Molecular engineered conjugated polymer with high thermal conductivity

Thermal Conductivity of Polymers: A Simple Matter Where Complexity Matters

Thermal conductivity coefficient κ measures the ability of a material to conduct a heat current. In particular, κ is an important property that often dictates the usefulness of a material over a wide range of environmental conditions. For example, while a low κ is desirable for the thermoelectric applications, a large κ is needed when a material is used under the high temperature conditions. These materials range from common crystals to commodity amorphous polymers. The latter is of particular importance because of their use in designing light weight high performance functional materials. In this context, however, one of the major limitations of the amorphous polymers is their low κ, reaching a maximum value of ≈0.4 W/Km that is 2-3 orders of magnitude smaller than the standard crystals. Moreover, when energy is predominantly transferred through the bonded connections, κ ⩾ 100 W/Km. Recently, extensive efforts have been devoted to attain a tunability in κ via macromolecular engineering. In this work, an overview of the recent results on the κ behavior in polymers and polymeric solids is presented. In particular, computational and theoretical results are discussed within the context of complimentary experiments. Future directions are also highlighted.

Morphological and molecular control of chemical vapor deposition (CVD) polymerized polythiophene thin films

Oxidative chemical vapor deposition (oCVD) has emerged as one of the most promising techniques for conjugated polymer deposition, especially for unsubstituted polythiophene thin films. oCVD overcomes the insolubility challenge that unsubstituted polythiophene (PT) presents and adds the ability to control morphological and molecular structure. This control is important for enhancing the performance of devices which incorporate organic conductors. In this work, Raman spectroscopy, UV-vis spectroscopy, and AFM reveal that the relative amount of distortion in the polymer chains, the conjugation length and the film roughness are all affected by the CVD deposition conditions, in particular the reactor pressure. PT films deposited at 150 mT and 300 mT are found to have lower chain distortion, longer conjugation lengths and lower surface roughness compared to other deposition pressures. The oCVD PT film is also directly grafted to the trichloro(phenylethyl)silane (PTS) treated substrates, where the effect of PTS grafting is observed to significantly affect film roughness. In addition, we report the first study of the effect of oCVD PT films on the performance of lithium-ion battery electrodes. These oCVD PT films are used to engineer a LiCoO2 cathode in lithium-ion batteries. The observed improvements are a 52% increase in the discharge capacity (67 mA h g-1 to 102 mA h g-1) at 10C and a 500% improvement in cycling stability tested at 5C within the voltage range of 3.0-4.5 V (capacity fading rate is reduced from 1.92%/cycle to 0.32%/cycle).

Anderson Localization of Phonons in Thermally Superinsulating Graphene Aerogels with Metal-Like Electrical Conductivity

In the quest to improve energy efficiency and design better thermal insulators, various engineering strategies have been extensively investigated to minimize heat transfer through a material. Yet, the suppression of thermal transport in a material remains elusive because heat can be transferred by multiple energy carriers. Here, the realization of Anderson localization of phonons in a random 3D elastic network of graphene is reported. It is shown that thermal conductivity in a cellular graphene aerogel can be drastically reduced to 0.9 mW m-1 K-1 by the application of compressive strain while keeping a high metal-like electrical conductivity of 120 S m-1 and ampacity of 0.9 A. The experiments reveal that the strain can cause phonon localization over a broad compression range. The remaining heat flow in the material is dominated by charge transport. Conversely, electrical conductivity exhibits a gradual increase with increasing compressive strain, opposite to the thermal conductivity. These results imply that strain engineering provides the ability to independently tune charge and heat transport, establishing a new paradigm for controlling phonon and charge conduction in solids. This approach will enable the development of a new type of high-performance insulation solutions and thermally superinsulating materials with metal-like electrical conductivity.

Intrinsically thermally conductive polymers

Here, we describe the design features that lead to intrinsically thermally conductive polymers. Though polymers are conventionally assumed to be thermal insulators (<0.3 W m-1 K-1), significant efforts by the thermal transport community have shown that polymers can be intrinsically thermally conductive (>1.0 W m-1 K-1). However, these findings have not yet driven comprehensive synthetic efforts to expose how different macromolecular features impact thermal conductivity. Preliminary theoretical and experimental investigations have revealed that high k polymers can be realized by enhancing the alignment, crystallinity, and intermolecular interactions. While a holistic mechanistic framework does not yet exist for thermal transport in polymeric materials, contemporary literature suggests that phonon-like heat carriers may be operative in macromolecules that meet the abovementioned criteria. In this review, we offer a perspective on how high thermal conductivity polymers can be systematically engineered from this understanding. Reports for several classes of macromolecules, including linear polymers, network polymers, liquid-crystalline polymers, and two-dimensional polymers substantiate the design principles we propose. Throughout this work, we offer opportunities for continued fundamental and technological development of polymers with high thermal conductivity.

Reversible two-way tuning of thermal conductivity in an end-linked star-shaped thermoset

Polymeric thermal switches that can reversibly tune and significantly enhance their thermal conductivities are desirable for diverse applications in electronics, aerospace, automotives, and medicine; however, they are rarely achieved. Here, we report a polymer-based thermal switch consisting of an end-linked star-shaped thermoset with two independent thermal conductivity tuning mechanisms-strain and temperature modulation-that rapidly, reversibly, and cyclically modulate thermal conductivity. The end-linked star-shaped thermoset exhibits a strain-modulated thermal conductivity enhancement up to 11.5 at a fixed temperature of 60 °C (increasing from 0.15 to 2.1 W m-1 K-1). Additionally, it demonstrates a temperature-modulated thermal conductivity tuning ratio up to 2.3 at a fixed stretch of 2.5 (increasing from 0.17 to 0.39 W m-1 K-1). When combined, these two effects collectively enable the end-linked star-shaped thermoset to achieve a thermal conductivity tuning ratio up to 14.2. Moreover, the end-linked star-shaped thermoset demonstrates reversible tuning for over 1000 cycles. The reversible two-way tuning of thermal conductivity is attributed to the synergy of aligned amorphous chains, oriented crystalline domains, and increased crystallinity by elastically deforming the end-linked star-shaped thermoset.

High Hydrogen Storage in Trigonal Prismatic Monomer-Based Highly Porous Aromatic Frameworks

Hydrogen storage is crucial in the shift toward a carbon-neutral society, where hydrogen serves as a pivotal renewable energy source. Utilizing porous materials can provide an efficient hydrogen storage solution, reducing tank pressures to manageable levels and circumventing the energy-intensive and costly current technological infrastructure. Herein, two highly porous aromatic frameworks (PAFs), C-PAF and Si-PAF, prepared through a Yamamoto C─C coupling reaction between trigonal prismatic monomers, are reported. These PAFs exhibit large pore volumes and Brunauer-Emmett-Teller areas, 3.93 cm3 g-1 and 4857 m2 g-1 for C-PAF, and 3.80 cm3 g-1 and 6099 m2 g-1 for Si-PAF, respectively. Si-PAF exhibits a record-high gravimetric hydrogen delivery capacity of 17.01 wt% and a superior volumetric capacity of 46.5 g L-1 under pressure-temperature swing adsorption conditions (77 K, 100 bar → 160 K, 5 bar), outperforming benchmark hydrogen storage materials. By virtue of the robust C─C covalent bond, both PAFs show impressive structural stabilities in harsh environments and unprecedented long-term durability. Computational modeling methods are employed to simulate and investigate the structural and adsorption properties of the PAFs. These results demonstrate that C-PAF and Si-PAF are promising materials for efficient hydrogen storage.

Correlating Young's Modulus with High Thermal Conductivity in Organic Conjugated Small Molecules

Attaining elevated thermal conductivity in organic materials stands as a coveted objective, particularly within electronic packaging, thermal interface materials, and organic matrix heat exchangers. These applications have reignited interest in researching thermally conductive organic materials. The understanding of thermal transport mechanisms in these organic materials is currently constrained. This study concentrates on N, N'-dioctyl-3,4,9,10-perylenedicarboximide (PTCDI-C8), an organic conjugated crystal. A correlation between elevated thermal conductivity and augmented Young's modulus is substantiated through meticulous experimentation. Achievement via employing the physical vapor transport method, capitalizing on the robust C═C covalent linkages running through the organic matrix chain, bolstered by π-π stacking and noncovalent affiliations that intertwine the chains. The coexistence of these dynamic interactions, alongside the perpendicular alignment of PTCDI-C8 molecules, is confirmed through structural analysis. PTCDI-C8 thin film exhibits an out-of-plane thermal conductivity of 3.1 ± 0.1 W m-1 K-1, as determined by time-domain thermoreflectance. This outpaces conventional organic materials by an order of magnitude. Nanoindentation tests and molecular dynamics simulations elucidate how molecular orientation and intermolecular forces within PTCDI-C8 molecules drive the film's high Young's modulus, contributing to its elevated thermal conductivity. This study's progress offers theoretical guidance for designing high thermal conductivity organic materials, expanding their applications and performance potential.

Electrically Conductive Polymers for Additive Manufacturing

The use of electrically conductive polymers (CPs) in the development of electronic devices has attracted significant interest due to their unique intrinsic properties, which result from the synergistic combination of physicochemical properties in conventional polymers with the electronic properties of metals or semiconductors. Most conventional methods adopted for the fabrication of devices with nonplanar morphologies are still challenged by the poor ionic/electronic mobility of end products. Additive manufacturing (AM) brings about exciting prospects to the realm of CPs by enabling greater design freedom, more elaborate structures, quicker prototyping, relatively low cost, and more environmentally friendly electronic device creation. A growing variety of AM technologies are becoming available for three-dimensional (3D) printing of conductive devices, i.e., vat photopolymerization (VP), material extrusion (ME), powder bed fusion (PBF), material jetting (MJ), and lamination object manufacturing (LOM). In this review, we provide an overview of the recent research progress in the area of CPs developed for AM, which advances the design and development of future electronic devices. We consider different AM techniques, vis-à-vis, their development progress and respective challenges in printing CPs. We also discuss the material requirements and notable advances in 3D printing of CPs, as well as their potential electronic applications including wearable electronics, sensors, energy storage and conversion devices, etc. This review concludes with an outlook on AM of CPs.

Molecular Dynamics Simulation on the Heat Transfer in the Cross-Linked Poly(dimethylsiloxane)

In this work, the effect of cross-linking degree and stretching on the thermal conductivity of poly(dimethylsiloxane) (PDMS) is explored by performing a molecular dynamics simulation. Our results demonstrate that the thermal conductivity of PDMS exhibits a monotonous rise with an increase in the cross-linking degree. By decomposing the total heat flux into three microscopic heat transfer modes, the high cross-linking degree improves the contribution from bonding interactions to the heat transfer more than that from the nonbonding interactions. An analysis of the vibrational density of states shows a blue-shift of the vibrational modes at low frequencies, indicating a large phonon group velocity due to the strong interchain bonding interaction. From the spectral distribution of heat flux, the spectral contributions are shifted toward the higher frequencies with the increasing cross-linking degree, which reflects more contribution from the high-frequency modes to the heat transfer. Stretching can improve the thermal conductivity parallel to the tensile direction with the increase in strain. This is mainly due to the further improved contribution of bonding interactions or high-frequency modes to heat transfer. Interestingly, the anisotropy of the thermal conductivity first decreases and then increases with the increasing cross-linking degree. Our study conducts a detailed investigation of the thermal conductivity of cross-linked PDMS, providing guidance on the application of thermal interface materials.

Heat transport with a twist

Despite the desirability of polymers for use in many products due to their flexibility, light weight, and durability, their status as thermal insulators has precluded their use in applications where thermal conductors are required. However, recent results suggest that the thermal conductance of polymers can be enhanced and that their heat transport behaviors may be highly sensitive to nanoscale control. Here we use non-equilibrium molecular dynamics simulations to study the effect of mechanical twist on the steady-state thermal conductance across multi-stranded polyethylene wires. We find that a highly twisted double-helical polyethylene wire can display a thermal conductance up to three times that of its untwisted form, an effect which can be attributed to a structural transition in the strands of the double helix. We also find that in thicker wires composed of many parallel strands, adding just one twist can increase its thermal conductance by over 30%. However, we find that unlike stretching a polymer wire, which causes a monotonic increase in thermal conductance, the effect of twist is highly non-monotonic, and certain amounts of twist can actually decrease the thermal conductance. Finally, we apply the Continuous Chirality Measure (CCM) in an attempt to explore the correlation between heat conductance and chirality. The CCM is found to correlate with twist as expected, but we attribute the observed heat transport behaviors to structural factors other than chirality.

Thermal Conductivity of Covalent-Organic Frameworks

Covalent-organic frameworks (COFs) are a highly promising class of materials that can provide an excellent platform for thermal management applications. In this Perspective, we first review previous works on the thermal conductivities of COFs. Then we share our insights on achieving high, low, and switchable thermal conductivities of future COFs. To obtain the desired thermal conductivity, a comprehensive understanding of their thermal transport mechanisms is necessary but lacking. We discuss current limitations in atomistic simulations, synthesis, and thermal conductivity measurements of COFs and share potential pathways to overcoming these challenges. We hope to stimulate collective, interdisciplinary efforts to study the thermal conductivity of COFs and enable their wide range of thermal applications.

Preparation of Monotrimethoxylsilylethyl-Terminated Polysiloxane Fluids and Their Application in Thermal Interface Materials

In this study, α-Trimethylsilylmethyl-ω-dimethylsilyl-terminated polydimethylsiloxane, polydiethylsiloxane and poly[2,2,2-trifluoropropyl(methyl)siloxane] are synthesized using an anion catalyzed nonequilibrium polymerization reaction with trimethylsilylmethyl lithium as the initiator; hexamethylcyclotrisiloxane, hexaethylcyclotrisiloxane or 1,3,5-trimethyl-1,3,5-trifluoropropylcyclotrisiloxane as the monomer; and dimethylchlorosilane as an end-capping agent. Three kinds of α-trimethylsilylmethyl-ω-trimethoxylsilylethyl-terminated polysiloxanes are further prepared by hydrosilylation reaction of α-trimethylsilylmethyl-ω-dimethylsilyl-terminated polysiloxanes with vinyltrimethoxysilane using Karstedt's catalyst. These α-trimethylsilylmethyl-ω-trimethoxylsilylethyl-terminated polysiloxanes are functionalized as in situ surface treatment agents for AlN particles. The effects of the structure of these polysiloxanes on the dispersion of AlN in the polysiloxane matrix and on the heat transfer performance of silicone pastes and silicone rubbers are investigated. A possible mechanism of surface treatment of AlN fillers by these novel silicone fluids is also discussed.

Thermal Transport in Poly(p-phenylene): Anomalous Dimensionality Dependence and Role of π-π Stacking

For heat conduction along polymer chains, a decrease in the axial thermal conductivity often occurs when the polymer structure changes from one-dimensional (1D) to three-dimensional (3D). For example, a single extended aliphatic chain (e.g., polyethylene or poly(dimethylsiloxane)) usually has a higher axial thermal conductivity than its double-chain or crystal counterparts because coupling between chains induces strong interchain anharmonic scatterings. Intuitively, for chains with an aromatic backbone, the even stronger π-π stacking, once formed between chains, should enhance thermal transport across chains and suppress the thermal conductivity along the chains. However, we show that this trend is the opposite in poly(p-phenylene) (PPP), a typical chain with an aromatic backbone. Using molecular dynamics simulations, we found that the axial thermal conductivity of PPP chains shows an anomalous dimensionality dependence where the thermal conductivity of double-chain and 3D crystal structures is higher than that of a 1D single chain. We analyzed the probability distribution of dihedral angles and found that π-π stacking between phenyl rings restricts the free rotation of phenyl rings and forms a long-range order along the chain, thus enhancing thermal transport along the chain direction. Though possessing a stronger bonding strength and stabilizing the multiple-chain structure, π-π stacking does not lead to a higher interchain thermal conductance between phenyl rings compared with that between aliphatic chains. Our simulation results on the effects of π-π stacking provide insights to engineer thermal transport in polymers at the molecular level.

The Effect of Mechanical Elongation on the Thermal Conductivity of Amorphous and Semicrystalline Thermoplastic Polyimides: Atomistic Simulations

Over the past few decades, the enhancement of polymer thermal conductivity has attracted considerable attention in the scientific community due to its potential for the development of new thermal interface materials (TIM) for both electronic and electrical devices. The mechanical elongation of polymers may be considered as an appropriate tool for the improvement of heat transport through polymers without the necessary addition of nanofillers. Polyimides (PIs) in particular have some of the best thermal, dielectric, and mechanical properties, as well as radiation and chemical resistance. They can therefore be used as polymer binders in TIM without compromising their dielectric properties. In the present study, the effects of uniaxial deformation on the thermal conductivity of thermoplastic PIs were examined for the first time using atomistic computer simulations. We believe that this approach will be important for the development of thermal interface materials based on thermoplastic PIs with improved thermal conductivity properties. Current research has focused on the analysis of three thermoplastic PIs: two semicrystalline, namely BPDA-P3 and R-BAPB; and one amorphous, ULTEM^TM. To evaluate the impact of uniaxial deformation on the thermal conductivity, samples of these PIs were deformed up to 200% at a temperature of 600 K, slightly above the melting temperatures of BPDA-P3 and R-BAPB. The thermal conductivity coefficients of these PIs increased in the glassy state and above the glass transition point. Notably, some improvement in the thermal conductivity of the amorphous polyimide ULTEM^TM was achieved. Our study demonstrates that the thermal conductivity coefficient is anisotropic in different directions with respect to the deformation axis and shows a significant increase in both semicrystalline and amorphous PIs in the direction parallel to the deformation. Both types of structural ordering (self-ordering of semicrystalline PI and mechanical elongation) led to the same significant increase in thermal conductivity coefficient.

Molecular Regulation of Flexible Composite Solid-Solid Phase Change Materials with Controllable Isotropic Thermal Conductivity for Thermal Energy Storage

In recent years, graphene has been introduced into phase change materials (PCMs) to improve thermal conductivity to enhance the heat transfer efficiency in thermal energy storage. However, graphenes tend to aggregate in PCMs, leading to the low thermal conductivity efficient enhancement (TCEE), anisotropic thermal conductivity, and deterioration of mechanical performance of PCMs. In this work, we fabricated biomimetic thermally conductive solid-solid PCMs (SSPCMs) by facile blending of the graphene into well-designed polyurethane SSPCMs, in which the graphene established a controllable and highly efficient isotropic thermally conductive pathway based on the π-π stacking between the graphene and the polymer aromatic ring segment. The as-fabricated SSPCMs showed high TCEE (156.78%), excellent flexibility (328% elongation at break), high enthalpy value (>101 J/g), and solid-solid phase transition properties, under 2% loading of graphene. The proportion of in-plane to through-plane thermal conductivity can be adjusted by an elaborate design of the aromatic ring segment in polyurethane SSPCMs. We further demonstrated mechanical flexibility and photothermal property of the composites to reveal their potential in practical applications.

Effect of GO on the Structure and Properties of PEG/Biochar Phase Change Composites

In recent years, phase change materials (PCMs) have been widely used in waste heat utilization, buildings, and solar and wind energy, but with a huge limitation from the low thermal conductivity, photothermal conversion efficiency, and low latent heat. Organic PCMs are eyecatching because of its high latent heat storage capability and reliability, but they still suffer from a lack of photothermal conversion and sharp stability. Here, we prepared sharp-stable PCMs by establishing a carbon material frame system consisting of graphene oxide (GO) and biochar. In particular, surfactants (CTAB, KH-560 and KH-570) were employed to improve the dispersity of GO in PEG. The differential scanning calorimetry results shows that the latent heat of PEG modified by CTAB grafted GO (PGO-CTAB) was the highest (191.36 J/g) and increased by 18.31% compared to that of pure PEG (161.74 J/g). After encapsulation of PGO-CTAB in biochar, the obtained composite PCM with the amount of biochar and PGO-CTAB in weight ratio 4:6 (PGO-CTAB/CS6(6)) possesses relatively high latent heat 106.51 J/g with good leak resistance and thermal stability, and with obviously enhanced thermal conductivity (0.337 W/(m·K)) and photothermal conversion efficiency (77.43%), which were higher than that of PEG6000 (0.325 W/(m·K), 44.63%). The enhancement mechanism of heat transfer and photothermal conversion on the composite PCM is discussed.

Sm-Co-based amorphous alloy films for zero-field operation of transverse thermoelectric generation

Transverse thermoelectric generation using magnetic materials is essential to develop active thermal engineering technologies, for which the improvements of not only the thermoelectric output but also applicability and versatility are required. In this study, using combinatorial material science and lock-in thermography technique, we have systematically investigated the transverse thermoelectric performance of Sm-Co-based alloy films. The high-throughput material investigation revealed the best Sm-Co-based alloys with the large anomalous Nernst effect (ANE) as well as the anomalous Ettingshausen effect (AEE). In addition to ANE/AEE, we discovered unique and superior material properties in these alloys: the amorphous structure, low thermal conductivity, and large in-plane coercivity and remanent magnetization. These properties make it advantageous over conventional materials to realize heat flux sensing applications based on ANE, as our Sm-Co-based films can generate thermoelectric output without an external magnetic field. Importantly, the amorphous nature enables the fabrication of these films on various substrates including flexible sheets, making the large-scale and low-cost manufacturing easier. Our demonstration will provide a pathway to develop flexible transverse thermoelectric devices for smart thermal management.

Thermally Conductive Self-Healing Nanoporous Materials Based on Hydrogen-Bonded Organic Frameworks

Hydrogen-bonded organic frameworks (HOFs) are a class of nanoporous crystalline materials formed by the assembly of organic building blocks that are held together by a network of hydrogen-bonding interactions. Herein, we show that the dynamic and responsive nature of these hydrogen-bonding interactions endows HOFs with a host of unique physical properties that combine ultraflexibility, high thermal conductivities, and the ability to "self-heal". Our systematic atomistic simulations reveal that their unique mechanical properties arise from the ability of the hydrogen-bond arrays to absorb and dissipate energy during deformation. Moreover, we also show that these materials demonstrate relatively high thermal conductivities for porous crystals with low mass densities due to their extended periodic framework structure that is comprised of light atoms. Our results reveal that HOFs mark a new regime of material design combining multifunctional properties that make them ideal candidates for gas storage and separation, flexible electronics, and thermal switching applications.

Microstructural and Thermal Transport Properties of Regioregular Poly(3-hexylthiophene-2,5-diyl) Thin Films

Polymeric thin films offer a wide range of exciting properties and applications, with several advantages compared to inorganic counterparts. The thermal conductivity of such thin films ranges typically between 0.1-1 W m-1 K-1. This low thermal conductivity can cause problems with heat dissipation in various applications. Detailed knowledge about thermal transport in polymeric thin films is desired to overcome these shortcomings, especially in light of the multitude of possible microstructures for semi-crystalline thin films. Therefore, poly(3-hexylthiophene-2,5-diyl) (P3HT) is chosen as a model system to analyze the microstructure and optoelectronic properties using X-ray scattering and absorption spectra along with the thermal transport properties using the photoacoustic technique. This combination of analysis methods allows for determining the optoelectronic and thermal transport properties on the same specimen, supplemented by structural information. The effect of different molecular weights and solvents during film preparation is systematically examined. A variation of the optoelectronic properties, mainly regarding molecular weight, is apparent, while no direct influence of the solvent during preparation is discernible. In contrast, the thermal conductivities of all films examined fall within a similar range. Therefore, the microstructural properties in the ordered regions do not significantly affect the resulting thermal properties in the sample space investigated in this work. We conclude that it is mainly the amorphous regions that determine the thermal transport properties, as these represent a bottleneck for thermal transport.

Toward a BT.2020 green emitter through a combined multiple resonance effect and multi-lock strategy

Color-saturated green-emitting molecules with high Commission Internationale de L’Eclairage (CIE) y values have great potential applications for displays and imaging. Here, we linked the outer phenyl groups in multiple-resonance (MR)-type blue-emitting B (boron)-N (nitrogen) molecules through bonding and spiro-carbon bridges, resulting in rigid green emitters with thermally activated delayed fluorescence. The MR effect and multiple interlocking strategy greatly suppressed the high-frequency vibrations in the molecules, which emit green light with a full-width at half-maximum of 14 nm and a CIE y value of 0.77 in cyclohexane. These were the purest green molecules with quantum efficiency and color purity that were comparable with current best quantum dots. Doping these emitters into a traditional green-emitting phosphorescence organic light-emitting diode (OLED) endowed the device with a Broadcast Service Television 2020 color-gamut, 50% improved external quantum efficiency, and an extremely high luminescence of 5.1 × 105 cd/m2, making it the greenest and brightest OLED ever reported.

Network Formation and Physical Properties of Epoxy Resins for Future Practical Applications

Epoxy resins are used in various fields in a wide range of applications such as coatings, adhesives, modeling compounds, impregnation materials, high-performance composites, insulating materials, and encapsulating and packaging materials for electronic devices. To achieve the desired properties, it is necessary to obtain a better understanding of how the network formation and physical state change involved in the curing reaction affect the resultant network architecture and physical properties. However, this is not necessarily easy because of their infusibility at higher temperatures and insolubility in organic solvents. In this paper, we summarize the knowledge related to these issues which has been gathered using various experimental techniques in conjunction with molecular dynamics simulations. This should provide useful ideas for researchers who aim to design and construct various thermosetting polymer systems including currently popular materials such as vitrimers over epoxy resins.

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed.

The Key Role of 3D Printing Technologies in the Further Development of Electrical Machines

There is a strong general demand for the permanent improvement of electrical machines. Nowadays, these are at their near maximum potential, and even small further improvements can only be achieved with great effort and high cost. The single solution should be a paradigm shift in their development, by using radically new approaches to topology, materials, and fabrication. Therefore, the application of diverse 3D printing techniques for advanced fabrication in this field is inevitable. Therefore, these new approaches are receiving a great deal of attention among electrical machines designers. In the paper, the possible applications of these new fabrication technologies in the field of electrical machines are surveyed. The focus is set on emphasizing the advancement over the traditional manufacturing approaches.

Facile Approach to Enhance Electrical and Thermal Performance of Conducting Polymer PEDOT:PSS Films via Hot Pressing

This paper studies the impact of hot pressing on the electrical and thermal performance of thick (thickness >5 μm) conducting polymer poly(3,4-ethylene dioxythiophene):poly(styrene sulfonate) (PEDOT:PSS) films after acid treatment. Thick conducting polymer films usually exhibit low electrical and thermal conductivities similar to bulk polymer because charge and heat carriers are easily scattered by the irregular arrangement of crystalline domains inside the polymer. In this work, the in-plane electrical conductivity of thick hot-pressed PEDOT:PSS film exceeded 1500 S/cm, and 50% enhancement was obtained in comparison with its non-hot-pressed counterparts. Its in-plane thermal conductivity reached as high as 1.11 W/mK (improved by almost 100% compared to acid-treated PEDOT:PSS films), which is comparable to that of some commercial thermal pads. Such electrical and thermal enhancement via the hot-pressing process is attributed to the optimized morphology and microstructures, which provide short paths for thermal and electrical transportation. We have also demonstrated that the hot-pressed PEDOT:PSS films could be potentially utilized as a flexible conductor and heat spreader for application in flexible electronics and thermal management, respectively. This study not only offers a new insight into the process-property relationship for conducting polymers but also further enables the use of PEDOT:PSS films with simultaneously improved electrical and thermal performance in practical applications, such as thermal management for organic electrodes in batteries, flexible electronics, soft robotics, and bioelectronics.

Experimental and Theoretical Assessment of Water Sorbent Kinetics

The kinetics of water adsorption in powder sorbent layers are important to design a scaled-up atmospheric water capture device. Herein, the adsorption kinetics of three sorbents, a chromium (Cr)-based metal-organic framework (Cr-MIL-101), a carbon-based material (nanoporous sponges/NPS), and silica gel, have been tested experimentally, using powder layers ranging from ∼0 to 7.5 mm in thickness, in a custom-made calibrated environmental chamber cycling from 5 to 95% RH at 30 °C. A mass and energy transfer model was applied onto the experimental curves to better understand the contribution of key parameters (maximum water uptake, kinetics of single particles, layer open porosity, and particle size distribution). Open porosity (i.e., the void-to-particle ratio in the sorbent layer) shows the highest influence to improve the kinetics. Converting the sorbent kinetics data into a daily yield of captured water demonstrated (i) the existence of an optimal open porosity for each sorbent, (ii) that thinner layers with moderate open porosity performed respectively better than thicker layers with high open porosity, and (iii) that high maximum water uptake and fast single-particle kinetics are not necessarily predictive of high daily water yield.

Highly thermoconductive yet ultraflexible polymer composites with superior mechanical properties and autonomous self-healing functionality via a binary filler strategy

It is still a formidable challenge to develop ideal thermal dissipation materials with simultaneous high thermal conductivity, excellent mechanical softness and toughness, and spontaneous self-healing. Herein, we report the introduction of sandwich-like boron nitride nanosheets-liquid metal binary fillers into an artificial poly(urea-urethane) elastomer to address the above issue, which confers the composite elastomer with a unique thermal-mechanical-healing combination, including a low modulus, high in-plane thermal conductivity and high mass loading of rigid fillers but self-recoverability and room-temperature self-healing.

State-of-the-Art, Opportunities, and Challenges in Bottom-up Synthesis of Polymers with High Thermal Conductivity

In contrast to metals, polymers are predominantly thermal and electrical insulators. With their unparalleled advantages such as light weight, turning polymer insulators into heat conductors with metal-like thermal conductivity is...

Interfacial Modulation of Graphene by Polythiophene with Controlled Molecular Weight to Enhance Thermal Conductivity

With a trend of continuing improvement in the development of electronic devices, a problem of serious heat accumulation has emerged which has created the need for more efficient thermal management. Graphene sheets (GNS) have drawn much attention with regard to heat transfer because of their excellent in-plane thermal conductivity; however, the ultrahigh interfacial thermal resistance between graphene lamellae has seriously restricted its practical applications. Herein, we describe heat transfer membranes composed of graphene which have been modified by intrinsic thermally conductive polymers with different molecular weights. The presence of macromolecular surface modifiers not only constructed the graphene heat transfer interface by π-π interactions, but also significantly enhanced the membranes' in-plane thermal conductivity by utilizing their intrinsic heat transfer properties. Such results indicated that the in-plane thermal conductivity of the fabricated membrane exhibits a high in-plane thermal conductivity of 4.17 W m-1 K-1, which, containing the GNS modified with 6000 g/mol (Mn) of poly(3-hexylthiophene) (P3HT), was 26 times higher that of poly (vinylidene fluoride) (PVDF). The P3HT molecular chain with specific molecular weight can form more matching structure π-π interactions, which promotes thermal conductivity. The investigation of different molecular weights has provided a new pathway for designing effective interfacial structures to relieve interface thermal resistance in thermally conductive membranes.

Tuning the Thermal Conductivity of the Amorphous PAA Polymer via Vapor-Phase Infiltration

The thermal properties of the polymer, together with mechanical stability, have been one of the key engineering factors to be considered for various applications. Here, we engineered the thermal conductivity of the amorphous poly(acrylic acid) (PAA) polymer by vapor-phase infiltration (VPI), which has usually occurred during the atomic layer deposition process. We observed that the VPI causes metal infiltration (e.g., Al and Zn) into the amorphous PAA polymer, which noticeably increases the thermal conductivity of the PAA polymer. From spectroscopy analysis and density functional theory simulations, we found that the carboxyl groups (-COOH) in PAA are notably modified and the bonding states of carbon and oxygen are significantly altered by the infiltrated metal. The newly formed Al-mediated bonds likely provide continuous phonon propagation pathways, thereby enhancing the thermal conductance. We believe that VPI could be a simple and useful way to engineer the thermal properties of various polymeric materials.

An Overview of Linear Dielectric Polymers and Their Nanocomposites for Energy Storage

As one of the most important energy storage devices, dielectric capacitors have attracted increasing attention because of their ultrahigh power density, which allows them to play a critical role in many high-power electrical systems. To date, four typical dielectric materials have been widely studied, including ferroelectrics, relaxor ferroelectrics, anti-ferroelectrics, and linear dielectrics. Among these materials, linear dielectric polymers are attractive due to their significant advantages in breakdown strength and efficiency. However, the practical application of linear dielectrics is usually severely hindered by their low energy density, which is caused by their relatively low dielectric constant. This review summarizes some typical studies on linear dielectric polymers and their nanocomposites, including linear dielectric polymer blends, ferroelectric/linear dielectric polymer blends, and linear polymer nanocomposites with various nanofillers. Moreover, through a detailed analysis of this research, we summarize several existing challenges and future perspectives in the research area of linear dielectric polymers, which may propel the development of linear dielectric polymers and realize their practical application.

Phonon-engineered extreme thermal conductivity materials

Materials with ultrahigh or low thermal conductivity are desirable for many technological applications, such as thermal management of electronic and photonic devices, heat exchangers, energy converters and thermal insulation. Recent advances in simulation tools (first principles, the atomistic Green's function and molecular dynamics) and experimental techniques (pump-probe techniques and microfabricated platforms) have led to new insights on phonon transport and scattering in materials and the discovery of new thermal materials, and are enabling the engineering of phonons towards desired thermal properties. We review recent discoveries of both inorganic and organic materials with ultrahigh and low thermal conductivity, highlighting heat-conduction physics, strategies used to change thermal conductivity, and future directions to achieve extreme thermal conductivities in solid-state materials.

High-temperature PMIA dielectric composites with enhanced thermal conductivity utilizing functionalized BaTiO3 nanowires–carbon nanotubes fillers

This study reports that a novel high-temperature poly (m-phenyleneisophthalamide) (PMIA) composite with enhanced dielectric constant and thermal conductivity was prepared by filling with BaTiO3 nanowires–carbon nanotubes (BTCNs) fillers. Due to effective functionalization of BaTiO3 nanowires (BTNWs) and multi-wall carbon nanotubes (MWCNTs), the fabricated BTCNs fillers were homogeneously dispersed in PMIA matrix. The consequence displays that the dielectric constant of PMIA composite with 15 wt % BTNWs fillers increases to 27.6 at 103 Hz, which is about nine times higher than that of pure PMIA. Moreover, owing to the high thermal conductivity of MWCNTs, the thermal conductivity of PMIA with 15 wt% BTNWs fillers increases to 1.01 W/(mK). The enhanced thermal conductivity is beneficial for BTCNs/PMIA composite to dissipate the generated heat by dielectric loss. Considering these merits, this research would provide new methods and ideas for preparation of high-temperature dielectric polymer composites and reducing the internal thermal effect.

Enhanced Thermal Conductivity in Oriented Polyvinyl Alcohol/Graphene Oxide Composites

Polymer composites have attracted increasing interest as thermal management materials for use in devices owing to their ease of processing and potential lower costs. However, most polymer composites have only modest thermal conductivities, even at high concentrations of additives, resulting in high costs and reduced mechanical properties, which limit their applications. To achieve high thermally conductive polymer materials with a low concentration of additives, anisotropic, solid-state drawn composite films were prepared using water-soluble polyvinyl alcohol (PVA) and dispersible graphene oxide (GO). A co-additive (sodium dodecyl benzenesulfonate) was used to improve both the dispersion of GO and consequently the thermal conductivity. The hydrogen bonding between GO and PVA and the simultaneous alignment of GO and PVA in drawn composite films contribute to an improved thermal conductivity (∼25 W m^-1 K^-1), which is higher than most reported polymer composites and an approximately 50-fold enhancement over isotropic PVA (0.3-0.5 W m^-1 K^-1). This work provides a new method for preparing water-processable, drawn polymer composite films with high thermal conductivity, which may be useful for thermal management applications.

Sequence-Engineering Polyethylene-Polypropylene Copolymers with High Thermal Conductivity Using a Molecular-Dynamics-Based Genetic Algorithm

Polymer sequence engineering is emerging as a potential tool to modulate material properties. Here, we employ a combination of a genetic algorithm (GA) and atomistic molecular dynamics (MD) simulation to design polyethylene-polypropylene (PE-PP) copolymers with the aim of identifying a specific sequence with high thermal conductivity. PE-PP copolymers with various sequences at the same monomer ratio are found to have a broad distribution of thermal conductivities. This indicates that the monomer sequence has a crucial effect on thermal energy transport of the copolymers. A non-periodic and non-intuitive optimal sequence is indeed identified by the GA, which gives the highest thermal conductivity compared with any regular block copolymers, for example, diblock, triblock, and hexablock. In comparison to the bulk density, chain conformations, and vibrational density of states, the monomer sequence has the strongest impact on the efficiency of thermal energy transport via inter- and intra-molecular interactions. Our work highlights polymer sequence engineering as a promising approach for tuning the thermal conductivity of copolymers, and it provides an example application of integrating atomistic MD modeling with the GA for computational material design.

Unidirectional coherent energy transport via conjugated oligo(p-phenylene) chains

We discovered a way to funnel high-frequency vibrational quanta rapidly and unidirectionally over large distances using oligo(p-phenylene) chains. After mid-IR photon photoexcitation of a -COOH end group, the excess energy is injected efficiently into the chain, forming vibrational wavepackets that propagate freely along the chain. The transport delivers high-energy vibrational quanta with a range of transport speeds reaching 8.6 km/s, which exceeds the speed of sound in common metals (∼5 km/s) and polymers (∼2 km/s). Efficiencies of energy injection into the chain and transport along the chain are found to be very high and dependent on the extent of conjugation across the structure. By tuning the degree of conjugation via electronic doping of the chain, the transport speed and efficiency can be controlled. The study opens avenues for developing materials with controllable energy transport properties for heat management, schemes with efficient energy delivery to hard-to-reach regions, including transport against thermal gradients, and ways for initiating chemical reactions remotely.

Heat conduction in polymer chains with controlled end-to-end distance

The low thermal conductance of polymers is one of the major drawbacks for many polymer-based products. However, a single polymer chain when stretched can have high thermal conductivities. We use non-equilibrium molecular dynamics simulations to study the steady-state thermal conductance along finite macromolecules under mechanical control of the end-to-end distance. We find that the nature of heat transport along such chains strongly depends on mechanical tuning, leading to significantly different heat conductions and temperature profiles along the chain in the compressed-chain and stretched-chain limits. This transition between modes of behaviors appears to be a threshold phenomenon: at relatively small end-to-end distances, the thermal conductance remains almost constant as one stretches the polymer chain. At given critical end-to-end distances, thermal conductances start to increase, reaching the fully extended chain values. Correlated with this behavior are two observations: first, the temperature bias falls mostly at contacts in the fully stretched chain, while part of it falls along the molecule in the compressed limit. Second, the heat conduction does not change significantly with the chain length in the stretched-chain limit but decreases dramatically when this length increases in the compressed molecule. This suggests that heat transfer along stretched chains is mostly ballistic, while in the compressed chain, heat is transferred by diffusive mechanisms. Significantly, these trends persist also for a large range of molecular structures and force fields, and the changing behavior correlates well with mode localization properties. Similar studies conducted with disordered chains and bundles of several chains show remnants of the same behavior.

Thermal conductivity of one-dimensional organic nanowires: effect of mass difference phonon scattering

We report the thermal conductivity of π-stacked metallophthalocyanine nanowires using the thermal bridge method. In the temperature range of 20-300 K, the thermal conductivity of copper phthalocyanine nanowires (CuPc NWs) and iron phthalocyanine nanowires (FePc NWs) increases with temperature and reaches a peak value at around T = 40 K, then decreases at a higher temperature following T ^-1 behavior. For three FePc NWs, the peak values are 7.1 ± 1.21, 8.3 ± 1.33, and 7.6 ± 1.42 Wm^-1 K^-1, respectively. The peak thermal conductivity is 6.6 ± 0.67 and 6.6 ± 0.51 Wm^-1 K^-1 for the two CuPc nanowires. The thermal conductivity of FePc NWs is slightly larger than that of CuPc NWs, which is believed to result from the different mass of metal atoms in the phthalocyanine centers, indicating a phonon mass-difference scattering effect. Meanwhile, the thermal contact conductance of the FePc-Pt interface is measured, which will benefit from a better understanding of the thermal transport across dissimilar interfaces.