Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

Metainterfaces with mechanical, thermal, and active programming properties based on programmable orientation-distributed biometric architectonics

Interfaces between different materials crucially determine the performance of multi-material systems, impacting a wide range of industries. Currently, precisely programming interfaces with distinct properties at different localized interface positions remains a challenge, leading to limited interface adaptability and unpredictable interface failures, thus hindering the development of next-generation materials and engineering systems with highly customizable multiphysical interface performances. Our research introduces programmable "metainterfaces" for the first time, featuring engineerable biometric architectonics that allows for mechanically, thermally, and actively programmed distribution of interfacial effects by its orientation, driven by artificial intelligence. Enabled by metainterfaces, we showcased improved mechanical properties of future composite metamaterials by programming interface resistance customized to the decoupling modes of distinct lattice topologies. Additionally, we demonstrate enhanced and programmable impact mechanics in fish scale assemblies equipped with pre-programmed metainterface sheets. The proposed metainterface also allows for coolant flow programming in thermal management systems, opening new avenues for development of highly customizable thermos-mechanical systems. Additionally, we introduce digitally controlled "metadisks" enabled by metainterfaces as novel solutions for actively programmable interface systems in robotics, offering real-time adaptive and intelligent interfacial mechanics. This research sets the foundation for next-generation multi-material systems with precisely programmed interfacial effects, offering broad applicability in areas such as smart materials, advanced thermal management, and intelligent robotics.

Poly(ionic liquid)s: A Promising Matrix for Thermal Interface Materials

The swift progression of high-density chiplet packaging, propelled by the artificial intelligence revolution, has precipitated a critical need for high-performance chip-scale thermal interface materials (TIMs). The elevated thermal resistance, limited interfacial adhesion, and mechanical flexibility intrinsic to silicone systems present a substantial challenge in meeting reliability standards amidst chip warpage. This particular matter underscores a significant performance bottleneck within existing high-end TIMs. In this study, we present poly(ionic liquid)s (PILs) as an innovative matrix for TIMs. Our findings highlight the unique properties of PILs, showcasing a low elastic modulus (60 kPa), exceptional flexibility and stretchability (>3800%), high adhesion to diverse substrates (up to 4.10 MPa), favorable filler compatibility, remarkable thermal stability, and prompt self-healing capabilities coupled with recyclability. The collective findings suggest that the PIL serves as an ideal matrix for heat transfer. As a proof of concept, PIL blended with liquid metal was straightforwardly combined to produce a TIM, exhibiting exceptional performance within practical encapsulated structures. The PIL-based TIM demonstrates substantial elongation at break (>350%), coupled with sustained high adhesion strength (up to 1.70 MPa), and exhibits favorable thermal conductivity in package testing. This study presents an innovative TIM matrix with the potential to enhance existing TIM systems, delivering significant performance benefits compared to silicones. Besides elucidating their multifaceted characteristics, this study forecasts an expanded range of applications for PILs, along with laying the groundwork for advancing next-generation TIMs.

In Situ Multi-Directional Liquid Manipulation Enabled by 3D Asymmetric Fang-Structured Surface

Decorating surfaces with wetting gradients or topological structures is a prevailing strategy to control uni-directional spreading without energy input. However, current methods, limited by fixed design, cannot achieve multi-directional control of liquids, posing challenges to practical applications. Here, a structured surface composed of arrayed three-dimensional asymmetric fang-structured units is reported that enable in situ control of customized multi-directional spreading for different surface tension liquids, exhibiting five novel modes. This is attributed to bottom-up distributed multi-curvature features of surface units, which create varied Laplace pressure gradients to guide the spreading of different-wettability liquids along specific directions. The surface's capability to respond to liquid properties for multimodal control leads to innovative functions that are absent in conventional structured surfaces. Selective multi-path circuits can be constructed by taking advantage of rich liquid behaviors with the surface; surface tensions of wetting liquids can be portably indicated with a resolution scope of 0.3-3.4 mN m-1 using the surface; temperature-mediated change of liquid properties is utilized to smartly manipulate liquid behavior and achieve the spatiotemporal-controllable targeted cooling of the surface at its heated state. These novel applications open new avenues for developing advanced surfaces for liquid manipulation.

Nanoscale hyperthermia mesostructures for sustainable antimicrobial design

Sustainability is critical in addressing global challenges posed by prolonged pandemics that impact health, economies, and the environment. Here, we introduce a molecular engineering approach for thermoregulated antimicrobial management inspired by firewalking rituals. The study uses in situ spectroscopy and multi-scale modeling to validate a hierarchical design. Efficient light-to-thermal energy conversion is achieved by engineering the molecular band structure. Rapid nanoscale hyperthermia is facilitated through thermal engineering. This approach significantly reduces the half-life of pathogens such as Escherichia coli, influenza A, and severe acute respiratory syndrome coronavirus 2 (SARS-CoV-2) to 1.4 min while maintaining a low perceived temperature on human skin. Standard disease infection and epidemic models show this technology's potential to flatten outbreak curves and delay peak infection rates, which is crucial during the early stages of pandemics when developing vaccines and antiviral drugs takes time. The scalable manufacturing and broad antimicrobial applicability hold great promise for controlling emerging infectious diseases and diverse bioprotective applications.

Insight into Interfacial Heat Transfer of β-Ga2O3/Diamond Heterostructures via the Machine Learning Potential

β-Ga2O3 is an ultrawide-band gap semiconductor with excellent potential for high-power and ultraviolet optoelectronic device applications. Low thermal conductivity is one of the major obstacles to enable the full performance of β-Ga2O3-based devices. A promising solution for this problem is to integrate β-Ga2O3 with a diamond heat sink. However, the thermal properties of the β-Ga2O3/diamond heterostructures after the interfacial bonding have not been studied extensively, which are influenced by the crystal orientations and interfacial atoms for the β-Ga2O3 and diamond interfaces. In this work, molecular dynamics simulations based on machine learning potential have been adopted to investigate the crystal-orientation-dependent and interfacial-atom-dependent thermal boundary resistance (TBR) of the β-Ga2O3/diamond heterostructure after interfacial bonding. The differences in TBR at different interfaces are explained in detail through the explorations of thermal conductivity value, thermal conductivity spectra, vibration density of states, and interfacial structures. Based on the above explorations, a further understanding of the influence of different crystal orientations and interfacial atoms on the β-Ga2O3/diamond heterostructure was achieved. Finally, insightful optimization strategies have been proposed in the study, which could pave the way for better thermal design and management of β-Ga2O3/diamond heterostructures according to guidance in the selection of the crystal orientations and interfacial atoms of the β-Ga2O3 and diamond interfaces.

Transparent radiative cooling cover window for flexible and foldable electronic displays

Transparent radiative cooling holds the promise to efficiently manage thermal conditions in various electronic devices without additional energy consumption. Radiative cooling cover windows designed for foldable and flexible displays could enhance cooling capacities in the ubiquitous deployment of flexible electronics in outdoor environments. However, previous demonstrations have not met the optical, mechanical, and moisture-impermeable criteria for such cover windows. Herein, we report transparent radiative cooling metamaterials with a thickness of 50 microns as a cover window of foldable and flexible displays by rational design and synthesis of embedding optically-modulating microstructures in clear polyimide. The resulting outcome not only includes excellent light emission in the atmospheric window under the secured optical transparency but also provides enhanced mechanical and moisture-impermeable properties to surpass the demands of target applications. Our metamaterials not only substantially mitigate the temperature rise in heat-generating devices exposed to solar irradiance but also enhance the thermal management of devices in dark conditions. The light output performance of light-emitting diodes in displays on which the metamaterials are deployed is greatly enhanced by suppressing the performance deterioration associated with thermalization.

Thermally Conductive Elastomer Composites with High Toughness, Softness, and Resilience Enabled by Regulating Interfacial Structure and Dynamics

The emerging applications of thermally conductive elastomer composites in modern electronic devices for heat dissipation require them to maintain both high toughness and resilience under thermomechanical stresses. However, such a combination of thermal conductivity and desired mechanical characteristics is extremely challenging to achieve in elastomer composites. Here this long-standing mismatch is resolved via regulating interfacial structure and dynamics response. This regulation is realized both by tuning the molecular weight of the dangling chains in the polymer networks and by silane grafting of the fillers, thereby creating a broad dynamic-gradient interfacial region comprising of entanglements. These entanglements can provide the slipping topological constraint that allows for tension equalization between and along the chains, while also tightening into rigid knots to prevent chain disentanglement upon stretching. Combined with ultrahigh loading of aluminum-fillers (90 wt%), this design provides a low Young's modulus (350.0 kPa), high fracture toughness (831.5 J m-2), excellent resilience (79%) and enhanced thermal conductivity (3.20 W m-1 k-1). This work presents a generalizable preparation strategy toward engineering soft, tough, and resilient high-filled elastomer composites, suitable for complex environments, such as automotive electronics, and wearable devices.

Elastomer Composites with High Damping and Low Thermal Resistance via Hierarchical Interactions and Regulating Filler

Modern microelectronics and emerging technologies such as wearable electronics and soft robotics require elastomers to integrate high damping with low thermal resistance to avoid damage caused by vibrations and heat accumulation. However, the strong coupling between storage modulus and loss factor makes it generally challenging to simultaneously increase both thermal conductance and damping. Here, a strategy of introducing hierarchical interaction and regulating fillers in polybutadiene/spherical aluminum elastomer composites is reported to simultaneously achieve extraordinary damping ability of tan δ > 1.0 and low thermal resistance of 0.15 cm2 K W-1, which surpasses state-of-the-art elastomers and their composites. The enhanced damping is attributed to increased energy dissipation via introducing the hierarchical hydrogen bond interactions in polybutadiene networks and the addition of spherical aluminum, which also functions as a thermally conductive filler to achieve low thermal resistance. As a proof of concept, the polybutadiene/spherical aluminum elastomer composites are used as thermal interface materials, showing effective heat dissipation for electronic devices in vibration scenarios. The combination of outstanding damping performance and extraordinary heat dissipation ability of the elastomer composites may create new opportunities for their applications in electronics.

Deep-potential enabled multiscale simulation of gallium nitride devices on boron arsenide cooling substrates

High-efficient heat dissipation plays critical role for high-power-density electronics. Experimental synthesis of ultrahigh thermal conductivity boron arsenide (BAs, 1300 W m-1K-1) cooling substrates into the wide-bandgap semiconductor of gallium nitride (GaN) devices has been realized. However, the lack of systematic analysis on the heat transfer across the GaN-BAs interface hampers the practical applications. In this study, by constructing the accurate and high-efficient machine learning interatomic potentials, we perform multiscale simulations of the GaN-BAs heterostructures. Ultrahigh interfacial thermal conductance of 260 MW m-2K-1 is achieved, which lies in the well-matched lattice vibrations of BAs and GaN. The strong temperature dependence of interfacial thermal conductance is found between 300 to 450 K. Moreover, the competition between grain size and boundary resistance is revealed with size increasing from 1 nm to 1000 μm. Such deep-potential equipped multiscale simulations not only promote the practical applications of BAs cooling substrates in electronics, but also offer approach for designing advanced thermal management systems.

Mechanically and Thermally Guided, Honeycomb-like Nanocomposites with Strain-Insensitive High Thermal Conductivity for Stretchable Electronics

Thermal management materials have become increasingly crucial for stretchable electronic devices and systems. Drastically different from conventional thermally conductive materials, which are applied at static conditions, thermal management materials for stretchable electronics additionally require strain-insensitive thermal conductivity, as they generally undergo cyclic deformation. However, realizing such a property remains challenging mainly because conventional thermally conductive polymer composites generally lack a mechanically guided design. Here, we report a honeycomb-like nanocomposite with a three-dimensional (3D) thermally conductive network fabricated by an arrayed ice-templating technique followed by elastomer infiltration. The hexagonal honeycomb-like structure with thin, compact walls (≈ 40 μm) endows our composite with a high through-plane thermal conductivity (≈ 1.54 W m-1 K-1) at an ultralow boron nitride nanosheet (BNNS) loading (≈ 0.85 vol %), with an enhancement factor of thermal conductivity up to 820% and thermal-insensitive strain up to 200%, which are 2.7 and 2 times higher than those reported in the literature. We report an intelligent strategy for the development of advanced thermal management materials for high-performance stretchable electronics.

Application-Driven High-Thermal-Conductivity Polymer Nanocomposites

Polymer nanocomposites combine the merits of polymer matrices and the unusual effects of nanoscale reinforcements and have been recognized as important members of the material family. Being a fundamental material property, thermal conductivity directly affects the molding and processing of materials as well as the design and performance of devices and systems. Polymer nanocomposites have been used in numerous industrial fields; thus, high demands are placed on the thermal conductivity feature of polymer nanocomposites. In this Perspective, we first provide roadmaps for the development of polymer nanocomposites with isotropic, in-plane, and through-plane high thermal conductivities, demonstrating the great effect of nanoscale reinforcements on thermal conductivity enhancement of polymer nanocomposites. Then the significance of the thermal conductivity of polymer nanocomposites in different application fields, including wearable electronics, thermal interface materials, battery thermal management, dielectric capacitors, electrical equipment, solar thermal energy storage, biomedical applications, carbon dioxide capture, and radiative cooling, are highlighted. In future research, we should continue to focus on methods that can further improve the thermal conductivity of polymer nanocomposites. On the other hand, we should pay more attention to the synergistic improvement of the thermal conductivity and other properties of polymer nanocomposites. Emerging polymer nanocomposites with high thermal conductivity should be based on application-oriented research.

Vitrimer Nanocomposites for Highly Thermal Conducting Materials with Sustainability

Vitrimers, as dynamic covalent network polymers, represent a groundbreaking advancement in materials science. They excel in their applications, such as advanced thermal-conductivity composite materials, providing a sustainable alternative to traditional polymers. The incorporation of vitrimers into composite fillers enhances alignment and heat passway broadly, resulting in superior thermal conductivity compared to conventional thermosetting polymers. Their dynamic exchange reactions enable straightforward reprocessing, fostering the easy reuse of damaged composite materials and opening possibilities for recycling both matrix and filler components. We review an overview of the present advancements in utilizing vitrimers for highly thermally conductive composite materials.

Patterned liquid metal embedded in brush-shaped polymers for dynamic thermal management

Interface thermal resistance has become a crucial barrier to effective thermal management in high-performance electronics and sensors. The growing complexity of operational conditions, such as irregular and dynamic surfaces, demands thermal interface materials (TIMs) to possess high thermal conductivity and soft elasticity. However, developing materials that simultaneously combine soft elasticity and high thermal conductivity remains a challenging task. Herein, we utilize a vertically oriented graphene aerogel (VGA) and rationally design liquid metal (LM) networks to achieve directional and adjustable pathways within the composite. Subsequently, we leverage the advantages of the low elastic modulus and high deformation capabilities of brush-shaped polydimethylsiloxane (BPDMS), together with the bicontinuous thermal conduction path constructed by VGA and LM networks. Ultimately, the designed composite of patterned liquid metal/vertically oriented graphene aerogel/brush-shaped PDMS (LM-VGA/BPDMS) shows a high thermal conductivity (7.11 W m-1 K-1), an ultra-low elastic modulus (10.13 kPa), excellent resilience, and a low interface thermal resistance (14.1 K mm2 W-1). This LM-VGA/BPDMS soft composite showcases a stable heat dissipation capability at dynamically changing interfaces, as well as excellent adaptability to different irregular surfaces. This strategy holds important application prospects in the fields of interface thermal management and thermal sensing in extremely complex environments.

Dry-Contact Thermal Interface Material with the Desired Bond Line Thickness and Ultralow Applied Thermal Resistance

Efforts to directly utilize thixotropic polymer composites for out-of-plane thermal transport applications, known as thermal interface materials (TIMs), have been impeded by their mediocre applied thermal resistance (Reff) in a sandwiched structure. Different from traditional attempts at enhancing thermal conductivity, this study proposes a low-bond line thickness (BLT) path for mitigating the sandwiched thermal impedance. Taking the most common TIM, polydimethylsiloxane/aluminum oxide/zinc oxide (PDMS/Al2O3/ZnO), as an example, liquid metal is designed to on-demand localize at the Al2O3-polymer and Al2O3-filler interface regions, breaking rheological challenges for lowering the BLT. Specifically, during the sandwiched compression process, interfacial LM is just like the lubricant, dexterously promoting the relaxation of immobilized PDMS chains and helping fillers to flow through mitigating the internal friction between Al2O3 and adjacent filler. As a result, this TIM first time exhibits a boundary BLT (4.28 μm) that almost approaches the diameter of the maximum filler and performs an ultralow dry-contact Reff of 4.05 mm2 K/W at 40 psi, outperforming most reported and commercial dry-contact TIMs. This study of the low-BLT direction is believed to point to a new path for future research on high-performance TIMs.

Non-Perturbative Determination of Isotope-induced Anomalous Vibrational Physics

In general, vibrational physics has been well described by quantum perturbation theory to provide footprint characteristics for common crystals. However, despite weak phonon anharmonicity, the recently discovered cubic crystals have shown anomalous vibrational dynamics with elusive fundamental origin. Here, we developed a non-perturbative ab initio approach, in together with spectroscopy and high-pressure experiments, to successfully determine the exact dynamic evolutions of the vibrational physics for the first time. We found that the local fluctuation and coupling isotopes significantly dictate the vibrational spectra, through the Brillouin zone folding that has been previously ignored in literature. By decomposing vibrational spectra into individual isotope eigenvectors, we observed both positive and negative contributions to Raman intensity from constitutional atoms (10B, 11B, 75As or 31P). Importantly, our non-perturbative theory predicts that a novel vibrational resonance appears at high hydrostatic pressure due to broken translational symmetry, which was indeed verified by experimental measurement under a pressure up to 31.5 GPa. Our study develops fundamental understandings for the anomalous lattice physics under the failure of quantum perturbation theory and provides a new approach in exploring novel transport phenomena for materials of extreme properties.

Electrically insulating PBO/MXene film with superior thermal conductivity, mechanical properties, thermal stability, and flame retardancy

Constructing flexible and robust thermally conductive but electrically insulating composite films for efficient and safe thermal management has always been a sought-after research topic. Herein, a nacre-inspired high-performance poly(p-phenylene-2,6-benzobisoxazole) (PBO)/MXene nanocomposite film was prepared by a sol-gel-film conversion method with a homogeneous gelation process. Because of the as-formed optimized brick and mortar structure, and the strong bridging and caging effects of the fine PBO nanofibre network on the MXene nanosheets, the resulting nanocomposite film is electrically insulating (2.5 × 109 Ω cm), and exhibits excellent mechanical properties (tensile strength of 416.7 MPa, Young's modulus of 9.1 GPa and toughness of 97.3 MJ m-3). More importantly, the synergistic orientation of PBO nanofibres and MXene nanosheets endows the film with an in-plane thermal conductivity of 42.2 W m-1 K-1. The film also exhibits excellent thermal stability and flame retardancy. This work broadens the ideas for preparing high-performance thermally conductive but electrically insulating composites.

Functional Materials and Innovative Strategies for Wearable Thermal Management Applications

Highlights

This article systematically reviews the thermal management wearables with a specific emphasis on materials and strategies to regulate the human body temperature. Thermal management wearables are subdivided into the active and passive thermal managing methods. The strength and weakness of each thermal regulatory wearables are discussed in details from the view point of practical usage in real-life.

Abstract

Thermal management is essential in our body as it affects various bodily functions, ranging from thermal discomfort to serious organ failures, as an example of the worst-case scenario. There have been extensive studies about wearable materials and devices that augment thermoregulatory functionalities in our body, employing diverse materials and systematic approaches to attaining thermal homeostasis. This paper reviews the recent progress of functional materials and devices that contribute to thermoregulatory wearables, particularly emphasizing the strategic methodology to regulate body temperature. There exist several methods to promote personal thermal management in a wearable form. For instance, we can impede heat transfer using a thermally insulating material with extremely low thermal conductivity or directly cool and heat the skin surface. Thus, we classify many studies into two branches, passive and active thermal management modes, which are further subdivided into specific strategies. Apart from discussing the strategies and their mechanisms, we also identify the weaknesses of each strategy and scrutinize its potential direction that studies should follow to make substantial contributions to future thermal regulatory wearable industries.

Electronic and valleytronic properties of crystalline boron-arsenide tuned by strain and disorder

Ab initio density functional theory (DFT) and DFT plus coherent potential approximation (DFT + CPA) are employed to reveal, respectively, the effect of in-plane strain and site-diagonal disorder on the electronic structure of cubic boron arsenide (BAs). It is demonstrated that tensile strain and static diagonal disorder both reduce the semiconducting one-particle band gap of BAs, and a V-shaped p-band electronic state emerges - enabling advanced valleytronics based on strained and disordered semiconducting bulk crystals. At biaxial tensile strains close to 15% the valence band lineshape relevant for optoelectronics is shown to coincide with one reported for GaAs at low energies. The role played by static disorder on the As sites is to promote p-type conductivity in the unstrained BAs bulk crystal, consistent with experimental observations. These findings illuminate the intricate and interdependent changes in crystal structure and lattice disorder on the electronic degrees of freedom of semiconductors and semimetals.

Tetris-Style Stacking Process to Tailor the Orientation of Carbon Fiber Scaffolds for Efficient Heat Dissipation

As the miniaturization of electronic devices and complication of electronic packaging, there are growing demands for thermal interfacial materials with enhanced thermal conductivity and the capability to direct the heat toward heat sink for highly efficient heat dissipation. Pitch-based carbon fiber (CF) with ultrahigh axial thermal conductivity and aspect ratios exhibits great potential for developing thermally conductive composites as TIMs. However, it is still hard to fabricate composites with aligned carbon fiber in a general approach to fully utilize its excellent axial thermal conductivity in specific direction. Here, three types of CF scaffolds with different oriented structure were developed via magnetic field-assisted Tetris-style stacking and carbonization process. By regulating the magnetic field direction and initial stacking density, the self-supporting CF scaffolds with horizontally aligned (HCS), diagonally aligned and vertically aligned (VCS) fibers were constructed. After embedding the polydimethylsiloxane (PDMS), the three composites exhibited unique heat transfer properties, and the HCS/PDMS and VCS/PDMS composites presented a high thermal conductivity of 42.18 and 45.01 W m-1 K-1 in fiber alignment direction, respectively, which were about 209 and 224 times higher than that of PDMS. The excellent thermal conductivity is mainly ascribed that the oriented CF scaffolds construct effective phonon transport pathway in the matrix. In addition, fishbone-shaped CF scaffold was also produced by multiple stacking and carbonization process, and the prepared composites exhibited a controlled heat transfer path, which can allow more versatility in the design of thermal management system.

Electric field-induced orientation of silicon carbide whiskers for directional and localized thermal management

Incorporating high thermal conductivity fillers into the matrix material and optimizing their distribution offers a targeted approach to controlling heat flow conduction. However, the design of composite microstructure, particularly the precise orientation of fillers in the micro-nano domain, remains a formidable challenge to date. Here, we report a novel method for constructing directional/localized thermal conduction pathways based on silicon carbide whiskers (SiCWs) in the polyacrylamide (PAM) gel matrix using micro-structured electrodes. SiCWs are one-dimensional nanomaterials with ultra-high thermal conductivity, strength, and hardness. The outstanding properties of SiCWs can be maximized through ordered orientation. Under the conditions of 18 V voltage and 5 MHz frequency, SiCWs can achieve complete orientation in only about 3 s. In addition, the prepared SiCWs/PAM composite exhibits interesting properties, including enhanced thermal conductivity and localized conduction of heat flow. When the SiCWs concentration is 0.5 g·L^-1, the thermal conductivity of SiCWs/PAM composite is about 0.7 W·m^-1·K^-1, which is 0.3 W·m^-1·K^-1 higher than that of PAM gel. This work achieved structural modulation of the thermal conductivity by constructing a specific spatial distribution of SiCWs units in the micro-nanoscale domain. The resulting SiCWs/PAM composite has unique localized heat conduction properties and is expected to become a new generation of composites with better characteristics and functions in thermal transmission and thermal management.

Nanopolyhybrids: Materials, Engineering Designs, and Advances in Thermal Management

The fundamental requirements for thermal comfort along with the unbalanced growth in the energy demand and consumption worldwide have triggered the development and innovation of advanced materials for high thermal-management capabilities. However, continuous development remains a significant challenge in designing thermally robust materials for the efficient thermal management of industrial devices and manufacturing technologies. The notable achievements thus far in nanopolyhybrid design technologies include multiresponsive energy harvesting/conversion (e.g., light, magnetic, and electric), thermoregulation (including microclimate), energy saving in construction, as well as the miniaturization, integration, and intelligentization of electronic systems. These are achieved by integrating nanomaterials and polymers with desired engineering strategies. Herein, fundamental design approaches that consider diverse nanomaterials and the properties of nanopolyhybrids are introduced, and the emerging applications of hybrid composites such as personal and electronic thermal management and advanced medical applications are highlighted. Finally, current challenges and outlook for future trends and prospects are summarized to develop nanopolyhybrid materials.

Self-Stacked 3D Anisotropic BNNS Network Guided by Para-Aramid Nanofibers for Highly Thermal Conductive Dielectric Nanocomposites

The enhancement of the heat-dissipation property of polymer-based composites is of great practical interest in modern electronics. Recently, the construction of a three-dimensional (3D) thermal pathway network structure for composites has become an attractive way. However, for most reported high thermal conductive composites, excellent properties are achieved at a high filler loading and the building of a 3D network structure usually requires complex steps, which greatly restrict the large-scale preparation and application of high thermal conductive polymer-based materials. Herein, utilizing the framework-forming characteristic of polymerization-induced para-aramid nanofibers (PANF) and the high thermal conductivity of hexagonal boron nitride nanosheets (BNNS), a 3D-laminated PANF-supported BNNS aerogel was successfully prepared via a simple vacuum-assisted self-stacking method, which could be used as a thermal conductive skeleton for epoxy resin (EP). The obtained PANF-BNNS/EP nanocomposite exhibits a high thermal conductivity of 3.66 W m^-1 K^-1 at only 13.2 vol % BNNS loading. The effectiveness of the heat conduction path was proved by finite element analysis. The PANF-BNNS/EP nanocomposite shows outstanding practical thermal management capability, excellent thermal stability, low dielectric constant, and dielectric loss, making it a reliable material for electronic packaging applications. This work also offers a potential and promotable strategy for the easy manufacture of 3D anisotropic high-efficiency thermal conductive network structures.

Room-Temperature Self-Healing Soft Composite Network with Unprecedented Crack Propagation Resistance Enabled by a Supramolecular Assembled Lamellar Structure

Soft self-healing materials are compelling candidates for stretchable devices because of their excellent compliance, extensibility, and self-restorability. However, most existing soft self-healing polymers suffer from crack propagation and irreversible fatigue failure due to easy breakage of their dynamic amorphous, low-energy polymer networks. Herein, inspired by distinct structure-property relationship of biological tissues, a supramolecular interfacial assembly strategy of preparing soft self-healing composites with unprecedented crack propagation resistance is proposed by structurally engineering preferentially aligned lamellar structures within a dynamic and superstretchable poly(urea-ureathane) matrix (which is elongated to 24 750× its original length). Such a design affords a world-record fracture energy (501.6 kJ m^-2 ), ultrahigh fatigue threshold (4064.1 J m^-2 ), and outstanding elastic restorability (dimensional recovery from 13 times elongation), and preserving low modulus (1.2 MPa), high stretchability (3200%), and high room-temperature self-healing efficiency (97%). Thereby, the resultant composite represents the best of its kind and even surpasses most biological tissues. The lamellar 2D transition-metal carbide/carbonitride (MXene) structure also leads to a relatively high in-plane thermal conductivity, enabling composites as stretchable thermoconductive skins applied in joints of robotics to thermal dissipation. The present work illustrates a viable approach how autonomous self-healing, crack tolerance, and fatigue resistance can be merged in future material design.

3D Graphene-Nanowire "Sandwich" Thermal Interface with Ultralow Resistance and Stiffness

Despite the recent advancements of passive and active cooling solutions for electronics, interfaces between materials have generally become crucial barriers for thermal transport because of intrinsic material dissimilarity and surface roughness at interfaces. We demonstrate a 3D graphene-nanowire "sandwich" thermal interface that enables an ultralow thermal resistance of ∼0.24 mm²·K/W that is about 1 order of magnitude smaller than those of solders and several orders of magnitude lower than those of thermal greases, gels, and epoxies, as well as a low elastic and shear moduli of ∼1 MPa like polymers and foams. The flexible 3D "sandwich" exhibits excellent long-term reliability with >1000 cycles over a broad temperature range from -55 °C to 125 °C. This nanostructured thermal interface material can greatly benefit a variety of electronic systems and devices by allowing them to operate at lower temperatures or at the same temperature but with higher performance and higher power density.

Two-Steps Method to Prepare Multilayer Sandwich Structure Carbon Fiber Composite with Thermal and Electrical Anisotropy and Electromagnetic Interference Shielding

Carbon fiber (CF) composites performance enhancement is a research hotspot at present. In this work, first, a sandwich structure composite, CF@(carbon nanotube/Fe₃O₄)/epoxy (CF@(CNT/Fe₃O₄)/EP), is prepared by the free arc dispersion-CFs surface spraying-rolling process method, herein, CFs in the middle layer and (CNT/Fe₃O₄)/EP as top and substrate layer. Then, CF@(CNT/Fe₃O₄)/EP (on both sides) and CFs (in the middle) are overlapped by structure design, forming a multilayer CF@(CNT/Fe₃O₄)/EP-CFs composite with a CFs core sheath. A small amount of CNT/Fe₃O₄ is consumed, (CNT/Fe₃O₄)/EP and CFs core sheath realize thermal and electrical anisotropy and directional enhancement, and multilayer sandwich structure makes the electromagnetic interference (EMI) shielding performance better strengthened by multiple absorption-reflection/penetration-reabsorption. From CF-0 to CF-8, CNT/Fe₃O₄ content only increases by 0.045 wt%, axial thermal conductivity (λ_‖) increases from 0.59 W/(m·K) to 1.1 W/(m·K), growth rate is 86%, radial thermal conductivity (λ_⟂) only increases by 0.05 W/(m·K), the maximum λ_‖/λ_⟂ is 2.9, axial electrical conductivity (σ_‖) increases from 6.2 S/cm to 7.7 S/cm, growth rate is 24%, radial electrical conductivity (σ_⟂) only increases by 0.7 × 10^-4 S/cm, the total EMI shielding effectiveness (EMI SE_T) increases by 196%, from 10.3 dB to 30.5 dB. This provides a new idea for enhancing CFs composite properties.

Reliability of printed stretchable electronics based on nano/micro materials for practical applications

Recent decades have witnessed the booming development of stretchable electronics based on nano/micro composite inks. Printing is a scalable, low-cost, and high-efficiency fabrication tool to realize stretchable electronics through additive processes. However, compared with conventional flexible electronics, stretchable electronics need to experience more severe mechanical deformation which may cause destructive damage. Most of the reported works in this field mainly focus on how to achieve a high stretchability of nano/micro composite conductors or single working modules/devices, with limited attention given to the reliability for practical applications. In this minireview, we summarized the failure modes when printing stretchable electronics using nano/micro composite ink, including dysfunction of the stretchable interconnects, the stress-concentrated rigid-soft interfaces for hybrid electronics, the vulnerable vias upon stretching, thermal accumulation, and environmental instability of stretchable materials. Strategies for tackling these challenges to realize reliable performances are proposed and discussed. Our review provides an overview on the importance of reliable, printable, and stretchable electronics, which are the key enablers in propelling stretchable electronics from fancy demos to practical applications.

Isotropically Ultrahigh Thermal Conductive Polymer Composites by Assembling Anisotropic Boron Nitride Nanosheets into a Biaxially Oriented Network

The demand for thermally conductive but electrically insulating materials has increased greatly in advanced electronic packaging. To this end, polymer-based composites filled with boron nitride (BN) nanosheets have been intensively studied as thermal interface material (TIM). However, it remains a great challenge to achieve isotropically ultrahigh thermal conductivity in BN/polymer composites due to the inherent thermal property anisotropy of BN nanosheets and/or the insufficient construction of the 3D thermal conductive network. Herein, we present a high-performance BN/polymer composite with a biaxially oriented thermal conductive network by a dendritic ice template. The composite exhibits both ultrahigh in-plane (∼39.0 W m^-1 K^-1) and through-plane thermal conductivity (∼11.5 W m^-1 K^-1) at 80 vol % BN loading, largely exceeding those of reported BN/polymer composites. In addition, our composite as a TIM shows higher cooling efficiency than that of commercial TIM with up to 15 °C reduction of the chip temperature and retains good thermal stability even after 1000 heating/cooling cycles. Our strategy represents an effective approach for developing advanced thermal interface materials, which are greatly demanded for advanced electronics and emerging areas like wearable electronics.

Multifunctional Epoxy-Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame Retardancy

The sharp reduction in size and increase in power density of next-generation integrated circuits lead to electromagnetic interference and heat failure being a key roadblock for their widespread applications in polymer-based electronic packaging materials. This work demonstrates a multifunctional epoxy-based composite (MDCF@LDH/EP) with high electromagnetic wave (EMW) absorption, thermal conductivity, and flame retardancy performance. In which, the synergistic effect of porous structure and heterointerface promotes the multiple reflection and absorption, and dielectric loss of EMW. A low reflection loss of -57.77 dB, and an effective absorption bandwidth of 7.20 GHz are achieved under the fillings of only 10 wt%. Meanwhile, a 241.4% enhanced thermal conductivity of EP is due to the high continuous 3D melamine-derived carbon foams (MDCF), which provides a broad path for the transport of phonons. In addition, MDCF@LDH/EP composite exhibits high thermal stability and flame retardancy, thanks to the physical barrier effect of MDCF@LDH combined with the high temperature cooling properties of NiAl-LDH-CO₃ ^2- . Compared with pure epoxy resin, the peak heat release rate and the total heat release rate are reduced by 19.4% and 30.7%, respectively. Such an excellent comprehensive performance enables MDCF@LDH/EP to a promising electronic packaging material.

Machine Learning for Harnessing Thermal Energy: From Materials Discovery to System Optimization

Recent advances in machine learning (ML) have impacted research communities based on statistical perspectives and uncovered invisibles from conventional standpoints. Though the field is still in the early stage, this progress has driven the thermal science and engineering communities to apply such cutting-edge toolsets for analyzing complex data, unraveling abstruse patterns, and discovering non-intuitive principles. In this work, we present a holistic overview of the applications and future opportunities of ML methods on crucial topics in thermal energy research, from bottom-up materials discovery to top-down system design across atomistic levels to multi-scales. In particular, we focus on a spectrum of impressive ML endeavors investigating the state-of-the-art thermal transport modeling (density functional theory, molecular dynamics, and Boltzmann transport equation), different families of materials (semiconductors, polymers, alloys, and composites), assorted aspects of thermal properties (conductivity, emissivity, stability, and thermoelectricity), and engineering prediction and optimization (devices and systems). We discuss the promises and challenges of current ML approaches and provide perspectives for future directions and new algorithms that could make further impacts on thermal energy research.

Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics

With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.

Flexible multifunctional platform based on piezoelectric acoustics for human-machine interaction and environmental perception

Flexible human-machine interfaces show broad prospects for next-generation flexible or wearable electronics compared with their currently available bulky and rigid counterparts. However, compared to their rigid counterparts, most reported flexible devices (e.g., flexible loudspeakers and microphones) show inferior performance, mainly due to the nature of their flexibility. Therefore, it is of great significance to improve their performance by developing and optimizing new materials, structures and design methodologies. In this paper, a flexible acoustic platform based on a zinc oxide (ZnO) thin film on an aluminum foil substrate is developed and optimized; this platform can be applied as a loudspeaker, a microphone, or an ambient sensor depending on the selection of its excitation frequencies. When used as a speaker, the proposed structure shows a high sound pressure level (SPL) of ~90 dB (with a standard deviation of ~3.6 dB), a low total harmonic distortion of ~1.41%, and a uniform directivity (with a standard deviation of ~4 dB). Its normalized SPL is higher than those of similar devices reported in the recent literature. When used as a microphone, the proposed device shows a precision of 98% for speech recognition, and the measured audio signals show a strong similarity to the original audio signals, demonstrating its equivalent performance compared to a rigid commercial microphone. As a flexible sensor, this device shows a high temperature coefficient of frequency of -289 ppm/K and good performance for respiratory monitoring.

AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics

Thermal management of flexible/stretchable electronics has been a crucial issue. Mass supernumerary thermal heat is created in the repetitive course of deformation because of the large nanocontact resistance between electric conductive fillers, as well as the interfacial resistance between fillers and the polymer matrix. Here, we report a stretchable thermoplastic polyurethane (TPU)-boron nitride nanosheet (BNNS) composite film with a high in-plane thermal conductivity based on an air/water interfacial (AWI) assembly method. In addition to rigid devices, it was capable for thermal management of flexible electronics. During more than 2000 cycles of the bending-releasing process, the average saturated surface temperature of the flexible conductor covered with composite film with 30 wt % BNNSs was approximately 40.8 ± 1 °C (10.5 °C lower than that with pure TPU). Moreover, the thermal dissipating property of the composite under stretching was measured. All the results prove that this TPU-BNNS composite film is a candidate for thermal management of next-generation flexible/stretchable electronics with high power density.

Self-Cooling Gallium-Based Transformative Electronics with a Radiative Cooler for Reliable Stiffness Tuning in Outdoor Use

Reconfigurability of a device that allows tuning of its shape and stiffness is utilized for personal electronics to provide an optimal mechanical interface for an intended purpose. Recent approaches in developing such transformative electronic systems (TES) involved the use of gallium liquid metal, which can change its liquid-solid phase by temperature to facilitate stiffness control of the device. However, the current design cannot withstand excessive heat during outdoor applications, leading to undesired softening of the device when the rigid mode of operation is favored. Here, a gallium-based TES integrated with a flexible and stretchable radiative cooler is presented, which offers zero-power thermal management for reliable rigid mode operation in the hot outdoors. The radiative cooler can both effectively reflect the heat transfer from the sun and emit thermal energy. It, therefore, allows a TES-in-the-air to maintain its temperature below the melting point of gallium (29.8 ℃) under hot weather with strong sun exposure, thus preventing unwanted softening of the device. Comprehensive studies on optical, thermal, and mechanical characteristics of radiative-cooler-integrated TES, along with a proof-of-concept demonstration in the hot outdoors verify the reliability of this design approach, suggesting the possibility of expanding the use of TES in various environments.

Interfacial Coordination Interaction Enables Soft Elastomer Composites High Thermal Conductivity and High Toughness

Soft elastomers have attracted wide applications, such as soft electronic devices and soft robotics, due to their ability to undergo large deformation with a small external force. Most elastomers suffer from poor toughness and thermal conductivity, which limits their use. The addition of inorganic fillers can enhance the thermal conductivity and toughness, but it deteriorates the softness (low Young's modulus and high stretchability). Integrating thermal conductivity, toughness, and softness into one elastomer is still a challenge. Here, we report a strategy of interfacial coordination interaction to achieve soft elastomer composites with high thermal conductivity and high toughness. We demonstrate the strategy by using poly(lipoic acid) elastomer and silver-coated aluminum filler as model, where silver-sulfur coordination cross-links are formed at the interface. The resultant elastomer composite shows high streachability (450%), high thermal conductivity (2.35 W m-1 K-1), low modulus (321 kPa), and high toughness (3496 J m-2), which cannot be achieve in existing elastomers. The time domain thermoreflectance technique demonstrates that the silver-sulfur coordination interaction lowers the interfacial thermal resistance, resulting in enhanced thermal conductivity of the elastomer composites. The excellent softness stems from lower bonding energy of the silver-sulfur coordination cross-links compared with covalent chemical cross-links. The high toughness also benefits from the interfacial silver-sulfur coordination interaction that can dissipate more energy upon deformation. We further demonstrate the potential application of the thermally conductive, tough, and soft elastomer composites for thermal management of chip and soft electronic devices.

Sandwich-Structured Flexible PVA/CS@MWCNTs Composite Films with High Thermal Conductivity and Excellent Electrical Insulation

High thermal conductivity polymer matrix composites have become an urgent need for the thermal management of modern electronic devices. However, increasing the thermal conductivity of polymer-based composites typically results in loss of lightweight, flexibility and electrical insulation. Herein, the polyvinyl alcohol (PVA)/PVA-chitosan-adsorbed multi-walled carbon nanotubes/PVA (PVA/CS@MWCNTs) composite films with a sandwich structure were designed and fabricated by a self-construction strategy inspired by the surface film formation of milk. The obtained film simultaneously possesses high thermal conductivity, electrical insulation, and excellent flexibility. In this particular structure, the uniform intermediate layer of PVA-CS@MWCNTs contributed to improving the thermal conductivity of composite films, and the PVA distributed on both sides of the sandwich structure maintains the electrical insulation of the films (superior electrical resistivity above 10¹² Ω·cm). It has been demonstrated that the fillers could be arranged in a horizontal direction during the scraping process. Thus, the obtained composite film exhibited high in-plane thermal conductivity of 5.312 W·m⁻¹·K⁻¹ at fairly low MWCNTs loading of 5 wt%, which increased by about 1190% compared with pure PVA (0.412 W·m⁻¹·K⁻¹). This work effectively realizes the combination of high thermal conductivity and excellent electrical insulation, which could greatly expand the application of polymer-based composite films in the area of thermal management.

Passive Ultra-Conductive Thermal Metamaterials

Ultra-conductive heat transport showcases significant potentials in popular thermal managements with convection, phase change, and heat source. However, it is captivated impossible for passive thermal manipulation, usually bounded by intrinsic thermal conductivities of natural materials, to outperform these active recipes in need of extra energy payload. Here, a robust recipe to create passive ultra-conductive thermal metamaterials consisting of nothing but bulk natural materials is reported. Thanks to the local thermal resistance regulation by vertical thermal transport channel, the proof-of-concept thermal metamaterials experimentally demonstrate extreme effective conductivity (1915 W m^-1  K^-1 ) solely with naturally occurring materials. The purely conductive modulation without any external energy is comparable to active counterparts, and further reveals its robustness and unexpected convenience. The findings construct a high-efficient paradigm of passive thermal management with ultra-conductive heat transport, and further hint potentials in other Laplace fields, e.g., DC and magnetostatics.

A van der Waals Ferroelectric Tunnel Junction for Ultrahigh-Temperature Operation Memory

Facing the constant scaling down and thus increasingly severe self-heating effect, developing ultrathin and heat-insensitive ferroelectric devices is essential for future electronics. However, conventional ultrathin ferroelectrics and most 2D ferroelectric materials (2DFMs) are not suitable for high-temperature operation due to their low Curie temperature. Here, by using few-layer α-In₂ Se₃ , a special 2DFM with high Curie temperature, van der Waals (vdW) ferroelectric tunnel junction (FTJ) memories that deliver outstanding and reliable performance at both room and high temperatures are constructed. The vdW FTJs offer a large on/off ratio of 10⁴ at room temperature and still reveal excellent on/off ratio at an ultrahigh temperature of 470 K, which will fail down other 2DFMs. Moreover, long retention and reliable cyclic endurance at high temperature are achieved, showing robust thermal stability of the vdW FTJ memory. The observations of this work demonstrate an exciting promise of α-In₂ Se₃ for reliable service in high temperature either from self-heating or harsh environments.

Temperature and interlayer coupling induced thermal transport across graphene/2D-SiC van der Waals heterostructure

Graphene based two-dimensional (2D) van der Waals (vdW) materials have attracted enormous attention because of their extraordinary physical properties. In this study, we explore the temperature and interlayer coupling induced thermal transport across the graphene/2D-SiC vdW interface using non-equilibrium molecular dynamics and transient pump probe methods. We find that the in-plane thermal conductivity κ deviates slightly from the 1/T law at high temperatures. A tunable κ is found with the variation of the interlayer coupling strength χ. The interlayer thermal resistance R across graphene/2D-SiC interface reaches 2.71 [Formula: see text] 10-7 [Formula: see text] at room temperature and χ = 1, and it reduces steadily with the elevation of system temperature and χ, demonstrating around 41% and 56% reduction with increasing temperature to 700 K and a χ of 25, respectively. We also elucidate the heat transport mechanism by estimating the in-plane and out-of-plane phonon modes. Higher phonon propagation possibility and Umklapp scattering across the interface at high temperatures and increased χ lead to the significant reduction of R. This work unveils the mechanism of heat transfer and interface thermal conductance engineering across the graphene/2D-SiC vdW heterostructure.

UV curing polyurethane–acrylate composites as full filling thermal interface materials

Thermally enhanced and insulating polyurethane acrylate composites can be used as fully filled TIMs by pre-filling and then UV curing.

Thermal management materials for energy-efficient and sustainable future buildings

Thermal management plays a key role in improving the energy efficiency and sustainability of future building envelopes. Here, we focus on the materials perspective and discuss the fundamental needs, current status, and future opportunities for thermal management of buildings. First, we identify the primary considerations and evaluation criteria for high-performance thermal materials. Second, state-of-the-art thermal materials are reviewed, ranging from conventional thermal insulating fiberglass, mineral wool, cellulose, and foams, to aerogels and mesoporous structures, as well as multifunctional thermal management materials. Further, recent progress on passive regulation and thermal energy storage systems are discussed, including sensible heat storage, phase change materials, and radiative cooling. Moreover, we discuss the emerging materials systems with tunable thermal and other physical properties that could potentially enable dynamic and interactive thermal management solutions for future buildings. Finally, we discuss the recent progress in theory and computational design from first-principles atomistic theory, molecular dynamics, to multiscale simulations and machine learning. We expect the rational design that combines data-driven computation and multiscale experiments could bridge the materials properties from microscopic to macroscopic scales and provide new opportunities in improving energy efficiency and enabling adaptive implementation per customized demand for future buildings.

A differential thin film resistance thermometry method for peak thermal conductivity measurements of high thermal conductivity crystals

High thermal conductivity materials are useful for thermal management applications and fundamental studies of phonon transport. Past measurements of several ultrahigh thermal conductivity materials were not able to obtain the peak thermal conductivity, which is expected to appear at a low temperature and contains insight into the competition between extrinsic phonon-defect and phonon-boundary scattering with intrinsic phonon-phonon processes. Here, we report a peak thermal conductivity measurement method based on differential Wheatstone bridge measurement of the small temperature drop between two thin film resistance thermometers patterned directly on the sample. With the use of a mesoscale silicon bar sample as the calibration standard, this method is able to obtain results that agree with past measurements of large bulk silicon crystals at high temperatures and first-principles calculation results that account for additional phonon-boundary scattering in the sample. The agreement demonstrates the accuracy of this measurement method for peak thermal conductivity measurements of high thermal conductivity materials.