhancement of polymer nanocomposites. Then the significance of the thermal conductivity of polymer nanocomposites in different application fields, including wearable electronics, thermal interface materials, battery thermal management, dielectric capacitors, electrical equipment, solar thermal energy storage, biomedical applications, carbon dioxide capture, and radiative cooling, are highlighted. In future research, we should continue to focus on methods that can further improve the thermal conductivity of polymer nanocomposites. On the other hand, we should pay more attention to the synergistic improvement of the thermal conductivity and other properties of polymer nanocomposites. Emerging polymer nanocomposites with high thermal conductivity should be based on application-oriented research.

Robust and Flame-Retardant Zylon Aerogel Fibers for Wearable Thermal Insulation and Sensing in Harsh Environment

The exceptional lightweight, highly porous, and insulating properties of aerogel fibers make them ideal for thermal insulation. However, current aerogel fibers face limitations due to their low resistance to harsh environments and a lack of intelligent responses. Herein, a universal strategy for creating polymer aerogel fibers using crosslinked nanofiber building blocks is proposed. This approach combines controlled proton absorption gelation spinning with a heat-induced crosslinking process. As a proof-of-concept, Zylon aerogel fibers that exhibited robust thermal stability (up to 650 °C), high flame retardancy (limiting oxygen index of 54.2%), and extreme chemical resistance are designed and synthesized. These fibers possess high porosity (98.6%), high breaking strength (8.6 MPa), and low thermal conductivity (0.036 W m-1 K-1 ). These aerogel fibers can be knotted or woven into textiles, utilized in harsh environments (-196-400 °C), and demonstrate sensitive self-powered sensing capabilities. This method of developing aerogel fibers expands the applications of high-performance polymer fibers and holds great potential for future applications in wearable smart protective fabrics.

Trans-scale interface engineering: Constructing nature-inspired spider-web networks for regulating thermal transport and mechanical performance of carbon fiber/phenolic composites

The development of interfacial engineering was crucial for achieving the industrialization of high-performance carbon fiber/phenolic composites. In this study, establishing scalable interpenetrating networks (cellulose nanofiber-zeolitic imidazolate frameworks-8/aramid nanofiber-boron nitride) on the fiber/matrix interphase, was in favor of realizing precise repairation of interfacial defects, further regulating thermal conductivity, mechanical and tribological properties of the composites. Based on the physical and chemical bridging-effects arising from above spider-web networks, the flexural strength and modulus of modified sample were 74.69 MPa and 6.22 GPa, showing an increase of 135.99% and 56.68%, respectively. Meanwhile, this trans-scale spider-web structure acted as a micron skeleton-nano unit continuous thermal conductive network, significantly reduced phonon scattering and displayed a 258.33% enhancement in the thermal management capability of modified sample. This study reveals key design principles of trans-scale interfacial structure to dynamicly regulate performances and meet service requirements of next-generation carbon fiber/phenolic composites.

High-Performance Graphene Biocomposite Enabled by Fe3+ Coordination for Thermal Management

Emerging biocomposites with excellent heat dissipation capabilities and inherent sustainability are urgently needed to address the cooling issues of modern electronics and growing environmental concerns. However, the moisture stability, mechanical performance, thermal conductivity, and even flame retardancy of biomass-based materials are generally insufficient for practical thermal management applications. Herein, we present a high-performance graphene biocomposite consisting of carboxylated cellulose nanofibers and graphene nanosheets through an evaporation-induced self-assembly and subsequent Fe3+ cross-linking strategy. The Fe3+ coordination plays a critical role in stabilizing the material structure, thereby improving the mechanical strength and water stability of the biocomposite films, and its effect is revealed by density functional theory calculations. The hierarchical structure of the biocomposite films also leads to a high in-plane thermal conductivity of 42.5 W m-1 K-1, enabling a superior heat transfer performance. Furthermore, the resultant biocomposite films exhibit outstanding Joule heating performance with a fast thermal response and long-term stability, improved thermal stability, and flame retardancy. Therefore, such a general strategy and the desired overall properties of the biocomposite films offer wide application prospects for functional and safe thermal management.

Superior high-temperature capacitive performance of polyaryl ether ketone copolymer composites enabled by interfacial engineered charge traps

Metalized film capacitors with high-temperature capacitive performance are crucial components in contemporary electromagnetic energy systems. However, the fabrication of polymer-based dielectric composites with designed structures faces the challenge of balancing high energy density (Ue) and low energy loss induced by electric field distortion at the interfaces. Here, BN nanoparticles coated with a thin layer of aminobenzoic acid (ABA) voltage stabilizer are introduced into a copolymer of aryletherketone and 2,6-bis(2-benzimidazolyl)pyridine (P(AEK-BBP)). Our results demonstrate that the ABA voltage stabilizer, possessing high electron affinity, significantly improves the dispersion of BN particles within the matrix, mitigates electric field distortion, and creates effective charge traps. This, in turn, effectively suppresses high-temperature-induced Schottky emission and P-F emission, leading to a dramatic decrease in leakage loss. As a result, the optimized composite film, filled with 0.3 vol% m-ABA-BN particles, exhibites a Ue of 10.1 J cm-3 and a η of 90% at 150 °C and 600 MV m-1, surpassing the majority of previously reported materials. Furthermore, even after undergoing 100 000 cycles at 150 °C and 250 MV m-1, the composite dielectric films demonstrate favorable charge-discharge characteristics. This work offers a novel approach to fabricate polymer-based dielectric materials with high-temperature resistance and high discharging efficiency for long-term high energy storage applications.

Self-standing boron nitride bulks enabled by liquid metals for thermal management

Thermally conductive materials (TCMs) are highly desirable for thermal management applications to tackle the "overheating" concerns in the electronics industry. Despite recent progress, the development of high performance TCMs integrated with an in-plane thermal conductivity (TC) higher than 50.0 W (m K)-1 and a through-plane TC greater than 10.0 W (m K)-1 is still challenging. Herein, self-standing liquid metal@boron nitride (LM@BN) bulks with ultrahigh in-plane TC and through-plane TC were reported for the first time. In the LM@BN bulks, LM could serve as a bonding and thermal linker among the oriented BN platelets, thus remarkably accelerating heat transfer across the whole system. Benefiting from the formation of a unique structure, the LM@BN bulk achieved an ultrahigh in-plane TC of 82.2 W (m K)-1 and a through-plane TC of 20.6 W (m K)-1, which were among the highest values ever reported for TCMs. Furthermore, the LM@BN bulks exhibited superior compressive and leakage-free performances, with a high compressive strength (5.2 MPa) and without any LM leakage even after being crushed. It was also demonstrated that the excellent TCs of the LM@BN bulks made them effectively cool high-power light emitting diode modules. This work opens up one promising pathway for the development of high-performance TCMs for thermal management in the electronics industry.

The Synergistic Effects between Liquid Crystal and Crystalline Phase on Photo-Responsive Elastomers toward Quick Photo-Responsive Performance

Adopting only a small amount of azobenzene molecular to design liquid crystal photo-responsive materials capable of quick response and flexible adjustability is in high demand but is challenging. Herein, azobenzenemolecules into polyurethane elastomer containing crystalline structure for preparing azobenzene liquid-crystal elastomers (ALCEs) are demonstrated and this phenomenon of the synergistic effects between liquid crystal and crystalline phase is discovered. The key point of the work is that the synthetic ALCEs can utilize the reversible isomerism capability of azobenzene molecules under light irradiation, which can pry the motion of the macromolecular crystalline region in system to realize the large macroscopic deformation of the photo-responsive behavior. Obviously, the ALCEs sample containing azobenzene molecule and polyethylene glycol crystallization can quickly bend, illuminated by ultraviolet light and rapidly straighten under green light. Under the same ultraviolet irradiation, the bending speed, final bending angle, recovery rate and recovery ratio of ALCEs are larger than that of ALCEs without any crystalline structure. This ALCEs based on the synergistic effects between liquid crystal and crystalline phase can break through the current dilemma that the application of traditional azobenzene photo-responsive materials is limited by their concentration, greatly expanding the design thought and their scope of application.

Effect of Nanoscale in Situ Interface Welding on the Macroscale Thermal Conductivity of Insulating Epoxy Composites: A Multiscale Simulation Investigation

Insulating thermally conductive polymer composites are in great demand in integrated-circuit packages, for efficient heat dissipation and to alleviative short-circuit risk. Herein, the continuous oriented hexagonal boron nitride (h-BN) frameworks (o-BN@SiC) were prepared via self-assembly and in situ chemical vapor infiltration (CVI) interface welding. The insulating o-BN@SiC/epoxy (o-BN@SiC/EP) composites exhibited enhanced thermal conductivity benefited from the CVI-SiC-welded BN-BN interface. Further, multiscale simulation, combining first-principles calculation, Monte Carlo simulation, and finite-element simulation, was performed to quantitatively reveal the effect of the welded BN-BN interface on the heat transfer of o-BN@SiC/EP composites. Phonon transmission in solders and phonon-phonon coupling of filler-solder interfaces enhanced the interfacial heat transfer between adjacent h-BN microplatelets, and the interfacial thermal resistance of the dominant BN-BN interface was decreased to only 3.83 nK·m2/W from 400 nK·m2/W, plunging by over 99%. This highly weakened interfacial thermal resistance greatly improved the heat transfer along thermal pathways and resulted in a 26% thermal conductivity enhancement of o-BN@SiC/EP composites, compared with physically contacted oriented h-BN/EP composites, at 15 vol % h-BN. This systematic multiscale simulation broke through the barrier of revealing the heat transfer mechanism of polymer composites from the nanoscale to the macroscale, which provided rational cognition about the effect of the interfacial thermal resistance between fillers on the thermal conductivity of polymer composites.

Preparation of Strong and Thermally Conductive, Spider Silk-Inspired, Soybean Protein-Based Adhesive for Thermally Conductive Wood-Based Composites

The development of formaldehyde-free functional wood composite materials through the preparation of strong and multifunctional soybean protein adhesives to replace formaldehyde-based resins is an important research area. However, ensuring the bonding performance of soybean protein adhesive while simultaneously developing thermally conductive adhesive and its corresponding wood composites is challenging. Taking inspiration from the microphase separation structure of spider silk, boron nitride (BN) and soy protein isolate (SPI) were mixed by ball milling to obtain a BN@SPI matrix and combined with the self-synthesized hyperbranched reactive substrates as amorphous region reinforcer and cross-linker triglycidylamine to prepare strong and thermally conductive soybean protein adhesive with cross-linked microphase separation structure. These findings indicate that mechanical ball milling can be employed to strip BN followed by combination with SPI, resulting in a tight bonded interface connection. Subsequently, the adhesive's dry and wet shear strengths increased by 14.3% and 90.5% to 1.83 and 1.05 MPa, respectively. The resultant adhesive also possesses a good thermal conductivity (0.363 W/mK). Impressively, because hot-pressing helps the resultant adhesive to establish a thermal conduction pathway, the thermal conductivity of the resulting wood-based composite is 10 times higher than that of the SPI adhesive, which shows a thermal conductivity similar to that of ceramic tile and has excellent potential for developing biothermal conductivity materials, geothermal floors, and energy storage materials. Moreover, the adhesive possessed effective flame retardancy (limit oxygen index = 36.5%) and mildew resistance (>50 days). This bionic design represents an efficient technique for developing multifunctional biomass adhesives and composites.

A synergistic interfacial and topological strategy for reinforcing aramid nanofiber films

While nanomaterials possess impressive mechanical properties at the microscale level, their macroscopic assemblies usually exhibit inferior properties due to ineffective stress transfer among individual nanomaterials. This issue is addressed in this work by achieving strong interfacial interactions between aramid nanofibers and graphene oxide nanosheets through a neutralization reaction in a dipolar solvent and regulating the topological properties using polymer micelles to form a compact structure, leading to the formation of a super-strong and super-tough nanofiber film. The film was prepared through a sol-gel-film transition process and possesses a nacre-like microstructure that deflects microcracks and prevents them from propagating straight through the film. Remarkably, it demonstrates a tensile strength of 599.0 MPa and a toughness of 37.7 MJ m-3, which are 491.0% and 1094.5% that of a pristine aramid nanofiber film, respectively. In addition, it exhibits excellent tolerance to extreme temperatures (-196 to 300 °C) and fatigue resistance to folding 10 000 times. Overall, this study presents a synergistic interfacial and topological enhancement strategy for constructing nanomaterial-based composites with inherited properties from the nanoscale building blocks to the macroscale structural material.

Nanobrick Wall Multilayer Thin Films with High Dielectric Breakdown Strength

Current thermally conductive and electrically insulating insulation systems are struggling to meet the needs of modern electronics due to increasing heat generation and power densities. Little research has focused on creating insulation systems that excel at both dissipating heat and withstanding high voltages (i.e., have both high thermal conductivity and a high breakdown strength). Herein, a polyelectrolyte-based multilayer nanocomposite is demonstrated to be a thermally conductive high-voltage insulation. Through inclusion of both boehmite and vermiculite clay, the breakdown strength of the nanocomposite was increased by ≈115%. It was also found that this unique nanocomposite has an increase in its breakdown strength, modulus, and hydrophobicity when exposed to elevated temperatures. This readily scalable insulation exhibits a remarkable combination of breakdown strength (250 kV/mm) and thermal conductivity (0.16 W m-1 K-1) for a polyelectrolyte-based nanocomposite. This dual clay insulation is a step toward meeting the needs of the next generation of high-performance insulation systems.

Constructing Hierarchical Polymer Nanocomposites with Strongly Enhanced Thermal Conductivity

The rapid advancement of communication technology has substantially increased the demand for advanced electronic packaging materials with high thermal conductivity and outstanding electrical insulation properties. In this study, we design polyvinyl alcohol/polydopamine-modified boron nitride nanosheet (PVA/BNNS@PDA) nanocomposites with hierarchical structures by combining electrospinning, vacuum filtration deposition, and hot pressing. The modified BNNS@PDA improves the interaction between the filler and the polymer matrix while reducing the interfacial thermal resistance, resulting in superior thermal conductivity, excellent insulation, and perfect flexibility. The PVA/BNNS@PDA nanocomposites possess an ultrahigh in-plane thermal conductivity of 16.6 W/(m·K) at 35.54 wt % BNNS@PDA content. Even after 2000 folds, the nanocomposites do not undergo any crack, showing their ultrahigh thermal conductivity behavior. Furthermore, the nanocomposites exhibit a volume resistivity above 1014 Ω·cm, which is well above the standard for insulating materials. Based on these results, this work provides a novel method to produce nanocomposites with high thermal conductivity, offering a new perspective to design advanced thermal management materials.

Nanopolyhybrids: Materials, Engineering Designs, and Advances in Thermal Management

The fundamental requirements for thermal comfort along with the unbalanced growth in the energy demand and consumption worldwide have triggered the development and innovation of advanced materials for high thermal-management capabilities. However, continuous development remains a significant challenge in designing thermally robust materials for the efficient thermal management of industrial devices and manufacturing technologies. The notable achievements thus far in nanopolyhybrid design technologies include multiresponsive energy harvesting/conversion (e.g., light, magnetic, and electric), thermoregulation (including microclimate), energy saving in construction, as well as the miniaturization, integration, and intelligentization of electronic systems. These are achieved by integrating nanomaterials and polymers with desired engineering strategies. Herein, fundamental design approaches that consider diverse nanomaterials and the properties of nanopolyhybrids are introduced, and the emerging applications of hybrid composites such as personal and electronic thermal management and advanced medical applications are highlighted. Finally, current challenges and outlook for future trends and prospects are summarized to develop nanopolyhybrid materials.

Intelligent cyclic fire warning sensor based on hybrid PBO nanofiber and montmorillonite nanocomposite papers decorated with phenyltriethoxysilane

An abundance of early warning graphene-based nano-materials and sensors have been developed to avoid and prevent the critical fire risk of combustible materials. However, there are still some limitations that should be addressed, such as the black color, high-cost and single fire warning response of graphene-based fire warning materials. Herein, we report an unexpected montmorillonite (MMT)-based intelligent fire warning materials that have excellent fire cyclic warning performance and reliable flame retardancy. Combining phenyltriethoxysilane (PTES) molecules, poly(p-phenylene benzobisoxazole) nanofiber (PBONF), and layers of MMT to form a silane crosslinked 3D nanonetwork system, the homologous PTES decorated MMT-PBONF nanocomposites are designed and fabricated via a sol-gel process and low temperature self-assembly method. The optimized nanocomposite paper shows good mechanical flexibility (good recovery after kneading or bending process), high tensile strength of ∼81 MPa and good water resistance. Furthermore, the nanocomposite paper exhibits high-temperature flame resistance (almost unchanged structure and size after 120 s combustion), sensitive flame alarm response (∼0.3 s response once exposure onto a flame), cyclic fire warning performance (>40 cycles), and adaptability to complex fire situations (several fire attack and evacuation scenarios), showing promising applications for monitoring the critical fire risk of combustible materials. Therefore, this work paves a rational way for design and fabrication of MMT-based smart fire warning materials that combine excellent flame shielding and sensitive fire alarm functions.

Self-Stacked 3D Anisotropic BNNS Network Guided by Para-Aramid Nanofibers for Highly Thermal Conductive Dielectric Nanocomposites

The enhancement of the heat-dissipation property of polymer-based composites is of great practical interest in modern electronics. Recently, the construction of a three-dimensional (3D) thermal pathway network structure for composites has become an attractive way. However, for most reported high thermal conductive composites, excellent properties are achieved at a high filler loading and the building of a 3D network structure usually requires complex steps, which greatly restrict the large-scale preparation and application of high thermal conductive polymer-based materials. Herein, utilizing the framework-forming characteristic of polymerization-induced para-aramid nanofibers (PANF) and the high thermal conductivity of hexagonal boron nitride nanosheets (BNNS), a 3D-laminated PANF-supported BNNS aerogel was successfully prepared via a simple vacuum-assisted self-stacking method, which could be used as a thermal conductive skeleton for epoxy resin (EP). The obtained PANF-BNNS/EP nanocomposite exhibits a high thermal conductivity of 3.66 W m^-1 K^-1 at only 13.2 vol % BNNS loading. The effectiveness of the heat conduction path was proved by finite element analysis. The PANF-BNNS/EP nanocomposite shows outstanding practical thermal management capability, excellent thermal stability, low dielectric constant, and dielectric loss, making it a reliable material for electronic packaging applications. This work also offers a potential and promotable strategy for the easy manufacture of 3D anisotropic high-efficiency thermal conductive network structures.

Advances and mechanisms in polymer composites toward thermal conduction and electromagnetic wave absorption

Polymer composites have essential applications in electronics due to their versatility, stable performance, and processability. However, with the increasing miniaturization and high power of electronics in the 5G era, there are significant challenges related to heat accumulation and electromagnetic wave (EMW) radiation in narrow spaces. Traditional solutions involve using either thermally conductive or EMW absorbing polymer composites, but these fail to meet the demand for multi-functional integrated materials in electronics. Therefore, designing thermal conduction and EMW absorption integrated polymer composites has become essential to solve the problems of heat accumulation and electromagnetic pollution in electronics and adapt to its development trend. Researchers have developed different approaches to fabricate thermal conduction and EMW absorption integrated polymer composites, including integrating functional fillers with both thermal conduction and EMW absorption functions and innovating processing methods. This review summarizes the latest research progress, factors that affect performance, and the mechanisms of thermal conduction and EMW absorption integrated polymer composites. The review also discusses problems that limit the development of these composites and potential solutions and development directions. The aim of this review is to provide references for the development of thermal conduction and EMW absorption integrated polymer composites.

A Malleable Composite Dough with Well-Dispersed and High-Content Boron Nitride Nanosheets

Aggregation of two-dimensional (2D) nanosheet fillers in a polymer matrix is a prevalent problem when the filler loading is high, leading to degradation of physical and mechanical properties of the composite. To avoid aggregation, a low-weight fraction of the 2D material (<5 wt %) is usually used to fabricate the composite, limiting performance improvement. Here, we develop a mechanical interlocking strategy where well-dispersed high filling content (up to 20 wt %) of boron nitride nanosheets (BNNSs) can be incorporated into a polytetrafluoroethylene (PTFE) matrix, resulting in a malleable, easy-to-process and reusable BNNS/PTFE composite dough. Importantly, the well-dispersed BNNS fillers can be rearranged into a highly oriented direction due to the malleable nature of the dough. The resultant composite film has a high thermal conductivity (4408% increase), low dielectric constant/loss, and excellent mechanical properties (334%, 69%, 266%, and 302% increases for tensile modulus, strength, toughness, and elongation, respectively), making it suitable for thermal management applications in the high-frequency areas. The technique is useful for the large-scale production of other 2D material/polymer composites with a high filler content for different applications.

Flexible, Highly Thermally Conductive and Electrically Insulating Phase Change Materials for Advanced Thermal Management of 5G Base Stations and Thermoelectric Generators

Thermal management has become a crucial problem for high-power-density equipment and devices. Phase change materials (PCMs) have great prospects in thermal management applications because of their large capacity of heat storage and isothermal behavior during phase transition. However, low intrinsic thermal conductivity, ease of leakage, and lack of flexibility severely limit their applications. Solving one of these problems often comes at the expense of other performance of the PCMs. In this work, we report core-sheath structured phase change nanocomposites (PCNs) with an aligned and interconnected boron nitride nanosheet network by combining coaxial electrospinning, electrostatic spraying, and hot-pressing. The advanced PCN films exhibit an ultrahigh thermal conductivity of 28.3 W m-1 K-1 at a low BNNS loading (i.e., 32 wt%), which thereby endows the PCNs with high enthalpy (> 101 J g-1), outstanding ductility (> 40%) and improved fire retardancy. Therefore, our core-sheath strategies successfully balance the trade-off between thermal conductivity, flexibility, and phase change enthalpy of PCMs. Further, the PCNs provide powerful cooling solutions on 5G base station chips and thermoelectric generators, displaying promising thermal management applications on high-power-density equipment and thermoelectric conversion devices.

Durable, Low-Cost, and Efficient Heat Spreader Design from Scrap Aramid Fibers and Hexagonal Boron Nitride

Aramid, chemically known as para phenylene terephthalamide or PPD-T, has been widely used in the reinforcement of telecommunication cables, rubber materials (transmission belts, pneumatic belts), ballistic clothing, and frictional materials primarily due to their high tensile resistance, high elastic modulus, and excellent thermal stability (−80–200 °C). These unique properties of aramid originate from its chemical structure, which consists of relatively rigid polymer chains linked by benzene rings and amide bonds (-CO-NH-). Here, in this work inspired by these properties, a heat spreader called Thermal Interface Material (TIM) is developed by synthesizing a resin from scrap aramid fibers. When hexagonal boron nitride (h-BN) as filler is introduced into the as-synthesized aramid resin to form a thin film of thermal sheet (50 μm), an in-plane thermal conductivity as high as 32.973 W/mK is achieved due to the firmly stacked and symmetric arrangement of the h-BN in the resin matrix. Moreover, the influence of h-BN platelet size is studied by fabricating thermal sheets with three different sizes of h-BN (6–7.5 μm, 15–21 μm, and 30–35 μm) in the aramid resin. The results of the study show that as platelet size increases, thermal conductivity increases significantly. Since the resin reported herein is developed out of scrap aramid fibers, the cost involved in the manufacture of the thermal sheet will be greatly lower. As the thermal sheet is designed with h-BN rather than graphene or carbonaceous materials, this high heat spreading sheet can be employed for 5G antenna modules where properties like a low dielectric constant and high electrical insulation are mandated.

Liquid Metal-Assisted High-Efficiency Exfoliation of Boron Nitride for Electrically Insulating Heat-Spreader Film

Boron nitride nanosheets (BNNSs) are regarded as promising two-dimensional materials in thermally conductive yet electrically insulating applications. Attributed to the strong interlayer "lip-lip" interactions in bulk hexagonal boron nitride (h-BN), high-efficiency exfoliation and scalable fabrication of BNNSs via the top-down strategies remain formidable challenges. Herein, an interesting observation is manifested that gallium-based liquid metal (LM) forming robust coordination interactions with h-BN helps reduce the lip-lip interlayer interactions and thus facilitates successful exfoliation under intense shearing force. For example, employing the ball-milling technique, the BNNS yield can increase to 41.21% with the assistance of LM at only 2 h milling time. Its exfoliation efficiency (yield/time) reaches as high as 26.72%/h, more than 2-fold that of other previously reported methods, including sonication and other ball-milling methods. Moreover, the exfoliated BNNSs are still found to be highly electrically insulating with a band gap of 4.65 eV, showing prospective potential in thermally conductive yet electrical insulating applications. As a proof of concept, a microwave-transparent heat spreader (cellulose nanofiber/BNNSs) is fabricated and verified for applications in high-frequency thermal-management fields.

Development and Perspectives of Thermal Conductive Polymer Composites

With the development of electronic appliances and electronic equipment towards miniaturization, lightweight and high-power density, the heat generated and accumulated by devices during high-speed operation seriously reduces the working efficiency and service life of the equipment. The key to solving this problem is to develop high-performance thermal management materials and improve the heat dissipation efficiency of the equipment. This paper mainly summarizes the research progress of polymer composites with high thermal conductivity and electrical insulation, including the thermal conductivity mechanism of composites, the factors affecting the thermal conductivity of composites, and the research status of thermally conductive and electrical insulation polymer composites in recent years. Finally, we look forward to the research focus and urgent problems that should be addressed of high-performance thermal conductive composites, which will provide strategies for further development and application of advanced thermal and electrical insulation composites.