Nanostructured polymer films with metal-like thermal conductivity

Advancing high thermal conductivity: novel theories, innovative materials, and applications in thermal management technologies

Effective thermal management is crucial for the performance and stability of modern electronics, emphasizing the demand for high thermal conductivity (κ). This review summarizes the latest development in highκ, discussing the emerging theories, innovative materials and practical applications for interfacial heat dissipation. Unique phononic thermal transport behaviors are discussed, including four phonon-phonon scattering, hydrodynamic phonons, surface phonon-polaritons, and more. The review also highlights innovative materials with highκ, such as two-dimensional pentagonal structures, boron carbon nitrogen structures, hexagonal boron arsenide andθ-phase tantalum nitride. In addition, the potential of polymer composites reinforced with highκfillers and surface engineering for advanced electronic applications are also discussed. By integrating these theoretical approaches and material innovations, this review offers comprehensive strategies for enhancing thermal management in modern electronic devices.

Designing Accurate Moment Tensor Potentials for Phonon-Related Properties of Crystalline Polymers

The phonon-related properties of crystalline polymers are highly relevant for various applications. Their simulation is, however, particularly challenging, as the systems that need to be modeled are often too extended to be treated by ab initio methods, while classical force fields are too inaccurate. Machine-learned potentials parametrized against material-specific ab initio data hold the promise of being extremely accurate and also highly efficient. Still, for their successful application, protocols for their parametrization need to be established to ensure an optimal performance, and the resulting potentials need to be thoroughly benchmarked. These tasks are tackled in the current manuscript, where we devise a protocol for parametrizing moment tensor potentials (MTPs) to describe the structural properties, phonon band structures, elastic constants, and forces in molecular dynamics simulations for three prototypical crystalline polymers: polyethylene (PE), polythiophene (PT), and poly-3-hexylthiophene (P3HT). For PE, the thermal conductivity and thermal expansion are also simulated and compared to experiments. A central element of the approach is to choose training data in view of the considered use case of the MTPs. This not only yields a massive speedup for complex calculations while essentially maintaining DFT accuracy, but also enables the reliable simulation of properties that, so far, have been entirely out of reach.

Phase Engineered Composite Phase Change Materials for Thermal Energy Manipulation

Phase change materials (PCMs) present a dual thermal management functionality through intrinsic thermal energy storage (TES) capabilities while maintaining a constant temperature. However, the practical application of PCMs encounters challenges, primarily stemming from their low thermal conductivity and shape-stability issues. Despite significant progress in the development of solid-solid PCMs, which offer superior shape-stability compared to their solid-liquid counterparts, they compromise TES capacity. Herein, a universal phase engineering strategy is introduced to address these challenges. The approach involves compositing solid-liquid PCM with a particulate-based conductive matrix followed by surface reaction to form a solid-solid PCM shell, resulting in a core-shell composite with enhanced thermal conductivity, high thermal storage capacity, and optimal shape-stability. The core-shell structure designed in this manner not only encapsulates the energy-rich solid-liquid PCM core but also significantly enhances TES capacity by up to 52% compared to solid-solid PCM counterparts. The phase-engineered high-performance PCMs exhibit excellent thermal management capabilities by reducing battery cell temperature by 15 °C and demonstrating durable solar-thermal-electric power generation under cloudy or no sunshine conditions. This proposed strategy holds promise for extending to other functional PCMs, offering a compelling avenue for the development of high-performance PCMs for thermal energy applications.

Intrinsically thermally conductive polymers

Here, we describe the design features that lead to intrinsically thermally conductive polymers. Though polymers are conventionally assumed to be thermal insulators (<0.3 W m-1 K-1), significant efforts by the thermal transport community have shown that polymers can be intrinsically thermally conductive (>1.0 W m-1 K-1). However, these findings have not yet driven comprehensive synthetic efforts to expose how different macromolecular features impact thermal conductivity. Preliminary theoretical and experimental investigations have revealed that high k polymers can be realized by enhancing the alignment, crystallinity, and intermolecular interactions. While a holistic mechanistic framework does not yet exist for thermal transport in polymeric materials, contemporary literature suggests that phonon-like heat carriers may be operative in macromolecules that meet the abovementioned criteria. In this review, we offer a perspective on how high thermal conductivity polymers can be systematically engineered from this understanding. Reports for several classes of macromolecules, including linear polymers, network polymers, liquid-crystalline polymers, and two-dimensional polymers substantiate the design principles we propose. Throughout this work, we offer opportunities for continued fundamental and technological development of polymers with high thermal conductivity.

Modulating Thermal Conductivity via Targeted Phonon Excitation

Thermal conductivity is a critical material property in numerous applications, such as those related to thermoelectric devices and heat dissipation. Effectively modulating thermal conductivity has become a great concern in the field of heat conduction. Here, a quantum modulation strategy is proposed to modulate the thermal conductivity/heat flux by exciting targeted phonons. It shows that the thermal conductivity of graphene can be tailored in the range of 1559 W m-1 K-1 (decreased to 49%) to 4093 W m-1 K-1 (increased to 128%), compared with the intrinsic value of 3189 W m-1 K-1. The effects are also observed for graphene nanoribbons and bulk silicon. The results are obtained through both density functional theory calculations and molecular dynamics simulations. This novel modulation strategy may pave the way for quantum heat conduction.

Self-adhesive, conductive, and multifunctional hybrid hydrogel for flexible/wearable electronics based on triboelectric and piezoresistive sensor

Flexible electronics are highly developed nowadays in human-machine interfaces (HMI). However, challenges such as lack of flexibility, conductivity, and versatility always greatly hindered flexible electronics applications. In this work, a multifunctional hybrid hydrogel (H-hydrogel) was prepared by combining two kinds of 1D polymer chains (polyacrylamide and polydopamine) and two kinds of 2D nanosheets (Ti3C2Tx MXene and graphene oxide nanosheets) as quadruple crosslinkers. The introduced Ti3C2Tx MXene and graphene oxide nanosheets are bonded with the PAM and PDA polymer chains by hydrogen bonds. This unique crosslinking and stable structure endow the H-hydrogel with advantages such as good flexibility, electrical conductivity, self-adhesion, and mechanical robustness. The two kinds of nanosheets not only improved the mechanical strength and conductivity of the H-hydrogel, but also helped to form the double electric layers (DELs) between the nanosheets and the bulk-free water phase inside the H-hydrogel. When utilized as the electrode of a triboelectric nanogenerator (TENG), high electrical output performances were realized due to the dynamic balance of the DELs between the nanosheets and the H-hydrogel's inside water molecules. Moreover, flexible sensors, including triboelectric, and strain/pressure sensors, were achieved for human motion detection at low frequencies. This hydrogel is promising for HMI and e-skin.

Higher-Order Structural Analysis of a Transparent and Flexible High Thermal Conductive Liquid Crystalline Elastomer Sheet and Its Composite

Transparency, flexibility, and high thermal conductivity are trade-offs. Specifically, we have investigated a cross-linked acrylic liquid crystal elastomer (LCE) that exhibits both transparency and flexibility while maintaining a high level of thermal conductivity. The transparent monodomain LCE sheet was achieved through a process of stretching an initially opaque polydomain sheet to 80% elongation and subsequently subjecting it to photocuring. The thermal conductivity in the stretching direction (x) of the monodomain LCE sheet was found to be 1.8 times higher than that of the prestretched polydomain sheet, consistent with findings from previous studies. However, in the orthogonal direction (y) to the stretching (x) direction, the thermal conductivity exhibited an even higher value, being 1.7 times greater than in the x-direction, with a value of 3.0 W/(m·K). This unique observation prompted us to conduct further investigation through higher-order structural analysis of these LCE sheets using 2D wide-angle X-ray scattering (WAXS) analysis. In the transparent sheet, the LCE molecules were aligned in the sheet in the stretching x-direction (monodomain structure) for the out-of-plane direction. However, in the in-plane x-direction, the molecular plane spacing exhibited random orientation at a period of 0.45 nm. In contrast, within the y-direction of the inner layer, the molecular plane spacing exhibited a uniaxial horizontal orientation at the same period length as in the x-direction. The heat energy entering into the y-direction once spreads to the x-direction, but it was considered that the reason for the higher thermal conductivity to the y-direction would be forming covalent bonds that function as new heat transmission paths, in the direction intersecting to the x-direction during photocuring. Therefore, we concluded that the synergistic effect of the high level of the ordered inner structure and covalent bonding structure due to cross-linking in the y-direction contributes to its higher thermal conductivity compared to that in the x-direction, which exhibits a random in-plane structure. Additionally, we have fabricated an LCE composite sheet filled with 75 vol % of alumina particles using a polydomain-type LCE as the base material. The composite sheet exhibits remarkable thermal conductivity in the thickness direction, measuring at 9.8 W/(m·K), while maintaining a flexibility characterized by an elastic modulus of 70 MPa. This thermal conductivity surpasses that of a nonmesogenic acrylic composite sheet with identical alumina particle filling, which measured at 3.9 W/(m·K), more than twice as much. The presence of the mesogen skeleton has been demonstrated to enhance heat transfer, even within soft composites, by facilitating the formation of an ordered structure.

Metal Cross-Linked Supramolecular Gel Noodles: Structural Insights and Antibacterial Assessment

Achieving precise control over gelator alignment and morphology is crucial for crafting tailored materials and supramolecular structures with distinct properties. We successfully aligned the self-assembled micelles formed by a functionalized dipeptide 2NapFF into long 1-D "gel noodles" by cross-linking with divalent metal chlorides. We identify the most effective cross-linker for alignment, enhancing mechanical stability, and imparting functional properties. Our study shows that Group 2 metal ions are particularly suited for creating mechanically robust yet flexible gel noodles because of their ionic and nondirectional bonding with carboxylate groups. In contrast, the covalent nature and high directional bonds of d-block metal ions with carboxylates tend to disrupt the self-assembly of 2NapFF. Furthermore, the 2NapFF-Cu noodles demonstrated selective antibacterial activity, indicating that the potent antibacterial property of the copper(II) ion is preserved within the cross-linked system. By merging insights into molecular alignment, gel extrusion processing, and integrating specific functionalities, we illustrate how the versatility of dipeptide-based gels can be utilized in creating next-generation soft materials.

Correlating Young's Modulus with High Thermal Conductivity in Organic Conjugated Small Molecules

Attaining elevated thermal conductivity in organic materials stands as a coveted objective, particularly within electronic packaging, thermal interface materials, and organic matrix heat exchangers. These applications have reignited interest in researching thermally conductive organic materials. The understanding of thermal transport mechanisms in these organic materials is currently constrained. This study concentrates on N, N'-dioctyl-3,4,9,10-perylenedicarboximide (PTCDI-C8), an organic conjugated crystal. A correlation between elevated thermal conductivity and augmented Young's modulus is substantiated through meticulous experimentation. Achievement via employing the physical vapor transport method, capitalizing on the robust C═C covalent linkages running through the organic matrix chain, bolstered by π-π stacking and noncovalent affiliations that intertwine the chains. The coexistence of these dynamic interactions, alongside the perpendicular alignment of PTCDI-C8 molecules, is confirmed through structural analysis. PTCDI-C8 thin film exhibits an out-of-plane thermal conductivity of 3.1 ± 0.1 W m-1 K-1, as determined by time-domain thermoreflectance. This outpaces conventional organic materials by an order of magnitude. Nanoindentation tests and molecular dynamics simulations elucidate how molecular orientation and intermolecular forces within PTCDI-C8 molecules drive the film's high Young's modulus, contributing to its elevated thermal conductivity. This study's progress offers theoretical guidance for designing high thermal conductivity organic materials, expanding their applications and performance potential.

Mechanically and Thermally Guided, Honeycomb-like Nanocomposites with Strain-Insensitive High Thermal Conductivity for Stretchable Electronics

Thermal management materials have become increasingly crucial for stretchable electronic devices and systems. Drastically different from conventional thermally conductive materials, which are applied at static conditions, thermal management materials for stretchable electronics additionally require strain-insensitive thermal conductivity, as they generally undergo cyclic deformation. However, realizing such a property remains challenging mainly because conventional thermally conductive polymer composites generally lack a mechanically guided design. Here, we report a honeycomb-like nanocomposite with a three-dimensional (3D) thermally conductive network fabricated by an arrayed ice-templating technique followed by elastomer infiltration. The hexagonal honeycomb-like structure with thin, compact walls (≈ 40 μm) endows our composite with a high through-plane thermal conductivity (≈ 1.54 W m-1 K-1) at an ultralow boron nitride nanosheet (BNNS) loading (≈ 0.85 vol %), with an enhancement factor of thermal conductivity up to 820% and thermal-insensitive strain up to 200%, which are 2.7 and 2 times higher than those reported in the literature. We report an intelligent strategy for the development of advanced thermal management materials for high-performance stretchable electronics.

Advanced Cooling Textiles: Mechanisms, Applications, and Perspectives

High-temperature environments pose significant risks to human health and safety. The body's natural ability to regulate temperature becomes overwhelmed under extreme heat, leading to heat stroke, dehydration, and even death. Therefore, the development of effective personal thermal-moisture management systems is crucial for maintaining human well-being. In recent years, significant advancements have been witnessed in the field of textile-based cooling systems, which utilize innovative materials and strategies to achieve effective cooling under different environments. This review aims to provide an overview of the current progress in textile-based personal cooling systems, mainly focusing on the classification, mechanisms, and fabrication techniques. Furthermore, the challenges and potential application scenarios are highlighted, providing valuable insights for further advancements and the eventual industrialization of personal cooling textiles.

Patterned liquid metal embedded in brush-shaped polymers for dynamic thermal management

Interface thermal resistance has become a crucial barrier to effective thermal management in high-performance electronics and sensors. The growing complexity of operational conditions, such as irregular and dynamic surfaces, demands thermal interface materials (TIMs) to possess high thermal conductivity and soft elasticity. However, developing materials that simultaneously combine soft elasticity and high thermal conductivity remains a challenging task. Herein, we utilize a vertically oriented graphene aerogel (VGA) and rationally design liquid metal (LM) networks to achieve directional and adjustable pathways within the composite. Subsequently, we leverage the advantages of the low elastic modulus and high deformation capabilities of brush-shaped polydimethylsiloxane (BPDMS), together with the bicontinuous thermal conduction path constructed by VGA and LM networks. Ultimately, the designed composite of patterned liquid metal/vertically oriented graphene aerogel/brush-shaped PDMS (LM-VGA/BPDMS) shows a high thermal conductivity (7.11 W m-1 K-1), an ultra-low elastic modulus (10.13 kPa), excellent resilience, and a low interface thermal resistance (14.1 K mm2 W-1). This LM-VGA/BPDMS soft composite showcases a stable heat dissipation capability at dynamically changing interfaces, as well as excellent adaptability to different irregular surfaces. This strategy holds important application prospects in the fields of interface thermal management and thermal sensing in extremely complex environments.

Ladder-like Poly(methacryloxypropyl) silsesquioxane-Al2O3-polybutadiene Flexible Nanocomposites with High Thermal Conductivity

Ladder-like poly(methacryloxypropyl)-silsesquioxanes (LPMASQ) are photocurable Si-based gels characterized by a double-stranded structure that ensures superior thermal stability and mechanical properties than common organic polymers. In this work, these attractive features were exploited to produce, in combination with alumina nanoparticles (NPs), both unmodified and functionalized with methacryloxypropyl-trimethoxysilane (MPTMS), LPMASQ/Al2O3 composites displaying remarkable thermal conductivity. Additionally, we combined LPMASQ with polybutadiene (PB) to produce hybrid nanocomposites with the addition of functionalized Al2O3 NPs. The materials underwent thermal stability, structural, and morphological evaluations via thermogravimetric analysis (TGA), scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDXS), Fourier transform infrared spectroscopy (FTIR), and solid-state nuclear magnetic resonance (NMR). Both blending PB with LPMASQ and surface functionalization of nanoparticles proved to be effective strategies for incorporating a higher ceramic filler amount in the matrices, resulting in significant increases in thermal conductivity. Specifically, a 113.6% increase in comparison to the bare matrix was achieved at relatively low filler content (11.2 vol%) in the presence of 40 wt% LPMASQ. Results highlight the potential of ladder-like silsesquioxanes in the field of thermally conductive polymers and their applications in heat dissipation for flexible electronic devices.

Studies on the Functional Properties of Titanium Dioxide Nanoparticles Distributed in Silyl-Alkyl Bridged Polyaniline-Based Nanofluids

In the present work, a new kind of nanocomposite (NC)-based solid component was prepared for formulating nanofluids (NFs). The NC comprised metal oxide (titanium dioxide, TiO2) dispersed in a conducting polymer with polyaniline (PANI) and chemically linked silyl-alkyl units in it (PSA) that were designated as T-PSA NC. The NFs with ethylene glycol (EG) as a base fluid were prepared with T-PSA NCs with various compositions of TiO2 and PSA as well for various concentrations of T-PSA NCs. The scanning electron microscopic evaluation of the NC revealed that PSA deposition on TiO2 nanoparticles (NPs) decreased particle agglomeration. The PSA coating on the TiO2 NPs did not influence the crystalline structure of the TiO2 NPs, according to the X-ray diffraction patterns. The thermophysical characterization and molecular interaction features of the NFs at 303 K including a novel inorganic-organic T-PSA NC, were detailed. Furthermore, the stability of the T-PSA NC-based NFs was investigated experimentally using the zeta potential, and the particle size distribution change was analyzed using the dynamic light scattering (DLS) method. The T-PSA NCs had particle sizes that were significantly bigger than pristine PSA and pure TiO2. Most of the preparation conditions used to produce the T-PSA NCs resulted in moderately stable suspensions in EG. The results revealed that the ultrasonic velocity increased with the increase in the concentration of T-PSA NC mass % in the NFs, the refractive index and thermal conductivity increased with the increase in the concentration, and the surface tension exhibited a linear change when the ratio of mass % concentration of the T-PSA NCs increased. The combined presence of components that synergistically contribute to the electro, thermal, optical, and rheological properties is expected to attract advanced applications for NFs.

Thermal Transport in Poly(p-phenylene): Anomalous Dimensionality Dependence and Role of π-π Stacking

For heat conduction along polymer chains, a decrease in the axial thermal conductivity often occurs when the polymer structure changes from one-dimensional (1D) to three-dimensional (3D). For example, a single extended aliphatic chain (e.g., polyethylene or poly(dimethylsiloxane)) usually has a higher axial thermal conductivity than its double-chain or crystal counterparts because coupling between chains induces strong interchain anharmonic scatterings. Intuitively, for chains with an aromatic backbone, the even stronger π-π stacking, once formed between chains, should enhance thermal transport across chains and suppress the thermal conductivity along the chains. However, we show that this trend is the opposite in poly(p-phenylene) (PPP), a typical chain with an aromatic backbone. Using molecular dynamics simulations, we found that the axial thermal conductivity of PPP chains shows an anomalous dimensionality dependence where the thermal conductivity of double-chain and 3D crystal structures is higher than that of a 1D single chain. We analyzed the probability distribution of dihedral angles and found that π-π stacking between phenyl rings restricts the free rotation of phenyl rings and forms a long-range order along the chain, thus enhancing thermal transport along the chain direction. Though possessing a stronger bonding strength and stabilizing the multiple-chain structure, π-π stacking does not lead to a higher interchain thermal conductance between phenyl rings compared with that between aliphatic chains. Our simulation results on the effects of π-π stacking provide insights to engineer thermal transport in polymers at the molecular level.

Measurement of the thermal diffusivities of insulating materials using boiling water

We present a method and corresponding experimental setup for estimating thermal diffusivities of insulating materials. The setup consists of a boiling water container placed on a heating plate; the test plate is placed atop the boiling water container. Under this condition, both the steady and transient input-response temperature characteristics are measured. We find that the water in its boiling state causes a nearly stable temperature at one side of the test plate. However, this stable condition is reached only after an initial transient period. Rather than using either steady or transient behavior of the response temperature characteristics exclusively in the analysis, we show the potential of using both by combining the experimental observations with the subsequent theoretical and optimization analyses. The proposed method and experimental setup do not require any prior estimation of other parameters. All the necessary information, including the thermal diffusivity, can be estimated from the input-response temperature characteristics only, as we show here.

Phonon transport along long polymer chains with varying configurations: Effects of phonon scattering

Following recent molecular dynamic simulations [M. Dinpajooh and A. Nitzan, J. Chem. Phys. 153, 164903 (2020)], we theoretically analyze how the phonon heat transport along a single polymer chain may be affected by varying the chain configuration. We suggest that phonon scattering controls the phonon heat conduction in strongly compressed (and tangled) chain when multiple random bends act as scattering centers for vibrational phonon modes, which results in the diffusive character of heat transport. As the chain is straightening up, the number of scatterers decreases, and the heat transport acquires nearly ballistic character. To analyze these effects, we introduce a model of a long atomic chain made out of identical atoms where some atoms are put in contact with scatterers and treat the phonon heat transfer through such a system as a multichannel scattering problem. We simulate the changes in the chain configurations by varying the number of the scatterers and mimic a gradual straightening of the chain by a gradual reducing of the number of scatterers attached to the chain atoms. It is demonstrated, in agreement with recently published simulation results, that the phonon thermal conductance shows a threshold-like transition from the limit where nearly all atoms are attached to the scatterers to the opposite limit where the scatterers vanish, which corresponds to a transition from the diffusive to the ballistic phonon transport.

Thermal Conductivity of Polyvinylidene Fluoride Films with a Multi-Scale Framework

The orientation of amorphous regions in pure polymers has been noted to be critical to the enhancement of thermal conductivity (TC), but the available reports are still rather few. Here, we propose to prepare a polyvinylidene fluoride (PVDF) film with a multi-scale framework by introducing anisotropic amorphous nanophases in the form of cross-planar alignments among the in-planar oriented extended-chain crystals (ECCs) lamellae, which show an enhanced TC of 1.99 Wm-1 K-1 in the through-plane direction (K⟂) and 4.35 Wm-1 K-1 in the in-plane direction (K∥). Structural characterization determination using scanning electron microscopy and high-resolution synchrotron X-ray scattering showed that shrinking the dimension of the amorphous nanophases can effectively reduce entanglement and lead to alignments formation. Moreover, the thermal anisotropy of the amorphous region is quantitatively discussed with the aid of the two-phase model. Superior thermal dissipation performances are intuitively displayed by means of finite element numerical analysis and heat exchanger applications. Moreover, such unique multi-scale architecture also results in significant benefit in the improvement of dimensional stability and thermal stability. This paper provides a reasonable solution for fabricating inexpensive thermal conducting polymer films from the perspective of practical applications.

Molecular Regulation of Flexible Composite Solid-Solid Phase Change Materials with Controllable Isotropic Thermal Conductivity for Thermal Energy Storage

In recent years, graphene has been introduced into phase change materials (PCMs) to improve thermal conductivity to enhance the heat transfer efficiency in thermal energy storage. However, graphenes tend to aggregate in PCMs, leading to the low thermal conductivity efficient enhancement (TCEE), anisotropic thermal conductivity, and deterioration of mechanical performance of PCMs. In this work, we fabricated biomimetic thermally conductive solid-solid PCMs (SSPCMs) by facile blending of the graphene into well-designed polyurethane SSPCMs, in which the graphene established a controllable and highly efficient isotropic thermally conductive pathway based on the π-π stacking between the graphene and the polymer aromatic ring segment. The as-fabricated SSPCMs showed high TCEE (156.78%), excellent flexibility (328% elongation at break), high enthalpy value (>101 J/g), and solid-solid phase transition properties, under 2% loading of graphene. The proportion of in-plane to through-plane thermal conductivity can be adjusted by an elaborate design of the aromatic ring segment in polyurethane SSPCMs. We further demonstrated mechanical flexibility and photothermal property of the composites to reveal their potential in practical applications.

Estimation of surface free energy at microstructured surface to investigate intermediate wetting state for partial wetting model

While partial wetting at nano-/microstructured surfaces can be described using the intermediate wetting state between the Cassie-Baxter and Wenzel states, the limitations of the partial wetting model remain unclear. In this study, we performed surface free energy analysis at a microstructured Si-water interface from both theoretical and experimental viewpoints. We experimentally measured the water contact angle on microstructured Si surfaces with square holes and compared the measured values with theoretical predictions. Furthermore, the surface free energy was analyzed using the effective wetting area estimated from the measured contact angle and electrochemical impedance spectroscopy results. We verified the validity of the partial wetting model for fabricated Si surfaces with a hole aperture a less than 230 μm and a hole height h of 12 μm, and for a < 400 μm, h = 40 μm. The model was found to be applicable to microstructured Si surfaces with a/h < 10.

Enhanced Electromagnetic Shielding and Thermal Management Properties in MXene/Aramid Nanofiber Films Fabricated by Intermittent Filtration

High-efficiency electromagnetic interference (EMI) shielding and heat dissipation synergy materials with flexible, robust, and environmental stability are urgently demanded in next-generation integration electronic devices. In this work, we report the lamellar MXene/Aramid nanofiber (ANF) composite films, which establish a nacre-like structure for EMI shielding and heat dissipation by using the intermittent filtration strategy. The MXene/ANF composite film filled with 50 wt % MXene demonstrates enhanced mechanical properties with a strength of 230.5 MPa, an elongation at break of 6.2%, and a toughness of 11.8 MJ·m³ (50 wt % MXene). These remarkable properties are attributed to the hydrogen bonding and highly oriented structure. Furthermore, due to the formation of the MXene conductive network, the MXene/ANF composite film shows an outstanding conductivity of 624.6 S/cm, an EMI shielding effectiveness (EMI SE) of 44.0 dB, and a superior specific SE value (SSE/t) of 18847.6 dB·cm²/g, which is better than the vacuum filtration film. Moreover, the MXene/ANF composite film also shows a great thermal conductivity of 0.43 W/m·K. The multifunctional MXene/ANF composite films with high-performance EMI shielding, heat dissipation, and joule heating show great potential in the field of aerospace, military, microelectronics, microcircuit, and smart wearable electronics.

Analysis of the Structure and the Thermal Conductivity of Semi-Crystalline Polyetheretherketone/Boron Nitride Sheet Composites Using All-Atom Molecular Dynamics Simulation

Thermal transport simulations were performed to investigate the important factors affecting the thermal conductivity based on the structure of semi-crystalline polyetheretherketone (PEEK), and the addition of boron nitride (BN) sheets. The molecular-level structural analysis facilitated the prediction of the thermal conductivity of the optimal structure of PEEK reflecting the best parameter value of the length of amorphous chains, and the ratio of linkage conformations, such as loops, tails, and bridges. It was found that the long heat transfer paths of polymer chains were induced by the addition of BN sheets, which led to the improvement of the thermal conductivities of the PEEK/BN composites. In addition, the convergence of the thermal conductivities of the PEEK/BN composites in relation to BN sheet size was verified by the disconnection of the heat transfer path due to aggregation of the BN sheets.

Thermally Conductive Self-Healing Nanoporous Materials Based on Hydrogen-Bonded Organic Frameworks

Hydrogen-bonded organic frameworks (HOFs) are a class of nanoporous crystalline materials formed by the assembly of organic building blocks that are held together by a network of hydrogen-bonding interactions. Herein, we show that the dynamic and responsive nature of these hydrogen-bonding interactions endows HOFs with a host of unique physical properties that combine ultraflexibility, high thermal conductivities, and the ability to "self-heal". Our systematic atomistic simulations reveal that their unique mechanical properties arise from the ability of the hydrogen-bond arrays to absorb and dissipate energy during deformation. Moreover, we also show that these materials demonstrate relatively high thermal conductivities for porous crystals with low mass densities due to their extended periodic framework structure that is comprised of light atoms. Our results reveal that HOFs mark a new regime of material design combining multifunctional properties that make them ideal candidates for gas storage and separation, flexible electronics, and thermal switching applications.

Enhanced High Thermal Conductivity Cellulose Filaments via Hydrodynamic Focusing

Nanocellulose is regarded as a green and renewable nanomaterial that has attracted increased attention. In this study, we demonstrate that nanocellulose materials can exhibit high thermal conductivity when their nanofibrils are highly aligned and bonded in the form of filaments. The thermal conductivity of individual filaments, consisting of highly aligned cellulose nanofibrils, fabricated by the flow-focusing method is measured in dried condition using a T-type measurement technique. The maximum thermal conductivity of the nanocellulose filaments obtained is 14.5 W/m-K, which is approximately five times higher than those of cellulose nanopaper and cellulose nanocrystals. Structural investigations suggest that the crystallinity of the filament remarkably influence their thermal conductivity. Smaller diameter filaments with higher crystallinity, that is, more internanofibril hydrogen bonds and less intrananofibril disorder, tend to have higher thermal conductivity. Temperature-dependence measurements also reveal that the filaments exhibit phonon transport at effective dimension between 2D and 3D.

Key Factors of Mechanical Strength and Toughness in Oriented Poly(l-lactic acid) Monofilaments for a Bioresorbable Self-Expanding Stent

The investigation of the strength and toughness of poly(l-lactic acid) (PLLA) monofilaments is essential as the fundamental element of a biodegradable braided stent. However, the determining factor remains poorly addressed with respect to influencing the mechanical behavior of PLLA monofilaments. In this work, the electron beam (EB) with different radiation doses was utilized to sterilize PLLA monofilaments. Properties of the monofilaments, including the breaking strength, elongation at break, molecular weight, orientation, and microstructure of the fracture, were characterized. Results showed that a random chain scission of PLLA resulting from EB during this process could cause the decrease in molecular weight, which led to the decline in breaking strength. Meanwhile, the irradiated monofilaments were found to have almost the same elongation at break below a dose of 30 kGy and declined by 71.41% up to a dose of 48 kGy. It was also found that the ductile fracture connection of the monofilament translated to the brittle fracture by comparing the microstructure without and with sterilization. These phenomena could originate from the destruction of the long molecular chains connecting the crystal plates into shorter ones by radiation. PLLA monofilaments with 0, 30, and 48 kGy were used to braid carotid stents. Compared with a carotid Wallstent, the PLLA stent can better provide radial supporting to the carotid lesion. This study provides preliminary experimental references to evaluate and predict the mechanical performance of PLLA braided stents.

Highly Thermally Conductive Adhesion Elastomer Enhanced by Vertically Aligned Folded Graphene

Heat and stress transfer at an interface are crucial for the contact-based tactile sensing to measure the temperature, morphology, and modulus. However, fabricating a smart sensing material that combines high thermal conductivity, elasticity, and good adhesion is challenging. In this study, a composite is fabricated using a directional template of vertically aligned folded graphene (VAFG) and a copolymer matrix of poly-2-[[(butylamino)carbonyl]oxy]ethyl ester and polydimethylsiloxane, vinyl-end-terminated polydimethylsiloxane (poly(PBAx-ran-PDMS)). With optimized chemical cross-linking and supermolecular interactions, the poly(PBA-ran-PDMS)/VAFG exhibits high thermal conductivity (15.49 W m-1 K-1 ), an high elastic deformation, and an interfacial adhesion of up to 6500 N m-1 . Poly(PBA-ran-PDMS)/VAFG is highly sensitive to temperature and pressure and demonstrates a self-learning capacity for manipulator applications. The smart manipulator can distinguish and selectively capture unknown materials in the dark. Thermally conductive, elastic, and adhesive poly(PBA-ran-PDMS)/VAFG can be developed into core materials in intelligent soft robots.

Machine Learning for Harnessing Thermal Energy: From Materials Discovery to System Optimization

Recent advances in machine learning (ML) have impacted research communities based on statistical perspectives and uncovered invisibles from conventional standpoints. Though the field is still in the early stage, this progress has driven the thermal science and engineering communities to apply such cutting-edge toolsets for analyzing complex data, unraveling abstruse patterns, and discovering non-intuitive principles. In this work, we present a holistic overview of the applications and future opportunities of ML methods on crucial topics in thermal energy research, from bottom-up materials discovery to top-down system design across atomistic levels to multi-scales. In particular, we focus on a spectrum of impressive ML endeavors investigating the state-of-the-art thermal transport modeling (density functional theory, molecular dynamics, and Boltzmann transport equation), different families of materials (semiconductors, polymers, alloys, and composites), assorted aspects of thermal properties (conductivity, emissivity, stability, and thermoelectricity), and engineering prediction and optimization (devices and systems). We discuss the promises and challenges of current ML approaches and provide perspectives for future directions and new algorithms that could make further impacts on thermal energy research.

Progress of Polymer-Based Thermally Conductive Materials by Fused Filament Fabrication: A Comprehensive Review

With the miniaturization and integration of electronic products, the heat dissipation efficiency of electronic equipment needs to be further improved. Notably, polymer materials are a choice for electronic equipment matrices because of their advantages of low cost and wide application availability. However, the thermal conductivity of polymers is insufficient to meet heat dissipation requirements, and their improvements remain challenging. For decades, as an efficient manufacturing technology, additive manufacturing has gradually attracted public attention, and researchers have also used this technology to produce new thermally conductive polymer materials. Here, we review the recent research progress of different 3D printing technologies in heat conduction and the thermal conduction mechanism of polymer matrix composites. Based on the classification of fillers, the research progress of thermally conductive materials prepared by fused filament fabrication (FFF) is discussed. It analyzes the internal relationship between FFF process parameters and the thermal conductivity of polymer matrix composites. Finally, this study summarizes the application and future development direction of thermally conductive composites by FFF.

Development and Perspectives of Thermal Conductive Polymer Composites

With the development of electronic appliances and electronic equipment towards miniaturization, lightweight and high-power density, the heat generated and accumulated by devices during high-speed operation seriously reduces the working efficiency and service life of the equipment. The key to solving this problem is to develop high-performance thermal management materials and improve the heat dissipation efficiency of the equipment. This paper mainly summarizes the research progress of polymer composites with high thermal conductivity and electrical insulation, including the thermal conductivity mechanism of composites, the factors affecting the thermal conductivity of composites, and the research status of thermally conductive and electrical insulation polymer composites in recent years. Finally, we look forward to the research focus and urgent problems that should be addressed of high-performance thermal conductive composites, which will provide strategies for further development and application of advanced thermal and electrical insulation composites.

On the origin of elasticity and heat conduction anisotropy of liquid crystal elastomers at gigahertz frequencies

Liquid crystal elastomers that offer exceptional load-deformation response at low frequencies often require consideration of the mechanical anisotropy only along the two symmetry directions. However, emerging applications operating at high frequencies require all five true elastic constants. Here, we utilize Brillouin light spectroscopy to obtain the engineering moduli and probe the strain dependence of the elasticity anisotropy at gigahertz frequencies. The Young's modulus anisotropy, E_||/E_⊥~2.6, is unexpectedly lower than that measured by tensile testing, suggesting disparity between the local mesogenic orientation and the larger scale orientation of the network strands. Unprecedented is the robustness of E_||/E_⊥ to uniaxial load that it does not comply with continuously transformable director orientation observed in the tensile testing. Likewise, the heat conductivity is directional, κ_||/κ_⊥~3.0 with κ_⊥ = 0.16 Wm^-1K^-1. Conceptually, this work reveals the different length scales involved in the thermoelastic anisotropy and provides insights for programming liquid crystal elastomers on-demand for high-frequency applications.

Super-Resolved 3D Mapping of Molecular Orientation Using Vibrational Techniques

When a sample has an anisotropic structure, it is possible to obtain additional information controlling the polarization of incident light. With their straightforward instrumentation approaches, infrared (IR) and Raman spectroscopies are widely popular in this area. Single-band-based determination of molecular in-plane orientation, typically used in materials science, is here extended by the concurrent use of two vibration bands, revealing the orientational ordering in three dimension. The concurrent analysis was applied to IR spectromicroscopic data to obtain orientation angles of a model polycaprolactone spherulite sample. The applicability of this method spans from high-resolution, diffraction-limited Fourier transform infrared (FT-IR) and Raman imaging to super-resolved optical photothermal infrared (O-PTIR) imaging. Due to the nontomographic experimental approach, no image distortion is visible and nanometer scale orientation domains can be observed. Three-dimensional (3D) bond orientation maps enable in-depth characterization and consequently precise control of the sample’s physicochemical properties and functions.

Thermal management and control of wearable devices

The emergence of wearable devices over the recent decades has motivated numerous studies aimed at developing flexible or stretchable materials and structures for their electronic or optoelectronic functionalities. Like in conventional devices, electronic and optoelectronic components in wearable devices must be kept within certain temperature ranges to ensure reliability, performance, and/or functionality. But this must be accomplished without requiring any bulky heat sinks or other heat transfer augmentation elements. At the same time, the proximity of wearable devices to the human skin poses additional requirements of thermal comfort and safety. A growing body of literature is now focusing on the thermal management or control of wearable devices and related development of new materials and structures. The present article aims to provide a broad overview of such materials and structures and offer suggestions for future research directions.

Sandwich-Structured Flexible PVA/CS@MWCNTs Composite Films with High Thermal Conductivity and Excellent Electrical Insulation

High thermal conductivity polymer matrix composites have become an urgent need for the thermal management of modern electronic devices. However, increasing the thermal conductivity of polymer-based composites typically results in loss of lightweight, flexibility and electrical insulation. Herein, the polyvinyl alcohol (PVA)/PVA-chitosan-adsorbed multi-walled carbon nanotubes/PVA (PVA/CS@MWCNTs) composite films with a sandwich structure were designed and fabricated by a self-construction strategy inspired by the surface film formation of milk. The obtained film simultaneously possesses high thermal conductivity, electrical insulation, and excellent flexibility. In this particular structure, the uniform intermediate layer of PVA-CS@MWCNTs contributed to improving the thermal conductivity of composite films, and the PVA distributed on both sides of the sandwich structure maintains the electrical insulation of the films (superior electrical resistivity above 10¹² Ω·cm). It has been demonstrated that the fillers could be arranged in a horizontal direction during the scraping process. Thus, the obtained composite film exhibited high in-plane thermal conductivity of 5.312 W·m⁻¹·K⁻¹ at fairly low MWCNTs loading of 5 wt%, which increased by about 1190% compared with pure PVA (0.412 W·m⁻¹·K⁻¹). This work effectively realizes the combination of high thermal conductivity and excellent electrical insulation, which could greatly expand the application of polymer-based composite films in the area of thermal management.

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed.

Highly thermoconductive yet ultraflexible polymer composites with superior mechanical properties and autonomous self-healing functionality via a binary filler strategy

It is still a formidable challenge to develop ideal thermal dissipation materials with simultaneous high thermal conductivity, excellent mechanical softness and toughness, and spontaneous self-healing. Herein, we report the introduction of sandwich-like boron nitride nanosheets-liquid metal binary fillers into an artificial poly(urea-urethane) elastomer to address the above issue, which confers the composite elastomer with a unique thermal-mechanical-healing combination, including a low modulus, high in-plane thermal conductivity and high mass loading of rigid fillers but self-recoverability and room-temperature self-healing.

Thickness dependent thermal performance of a poly(3,4-ethylenedioxythiophene) thin film synthesized via an electrochemical approach

Polymer-based thermal interface materials (TIMs) have attracted wide attention in the field of thermal management because of their outstanding properties including light weight, low cost, corrosion resistance and easy processing. However, the low thermal conductivity (∼0.2 W m-1 K-1) of the intrinsic polymer matrix largely degrades the overall thermal performance of polymer-based TIMs even those containing highly thermal conductive fillers. Hence, enhancing the intrinsic thermal conductivity of the polymer matrix is one of the most critical problems needed to be solved. This paper studies the thermal conductivity of poly(3,4-ethylenedioxythiophene) (PEDOT) films fabricated via cyclic voltammetry. By controlling the number of cycles in the electrochemical synthesis, different thickness of PEDOT films could be obtained. A time-domain thermoreflectance (TDTR) system was employed to evaluate the thermal performance of such as-prepared PEDOT films. We have demonstrated that a PEDOT film with thickness of 40 nm achieves the highest out-of-plane thermal conductivity of ∼0.60 W m-1 K-1, which is almost three folds the thermal conductivity of commercially available pristine PEDOT:PSS film with similar thickness. The X-ray diffraction spectrum reveals that the PEDOT thin film with high crystallinity at the initial stage of electrochemical synthesis leads to enhanced thermal transportation. The findings in this work not only offer an opportunity to fabricate polymer materials exhibiting enhanced thermal conductivity, but also allow one to adjust the thermal performance of conducting polymers in practical applications.

State-of-the-Art, Opportunities, and Challenges in Bottom-up Synthesis of Polymers with High Thermal Conductivity

In contrast to metals, polymers are predominantly thermal and electrical insulators. With their unparalleled advantages such as light weight, turning polymer insulators into heat conductors with metal-like thermal conductivity is...

Polycaprolactone Adsorption and Nucleation onto Graphite Nanoplates for Highly Flexible, Thermally Conductive, and Thermomechanically Stiff Nanopapers

Free-standing nanopapers based on graphene and its related materials have been widely studied and proposed for flexible heat spreader applications. Given that these materials are typically brittle, this work reports the exploitation of polycaprolactone (PCL) as a polymer binder to enhance resistance and flexibility of nanopapers based on graphite nanoplates (GNP), while maintaining a high thermal conductivity. Properties of nanopapers appear to correlate with the excellent PCL adhesion and strong nucleation of the surface of GNP flakes. Furthermore, different crystalline populations were observed for PCL within the nanopaper and were investigated in detail via differential scanning calorimetry advanced techniques and X-ray diffraction. These demonstrated the coexistence of conventional unoriented PCL crystals, oriented PCL crystals obtained as a consequence of the strong nucleation effect, and highly stable PCL fractions explained by the formation of crystalline pre-freezing layers, the latter having melting temperatures well above the equilibrium melting temperature for pristine PCL. This peculiar crystallization behavior of PCL, reported in this paper for the first time for a tridimensional structure, has a direct impact on material properties. Indeed, the presence of high thermal stability crystals, strongly bound to GNP flakes, coexisting with the highly flexible amorphous fraction, delivers an ideal solution for the strengthening and toughening of GNP nanopapers. Thermomechanical properties of PCL/GNP nanopapers, investigated both on a heating ramp and by creep tests at high temperatures, demonstrated superior stiffness well above the conventional melting temperature of PCL. At the same time, a thermal conductivity > 150 W/m·K was obtained for PCL/GNP nanopapers, representing a viable alternative to traditional metals in terms of heat dissipation, while affording flexibility and light weight, unmatched by conventional thermally conductive metals or ceramics. Besides the obtained performance, the formation of polymer crystals that are stable above the equilibrium melting temperature constitutes a novel approach in the self-assembly of highly ordered nanostructures based on graphene and related materials.

Ultrahigh Molecular Weight Polyethylene Lamellar-Thin Framework on Square Meter Scale

A new member of low-dimensional structures with a high aspect ratio (LDHA) is introduced. For the first time, commodity polymer is processed into LDHA, which has long been stagnated by the lack of suitable processing techniques. The key to solve the current bottleneck is to overcome the trade-off between kinetic processability and thermodynamic stability. These two factors are both highly determined by intermolecular interaction level (IIL). Thus with a wide tuning range of IIL, ultrahigh molecular weight polyethylene (UHMWPE) is selected and investigated to break through the trade-off. Polymeric LDHA preparation needs both thinning and stiffening. By focusing on one then the other sequentially, they are realized simultaneously. Thus the over sixty-year-old material is finally thinned down by seven orders of magnitude into a 65.5 nm thick and 0.64 m² large lamellar-thin framework (LTF). LTF exhibits a series of exceptional properties such as over-95% transparency, and seven times higher specific strength referred to steel. For the first time, cryogenic electron microscopy (Cryo-EM) is utilized to observe commodity polymers directly. This new LDHA material is promising to expand the scale boundaries of both fundamental research and practical applications, not only for UHMWPE, but also for more commodity polymers to come.

Solution-shearing of dielectric polymer with high thermal conductivity and electric insulation

Polymer dielectrics, an insulating material ubiquitous in electrical power systems, must be ultralight, mechanically and dielectrically strong, and very thermally conductive. However, electric and thermal transport parameters are intercorrelated in a way that works against the occurrence of thermally conductive polymer electric insulators. Here, we describe how solution gel-shearing–strained polyethylene yields an electric insulating material with an outstanding in-plane thermal conductivity of 10.74 W m⁻¹ K⁻¹ and an average dielectric constant of 4.1. The dielectric constant and loss of such sheared polymer electric insulators are nearly independent of the frequency and a wide temperature range. The gel-shearing aligns ultrahigh–molecular weight polymer crystalline chains for the formation of separated and aligned nanoscale fibrous arrays. Together with lattice strains and the presence of boron nitride nanosheets, the dielectric polymer shows high current density carrying and high operating temperature, which is attributed to greatly enhanced heat conduction.

Current Status of Research on the Modification of Thermal Properties of Epoxy Resin-Based Syntactic Foam Insulation Materials

As a lightweight and highly insulating composite material, epoxy resin syntactic foam is increasingly widely used for insulation filling in electrical equipment. To avoid core burning and cracking, which are prone to occur during the casting process, the epoxy resin-based syntactic foam insulation materials with high thermal conductivity and low coefficient of thermal expansion are required for composite insulation equipment. The review is divided into three sections concentrating on the two main aspects of modifying the thermal properties of syntactic foam. The mechanism and models, from the aspects of thermal conductivity and coefficient of thermal expansion, are presented in the first part. The second part aims to better understand the methods for modifying the thermal properties of syntactic foam by adding functional fillers, including the addition of thermally conductive particles, hollow glass microspheres, negative thermal expansion filler and fibers, etc. The third part concludes by describing the existing challenges in this research field and expanding the applicable areas of epoxy resin-based syntactic foam insulation materials, especially cross-arm composite insulation.

Phonon-engineered extreme thermal conductivity materials

Materials with ultrahigh or low thermal conductivity are desirable for many technological applications, such as thermal management of electronic and photonic devices, heat exchangers, energy converters and thermal insulation. Recent advances in simulation tools (first principles, the atomistic Green's function and molecular dynamics) and experimental techniques (pump-probe techniques and microfabricated platforms) have led to new insights on phonon transport and scattering in materials and the discovery of new thermal materials, and are enabling the engineering of phonons towards desired thermal properties. We review recent discoveries of both inorganic and organic materials with ultrahigh and low thermal conductivity, highlighting heat-conduction physics, strategies used to change thermal conductivity, and future directions to achieve extreme thermal conductivities in solid-state materials.

Al2O3 Dispersion-Induced Micropapillae in an Epoxy Composite Coating and Implications in Thermal Conductivity

Al₂O₃ particles with different sizes were dispersed into an epoxy precursor to improve the thermal conductivity (TC) of the epoxy coating. Al₂O₃ particles tend to aggregate in epoxy, and the aggregation becomes more apparent (formation of micropapillae when the particle size is larger than 1 μm) with the increase of particle size. The calculated fast aggregation rates of various-size Al₂O₃ particles in epoxy showed that the fast aggregation rate increased to a maximum rate of 6.37 × 10^-20 m³·s^-1 at a particle size of 200 nm and then decreased to a plateau value with the increase of particle size. The high fast aggregation rate caused the aggregation and the formation of nano- and micropapillae, causing the heterogeneous distribution of Al₂O₃ particles. These micropapillae were separated by epoxy, which made formation of continuous pathways fail, causing the reduction of TC and heterogeneous heat distribution. The highest thermal conductivity of 2.52 W/m·K and uniform heat distribution were observed at the optimum filler size of 30 nm. The research findings provide the knowledge of optimizing particle size on constructing a thermally conductive polymer composite.

Fully Organic Bulk Polymer with Metallic Thermal Conductivity and Tunable Thermal Pathways

Electrically insulating polymers are indispensable for electronic and energy applications, but their poor thermal conduction has increasingly become a bottleneck for high-performance devices. Highly drawn low-dimensional polymeric fibers and thin films can exhibit metallic conductivity. Extending this to bulk materials required by real world applications is prohibitive due to the additional interfacial thermal conduction barriers. It is demonstrated that highly aligned ultrahigh molecular weight polyethylene microfibers can be incorporated into a silicone matrix to yield a fully organic bulk polymer composite with a continuous vertical phonon pathway. This leads to a perpendicular thermal conductivity of 38.27 W m^-1 K^-1 , at par with metals and two orders of magnitude higher than other bulk organic polymers. Taking further advantage of the mechanical flexibility of the microfibers, the processing method offers the freedom to tailor heat transfer pathways in a macroscopic 3D space. The material/process opens up opportunities for efficient thermal management in high-performance devices.