1
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Xu J, Luo Z, Chen L, Zhou X, Zhang H, Zheng Y, Wei L. Recent advances in flexible memristors for advanced computing and sensing. MATERIALS HORIZONS 2024; 11:4015-4036. [PMID: 38919028 DOI: 10.1039/d4mh00291a] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/27/2024]
Abstract
Conventional computing systems based on von Neumann architecture face challenges such as high power consumption and limited data processing capability. Improving device performance via scaling guided by Moore's Law becomes increasingly difficult. Emerging memristors can provide a promising solution for achieving high-performance computing systems with low power consumption. In particular, the development of flexible memristors is an important topic for wearable electronics, which can lead to intelligent systems in daily life with high computing capacity and efficiency. Here, recent advances in flexible memristors are reviewed, from operating mechanisms and typical materials to representative applications. Potential directions and challenges for future study in this area are also discussed.
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Affiliation(s)
- Jiaming Xu
- School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore.
| | - Ziwang Luo
- School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore.
| | - Long Chen
- School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore.
| | - Xuhui Zhou
- School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore.
| | - Haozhe Zhang
- School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore.
| | - Yuanjin Zheng
- School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore.
| | - Lei Wei
- School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore.
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2
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Li D, Cui T, Xu Z, Xu S, Dong Z, Tao L, Liu H, Yang Y, Ren TL. Designs and Applications for the Multimodal Flexible Hybrid Epidermal Electronic Systems. RESEARCH (WASHINGTON, D.C.) 2024; 7:0424. [PMID: 39130493 PMCID: PMC11310101 DOI: 10.34133/research.0424] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 04/28/2024] [Accepted: 06/17/2024] [Indexed: 08/13/2024]
Abstract
Research on the flexible hybrid epidermal electronic system (FHEES) has attracted considerable attention due to its potential applications in human-machine interaction and healthcare. Through material and structural innovations, FHEES combines the advantages of traditional stiff electronic devices and flexible electronic technology, enabling it to be worn conformally on the skin while retaining complex system functionality. FHEESs use multimodal sensing to enhance the identification accuracy of the wearer's motion modes, intentions, or health status, thus realizing more comprehensive physiological signal acquisition. However, the heterogeneous integration of soft and stiff components makes balancing comfort and performance in designing and implementing multimodal FHEESs challenging. Herein, multimodal FHEESs are first introduced in 2 types based on their different system structure: all-in-one and assembled, reflecting totally different heterogeneous integration strategies. Characteristics and the key design issues (such as interconnect design, interface strategy, substrate selection, etc.) of the 2 multimodal FHEESs are emphasized. Besides, the applications and advantages of the 2 multimodal FHEESs in recent research have been presented, with a focus on the control and medical fields. Finally, the prospects and challenges of the multimodal FHEES are discussed.
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Affiliation(s)
- Ding Li
- School of Integrated Circuit,
Tsinghua University, Beijing, China
| | - Tianrui Cui
- School of Integrated Circuit,
Tsinghua University, Beijing, China
| | - Zigan Xu
- School of Integrated Circuit,
Tsinghua University, Beijing, China
| | - Shuoyan Xu
- School of Integrated Circuit,
Tsinghua University, Beijing, China
| | - Zirui Dong
- School of Integrated Circuit,
Tsinghua University, Beijing, China
| | - Luqi Tao
- Beijing National Research Center for Information Science and Technology (BNRist),
Tsinghua University, Beijing, China
| | - Houfang Liu
- Beijing National Research Center for Information Science and Technology (BNRist),
Tsinghua University, Beijing, China
| | - Yi Yang
- School of Integrated Circuit,
Tsinghua University, Beijing, China
- Beijing National Research Center for Information Science and Technology (BNRist),
Tsinghua University, Beijing, China
| | - Tian-Ling Ren
- School of Integrated Circuit,
Tsinghua University, Beijing, China
- Beijing National Research Center for Information Science and Technology (BNRist),
Tsinghua University, Beijing, China
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3
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Joch D, Lang T, Sanctis S, Jank MPM. Simulation-Guided Analysis towards Trench Depth Optimization for Enhanced Flexibility in Stretch-Free, Shape-Induced Interconnects for Flexible Electronics. MATERIALS (BASEL, SWITZERLAND) 2024; 17:3849. [PMID: 39124515 PMCID: PMC11314053 DOI: 10.3390/ma17153849] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/25/2024] [Revised: 07/25/2024] [Accepted: 08/01/2024] [Indexed: 08/12/2024]
Abstract
In this paper, we present an optimization of the planar manufacturing scheme for stretch-free, shape-induced metal interconnects to simplify fabrication with the aim of maximizing the flexibility in a structure regarding stress and strain. The formation of trenches between silicon islands is actively used in the lithographic process to create arc shape structures by spin coating resists into the trenches. The resulting resist form is used as a template for the metal lines, which are structured on top. Because this arc shape is beneficial for the flexibility of these bridges. The trench depth as a key parameter for the stress distribution is investigated by applying numerical simulations. The simulated results show that the increase in penetration depth of the metal bridge into the trench increases the tensile load which is converted into a shear force Q(x), that usually leads to increased strains the structure can generate. For the fabrication, the filling of the trenches with resists is optimized by varying the spin speed. Compared to theoretical resistance, the current-voltage measurements of the metal bridges show a similar behavior and almost every structural variation is capable of functioning as a flexible electrical interconnect in a complete island-bridge array.
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Affiliation(s)
- Daniel Joch
- Si Special Devices Group, Research and Development Semiconductor Devices, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Schottkystrasse 10, 91058 Erlangen, Germany
- Electron Devices (LEB), Friedrich-Alexander-Universität Erlangen-Nuremberg, Cauerstr. 6, 91058 Erlangen, Germany
| | - Thomas Lang
- Si Special Devices Group, Research and Development Semiconductor Devices, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Schottkystrasse 10, 91058 Erlangen, Germany
| | - Shawn Sanctis
- Electron Devices (LEB), Friedrich-Alexander-Universität Erlangen-Nuremberg, Cauerstr. 6, 91058 Erlangen, Germany
| | - Michael P. M. Jank
- Si Special Devices Group, Research and Development Semiconductor Devices, Fraunhofer Institute for Integrated Systems and Device Technology IISB, Schottkystrasse 10, 91058 Erlangen, Germany
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4
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Du B, Xiong S, Sun L, Tagawa Y, Inoue D, Hashizume D, Wang W, Guo R, Yokota T, Wang S, Ishida Y, Lee S, Fukuda K, Someya T. A water-resistant, ultrathin, conformable organic photodetector for vital sign monitoring. SCIENCE ADVANCES 2024; 10:eadp2679. [PMID: 39047100 PMCID: PMC11268404 DOI: 10.1126/sciadv.adp2679] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/17/2024] [Accepted: 06/20/2024] [Indexed: 07/27/2024]
Abstract
Ultrathin flexible photodetectors can be conformably integrated with the human body, offering promising advancements for emerging skin-interfaced sensors. However, the susceptibility to degradation in ambient and particularly in aqueous environments hinders their practical application. Here, we report a 3.2-micrometer-thick water-resistant organic photodetector capable of reliably monitoring vital sign while submerged underwater. Embedding the organic photoactive layer in an adhesive elastomer matrix induces multidimensional hybrid phase separation, enabling high adhesiveness of the photoactive layer on both the top and bottom surfaces with maintained charge transport. This improves the water-immersion stability of the photoactive layer and ensures the robust sealing of interfaces within the device, notably suppressing fluid ingression in aqueous environments. Consequently, our fabricated ultrathin organic photodetector demonstrates stability in deionized water or cell nutrient media over extended periods, high detectivity, and resilience to cyclic mechanical deformation. We also showcase its potential for vital sign monitoring while submerged underwater.
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Affiliation(s)
- Baocai Du
- Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
- RIKEN Center for Emergent Matter Science, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Sixing Xiong
- RIKEN Center for Emergent Matter Science, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Lulu Sun
- Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Yusaku Tagawa
- Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
| | - Daishi Inoue
- RIKEN Center for Emergent Matter Science, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Daisuke Hashizume
- RIKEN Center for Emergent Matter Science, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Wenqing Wang
- Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
- RIKEN Center for Emergent Matter Science, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Ruiqi Guo
- RIKEN Center for Emergent Matter Science, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Tomoyuki Yokota
- Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
- Institute of Engineering Innovation, Graduate School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
| | - Shuxu Wang
- RIKEN Center for Emergent Matter Science, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Yasuhiro Ishida
- RIKEN Center for Emergent Matter Science, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Sunghoon Lee
- RIKEN Center for Emergent Matter Science, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
- Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Kenjiro Fukuda
- RIKEN Center for Emergent Matter Science, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
- Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Takao Someya
- Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
- RIKEN Center for Emergent Matter Science, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
- Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
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5
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Wei J, Wang Z, Pan F, Yuan T, Fang Y, Gao C, Ping H, Wang Y, Zhao S, Fu Z. Biosustainable Multiscale Transparent Nanocomposite Films for Sensitive Pressure and Humidity Sensors. ACS APPLIED MATERIALS & INTERFACES 2024; 16:37122-37130. [PMID: 38953852 DOI: 10.1021/acsami.4c09157] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 07/04/2024]
Abstract
Light weight, thinness, transparency, flexibility, and insulation are the key indicators for flexible electronic device substrates. The common flexible substrates are usually polymer materials, but their recycling is an overwhelming challenge. Meanwhile, paper substrates are limited in practical applications because of their poor mechanical and thermal stability. However, natural biomaterials have excellent mechanical properties and versatility thanks to their organic-inorganic multiscale structures, which inspired us to design an organic-inorganic nanocomposite film. For this purpose, a bio-inspired multiscale film was developed using cellulose nanofibers with abundant hydrophilic functional groups to assist in dispersing hydroxyapatite nanowires. The thickness of the biosustainable film is only 40 μm, and it incorporates distinctive mechanical properties (strength: 52.8 MPa; toughness: 0.88 MJ m-3) and excellent optical properties (transmittance: 80.0%; haze: 71.2%). Consequently, this film is optimal as a substrate employed for flexible sensors, which can transmit capacitance and resistance signals through wireless Bluetooth, showing an ultrasensitive response to pressure and humidity (for example, responding to finger pressing with 5000% signal change and exhaled water vapor with 4000% signal change). Therefore, the comprehensive performance of the biomimetic multiscale organic-inorganic composite film confers a prominent prospect in flexible electronics devices, food packaging, and plastic substitution.
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Affiliation(s)
- Jingjiang Wei
- Institute for Advanced Study, Chengdu University, Chengdu 610106, P. R. China
| | - Zhikang Wang
- College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, P. R. China
| | - Fei Pan
- Department of Chemistry, University of Basel, Basel 4058, Switzerland
| | - Tianyu Yuan
- Institute for Advanced Study, Chengdu University, Chengdu 610106, P. R. China
| | - Yuanlai Fang
- Institute for Advanced Study, Chengdu University, Chengdu 610106, P. R. China
| | - Caiqin Gao
- College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, P. R. China
| | - Hang Ping
- State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, P. R. China
| | - Yanqing Wang
- College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, P. R. China
| | - Shanyu Zhao
- Laboratory for Building Energy Materials and Components, Swiss Federal Laboratories for Materials Science and Technology (Empa), Dübendorf 8600, Switzerland
| | - Zhengyi Fu
- State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, P. R. China
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6
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Qu X, Wu Y, Han Z, Li J, Deng L, Xie R, Zhang G, Wang H, Chen S. Highly Sensitive Fiber Crossbar Sensors Enabled by Second-Order Synergistic Effect of Air Capacitance and Equipotential Body. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2024; 20:e2311498. [PMID: 38377274 DOI: 10.1002/smll.202311498] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/10/2023] [Revised: 01/30/2024] [Indexed: 02/22/2024]
Abstract
Fiber crossbars, an emerging electronic device, have become the most promising basic unit for advanced smart textiles. The demand for highly sensitive fiber crossbar sensors (FCSs) in wearable electronics is increased. However, the unique structure of FCSs presents challenges in replicating existing sensitivity enhancement strategies. Aiming at the sensitivity of fiber crossbar sensors, a second-order synergistic strategy is proposed that combines air capacitance and equipotential bodies, resulting in a remarkable sensitivity enhancement of over 20 times for FCSs. This strategy offers a promising avenue for the design and fabrication of FCSs that do not depend on intricate microstructures. Furthermore, the integrative structure of core-sheath fibers ensures a robust interface, leading to a low hysteresis of only 2.33% and exceptional stability. The outstanding capacitive response performance of FCSs allows them to effectively capture weak signals such as pulses and sounds. This capability opens up possibilities for the application of FCSs in personalized health management, as demonstrated by wireless monitoring systems based on pulse signals.
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Affiliation(s)
- Xiangyang Qu
- State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, P. R. China
| | - Yuchen Wu
- College of Information Sciences and Technology, Donghua University, Shanghai, 201620, P. R. China
| | - Zhiliang Han
- State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, P. R. China
| | - Jing Li
- State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, P. R. China
| | - Lili Deng
- State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, P. R. China
| | - Ruimin Xie
- State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, P. R. China
| | - Guanglin Zhang
- College of Information Sciences and Technology, Donghua University, Shanghai, 201620, P. R. China
| | - Huaping Wang
- State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, P. R. China
| | - Shiyan Chen
- State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, P. R. China
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7
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Al-Hamry A, Pan Y, Rahaman M, Selyshchev O, Tegenkamp C, Zahn DRT, Pašti IA, Kanoun O. Toward Humidity-Independent Sensitive and Fast Response Temperature Sensors Based on Reduced Graphene Oxide/Poly(vinyl alcohol) Nanocomposites. ACS APPLIED ELECTRONIC MATERIALS 2024; 6:4718-4734. [PMID: 38947952 PMCID: PMC11210420 DOI: 10.1021/acsaelm.4c00729] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 04/23/2024] [Revised: 05/17/2024] [Accepted: 05/19/2024] [Indexed: 07/02/2024]
Abstract
Flexible temperature sensors are becoming increasingly important these days. In this work, we explore graphene oxide (GO)/poly(vinyl alcohol) (PVA) nanocomposites for potential application in temperature sensors. The influence of the mixing ratio of both materials, the reduction temperature, and passivation on the sensing performance has been investigated. Various spectroscopic techniques revealed the composite structure and atomic composition. These were complemented by semiempirical quantum chemical calculations to investigate rGO and PVA interaction. Scanning electron and atomic force microscopy measurements were carried out to evaluate dispersion and coated film quality. The temperature sensitivity has been evaluated for several composite materials with different compositions in the range from 10 to 80 °C. The results show that a linear temperature behavior can be realized based on rGO/PVA composites with temperature coefficients of resistance (TCR) larger than 1.8% K-1 and a fast response time of 0.3 s with minimal hysteresis. Furthermore, humidity influence has been investigated in the range from 10% to 80%, and a minor effect is shown. Therefore, we can conclude that rGO/PVA composites have a high potential for excellent passivation-free, humidity-independent, sensitive, and fast response temperature sensors for various applications. The GO reduction is tunable, and PVA improves the rGO/PVA sensor performance by increasing the tunneling effect and band gap energy, consequently improving temperature sensitivity. Additionally, PVA exhibits minimal water absorption, reducing the humidity sensitivity. rGO/PVA maintains its temperature sensitivity during and after several mechanical deformations.
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Affiliation(s)
- Ammar Al-Hamry
- Measurement
and Sensor Technology, Chemnitz University
of Technology, Reichenhainer Str. 70, 09126 Chemnitz, Germany
| | - Yang Pan
- Semiconductor
Physics, Chemnitz University of Technology, Reichenhainer Str. 70, 09126 Chemnitz, Germany
| | - Mahfujur Rahaman
- Semiconductor
Physics, Chemnitz University of Technology, Reichenhainer Str. 70, 09126 Chemnitz, Germany
| | - Oleksandr Selyshchev
- Semiconductor
Physics, Chemnitz University of Technology, Reichenhainer Str. 70, 09126 Chemnitz, Germany
| | - Christoph Tegenkamp
- Analysis
of Solid Surfaces, Chemnitz University of
Technology, Reichenhainer
Str. 70, 09126 Chemnitz, Germany
| | - Dietrich R. T. Zahn
- Semiconductor
Physics, Chemnitz University of Technology, Reichenhainer Str. 70, 09126 Chemnitz, Germany
| | - Igor A. Pašti
- Faculty
of Physical Chemistry, University of Belgrade, Studentski trg 12-16, 11158 Belgrade, Serbia
| | - Olfa Kanoun
- Measurement
and Sensor Technology, Chemnitz University
of Technology, Reichenhainer Str. 70, 09126 Chemnitz, Germany
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8
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Cao C, Ji S, Jiang Y, Su J, Xia H, Li H, Tian C, Wong YJ, Feng X, Chen X. Mitigating the Overheat of Stretchable Electronic Devices Via High-Enthalpy Thermal Dissipation of Hydrogel Encapsulation. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2401875. [PMID: 38598692 DOI: 10.1002/adma.202401875] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/04/2024] [Revised: 03/27/2024] [Indexed: 04/12/2024]
Abstract
The practical application of flexible and stretchable electronics is significantly influenced by their thermal and chemical stability. Elastomer substrates and encapsulation, due to their soft polymer chains and high surface-area-to-volume ratio, are particularly susceptible to high temperatures and flame. Excessive heat poses a severe threat of damage and decomposition to these elastomers. By leveraging water as a high enthalpy dissipating agent, here, a hydrogel encapsulation strategy is proposed to enhance the flame retardancy and thermal stability of stretchable electronics. The hydrogel-based encapsulation provides thermal protection against flames for more than 10 s through the evaporation of water. Further, the stretchability and functions automatically recover by absorbing air moisture. The incorporation of hydrogel encapsulation enables stretchable electronics to maintain their functions and perform complex tasks, such as fire saving in soft robotics and integrated electronics sensing. With high enthalpy heat dissipation, encapsulated soft electronic devices are effectively shielded and retain their full functionality. This strategy offers a universal method for flame retardant encapsulation of stretchable electronic devices.
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Affiliation(s)
- Can Cao
- Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, 314000, China
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Shaobo Ji
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798, Singapore
- Institute of Functional Nano & Soft Materials (FUNSOM), Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Soochow University, Suzhou, 215123, China
| | - Ying Jiang
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Jiangtao Su
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Huarong Xia
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798, Singapore
| | - Haicheng Li
- Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, 314000, China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China
| | - Changhao Tian
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798, Singapore
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore, 138634, Singapore
| | - Yi Jing Wong
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798, Singapore
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore, 138634, Singapore
| | - Xue Feng
- Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, 314000, China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China
| | - Xiaodong Chen
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798, Singapore
- Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, Singapore, 639798, Singapore
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9
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Lu P, Liao X, Guo X, Cai C, Liu Y, Chi M, Du G, Wei Z, Meng X, Nie S. Gel-Based Triboelectric Nanogenerators for Flexible Sensing: Principles, Properties, and Applications. NANO-MICRO LETTERS 2024; 16:206. [PMID: 38819527 PMCID: PMC11143175 DOI: 10.1007/s40820-024-01432-2] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/08/2024] [Accepted: 04/30/2024] [Indexed: 06/01/2024]
Abstract
The rapid development of the Internet of Things and artificial intelligence technologies has increased the need for wearable, portable, and self-powered flexible sensing devices. Triboelectric nanogenerators (TENGs) based on gel materials (with excellent conductivity, mechanical tunability, environmental adaptability, and biocompatibility) are considered an advanced approach for developing a new generation of flexible sensors. This review comprehensively summarizes the recent advances in gel-based TENGs for flexible sensors, covering their principles, properties, and applications. Based on the development requirements for flexible sensors, the working mechanism of gel-based TENGs and the characteristic advantages of gels are introduced. Design strategies for the performance optimization of hydrogel-, organogel-, and aerogel-based TENGs are systematically summarized. In addition, the applications of gel-based TENGs in human motion sensing, tactile sensing, health monitoring, environmental monitoring, human-machine interaction, and other related fields are summarized. Finally, the challenges of gel-based TENGs for flexible sensing are discussed, and feasible strategies are proposed to guide future research.
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Affiliation(s)
- Peng Lu
- School of Light Industry and Food Engineering, Guangxi University, Nanning, 530004, People's Republic of China
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing, 101400, People's Republic of China
| | - Xiaofang Liao
- School of Light Industry and Food Engineering, Guangxi University, Nanning, 530004, People's Republic of China
| | - Xiaoyao Guo
- School of Light Industry and Food Engineering, Guangxi University, Nanning, 530004, People's Republic of China
| | - Chenchen Cai
- School of Light Industry and Food Engineering, Guangxi University, Nanning, 530004, People's Republic of China
| | - Yanhua Liu
- School of Light Industry and Food Engineering, Guangxi University, Nanning, 530004, People's Republic of China
| | - Mingchao Chi
- School of Light Industry and Food Engineering, Guangxi University, Nanning, 530004, People's Republic of China
| | - Guoli Du
- School of Light Industry and Food Engineering, Guangxi University, Nanning, 530004, People's Republic of China
| | - Zhiting Wei
- School of Light Industry and Food Engineering, Guangxi University, Nanning, 530004, People's Republic of China
| | - Xiangjiang Meng
- School of Light Industry and Food Engineering, Guangxi University, Nanning, 530004, People's Republic of China
| | - Shuangxi Nie
- School of Light Industry and Food Engineering, Guangxi University, Nanning, 530004, People's Republic of China.
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10
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Peng L, Wang J, Gao F, Zhang J, Zhai W, Zhou L, Jiang X. Incoherent partial superposition modeling for single-shot angle-resolved ellipsometry measurement of thin films on transparent substrates. OPTICS EXPRESS 2024; 32:15774-15787. [PMID: 38859219 DOI: 10.1364/oe.517216] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/28/2023] [Accepted: 04/04/2024] [Indexed: 06/12/2024]
Abstract
Ellipsometric measurement of transparent samples suffers from substrate backside reflection challenges, including incoherent and partial superposition issues. The recently developed angle-resolved ellipsometry (ARE) can naturally eliminate the backside reflections of substrates with a micro-spot equivalent thickness or thicker; however, for thinner substrates, ARE working with general incoherent backside reflection models shows significant inaccuracy or measurement failure. In this paper, an incoherent partial superposition (IPS) model is proposed to characterize the optical superposition effect between the frontside and uncertain backside reflections from an unknown substrate. IPS introduces a cosine-like correction of the backside reflection, corresponding to the overlapping-area change of backside and frontside reflections along with incident angles. Benefiting from ARE's wide-angle spectral imaging capability, IPS achieves single-shot measurement of thin film thicknesses on transparent substrates of unknown thickness. An ARE system was built and calibrated regarding the linear relationship between the cosine-corrected angular frequencies and substrate thicknesses. Then, commercial ITO films on glasses of different thicknesses ranging from 200 to 1000 µm were measured. Experimental results show that IPS-ARE results in a root-mean-square accuracy error of ∼1 nm in film thickness measurement and provides a ∼77% error reduction from general incoherent backside reflection models.
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11
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Chang S, Koo JH, Yoo J, Kim MS, Choi MK, Kim DH, Song YM. Flexible and Stretchable Light-Emitting Diodes and Photodetectors for Human-Centric Optoelectronics. Chem Rev 2024; 124:768-859. [PMID: 38241488 DOI: 10.1021/acs.chemrev.3c00548] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/21/2024]
Abstract
Optoelectronic devices with unconventional form factors, such as flexible and stretchable light-emitting or photoresponsive devices, are core elements for the next-generation human-centric optoelectronics. For instance, these deformable devices can be utilized as closely fitted wearable sensors to acquire precise biosignals that are subsequently uploaded to the cloud for immediate examination and diagnosis, and also can be used for vision systems for human-interactive robotics. Their inception was propelled by breakthroughs in novel optoelectronic material technologies and device blueprinting methodologies, endowing flexibility and mechanical resilience to conventional rigid optoelectronic devices. This paper reviews the advancements in such soft optoelectronic device technologies, honing in on various materials, manufacturing techniques, and device design strategies. We will first highlight the general approaches for flexible and stretchable device fabrication, including the appropriate material selection for the substrate, electrodes, and insulation layers. We will then focus on the materials for flexible and stretchable light-emitting diodes, their device integration strategies, and representative application examples. Next, we will move on to the materials for flexible and stretchable photodetectors, highlighting the state-of-the-art materials and device fabrication methods, followed by their representative application examples. At the end, a brief summary will be given, and the potential challenges for further development of functional devices will be discussed as a conclusion.
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Affiliation(s)
- Sehui Chang
- School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology (GIST), Gwangju 61005, Republic of Korea
| | - Ja Hoon Koo
- Department of Semiconductor Systems Engineering, Sejong University, Seoul 05006, Republic of Korea
- Institute of Semiconductor and System IC, Sejong University, Seoul 05006, Republic of Korea
| | - Jisu Yoo
- Department of Materials Science and Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, Republic of Korea
| | - Min Seok Kim
- School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology (GIST), Gwangju 61005, Republic of Korea
| | - Moon Kee Choi
- Department of Materials Science and Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, Republic of Korea
- Graduate School of Semiconductor Materials and Devices Engineering, Center for Future Semiconductor Technology (FUST), UNIST, Ulsan 44919, Republic of Korea
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea
| | - Dae-Hyeong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea
- School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University (SNU), Seoul 08826, Republic of Korea
- Department of Materials Science and Engineering, SNU, Seoul 08826, Republic of Korea
- Interdisciplinary Program for Bioengineering, SNU, Seoul 08826, Republic of Korea
| | - Young Min Song
- School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology (GIST), Gwangju 61005, Republic of Korea
- Department of Materials Science and Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, Republic of Korea
- Artificial Intelligence (AI) Graduate School, GIST, Gwangju 61005, Republic of Korea
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12
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Hu C, Wang L, Liu S, Sheng X, Yin L. Recent Development of Implantable Chemical Sensors Utilizing Flexible and Biodegradable Materials for Biomedical Applications. ACS NANO 2024; 18:3969-3995. [PMID: 38271679 DOI: 10.1021/acsnano.3c11832] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 01/27/2024]
Abstract
Implantable chemical sensors built with flexible and biodegradable materials exhibit immense potential for seamless integration with biological systems by matching the mechanical properties of soft tissues and eliminating device retraction procedures. Compared with conventional hospital-based blood tests, implantable chemical sensors have the capability to achieve real-time monitoring with high accuracy of important biomarkers such as metabolites, neurotransmitters, and proteins, offering valuable insights for clinical applications. These innovative sensors could provide essential information for preventive diagnosis and effective intervention. To date, despite extensive research on flexible and bioresorbable materials for implantable electronics, the development of chemical sensors has faced several challenges related to materials and device design, resulting in only a limited number of successful accomplishments. This review highlights recent advancements in implantable chemical sensors based on flexible and biodegradable materials, encompassing their sensing strategies, materials strategies, and geometric configurations. The following discussions focus on demonstrated detection of various objects including ions, small molecules, and a few examples of macromolecules using flexible and/or bioresorbable implantable chemical sensors. Finally, we will present current challenges and explore potential future directions.
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Affiliation(s)
- Chen Hu
- School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Liu Wang
- Key Laboratory of Biomechanics and Mechanobiology of Ministry of Education, Beijing Advanced Innovation Center for Biomedical Engineering, School of Biological Science and Medical Engineering, Beihang University, Beijing 100083, P. R. China
| | - Shangbin Liu
- School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Xing Sheng
- Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Laboratory of Flexible Electronics Technology, IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing 100084, P. R. China
| | - Lan Yin
- School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
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13
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Wang Z, Lu H, Zhang Y, Liu C, Zhang H, Yu Y. Ultrathin Flexible Encapsulation Materials Based on Al 2O 3/Alucone Nanolaminates for Improved Electrical Stability of Silicon Nanomembrane-Based MOS Capacitors. MICROMACHINES 2023; 15:41. [PMID: 38258160 PMCID: PMC10818618 DOI: 10.3390/mi15010041] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/27/2023] [Revised: 12/18/2023] [Accepted: 12/22/2023] [Indexed: 01/24/2024]
Abstract
Ultrathin flexible encapsulation (UFE) using multilayered films has prospects for practical applications, such as implantable and wearable electronics. However, existing investigations of the effect of mechanical bending strains on electrical properties after the encapsulation procedure provide insufficient information for improving the electrical stability of ultrathin silicon nanomembrane (Si NM)-based metal oxide semiconductor capacitors (MOSCAPs). Here, we used atomic layer deposition and molecular layer deposition to generate 3.5 dyads of alternating 11 nm Al2O3 and 3.5 nm aluminum alkoxide (alucone) nanolaminates on flexible Si NM-based MOSCAPs. Moreover, we bent the MOSCAPs inwardly to radii of 85 and 110.5 mm and outwardly to radii of 77.5 and 38.5 mm. Subsequently, we tested the unbent and bent MOSCAPs to determine the effect of strain on various electrical parameters, namely the maximum capacitance, minimum capacitance, gate leakage current density, hysteresis voltage, effective oxide charge, oxide trapped charge, interface trap density, and frequency dispersion. The comparison of encapsulated and unencapsulated MOSCAPs on these critical parameters at bending strains indicated that Al2O3/alucone nanolaminates stabilized the electrical and interfacial characteristics of the Si NM-based MOSCAPs. These results highlight that ultrathin Al2O3/alucone nanolaminates are promising encapsulation materials for prolonging the operational lifetimes of flexible Si NM-based metal oxide semiconductor field-effect transistors.
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Affiliation(s)
- Zhuofan Wang
- Key Laboratory for Wide Band Gap Semiconductor Materials and Devices of Education Ministry, School of Microelectronics, Xidian University, Xi’an 710071, China; (Z.W.); (Y.Z.)
| | - Hongliang Lu
- Key Laboratory for Wide Band Gap Semiconductor Materials and Devices of Education Ministry, School of Microelectronics, Xidian University, Xi’an 710071, China; (Z.W.); (Y.Z.)
| | - Yuming Zhang
- Key Laboratory for Wide Band Gap Semiconductor Materials and Devices of Education Ministry, School of Microelectronics, Xidian University, Xi’an 710071, China; (Z.W.); (Y.Z.)
| | - Chen Liu
- Key Laboratory for Wide Band Gap Semiconductor Materials and Devices of Education Ministry, School of Microelectronics, Xidian University, Xi’an 710071, China; (Z.W.); (Y.Z.)
| | - Haonan Zhang
- Key Laboratory for Wide Band Gap Semiconductor Materials and Devices of Education Ministry, School of Microelectronics, Xidian University, Xi’an 710071, China; (Z.W.); (Y.Z.)
| | - Yanhao Yu
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China;
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14
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Lin R, Lei M, Ding S, Cheng Q, Ma Z, Wang L, Tang Z, Zhou B, Zhou Y. Applications of flexible electronics related to cardiocerebral vascular system. Mater Today Bio 2023; 23:100787. [PMID: 37766895 PMCID: PMC10519834 DOI: 10.1016/j.mtbio.2023.100787] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/06/2023] [Revised: 08/14/2023] [Accepted: 08/28/2023] [Indexed: 09/29/2023] Open
Abstract
Ensuring accessible and high-quality healthcare worldwide requires field-deployable and affordable clinical diagnostic tools with high performance. In recent years, flexible electronics with wearable and implantable capabilities have garnered significant attention from researchers, which functioned as vital clinical diagnostic-assisted tools by real-time signal transmission from interested targets in vivo. As the most crucial and complex system of human body, cardiocerebral vascular system together with heart-brain network attracts researchers inputting profuse and indefatigable efforts on proper flexible electronics design and materials selection, trying to overcome the impassable gulf between vivid organisms and rigid inorganic units. This article reviews recent breakthroughs in flexible electronics specifically applied to cardiocerebral vascular system and heart-brain network. Relevant sensor types and working principles, electronics materials selection and treatment methods are expounded. Applications of flexible electronics related to these interested organs and systems are specially highlighted. Through precedent great working studies, we conclude their merits and point out some limitations in this emerging field, thus will help to pave the way for revolutionary flexible electronics and diagnosis assisted tools development.
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Affiliation(s)
- Runxing Lin
- Joint Key Laboratory of the Ministry of Education, Institute of Applied Physics and Materials Engineering, University of Macau, Avenida da Universidade, Taipa, Macau, 999078, China
- Brain Cognition and Brain Disease Institute, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China
| | - Ming Lei
- Joint Key Laboratory of the Ministry of Education, Institute of Applied Physics and Materials Engineering, University of Macau, Avenida da Universidade, Taipa, Macau, 999078, China
| | - Sen Ding
- Joint Key Laboratory of the Ministry of Education, Institute of Applied Physics and Materials Engineering, University of Macau, Avenida da Universidade, Taipa, Macau, 999078, China
| | - Quansheng Cheng
- Joint Key Laboratory of the Ministry of Education, Institute of Applied Physics and Materials Engineering, University of Macau, Avenida da Universidade, Taipa, Macau, 999078, China
| | - Zhichao Ma
- Institute of Medical Robotics, School of Biomedical Engineering, Shanghai Jiao Tong University, No.800 Dongchuan Road, Shanghai, 200240, China
| | - Liping Wang
- Brain Cognition and Brain Disease Institute, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China
| | - Zikang Tang
- Joint Key Laboratory of the Ministry of Education, Institute of Applied Physics and Materials Engineering, University of Macau, Avenida da Universidade, Taipa, Macau, 999078, China
| | - Bingpu Zhou
- Joint Key Laboratory of the Ministry of Education, Institute of Applied Physics and Materials Engineering, University of Macau, Avenida da Universidade, Taipa, Macau, 999078, China
| | - Yinning Zhou
- Joint Key Laboratory of the Ministry of Education, Institute of Applied Physics and Materials Engineering, University of Macau, Avenida da Universidade, Taipa, Macau, 999078, China
- Department of Physics and Chemistry, Faculty of Science and Technology, University of Macau, Avenida da Universidade, Taipa, Macau, 999078, China
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15
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Hu H, Zhang C, Ding Y, Chen F, Huang Q, Zheng Z. A Review of Structure Engineering of Strain-Tolerant Architectures for Stretchable Electronics. SMALL METHODS 2023; 7:e2300671. [PMID: 37661591 DOI: 10.1002/smtd.202300671] [Citation(s) in RCA: 3] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/29/2023] [Revised: 08/01/2023] [Indexed: 09/05/2023]
Abstract
Stretchable electronics possess significant advantages over their conventional rigid counterparts and boost game-changing applications such as bioelectronics, flexible displays, wearable health monitors, etc. It is, nevertheless, a formidable task to impart stretchability to brittle electronic materials such as silicon. This review provides a concise but critical discussion of the prevailing structural engineering strategies for achieving strain-tolerant electronic devices. Not only the more commonly discussed lateral designs of structures such as island-bridge, wavy structures, fractals, and kirigami, but also the less discussed vertical architectures such as strain isolation and elastoplastic principle are reviewed. Future opportunities are envisaged at the end of the paper.
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Affiliation(s)
- Hong Hu
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Chi Zhang
- Department of Applied Biology and Chemical Technology, Faculty of Science, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Yichun Ding
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Fan Chen
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Qiyao Huang
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
- Research Institute for Intelligent Wearable Systems, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Zijian Zheng
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
- Department of Applied Biology and Chemical Technology, Faculty of Science, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
- Research Institute for Intelligent Wearable Systems, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
- Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
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16
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Han WB, Ko GJ, Yang SM, Kang H, Lee JH, Shin JW, Jang TM, Han S, Kim DJ, Lim JH, Rajaram K, Bandodkar AJ, Hwang SW. Micropatterned Elastomeric Composites for Encapsulation of Transient Electronics. ACS NANO 2023. [PMID: 37497757 DOI: 10.1021/acsnano.3c03063] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 07/28/2023]
Abstract
Although biodegradable, transient electronic devices must dissolve or decompose via environmental factors, an effective waterproofing or encapsulation system is essential for reliable, durable operation for a desired period of time. Existing protection approaches use multiple or alternate layers of electrically inactive organic/inorganic elements combined with polymers; however, their high mechanical stiffness is not suitable for soft, time-dynamic biological tissues/skins/organs. Here, we introduce a stretchable, bioresorbable encapsulant using nanoparticle-incorporated elastomeric composites with modifications of surface morphology. Nature-inspired micropatterns reduce the diffusion area for water molecules, and embedded nanoparticles impede water permeation, which synergistically enhances the water-barrier performance. Empirical and theoretical evaluations validate the encapsulation mechanisms under strains. Demonstration of a soft, degradable shield with an optical component under a biological solution highlights the potential applicability of the proposed encapsulation strategy.
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Affiliation(s)
- Won Bae Han
- KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
| | - Gwan-Jin Ko
- KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
| | - Seung Min Yang
- KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
| | - Heeseok Kang
- KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
| | - Joong Hoon Lee
- KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
| | - Jeong-Woong Shin
- KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
| | - Tae-Min Jang
- KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
| | - Sungkeun Han
- KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
| | - Dong-Je Kim
- KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
| | - Jun Hyeon Lim
- KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
| | - Kaveti Rajaram
- KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
- Department of Electrical and Computer Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States
| | - Amay Jairaj Bandodkar
- Department of Electrical and Computer Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States
- Center for Advanced Self-Powered Systems of Integrated Sensors and Technologies (ASSIST), North Carolina State University, Raleigh, North Carolina 27606, United States
| | - Suk-Won Hwang
- KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
- Center for Biomaterials, Biomedical Research Institute, Korea Institute of Science and Technology (KIST), 5 Hwarang-ro 14-gil, Seongbuk-gu, Seoul, 02792, Republic of Korea
- Department of Integrative Energy Engineering, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
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17
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Nguyen TH, Ngo BV, Nguyen TN, Vu CC. Flexible Pressure Sensors and Machine Learning Algorithms for Human Walking Phase Monitoring. MICROMACHINES 2023; 14:1411. [PMID: 37512722 PMCID: PMC10385105 DOI: 10.3390/mi14071411] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/21/2023] [Revised: 07/08/2023] [Accepted: 07/10/2023] [Indexed: 07/30/2023]
Abstract
Soft sensors are attracting much attention from researchers worldwide due to their versatility in practical projects. There are already many applications of soft sensors in aspects of life, consisting of human-robot interfaces, flexible electronics, medical monitoring, and healthcare. However, most of these studies have focused on a specific area, such as fabrication, data analysis, or experimentation. This approach can lead to challenges regarding the reliability, accuracy, or connectivity of the components. Therefore, there is a pressing need to consider the sensor's placement in an overall system and find ways to maximize the efficiency of such flexible sensors. This paper proposes a fabrication method for soft capacitive pressure sensors with spacer fabric, conductive inks, and encapsulation glue. The sensor exhibits a good sensitivity of 0.04 kPa-1, a fast recovery time of 7 milliseconds, and stability of 10,000 cycles. We also evaluate how to connect the sensor to other traditional sensors or hardware components. Some machine learning models are applied to these built-in soft sensors. As expected, the embedded wearables achieve a high accuracy of 96% when recognizing human walking phases.
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Affiliation(s)
- Thanh-Hai Nguyen
- Faculty of Electrical and Electronics Engineering, Ho Chi Minh City University of Technology and Education, 01 Vo Van Ngan Street, Linh Chieu Ward, Ho Chi Minh City 700000, Vietnam
| | - Ba-Viet Ngo
- Faculty of Electrical and Electronics Engineering, Ho Chi Minh City University of Technology and Education, 01 Vo Van Ngan Street, Linh Chieu Ward, Ho Chi Minh City 700000, Vietnam
| | - Thanh-Nghia Nguyen
- Faculty of Electrical and Electronics Engineering, Ho Chi Minh City University of Technology and Education, 01 Vo Van Ngan Street, Linh Chieu Ward, Ho Chi Minh City 700000, Vietnam
| | - Chi Cuong Vu
- Faculty of Electrical and Electronics Engineering, Ho Chi Minh City University of Technology and Education, 01 Vo Van Ngan Street, Linh Chieu Ward, Ho Chi Minh City 700000, Vietnam
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18
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Passlack U, Simon N, Bucher V, Harendt C, Stieglitz T, Burghartz JN. Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al 2O 3-TiO 2 Nanolaminates. ACS APPLIED MATERIALS & INTERFACES 2023; 15:16221-16231. [PMID: 36939586 PMCID: PMC10064999 DOI: 10.1021/acsami.2c22513] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/14/2022] [Accepted: 03/03/2023] [Indexed: 06/18/2023]
Abstract
Plasma-enhanced atomic layer deposition (PEALD) is utilized to improve the barrier properties of an organic chip-film patch (CFP) when it is used as an implant to prevent moisture and ions from migrating into the embedded electronic circuits. For this purpose, surface condition and material properties of eight modifications of Al2O3-TiO2 nanolaminates sequentially deposited on polyimide PI-2611 films are evaluated in detail. The effect of stress-induced warpage of the deposited Al2O3-TiO2 on the wafer level is calculated with the Stoney equation and reveals higher tensile stress values while increasing the thickness of Al2O3-TiO2 nanolaminates from 20 up to 80 nm. Contact angle measurement and atomic force microscopy are used to investigate the surface energy and wettability, as well as the surface morphology of polyimide-Al2O3-TiO2 interfaces. We show that plasma treatment of pristine polyimide leads to an enhanced adhesion force of the PEAL-deposited layer by a factor of 1.3. The water vapor transmission rate (WVTR) is determined by exposing the coated polyimide films to 85% humidity and 23 °C and yields down to 1.58 × 10-3 g(H2O)/(m2 d). The data obtained are compared with alternative coating processes using the polymers parylene-C and benzocyclobutene (BCB). The latter shows higher WVTR values of 1.2 × 10-1 and 1.7 × 10-1 g(H2O)/(m2 d) compared to the PEALD-PI-2611 systems, indicating lower barrier properties. Two Al2O3-TiO2 modifications with low WVTR values have been chosen for encapsulating the CFP substrates and exposing them in a long-time experiment to chemical and mechanical loads in a chamber filled with phosphate-buffered saline at 37 °C, pH 7.3, and a cyclically applied pressure of 160 mbar (∼120 mm Hg). The electrical leakage behavior of the CFP systems is measured and reveals reliable electrical long-term stability far beyond 11 months, highlighting the great potential of PEALD-encapsulated CFPs.
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Affiliation(s)
- Ulrike Passlack
- Institut
für Mikroelektronik Stuttgart (IMS CHIPS), Stuttgart D-70569, Germany
| | - Nicolai Simon
- Faculty
Mechanical and Medical Engineering (MME), Institute for Microsystems Technology (iMST), Rottweil D-78628, Germany
- Laboratory
for Biomedical Microtechnology, Department of Microsystems Engineering-IMTEK, University of Freiburg, Freiburg D-79110, Germany
| | - Volker Bucher
- Faculty
Mechanical and Medical Engineering (MME), Institute for Microsystems Technology (iMST), Rottweil D-78628, Germany
| | - Christine Harendt
- Institut
für Mikroelektronik Stuttgart (IMS CHIPS), Stuttgart D-70569, Germany
| | - Thomas Stieglitz
- Laboratory
for Biomedical Microtechnology, Department of Microsystems Engineering-IMTEK, University of Freiburg, Freiburg D-79110, Germany
- BrainLinks-Braintools//IMBIT, University of Freiburg, Freiburg D-79110, Germany
| | - Joachim N. Burghartz
- Institut
für Mikroelektronik Stuttgart (IMS CHIPS), Stuttgart D-70569, Germany
- Institute
for Nano- and Microelectronic Systems (INES), University of Stuttgart, Stuttgart D-70569, Germany
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19
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Luo Y, Abidian MR, Ahn JH, Akinwande D, Andrews AM, Antonietti M, Bao Z, Berggren M, Berkey CA, Bettinger CJ, Chen J, Chen P, Cheng W, Cheng X, Choi SJ, Chortos A, Dagdeviren C, Dauskardt RH, Di CA, Dickey MD, Duan X, Facchetti A, Fan Z, Fang Y, Feng J, Feng X, Gao H, Gao W, Gong X, Guo CF, Guo X, Hartel MC, He Z, Ho JS, Hu Y, Huang Q, Huang Y, Huo F, Hussain MM, Javey A, Jeong U, Jiang C, Jiang X, Kang J, Karnaushenko D, Khademhosseini A, Kim DH, Kim ID, Kireev D, Kong L, Lee C, Lee NE, Lee PS, Lee TW, Li F, Li J, Liang C, Lim CT, Lin Y, Lipomi DJ, Liu J, Liu K, Liu N, Liu R, Liu Y, Liu Y, Liu Z, Liu Z, Loh XJ, Lu N, Lv Z, Magdassi S, Malliaras GG, Matsuhisa N, Nathan A, Niu S, Pan J, Pang C, Pei Q, Peng H, Qi D, Ren H, Rogers JA, Rowe A, Schmidt OG, Sekitani T, Seo DG, Shen G, Sheng X, Shi Q, Someya T, Song Y, Stavrinidou E, Su M, Sun X, Takei K, Tao XM, Tee BCK, Thean AVY, Trung TQ, Wan C, Wang H, Wang J, Wang M, Wang S, Wang T, Wang ZL, Weiss PS, Wen H, Xu S, Xu T, Yan H, Yan X, Yang H, Yang L, Yang S, Yin L, Yu C, Yu G, Yu J, Yu SH, Yu X, Zamburg E, Zhang H, Zhang X, Zhang X, Zhang X, Zhang Y, Zhang Y, Zhao S, Zhao X, Zheng Y, Zheng YQ, Zheng Z, Zhou T, Zhu B, Zhu M, Zhu R, Zhu Y, Zhu Y, Zou G, Chen X. Technology Roadmap for Flexible Sensors. ACS NANO 2023; 17:5211-5295. [PMID: 36892156 PMCID: PMC11223676 DOI: 10.1021/acsnano.2c12606] [Citation(s) in RCA: 209] [Impact Index Per Article: 209.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity.
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Affiliation(s)
- Yifei Luo
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Mohammad Reza Abidian
- Department of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States
| | - Jong-Hyun Ahn
- School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
| | - Deji Akinwande
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Anne M Andrews
- Department of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Markus Antonietti
- Colloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany
| | - Zhenan Bao
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Magnus Berggren
- Laboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden
- Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC), SE-100 44 Stockholm, Sweden
| | - Christopher A Berkey
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Christopher John Bettinger
- Department of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States
| | - Jun Chen
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Peng Chen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Wenlong Cheng
- Nanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800
- Monash Institute of Medical Engineering, Monash University, Clayton, Australia3800
| | - Xu Cheng
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Seon-Jin Choi
- Division of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea
| | - Alex Chortos
- School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Canan Dagdeviren
- Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
| | - Reinhold H Dauskardt
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Chong-An Di
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States
| | - Xiangfeng Duan
- Department of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Antonio Facchetti
- Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States
| | - Zhiyong Fan
- Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
| | - Yin Fang
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Jianyou Feng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Xue Feng
- Laboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
| | - Huajian Gao
- School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Wei Gao
- Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States
| | - Xiwen Gong
- Department of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States
| | - Chuan Fei Guo
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China
| | - Xiaojun Guo
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
| | - Martin C Hartel
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Zihan He
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - John S Ho
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore
| | - Youfan Hu
- School of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China
| | - Qiyao Huang
- School of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Yu Huang
- Department of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Fengwei Huo
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China
| | - Muhammad M Hussain
- mmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Ali Javey
- Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States
- Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States
| | - Unyong Jeong
- Department of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea
| | - Chen Jiang
- Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
| | - Xingyu Jiang
- Department of Biomedical Engineering, Southern University of Science and Technology, No 1088, Xueyuan Road, Xili, Nanshan District, Shenzhen, Guangdong 518055, PR China
| | - Jiheong Kang
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Daniil Karnaushenko
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
| | | | - Dae-Hyeong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Il-Doo Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea
| | - Dmitry Kireev
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Lingxuan Kong
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Chengkuo Lee
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
- NUS Graduate School-Integrative Sciences and Engineering Programme (ISEP), National University of Singapore, Singapore 119077, Singapore
| | - Nae-Eung Lee
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Pooi See Lee
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Singapore-HUJ Alliance for Research and Enterprise (SHARE), Campus for Research Excellence and Technological Enterprise (CREATE), Singapore 138602, Singapore
| | - Tae-Woo Lee
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
- School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
- Institute of Engineering Research, Research Institute of Advanced Materials, Seoul National University, Soft Foundry, Seoul 08826, Republic of Korea
- Interdisciplinary Program in Bioengineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Fengyu Li
- College of Chemistry and Materials Science, Jinan University, Guangzhou, Guangdong 510632, China
| | - Jinxing Li
- Department of Biomedical Engineering, Department of Electrical and Computer Engineering, Neuroscience Program, BioMolecular Science Program, and Institute for Quantitative Health Science and Engineering, Michigan State University, East Lansing, Michigan 48823, United States
| | - Cuiyuan Liang
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Chwee Teck Lim
- Department of Biomedical Engineering, National University of Singapore, Singapore 117583, Singapore
- Mechanobiology Institute, National University of Singapore, Singapore 117411, Singapore
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 119276, Singapore
| | - Yuanjing Lin
- School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
| | - Darren J Lipomi
- Department of Nano and Chemical Engineering, University of California, San Diego, La Jolla, California 92093-0448, United States
| | - Jia Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Kai Liu
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Nan Liu
- Beijing Key Laboratory of Energy Conversion and Storage Materials, College of Chemistry, Beijing Normal University, Beijing 100875, PR China
| | - Ren Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Yuxin Liu
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Biomedical Engineering, N.1 Institute for Health, Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore 119077, Singapore
| | - Yuxuan Liu
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Zhiyuan Liu
- Neural Engineering Centre, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 518055
| | - Zhuangjian Liu
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xian Jun Loh
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Nanshu Lu
- Department of Aerospace Engineering and Engineering Mechanics, Department of Electrical and Computer Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Zhisheng Lv
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Shlomo Magdassi
- Institute of Chemistry and the Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
| | - George G Malliaras
- Electrical Engineering Division, Department of Engineering, University of Cambridge CB3 0FA, Cambridge United Kingdom
| | - Naoji Matsuhisa
- Institute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan
| | - Arokia Nathan
- Darwin College, University of Cambridge, Cambridge CB3 9EU, United Kingdom
| | - Simiao Niu
- Department of Biomedical Engineering, Rutgers University, Piscataway, New Jersey 08854, United States
| | - Jieming Pan
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
| | - Changhyun Pang
- School of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea
| | - Qibing Pei
- Department of Materials Science and Engineering, Department of Mechanical and Aerospace Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Huisheng Peng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Dianpeng Qi
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Huaying Ren
- Department of Chemistry and Biochemistry, University of California, Los Angeles, Los Angeles, California, 90095, United States
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
- Department of Materials Science and Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Departments of Electrical and Computer Engineering and Chemistry, and Department of Neurological Surgery, Northwestern University, Evanston, Illinois 60208, United States
| | - Aaron Rowe
- Becton, Dickinson and Company, 1268 N. Lakeview Avenue, Anaheim, California 92807, United States
- Ready, Set, Food! 15821 Ventura Blvd #450, Encino, California 91436, United States
| | - Oliver G Schmidt
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz 09107, Germany
- Nanophysics, Faculty of Physics, TU Dresden, Dresden 01062, Germany
| | - Tsuyoshi Sekitani
- The Institute of Scientific and Industrial Research (SANKEN), Osaka University, Osaka, Japan 5670047
| | - Dae-Gyo Seo
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Guozhen Shen
- School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China
| | - Xing Sheng
- Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Center for Flexible Electronics Technology, and IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, China
| | - Qiongfeng Shi
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
| | - Takao Someya
- Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan
| | - Yanlin Song
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Eleni Stavrinidou
- Laboratory of Organic Electronics, Department of Science and Technology, Linköping University, SE-601 74 Norrkoping, Sweden
| | - Meng Su
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Xuemei Sun
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Kuniharu Takei
- Department of Physics and Electronics, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan
| | - Xiao-Ming Tao
- Research Institute for Intelligent Wearable Systems, School of Fashion and Textiles, Hong Kong Polytechnic University, Hong Kong, China
| | - Benjamin C K Tee
- Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore
- iHealthtech, National University of Singapore, Singapore 119276, Singapore
| | - Aaron Voon-Yew Thean
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Tran Quang Trung
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Changjin Wan
- School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
| | - Huiliang Wang
- Department of Biomedical Engineering, University of Texas at Austin, Austin, Texas 78712, United States
| | - Joseph Wang
- Department of Nanoengineering, University of California, San Diego, California 92093, United States
| | - Ming Wang
- Frontier Institute of Chip and System, State Key Laboratory of Integrated Chip and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China
- the Shanghai Qi Zhi Institute, 41th Floor, AI Tower, No.701 Yunjin Road, Xuhui District, Shanghai 200232, China
| | - Sihong Wang
- Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, 60637, United States
| | - Ting Wang
- State Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Zhong Lin Wang
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China
- Georgia Institute of Technology, Atlanta, Georgia 30332-0245, United States
| | - Paul S Weiss
- California NanoSystems Institute, Department of Chemistry and Biochemistry, Department of Bioengineering, and Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Hanqi Wen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
- Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, China 314000
| | - Sheng Xu
- Department of Nanoengineering, Department of Electrical and Computer Engineering, Materials Science and Engineering Program, and Department of Bioengineering, University of California San Diego, La Jolla, California, 92093, United States
| | - Tailin Xu
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong, 518060, PR China
| | - Hongping Yan
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Xuzhou Yan
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Hui Yang
- Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Tianjin, China, 300072
| | - Le Yang
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Materials Science and Engineering, National University of Singapore (NUS), 9 Engineering Drive 1, #03-09 EA, Singapore 117575, Singapore
| | - Shuaijian Yang
- School of Biomedical Sciences, Faculty of Biological Sciences, University of Leeds, Leeds, LS2 9JT, United Kingdom
| | - Lan Yin
- School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, and Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
| | - Cunjiang Yu
- Department of Engineering Science and Mechanics, Department of Biomedical Engineering, Department of Material Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, 16802, United States
| | - Guihua Yu
- Materials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, 78712, United States
| | - Jing Yu
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Shu-Hong Yu
- Department of Chemistry, Institute of Biomimetic Materials and Chemistry, Hefei National Research Center for Physical Science at the Microscale, University of Science and Technology of China, Hefei 230026, China
| | - Xinge Yu
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Evgeny Zamburg
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Haixia Zhang
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Xiangyu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Xiaosheng Zhang
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
| | - Xueji Zhang
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong 518060, PR China
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Yu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Siyuan Zhao
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Xuanhe Zhao
- Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, United States
| | - Yuanjin Zheng
- Center for Integrated Circuits and Systems, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
| | - Yu-Qing Zheng
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Zijian Zheng
- Department of Applied Biology and Chemical Technology, Faculty of Science, Research Institute for Intelligent Wearable Systems, Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Tao Zhou
- Center for Neural Engineering, Department of Engineering Science and Mechanics, The Huck Institutes of the Life Sciences, Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Bowen Zhu
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou 310024, China
| | - Ming Zhu
- Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore
| | - Rong Zhu
- Department of Precision Instrument, Tsinghua University, Beijing 100084, China
| | - Yangzhi Zhu
- Terasaki Institute for Biomedical Innovation, Los Angeles, California, 90064, United States
| | - Yong Zhu
- Department of Mechanical and Aerospace Engineering, Department of Materials Science and Engineering, and Department of Biomedical Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Guijin Zou
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xiaodong Chen
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
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Kashaninejad N, Nguyen NT. Microfluidic solutions for biofluids handling in on-skin wearable systems. LAB ON A CHIP 2023; 23:913-937. [PMID: 36628970 DOI: 10.1039/d2lc00993e] [Citation(s) in RCA: 6] [Impact Index Per Article: 6.0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/17/2023]
Abstract
On-skin wearable systems for biofluid sampling and biomarker sensing can revolutionize the current practices in healthcare monitoring and personalized medicine. However, there is still a long path toward complete market adoption and acceptance of this fascinating technology. Accordingly, microfluidic science and technology can provide excellent solutions for bridging the gap between basic research and clinical research. The research gap has led to the emerging field of epidermal microfluidics. Moreover, recent advances in the fabrication of highly flexible and stretchable microfluidic systems have revived the concept of micro elastofluidics, which can provide viable solutions for on-skin wearable biofluid handling. In this context, this review highlights the current state-of-the-art platforms in this field and discusses the potential technologies that can be used for on-skin wearable devices. Toward this aim, we first compare various microfluidic platforms that could be used for on-skin wearable devices. These platforms include semiconductor-based, polymer-based, liquid metal-based, paper-based, and textile-based microfluidics. Next, we discuss how these platforms can enhance the stretchability of on-skin wearable biosensors at the device level. Next, potential microfluidic solutions for collecting, transporting, and controlling the biofluids are discussed. The application of finger-powered micropumps as a viable solution for precise and on-demand biofluid pumping is highlighted. Finally, we present the future directions of this field by emphasizing the applications of droplet-based microfluidics, stretchable continuous-flow micro elastofluidics, stretchable superhydrophobic surfaces, liquid beads as a form of digital micro elastofluidics, and topological liquid diodes that received less attention but have enormous potential to be integrated into on-skin wearable devices.
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Affiliation(s)
- Navid Kashaninejad
- Queensland Micro- and Nanotechnology Centre, Griffith University, 170 Kessels Road, Nathan, QLD 4111, Australia.
| | - Nam-Trung Nguyen
- Queensland Micro- and Nanotechnology Centre, Griffith University, 170 Kessels Road, Nathan, QLD 4111, Australia.
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21
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Popple D, Shekhirev M, Dai C, Kim P, Wang KX, Ashby P, Helms BA, Gogotsi Y, Russell TP, Zettl A. All-Liquid Reconfigurable Electronics Using Jammed MXene Interfaces. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2208148. [PMID: 36302090 DOI: 10.1002/adma.202208148] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 09/05/2022] [Revised: 10/20/2022] [Indexed: 06/16/2023]
Abstract
Rigid, solid-state components represent the current paradigm for electronic systems, but they lack post-production reconfigurability and pose ever-increasing challenges to efficient end-of-life recycling. Liquid electronics may overcome these limitations by offering flexible in-the-field redesign and separation at end-of-life via simple liquid phase chemistries. Up to now, preliminary work on liquid electronics has focused on liquid metal components, but these devices still require an encapsulating polymer and typically use alloys of rare elements like indium. Here, using the self-assembly of jammed 2D titanium carbide (Ti3 C2 Tx ) MXene nanoparticles at liquid-liquid interfaces, "all-liquid" electrically conductive sheets, wires, and simple functional devices are described including electromechanical switches and photodetectors. These assemblies combine the high conductivity of MXene nanosheets with the controllable form and reconfigurability of structured liquids. Such configurations can have applications not only in electronics, but also in catalysis and microfluidics, especially in systems where the product and substrate have affinity for solvents of differing polarity.
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Affiliation(s)
- Derek Popple
- Department of Chemistry, University of California Berkeley, Berkeley, CA, 94720, USA
- Department of Physics, University of California Berkeley, Berkeley, CA, 94720, USA
- Materials Sciences Division, Lawrence Berkeley National Lab, 1 Cyclotron Road, Berkeley, CA, 94720, USA
- Kavli Energy NanoSciences Institute at the University of California at Berkeley and the Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA
| | - Mikhail Shekhirev
- Department of Materials Science & Engineering and A. J. Drexel Nanomaterials Institute, Drexel University, Philadelphia, PA, 19104, USA
| | - Chunhui Dai
- Department of Physics, University of California Berkeley, Berkeley, CA, 94720, USA
- Materials Sciences Division, Lawrence Berkeley National Lab, 1 Cyclotron Road, Berkeley, CA, 94720, USA
| | - Paul Kim
- Materials Sciences Division, Lawrence Berkeley National Lab, 1 Cyclotron Road, Berkeley, CA, 94720, USA
| | | | - Paul Ashby
- Materials Sciences Division, Lawrence Berkeley National Lab, 1 Cyclotron Road, Berkeley, CA, 94720, USA
- Molecular Foundry Division, Lawrence Berkeley National Lab, 1 Cyclotron Road, Berkeley, CA, 94720, USA
| | - Brett A Helms
- Materials Sciences Division, Lawrence Berkeley National Lab, 1 Cyclotron Road, Berkeley, CA, 94720, USA
- Molecular Foundry Division, Lawrence Berkeley National Lab, 1 Cyclotron Road, Berkeley, CA, 94720, USA
| | - Yury Gogotsi
- Department of Materials Science & Engineering and A. J. Drexel Nanomaterials Institute, Drexel University, Philadelphia, PA, 19104, USA
| | - Thomas P Russell
- Materials Sciences Division, Lawrence Berkeley National Lab, 1 Cyclotron Road, Berkeley, CA, 94720, USA
- University of Massachusetts, Amherst, Amherst, MA, 01003, USA
| | - Alex Zettl
- Department of Physics, University of California Berkeley, Berkeley, CA, 94720, USA
- Materials Sciences Division, Lawrence Berkeley National Lab, 1 Cyclotron Road, Berkeley, CA, 94720, USA
- Kavli Energy NanoSciences Institute at the University of California at Berkeley and the Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA
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22
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Yang J, Zhang Z, Zhou P, Zhang Y, Liu Y, Xu Y, Gu Y, Qin S, Haick H, Wang Y. Toward a new generation of permeable skin electronics. NANOSCALE 2023; 15:3051-3078. [PMID: 36723108 DOI: 10.1039/d2nr06236d] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Skin-mountable electronics are considered to be the future of the next generation of portable electronics, due to their softness and seamless integration with human skin. However, impermeable materials limit device comfort and reliability for long-term, continuous usage. The recent emergence of permeable skin-mountable electronics has attracted tremendous attention in the soft electronics field. Herein, we provide a comprehensive and systematic review of permeable skin-mountable electronics. Typical porous materials and structures are first highlighted, followed by discussion of important device properties. Then, we review the latest representative applications of breathable skin-mountable electronics, such as bioelectrical sensors, temperature sensors, humidity and hydration sensors, strain and pressure sensors, and energy harvesting and storage devices. Finally, a conclusion and future directions for permeable skin electronics are provided.
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Affiliation(s)
- Jiawei Yang
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
- Department of Chemical Engineering, Technion-Israel Institute of Technology (IIT), Haifa 3200003, Israel
| | - Zongman Zhang
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
| | - Pengcheng Zhou
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
| | - Yujie Zhang
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
- Department of Chemical Engineering, Technion-Israel Institute of Technology (IIT), Haifa 3200003, Israel
| | - Yi Liu
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
- Department of Chemical Engineering, Technion-Israel Institute of Technology (IIT), Haifa 3200003, Israel
| | - Yumiao Xu
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
| | - Yuheng Gu
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
| | - Shenglin Qin
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
| | - Hossam Haick
- Department of Chemical Engineering and Russell Berrie Nanotechnology Institute, Technion-Israel Institute of Technology, Haifa 3200003, Israel.
| | - Yan Wang
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
- Department of Chemical Engineering, Technion-Israel Institute of Technology (IIT), Haifa 3200003, Israel
- Guangdong Provincial Key Laboratory of Materials and Technologies for Energy Conversion, Guangdong Technion-Israel Institute of Technology, Shantou, Guangdong 515063, China
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23
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Zeng MZ, Wei D, Ding J, Tian Y, Wu XY, Chen ZH, Wu CH, Sun J, Yin HB, Fan HS. Dopamine induced multiple bonding in hyaluronic acid network to construct particle-free conductive hydrogel for reliable electro-biosensing. Carbohydr Polym 2023; 302:120403. [PMID: 36604075 DOI: 10.1016/j.carbpol.2022.120403] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/13/2022] [Revised: 11/11/2022] [Accepted: 11/22/2022] [Indexed: 11/27/2022]
Abstract
Conductive hydrogel (CH) as flexible electrophysiology interface has become the new trend of bioelectronics, but still challenging in synergizing the biocompatibility, mechanics and comprehensive electrical performance. Hyaluronic acid (HA), featured with abundant active sites for personalized-modification and well-known biocompatibility, is one of the alterative candidates. The obstacle lies in the unstable conductivity from the ionic conduction, and the electronic conduction by embedding conductive nanoparticles (NPs) is likely to result in inhomogeneous CH with poor stretchability and discontinuous conductive network. Herein, inspired by catechol chemistry, dopamine (DA)-modified HA was homogeneously composited with DA-modified poly (3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS, named PP), to produce particle-free conductive hydrogel (HA-DA-PP). The DA-introduced multiple bondings in HA network and PP molecules brought aqueous conductive PP into HA hydrogel to form a homogeneous crosslinking network, imparted the flexible stretchability. By accurately regulation, HA-DA-PP achieved high stretchability with large tensile deformation (over 470 %) in the category of natural polymer-based hydrogels. Moreover, the interaction between DA and PP (conformational transition and charge transfer) could effectively enhance the hydrogel's conductivity. Consequently, HA-DA-PP hydrogel showed high sensibility to human movement, epidermal and in vivo electrophysiological signals monitoring. Overall, DA-mediated multiple bonding is a powerful strategy for constructing CH with high performance for bioelectronics.
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Affiliation(s)
- Ming-Ze Zeng
- National Engineering Research Center for Biomaterials, College of Biomedical Engineering, Sichuan University, Chengdu 610064, Sichuan, China
| | - Dan Wei
- National Engineering Research Center for Biomaterials, College of Biomedical Engineering, Sichuan University, Chengdu 610064, Sichuan, China
| | - Jie Ding
- National Engineering Research Center for Biomaterials, College of Biomedical Engineering, Sichuan University, Chengdu 610064, Sichuan, China
| | - Yuan Tian
- National Engineering Research Center for Biomaterials, College of Biomedical Engineering, Sichuan University, Chengdu 610064, Sichuan, China
| | - Xiao-Yang Wu
- National Engineering Research Center for Biomaterials, College of Biomedical Engineering, Sichuan University, Chengdu 610064, Sichuan, China
| | - Zhi-Hong Chen
- National Engineering Research Center for Biomaterials, College of Biomedical Engineering, Sichuan University, Chengdu 610064, Sichuan, China
| | - Cheng-Heng Wu
- National Engineering Research Center for Biomaterials, College of Biomedical Engineering, Sichuan University, Chengdu 610064, Sichuan, China; Institute of Regulatory Science for Medical Devices, Sichuan University, Chengdu 610065, Sichuan, China
| | - Jing Sun
- National Engineering Research Center for Biomaterials, College of Biomedical Engineering, Sichuan University, Chengdu 610064, Sichuan, China
| | - Hua-Bing Yin
- James Watt School of Engineering, University of Glasgow, G12 8LT, UK
| | - Hong-Song Fan
- National Engineering Research Center for Biomaterials, College of Biomedical Engineering, Sichuan University, Chengdu 610064, Sichuan, China.
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Wang X, Huang J, Liu Y, Tan J, Chen S, Avila R, Xie Z. Design of protective and high sensitivity encapsulation layers in wearable devices. SCIENCE CHINA. TECHNOLOGICAL SCIENCES 2022; 66:223-232. [PMID: 36593863 PMCID: PMC9798368 DOI: 10.1007/s11431-022-2034-y] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/08/2022] [Accepted: 03/17/2022] [Indexed: 06/17/2023]
Abstract
UNLABELLED Elastomeric encapsulation layers are widely used in soft, wearable devices to physically isolate rigid electronic components from external environmental stimuli (e.g., stress) and facilitate device sterilization for reusability. In devices experiencing large deformations, the stress-isolation effect of the top encapsulation layer can eliminate the damage to the electronic components caused by external forces. However, for health monitoring and sensing applications, the strain-isolation effect of the bottom encapsulation layer can partially block the physiological signals of interest and degrade the measurement accuracy. Here, an analytic model is developed for the strain- and stress-isolation effects present in wearable devices with elastomeric encapsulation layers. The soft, elastomeric encapsulation layers and main electronic components layer are modeled as transversely isotropic-elastic mediums and the strain- and stress-isolation effects are described using isolation indexes. The analysis and results show that the isolation effects strongly depend on the thickness, density, and elastic modulus of both the elastomeric encapsulation layers and the main electronic component layer. These findings, combined with the flexible mechanics design strategies of wearable devices, provide new design guidelines for future wearable devices to protect them from external forces while capturing the relevant physiological signals underneath the skin. ELECTRONIC SUPPLEMENTARY MATERIAL Supplementary material is available in the online version of this article at 10.1007/s11431-022-2034-y.
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Affiliation(s)
- XiuFeng Wang
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - JieLong Huang
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - YangChengYi Liu
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - JinYuan Tan
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - ShangDa Chen
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - Raudel Avila
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208 USA
| | - ZhaoQian Xie
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, 116024 China
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25
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Niu Y, Tian G, Liang C, Wang T, Ma X, Gong G, Qi D. Thermal-Sinterable EGaIn Nanoparticle Inks for Highly Deformable Bioelectrode Arrays. Adv Healthc Mater 2022; 12:e2202531. [PMID: 36562213 DOI: 10.1002/adhm.202202531] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/03/2022] [Revised: 12/12/2022] [Indexed: 12/24/2022]
Abstract
Liquid metal (especially eutectic gallium indium, EGaIn) nanoparticle inks overcome the poor wettability of high surface tension EGaIn to elastomer substrates and show great potential in soft electronics. Normally, a sintering strategy is required to break the oxide shells of the EGaIn nanoparticles (EGaIn NPs) to achieve conductive paths. Herein, for the first time, thermal-sinterable EGaIn NP inks are prepared by introducing thermal expansion microspheres (TEMs) into EGaIn NP solution. Through the mechanical pressure induced by the expansion of the heated TEMs, the printed EGaIn NPs can be sintered into electrically conductive paths to achieve highly stretchable bioelectrode arrays, which exhibit giant electromechanical performance (up to 680% strain), good cyclic stability (over 2 × 104 cycles), and stable conductivity after high-speed rotation (6000 rpm). Simultaneously, the recording sites are hermetically sealed by ionic elastomer layers, ensuring the complete leakage-free property of EGaIn and reducing the electrochemical impedance of the electrodes (891.16 Ω at 1 kHz). The bioelectrode is successfully applied to monitor dynamic electromyographic signals. The sintering strategy overcomes the disadvantages of the traditional sintering strategies, such as leakage of EGaIn, reformation of large EGaIn droplets, and low throughput, which promotes the application of EGaIn in soft electronics.
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Affiliation(s)
- Yan Niu
- College of Material Science and Chemical Engineering, Harbin University of Science and Technology, Harbin, 150040, P. R. China
| | - Gongwei Tian
- National and Local Joint Engineering Laboratory for Synthesis, Transformation, and Separation of Extreme Environmental Nutrients; MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, 150001, P. R. China
| | - Cuiyuan Liang
- National and Local Joint Engineering Laboratory for Synthesis, Transformation, and Separation of Extreme Environmental Nutrients; MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, 150001, P. R. China
| | - Tianchi Wang
- College of Material Science and Chemical Engineering, Harbin University of Science and Technology, Harbin, 150040, P. R. China
| | - Xu Ma
- College of Material Science and Chemical Engineering, Harbin University of Science and Technology, Harbin, 150040, P. R. China
| | - Guifen Gong
- College of Material Science and Chemical Engineering, Harbin University of Science and Technology, Harbin, 150040, P. R. China
| | - Dianpeng Qi
- National and Local Joint Engineering Laboratory for Synthesis, Transformation, and Separation of Extreme Environmental Nutrients; MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, 150001, P. R. China
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26
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Yu S, Zhang J, Li H, Li L, Ni Y. Controllable Buckle Delaminations in Polymer-Supported Periodic Gradient Films by Mechanical Compression. LANGMUIR : THE ACS JOURNAL OF SURFACES AND COLLOIDS 2022; 38:13469-13476. [PMID: 36302725 DOI: 10.1021/acs.langmuir.2c01939] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
Surface instabilities including wrinkles and buckle-delaminations are widespread in nature and can be found in a wide range of practical applications. Compared with the homogeneous wrinkle mode, the buckle-delaminations are spontaneously stress-localized, and their initiation positions and geometrical parameters are hardly precisely controlled by a simple method. Here, we report on the controllable buckle-delaminations in periodic thickness-gradient metal films on polydimethylsiloxane (PDMS) substrates by uniaxial mechanical compression. It is found that a periodic thickness-gradient film is spontaneously formed by masking a copper grid during deposition. The released mechanical strain tends to concentrate in thinner film regions, resulting in the restricted growth of buckle-delaminations. The geometrical features, evolutional behaviors, and underlying physical mechanisms of such buckle-delaminations are analyzed and discussed in detail based on the buckling model and finite element simulations. This work would provide a better understanding of the restricted buckle-delaminations in heterogeneous film-substrate systems and controllable fabrication of ordered structural arrays by copper grid masking and mechanical loading.
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Affiliation(s)
- Senjiang Yu
- Key Laboratory of Novel Materials for Sensor of Zhejiang Province, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou310018, P. R. China
| | - Jiahui Zhang
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China, Hefei230026, P. R. China
| | - Huihua Li
- Key Laboratory of Novel Materials for Sensor of Zhejiang Province, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou310018, P. R. China
| | - Lingwei Li
- Key Laboratory of Novel Materials for Sensor of Zhejiang Province, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou310018, P. R. China
| | - Yong Ni
- CAS Key Laboratory of Mechanical Behavior and Design of Materials, Department of Modern Mechanics, University of Science and Technology of China, Hefei230026, P. R. China
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27
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Wang Z, Lai YC, Chiang YT, Scheiger JM, Li S, Dong Z, Cai Q, Liu S, Hsu SH, Chou CC, Levkin PA. Tough, Self-Healing, and Conductive Elastomer ─Ionic PEGgel. ACS APPLIED MATERIALS & INTERFACES 2022; 14:50152-50162. [PMID: 36306446 DOI: 10.1021/acsami.2c14394] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
Ionically conductive elastomers are necessary for realizing human-machine interfaces, bioelectronic applications, or durable wearable sensors. Current design strategies, however, often suffer from solvent leakage and evaporation, or from poor mechanical properties. Here, we report a strategy to fabricate ionic elastomers (IHPs) demonstrating high conductivity (0.04 S m-1), excellent electrochemical stability (>60,000 cycles), ultra-stretchability (up to 1400%), high toughness (7.16 MJ m-3), and fast self-healing properties, enabling the restoration of ionic conductivity within seconds, as well as no solvent leakage. The ionic elastomer is composed of in situ formed physically cross-linked poly(2-hydroxyethyl methacrylate) networks and poly(ethylene glycol) (PEG). The long molecular chains of PEG serve as a solvent for dissolving electrolytes, improve its long-term stability, reduce solvent leakage, and ensure the outstanding mechanical properties of the IHP. Surprisingly, the incorporation of ions into PEG simultaneously enhances the strength and toughness of the elastomer. The strengthening and toughening mechanisms were further revealed by molecular simulation. We demonstrate an application of the IHPs as (a) flexible sensors for strain or temperature sensing, (b) skin electrodes for recording electrocardiograms, and (c) a tough and sensing material for pneumatic artificial muscles. The proposed strategy is simple and easily scalable and can further inspire the design of novel ionic elastomers for ionotronics applications.
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Affiliation(s)
- Zhenwu Wang
- Institute of Biological and Chemical Systems-Functional Molecular Systems (IBCS-FMS), Karlsruhe Institute of Technology(KIT), Hermann-von-Helmholtz-Platz 1, Karlsruhe 76344, Eggenstein-Leopoldshafen, Germany
| | - Yu-Cheng Lai
- Institute of Applied Mechanics, College of Engineering, National Taiwan University, Roosevelt Road No. 1, Sec. 4, Taipei 10617, Taiwan, Republic of China
| | - Ya-Tang Chiang
- Institute of Polymer Science and Engineering, National Taiwan University, Roosevelt Road No. 1, Sec. 4, Taipei 10617, Taiwan, Republic of China
| | - Johannes Martin Scheiger
- Institute of Biological and Chemical Systems-Functional Molecular Systems (IBCS-FMS), Karlsruhe Institute of Technology(KIT), Hermann-von-Helmholtz-Platz 1, Karlsruhe 76344, Eggenstein-Leopoldshafen, Germany
| | - Shuai Li
- Institute of Biological and Chemical Systems-Functional Molecular Systems (IBCS-FMS), Karlsruhe Institute of Technology(KIT), Hermann-von-Helmholtz-Platz 1, Karlsruhe 76344, Eggenstein-Leopoldshafen, Germany
| | - Zheqin Dong
- Institute of Biological and Chemical Systems-Functional Molecular Systems (IBCS-FMS), Karlsruhe Institute of Technology(KIT), Hermann-von-Helmholtz-Platz 1, Karlsruhe 76344, Eggenstein-Leopoldshafen, Germany
| | - Qianyu Cai
- Institute of Biological and Chemical Systems-Functional Molecular Systems (IBCS-FMS), Karlsruhe Institute of Technology(KIT), Hermann-von-Helmholtz-Platz 1, Karlsruhe 76344, Eggenstein-Leopoldshafen, Germany
| | - Sida Liu
- Institute of Biological and Chemical Systems-Functional Molecular Systems (IBCS-FMS), Karlsruhe Institute of Technology(KIT), Hermann-von-Helmholtz-Platz 1, Karlsruhe 76344, Eggenstein-Leopoldshafen, Germany
| | - Shan-Hui Hsu
- Institute of Polymer Science and Engineering, National Taiwan University, Roosevelt Road No. 1, Sec. 4, Taipei 10617, Taiwan, Republic of China
| | - Chia-Ching Chou
- Institute of Applied Mechanics, College of Engineering, National Taiwan University, Roosevelt Road No. 1, Sec. 4, Taipei 10617, Taiwan, Republic of China
| | - Pavel A Levkin
- Institute of Biological and Chemical Systems-Functional Molecular Systems (IBCS-FMS), Karlsruhe Institute of Technology(KIT), Hermann-von-Helmholtz-Platz 1, Karlsruhe 76344, Eggenstein-Leopoldshafen, Germany
- Institute of Organic Chemistry (IOC), Karlsruhe Institute of Technology (KIT), Fritz-Haber-Weg 6, Karlsruhe 76131, Germany
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28
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Sang M, Kim K, Shin J, Yu KJ. Ultra-Thin Flexible Encapsulating Materials for Soft Bio-Integrated Electronics. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2022; 9:e2202980. [PMID: 36031395 PMCID: PMC9596833 DOI: 10.1002/advs.202202980] [Citation(s) in RCA: 20] [Impact Index Per Article: 10.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/22/2022] [Revised: 07/22/2022] [Indexed: 05/11/2023]
Abstract
Recently, bioelectronic devices extensively researched and developed through the convergence of flexible biocompatible materials and electronics design that enables more precise diagnostics and therapeutics in human health care and opens up the potential to expand into various fields, such as clinical medicine and biomedical research. To establish an accurate and stable bidirectional bio-interface, protection against the external environment and high mechanical deformation is essential for wearable bioelectronic devices. In the case of implantable bioelectronics, special encapsulation materials and optimized mechanical designs and configurations that provide electronic stability and functionality are required for accommodating various organ properties, lifespans, and functions in the biofluid environment. Here, this study introduces recent developments of ultra-thin encapsulations with novel materials that can preserve or even improve the electrical performance of wearable and implantable bio-integrated electronics by supporting safety and stability for protection from destruction and contamination as well as optimizing the use of bioelectronic systems in physiological environments. In addition, a summary of the materials, methods, and characteristics of the most widely used encapsulation technologies is introduced, thereby providing a strategic selection of appropriate choices of recently developed flexible bioelectronics.
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Affiliation(s)
- Mingyu Sang
- School of Electrical and Electronic EngineeringYonsei University50 Yonsei‐ro, SeodaemunguSeoul03722Republic of Korea
| | - Kyubeen Kim
- School of Electrical and Electronic EngineeringYonsei University50 Yonsei‐ro, SeodaemunguSeoul03722Republic of Korea
| | - Jongwoon Shin
- School of Electrical and Electronic EngineeringYonsei University50 Yonsei‐ro, SeodaemunguSeoul03722Republic of Korea
| | - Ki Jun Yu
- School of Electrical and Electronic EngineeringYonsei University50 Yonsei‐ro, SeodaemunguSeoul03722Republic of Korea
- YU‐KIST InstituteYonsei University50 Yonsei‐ro, SeodaemunguSeoul03722Republic of Korea
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29
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He Q, Wang M, Du Y, Qin Q, Qiu W. Quantitative Characterization of the Anisotropy of the Stress-Optical Properties of Polyethylene Terephthalate Films Based on the Photoelastic Method. Polymers (Basel) 2022; 14:polym14163257. [PMID: 36015516 PMCID: PMC9415013 DOI: 10.3390/polym14163257] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/14/2022] [Revised: 07/30/2022] [Accepted: 08/04/2022] [Indexed: 11/30/2022] Open
Abstract
Polyethylene terephthalate (PET) is one of the most commonly used substrate materials in the field of flexible electronics, and its stress-induced birefringence often has a detrimental effect on the optical properties of the device. Therefore, a deep and systematic understanding of the stress-optical properties of PET films is crucial for device design and manufacture. The photoelastic method is a direct optical measurement technique based on the stress-induced birefringence effect of materials, which has the advantages of being nondestructive and noncontact. In this work, the photoelastic method was used to quantitatively characterize the anisotropy of the stress-optical properties of PET films under the uniaxial stress state. First, a self-built reflection-transmission coaxial bidirectional photoelasticity measurement system was developed by means of a combination of transmission and reflection photoelasticity. Then, the stress-optical coefficients and isoclinic angles of PET films with different stretching angles were measured. Finally, the linear combinations of the photoelastic tensor components and refractive-index-related parameters were determined by fitting the analytical relationship between the stress-optical coefficients and isoclinic angles.
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Affiliation(s)
- Quanyan He
- Department of Mechanics, Tianjin University, Tianjin 300354, China
| | - Miaojing Wang
- Department of Mechanics, Tianjin University, Tianjin 300354, China
| | - Yitao Du
- Department of Mechanics, Tianjin University, Tianjin 300354, China
| | - Qinghua Qin
- Department of Mechanics, Tianjin University, Tianjin 300354, China
| | - Wei Qiu
- Department of Mechanics, Tianjin University, Tianjin 300354, China
- Tianjin Key Laboratory of Modern Engineering Mechanics, Tianjin 300354, China
- Correspondence: ; Tel.: +86-139-2046-2608
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30
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Wang X, Liu Y, Cheng H, Ouyang X. Surface Wettability for Skin-Interfaced Sensors and Devices. ADVANCED FUNCTIONAL MATERIALS 2022; 32:2200260. [PMID: 36176721 PMCID: PMC9514151 DOI: 10.1002/adfm.202200260] [Citation(s) in RCA: 38] [Impact Index Per Article: 19.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/08/2022] [Indexed: 05/05/2023]
Abstract
The practical applications of skin-interfaced sensors and devices in daily life hinge on the rational design of surface wettability to maintain device integrity and achieve improved sensing performance under complex hydrated conditions. Various bio-inspired strategies have been implemented to engineer desired surface wettability for varying hydrated conditions. Although the bodily fluids can negatively affect the device performance, they also provide a rich reservoir of health-relevant information and sustained energy for next-generation stretchable self-powered devices. As a result, the design and manipulation of the surface wettability are critical to effectively control the liquid behavior on the device surface for enhanced performance. The sensors and devices with engineered surface wettability can collect and analyze health biomarkers while being minimally affected by bodily fluids or ambient humid environments. The energy harvesters also benefit from surface wettability design to achieve enhanced performance for powering on-body electronics. In this review, we first summarize the commonly used approaches to tune the surface wettability for target applications toward stretchable self-powered devices. By considering the existing challenges, we also discuss the opportunities as a small fraction of potential future developments, which can lead to a new class of skin-interfaced devices for use in digital health and personalized medicine.
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Affiliation(s)
- Xiufeng Wang
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China
| | - Yangchengyi Liu
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China
| | - Huanyu Cheng
- Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA 16802, USA
| | - Xiaoping Ouyang
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China
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Kim GI, Jung J, Min WK, Kim MS, Jung S, Choi DH, Chung J, Kim HJ. Mechanically Durable Organic/High- k Inorganic Hybrid Gate Dielectrics Enabled by Plasma-Polymerization of PTFE for Flexible Electronics. ACS APPLIED MATERIALS & INTERFACES 2022; 14:28085-28096. [PMID: 35680562 DOI: 10.1021/acsami.2c04340] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
To achieve both the synergistic advantages of outstanding flexibility in organic dielectrics and remarkable dielectric/insulating properties in inorganic dielectrics, a plasma-polymerized hafnium oxide (HfOx) hybrid (PPH-hybrid) dielectric is proposed. Using a radio-frequency magnetron cosputtering process, the high-k HfOx dielectric is plasma-polymerized with polytetrafluoroethylene (PTFE), which is a flexible, thermally stable, and hydrophobic fluoropolymer dielectric. The PPH-hybrid dielectric with a high dielectric constant of 14.17 exhibits excellent flexibility, maintaining a leakage current density of ∼10-8 A/cm2 even after repetitive bending stress (up to 10000 bending cycles with a radius of 2 mm), whereas the HfOx dielectric degrades to be leaky. To evaluate its practical applicability to flexible thin-film transistors (TFTs), the PPH-hybrid dielectric is applied to amorphous indium-gallium-zinc oxide (IGZO) TFTs as a gate dielectric. Consequently, the PPH-hybrid dielectric-based IGZO TFTs exhibit stable electrical performance under the same harsh bending cycles: a field-effect mobility of 16.99 cm2/(V s), an on/off current ratio of 1.15 × 108, a subthreshold swing of 0.35 V/dec, and a threshold voltage of 0.96 V (averaged in nine devices). Moreover, the PPH-hybrid dielectric-based IGZO TFTs exhibit a reduced I-V hysteresis and an enhanced positive bias stress stability, with the threshold voltage shift decreasing from 4.99 to 1.74 V, due to fluorine incorporation. These results demonstrate that PTFE improves both the mechanical durability and electrical stability, indicating that the PPH-hybrid dielectric is a promising candidate for high-performance and low-power flexible electronics.
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Affiliation(s)
- Gwan In Kim
- School of Electrical and Electronic Engineering, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul 03722, Republic of Korea
| | - Joohye Jung
- School of Electrical and Electronic Engineering, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul 03722, Republic of Korea
- Display R&D Center, Samsung Display Co., Ltd., 181 Samsung-ro, Tangjeong-myeon, Asan-Si 31454, Republic of Korea
| | - Won Kyung Min
- School of Electrical and Electronic Engineering, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul 03722, Republic of Korea
| | - Min Seong Kim
- School of Electrical and Electronic Engineering, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul 03722, Republic of Korea
| | - Sujin Jung
- School of Electrical and Electronic Engineering, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul 03722, Republic of Korea
| | - Dong Hyun Choi
- School of Electrical and Electronic Engineering, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul 03722, Republic of Korea
| | - Jusung Chung
- School of Electrical and Electronic Engineering, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul 03722, Republic of Korea
| | - Hyun Jae Kim
- School of Electrical and Electronic Engineering, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul 03722, Republic of Korea
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Liu H, Du C, Liao L, Zhang H, Zhou H, Zhou W, Ren T, Sun Z, Lu Y, Nie Z, Xu F, Zhu J, Huang W. Approaching intrinsic dynamics of MXenes hybrid hydrogel for 3D printed multimodal intelligent devices with ultrahigh superelasticity and temperature sensitivity. Nat Commun 2022; 13:3420. [PMID: 35701412 PMCID: PMC9197829 DOI: 10.1038/s41467-022-31051-7] [Citation(s) in RCA: 54] [Impact Index Per Article: 27.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 11/21/2021] [Accepted: 05/31/2022] [Indexed: 12/18/2022] Open
Abstract
Hydrogels are investigated broadly in flexible sensors which have been applied into wearable electronics. However, further application of hydrogels is restricted by the ambiguity of the sensing mechanisms, and the multi-functionalization of flexible sensing systems based on hydrogels in terms of cost, difficulty in integration, and device fabrication remains a challenge, obstructing the specific application scenarios. Herein, cost-effective, structure-specialized and scenario-applicable 3D printing of direct ink writing (DIW) technology fabricated two-dimensional (2D) transition metal carbides (MXenes) bonded hydrogel sensor with excellent strain and temperature sensing performance is developed. Gauge factor (GF) of 5.7 (0 − 191% strain) and high temperature sensitivity (−5.27% °C−1) within wide working range (0 − 80 °C) can be achieved. In particular, the corresponding mechanisms are clarified based on finite element analysis and the first use of in situ temperature-dependent Raman technology for hydrogels, and the printed sensor can realize precise temperature indication of shape memory solar array hinge. Cost effective device fabrication of powerful hydrogel sensors remains challenging. Here, the authors propose a cost-effective and structure-specialized direct ink writing technique for the fabrication of two-dimensional MXene bonded hydrogel sensors with excellent strain and temperature sensing performance.
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Affiliation(s)
- Haodong Liu
- Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University (NPU), Xi'an, PR China
| | - Chengfeng Du
- State Key Laboratory of Solidification Processing, Center of Advanced Lubrication and Seal Materials, Northwestern Polytechnical University (NPU), Xi'an, PR China
| | - Liling Liao
- Key Laboratory of Low-Dimensional Quantum Structures and Quantum Control of Ministry of Education, Key Laboratory for Matter Microstructure and Function of Hunan Province, Department of Physics and Synergetic Innovation Center for Quantum Effects and Applications, Hunan Normal University, Changsha, PR China
| | - Hongjian Zhang
- Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University (NPU), Xi'an, PR China
| | - Haiqing Zhou
- Key Laboratory of Low-Dimensional Quantum Structures and Quantum Control of Ministry of Education, Key Laboratory for Matter Microstructure and Function of Hunan Province, Department of Physics and Synergetic Innovation Center for Quantum Effects and Applications, Hunan Normal University, Changsha, PR China
| | - Weichang Zhou
- Key Laboratory of Low-Dimensional Quantum Structures and Quantum Control of Ministry of Education, Key Laboratory for Matter Microstructure and Function of Hunan Province, Department of Physics and Synergetic Innovation Center for Quantum Effects and Applications, Hunan Normal University, Changsha, PR China
| | - Tianning Ren
- School of Chemistry and Chemical Engineering, Northwestern Polytechnical University (NPU), Xi'an, PR China
| | - Zhicheng Sun
- Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University (NPU), Xi'an, PR China
| | - Yufei Lu
- Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University (NPU), Xi'an, PR China
| | - Zhentao Nie
- Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University (NPU), Xi'an, PR China
| | - Feng Xu
- Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University (NPU), Xi'an, PR China
| | - Jixin Zhu
- State Key Laboratory of Fire Science, University of Science and Technology of China, Hefei, PR China. .,Institute of Advanced Materials (IAM), Key Laboratory of Institute of Advanced Materials, Nanjing Tech University (NanjingTech), Nanjing, PR China.
| | - Wei Huang
- Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University (NPU), Xi'an, PR China. .,Institute of Advanced Materials (IAM), Key Laboratory of Institute of Advanced Materials, Nanjing Tech University (NanjingTech), Nanjing, PR China.
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Zahertar S, Torun H, Sun C, Markwell C, Dong Y, Yang X, Fu Y. Flexible Platform of Acoustofluidics and Metamaterials with Decoupled Resonant Frequencies. SENSORS (BASEL, SWITZERLAND) 2022; 22:4344. [PMID: 35746129 PMCID: PMC9228408 DOI: 10.3390/s22124344] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 05/18/2022] [Revised: 06/05/2022] [Accepted: 06/07/2022] [Indexed: 06/15/2023]
Abstract
The key challenge for a lab-on-chip (LOC) device is the seamless integration of key elements of biosensing and actuation (e.g., biosampling or microfluidics), which are conventionally realised using different technologies. In this paper, we report a convenient and efficient LOC platform fabricated using an electrode patterned flexible printed circuit board (FPCB) pressed onto a piezoelectric film coated substrate, which can implement multiple functions of both acoustofluidics using surface acoustic waves (SAWs) and sensing functions using electromagnetic metamaterials, based on the same electrode on the FPCB. We explored the actuation capability of the integrated structure by pumping a sessile droplet using SAWs in the radio frequency range. We then investigated the hybrid sensing capability (including both physical and chemical ones) of the structure employing the concept of electromagnetic split-ring resonators (SRRs) in the microwave frequency range. The originality of this sensing work is based on the premise that the proposed structure contains three completely decoupled resonant frequencies for sensing applications and each resonance has been used as a separate physical or a chemical sensor. This feature compliments the acoustofluidic capability and is well-aligned with the goals set for a successful LOC device.
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Affiliation(s)
- Shahrzad Zahertar
- Faculty of Engineering and Environment, Northumbria University, Newcastle upon Tyne NE1 8ST, UK; (S.Z.); (C.M.)
- Zepler Institute, University of Southampton, Southampton SO17 1BJ, UK
| | - Hamdi Torun
- Faculty of Engineering and Environment, Northumbria University, Newcastle upon Tyne NE1 8ST, UK; (S.Z.); (C.M.)
| | - Chao Sun
- School of Life Sciences, Northwestern Polytechnical University, Xi’an 710072, China;
| | - Christopher Markwell
- Faculty of Engineering and Environment, Northumbria University, Newcastle upon Tyne NE1 8ST, UK; (S.Z.); (C.M.)
| | - Yinhua Dong
- Department of Neurology, Tianjin 4th Centre Hospital Affiliated to Nankai University, Tianjin 300140, China;
| | - Xin Yang
- Department of Electrical and Electronic Engineering, School of Engineering, Cardiff University, Cardiff CF24 3AA, UK;
| | - Yongqing Fu
- Faculty of Engineering and Environment, Northumbria University, Newcastle upon Tyne NE1 8ST, UK; (S.Z.); (C.M.)
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Lan L, Ping J, Xiong J, Ying Y. Sustainable Natural Bio-Origin Materials for Future Flexible Devices. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2022; 9:e2200560. [PMID: 35322600 PMCID: PMC9130888 DOI: 10.1002/advs.202200560] [Citation(s) in RCA: 21] [Impact Index Per Article: 10.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/28/2022] [Revised: 02/27/2022] [Indexed: 05/12/2023]
Abstract
Flexible devices serve as important intelligent interfaces in various applications involving health monitoring, biomedical therapies, and human-machine interfacing. To address the concern of electronic waste caused by the increasing usage of electronic devices based on synthetic polymers, bio-origin materials that possess environmental benignity as well as sustainability offer new opportunities for constructing flexible electronic devices with higher safety and environmental adaptivity. Herein, the bio-source and unique molecular structures of various types of natural bio-origin materials are briefly introduced. Their properties and processing technologies are systematically summarized. Then, the recent progress of these materials for constructing emerging intelligent flexible electronic devices including energy harvesters, energy storage devices, and sensors are introduced. Furthermore, the applications of these flexible electronic devices including biomedical implants, artificial e-skin, and environmental monitoring are summarized. Finally, future challenges and prospects for developing high-performance bio-origin material-based flexible devices are discussed. This review aims to provide a comprehensive and systematic summary of the latest advances in the natural bio-origin material-based flexible devices, which is expected to offer inspirations for exploitation of green flexible electronics, bridging the gap in future human-machine-environment interactions.
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Affiliation(s)
- Lingyi Lan
- Laboratory of Agricultural Information Intelligent SensingSchool of Biosystems Engineering and Food ScienceZhejiang UniversityHangzhouZhejiang310058China
- Key Laboratory of Intelligent Equipment and Robotics for Agriculture of Zhejiang ProvinceHangzhouZhejiang310058China
| | - Jianfeng Ping
- Laboratory of Agricultural Information Intelligent SensingSchool of Biosystems Engineering and Food ScienceZhejiang UniversityHangzhouZhejiang310058China
- Key Laboratory of Intelligent Equipment and Robotics for Agriculture of Zhejiang ProvinceHangzhouZhejiang310058China
| | - Jiaqing Xiong
- Innovation Center for Textile Science and TechnologyDonghua University2999 North Renmin RoadShanghai201620China
| | - Yibin Ying
- Laboratory of Agricultural Information Intelligent SensingSchool of Biosystems Engineering and Food ScienceZhejiang UniversityHangzhouZhejiang310058China
- Key Laboratory of Intelligent Equipment and Robotics for Agriculture of Zhejiang ProvinceHangzhouZhejiang310058China
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Cui X, Huang F, Zhang X, Song P, Zheng H, Chevali V, Wang H, Xu Z. Flexible pressure sensors via engineering microstructures for wearable human-machine interaction and health monitoring applications. iScience 2022; 25:104148. [PMID: 35402860 PMCID: PMC8991382 DOI: 10.1016/j.isci.2022.104148] [Citation(s) in RCA: 15] [Impact Index Per Article: 7.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/05/2023] Open
Abstract
Flexible pressure sensors capable of transducing pressure stimuli into electrical signals have drawn extensive attention owing to their potential applications for human-machine interaction and healthcare monitoring. To meet these application demands, engineering microstructures in the pressure sensors are an efficient way to improve key sensing performances, such as sensitivity, linear sensing range, response time, hysteresis, and durability. In this review, we provide an overview of the recent advances in the fabrication and application of high-performance flexible pressure sensors via engineering microstructures. The implementation mechanisms and fabrication strategies of microstructures including micropatterned, porous, fiber-network, and multiple microstructures are systematically summarized. The applications of flexible pressure sensors with microstructures in the fields of wearable human-machine interaction, and ex vivo and in vivo healthcare monitoring are comprehensively discussed. Finally, the outlook and challenges in the future improvement of flexible pressure sensors toward practical applications are presented.
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Affiliation(s)
- Xihua Cui
- China-Australia Institute for Advanced Materials and Manufacturing, Jiaxing University, Jiaxing 314001, China
| | - Fengli Huang
- College of Information Science and Engineering, Key Laboratory of Medical Electronics and Digital Health of Zhejiang Province, Engineering Research Center of Intelligent Human Health Situation Awareness of Zhejiang Province, Jiaxing University, Jiaxing 314001, China
| | - Xianchao Zhang
- College of Information Science and Engineering, Key Laboratory of Medical Electronics and Digital Health of Zhejiang Province, Engineering Research Center of Intelligent Human Health Situation Awareness of Zhejiang Province, Jiaxing University, Jiaxing 314001, China
| | - Pingan Song
- Centre for Future Materials, University of Southern Queensland, Springfield Central 4300, Australia
- School of Agriculture and Environmental Science, University of Southern Queensland, Springfield Central 4300, Australia
| | - Hua Zheng
- School of Architecture and Energy Engineering, Wenzhou University of Technology, 1 Jingguan Road, Wenzhou University Town, Wenzhou 325035, China
| | - Venkata Chevali
- Centre for Future Materials, University of Southern Queensland, Springfield Central 4300, Australia
| | - Hao Wang
- Centre for Future Materials, University of Southern Queensland, Springfield Central 4300, Australia
| | - Zhiguang Xu
- China-Australia Institute for Advanced Materials and Manufacturing, Jiaxing University, Jiaxing 314001, China
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Kim H, Kim MJ, Kwon YW, Jeon S, Lee S, Kim C, Choi BT, Shin Y, Hong SW, Shin HK. Benefits of a Skull-Interfaced Flexible and Implantable Multilight Emitting Diode Array for Photobiomodulation in Ischemic Stroke. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2022; 9:e2104629. [PMID: 35076161 PMCID: PMC9008794 DOI: 10.1002/advs.202104629] [Citation(s) in RCA: 10] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/18/2021] [Revised: 01/08/2022] [Indexed: 05/05/2023]
Abstract
Photobiomodulation (PBM) has received attention due to its potential for improving tissue function and enhancing regeneration in stroke. A lightweight, compact, and simple system of miniaturized electronic devices consisting of packaged light-emitting diodes (LEDs) that incorporates a flexible substrate for in vivo brain PBM in a mouse model is developed. Using this device platform, the preventive and therapeutic effects of PBM affixed to the exposed skull of mice in the photothrombosis and middle cerebral artery occlusion stroke model are evaluated. Among the wavelength range of 630, 850, and 940 nm LED array, the PBM with 630-nm LED array is proved to be the most effective for reducing the infarction volume and neurological impairment after ischemic stroke. Moreover, the PBM with 630 nm LED array remarkably improves the capability of spatial learning and memory in the chronic poststroke phase, attenuates AIM2 inflammasome activation and inflammasome-mediated pyroptosis, and modulates microglial polarization in the hippocampus and cortex 7 days following ischemic stroke. Thus, PBM may prevent tissue and functional damage in acute ischemic injury, thereby attenuating the development of cognitive impairment after stroke.
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Affiliation(s)
- Hyunha Kim
- Department of Korean Medical ScienceGraduate Training Program of Korean Medical Therapeutics for Healthy‐AgingSchool of Korean MedicinePusan National UniversityYangsan50612Republic of Korea
- Department of Pharmacology and NeuroscienceCreighton University School of MedicineOmahaNE68178USA
| | - Min Jae Kim
- Department of Korean Medical ScienceGraduate Training Program of Korean Medical Therapeutics for Healthy‐AgingSchool of Korean MedicinePusan National UniversityYangsan50612Republic of Korea
| | - Young Woo Kwon
- Department of Nano‐Fusion TechnologyCollege of Nanoscience & NanotechnologyPusan National UniversityBusan46241Republic of Korea
| | - Sangheon Jeon
- Department of Congo‐Mechatronics EngineeringDepartment of Optics and Mechatronics EngineeringCollege of Nanoscience & NanotechnologyPusan National UniversityBusan46241Republic of Korea
| | - Seo‐Yeon Lee
- Department of PharmacologyWonkwang University School of MedicineIksan54538Republic of Korea
| | - Chang‐Seok Kim
- Department of Congo‐Mechatronics EngineeringDepartment of Optics and Mechatronics EngineeringCollege of Nanoscience & NanotechnologyPusan National UniversityBusan46241Republic of Korea
| | - Byung Tae Choi
- Department of Korean Medical ScienceGraduate Training Program of Korean Medical Therapeutics for Healthy‐AgingSchool of Korean MedicinePusan National UniversityYangsan50612Republic of Korea
| | - Yong‐Il Shin
- Department of Rehabilitation MedicineSchool of MedicinePusan National UniversityYangsan50612Republic of Korea
| | - Suck Won Hong
- Department of Congo‐Mechatronics EngineeringDepartment of Optics and Mechatronics EngineeringCollege of Nanoscience & NanotechnologyPusan National UniversityBusan46241Republic of Korea
| | - Hwa Kyoung Shin
- Department of Korean Medical ScienceGraduate Training Program of Korean Medical Therapeutics for Healthy‐AgingSchool of Korean MedicinePusan National UniversityYangsan50612Republic of Korea
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Jeong I, Han DY, Hwang J, Song WJ, Park S. Foldable batteries: from materials to devices. NANOSCALE ADVANCES 2022; 4:1494-1516. [PMID: 36134364 PMCID: PMC9419599 DOI: 10.1039/d1na00892g] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 12/26/2021] [Accepted: 02/03/2022] [Indexed: 06/16/2023]
Abstract
Wearable electronics is a growing field that has important applications in advanced human-integrated systems with high performance and mechanical deformability, especially foldable characteristics. Although foldable electronics such as rollable TVs (LG signature OLED R) or foldable smartphones (Samsung Galaxy Z fold/flip series) have been successfully established in the market, these devices are still powered by rigid and stiff batteries. Therefore, to realize fully wearable devices, it is necessary to develop state-of-the-art foldable batteries with high performance and safety in dynamic deformation states. In this review, we cover the recent progress in developing materials and system designs for foldable batteries. The Materials section is divided into three sections aimed at helping researchers choose suitable materials for their systems. Several foldable battery systems are discussed and the combination of innovative materials and system design that yields successful devices is considered. Furthermore, the basic analysis process of electrochemical and mechanical properties is provided as a guide for researchers interested in the evaluation of foldable battery systems. The current challenges facing the practical application of foldable batteries are briefly discussed. This review will help researchers to understand various aspects (from material preparation to battery configuration) of foldable batteries and provide a brief guideline for evaluating the performance of these batteries.
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Affiliation(s)
- Insu Jeong
- Department of Chemistry, Pohang University of Science and Technology Pohang 37673 South Korea
| | - Dong-Yeob Han
- Department of Chemistry, Pohang University of Science and Technology Pohang 37673 South Korea
| | - Jongha Hwang
- Department of Organic Materials Engineering, Chungnam National University Daejeon 34134 South Korea
| | - Woo-Jin Song
- Department of Organic Materials Engineering, Chungnam National University Daejeon 34134 South Korea
| | - Soojin Park
- Department of Chemistry, Pohang University of Science and Technology Pohang 37673 South Korea
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38
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Dielectric, structural and mechanical properties of thermally aged biaxially oriented polymeric substrates for flexible electronics. Polym Degrad Stab 2022. [DOI: 10.1016/j.polymdegradstab.2022.109906] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/15/2022]
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Balakrishnan G, Song J, Mou C, Bettinger CJ. Recent Progress in Materials Chemistry to Advance Flexible Bioelectronics in Medicine. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2106787. [PMID: 34751987 PMCID: PMC8917047 DOI: 10.1002/adma.202106787] [Citation(s) in RCA: 24] [Impact Index Per Article: 12.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/27/2021] [Revised: 10/15/2021] [Indexed: 05/09/2023]
Abstract
Designing bioelectronic devices that seamlessly integrate with the human body is a technological pursuit of great importance. Bioelectronic medical devices that reliably and chronically interface with the body can advance neuroscience, health monitoring, diagnostics, and therapeutics. Recent major efforts focus on investigating strategies to fabricate flexible, stretchable, and soft electronic devices, and advances in materials chemistry have emerged as fundamental to the creation of the next generation of bioelectronics. This review summarizes contemporary advances and forthcoming technical challenges related to three principal components of bioelectronic devices: i) substrates and structural materials, ii) barrier and encapsulation materials, and iii) conductive materials. Through notable illustrations from the literature, integration and device fabrication strategies and associated challenges for each material class are highlighted.
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Affiliation(s)
| | - Jiwoo Song
- Carnegie Mellon University, 5000 Forbes Avenue, Pittsburgh, PA, 15213, USA
| | - Chenchen Mou
- Carnegie Mellon University, 5000 Forbes Avenue, Pittsburgh, PA, 15213, USA
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Li WD, Ke K, Jia J, Pu JH, Zhao X, Bao RY, Liu ZY, Bai L, Zhang K, Yang MB, Yang W. Recent Advances in Multiresponsive Flexible Sensors towards E-skin: A Delicate Design for Versatile Sensing. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2022; 18:e2103734. [PMID: 34825473 DOI: 10.1002/smll.202103734] [Citation(s) in RCA: 39] [Impact Index Per Article: 19.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/26/2021] [Revised: 09/16/2021] [Indexed: 05/07/2023]
Abstract
Multiresponsive flexile sensors with strain, temperature, humidity, and other sensing abilities serving as real electronic skin (e-skin) have manifested great application potential in flexible electronics, artificial intelligence (AI), and Internet of Things (IoT). Although numerous flexible sensors with sole sensing function have already been reported since the concept of e-skin, that mimics the sensing features of human skin, was proposed about a decade ago, the ones with more sensing capacities as new emergences are urgently demanded. However, highly integrated and highly sensitive flexible sensors with multiresponsive functions are becoming a big thrust for the detection of human body motions, physiological signals (e.g., skin temperature, blood pressure, electrocardiograms (ECG), electromyograms (EMG), sweat, etc.) and environmental stimuli (e.g., light, magnetic field, volatile organic compounds (VOCs)), which are vital to real-time and all-round human health monitoring and management. Herein, this review summarizes the design, manufacturing, and application of multiresponsive flexible sensors and presents the future challenges of fabricating these sensors for the next-generation e-skin and wearable electronics.
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Affiliation(s)
- Wu-Di Li
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan, 610065, China
| | - Kai Ke
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan, 610065, China
| | - Jin Jia
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan, 610065, China
| | - Jun-Hong Pu
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan, 610065, China
| | - Xing Zhao
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan, 610065, China
| | - Rui-Ying Bao
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan, 610065, China
| | - Zheng-Ying Liu
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan, 610065, China
| | - Lu Bai
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan, 610065, China
| | - Kai Zhang
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan, 610065, China
| | - Ming-Bo Yang
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan, 610065, China
| | - Wei Yang
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu, Sichuan, 610065, China
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Qu CC, Sun XY, Sun WX, Cao LX, Wang XQ, He ZZ. Flexible Wearables for Plants. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2021; 17:e2104482. [PMID: 34796649 DOI: 10.1002/smll.202104482] [Citation(s) in RCA: 18] [Impact Index Per Article: 6.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/28/2021] [Revised: 10/18/2021] [Indexed: 05/27/2023]
Abstract
The excellent stretchability and biocompatibility of flexible sensors have inspired an emerging field of plant wearables, which enable intimate contact with the plants to continuously monitor the growth status and localized microclimate in real-time. Plant flexible wearables provide a promising platform for the development of plant phenotype and the construction of intelligent agriculture via monitoring and regulating the critical physiological parameters and microclimate of plants. Here, the emerging applications of plant flexible wearables together with their pros and cons from four aspects, including physiological indicators, surrounding environment, crop quality, and active control of growth, are highlighted. Self-powered energy supply systems and signal transmission mechanisms are also elucidated. Furthermore, the future opportunities and challenges of plant wearables are discussed in detail.
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Affiliation(s)
- Chun-Chun Qu
- College of Engineering, China Agricultural University, Beijing, 100083, China
- State Key Laboratory of Plant Physiology and Biochemistry, Center for Crop Functional Genomics and Molecular Breeding, China Agricultural University, Beijing, 100083, China
- Sanya Institute of China Agricultural University, China Agricultural University, Hainan, 572000, China
| | - Xu-Yang Sun
- School of Medical Science and Engineering, Beihang University, Beijing, 100191, China
| | - Wen-Xiu Sun
- College of Engineering, China Agricultural University, Beijing, 100083, China
- State Key Laboratory of Plant Physiology and Biochemistry, Center for Crop Functional Genomics and Molecular Breeding, China Agricultural University, Beijing, 100083, China
| | - Ling-Xiao Cao
- College of Engineering, China Agricultural University, Beijing, 100083, China
| | - Xi-Qing Wang
- State Key Laboratory of Plant Physiology and Biochemistry, Center for Crop Functional Genomics and Molecular Breeding, China Agricultural University, Beijing, 100083, China
| | - Zhi-Zhu He
- College of Engineering, China Agricultural University, Beijing, 100083, China
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Barcelos DA, Leitao DC, Pereira LCJ, Gonçalves MC. What Is Driving the Growth of Inorganic Glass in Smart Materials and Opto-Electronic Devices? MATERIALS (BASEL, SWITZERLAND) 2021; 14:2926. [PMID: 34072283 PMCID: PMC8198596 DOI: 10.3390/ma14112926] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 04/30/2021] [Revised: 05/19/2021] [Accepted: 05/21/2021] [Indexed: 02/06/2023]
Abstract
Inorganic glass is a transparent functional material and one of the few materials that keeps leading innovation. In the last decades, inorganic glass was integrated into opto-electronic devices such as optical fibers, semiconductors, solar cells, transparent photovoltaic devices, or photonic crystals and in smart materials applications such as environmental, pharmaceutical, and medical sensors, reinforcing its influence as an essential material and providing potential growth opportunities for the market. Moreover, inorganic glass is the only material that is 100% recyclable and can incorporate other industrial offscourings and/or residues to be used as raw materials. Over time, inorganic glass experienced an extensive range of fabrication techniques, from traditional melting-quenching (with an immense diversity of protocols) to chemical vapor deposition (CVD), physical vapor deposition (PVD), and wet chemistry routes as sol-gel and solvothermal processes. Additive manufacturing (AM) was recently added to the list. Bulks (3D), thin/thick films (2D), flexible glass (2D), powders (2D), fibers (1D), and nanoparticles (NPs) (0D) are examples of possible inorganic glass architectures able to integrate smart materials and opto-electronic devices, leading to added-value products in a wide range of markets. In this review, selected examples of inorganic glasses in areas such as: (i) magnetic glass materials, (ii) solar cells and transparent photovoltaic devices, (iii) photonic crystal, and (iv) smart materials are presented and discussed.
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Affiliation(s)
- Daniel Alves Barcelos
- Departamento de Engenharia Química, Instituto Superior Técnico, Universidade de Lisboa, Av. Rovisco Pais, 1049-001 Lisboa, Portugal;
- CQE, Centro de Química Estrutural, Av. Rovisco Pais, 1049-001 Lisboa, Portugal
| | - Diana C. Leitao
- INESC Microsistemas e Nanotecnologias, R. Alves Redol 9, 1000-029 Lisboa, Portugal;
- Departamento de Física, Instituto Superior Técnico, Universidade de Lisboa, Av. Rovisco Pais, 1049-001 Lisboa, Portugal
| | - Laura C. J. Pereira
- Departamento de Engenharia e Ciências Nucleares, Instituto Superior Técnico, Universidade de Lisboa, 2685-066 Bobadela LRS, Portugal;
- Centro de Ciências e Tecnologias Nucleares, Instituto Superior Técnico, Universidade de Lisboa, 2685-066 Bobadela LRS, Portugal
| | - Maria Clara Gonçalves
- Departamento de Engenharia Química, Instituto Superior Técnico, Universidade de Lisboa, Av. Rovisco Pais, 1049-001 Lisboa, Portugal;
- CQE, Centro de Química Estrutural, Av. Rovisco Pais, 1049-001 Lisboa, Portugal
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Vu CC, Kim SJ, Kim J. Flexible wearable sensors - an update in view of touch-sensing. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS 2021; 22:26-36. [PMID: 33854405 PMCID: PMC8018418 DOI: 10.1080/14686996.2020.1862629] [Citation(s) in RCA: 18] [Impact Index Per Article: 6.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/31/2020] [Revised: 11/27/2020] [Accepted: 11/27/2020] [Indexed: 05/27/2023]
Abstract
Nowadays, much of user interface is based on touch and the touch sensors have been common for displays, Internet of things (IoT) projects, or robotics. They can be found in lamps, touch screens of smartphones, or other wide arrays of applications as well. However, the conventional touch sensors, fabricated from rigid materials, are bulky, inflexible, hard, and hard-to-wear devices. The current IoT trend has made these touch sensors increasingly important when it added in the skin or clothing to affect different aspects of human life flexibly and comfortably. The paper provides an overview of the recent developments in this field. We discuss exciting advances in materials, fabrications, enhancements, and applications of flexible wearable sensors under view of touch-sensing. Therein, the review describes the theoretical principles of touch sensors, including resistive, capacitive, and piezoelectric types. Following that, the conventional and novel materials, as well as manufacturing technologies of flexible sensors are considered to. Especially, this review highlights the multidisciplinary approaches such as e-skins, e-textiles, e-healthcare, and e-control of flexible touch sensors. Finally, we summarize the challenges and opportunities that use is key to widespread development and adoption for future research.
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Affiliation(s)
- Chi Cuong Vu
- Department of Organic Materials and Fibers Engineering, Soongsil University, Seoul, Republic of Korea
| | - Sang Jin Kim
- Department of Organic Materials and Fibers Engineering, Soongsil University, Seoul, Republic of Korea
| | - Jooyong Kim
- Department of Organic Materials and Fibers Engineering, Soongsil University, Seoul, Republic of Korea
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Wang Z, Sun L, Ni Y, Liu L, Xu W. Flexible Electronics and Healthcare Applications. FRONTIERS IN NANOTECHNOLOGY 2021. [DOI: 10.3389/fnano.2021.625989] [Citation(s) in RCA: 6] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/11/2022] Open
Abstract
Flexible electronics has attracted tremendous attention in recent years. The essential requirements for flexible electronics include excellent electrical properties, flexibility and stretchability. By introducing special structures or using flexible materials, electronic devices can be given excellent flexibility and stretchability. In this paper we review the realization of flexible electronics from the perspective of structural design strategies and materials; then, healthcare application of flexible electronic systems was introduced. Finally, a brief summary and outlook are presented.
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