Interfacial modification of boron nitride nanoplatelets for epoxy composites with improved thermal properties

Protruding Boron Nitride Nanotubes on the Al2O3 Surface Enabled by Tannic Acid-Assisted Modification to Fabricate a Thermal Conductive Epoxy/Al2O3 Composite

Over the past few years, the ability to efficiently increase boron nitride nanotube (BNNT) production has opened up ample research possibilities. BNNT has garnered significant attention for diversifying its industrial applications. However, the problem of poor processability resulting from agglomeration and uneven distribution has emerged as a major challenge to integrating BNNT into the polymer matrix for composite material formation. Utilizing noncovalently attached molecules with various reactive sites can be a logical method to enhance the compatibility of BNNT with different polymers. The present study explored a simple approach to protruding BNNT onto the surface of Al2O3 through tannic acid (TA)-assisted generation of alkyl chains (octadecylamine, ODA) to fabricate Al2O3@ODA-BNNT. The subsequent compounding of Al2O3@ODA-BNNT with epoxy polymer generates interconnected thermal conduction pathways, thereby improving the thermal conduction and mechanical performance of the composites. The current research approach allows for the even distribution of BNNT throughout the polymer matrix, as demonstrated by optical characterization, mechanical performance analysis, and isotropic thermal conductivity analysis. The fabricated epoxy composite by incorporating a 2 wt % (BNNT = 1.3 wt % and ODA = 0.7 wt %) ODA-BNNT exhibited 5.117 W/mK thermal conductivity and 7.43 MPa mechanical stress. Thermal conductivity improved by 2528, 76.56, and 54.7%, while mechanical stress enhanced by 270, 221, and 34% compared to neat polymers without BNNT and virgin BNNT epoxy composites, respectively.

2D Materials-Based Thermal Interface Materials: Structure, Properties, and Applications

The challenges associated with heat dissipation in high-power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high-performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat sinks. Recently, emerging 2D materials, such as graphene and boron nitride, renowned for their ultrahigh basal-plane thermal conductivity and the capacity to facilitate cross-scale, multi-morphic structural design, have found widespread use as thermal fillers in the production of high-performance TIMs. To deepen the understanding of 2D material-based TIMs, this review focuses primarily on graphene and boron nitride-based TIMs, exploring their structures, properties, and applications. Building on this foundation, the developmental history of these TIMs is emphasized and a detailed analysis of critical challenges and potential solutions is provided. Additionally, the preparation and application of some other novel 2D materials-based TIMs are briefly introduced, aiming to offer constructive guidance for the future development of high-performance TIMs.

Influence of the 3-Hydroxyvalerate Content on the Processability, Nucleating and Blending Ability of Poly(3-Hydroxybutyrate-co-3-hydroxyvalerate)-Based Materials

Poly(3-hydroxybutyrate-co-3-hydroxyvalerate (P(3HB-co-3HV) copolymers are an attractive class of biopolymers whose properties can be tailored by changing the 3-hydroxyvalerate monomer (3HV) concentration, offering the possibility of counteracting problems related to high crystallinity, brittleness, and processability. However, there are few studies about the effects of 3HV content on the processability of copolymers. The present study aims to provide new insights into the effect of 3HV content on the processing step including common practices like compounding, addition of nucleation agents and/or amorphous polymers as plasticizers. P(3HB-co-3HV)-based films containing 3, 18, and 28 mol % 3HV were processed into films by extrusion and subsequent molding. The characterization results confirmed that increasing the 3HV content from 3 to 28 mol % resulted in a decrease in the melting point (from 175 to 100 °C) and an improvement in mechanical properties (i.e., elongation at break from 7 ± 1% to 120 ± 3%). The behavior of P(3HB-co-3HV) in the presence of additives was also investigated. It was shown that an increase in the 3HV content leads to better miscibility with amorphous polymers.

1D and 2D Boron Nitride Nano Structures: A Critical Analysis for Emerging Applications in the Field of Nanocomposites

Boron nitride (BN) with its 1D and 2D nano derivatives have gained immense popularity in both the field of research and applications. These nano derivatives have proved to be one of the most promising fillers which can be incorporated in polymers to form nanocomposites with excellent properties. These materials have been around for 25 years whereas significant research has been done in this field for only the past decade. There are many interesting properties which are imparted to the nanocomposites wherein thermal stability, large energy band gap, resistance to oxidation, excellent thermal conductivity, chemical inertness, and exceptional mechanical properties are just a few worthy of mention. Hexagonal boron nitride (h-BN) was selected as the parent material by most researchers reviewed in this paper through which 2D derivative Boron nitride nanosheets (BNNS) and 1D derivative Boron nitride nanotubes (BNNTs) are synthesized. This review will focus on the in-depth properties of h-BN and further will concisely focus on BNNS and BNNTs for their various properties. A detailed discussion of the addition of BNNS and BNNTs into polymers to form nanocomposites, their synthesis, properties, and applications is followed by a summary determining the most suitable synthesizing processes and the materials, keeping in mind the current challenges.

Silver nanoparticles modified sulfur-containing POSS polymer membrane substrate for adsorption and surface-enhanced Raman scattering analysis of chrysoidine in food samples

In analysis of complex samples, the stability and sensitivity of surface-enhanced Raman scattering (SERS) substrates may be compromised by matrix interference. To address this issue, a membrane substrate was prepared for fast enrichment, separation, and detection of chrysoidine all-in-one. The silver nanoparticles modified sulfur-containing POSS polymer (AgNPs/POSS-P-S) SERS membrane substrate was fabricated using polyhedral oligomeric silsesquioxane (POSS) as support materials. Through in-situ growth, AgNPs were uniformly modified on POSS-P-S to ensure the stability and SERS activity of the membrane substrate. The enhancement factor of the malachite green was up to 5.3 × 105. By loading the AgNPs/POSS-P-S on membrane, on the other hand, the SERS membrane substrate can also serve as an adsorption medium for separating chrysoidine from sample matrix. Furthermore, the specific sensing mechanism of AgNPs/POSS-P-S for chrysoidine was investigated and a fast, sensitive, and selective method for its quantification was established, with a linear range of 0.010-2.0 mg/L and the limits of detection at 3.7 μg/L. In addition, the SERS method was successfully applied for the analysis of chrysoidine in beverages and chili products with the recoveries in the range of 83.5%-113.4 % and the relative standard deviations in 3.2%-9.0 %. The proposed AgNPs/POSS-P-S membrane based SRES method has great potential for rapid chrysoidine analysis in food samples.

Thermal Conductivity Enhancement of Polymeric Composites Using Hexagonal Boron Nitride: Design Strategies and Challenges

With the integration and miniaturization of chips, there is an increasing demand for improved heat dissipation. However, the low thermal conductivity (TC) of polymers, which are commonly used in chip packaging, has seriously limited the development of chips. To address this limitation, researchers have recently shown considerable interest in incorporating high-TC fillers into polymers to fabricate thermally conductive composites. Hexagonal boron nitride (h-BN) has emerged as a promising filler candidate due to its high-TC and excellent electrical insulation. This review comprehensively outlines the design strategies for using h-BN as a high-TC filler and covers intrinsic TC and morphology effects, functionalization methods, and the construction of three-dimensional (3D) thermal conduction networks. Additionally, it introduces some experimental TC measurement techniques of composites and theoretical computational simulations for composite design. Finally, the review summarizes some effective strategies and possible challenges for the design of h-BN fillers. This review provides researchers in the field of thermally conductive polymeric composites with a comprehensive understanding of thermal conduction and constructive guidance on h-BN design.

Advances in boron nitride-based nanomaterials for environmental remediation and water splitting: a review

Boron nitride has gained wide-spread attention globally owing to its outstanding characteristics, such as a large surface area, high thermal resistivity, great mechanical strength, low density, and corrosion resistance. This review compiles state-of-the-art synthesis techniques, including mechanical exfoliation, chemical exfoliation, chemical vapour deposition (CVD), and green synthesis for the fabrication of hexagonal boron nitride and its composites, their structural and chemical properties, and their applications in hydrogen production and environmental remediation. Additionally, the adsorptive and photocatalytic properties of boron nitride-based nanocomposites for the removal of heavy metals, dyes, and pharmaceuticals from contaminated waters are discussed. Lastly, the scope of future research, including the facile synthesis and large-scale applicability of boron nitride-based nanomaterials for wastewater treatment, is presented. This review is expected to deliver preliminary knowledge of the present state and properties of boron nitride-based nanomaterials, encouraging the future study and development of these materials for their applications in various fields.

Covalently bonded interface in polymer/boron nitride nanosheet composite toward enhanced mechanical and thermal behaviour

This experimental study aimed to enhance the mechanical and thermal properties of BN (hexagonal boron nitride) nanosheet-reinforced high-density polyethylene by functionalizing its interface. The challenges associated with this nanocomposites are its poor dispersion and weak interface. Accordingly, to improve the load transfer at the interface, BN nanosheets were chemically modified with silane functional groups ((3-aminopropyl)tri-ethoxy silane), making it possible to form covalent bonds between the maleic anhydride-grafted polyethylene and nanosheet. Consequently, three different types of nanocomposite samples were fabricated based on the covalently bonded or non-bonded interface. Two nanocomposite configurations featured a non-bonded interface between the nanofiller and PE matrix (p-BN/PE and (silane functionalized) s-BN/PE). In contrast, the third configuration had a covalently bonded interface (silane-functionalized h-BN + maleic anhydride-grafted PE, i.e., PE-g-BN). According to the zeta potential analysis, the silane-functionalized BN nanosheets were stable suspensions and uniformly dispersed in the polymer matrix. The tensile and flexure strength of the nanocomposites showed over 100% improvement due to the covalently bonded interface. The lamellae structure of PE in the bonded interface samples was responsible for achieving higher mechanical strength in the nanocomposites. Furthermore, the thermal conductivity of the nanocomposites was significantly affected by the type of interfacial bonding, BN wt%, and operating temperature.

Hexagonal boron nitride exfoliation and dispersion

Research on hexagonal boron nitride (hBN) 2-dimensional nanostructures has gained traction due to their unique chemical, thermal, and electronic properties. However, to make use of these exceptional properties and fabricate macroscopic materials, hBN often needs to be exfoliated and dispersed in a solvent. In this review, we provide an overview of the many different methods that have been used for dispersing hBN. The approaches that will be covered in this review include solvents, covalent functionalization, acids and bases, surfactants and polymers, biomolecules, intercalating agents, and thermal expansion. The properties of the exfoliated sheets obtained and the dispersions are discussed, and an overview of the work in the field throughout the years is provided.

Chromophores' Contribution to Color Changes of Thermally Modified Tropical Wood Species

This work examines the effect of thermal modification temperature (180, 200, and 220 °C) in comparison with reference (untreated) samples on selected optical properties of six tropical wood species-Sp. cedar (Cedrala odorata), iroko (Chlorophora excelsa), merbau (Intsia spp.), meranti (Shorea spp.), padouk (Pterocarpus soyauxii), and teak (Tectona grandis). The main goal is to expand the existing knowledge in the field of wood thermal modification by understanding the related degradation mechanisms associated with the formation of chromophoric structures and, above all, to focus on the change in the content of extractive substances. For solid wood, the CIELAB color space parameters (L*, a*, b*, and ΔE*), yellowness (Y), ISO brightness, and UV-Vis diffuse reflectance spectra were obtained. Subsequently, these wood samples were extracted into three individual solvents (acetone, ethanol, and ethanol-toluene). The yields of the extracted compounds, their absorption spectra, and again L*, a*, b*, ΔE*, and Yi parameters were determined. With increasing temperatures, the samples lose brightness and darken, while their total color difference grows (except merbau). The highest yield of extractives (mainly phenolic compounds, glycosides, and dyes) from thermally modified samples was usually obtained using ethanol. New types of extractives (e.g., 2-furaldehyde, lactones, formic acid, some monomer derivatives of phenols, etc.) are already created around a temperature of 180 °C and may undergo condensation reactions at higher temperatures. For padouk, merbau, teak, and partially iroko modified at temperatures of 200 and 220 °C, there was a detected similarity in the intensities of their UV-Vis DR spectra at the wavelength regions corresponding to phenolic aldehydes, unsaturated ketones, quinones, stilbenes, and other conjugated carbonyl structures. Overall, a statistical assessment using PCA sorted the samples into five clusters. Cluster 3 consists of almost all samples modified at 200 and 220 °C, and in the other four, the reference and thermally modified samples at 180 °C were distributed. The yellowness of wood (Y) has a very high dependence (r = 0.972) on its brightness (L*) and the yellowness index of the extractives in acetone Yi(Ac), whose relationship was described by the equation Y = -0.0951 × Y(Ac) + 23.3485.

Research Progress in Boron-Modified Phenolic Resin and Its Composites

As one of the most successful modified phenolic resins, boron-modified phenolic resin (BPF) has excellent heat resistance and ablative resistance, good mechanical and wear resistance, and flame retardancy. BPF and its composites can be widely used in areas such as aerospace, weapons and equipment, automobile brakes, and fire retardants. In this review, the current state of development of BPF and its composites is presented and discussed. After introducing various methods to synthesize BPF, functionalization of BPF is briefly summarized. Particular emphasis is placed on general methods used to fabricate BPF-based composites and the heat resistance, ablative resistance, mechanical property, wear resistance, flame retardancy, and water resistance of BPF-based composites. Finally, the challenges of this research area are summarized and its future outlook is prospected.

Corrosion Behavior of 1D and 2D Polymorphs of Boron Nitride Ceramic

This study reports a fundamental electrochemical study to understand the corrosion behavior of 1D bulk, free-standing 1D boron nanotube (BNNT) buckypaper and compare it with a sintered 2D hBN nanoplatelet (BNNP) pellet. Tafel analysis indicates that 1D BNNT has superior corrosion resistance with a lower corrosion rate of 0.0026 mils per year (mpy). 2D BNNP, although having similar chemistry to 1D BNNT, resulted in an increased (40 times) corrosion rate of 0.107 mpy. The higher surface area and aspect ratio of BNNT drastically influenced the corrosion kinetics. The scientific outcomes will enable the better design of novel hBN-based corrosion-resistant materials.

Construction of Photoinitiator Functionalized Spherical Nanoparticles Enabling Favorable Photoinitiating Activity and Migration Resistance for 3D Printing

A straight-forward method was exploited to construct a multifunctional hybrid photoinitiator by supporting 2-hydroxy-2-methylpropiophenone (HMPP) onto a nano-silica surface through a chemical reaction between silica and HMPP by using (3-isocyanatopropyl)-triethoxysilane (IPTS) as a bridge, and this was noted as silica-s-HMPP. The novel hybrid-photoinitiator can not only initiate the photopolymerization but also prominently improve the dispersion of nanoparticles in the polyurethane acrylate matrix and enhance the filler-elastomer interfacial interaction, which results in excellent mechanical properties of UV-cured nanocomposites. Furthermore, the amount of extractable residual photoinitiators in the UV-cured system of silica-s-HPMM shows a significant decrease compared with the original HPMM system. Since endowing the silica nanoparticle with photo-initiated performance and fairly lower mobility, it may lead to a reduction in environmental contamination compared to traditional photoinitators. In addition, the hybrid-photoinitiator gives rise to an accurate resolution object with a complex construction and favorable surface morphology, indicating that multifunctional nanosilica particles can be applied in stereolithographic 3D printing.

Flexible silicone rubber/carbon fiber/nano-diamond composites with enhanced thermal conductivity via reducing the interface thermal resistance

Insulating materials with heat dissipation are urgently required for modern electronic devices and systems. In this study, 4,4-methylene diphenyl diisocyanate was used as the coupling agent, and nano-diamond (ND) particles were grafted onto the surface of carbon fibers (CFs) to prepare CF-ND/silicone rubber (SR) composites. The ND acted as a “bridge” among CFs, which can reduce the interface thermal resistance between CFs because the dot-like ND can increase the interfacial area of CFs, making it easier to form heat-conducting networks between SR. When the content of CF-ND (1:6) was 20%, the thermal conductivity of the SR composite was 0.305 W/(m·K), 69% higher than that of pure SR. The ND between CFs can improve the dynamic mechanical properties by acting as a crack pinhole. In addition, the CF-ND/SR composites also exhibited excellent thermal stability. This work has enormous potential for advanced electronic devices.

The Establishment of Thermal Conductivity Model for Linear Low-Density Polyethylene/Alumina Composites Considering the Interface Thermal Resistance

An optimized thermal conductivity model of spherical particle-filled polymer composites considering the influence of interface layer was established based on the classic series and parallel models. ANSYS software was used to simulate the thermal transfer process. Meanwhile, linear low-density polyethylene/alumina (LLDPE/Al2O3) composites with different volume fractions and Al2O3 particle sizes were prepared with the continuous mixer, and the effects of Al2O3 particle size and volume fraction on the thermal conductivity of the composites were discussed. Finally, the test result of the thermal conductivity was analyzed and compared with ANSYS simulations and the model prediction. The results proved that the thermal conductivity model considering the influence of the interface layer could predict the thermal conductivity of LLDPE/Al2O3 composites more precisely.

Developing visible light responsive BN/NTCDA heterojunctions with a good degradation performance for tetracycline

In this paper, a series of BN/NTCDA photocatalysts have been prepared using a simple calcination method and their photocatalytic performance under visible light irradiation is studied with tetracycline (TC) as the target pollutant.

Nanoarchitectonics of BN/AgNWs/Epoxy Composites with High Thermal Conductivity and Electrical Insulation

To promote the construction of the thermal network in the epoxy resin (EP), a certain proportion of silver nanowires (AgNWs) coupled with the hexagonal boron nitride (BN) nanoplates were chosen as fillers to improve the thermal conductivity of EP resin. Before preparing the composites, BN was treated by silane coupling agent 3-aminopropyltriethoxysilane (KH550), and AgNWs was coated by dopamine hydrochloride. The BN/AgNWs/EP composites were prepared after curing, and the thermal conductivity and dielectric properties of the composites was tested. Results showed that the AgNWs and BN were uniformly dispersed in epoxy resin. It synergistically built a thermal network and greatly increased the thermal conductivity of the composites, which increased 9% after adding AgNWs. Moreover, the electrical property test showed that the addition of AgNWs had little effect on the dielectric constant and dielectric loss of the composites, indicating a rather good electrical insulation of the composites.

Structure, Properties and Applications of Two-Dimensional Hexagonal Boron Nitride

Hexagonal boron nitride (h-BN) has emerged as a strong candidate for two-dimensional (2D) material owing to its exciting optoelectrical properties combined with mechanical robustness, thermal stability, and chemical inertness. Super-thin h-BN layers have gained significant attention from the scientific community for many applications, including nanoelectronics, photonics, biomedical, anti-corrosion, and catalysis, among others. This review provides a systematic elaboration of the structural, electrical, mechanical, optical, and thermal properties of h-BN followed by a comprehensive account of state-of-the-art synthesis strategies for 2D h-BN, including chemical exfoliation, chemical, and physical vapor deposition, and other methods that have been successfully developed in recent years. It further elaborates a wide variety of processing routes developed for doping, substitution, functionalization, and combination with other materials to form heterostructures. Based on the extraordinary properties and thermal-mechanical-chemical stability of 2D h-BN, various potential applications of these structures are described.

Methods of hexagonal boron nitride exfoliation and its functionalization: covalent and non-covalent approaches

The exfoliation of two-dimensional (2D) hexagonal boron nitride nanosheets (h-BNNSs) from bulk hexagonal boron nitride (h-BN) materials has received intense interest owing to their fascinating physical, chemical, and biological properties. Numerous exfoliation techniques offer scalable approaches for harvesting single-layer or few-layer h-BNNSs. Their structure is very comparable to graphite, and they have numerous significant applications owing to their superb thermal, electrical, optical, and mechanical performance. Exfoliation from bulk stacked h-BN is the most cost-effective way to obtain large quantities of few layer h-BN. Herein, numerous methods have been discussed to achieve the exfoliation of h-BN, each with advantages and disadvantages. Herein, we describe the existing exfoliation methods used to fabricate single-layer materials. Besides exfoliation methods, various functionalization methods, such as covalent, non-covalent, and Lewis acid-base approaches, including physical and chemical methods, are extensively described for the preparation of several h-BNNS derivatives. Moreover, the unique and potent characteristics of functionalized h-BNNSs, like enhanced solubility in water, improved thermal conductivity, stability, and excellent biocompatibility, lead to certain extensive applications in the areas of biomedical science, electronics, novel polymeric composites, and UV photodetectors, and these are also highlighted.

Enhancing Thermo-Mechanical Properties of Epoxy Composites Using Fumed Silica with Different Surface Treatment

The objectives of this study are to improve the thermal and mechanical properties of epoxy/fumed silica composite with different surface treatments of fumed silica. The addition of silica nanoparticles improved the thermal stability of the composite and slowed down the pyrolysis process. The crosslinking density and T_g of the epoxy/fumed silica composites increased because of the interfacial interaction between the PDMS-treated fumed silica particles and the epoxy matrix. The flexural strength of the epoxy nanocomposite was very high even at a low silica content because of the strong interactions between the PDMS-treated fillers and the epoxy matrix. These strong interfacial interactions originate from the attractive forces between the polymer and the filler. Therefore, the polymer nanocomposite containing the PDMS-treated fumed silica is shown to be sufficiently commercially promising.

Thermomechanical properties of silica–epoxy nanocomposite modified by hyperbranched polyester: A molecular dynamics simulation

In this article, pure epoxy resin and silica–epoxy nanocomposite models were established to investigate the effects of hyperbranched polyester on microstructure and thermomechanical properties of epoxy resin through molecular dynamics simulation. Results revealed that the composite of silica can improve the thermomechanical properties of nanocomposites, including the glass transition temperature, thermal conductivity, and elastic modulus. Moreover, the thermomechanical properties were further enhanced through chemical modification on the silica surface, where the effectiveness was the best through grafting hyperbranched polyester on the silica surface. Compared with pure epoxy resin, the glass transition temperature of silica–epoxy composite modified by silica grafted with hyperbranched polyester increased by 38 K. The thermal conductivity increased with the increase of temperature and thermal conductivity at room temperature increased to 0.4171 W/(m·K)−1 with an increase ratio of 94.3%. Young’s modulus, volume modulus, and shear modulus all fluctuated as temperature rise with a down overall trend. They increased by 44.68%, 29.52%, and 36.65%, respectively, when compared with pure epoxy resin. At the same time, the thermomechanical properties were closely related to the microstructure such as fractional free volume (FFV), mean square displacement (MSD), and binding energy. Silica surface modification by grafting hyperbranched polyester reduced the FFV value and MSD value most and strengthened the combination of silica and epoxy resin matrix the best, resulting in the best thermomechanical properties.

Thermal conductivity and mechanical performance of hexagonal boron nitride nanosheets-based epoxy adhesives

Thermosets possess diverse physical and chemical properties and thus they are widely used in various applications such as electronic packaging, construction, and automotive industries. However, their poor thermal conductivity and weak mechanical performance jeopardize their continual spread in modern industry. In this study, boron nitride nanosheets (BNNSs) were employed to promote both mechanical and thermal properties of epoxy nanocomposites. BNNSs and their epoxy nanocomposites were fabricated usingin situsolvent ultrasonication andin situpolymerization, respectively. Thermal conductivity was enhanced by 153% increment in epoxy/BNNS nanocomposite at 7 wt% in comparison with neat epoxy. In parallel, Young's modulus, lap shear strength, fracture toughness (K_1C) and energy release rate (G_1C) increased by 69%, 31%, 122% and 118%, respectively at 1 wt% BNNSs. Moreover, fatigue life and strength of lap shear joints were significantly improved upon adding BNNSs. A numerical model of the single lap shear joint was developed to validate the accuracy of the material constants obtained. Epoxy/BNNS nanocomposites exhibited an outstanding mechanical performance as well as high thermal conductivity giving them merits to widen their applications in electronic and automotive industry.

Tailoring the Thermal Conductivity of Rubber Nanocomposites by Inorganic Systems: Opportunities and Challenges for Their Application in Tires Formulation

The development of effective thermally conductive rubber nanocomposites for heat management represents a tricky point for several modern technologies, ranging from electronic devices to the tire industry. Since rubber materials generally exhibit poor thermal transfer, the addition of high loadings of different carbon-based or inorganic thermally conductive fillers is mandatory to achieve satisfactory heat dissipation performance. However, this dramatically alters the mechanical behavior of the final materials, representing a real limitation to their application. Moreover, upon fillers’ incorporation into the polymer matrix, interfacial thermal resistance arises due to differences between the phonon spectra and scattering at the hybrid interface between the phases. Thus, a suitable filler functionalization is required to avoid discontinuities in the thermal transfer. In this challenging scenario, the present review aims at summarizing the most recent efforts to improve the thermal conductivity of rubber nanocomposites by exploiting, in particular, inorganic and hybrid filler systems, focusing on those that may guarantee a viable transfer of lab-scale formulations to technological applicable solutions. The intrinsic relationship among the filler’s loading, structure, morphology, and interfacial features and the heat transfer in the rubber matrix will be explored in depth, with the ambition of providing some methodological tools for a more profitable design of thermally conductive rubber nanocomposites, especially those for the formulation of tires.

Electrical and thermal performances of epoxy-based micro-nano hybrid composites at different electric fields and temperatures

This paper investigates the electrical and thermal properties of pure epoxy resin (EP) and its micro-nano hybrid composites (20 wt% micro-AlN fillers with 1 wt% and 3 wt% nano-Al₂O₃fillers; 50% micro-AlN with 3% nano-Al₂O₃fillers) for power electronic packaging applications. Electrical properties such as space charge distribution, electrical conductivity and surface potential decay are measured. The thermal performance of the fabricated samples is estimated using thermal analysis devices. The hybrid composite consisting of 20 wt% micro-AlN and 1 wt% nano-Al₂O₃fillers exhibits the least space charge accumulation, higher thermal conductivity and better thermal stability. However, the excessive addition adversely affects space charge and electrical conductivity properties. The micro-nano hybrid composites significantly exhibit higher electrical conductivity than pure EP. The microfiller addition from 20 wt% to 50 wt% significantly improves the thermal conductivity of the EP. The reduced space charge injection and accumulation in the hybrid micro-nano composites are attributed to the enhancement of the injection barrier and reduction of the charge carrier traps in these materials. A theoretical mechanism of the charge dynamics inside the samples under different test conditions is proposed to support the experimental results.

Effect of Aminosilane Coupling Agent-Modified Nano-SiO2 Particles on Thermodynamic Properties of Epoxy Resin Composites

From the perspective of improving the thermodynamic properties of epoxy resin, it has become the focus of research to enhance the operational stability of GIS (Gas Insulated Substation) basin insulators for UHV (Ultra-High Voltage) equipment. In this paper, three aminosilane coupling agents with different chain lengths, (3-Aminopropyl)trimethoxysilane (KH550), Aminoethyl)-γ-aminopropyltrimethoxysilane (KH792) and 3-[2-(2-Aminoethylamino)ethylamino]propyl-trimethoxysilane (TAPS), were used to modify nano-SiO2 and doped into epoxy resin, respectively, using a combination of experimental and molecular dynamics simulations. The experimental results showed that the surface-grafted KH792 model of nano-SiO2 exhibited the most significant improvement in thermal properties compared with the undoped nanoparticle model. The storage modulus increased by 276 MPa and the Tg increased by 61 K. The simulation results also showed that the mechanical properties of the nano-SiO2 surface-grafted KH792 model were about 3 times higher than that of the undoped nanoparticle model, the Tg increased by 36.5 K, and the thermal conductivity increased by 24.5%.

Remarkable Thermal Conductivity of Epoxy Composites Filled with Boron Nitride and Cured under Pressure

This work demonstrates that the application of even moderate pressures during cure can result in a remarkable enhancement of the thermal conductivity of composites of epoxy and boron nitride (BN). Two systems have been used: epoxy-thiol and epoxy-diamine composites, filled with BN particles of different sizes and types: 2, 30 and 180 μm platelets and 120 μm agglomerates. Using measurements of density and thermal conductivity, samples cured under pressures of 175 kPa and 2 MPa are compared with the same compositions cured at ambient pressure. The thermal conductivity increases for all samples cured under pressure, but the mechanism responsible depends on the composite system: For epoxy-diamine composites, the increase results principally from a reduction in the void content; for the epoxy-thiol system with BN platelets, the increase results from an improved matrix-particle interface; for the epoxy-thiol system with BN agglomerates, which has a thermal conductivity greater than 10 W/mK at 44.7 vol.% filler content, the agglomerates are deformed to give a significantly increased area of contact. These results indicate that curing under pressure is an effective means of achieving high conductivity in epoxy-BN composites.