High-κ Dielectric (HfO2)/2D Semiconductor (HfSe2) Gate Stack for Low-Power Steep-Switching Computing Devices

Herein, a high-quality gate stack (native HfO2 formed on 2D HfSe2) fabricated via plasma oxidation is reported, realizing an atomically sharp interface with a suppressed interface trap density (Dit ≈ 5 × 1010 cm-2 eV-1). The chemically converted HfO2 exhibits dielectric constant, κ ≈ 23, resulting in low gate leakage current (≈10-3 A cm-2) at equivalent oxide thickness ≈0.5 nm. Density functional calculations indicate that the atomistic mechanism for achieving a high-quality interface is the possibility of O atoms replacing the Se atoms of the interfacial HfSe2 layer without a substitution energy barrier, allowing layer-by-layer oxidation to proceed. The field-effect-transistor-fabricated HfO2/HfSe2 gate stack demonstrates an almost ideal subthreshold slope (SS) of ≈61 mV dec-1 (over four orders of IDS) at room temperature (300 K), along with a high Ion/Ioff ratio of ≈108 and a small hysteresis of ≈10 mV. Furthermore, by utilizing a device architecture with separately controlled HfO2/HfSe2 gate stack and channel structures, an impact ionization field-effect transistor is fabricated that exhibits n-type steep-switching characteristics with a SS value of 3.43 mV dec-1 at room temperature, overcoming the Boltzmann limit. These results provide a significant step toward the realization of post-Si semiconducting devices for future energy-efficient data-centric computing electronics.

Composition and Surface Optical Properties of GaSe:Eu Crystals before and after Heat Treatment

This work studies the technological preparation conditions, morphology, structural characteristics and elemental composition, and optical and photoluminescent properties of GaSe single crystals and Eu-doped β-Ga2O3 nanoformations on ε-GaSe:Eu single crystal substrate, obtained by heat treatment at 750-900 °C, with a duration from 30 min to 12 h, in water vapor-enriched atmosphere, of GaSe plates doped with 0.02-3.00 at. % Eu. The defects on the (0001) surface of GaSe:Eu plates serve as nucleation centers of β-Ga2O3:Eu crystallites. For 0.02 at. % Eu doping, the fundamental absorption edge of GaSe:Eu crystals at room temperature is formed by n = 1 direct excitons, while at 3.00 at. % doping, Eu completely shields the electron-hole bonds. The band gap of nanostructured β-Ga2O3:Eu layer, determined from diffuse reflectance spectra, depends on the dopant concentration and ranges from 4.64 eV to 4.87 eV, for 3.00 and 0.05 at. % doping, respectively. At 0.02 at. % doping level, the PL spectrum of ε-GaSe:Eu single crystals consists of the n = 1 exciton band, together with the impurity band with a maximum intensity at 800 nm. Fabry-Perrot cavities with a width of 9.3 μm are formed in these single crystals, which determine the interference structure of the impurity PL band. At 1.00-3.00 at. % Eu concentrations, the PL spectra of GaSe:Eu single crystals and β-Ga2O3:Eu nanowire/nanolamellae layers are determined by electronic transitions of Eu2+ and Eu3+ ions.

Corrosion of Passive Aluminum Anodes in a Chloroaluminate Deep Eutectic Solvent for Secondary Batteries: The Bad, the Good, and the Ugly

The passivity of aluminum is detrimental to its performance as an anode in batteries. Soaking of native oxide-covered aluminum in a chloroaluminate deep eutectic solvent gradually activates the electrode surface, which is reflected in a continuously decreasing open circuit potential. The underlying processes were studied by analyzing the 3 to 7 nm thick layer of native oxide after increasing periods of soaking with secondary neutral mass spectrometry, X-ray photoelectron spectroscopy, and energy-dispersive spectroscopy in a transmission electron microscope. They consistently show permeation of electrolyte species into the layer associated with gradual swelling. After extended periods of soaking at open circuit potentials, local deposits of a range of foreign metals have been found in scanning electron microscopy images of the electrode surface. The pitting corrosion is caused by trace metal ion impurities present in the electrolyte and results in highly nonuniform current density distribution during discharge/charge cycling of battery cells as shown by local deposits of aluminum. The processes during soaking at open circuit potentials have been monitored by electrochemical impedance spectroscopy and could be analyzed by fitting an equivalent circuit model for pitting corrosion.

Enhanced Energetic Performance of Aluminum Nanoparticles by Plasma Deposition of Perfluorinated Nanofilms

The performance of Al as nanoenergetic material in solid fuel propulsion or additive in liquid fuels is limited by the presence of the native oxide layer at the surface, which represents a significant weight fraction, does not contribute to heat release during oxidation, and acts as a diffusion barrier to Al oxidation. We develop an efficient technique in which the oxide layer is effectively turned into an energetic component via a reaction with fluorine that is coated in the form of a fluorocarbon nanofilm on the Al surface by plasma-enhanced chemical vapor deposition. Perfluorodecalin vapors are introduced in a low-pressure plasma reactor to produce nanofilms on the surface of Al nanoparticles, whose thickness is controlled with nanolevel precision as demonstrated by high-resolution transmission electron microscopy images. Coated particles show superior heat release, with a maximum enhancement of 50% at a thickness of 10 nm. This significant improvement is attributed to the chemical interaction between Al₂O₃ and F to form AlF₃, which removes the oxide barrier via an exothermic reaction and contributes to the amount of heat released during thermal oxidation. The chemistry and mechanism of the enhancement effect of the plasma nanofilms are explained with the help of X-ray photoelectron spectroscopy, X-ray diffraction, high-angle annular dark-field scanning transmission electron microscopy-energy dispersive spectroscopy, thermogravimetric analysis, and differential scanning calorimetry.

Enhanced Hole Injection Characteristics of a Top Emission Organic Light-Emitting Diode with Pure Aluminum Anode

A top emitting organic light-emitting diode (OLED) device with pure aluminum (Al) anode for high-resolution microdisplays was proposed and fabricated. The low work function of the Al anode, even with a native oxide formed on the Al anode surface, increases the energy barrier of the interface between the anode and hole injection layer, and has poor hole-injection properties, which causes the low efficiency of the device. To enhance the hole-injection characteristics of the Al anode, we applied hexaazatriphenylene hexacarbonitrile (HATCN) as the hole-injection layer material. The proposed OLED device with a pure Al anode and native oxide on the anode surface improved efficiency by up to 35 cd/A at 1000 nit, which is 78% of the level of normal OLEDs with indium tin oxide (ITO) anode.

Controlling Native Oxidation of HfS2 for 2D Materials Based Flash Memory and Artificial Synapse

Two-dimensional (2D) materials based artificial synapses are important building blocks for the brain-inspired computing systems that are promising in handling large amounts of informational data with high energy-efficiency in the future. However, 2D devices usually rely on deposited or transferred insulators as the dielectric layer, resulting in various challenges in device compatibility and fabrication complexity. Here, we demonstrate a controllable and reliable oxidation process to turn 2D semiconductor HfS₂ into native oxide, HfO_x, which shows good insulating property and clean interface with HfS₂. We then incorporate the HfO_x/HfS₂ heterostructure into a flash memory device, achieving a high on/off current ratio of ∼10⁵, a large memory window over 60 V, good endurance, and a long retention time over 10³ seconds. In particular, the memory device can work as an artificial synapse to emulate basic synaptic functions and feature good linearity and symmetry in conductance change during long-term potentiation/depression processes. A simulated artificial neural network based on our synaptic device achieves a high accuracy of ∼88% in MNIST pattern recognition. Our work provides a simple and effective approach for integrating high-k dielectrics into 2D material-based memory and synaptic devices.

Surface-Functionalized Boron Nanoparticles with Reduced Oxide Content by Nonthermal Plasma Processing for Nanoenergetic Applications

The development of an in situ nonthermal plasma technology improved the oxidation and energy release of boron nanoparticles. We reduced the native oxide layer on the surface of boron nanoparticles (70 nm) by treatment in a nonthermal hydrogen plasma, followed by the formation of a passivation barrier by argon plasma-enhanced chemical vapor deposition (PECVD) using perfluorodecalin (C₁₀F₁₈). Both processes occur near room temperature, thus avoiding aggregation and sintering of the nanoparticles. High-resolution transmission electron microscopy (HRTEM), high-angular annular dark-field imaging (HAADF)-scanning TEM (STEM)-energy dispersive spectroscopy (EDS), and X-ray photoelectron spectroscopy (XPS) demonstrated a significant reduction in surface oxide concentration due to hydrogen plasma treatment and the formation of a 2.5 nm thick passivation coating on the surface due to PECVD treatment. These results correlated with the thermal analysis results, which demonstrated a 19% increase in energy release and an increase in metallic boron content after 120 min of hydrogen plasma treatment and 15 min of PECVD of perfluorodecalin. The PECVD coating provided excellent passivation against air and humidity for 60 days. We conclude in situ nonthermal plasma reduction and passivation lead to the amelioration of energy release characteristics and the storage life of boron nanoparticles, benefits conducive for nanoenergetic applications.

Uniform High-k Amorphous Native Oxide Synthesized by Oxygen Plasma for Top-Gated Transistors

The integration of high-k gate dielectrics with two-dimensional (2D) semiconducting channel materials is essential for high-performance and low-power electronics. However, the conformal deposition of a uniform high-k dielectric with sub-1 nm equivalent oxide thickness (EOT) and high interface quality on high-mobility 2D semiconductors is still challenging. Here, we report a facile approach to synthesize a uniform high-k (ε_r ∼ 22) amorphous native oxide Bi₂SeO_x on the high-mobility 2D semiconducting Bi₂O₂Se using O₂ plasma at room temperature. The conformal native oxide can directly serve as gate dielectrics with EOT of ∼0.9 nm, while the original properties of underlying 2D Bi₂O₂Se is preserved. Furthermore, high-resolution area-selective oxidation of Bi₂O₂Se is achieved to fabricate discrete electronic components. This facile integration of a high-mobility 2D semiconductor and its high-k native oxide holds high promise for next-generation nanoelectronics.

Native Oxide Seeded Spontaneous Integration of Dielectrics on Exfoliated Black Phosphorus

Two-dimensional (2D) semiconductors have been a central focus for next-generation electronics and optoelectronics owing to their great potential to extend the scaling limits in a silicon transistor. However, due to the lack of surface dangling bonds in most 2D semiconductors, such as graphene and transition metal dichalcogenides (TMDs), the direct growth of the high-κ film on these 2D materials via an atomic layer deposition (ALD) technique often produces dielectrics with poor quality, which hinders their integration in the modern semiconductor industry. Here, we comprehensively investigate the ALD growth of the Al₂O₃ layer on 2D exfoliated black phosphorus (BP). Intriguingly, we found that the 2D BP with "silicon-like" characteristics possesses a native surface oxide layer P_xO_y after air exposure. The P_xO_y-induced surface dangling bonds enable the spontaneous integration of the high-quality Al₂O₃ layer on the BP flake without any pretreatments to functionalize the surface. Additionally, the Al₂O₃ layer could effectively passivate BP to prevent its degradation in ambient conditions, which addresses the most serious problem of the BP material. Moreover, the Al₂O₃-encapsulated BP field-effect transistor (FET) exhibits good electrical transport performance, with a high hole mobility of ∼420 cm² V^-1 s^-1 and electron mobility of ∼80 cm² V^-1 s^-1. Moreover, the high-quality Al₂O₃ layer can also be integrated into the top-gated BP transistor and inverter. Our findings reveal the silicon-like characteristics of BP for the high-κ ALD dielectric growth technology, which promises the seamless integration of 2D BP in the modern semiconductor industry.

Bifunctional NbS2-Based Asymmetric Heterostructure for Lateral and Vertical Electronic Devices

Structural asymmetry of materials plays a crucial role in developing multipurpose devices. Layered metallic transition metal dichalcogenides (MTMDCs) have been proposed as promising materials in electronics. However, they are still subject to native surface oxidation, limiting their practical applications. Combination of surface protection and native surface oxidation of MTMDCs will create asymmetric structures for devices but has yet to be explored. Here, we report a bifunctional NbS₂-based vertical heterostructure derived from epitaxially grown NbS₂ on MoS₂ followed by a natural oxidation (MoS₂-NbS₂-NbO_x), which simultaneously exhibits both high-efficiency tunneling conductive and memristive surfaces. With the tunneling conductive surface, the heterostructure functions as nearly ohmic contact electrodes with a two-dimensional (2D) channel in lateral transistors, delivering an enhanced mobility ∼140 times higher than that of the exfoliated NbS₂-contacted device. With the memristive surface, the heterostructure can be used to build high-performance lateral or vertical memristors with low working voltages and synaptic functions. By combining both types of surfaces, a memristor array for nonvolatile memory is further developed. Moreover, the memristors show a good endurance for 2000 cycles of bending as flexible devices. The bifunctional heterostructure based on NbS₂ offers a strategy toward the future applications of layered metallic materials.

Surfing Silicon Nanofacets for Cold Cathode Electron Emission Sites

Point sources exhibit low threshold electron emission due to local field enhancement at the tip. In the case of silicon, however, the realization of tip emitters has been hampered by unwanted oxidation, limiting the number of emission sites and the overall current. In contrast to this, here, we report the fascinating low threshold (∼0.67 V μm^-1) cold cathode electron emission from silicon nanofacets (Si-NFs). The ensembles of nanofacets fabricated at different time scales, under low energy ion impacts, yield tunable field emission with a Fowler-Nordheim tunneling field in the range of 0.67-4.75 V μm^-1. The local probe surface microscopy-based tunneling current mapping in conjunction with Kelvin probe force microscopy measurements revealed that the valleys and a part of the sidewalls of the nanofacets contribute more to the field emission process. The observed lowest turn-on field is attributed to the absence of native oxide on the sidewalls of the smallest facets as well as their lowest work function. In addition, first-principle density functional theory-based simulation revealed a crystal orientation-dependent work function of Si, which corroborates well with our experimental observations. The present study demonstrates a novel way to address the origin of the cold cathode electron emission sites from Si-NFs fabricated at room temperature. In principle, the present methodology can be extended to probe the cold cathode electron emission sites from any nanostructured material.

Investigation of nanoparticulate silicon as printed layers using scanning electron microscopy, transmission electron microscopy, X-ray absorption spectroscopy and X-ray photoelectron spectroscopy

The presence of native oxide on the surface of silicon nanoparticles is known to inhibit charge transport on the surfaces. Scanning electron microscopy (SEM) studies reveal that the particles in the printed silicon network have a wide range of sizes and shapes. High-resolution transmission electron microscopy reveals that the particle surfaces have mainly the (111)- and (100)-oriented planes which stabilizes against further oxidation of the particles. X-ray absorption spectroscopy (XANES) and X-ray photoelectron spectroscopy (XPS) measurements at the O 1s-edge have been utilized to study the oxidation and local atomic structure of printed layers of silicon nanoparticles which were milled for different times. XANES results reveal the presence of the +4 (SiO₂) oxidation state which tends towards the +2 (SiO) state for higher milling times. Si 2p XPS results indicate that the surfaces of the silicon nanoparticles in the printed layers are only partially oxidized and that all three sub-oxide, +1 (Si₂O), +2 (SiO) and +3 (Si₂O₃), states are present. The analysis of the change in the sub-oxide peaks of the silicon nanoparticles shows the dominance of the +4 state only for lower milling times.

Anisotropic Black Phosphorus Synaptic Device for Neuromorphic Applications

The first black-phosphorus synaptic device is demonstrated, which offers intrinsic anisotropy in its synaptic characteristics directly resulting from its low crystalline symmetry. Key features of biological synapses, such as long-term plasticity with heterogeneity, including long-term potentiation/depression and spike-timing-dependent plasticity, are mimicked. This demonstration represents an important step toward introducing intrinsic heterogeneity to artificial neuromorphic systems.

Role of interfacial oxide in high-efficiency graphene-silicon Schottky barrier solar cells

The advent of chemical vapor deposition (CVD) grown graphene has allowed researchers to investigate large area graphene/n-silicon Schottky barrier solar cells. Using chemically doped graphene, efficiencies of nearly 10% can be achieved for devices without antireflective coatings. However, many devices reported in past literature often exhibit a distinctive s-shaped kink in the measured I/V curves under illumination resulting in poor fill factor. This behavior is especially prevalent for devices with pristine (not chemically doped) graphene but can be seen in some cases for doped graphene as well. In this work, we show that the native oxide on the silicon presents a transport barrier for photogenerated holes and causes recombination current, which is responsible for causing the kink. We experimentally verify our hypothesis and propose a simple semiconductor physics model that qualitatively captures the effect. Furthermore, we offer an additional optimization to graphene/n-silicon devices: by choosing the optimal oxide thickness, we can increase the efficiency of our devices to 12.4% after chemical doping and to a new record of 15.6% after applying an antireflective coating.

Origin of the accumulation layer at the InN/a-In2O3 interface

We perform first-principles Density Functional Theory calculations for the amorphous In2O3/InN (11̅00) heterostructure. Our results suggest that the interface between InN and its native amorphous oxide is a type "I" interface as observed in X-ray photoemission spectroscopy data for the same materials in the crystalline form. The microscopic analysis of the system reveals the presence of peculiar structural features localized at the interface, such as the formation of N-O bonds and the existence of N dangling bonds, that are responsible for donor states. These findings shed light on the origin of the electron accumulation layer occurring at the interface in spontaneously oxidized InN nanowires, recently associated with the observed increase in conductivity for such systems.

In situ transmission electron microscopy probing of native oxide and artificial layers on silicon nanoparticles for lithium ion batteries

Surface modification of silicon nanoparticles via molecular layer deposition (MLD) has been recently proved to be an effective way for dramatically enhancing the cyclic performance in lithium ion batteries. However, the fundamental mechanism of how this thin layer of coating functions is not known, which is complicated by the inevitable presence of native oxide of several nanometers on the silicon nanoparticle. Using in situ TEM, we probed in detail the structural and chemical evolution of both uncoated and coated silicon particles upon cyclic lithiation/delithation. We discovered that upon initial lithiation, the native oxide layer converts to crystalline Li2O islands, which essentially increases the impedance on the particle, resulting in ineffective lithiation/delithiation and therefore low Coulombic efficiency. In contrast, the alucone MLD-coated particles show extremely fast, thorough, and highly reversible lithiation behaviors, which are clarified to be associated with the mechanical flexibility and fast Li(+)/e(-) conductivity of the alucone coating. Surprisingly, the alucone MLD coating process chemically changes the silicon surface, essentially removing the native oxide layer, and therefore mitigates side reactions and detrimental effects of the native oxide. This study provides a vivid picture of how the MLD coating works to enhance the Coulombic efficiency, preserves capacity, and clarifies the role of the native oxide on silicon nanoparticles during cyclic lithiation and delithiation. More broadly, this work also demonstrates that the effect of the subtle chemical modification of the surface during the coating process may be of equal importance to the coating layer itself.