Thermally assisted nanotransfer printing with sub-20-nm resolution and 8-inch wafer scalability

Wafer-Scale Replication of Plasmonic Nanostructures via Microbubbles for Nanophotonics

Quasi-3D plasmonic nanostructures are in high demand for their ability to manipulate and enhance light-matter interactions at subwavelength scales, making them promising building blocks for diverse nanophotonic devices. Despite their potential, the integration of these nanostructures with optical sensors and imaging systems on a large scale poses challenges. Here, a robust technique for the rapid, scalable, and seamless replication of quasi-3D plasmonic nanostructures is presented straight from their production wafers using a microbubble process. This approach not only simplifies the integration of quasi-3D plasmonic nanostructures into a wide range of standard and custom optical imaging devices and sensors but also significantly enhances their imaging and sensing performance beyond the limits of conventional methods. This study encompasses experimental, computational, and theoretical investigations, and it fully elucidates the operational mechanism. Additionally, it explores a versatile set of options for outfitting nanophotonic devices with custom-designed plasmonic nanostructures, thereby fulfilling specific operational criteria.

Polymer chain transport investigated using surface enhanced Raman spectroscopy: monitoring of diffusion kinetics on meso-structured plasmonic substrates

We utilize the results of surface-enhanced Raman spectroscopy (SERS)-based interdiffusion experiments on meso-structured substrates to independently validate direct observations of plasmonic enhancements on these elements. The plasmonic enhancement function (PEF) is crucial for accurately determining interdiffusion coefficients using this newly proposed SERS-based methodology. The substrates feature a microscale inverted pyramid geometry, coated with nanoscale sputtered gold. Interdiffusion experiments involve the sequential deposition of polymer bilayers, with deuterated polystyrene (dPS) at the bottom and polystyrene (PS) on top, followed by annealing while periodically acquiring Raman spectra. The temporal evolution of the PS Raman signal reflects not only the interdiffusion process but also plasmonic effects, as the Raman scattering primarily arises from the substrate's plasmonic hotspots. High-resolution finite element (FE) diffusion simulations, combined with experimental SERS data, are used to infer the PEF of the substrate. The derived PEF is consistent with two hotspots located at the apex and vertices of the pyramidal cavity, extending along the edges and spreading into the molecular layer in direct contact with the substrate. This finding is tested against experiments conducted at various diffusion rates, showing excellent agreement. It corroborates recent observations by Steuwe et al. regarding the localization of hotspots on this specific substrate but contradicts other studies that attribute hotspots solely to the micron-scale geometry. This analysis establishes a solid foundation for reliably determining diffusion coefficients using this SERS-based methodology.

Tip-based Lithography with a Sacrificial Layer

The fabrication of a highly controlled gold (Au) nanohole (NH) array via tip-based lithography is improved by incorporating a sacrificial layer-a tip-crash buffer layer. This inclusion mitigates scratches during the nano-indentation process by employing a 300 nm thick poly(methyl methacrylate) layer as a sacrificial layer on top of the Au film. Such a precaution ensures minimal scratches on the Au film, facilitating the creation of sub-50 nm Au NHs with a 15 nm gap between the Au NHs. The precision of this method exceeds that of fabricating Au NHs without a sacrificial layer. Demonstrating its versatility, this Au NH array is utilized in two distinct applications: as a dry etching mask to form a molybdenum disulfide hole array and as a catalyst in metal-assisted chemical etching, resulting in conical-shaped silicon nanostructures. Additionally, a significant electric field is generated when Au nanoparticles (NPs) are placed within the Au NHs. This effect arises from coupling electromagnetic waves, concentrated by the Au NHs and amplified by the Au NPs. A notable result of this configuration is the enhancement factor of surface-enhanced Raman scattering, which is an order of magnitude greater than that observed with just Au NHs and Au NPs alone.

Thermal-Assisted Multiscale Patterning of Nonplanar Colloidal Nanostructures for Multi-Modal Anti-Counterfeiting

Nanotransfer printing of colloidal nanoparticles is a promising technique for the fabrication of functional materials and devices. However, patterning nonplanar nanostructures pose a challenge due to weak adhesion from the extremely small nanostructure-substrate contact area. Here, the study proposes a thermal-assisted nonplanar nanostructure transfer printing (NP-NTP) strategy for multiscale patterning of polystyrene (PS) nanospheres. The printing efficiency is significantly improved from ≈3.1% at low temperatures to ≈97.2% under the glass transition temperature of PS. Additionally, the arrangement of PS nanospheres transitioned from disorder to long-range order. The mechanism of printing efficiency enhancement is the drastic drop of Young's modulus of nanospheres, giving rise to an increased contact area, self-adhesive effect, and inter-particle necking. To demonstrate the versatility of the NP-NTP strategy, it is combined with the intaglio transfer printing technique, and multiple patterns are created at both micro and macro scales at a 4-inch scale with a resolution of ≈2757 pixels per inch (PPI). Furthermore, a multi-modal anti-counterfeiting concept based on structural patterns at hierarchical length scales is proposed, providing a new paradigm of imparting multiscale nanostructure patterning into macroscale functional devices.

Illuminating Recent Progress in Nanotransfer Printing: Core Principles, Emerging Applications, and Future Perspectives

As the demand for diverse nanostructures in physical/chemical devices continues to rise, the development of nanotransfer printing (nTP) technology is receiving significant attention due to its exceptional throughput and ease of use. Over the past decade, researchers have attempted to enhance the diversity of materials and substrates used in transfer processes as well as to improve the resolution, reliability, and scalability of nTP. Recent research on nTP has made continuous progress, particularly using the control of the interfacial adhesion force between the donor mold, target material, and receiver substrate, and numerous practical nTP methods with niche applications have been demonstrated. This review article offers a comprehensive analysis of the chronological advancements in nTP technology and categorizes recent strategies targeted for high-yield and versatile printing based on controlling the relative adhesion force depending on interfacial layers. In detail, the advantages and challenges of various nTP approaches are discussed based on their working mechanisms, and several promising solutions to improve morphological/material diversity are presented. Furthermore, this review provides a summary of potential applications of nanostructured devices, along with perspectives on the outlook and remaining challenges, which are expected to facilitate the continued progress of nTP technology and to inspire future innovations.

Electrohydrodynamic Nanopatterning: A Novel Solvent-Assisted Technique for Unconventional Substrates

Electrohydrodynamic (EHD)-driven patterning is a pioneering lithographic technique capable of replicating and modifying micro/nanostructures efficiently. However, this process is currently restricted to conventional substrates, as it necessitates a uniform and robust electric field over a large area. Consequently, the use of nontraditional substrates, such as those that are flexible, nonflat, or have high insulation, has been notably limited. In our study, we extend the applicability of EHD-driven patterning by introducing a solvent-assisted capillary peel-and-transfer method that allows the successful removal of diverse EHD-induced structures from their original substrates. Compared with the traditional route, our process boasts a success rate close to 100%. The detached structures can then be efficiently transferred to nonconventional substrates, overcoming the limitations of the traditional EHD process. Our method exhibits significant versatility, as evidenced by successful transfer of structures with engineered wettability and patterned structures composed of metals and metal oxides onto nonconventional substrates.

Advances in lithographic techniques for precision nanostructure fabrication in biomedical applications

Nano-fabrication techniques have demonstrated their vital importance in technological innovation. However, low-throughput, high-cost and intrinsic resolution limits pose significant restrictions, it is, therefore, paramount to continue improving existing methods as well as developing new techniques to overcome these challenges. This is particularly applicable within the area of biomedical research, which focuses on sensing, increasingly at the point-of-care, as a way to improve patient outcomes. Within this context, this review focuses on the latest advances in the main emerging patterning methods including the two-photon, stereo, electrohydrodynamic, near-field electrospinning-assisted, magneto, magnetorheological drawing, nanoimprint, capillary force, nanosphere, edge, nano transfer printing and block copolymer lithographic technologies for micro- and nanofabrication. Emerging methods enabling structural and chemical nano fabrication are categorised along with prospective chemical and physical patterning techniques. Established lithographic techniques are briefly outlined and the novel lithographic technologies are compared to these, summarising the specific advantages and shortfalls alongside the current lateral resolution limits and the amenability to mass production, evaluated in terms of process scalability and cost. Particular attention is drawn to the potential breakthrough application areas, predominantly within biomedical studies, laying the platform for the tangible paths towards the adoption of alternative developing lithographic technologies or their combination with the established patterning techniques, which depends on the needs of the end-user including, for instance, tolerance of inherent limits, fidelity and reproducibility.

Direct Printing of Ultrathin Block Copolymer Film with Nano-in-Micro Pattern Structures

Nanotransfer printing (nTP) is one of the most promising nanopatterning methods given that it can be used to produce nano-to-micro patterns effectively with functionalities for electronic device applications. However, the nTP process is hindered by several critical obstacles, such as sub-20 nm mold technology, reliable large-area replication, and uniform transfer-printing of functional materials. Here, for the first time, a dual nanopatterning process is demonstrated that creates periodic sub-20 nm structures on the eight-inch wafer by the transfer-printing of patterned ultra-thin (<50 nm) block copolymer (BCP) film onto desired substrates. This study shows how to transfer self-assembled BCP patterns from the Si mold onto rigid and/or flexible substrates through a nanopatterning method of thermally assisted nTP (T-nTP) and directed self-assembly (DSA) of Si-containing BCPs. In particular, the successful microscale patternization of well-ordered sub-20 nm SiOx patterns is systematically presented by controlling the self-assembly conditions of BCP and printing temperature. In addition, various complex pattern geometries of nano-in-micro structures are displayed over a large patterning area by T-nTP, such as angular line, wave line, ring, dot-in-hole, and dot-in-honeycomb structures. This advanced BCP-replicated nanopatterning technology is expected to be widely applicable to nanofabrication of nano-to-micro electronic devices with complex circuits.

Efficient and sustainable water electrolysis achieved by excess electron reservoir enabling charge replenishment to catalysts

Suppressing the oxidation of active-Ir(III) in IrOx catalysts is highly desirable to realize an efficient and durable oxygen evolution reaction in water electrolysis. Although charge replenishment from supports can be effective in preventing the oxidation of IrOx catalysts, most supports have inherently limited charge transfer capability. Here, we demonstrate that an excess electron reservoir, which is a charged oxygen species, incorporated in antimony-doped tin oxide supports can effectively control the Ir oxidation states by boosting the charge donations to IrOx catalysts. Both computational and experimental analyses reveal that the promoted charge transfer driven by excess electron reservoir is the key parameter for stabilizing the active-Ir(III) in IrOx catalysts. When used in a polymer electrolyte membrane water electrolyzer, Ir catalyst on excess electron reservoir incorporated support exhibited 75 times higher mass activity than commercial nanoparticle-based catalysts and outstanding long-term stability for 250 h with a marginal degradation under a water-splitting current of 1 A cm-2. Moreover, Ir-specific power (74.8 kW g-1) indicates its remarkable potential for realizing gigawatt-scale H2 production for the first time.

High-Resolution Nanotransfer Printing of Porous Crossbar Array Using Patterned Metal Molds by Extreme-Pressure Imprint Lithography

High-resolution nanotransfer printing (nTP) technologies have attracted a tremendous amount of attention due to their excellent patternability, high productivity, and cost-effectiveness. However, there is still a need to develop low-cost mold manufacturing methods, because most nTP techniques generally require the use of patterned molds fabricated by high-cost lithography technology. Here, we introduce a novel nTP strategy that uses imprinted metal molds to serve as an alternative to a Si stamp in the transfer printing process. We present a method by which to fabricate rigid surface-patterned metallic molds (Zn, Al, and Ni) based on the process of direct extreme-pressure imprint lithography (EPIL). We also demonstrate the nanoscale pattern formation of functional materials, in this case Au, TiO2, and GST, onto diverse surfaces of SiO2/Si, polished metal, and slippery glass by the versatile nTP method using the imprinted metallic molds with nanopatterns. Furthermore, we show the patterning results of nanoporous crossbar arrays on colorless polyimide (CPI) by a repeated nTP process. We expect that this combined nanopatterning method of EPIL and nTP processes will be extendable to the fabrication of various nanodevices with complex circuits based on micro/nanostructures.

Formation of Multiscale Pattern Structures by Combined Patterning of Nanotransfer Printing and Laser Micromachining

Various lithography techniques have been widely used for the fabrication of next-generation device applications. Micro/nanoscale pattern structures formed by lithographic methods significantly improve the performance capabilities of the devices. Here, we introduce a novel method that combines the patterning of nanotransfer printing (nTP) and laser micromachining to fabricate multiscale pattern structures on a wide range of scales. Prior to the formation of various nano-in-micro-in-millimeter (NMM) patterns, the nTP process is employed to obtain periodic nanoscale patterns on the target substrates. Then, an optimum laser-based patterning that effectively engraves various nanopatterned surfaces, in this case, spin-cast soft polymer film, rigid polymer film, a stainless still plate, and a Si substrate, is established. We demonstrate the formation of well-defined square and dot-shaped multiscale NMM-patterned structures by the combined patterning method of nTP and laser processes. Furthermore, we present the generation of unusual text-shaped NMM pattern structures on colorless polyimide (CPI) film, showing optically excellent rainbow luminescence based on the configuration of multiscale patterns from nanoscale to milliscale. We expect that this combined patterning strategy will be extendable to other nano-to-micro fabrication processes for application to various nano/microdevices with complex multiscale pattern geometries.

High-fidelity and clean nanotransfer lithography using structure-embedded and electrostatic-adhesive carriers

Metallic nanostructures are becoming increasingly important for both fundamental research and practical devices. Many emerging applications employing metallic nanostructures often involve unconventional substrates that are flexible or nonplanar, making direct lithographic fabrication very difficult. An alternative approach is to transfer prefabricated structures from a conventional substrate; however, it is still challenging to maintain high fidelity and a high yield in the transfer process. In this paper, we propose a high-fidelity, clean nanotransfer lithography method that addresses the above challenges by employing a polyvinyl acetate (PVA) film as the transferring carrier and promoting electrostatic adhesion through triboelectric charging. The PVA film embeds the transferred metallic nanostructures and maintains their spacing with a remarkably low variation of <1%. When separating the PVA film from the donor substrate, electrostatic charges are generated due to triboelectric charging and facilitate adhesion to the receiver substrate, resulting in a high large-area transfer yield of up to 99.93%. We successfully transferred the metallic structures of a variety of materials (Au, Cu, Pd, etc.) with different geometries with a <50-nm spacing, high aspect ratio (>2), and complex 3D structures. Moreover, the thin and flexible carrier film enables transfer on highly curved surfaces, such as a single-mode optical fiber with a curvature radius of 62.5 μm. With this strategy, we demonstrate the transfer of metallic nanostructures for a compact spectrometer with Cu nanogratings transferred on a convex lens and for surface-enhanced Raman spectroscopy (SERS) characterization on graphene with reliable responsiveness.

Moiré Modulation of Van Der Waals Potential in Twisted Hexagonal Boron Nitride

When a twist angle is applied between two layered materials (LMs), the registry of the layers and the associated change in their functional properties are spatially modulated, and a moiré superlattice arises. Several works explored the optical, electric, and electromechanical moiré-dependent properties of such twisted LMs but, to the best of our knowledge, no direct visualization and quantification of van der Waals (vdW) interlayer interactions has been presented, so far. Here, we use tapping mode atomic force microscopy phase-imaging to probe the spatial modulation of the vdW potential in twisted hexagonal boron nitride. We find a moiré superlattice in the phase channel only when noncontact (long-range) forces are probed, revealing the modulation of the vdW potential at the sample surface, following AB and BA stacking domains. The creation of scalable electrostatic domains, modulating the vdW potential at the interface with the environment by means of layer twisting, could be used for local adhesion engineering and surface functionalization by affecting the deposition of molecules or nanoparticles.

Direct Chemisorption-Assisted Nanotransfer Printing with Wafer-Scale Uniformity and Controllability

Nanotransfer printing techniques have attracted significant attention due to their outstanding simplicity, cost-effectiveness, and high throughput. However, conventional methods via a chemical medium hamper the efficient fabrication with large-area uniformity and rapid development of electronic and photonic devices. Herein, we report a direct chemisorption-assisted nanotransfer printing technique based on the nanoscale lower melting effect, which is an enabling technology for two- or three-dimensional nanostructures with feature sizes ranging from tens of nanometers up to a 6 in. wafer-scale. The method solves the major bottleneck (large-scale uniform metal catalysts with nanopatterns) encountered by metal-assisted chemical etching. It also achieves wafer-scale, uniform, and controllable nanostructures with extremely high aspect ratios. We further demonstrate excellent uniformity and high performance of the resultant devices by fabricating 100 photodetectors on a 6 in. Si wafer. Therefore, our method can create a viable route for next-generation, wafer-scale, uniformly ordered, and controllable nanofabrication, leading to significant advances in various applications, such as energy harvesting, quantum, electronic, and photonic devices.

Instant interfacial self-assembly for homogeneous nanoparticle monolayer enabled conformal "lift-on" thin film technology

Thin film fabrication is of great importance in modern engineering. Here, we propose a universal and conformal thin film technique enabled by the wetting empowered interfacial self-assembly. By tailoring the contact angle of nanoparticle (NP), a NP monolayer can be assembled instantly (within 5 seconds) with an excellent harvesting efficiency (up to 97.5 weight %). This self-assembly strategy presents a universal applicability on various materials, e.g., nonmetal, metal, and core-shell structures, and can achieve a monolayer with same in-plane area as a 95 cm² wafer in a single process, indicating great potential for scale-up manufacturing. Through a template transfer, we coat the surface of different substrates (plastic, paper, etc.) with the assembled film in a conformal and nondestructive “lift-on” manner and subsequently demonstrate fluorescent micropatterns. This self-assembly strategy has great implications in advancing thin film technology in a user-friendly and cost-effective fashion for applications in anti-counterfeiting, actuators, and wearable/flexible electronics.

Instant interfacial self-assembly for homogeneous nanoparticle monolayer enabled conformal "lift-on" thin film technology

Thin film fabrication is of great importance in modern engineering. Here, we propose a universal and conformal thin film technique enabled by the wetting empowered interfacial self-assembly. By tailoring the contact angle of nanoparticle (NP), a NP monolayer can be assembled instantly (within 5 seconds) with an excellent harvesting efficiency (up to 97.5 weight %). This self-assembly strategy presents a universal applicability on various materials, e.g., nonmetal, metal, and core-shell structures, and can achieve a monolayer with same in-plane area as a 95 cm² wafer in a single process, indicating great potential for scale-up manufacturing. Through a template transfer, we coat the surface of different substrates (plastic, paper, etc.) with the assembled film in a conformal and nondestructive “lift-on” manner and subsequently demonstrate fluorescent micropatterns. This self-assembly strategy has great implications in advancing thin film technology in a user-friendly and cost-effective fashion for applications in anti-counterfeiting, actuators, and wearable/flexible electronics.

Rotating Cylinder-Assisted Nanoimprint Lithography for Enhanced Chemisorbable Filtration Complemented by Molecularly Imprinted Polymers

Rotating cylindrical stamp-based nanoimprint technique has many advantages, including the continuous fabrication of intriguing micro/nanostructures and rapid pattern transfer on a large scale. Despite these advantages, the previous nanoimprint lithography has rarely been used for producing sophisticated nanoscale patterns on a non-planar substrate that has many extended applications. Here, the simple integration of nanoimprinting process with a help of a transparent stamp wrapped on the cylindrical roll and UV optical source in the core to enable high-throughput pattern transfer, particularly on a fabric substrate is demonstrated. Moreover, as a functional resin material, this innovative strategy involves a synergistic approach on the synthesis of molecularly imprinted polymer, which are spatially organized free-standing perforated nanostructures such as nano/microscale lines, posts, and holes patterns on various woven or nonwoven blank substrates. The proposed materials can serve as a self-encoded filtration medium for selective separation of formaldehyde molecules. It is envisioned that the combinatorial fabrication process and attractive material paves the way for designing next-generation separation systems in use to capture industrial or household toxic substances.

Switching-Modulated Phase Change Memory Realized by Si-Containing Block Copolymers

The phase change memory (PCM) is one of the key enabling memory technologies for next-generation non-volatile memory device applications due to its high writing speed, excellent endurance, long retention time, and good scalability. However, the high power consumption of PCM devices caused by the high switching current from a high resistive state to a low resistive state is a critical obstacle to be resolved before widespread commercialization can be realized. Here, a useful approach to reduce the writing current of PCM, which depends strongly on the contact area between the heater electrode and active layer, by employing self-assembly process of Si-containing block copolymers (BCPs) is presented. Self-assembled insulative BCP pattern geometries can locally block the current path of the contact between a high resistive film (TiN) and a phase-change material (Ge₂ Sb₂ Te₅ ), resulting in a significant reduction of the writing current. Compared to a conventional PCM cell, the BCP-modified PCM shows excellent switching power reduction up to 1/20 given its use of self-assembled hybrid SiFe_x O_y /SiO_x dot-in-hole nanostructures. This BCP-based bottom-up process can be extended to various applications of other non-volatile memory devices, such as resistive switching memory and magnetic storage devices.

Controlled self-assembly of block copolymers in printed sub-20 nm cross-bar structures

Directed self-assembly (DSA) of block copolymers (BCPs) has garnered much attention due to its excellent pattern resolution, simple process, and good compatibility with many other lithography methods for useful nanodevice applications. Here, we present a BCP-based multiple nanopatterning process to achieve three-dimensional (3D) pattern formation of metal/oxide hybrid nanostructures. We employed a self-assembled sub-20 nm SiO x line pattern as a master mold for nanotransfer printing (nTP) to generate a cross-bar array. By using the transfer-printed cross-bar structures as BCP-guiding templates, we can obtain well-ordered BCP microdomains in the distinct spaces of the nanotemplates through a confined BCP self-assembly process. We also demonstrate the morphological evolution of a cylinder-forming BCP by controlling the BCP film thickness, showing a clear morphological transition from cylinders to spheres in the designated nanospaces. Furthermore, we demonstrate how to control the number of BCP spheres within the cross-bar 3D pattern by adjusting the printing angle of the multiple nTP process to provide a suitable area for spontaneous BCP accommodation. This multiple-patterning-based approach is applicable to useful 3D nanofabrication of various devices with complex hybrid nanostructures.

Topographically designed hybrid nanostructures via nanotransfer printing and block copolymer self-assembly

Nanotransfer printing (nTP) has attracted much attention due to its high pattern resolution, simple process, and low processing cost for useful nanofabrication. Here, we introduce a thermally assisted nTP (T-nTP) process for the effective fabrication of various periodic three-dimensional (3D) nanosheets, such as concavo-convex lines, spine lines, square domes, and complex multi-line patterns. The T-nTP method allows continuous nanoscale 3D patterns with functionality to be transferred onto both rigid and flexible substrates by heat without any collapse of uniform convex nanostructures with nanochannels. We also show the pattern formation of multi-layered hybrid structures consisting of two or more materials by T-nTP. Furthermore, the formation of silicon oxide nanodots (0D) within a printed metallic nanowave structure (3D) can be achieved by the combined method of T-nTP and the self-assembly of poly(styrene-b-dimethylsiloxane) (PS-b-PDMS) block copolymers. Moreover, we demonstrate how to obtain well-defined oxide-metal hybrid nanostructures (0D-in-3D) through the spontaneous accommodation of PDMS spheres in the confined spaces of an Au-wave nanotemplate. This approach is applicable during the nanofabrication of various high-resolution devices with complex geometrical nanopatterns.

Conformation-modulated three-dimensional electrocatalysts for high-performance fuel cell electrodes

Unsupported Pt electrocatalysts demonstrate excellent electrochemical stability when used in polymer electrolyte membrane fuel cells; however, their extreme thinness and low porosity result in insufficient surface area and high mass transfer resistance. Here, we introduce three-dimensionally (3D) customized, multiscale Pt nanoarchitectures (PtNAs) composed of dense and narrow (for sufficient active sites) and sparse (for improved mass transfer) nanoscale building blocks. The 3D-multiscale PtNA fabricated by ultrahigh-resolution nanotransfer printing exhibited excellent performance (45% enhanced maximum power density) and high durability (only 5% loss of surface area for 5000 cycles) compared to commercial Pt/C. We also theoretically elucidate the relationship between the 3D structures and cell performance using computational fluid dynamics. We expect that the structure-controlled 3D electrocatalysts will introduce a new pathway to design and fabricate high-performance electrocatalysts for fuel cells, as well as various electrochemical devices that require the precision engineering of reaction surfaces and mass transfer.

Extreme-Pressure Imprint Lithography for Heat and Ultraviolet-Free Direct Patterning of Rigid Nanoscale Features

Nanoimprint lithography (NIL) is typically performed by filling up of molds by heated polymers or UV-curable liquid resists, inevitably requiring subsequent pattern-transfer processes. Although direct NIL techniques have been suggested alternatively, they usually require precursors or ink-type resists containing undesired organic components. Here, we demonstrate extreme-pressure imprint lithography (EPIL) that effectively produces well-defined multiscale structures with a wide range from 10 nm to 10 mm on diverse surfaces even including pure or alloy metals without using any precursors, heating, UV exposure, or pattern transfer. In particular, EPIL is accomplished through precise control of room-temperature plastic deformation in nanoscale volumes, which is elucidated by finite element analyses and molecular dynamics simulations. In addition to scalability to macroscopic areas, we confirm the outstanding versatility of EPIL via its successful applications to Ni, Cu, steel, and organics. We expect that the state-of-the-art EPIL process combined with other emerging nanopatterning technologies will be extendable to the future large-area nanofabrication of various devices.

Large Area Patterning of Nanoparticles and Nanostructures: Current Status and Future Prospects

Nanoparticles possess exceptional optical, magnetic, electrical, and chemical properties. Several applications, ranging from surfaces for optical displays and electronic devices, to energy conversion, require large-area patterns of nanoparticles. Often, it is crucial to maintain a defined arrangement and spacing between nanoparticles to obtain a consistent and uniform surface response. In the majority of the established patterning methods, the pattern is written and formed, which is slow and not scalable. Some parallel techniques, forming all points of the pattern simultaneously, have therefore emerged. These methods can be used to quickly assemble nanoparticles and nanostructures on large-area substrates into well-ordered patterns. Here, we review these parallel methods, the materials that have been processed by them, and the types of particles that can be used with each method. We also emphasize the maximal substrate areas that each method can pattern and the distances between particles. Finally, we point out the advantages and disadvantages of each method, as well as the challenges that still need to be addressed to enable facile, on-demand large-area nanopatterning.

Formation of Li2CO3 Nanostructures for Lithium-Ion Battery Anode Application by Nanotransfer Printing

Various high-performance anode and cathode materials, such as lithium carbonate, lithium titanate, cobalt oxides, silicon, graphite, germanium, and tin, have been widely investigated in an effort to enhance the energy density storage properties of lithium-ion batteries (LIBs). However, the structural manipulation of anode materials to improve the battery performance remains a challenging issue. In LIBs, optimization of the anode material is a key technology affecting not only the power density but also the lifetime of the device. Here, we introduce a novel method by which to obtain nanostructures for LIB anode application on various surfaces via nanotransfer printing (nTP) process. We used a spark plasma sintering (SPS) process to fabricate a sputter target made of Li2CO3, which is used as an anode material for LIBs. Using the nTP process, various Li2CO3 nanoscale patterns, such as line, wave, and dot patterns on a SiO2/Si substrate, were successfully obtained. Furthermore, we show highly ordered Li2CO3 nanostructures on a variety of substrates, such as Al, Al2O3, flexible PET, and 2-Hydroxylethyl Methacrylate (HEMA) contact lens substrates. It is expected that the approach demonstrated here can provide new pathway to generate many other designable structures of various LIB anode materials.