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Luo Y, Abidian MR, Ahn JH, Akinwande D, Andrews AM, Antonietti M, Bao Z, Berggren M, Berkey CA, Bettinger CJ, Chen J, Chen P, Cheng W, Cheng X, Choi SJ, Chortos A, Dagdeviren C, Dauskardt RH, Di CA, Dickey MD, Duan X, Facchetti A, Fan Z, Fang Y, Feng J, Feng X, Gao H, Gao W, Gong X, Guo CF, Guo X, Hartel MC, He Z, Ho JS, Hu Y, Huang Q, Huang Y, Huo F, Hussain MM, Javey A, Jeong U, Jiang C, Jiang X, Kang J, Karnaushenko D, Khademhosseini A, Kim DH, Kim ID, Kireev D, Kong L, Lee C, Lee NE, Lee PS, Lee TW, Li F, Li J, Liang C, Lim CT, Lin Y, Lipomi DJ, Liu J, Liu K, Liu N, Liu R, Liu Y, Liu Y, Liu Z, Liu Z, Loh XJ, Lu N, Lv Z, Magdassi S, Malliaras GG, Matsuhisa N, Nathan A, Niu S, Pan J, Pang C, Pei Q, Peng H, Qi D, Ren H, Rogers JA, Rowe A, Schmidt OG, Sekitani T, Seo DG, Shen G, Sheng X, Shi Q, Someya T, Song Y, Stavrinidou E, Su M, Sun X, Takei K, Tao XM, Tee BCK, Thean AVY, Trung TQ, Wan C, Wang H, Wang J, Wang M, Wang S, Wang T, Wang ZL, Weiss PS, Wen H, Xu S, Xu T, Yan H, Yan X, Yang H, Yang L, Yang S, Yin L, Yu C, Yu G, Yu J, Yu SH, Yu X, Zamburg E, Zhang H, Zhang X, Zhang X, Zhang X, Zhang Y, Zhang Y, Zhao S, Zhao X, Zheng Y, Zheng YQ, Zheng Z, Zhou T, Zhu B, Zhu M, Zhu R, Zhu Y, Zhu Y, Zou G, Chen X. Technology Roadmap for Flexible Sensors. ACS NANO 2023; 17:5211-5295. [PMID: 36892156 DOI: 10.1021/acsnano.2c12606] [Citation(s) in RCA: 165] [Impact Index Per Article: 165.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity.
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Affiliation(s)
- Yifei Luo
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Mohammad Reza Abidian
- Department of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States
| | - Jong-Hyun Ahn
- School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
| | - Deji Akinwande
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Anne M Andrews
- Department of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Markus Antonietti
- Colloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany
| | - Zhenan Bao
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Magnus Berggren
- Laboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden
- Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC), SE-100 44 Stockholm, Sweden
| | - Christopher A Berkey
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Christopher John Bettinger
- Department of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States
| | - Jun Chen
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Peng Chen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Wenlong Cheng
- Nanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800
- Monash Institute of Medical Engineering, Monash University, Clayton, Australia3800
| | - Xu Cheng
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Seon-Jin Choi
- Division of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea
| | - Alex Chortos
- School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Canan Dagdeviren
- Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
| | - Reinhold H Dauskardt
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Chong-An Di
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States
| | - Xiangfeng Duan
- Department of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Antonio Facchetti
- Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States
| | - Zhiyong Fan
- Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
| | - Yin Fang
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Jianyou Feng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Xue Feng
- Laboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
| | - Huajian Gao
- School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Wei Gao
- Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States
| | - Xiwen Gong
- Department of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States
| | - Chuan Fei Guo
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China
| | - Xiaojun Guo
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
| | - Martin C Hartel
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Zihan He
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - John S Ho
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore
| | - Youfan Hu
- School of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China
| | - Qiyao Huang
- School of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Yu Huang
- Department of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Fengwei Huo
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China
| | - Muhammad M Hussain
- mmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Ali Javey
- Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States
- Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States
| | - Unyong Jeong
- Department of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea
| | - Chen Jiang
- Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
| | - Xingyu Jiang
- Department of Biomedical Engineering, Southern University of Science and Technology, No 1088, Xueyuan Road, Xili, Nanshan District, Shenzhen, Guangdong 518055, PR China
| | - Jiheong Kang
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Daniil Karnaushenko
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
| | | | - Dae-Hyeong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Il-Doo Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea
| | - Dmitry Kireev
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Lingxuan Kong
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Chengkuo Lee
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
- NUS Graduate School-Integrative Sciences and Engineering Programme (ISEP), National University of Singapore, Singapore 119077, Singapore
| | - Nae-Eung Lee
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Pooi See Lee
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Singapore-HUJ Alliance for Research and Enterprise (SHARE), Campus for Research Excellence and Technological Enterprise (CREATE), Singapore 138602, Singapore
| | - Tae-Woo Lee
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
- School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
- Institute of Engineering Research, Research Institute of Advanced Materials, Seoul National University, Soft Foundry, Seoul 08826, Republic of Korea
- Interdisciplinary Program in Bioengineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Fengyu Li
- College of Chemistry and Materials Science, Jinan University, Guangzhou, Guangdong 510632, China
| | - Jinxing Li
- Department of Biomedical Engineering, Department of Electrical and Computer Engineering, Neuroscience Program, BioMolecular Science Program, and Institute for Quantitative Health Science and Engineering, Michigan State University, East Lansing, Michigan 48823, United States
| | - Cuiyuan Liang
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Chwee Teck Lim
- Department of Biomedical Engineering, National University of Singapore, Singapore 117583, Singapore
- Mechanobiology Institute, National University of Singapore, Singapore 117411, Singapore
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 119276, Singapore
| | - Yuanjing Lin
- School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
| | - Darren J Lipomi
- Department of Nano and Chemical Engineering, University of California, San Diego, La Jolla, California 92093-0448, United States
| | - Jia Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Kai Liu
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Nan Liu
- Beijing Key Laboratory of Energy Conversion and Storage Materials, College of Chemistry, Beijing Normal University, Beijing 100875, PR China
| | - Ren Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Yuxin Liu
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Biomedical Engineering, N.1 Institute for Health, Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore 119077, Singapore
| | - Yuxuan Liu
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Zhiyuan Liu
- Neural Engineering Centre, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 518055
| | - Zhuangjian Liu
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xian Jun Loh
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Nanshu Lu
- Department of Aerospace Engineering and Engineering Mechanics, Department of Electrical and Computer Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Zhisheng Lv
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Shlomo Magdassi
- Institute of Chemistry and the Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
| | - George G Malliaras
- Electrical Engineering Division, Department of Engineering, University of Cambridge CB3 0FA, Cambridge United Kingdom
| | - Naoji Matsuhisa
- Institute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan
| | - Arokia Nathan
- Darwin College, University of Cambridge, Cambridge CB3 9EU, United Kingdom
| | - Simiao Niu
- Department of Biomedical Engineering, Rutgers University, Piscataway, New Jersey 08854, United States
| | - Jieming Pan
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
| | - Changhyun Pang
- School of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea
| | - Qibing Pei
- Department of Materials Science and Engineering, Department of Mechanical and Aerospace Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Huisheng Peng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Dianpeng Qi
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Huaying Ren
- Department of Chemistry and Biochemistry, University of California, Los Angeles, Los Angeles, California, 90095, United States
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
- Department of Materials Science and Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Departments of Electrical and Computer Engineering and Chemistry, and Department of Neurological Surgery, Northwestern University, Evanston, Illinois 60208, United States
| | - Aaron Rowe
- Becton, Dickinson and Company, 1268 N. Lakeview Avenue, Anaheim, California 92807, United States
- Ready, Set, Food! 15821 Ventura Blvd #450, Encino, California 91436, United States
| | - Oliver G Schmidt
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz 09107, Germany
- Nanophysics, Faculty of Physics, TU Dresden, Dresden 01062, Germany
| | - Tsuyoshi Sekitani
- The Institute of Scientific and Industrial Research (SANKEN), Osaka University, Osaka, Japan 5670047
| | - Dae-Gyo Seo
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Guozhen Shen
- School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China
| | - Xing Sheng
- Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Center for Flexible Electronics Technology, and IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, China
| | - Qiongfeng Shi
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
| | - Takao Someya
- Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan
| | - Yanlin Song
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Eleni Stavrinidou
- Laboratory of Organic Electronics, Department of Science and Technology, Linköping University, SE-601 74 Norrkoping, Sweden
| | - Meng Su
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Xuemei Sun
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Kuniharu Takei
- Department of Physics and Electronics, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan
| | - Xiao-Ming Tao
- Research Institute for Intelligent Wearable Systems, School of Fashion and Textiles, Hong Kong Polytechnic University, Hong Kong, China
| | - Benjamin C K Tee
- Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore
- iHealthtech, National University of Singapore, Singapore 119276, Singapore
| | - Aaron Voon-Yew Thean
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Tran Quang Trung
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Changjin Wan
- School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
| | - Huiliang Wang
- Department of Biomedical Engineering, University of Texas at Austin, Austin, Texas 78712, United States
| | - Joseph Wang
- Department of Nanoengineering, University of California, San Diego, California 92093, United States
| | - Ming Wang
- Frontier Institute of Chip and System, State Key Laboratory of Integrated Chip and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China
- the Shanghai Qi Zhi Institute, 41th Floor, AI Tower, No.701 Yunjin Road, Xuhui District, Shanghai 200232, China
| | - Sihong Wang
- Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, 60637, United States
| | - Ting Wang
- State Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Zhong Lin Wang
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China
- Georgia Institute of Technology, Atlanta, Georgia 30332-0245, United States
| | - Paul S Weiss
- California NanoSystems Institute, Department of Chemistry and Biochemistry, Department of Bioengineering, and Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Hanqi Wen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
- Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, China 314000
| | - Sheng Xu
- Department of Nanoengineering, Department of Electrical and Computer Engineering, Materials Science and Engineering Program, and Department of Bioengineering, University of California San Diego, La Jolla, California, 92093, United States
| | - Tailin Xu
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong, 518060, PR China
| | - Hongping Yan
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Xuzhou Yan
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Hui Yang
- Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Tianjin, China, 300072
| | - Le Yang
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Materials Science and Engineering, National University of Singapore (NUS), 9 Engineering Drive 1, #03-09 EA, Singapore 117575, Singapore
| | - Shuaijian Yang
- School of Biomedical Sciences, Faculty of Biological Sciences, University of Leeds, Leeds, LS2 9JT, United Kingdom
| | - Lan Yin
- School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, and Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
| | - Cunjiang Yu
- Department of Engineering Science and Mechanics, Department of Biomedical Engineering, Department of Material Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, 16802, United States
| | - Guihua Yu
- Materials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, 78712, United States
| | - Jing Yu
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Shu-Hong Yu
- Department of Chemistry, Institute of Biomimetic Materials and Chemistry, Hefei National Research Center for Physical Science at the Microscale, University of Science and Technology of China, Hefei 230026, China
| | - Xinge Yu
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Evgeny Zamburg
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Haixia Zhang
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Xiangyu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Xiaosheng Zhang
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
| | - Xueji Zhang
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong 518060, PR China
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Yu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Siyuan Zhao
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Xuanhe Zhao
- Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, United States
| | - Yuanjin Zheng
- Center for Integrated Circuits and Systems, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
| | - Yu-Qing Zheng
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Zijian Zheng
- Department of Applied Biology and Chemical Technology, Faculty of Science, Research Institute for Intelligent Wearable Systems, Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Tao Zhou
- Center for Neural Engineering, Department of Engineering Science and Mechanics, The Huck Institutes of the Life Sciences, Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Bowen Zhu
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou 310024, China
| | - Ming Zhu
- Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore
| | - Rong Zhu
- Department of Precision Instrument, Tsinghua University, Beijing 100084, China
| | - Yangzhi Zhu
- Terasaki Institute for Biomedical Innovation, Los Angeles, California, 90064, United States
| | - Yong Zhu
- Department of Mechanical and Aerospace Engineering, Department of Materials Science and Engineering, and Department of Biomedical Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Guijin Zou
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xiaodong Chen
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
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Yu K, He T. Silver-Nanowire-Based Elastic Conductors: Preparation Processes and Substrate Adhesion. Polymers (Basel) 2023; 15:polym15061545. [PMID: 36987325 PMCID: PMC10058989 DOI: 10.3390/polym15061545] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/17/2023] [Revised: 03/14/2023] [Accepted: 03/15/2023] [Indexed: 03/30/2023] Open
Abstract
The production of flexible electronic systems includes stretchable electrical interconnections and flexible electronic components, promoting the research and development of flexible conductors and stretchable conductive materials with large bending deformation or torsion resistance. Silver nanowires have the advantages of high conductivity, good transparency and flexibility in the development of flexible electronic products. In order to further prepare system-level flexible systems (such as autonomous full-software robots, etc.), it is necessary to focus on the conductivity of the system's composite conductor and the robustness of the system at the physical level. In terms of conductor preparation processes and substrate adhesion strategies, the more commonly used solutions are selected. Four kinds of elastic preparation processes (pretensioned/geometrically topological matrix, conductive fiber, aerogel composite, mixed percolation dopant) and five kinds of processes (coating, embedding, changing surface energy, chemical bond and force, adjusting tension and diffusion) to enhance the adhesion of composite conductors using silver nanowires as current-carrying channel substrates were reviewed. It is recommended to use the preparation process of mixed percolation doping and the adhesion mode of embedding/chemical bonding under non-special conditions. Developments in 3D printing and soft robots are also discussed.
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Affiliation(s)
- Kai Yu
- College of Mechanical and Electrical Engineering, Qingdao University, Qingdao 266071, China
| | - Tian He
- College of Mechanical and Electrical Engineering, Qingdao University, Qingdao 266071, China
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Li M, Chen D, Deng X, Xu B, Li M, Liang H, Wang M, Song G, Zhang T, Liu Y. Graded Mxene-Doped Liquid Metal as Adhesion Interface Aiming for Conductivity Enhancement of Hybrid Rigid-Soft Interconnection. ACS APPLIED MATERIALS & INTERFACES 2023. [PMID: 36893387 DOI: 10.1021/acsami.2c23002] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Hybrid rigid-soft electronic system combines the biocompatibility of stretchable electronics and the computing capacity of silicon-based chips, which has a chance to realize a comprehensive stretchable electronic system with perception, control, and algorithm in near future. However, a reliable rigid-soft interconnection interface is urgently required to ensure both the conductivity and stretchability under a large strain. To settle this demand, this paper proposes a graded Mxene-doped liquid metal (LM) method to achieve a stable solid-liquid composite interconnect (SLCI) between the rigid chip and stretchable interconnect lines. To overcome the surface tension of LM, a high-conductive Mxene is doped for the balance between adhesion and liquidity of LM. And the high-concentration doping could prevent the contact failure with chip pins, while the low-concentration doping tends to maintain the stretchability. Based on this dosage-graded interface structure, the solid light-emitting diode (LED) and other devices integrated into the stretchable hybrid electronic system could achieve an excellent conductivity insensitive to the exerted tensile strain. In addition, the hybrid electronic system is demonstrated for skin-mounted and tire-mounted temperature-test applications under the tensile strain up to 100%. This Mxene-doped LM method aims to obtain a robust interface between rigid components and flexible interconnects by attenuating the inherent Young's modulus mismatch between rigid and flexible systems and makes it a promising candidate for effective interconnection between solid electronics and soft electronics.
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Affiliation(s)
- Min Li
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Da Chen
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Xiupeng Deng
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Baochun Xu
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Mingyue Li
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Hongrui Liang
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Mengxin Wang
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Ge Song
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Tong Zhang
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Yijian Liu
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
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54
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Kim HJ, Jung D, Sunwoo SH, Jung S, Koo JH, Kim DH. Integration of Conductive Nanocomposites and Nanomembranes for High‐Performance Stretchable Conductors. ADVANCED NANOBIOMED RESEARCH 2023. [DOI: 10.1002/anbr.202200153] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 02/18/2023] Open
Affiliation(s)
- Hye Jin Kim
- Center for Nanoparticle Research Institute for Basic Science (IBS) Seoul 08826 Republic of Korea
- School of Chemical and Biological Engineering, and Institute of Chemical Processes Seoul National University Seoul 08826 Republic of Korea
| | - Dongjun Jung
- Center for Nanoparticle Research Institute for Basic Science (IBS) Seoul 08826 Republic of Korea
- School of Chemical and Biological Engineering, and Institute of Chemical Processes Seoul National University Seoul 08826 Republic of Korea
| | - Sung-Hyuk Sunwoo
- Center for Nanoparticle Research Institute for Basic Science (IBS) Seoul 08826 Republic of Korea
- Institute of Radiation Medicine Seoul National University Medical Research Center Seoul 03080 Republic of Korea
| | - Sonwoo Jung
- School of Chemical and Biological Engineering, and Institute of Chemical Processes Seoul National University Seoul 08826 Republic of Korea
| | - Ja Hoon Koo
- Center for Nanoparticle Research Institute for Basic Science (IBS) Seoul 08826 Republic of Korea
- School of Chemical and Biological Engineering, and Institute of Chemical Processes Seoul National University Seoul 08826 Republic of Korea
| | - Dae-Hyeong Kim
- Center for Nanoparticle Research Institute for Basic Science (IBS) Seoul 08826 Republic of Korea
- School of Chemical and Biological Engineering, and Institute of Chemical Processes Seoul National University Seoul 08826 Republic of Korea
- Department of Materials Science and Engineering Seoul National University Seoul 08826 Republic of Korea
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55
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Shen Q, Jiang M, Wang R, Song K, Vong MH, Jung W, Krisnadi F, Kan R, Zheng F, Fu B, Tao P, Song C, Weng G, Peng B, Wang J, Shang W, Dickey MD, Deng T. Liquid metal-based soft, hermetic, and wireless-communicable seals for stretchable systems. Science 2023; 379:488-493. [PMID: 36730410 DOI: 10.1126/science.ade7341] [Citation(s) in RCA: 23] [Impact Index Per Article: 23.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 02/04/2023]
Abstract
Soft materials tend to be highly permeable to gases, making it difficult to create stretchable hermetic seals. With the integration of spacers, we demonstrate the use of liquid metals, which show both metallic and fluidic properties, as stretchable hermetic seals. Such soft seals are used in both a stretchable battery and a stretchable heat transfer system that involve volatile fluids, including water and organic fluids. The capacity retention of the battery was ~72.5% after 500 cycles, and the sealed heat transfer system showed an increased thermal conductivity of approximately 309 watts per meter-kelvin while strained and heated. Furthermore, with the incorporation of a signal transmission window, we demonstrated wireless communication through such seals. This work provides a route to create stretchable yet hermetic packaging design solutions for soft devices.
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Affiliation(s)
- Qingchen Shen
- State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China.,Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC 27695, USA
| | - Modi Jiang
- State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China
| | - Ruitong Wang
- State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China
| | - Kexian Song
- State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China
| | - Man Hou Vong
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC 27695, USA
| | - Woojin Jung
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC 27695, USA
| | - Febby Krisnadi
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC 27695, USA
| | - Ruyu Kan
- State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China
| | - Feiyu Zheng
- State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China
| | - Benwei Fu
- State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China
| | - Peng Tao
- State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China
| | - Chengyi Song
- State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China
| | - Guoming Weng
- Shanghai Key Laboratory of Hydrogen Science, School of Materials Science and Engineering, Shanghai Jiao Tong University; Shanghai 200240, P. R. China
| | - Bo Peng
- Wanxiang A123-Global Headquarters, A123 Systems, Hangzhou 311215, P. R. China
| | - Jun Wang
- Research and Development Center, A123 Systems, Waltham, MA 02451, USA
| | - Wen Shang
- State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC 27695, USA
| | - Tao Deng
- State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, P. R. China.,Shanghai Key Laboratory of Hydrogen Science, School of Materials Science and Engineering, Shanghai Jiao Tong University; Shanghai 200240, P. R. China
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56
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Kim M, Lim H, Ko SH. Liquid Metal Patterning and Unique Properties for Next-Generation Soft Electronics. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2023; 10:e2205795. [PMID: 36642850 PMCID: PMC9951389 DOI: 10.1002/advs.202205795] [Citation(s) in RCA: 12] [Impact Index Per Article: 12.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/06/2022] [Revised: 11/27/2022] [Indexed: 05/28/2023]
Abstract
Room-temperature liquid metal (LM)-based electronics is expected to bring advancements in future soft electronics owing to its conductivity, conformability, stretchability, and biocompatibility. However, various difficulties arise when patterning LM because of its rheological features such as fluidity and surface tension. Numerous attempts are made to overcome these difficulties, resulting in various LM-patterning methods. An appropriate choice of patterning method based on comprehensive understanding is necessary to fully utilize the unique properties. Therefore, the authors aim to provide thorough knowledge about patterning methods and unique properties for LM-based future soft electronics. First, essential considerations for LM-patterning are investigated. Then, LM-patterning methods-serial-patterning, parallel-patterning, intermetallic bond-assisted patterning, and molding/microfluidic injection-are categorized and investigated. Finally, perspectives on LM-based soft electronics with unique properties are provided. They include outstanding features of LM such as conformability, biocompatibility, permeability, restorability, and recyclability. Also, they include perspectives on future LM-based soft electronics in various areas such as radio frequency electronics, soft robots, and heterogeneous catalyst. LM-based soft devices are expected to permeate the daily lives if patterning methods and the aforementioned features are analyzed and utilized.
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Affiliation(s)
- Minwoo Kim
- Applied Nano and Thermal Science LabDepartment of Mechanical EngineeringSeoul National University1 Gwanak‐ro, Gwanak‐guSeoul08826South Korea
| | - Hyungjun Lim
- Applied Nano and Thermal Science LabDepartment of Mechanical EngineeringSeoul National University1 Gwanak‐ro, Gwanak‐guSeoul08826South Korea
- Department of Mechanical EngineeringPohang University of Science and Technology77 Chungam‐ro, Nam‐guPohang37673South Korea
| | - Seung Hwan Ko
- Applied Nano and Thermal Science LabDepartment of Mechanical EngineeringSeoul National University1 Gwanak‐ro, Gwanak‐guSeoul08826South Korea
- Institute of Advanced Machinery and Design/Institute of Engineering ResearchSeoul National University1 Gwanak‐ro, Gwanak‐guSeoul08826South Korea
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57
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Chen S, Fan S, Qi J, Xiong Z, Qiao Z, Wu Z, Yeo JC, Lim CT. Ultrahigh Strain-Insensitive Integrated Hybrid Electronics Using Highly Stretchable Bilayer Liquid Metal Based Conductor. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2208569. [PMID: 36353902 DOI: 10.1002/adma.202208569] [Citation(s) in RCA: 12] [Impact Index Per Article: 12.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 09/18/2022] [Revised: 10/26/2022] [Indexed: 06/16/2023]
Abstract
Human-interfaced electronic systems require strain-resilient circuits. However, present integrated stretchable electronics easily suffer from electrical deterioration and face challenges in forming robust multilayered soft-rigid hybrid configurations. Here, a bilayer liquid-solid conductor (b-LSC) with amphiphilic properties is introduced to reliably interface with both rigid electronics and elastomeric substrates. The top liquid metal can self-solder its interface with rigid electronics at a resistance 30% lower than the traditional tin-soldered rigid interface. The bottom polar composite comprising liquid metal particles and polymers can not only reliably interface with elastomers but also help the b-LSC heal after breakage. The b-LSC can be scalably fabricated by printing and subsequent peeling strategies, showing ultra-high strain-insensitive conductivity (maximum 22 532 S cm-1 ), extreme stretchability (2260%), and negligible resistance change under ultra-high strain (0.34 times increase under 1000% strain). It can act as stretchable vertical interconnect access for connecting multilayered layouts and can be scalably and universally fabricated on various substrates with a resolution of ≈200 µm. It is demonstrated that it can construct stretchable sensor arrays, multi-layered stretchable displays, highly integrated haptic user-interactive optoelectric E-skins, visualized heaters, robot touch sensing systems, and wireless powering for wearable electronics.
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Affiliation(s)
- Shuwen Chen
- Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore, 119276, Singapore
| | - Shicheng Fan
- Department of Biomedical Engineering, National University of Singapore, Singapore, 117583, Singapore
| | - Jiaming Qi
- Department of Biomedical Engineering, National University of Singapore, Singapore, 117583, Singapore
| | - Ze Xiong
- Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore, 119276, Singapore
| | - Zheng Qiao
- Department of Biomedical Engineering, National University of Singapore, Singapore, 117583, Singapore
| | - Zixiong Wu
- Department of Biomedical Engineering, National University of Singapore, Singapore, 117583, Singapore
| | - Joo Chuan Yeo
- Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore, 119276, Singapore
| | - Chwee Teck Lim
- Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore, 119276, Singapore
- Department of Biomedical Engineering, National University of Singapore, Singapore, 117583, Singapore
- Mechanobiology Institute, National University of Singapore, Singapore, 117411, Singapore
- Institute for Functional Intelligent Materials, National University of Singapore, Singapore, 117544, Singapore
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58
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Wang L, Yi Z, Zhao Y, Liu Y, Wang S. Stretchable conductors for stretchable field-effect transistors and functional circuits. Chem Soc Rev 2023; 52:795-835. [PMID: 36562312 DOI: 10.1039/d2cs00837h] [Citation(s) in RCA: 5] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/24/2022]
Abstract
Stretchable electronics have received intense attention due to their broad application prospects in many areas, and can withstand large deformations and form close contact with curved surfaces. Stretchable conductors are vital components of stretchable electronic devices used in wearables, soft robots, and human-machine interactions. Recent advances in stretchable conductors have motivated basic scientific and technological research efforts. Here, we outline and analyse the development of stretchable conductors in transistors and circuits, and examine advances in materials, device engineering, and preparation technologies. We divide the existing approaches to constructing stretchable transistors with stretchable conductors into the following two types: geometric engineering and intrinsic stretchability engineering. Finally, we consider the challenges and outlook in this field for delivering stretchable electronics.
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Affiliation(s)
- Liangjie Wang
- Department of Materials Science, Fudan University, Shanghai 200433, P. R. China.
| | - Zhengran Yi
- Department of Materials Science, Fudan University, Shanghai 200433, P. R. China.
| | - Yan Zhao
- Department of Materials Science, Fudan University, Shanghai 200433, P. R. China.
| | - Yunqi Liu
- Department of Materials Science, Fudan University, Shanghai 200433, P. R. China.
| | - Shuai Wang
- Department of Materials Science, Fudan University, Shanghai 200433, P. R. China. .,School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, P. R. China.
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59
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Xu Y, Su Y, Xu X, Arends B, Zhao G, Ackerman DN, Huang H, Reid S, Santarpia JL, Kim C, Chen Z, Mahmoud S, Ling Y, Brown A, Chen Q, Huang G, Xie J, Yan Z. Porous liquid metal-elastomer composites with high leakage resistance and antimicrobial property for skin-interfaced bioelectronics. SCIENCE ADVANCES 2023; 9:eadf0575. [PMID: 36608138 PMCID: PMC9821854 DOI: 10.1126/sciadv.adf0575] [Citation(s) in RCA: 11] [Impact Index Per Article: 11.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 09/26/2022] [Accepted: 12/02/2022] [Indexed: 06/17/2023]
Abstract
Liquid metal-elastomer composite is a promising soft conductor for skin-interfaced bioelectronics, soft robots, and others due to its large stretchability, ultrasoftness, high electrical conductivity, and mechanical-electrical decoupling. However, it often suffers from deformation-induced leakage, which can smear skin, deteriorate device performance, and cause circuit shorting. Besides, antimicrobial property is desirable in soft conductors to minimize microbial infections. Here, we report phase separation-based synthesis of porous liquid metal-elastomer composites with high leakage resistance and antimicrobial property, together with large stretchability, tissue-like compliance, high and stable electrical conductivity over deformation, high breathability, and magnetic resonance imaging compatibility. The porous structures can minimize leakage through damping effects and lower percolation thresholds to reduce liquid metal usage. In addition, epsilon polylysine is loaded into elastic matrices during phase separation to provide antimicrobial property. The enabled skin-interfaced bioelectronics can monitor cardiac electrical and mechanical activities and offer electrical stimulations in a mechanically imperceptible and electrically stable manner even during motions.
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Affiliation(s)
- Yadong Xu
- Department of Biomedical, Biological and Chemical Engineering, University of Missouri, Columbia, MO 65211, USA
| | - Yajuan Su
- Department of Surgery-Transplant and Mary and Dick Holland Regenerative Medicine Program, University of Nebraska Medical Center, Omaha, NE 68198, USA
| | - Xianchen Xu
- Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO 65211, USA
| | - Brian Arends
- Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO 65211, USA
| | - Ganggang Zhao
- Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO 65211, USA
| | | | - Henry Huang
- School of Aeronautics and Astronautics, Purdue University, West Lafayette, IN 47907, USA
| | - St. Patrick Reid
- Department of Pathology and Microbiology, University of Nebraska Medical Center, Omaha, NE 68130, USA
| | - Joshua L. Santarpia
- Department of Pathology and Microbiology, University of Nebraska Medical Center, Omaha, NE 68130, USA
| | - Chansong Kim
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Zehua Chen
- Department of Biomedical, Biological and Chemical Engineering, University of Missouri, Columbia, MO 65211, USA
| | - Sana Mahmoud
- Department of Computer Science, North Carolina State University, Raleigh, NC 27695, USA
| | - Yun Ling
- Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO 65211, USA
| | - Alexander Brown
- Cognitive Neuroscience Systems Core, University of Missouri, Columbia, MO 65211, USA
| | - Qian Chen
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Guoliang Huang
- Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO 65211, USA
| | - Jingwei Xie
- Department of Surgery-Transplant and Mary and Dick Holland Regenerative Medicine Program, University of Nebraska Medical Center, Omaha, NE 68198, USA
| | - Zheng Yan
- Department of Biomedical, Biological and Chemical Engineering, University of Missouri, Columbia, MO 65211, USA
- Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO 65211, USA
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60
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Lv J, Thangavel G, Lee PS. Reliability of printed stretchable electronics based on nano/micro materials for practical applications. NANOSCALE 2023; 15:434-449. [PMID: 36515001 DOI: 10.1039/d2nr04464a] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/17/2023]
Abstract
Recent decades have witnessed the booming development of stretchable electronics based on nano/micro composite inks. Printing is a scalable, low-cost, and high-efficiency fabrication tool to realize stretchable electronics through additive processes. However, compared with conventional flexible electronics, stretchable electronics need to experience more severe mechanical deformation which may cause destructive damage. Most of the reported works in this field mainly focus on how to achieve a high stretchability of nano/micro composite conductors or single working modules/devices, with limited attention given to the reliability for practical applications. In this minireview, we summarized the failure modes when printing stretchable electronics using nano/micro composite ink, including dysfunction of the stretchable interconnects, the stress-concentrated rigid-soft interfaces for hybrid electronics, the vulnerable vias upon stretching, thermal accumulation, and environmental instability of stretchable materials. Strategies for tackling these challenges to realize reliable performances are proposed and discussed. Our review provides an overview on the importance of reliable, printable, and stretchable electronics, which are the key enablers in propelling stretchable electronics from fancy demos to practical applications.
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Affiliation(s)
- Jian Lv
- School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore.
- Singapore-HUJ Alliance for Research and Enterprise (SHARE), Smart Grippers for Soft Robotics (SGSR), Campus for Research Excellence and Technological Enterprise, Singapore 138602, Singapore
| | - Gurunathan Thangavel
- School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore.
| | - Pooi See Lee
- School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore.
- Singapore-HUJ Alliance for Research and Enterprise (SHARE), Smart Grippers for Soft Robotics (SGSR), Campus for Research Excellence and Technological Enterprise, Singapore 138602, Singapore
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61
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Cao J, Li X, Liu Y, Zhu G, Li RW. Liquid Metal-Based Electronics for On-Skin Healthcare. BIOSENSORS 2023; 13:bios13010084. [PMID: 36671919 PMCID: PMC9856137 DOI: 10.3390/bios13010084] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/18/2022] [Revised: 12/27/2022] [Accepted: 12/28/2022] [Indexed: 05/28/2023]
Abstract
Wearable devices are receiving growing interest in modern technologies for realizing multiple on-skin purposes, including flexible display, flexible e-textiles, and, most importantly, flexible epidermal healthcare. A 'BEER' requirement, i.e., biocompatibility, electrical elasticity, and robustness, is first proposed here for all the on-skin healthcare electronics for epidermal applications. This requirement would guide the designing of the next-generation on-skin healthcare electronics. For conventional stretchable electronics, the rigid conductive materials, e.g., gold nanoparticles and silver nanofibers, would suffer from an easy-to-fail interface with elastic substrates due to a Young's modulus mismatch. Liquid metal (LM) with high conductivity and stretchability has emerged as a promising solution for robust stretchable epidermal electronics. In addition, the fundamental physical, chemical, and biocompatible properties of LM are illustrated. Furthermore, the fabrication strategies of LM are outlined for pure LM, LM composites, and LM circuits based on the surface tension control. Five dominant epidermal healthcare applications of LM are illustrated, including electrodes, interconnectors, mechanical sensors, thermal management, and biomedical and sustainable applications. Finally, the key challenges and perspectives of LM are identified for the future research vision.
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Affiliation(s)
- Jinwei Cao
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
- Department of Mechanical, Materials and Manufacturing Engineering, University of Nottingham Ningbo China, Ningbo 315100, China
| | - Xin Li
- School of Integrated Circuits and Beijing National Research Centre for Information Science and Technology (BNRist), Tsinghua University, Beijing 100084, China
| | - Yiwei Liu
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
| | - Guang Zhu
- Department of Mechanical, Materials and Manufacturing Engineering, University of Nottingham Ningbo China, Ningbo 315100, China
| | - Run-Wei Li
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
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62
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Hu H, Huang H, Li M, Gao X, Yin L, Qi R, Wu RS, Chen X, Ma Y, Shi K, Li C, Maus TM, Huang B, Lu C, Lin M, Zhou S, Lou Z, Gu Y, Chen Y, Lei Y, Wang X, Wang R, Yue W, Yang X, Bian Y, Mu J, Park G, Xiang S, Cai S, Corey PW, Wang J, Xu S. A wearable cardiac ultrasound imager. Nature 2023; 613:667-675. [PMID: 36697864 PMCID: PMC9876798 DOI: 10.1038/s41586-022-05498-z] [Citation(s) in RCA: 74] [Impact Index Per Article: 74.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/11/2022] [Accepted: 10/31/2022] [Indexed: 01/26/2023]
Abstract
Continuous imaging of cardiac functions is highly desirable for the assessment of long-term cardiovascular health, detection of acute cardiac dysfunction and clinical management of critically ill or surgical patients1-4. However, conventional non-invasive approaches to image the cardiac function cannot provide continuous measurements owing to device bulkiness5-11, and existing wearable cardiac devices can only capture signals on the skin12-16. Here we report a wearable ultrasonic device for continuous, real-time and direct cardiac function assessment. We introduce innovations in device design and material fabrication that improve the mechanical coupling between the device and human skin, allowing the left ventricle to be examined from different views during motion. We also develop a deep learning model that automatically extracts the left ventricular volume from the continuous image recording, yielding waveforms of key cardiac performance indices such as stroke volume, cardiac output and ejection fraction. This technology enables dynamic wearable monitoring of cardiac performance with substantially improved accuracy in various environments.
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Affiliation(s)
- Hongjie Hu
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
| | - Hao Huang
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
| | - Mohan Li
- Department of Electrical and Computer Engineering, University of California San Diego, La Jolla, CA, USA
| | - Xiaoxiang Gao
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
| | - Lu Yin
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
| | - Ruixiang Qi
- Department of Computer Science and Engineering, University of California San Diego, La Jolla, CA, USA
| | - Ray S Wu
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
| | - Xiangjun Chen
- Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA
| | - Yuxiang Ma
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
- Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA
| | - Keren Shi
- Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA
- Materials Science and Engineering Program, University of California, Riverside, CA, USA
| | - Chenghai Li
- Department of Mechanical and Aerospace Engineering, University of California San Diego, La Jolla, CA, USA
| | - Timothy M Maus
- Department of Anesthesiology, University of California, San Diego Health Sulpizio Cardiovascular Center, La Jolla, CA, USA
| | - Brady Huang
- Department of Radiology, School of Medicine, University of California San Diego, La Jolla, CA, USA
| | - Chengchangfeng Lu
- Department of Electrical and Computer Engineering, University of California San Diego, La Jolla, CA, USA
| | - Muyang Lin
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
| | - Sai Zhou
- Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA
| | - Zhiyuan Lou
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
| | - Yue Gu
- Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA
- Department of Neurosurgery, Yale University, New Haven, CT, USA
| | - Yimu Chen
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
| | - Yusheng Lei
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
- Department of Chemical Engineering, Stanford University, Stanford, CA, USA
| | - Xinyu Wang
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
| | - Ruotao Wang
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
| | - Wentong Yue
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
| | - Xinyi Yang
- Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA
| | - Yizhou Bian
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
| | - Jing Mu
- Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA
| | - Geonho Park
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
| | - Shu Xiang
- Softsonics, Inc., San Diego, CA, USA
| | - Shengqiang Cai
- Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA
- Department of Mechanical and Aerospace Engineering, University of California San Diego, La Jolla, CA, USA
| | - Paul W Corey
- Department of Anesthesiology, Sharp Memorial Hospital, San Diego, CA, USA
| | - Joseph Wang
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA
- Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA
| | - Sheng Xu
- Department of Nanoengineering, University of California San Diego, La Jolla, CA, USA.
- Department of Electrical and Computer Engineering, University of California San Diego, La Jolla, CA, USA.
- Materials Science and Engineering Program, University of California San Diego, La Jolla, CA, USA.
- Department of Radiology, School of Medicine, University of California San Diego, La Jolla, CA, USA.
- Department of Bioengineering, University of California San Diego, La Jolla, CA, USA.
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63
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Jung W, Koirala GR, Lee JS, Kim JU, Park B, Jo YJ, Jeong C, Hong H, Kwon K, Ye YS, Kim J, Lee K, Kim TI. Solvent-Assisted Filling of Liquid Metal and Its Selective Dewetting for the Multilayered 3D Interconnect in Stretchable Electronics. ACS NANO 2022; 16:21471-21481. [PMID: 36453938 DOI: 10.1021/acsnano.2c09994] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/17/2023]
Abstract
As stretchable electronics are rapidly developing and becoming complex, the requirement for stretchable, multilayered, and large-area printed circuit boards (PCBs) is emerging. This demands a stretchable electrode and its vertical interconnect access (via) for 3-dimensional (3D) connectivity between layers. Here, we demonstrate solvent-assisted liquid metal (LM) filling into the submicrometer channel (∼400 nm), including via-hole filling and selective dewetting of LM. We provide the theoretical background of solvent-assisted LM filling and selective dewetting and reveal the osmotic pressure arising from anomalous mass transport phenomena, case II diffusion, which drives negative pressure, the spontaneous pulling of LM into the open channel. Also, we suggest design criteria for the geometry and dimension of LM interconnects to obtain structural stability without dewetting, based on the theoretical and computational background. We demonstrate a simple stretchable near-field communication (NFC) device including transferred micrometer-size light-emitting diodes (LEDs) with only 230 μm to the stretchable liquid metal PCB, without any soldering process. The device operates stably under repetitive stretching and releasing (∼50% uniaxial strain) due to the stable connection through the LM via between the upper and lower layers. Finally, we propose a concept for modular-type stretchable electronics, based on the cohesive liquid nature of LM. As a building block, the functional module can be easily removed from a mainframe, and replaced by another functional module, to suit user demand.
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Affiliation(s)
- Woojin Jung
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Gyan Raj Koirala
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Ju Seung Lee
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Jong Uk Kim
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Byeonghak Park
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Young Jin Jo
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Chanho Jeong
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Haeleen Hong
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Kiyoon Kwon
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Yeong-Sinn Ye
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Jiwon Kim
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Kanghyuk Lee
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Tae-Il Kim
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
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64
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Li G, Ma X, Xu Z, Shen Y, Yuan M, Huang J, Cole T, Wei J, Liu S, Han F, Li H, Bayinqiaoge, Xu Z, Tang SY, Liu Z. A crack compensation strategy for highly stretchable conductors based on liquid metal inclusions. iScience 2022; 25:105495. [PMID: 36419853 PMCID: PMC9676391 DOI: 10.1016/j.isci.2022.105495] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/22/2022] [Revised: 10/04/2022] [Accepted: 11/01/2022] [Indexed: 11/06/2022] Open
Abstract
Crack control strategies have been proven very useful for enhancing the stretchability of metal film-based stretchable conductors. However, existing strategies often suffer from the drawbacks of complicated preparation and predefined effective directions. Here, we propose a crack compensation strategy for preparing conductors featured with high stretchability by using liquid metal microparticles (LMMPs)-embedded polydimethylsiloxane (PDMS) as the substrate with a thin film of gold (Au) sputtered on the surface. LMMPs can be elongated to connect the cracked Au film upon stretching, which can form a conductive "island-tunnel" (IT) architecture to compensate for the cracks and maintain the conductivity. The high performance of the stretchable conductor is demonstrated by using it as electrodes to record surface electromyography of human brachioradialis and monitor electrocorticography signals of a rat in normal and epileptic states. The developed strategy shows the potential to provide a new perspective for the fabrication of flexible electronics.
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Affiliation(s)
- Guoqiang Li
- Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
- Department of Electronic Electrical and Systems Engineering, University of Birmingham, Edgbaston, Birmingham B15 2TT, UK
| | - Xing Ma
- Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
- Corresponding author
| | - Zirong Xu
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
| | - Yifeng Shen
- Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Man Yuan
- Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Jianping Huang
- Research Center for Neural Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
| | - Tim Cole
- Department of Electronic Electrical and Systems Engineering, University of Birmingham, Edgbaston, Birmingham B15 2TT, UK
| | - Jingjing Wei
- Research Center for Neural Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
| | - Sanhu Liu
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
| | - Fei Han
- Research Center for Neural Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
| | - Hanfei Li
- Research Center for Neural Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
| | - Bayinqiaoge
- Department of Electronic Electrical and Systems Engineering, University of Birmingham, Edgbaston, Birmingham B15 2TT, UK
| | - Zhiwu Xu
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
| | - Shi-Yang Tang
- Department of Electronic Electrical and Systems Engineering, University of Birmingham, Edgbaston, Birmingham B15 2TT, UK
- Corresponding author
| | - Zhiyuan Liu
- Research Center for Neural Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
- Corresponding author
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65
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Cao HL, Cai SQ. Recent advances in electronic skins: material progress and applications. Front Bioeng Biotechnol 2022; 10:1083579. [PMID: 36588929 PMCID: PMC9795216 DOI: 10.3389/fbioe.2022.1083579] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/29/2022] [Accepted: 11/29/2022] [Indexed: 12/15/2022] Open
Abstract
Electronic skins are currently in huge demand for health monitoring platforms and personalized medicine applications. To ensure safe monitoring for long-term periods, high-performance electronic skins that are softly interfaced with biological tissues are required. Stretchability, self-healing behavior, and biocompatibility of the materials will ensure the future application of electronic skins in biomedical engineering. This mini-review highlights recent advances in mechanically active materials and structural designs for electronic skins, which have been used successfully in these contexts. Firstly, the structural and biomechanical characteristics of biological skins are described and compared with those of artificial electronic skins. Thereafter, a wide variety of processing techniques for stretchable materials are reviewed, including geometric engineering and acquiring intrinsic stretchability. Then, different types of self-healing materials and their applications in electronic skins are critically assessed and compared. Finally, the mini-review is concluded with a discussion on remaining challenges and future opportunities for materials and biomedical research.
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66
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Zhang J, Hu Y, Zhang L, Zhou J, Lu A. Transparent, Ultra-Stretching, Tough, Adhesive Carboxyethyl Chitin/Polyacrylamide Hydrogel Toward High-Performance Soft Electronics. NANO-MICRO LETTERS 2022; 15:8. [PMID: 36477664 PMCID: PMC9729505 DOI: 10.1007/s40820-022-00980-9] [Citation(s) in RCA: 24] [Impact Index Per Article: 12.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Accepted: 11/22/2022] [Indexed: 05/23/2023]
Abstract
To date, hydrogels have gained increasing attentions as a flexible conductive material in fabricating soft electronics. However, it remains a big challenge to integrate multiple functions into one gel that can be used widely under various conditions. Herein, a kind of multifunctional hydrogel with a combination of desirable characteristics, including remarkable transparency, high conductivity, ultra-stretchability, toughness, good fatigue resistance, and strong adhesive ability is presented, which was facilely fabricated through multiple noncovalent crosslinking strategy. The resultant versatile sensors are able to detect both weak and large deformations, which owns a low detection limit of 0.1% strain, high stretchability up to 1586%, ultrahigh sensitivity with a gauge factor up to 18.54, as well as wide pressure sensing range (0-600 kPa). Meanwhile, the fabrication of conductive hydrogel-based sensors is demonstrated for various soft electronic devices, including a flexible human-machine interactive system, the soft tactile switch, an integrated electronic skin for unprecedented nonplanar visualized pressure sensing, and the stretchable triboelectric nanogenerators with excellent biomechanical energy harvesting ability. This work opens up a simple route for multifunctional hydrogel and promises the practical application of soft and self-powered wearable electronics in various complex scenes.
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Affiliation(s)
- Jipeng Zhang
- College of Chemistry and Molecular Sciences, Wuhan University, Wuhan, 430072, People's Republic of China
- Hubei Engineering Center of Natural Polymer-Based Medical Materials, Wuhan University, Wuhan, 430072, People's Republic of China
| | - Yang Hu
- College of Chemistry and Molecular Sciences, Wuhan University, Wuhan, 430072, People's Republic of China
- Hubei Engineering Center of Natural Polymer-Based Medical Materials, Wuhan University, Wuhan, 430072, People's Republic of China
| | - Lina Zhang
- College of Chemistry and Molecular Sciences, Wuhan University, Wuhan, 430072, People's Republic of China
- Hubei Engineering Center of Natural Polymer-Based Medical Materials, Wuhan University, Wuhan, 430072, People's Republic of China
| | - Jinping Zhou
- College of Chemistry and Molecular Sciences, Wuhan University, Wuhan, 430072, People's Republic of China
- Hubei Engineering Center of Natural Polymer-Based Medical Materials, Wuhan University, Wuhan, 430072, People's Republic of China
| | - Ang Lu
- College of Chemistry and Molecular Sciences, Wuhan University, Wuhan, 430072, People's Republic of China.
- Hubei Engineering Center of Natural Polymer-Based Medical Materials, Wuhan University, Wuhan, 430072, People's Republic of China.
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67
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Kim J, Kim M, Jung H, Park J, Jun BO, Kang B, Jang JE, Lee Y. High-Quality Microprintable and Stretchable Conductors for High-Performance 5G Wireless Communication. ACS APPLIED MATERIALS & INTERFACES 2022; 14:53250-53260. [PMID: 36382782 DOI: 10.1021/acsami.2c18424] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
With the advent of 5G wireless and Internet of Things technologies, flexible and stretchable printed circuit boards (PCBs) should be designed to address all the specifications necessary to receive signal transmissions, maintaining the signal integrity, and providing electrical connections. Here, we propose a silver nanoparticle (AgNP)/silver nanowire (AgNW) hybrid conductor and high-quality microprinting technology for fabricating flexible and stretchable PCBs in high-performance 5G wireless communication. A simple and low-cost reverse offset printing technique using a commercial adhesive hand-roller was adapted to ensure high-resolution and excellent pattern quality. The AgNP/AgNW micropatterns were fabricated in various line widths, from 5 μm to 5 mm. They exhibited excellent pattern qualities, such as fine line spacing, clear edge definition and outstanding pattern uniformity. After annealing via intense pulsed light irradiation, they showed outstanding electrical resistivity (15.7 μΩ cm). Moreover, they could withstand stretching up to a strain of 90% with a small change in resistance. As a demonstration of their practical application, the AgNP/AgNW micropatterns were used to fabricate 5G communication antennas that exhibited excellent wireless signal processing at operating frequencies in the C-band (4-8 GHz). Finally, a wearable sensor fabricated with these AgNP/AgNW micropatterns could successfully detected fine finger movements in real time with excellent sensitivity.
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Affiliation(s)
- Jongyoun Kim
- Department of Energy Science and Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), 333 Techno Jungang-daero, Hyeonpung-Eup, Dalseong-Gun, Daegu 42988, Republic of Korea
| | - Minkyoung Kim
- Department of Energy Science and Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), 333 Techno Jungang-daero, Hyeonpung-Eup, Dalseong-Gun, Daegu 42988, Republic of Korea
| | - Hyeonwoo Jung
- Department of Energy Science and Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), 333 Techno Jungang-daero, Hyeonpung-Eup, Dalseong-Gun, Daegu 42988, Republic of Korea
| | - Jaehyoung Park
- Department of Energy Science and Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), 333 Techno Jungang-daero, Hyeonpung-Eup, Dalseong-Gun, Daegu 42988, Republic of Korea
| | - Byoung Ok Jun
- Department of Electrical Engineering & Computer Science, Daegu Gyeongbuk Institute of Science and Technology (DGIST), 333 Techno Jungang-daero, Hyeonpung-Eup, Dalseong-Gun, Daegu 42988, Republic of Korea
| | - Byeongjae Kang
- Department of Energy Science and Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), 333 Techno Jungang-daero, Hyeonpung-Eup, Dalseong-Gun, Daegu 42988, Republic of Korea
| | - Jae Eun Jang
- Department of Electrical Engineering & Computer Science, Daegu Gyeongbuk Institute of Science and Technology (DGIST), 333 Techno Jungang-daero, Hyeonpung-Eup, Dalseong-Gun, Daegu 42988, Republic of Korea
| | - Youngu Lee
- Department of Energy Science and Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), 333 Techno Jungang-daero, Hyeonpung-Eup, Dalseong-Gun, Daegu 42988, Republic of Korea
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68
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Zhang J, Ma B, Chen G, Chen Y, Xu C, Hao Q, Zhao C, Liu H. Surface-Embedded Liquid Metal Electrodes with Abrasion Resistance via Direct Magnetic Printing. ACS APPLIED MATERIALS & INTERFACES 2022; 14:53405-53412. [PMID: 36382935 DOI: 10.1021/acsami.2c15282] [Citation(s) in RCA: 6] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
Gallium-based liquid metals (LMs) featuring both high conductivity and fluidity are ideal conductors for soft and stretchable electronics. However, their liquid nature is a double-edged sword in many key applications since LMs are inherently prone to mechanical damage. Although additional encapsulation is frequently used for the protection of delicate LM electrodes, it hinders the electrical interfacing with other objects for interconnection, sensing, and stimulation. Here, different from conventional patterning methods that deposit LM on or inside substrates, we for the first time report a simple strategy to create surface-embedded LM of eutectic gallium-indium (EGaIn) circuits with mechanical damage endurance. This was achieved by using direct magnetic printing to overcome the high surface tension of LM, allowing it to be passively filled into the laser-patterned microgrooves on soft substrates. We show that the surface-embedded LM circuits are resistant to mechanical erasure, washing, and peeling. We also show the applications of our surface-embedded LM electrodes in respiration monitoring and electrical stimulation of nerves. This work provides a simple and efficient way to create mechanically reliable LM microelectrodes, holding great promise for wearable and implantable bioelectronics.
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Affiliation(s)
- Jin Zhang
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Biao Ma
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Gangsheng Chen
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Yi Chen
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Chengtao Xu
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Qing Hao
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Chao Zhao
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Hong Liu
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
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69
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Huang Z, Lin Y. Transfer printing technologies for soft electronics. NANOSCALE 2022; 14:16749-16760. [PMID: 36353821 DOI: 10.1039/d2nr04283e] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
Soft electronics have received increasing attention in recent years, owing to their wide range of applications in dynamic nonplanar surface integration electronics that include skin electronics, implantable devices, and soft robotics. Transfer printing is a widely used assembly technology for micro- and nano-fabrication, which enables the integration of functional devices with flexible or elastomeric substrates for the manufacturing of soft electronics. Through advanced materials and process design, numerous impressive studies related to transfer printing strategies and applications have been proposed. Herein, a discussion of transfer printing technologies toward soft electronics in terms of mechanisms and example demonstrations is provided. Moreover, the perspectives on the potential challenges and future directions of this field are briefly discussed.
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Affiliation(s)
- Zhenlong Huang
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China.
- Shenzhen Institute for Advanced Study, University of Electronic Science and Technology of China, Shenzhen 518110, Guangdong, China
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China
- Research Centre for Information Technology, Shenzhen Institute of Information Technology, Shenzhen 518172, Guangdong, China
| | - Yuan Lin
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China.
- Shenzhen Institute for Advanced Study, University of Electronic Science and Technology of China, Shenzhen 518110, Guangdong, China
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China
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70
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Lee W, Kim H, Kang I, Park H, Jung J, Lee H, Park H, Park JS, Yuk JM, Ryu S, Jeong JW, Kang J. Universal assembly of liquid metal particles in polymers enables elastic printed circuit board. Science 2022; 378:637-641. [DOI: 10.1126/science.abo6631] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/12/2022]
Abstract
An elastic printed circuit board (E-PCB) is a conductive framework used for the facile assembly of system-level stretchable electronics. E-PCBs require elastic conductors that have high conductivity, high stretchability, tough adhesion to various components, and imperceptible resistance changes even under large strain. We present a liquid metal particle network (LMP
Net
) assembled by applying an acoustic field to a solid-state insulating liquid metal particle composite as the elastic conductor. The LMP
Net
conductor satisfies all the aforementioned requirements and enables the fabrication of a multilayered high-density E-PCB, in which numerous electronic components are intimately integrated to create highly stretchable skin electronics. Furthermore, we could generate the LMP
Net
in various polymer matrices, including hydrogels, self-healing elastomers, and photoresists, thus showing their potential for use in soft electronics.
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Affiliation(s)
- Wonbeom Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Hyunjun Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Inho Kang
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Hongjun Park
- Center for Nanomaterials and Chemical Reactions, Institute for Basic Science (IBS), Daejeon 34141, Republic of Korea
| | - Jiyoung Jung
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Haeseung Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Hyunchang Park
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Ji Su Park
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Jong Min Yuk
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Seunghwa Ryu
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Jae-Woong Jeong
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Jiheong Kang
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
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71
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Ko J, Kim C, Kim D, Song Y, Lee S, Yeom B, Huh J, Han S, Kang D, Koh JS, Cho J. High-performance electrified hydrogel actuators based on wrinkled nanomembrane electrodes for untethered insect-scale soft aquabots. Sci Robot 2022; 7:eabo6463. [DOI: 10.1126/scirobotics.abo6463] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/02/2022]
Abstract
Hydrogels have diverse chemical properties and can exhibit reversibly large mechanical deformations in response to external stimuli; these characteristics suggest that hydrogels are promising materials for soft robots. However, reported actuators based on hydrogels generally suffer from slow response speed and/or poor controllability due to intrinsic material limitations and electrode fabrication technologies. Here, we report a hydrogel actuator that operates at low voltages (<3 volts) with high performance (strain > 50%, energy density > 7 × 10
5
joules per cubic meter, and power density > 3 × 10
4
watts per cubic meter), surpassing existing hydrogel actuators and other types of electroactive soft actuators. The enhanced performance of our actuator is due to the formation of wrinkled nanomembrane electrodes that exhibit high conductivity and excellent mechanical deformation through capillary-assisted assembly of metal nanoparticles and deswelling-induced wrinkled structures. By applying an electric potential through the wrinkled nanomembrane electrodes that sandwich the hydrogel, we were able to trigger a reversible and substantial electroosmotic water flow inside a hydrogel film, which drove the controlled swelling of the hydrogel. The high energy efficiency and power density of our wrinkled nanomembrane electrode–induced actuator enabled the fabrication of an untethered insect-scale aquabot integrated with an on-board control unit demonstrating maneuverability with fast locomotion speed (1.02 body length per second), which occupies only 2% of the total mass of the robot.
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Affiliation(s)
- Jongkuk Ko
- Department of Chemical and Biological Engineering, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul 02841, Republic of Korea
| | - Changhwan Kim
- Department of Mechanical Engineering, Ajou University, 206 Worldcup-ro, Yeongtong-gu, Suwon 16499, Republic of Korea
| | - Dongjin Kim
- Department of Mechanical Engineering, Ajou University, 206 Worldcup-ro, Yeongtong-gu, Suwon 16499, Republic of Korea
| | - Yongkwon Song
- Department of Chemical and Biological Engineering, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul 02841, Republic of Korea
| | - Seokmin Lee
- Department of Chemical and Biological Engineering, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul 02841, Republic of Korea
| | - Bongjun Yeom
- Department of Chemical Engineering, Hanyang University, Seongdong-gu, Seoul 04763, Republic of Korea
| | - June Huh
- Department of Chemical and Biological Engineering, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul 02841, Republic of Korea
- Department of Life Sciences, Korea University, Seoul 02841, Republic of Korea
| | - Seungyong Han
- Department of Mechanical Engineering, Ajou University, 206 Worldcup-ro, Yeongtong-gu, Suwon 16499, Republic of Korea
| | - Daeshik Kang
- Department of Mechanical Engineering, Ajou University, 206 Worldcup-ro, Yeongtong-gu, Suwon 16499, Republic of Korea
| | - Je-Sung Koh
- Department of Mechanical Engineering, Ajou University, 206 Worldcup-ro, Yeongtong-gu, Suwon 16499, Republic of Korea
| | - Jinhan Cho
- Department of Chemical and Biological Engineering, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul 02841, Republic of Korea
- KU-KIST Graduate School of Converging Science and Technology, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul 02841, Republic of Korea
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72
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Chen S, Pan Q, Wu T, Xie H, Xue T, Su M, Song Y. Printing nanoparticle-based isotropic/anisotropic networks for directional electrical circuits. NANOSCALE 2022; 14:14956-14961. [PMID: 36178246 DOI: 10.1039/d2nr03892g] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
With the demand for integrated nanodevices, anisotropic conductive films are one type of interconnection structure for electronic components, which have been widely used for improving the integration of the system in printed circuit boards. This work presents a template-assisted printing strategy for the fabrication of nanoparticle-based networks with multi electrical properties. By manipulating the microfluid behavior under the guidance of the grid-shaped template, the continuity of liquid bridges can be precisely controlled in two directions. The isotropous circuits with crossbar paths, discrete paths as well as unidirectional paths are obtained, which achieve the switching of on/off states in the circuits. This work demonstrates a new type of directional circuits by the template-assisted printing method, which provides an effective fabrication strategy for electrical components and integrated systems.
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Affiliation(s)
- Sisi Chen
- Key Laboratory of Green Printing, CAS Research/Education Center for Excellence in Molecular Sciences, Institute of Chemistry, Chinese Academy of Sciences (ICCAS), Beijing Engineering Research Center of Nanomaterials for Green Printing Technology, Beijing National Laboratory for Molecular Sciences (BNLMS), Beijing 100190, P. R. China.
- University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Qi Pan
- Key Laboratory of Green Printing, CAS Research/Education Center for Excellence in Molecular Sciences, Institute of Chemistry, Chinese Academy of Sciences (ICCAS), Beijing Engineering Research Center of Nanomaterials for Green Printing Technology, Beijing National Laboratory for Molecular Sciences (BNLMS), Beijing 100190, P. R. China.
- University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Tingqing Wu
- Key Laboratory of Green Printing, CAS Research/Education Center for Excellence in Molecular Sciences, Institute of Chemistry, Chinese Academy of Sciences (ICCAS), Beijing Engineering Research Center of Nanomaterials for Green Printing Technology, Beijing National Laboratory for Molecular Sciences (BNLMS), Beijing 100190, P. R. China.
- University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Hongfei Xie
- Key Laboratory of Green Printing, CAS Research/Education Center for Excellence in Molecular Sciences, Institute of Chemistry, Chinese Academy of Sciences (ICCAS), Beijing Engineering Research Center of Nanomaterials for Green Printing Technology, Beijing National Laboratory for Molecular Sciences (BNLMS), Beijing 100190, P. R. China.
- University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Tangyue Xue
- Key Laboratory of Green Printing, CAS Research/Education Center for Excellence in Molecular Sciences, Institute of Chemistry, Chinese Academy of Sciences (ICCAS), Beijing Engineering Research Center of Nanomaterials for Green Printing Technology, Beijing National Laboratory for Molecular Sciences (BNLMS), Beijing 100190, P. R. China.
- School of Materials Science and Engineering, Zhengzhou University, Zhengzhou 450001, P. R. China
| | - Meng Su
- Key Laboratory of Green Printing, CAS Research/Education Center for Excellence in Molecular Sciences, Institute of Chemistry, Chinese Academy of Sciences (ICCAS), Beijing Engineering Research Center of Nanomaterials for Green Printing Technology, Beijing National Laboratory for Molecular Sciences (BNLMS), Beijing 100190, P. R. China.
- University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Yanlin Song
- Key Laboratory of Green Printing, CAS Research/Education Center for Excellence in Molecular Sciences, Institute of Chemistry, Chinese Academy of Sciences (ICCAS), Beijing Engineering Research Center of Nanomaterials for Green Printing Technology, Beijing National Laboratory for Molecular Sciences (BNLMS), Beijing 100190, P. R. China.
- University of Chinese Academy of Sciences, Beijing 100049, P. R. China
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73
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Yentes JM, Liu WY, Zhang K, Markvicka E, Rennard SI. Updated Perspectives on the Role of Biomechanics in COPD: Considerations for the Clinician. Int J Chron Obstruct Pulmon Dis 2022; 17:2653-2675. [PMID: 36274993 PMCID: PMC9585958 DOI: 10.2147/copd.s339195] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/10/2022] [Accepted: 09/24/2022] [Indexed: 11/05/2022] Open
Abstract
Patients with chronic obstructive pulmonary disease (COPD) demonstrate extra-pulmonary functional decline such as an increased prevalence of falls. Biomechanics offers insight into functional decline by examining mechanics of abnormal movement patterns. This review discusses biomechanics of functional outcomes, muscle mechanics, and breathing mechanics in patients with COPD as well as future directions and clinical perspectives. Patients with COPD demonstrate changes in their postural sway during quiet standing compared to controls, and these deficits are exacerbated when sensory information (eg, eyes closed) is manipulated. If standing balance is disrupted with a perturbation, patients with COPD are slower to return to baseline and their muscle activity is differential from controls. When walking, patients with COPD appear to adopt a gait pattern that may increase stability (eg, shorter and wider steps, decreased gait speed) in addition to altered gait variability. Biomechanical muscle mechanics (ie, tension, extensibility, elasticity, and irritability) alterations with COPD are not well documented, with relatively few articles investigating these properties. On the other hand, dyssynchronous motion of the abdomen and rib cage while breathing is well documented in patients with COPD. Newer biomechanical technologies have allowed for estimation of regional, compartmental, lung volumes during activity such as exercise, as well as respiratory muscle activation during breathing. Future directions of biomechanical analyses in COPD are trending toward wearable sensors, big data, and cloud computing. Each of these offers unique opportunities as well as challenges. Advanced analytics of sensor data can offer insight into the health of a system by quantifying complexity or fluctuations in patterns of movement, as healthy systems demonstrate flexibility and are thus adaptable to changing conditions. Biomechanics may offer clinical utility in prediction of 30-day readmissions, identifying disease severity, and patient monitoring. Biomechanics is complementary to other assessments, capturing what patients do, as well as their capability.
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Affiliation(s)
- Jennifer M Yentes
- Department of Kinesiology & Sport Management, Texas A&M University, College Station, TX, USA
| | - Wai-Yan Liu
- Department of Orthopaedic Surgery & Trauma, Máxima MC, Eindhoven, the Netherlands
- Department of Orthopaedic Surgery & Trauma, Catharina Hospital, Eindhoven, the Netherlands
| | - Kuan Zhang
- Department of Electrical & Computer Engineering, University of Nebraska at Lincoln, Lincoln, NE, USA
| | - Eric Markvicka
- Department of Electrical & Computer Engineering, University of Nebraska at Lincoln, Lincoln, NE, USA
- Department of Mechanical & Materials Engineering, University of Nebraska at Lincoln, Lincoln, NE, USA
| | - Stephen I Rennard
- Department of Internal Medicine, Division of Pulmonary, Critical Care and Sleep Medicine, University of Nebraska Medical Center, Omaha, NE, USA
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74
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Bioinspired Strategies for Stretchable Conductors. Chem Res Chin Univ 2022. [DOI: 10.1007/s40242-022-2236-1] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/03/2022]
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75
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Gan T, Xiao Q, Handschuh-Wang S, Huang X, Wang H, Deng X, Hu S, Wang B, Wu Q, Zhou X. Conformally Adhesive, Large-Area, Solidlike, yet Transient Liquid Metal Thin Films and Patterns via Gelatin-Regulated Droplet Deposition and Sintering. ACS APPLIED MATERIALS & INTERFACES 2022; 14:42744-42756. [PMID: 36068651 DOI: 10.1021/acsami.2c12880] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
Adhesion and spreading of liquid metals (LMs) on substrates are essential steps for the generation of flexible electronics and thermal management devices. However, the controlled deposition is limited by the high surface tension and peculiar wetting and adhesion behavior of LMs. Herein, we introduce gelatin-regulated LM droplet deposition and sintering (GLMDDS), for the upscalable production of conformally adhesive, solidlike, yet transient LM thin films and patterns on diverse substrates. This method involves four steps: homogeneous deposition of LM microdroplets, gelation of the LM-gelatin solution, toughening of the gelatin hydrogel by solvent displacement, and peeling-induced sintering of LM microdroplets. The LM thin film exhibits a three-layer structure, comprising an LM microdroplet-embedded tough organohydrogel adhesion layer, a continuous LM layer, and an oxide skin. The composite exhibits high stretchability and mechanical robustness, conformal adhesion to various substrates, high conductivity (4.35 × 105 S·m-1), and transience (86% LM recycled). Large-scale deposition (i.e., 5.6 dm2) and the potential for patterns on diverse substrates demonstrate its upscalability and broad suitability. Finally, the LM thin films and patterns are applied for flexible and wearable devices, i.e., pressure sensors, heaters, human motion tracking devices, and thermal management devices, illustrating the broad applicability of this strategy.
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Affiliation(s)
- Tiansheng Gan
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Qi Xiao
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Stephan Handschuh-Wang
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Xiaoqin Huang
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Haifei Wang
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Xiaobo Deng
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Shuangyan Hu
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Ben Wang
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Qixing Wu
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Xuechang Zhou
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
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76
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Cho C, Shin W, Kim M, Bang J, Won P, Hong S, Ko SH. Monolithically Programmed Stretchable Conductor by Laser-Induced Entanglement of Liquid Metal and Metallic Nanowire Backbone. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2022; 18:e2202841. [PMID: 35901286 DOI: 10.1002/smll.202202841] [Citation(s) in RCA: 11] [Impact Index Per Article: 5.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/08/2022] [Revised: 06/19/2022] [Indexed: 06/15/2023]
Abstract
Owing to its low mechanical compliance, liquid metal is intrinsically suitable for stretchable electronics and future wearable devices. However, its invariable strain-resistance behavior according to the strain-induced geometrical deformation and the difficulty of circuit patterning limit the extensive use of liquid metal, especially for strain-insensitive wiring purposes. To overcome these limitations, herein, novel liquid-metal-based electrodes of fragmented eutectic gallium-indium alloy (EGaIn) and Ag nanowire (NW) backbone of which their entanglement is controlled by the laser-induced photothermal reaction to enable immediate and direct patterning of the stretchable electrode with spatially programmed strain-resistance characteristics are developed. The coexistence of fragmented EGaIn and AgNW backbone, that is, a biphasic metallic composite (BMC), primarily supports the uniform and durable formation of target layers on stretchable substrates. The laser-induced photothermal reaction not only promotes the adhesion between the BMC layer and substrates but also alters the structure of laser-irradiated BMC. By controlling the degree of entanglement between fragmented EGaIn and AgNW, the initial conductivity and local gauge factor are regulated and the electrode becomes effectively insensitive to applied strain. As the configuration developed in this study is compatible with both regimes of electrodes, it can open new routes for the rapid creation of complex stretchable circuitry through a single process.
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Affiliation(s)
- Chulmin Cho
- Department of Mechanical Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, South Korea
- Mechatronics Research, Samsung Electronics, 1 Samsungjeonja-ro, Hwaseong-si, Gyeonggi-do, 18848, South Korea
| | - Wooseop Shin
- Department of Mechanical Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, South Korea
| | - Minwoo Kim
- Department of Mechanical Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, South Korea
| | - Junhyuk Bang
- Department of Mechanical Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, South Korea
| | - Phillip Won
- Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213, USA
| | - Sukjoon Hong
- Department of Mechanical Engineering, BK21 FOUR ERICA-ACE Center, Hanyang University, 55 Hanyangdaehak-ro, Sangnok-gu, Ansan, Gyeonggi-do, 15588, South Korea
| | - Seung Hwan Ko
- Department of Mechanical Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, South Korea
- Institute of Advanced Machines and Design/Institute of Engineering Research, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, South Korea
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77
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Guo R, Li T, Wu Z, Wan C, Niu J, Huo W, Yu H, Huang X. Thermal Transfer-Enabled Rapid Printing of Liquid Metal Circuits on Multiple Substrates. ACS APPLIED MATERIALS & INTERFACES 2022; 14:37028-37038. [PMID: 35938409 DOI: 10.1021/acsami.2c08743] [Citation(s) in RCA: 7] [Impact Index Per Article: 3.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
Low-cost, rapid patterning of liquid metal on various substrates is a key processing step for liquid metal-based soft electronics. Current patterning methods rely on expensive equipment and specific substrates, which severely limit their widespread applications. Based on surface adhesion adjustment of liquid metal through thermal transferring toner patterns, we present a universal printing technique of liquid metal circuits. Without using any expensive processing steps or equipment, the circuit patterns can be printed quickly on thermal transfer paper using a desktop laser printer, and a toner on the thermal transfer paper can be transferred to various smooth substrates and polymer-coated rough substrates. The technique has yielded liquid metal circuits with a minimum linewidth of 50 μm fabricated on various smooth, rough, and three-dimensional substrates with complex morphology. The liquid metal circuits can maintain their functions even under an extreme strain of 800%. Various circuits such as LED arrays, multiple sensors, a flexible display, a heating circuit, a radiofrequency identification circuit, and a 12-lead electrocardiogram circuit on various substrates have been demonstrated, indicating the great potential of such a technique to rapidly achieve large-area flexible circuits for wearable health monitoring, internet of things, and consumer electronics at low cost and high efficiency.
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Affiliation(s)
- Rui Guo
- Department of Biomedical Engineering, Tianjin University, 92 Weijin Road, Tianjin 300072, China
| | - Tianyu Li
- Department of Biomedical Engineering, Tianjin University, 92 Weijin Road, Tianjin 300072, China
| | - Ziyue Wu
- Department of Biomedical Engineering, Tianjin University, 92 Weijin Road, Tianjin 300072, China
| | - Chunxue Wan
- Department of Biomedical Engineering, Tianjin University, 92 Weijin Road, Tianjin 300072, China
| | - Jing Niu
- Department of Biomedical Engineering, Tianjin University, 92 Weijin Road, Tianjin 300072, China
| | - Wenxing Huo
- Department of Biomedical Engineering, Tianjin University, 92 Weijin Road, Tianjin 300072, China
| | - Haixia Yu
- Department of Biomedical Engineering, Tianjin University, 92 Weijin Road, Tianjin 300072, China
| | - Xian Huang
- Department of Biomedical Engineering, Tianjin University, 92 Weijin Road, Tianjin 300072, China
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78
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Abstract
Herein, we present the imbibition-induced, spontaneous, and selective wetting characteristics of gallium-based liquid metal alloys on a metallized surface with micro-scale topographical features. Gallium-based liquid metal alloys are fascinating materials that have enormous surface tension; therefore, they are difficult to pattern into films. The complete wetting of eutectic alloy of gallium and indium is realized on microstructured copper surfaces in the presence of HCl vapor, which removes the native oxide from the liquid metal alloy. This wetting is numerically explained based on the Wenzel’s model and imbibition process, revealing that the dimensions of the microstructures are critical for effective imbibition-driven wetting of the liquid metal. Further, we demonstrate that the spontaneous wetting of the liquid metal can be directed selectively along the microstructured region on the metallic surface to create patterns. This simple process enables the uniform coating and patterning of the liquid metal over large areas without an external force or complex processing. We demonstrate that the liquid metal-patterned substrates maintain electrical connection even in a stretched state and after repetitive stretching cycles. Liquid metals that have enormous surface tension are difficult to pattern into films. Here, authors report the spontaneous and selective wetting of a gallium-based liquid metal, which is induced by imbibition on a micro-structured metallized substrate.
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79
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Nie Z, Kwak JW, Han M, Rogers JA. Mechanically Active Materials and Devices for Bio-Interfaced Pressure Sensors-A Review. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022:e2205609. [PMID: 35951770 DOI: 10.1002/adma.202205609] [Citation(s) in RCA: 11] [Impact Index Per Article: 5.5] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/20/2022] [Revised: 07/31/2022] [Indexed: 06/15/2023]
Abstract
Pressures generated by external forces or by internal body processes represent parameters of critical importance in diagnosing physiological health and in anticipating injuries. Examples span intracranial hypertension from traumatic brain injuries, high blood pressure from poor diet, pressure-induced skin ulcers from immobility, and edema from congestive heart failure. Pressures measured on the soft surfaces of vital organs or within internal cavities of the body can provide essential insights into patient status and progression. Challenges lie in the development of high-performance pressure sensors that can softly interface with biological tissues to enable safe monitoring for extended periods of time. This review focuses on recent advances in mechanically active materials and structural designs for classes of soft pressure sensors that have proven uses in these contexts. The discussions include applications of such sensors as implantable and wearable systems, with various unique capabilities in wireless continuous monitoring, minimally invasive deployment, natural degradation in biofluids, and/or multiplexed spatiotemporal mapping. A concluding section summarizes challenges and future opportunities for this growing field of materials and biomedical research.
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Affiliation(s)
- Zhongyi Nie
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
| | - Jean Won Kwak
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Mengdi Han
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Departments of Biomedical Engineering, Materials Science and Engineering, Neurological Surgery, Chemistry, and Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, 60208, USA
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80
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Wang M, Wang K, Ma C, Uzabakiriho PC, Chen X, Zhao G. Mechanical Gradients Enable Highly Stretchable Electronics Based on Nanofiber Substrates. ACS APPLIED MATERIALS & INTERFACES 2022; 14:35997-36006. [PMID: 35894160 DOI: 10.1021/acsami.2c10245] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
Stretchable electronics play a pivotal role in the age of information and intelligence. Integrated circuit components are an integral part of high-performance and multifunctional stretchable electronic devices. Therefore, it is an ideal design concept for stretchable electronic devices to not only ensure the reliability of the connection between rigid inorganic electronic components and stretchable circuits but also maintain the stretchability of the device. In this work, we constructed a mechanical gradient strategy to fabricate high-performance stretchable electronic devices. Briefly, polyvinyl alcohol glue is used to fix integrated circuits on stretchable circuits, which are fabricated by printing liquid metal on a thermoplastic polyurethane nanofiber membrane. The strategy of integrated circuits (rigid)-polyvinyl alcohol glue (high elastic modulus)-thermoplastic polyurethane nanofiber membrane (low elastic modulus)-liquid metal (liquid) realizes the strain gradient during the stretching process of the device, thus ensuring the stability and reliability. Moreover, we explored the mechanism through experiments and finite element analysis. The flexible electronic devices fabricated by this scheme are not only ultra-stretchable (900%) but also have good stability and comfort. As proof, the application in stretchable sensors, human-computer interaction devices, and displays was realized.
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Affiliation(s)
- Meng Wang
- Department of Electronic Engineering and Information Science, University of Science and Technology of China, Hefei 230027, China
| | - Kai Wang
- Department of Electronic Engineering and Information Science, University of Science and Technology of China, Hefei 230027, China
| | - Chao Ma
- Department of Electronic Engineering and Information Science, University of Science and Technology of China, Hefei 230027, China
| | - Pierre Claver Uzabakiriho
- Department of Electronic Engineering and Information Science, University of Science and Technology of China, Hefei 230027, China
| | - Xi Chen
- College of Mathematics, Physics and Information Science and Engineering, Zhejiang Normal University, Jinhua 321004, China
| | - Gang Zhao
- Department of Electronic Engineering and Information Science, University of Science and Technology of China, Hefei 230027, China
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81
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Lee GH, Woo H, Yoon C, Yang C, Bae JY, Kim W, Lee DH, Kang H, Han S, Kang SK, Park S, Kim HR, Jeong JW, Park S. A Personalized Electronic Tattoo for Healthcare Realized by On-the-Spot Assembly of an Intrinsically Conductive and Durable Liquid-Metal Composite. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2204159. [PMID: 35702762 DOI: 10.1002/adma.202204159] [Citation(s) in RCA: 26] [Impact Index Per Article: 13.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/09/2022] [Revised: 05/31/2022] [Indexed: 06/15/2023]
Abstract
Conventional electronic (e-) skins are a class of thin-film electronics mainly fabricated in laboratories or factories, which is incapable of rapid and simple customization for personalized healthcare. Here a new class of e-tattoos is introduced that can be directly implemented on the skin by facile one-step coating with various designs at multi-scale depending on the purpose of the user without a substrate. An e-tattoo is realized by attaching Pt-decorated carbon nanotubes on gallium-based liquid-metal particles (CMP) to impose intrinsic electrical conductivity and mechanical durability. Tuning the CMP suspension to have low-zeta potential, excellent wettability, and high-vapor pressure enables conformal and intimate assembly of particles directly on the skin in 10 s. Low-cost, ease of preparation, on-skin compatibility, and multifunctionality of CMP make it highly suitable for e-tattoos. Demonstrations of electrical muscle stimulators, photothermal patches, motion artifact-free electrophysiological sensors, and electrochemical biosensors validate the simplicity, versatility, and reliability of the e-tattoo-based approach in biomedical engineering.
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Affiliation(s)
- Gun-Hee Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Heejin Woo
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Chanwoong Yoon
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Congqi Yang
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Jae-Young Bae
- Department of Materials Science and Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, Republic of Korea
| | - Wonsik Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Do Hoon Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Heemin Kang
- Department of Materials Science and Engineering, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
| | - Seungmin Han
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Seung-Kyun Kang
- Department of Materials Science and Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, Republic of Korea
| | - Seongjun Park
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
- KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Hyung-Ryong Kim
- Department of Pharmacology, College of Dentistry, Jeonbuk National University, 567 Baekje-daero, Jeonju, 54896, Republic of Korea
| | - Jae-Woong Jeong
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
- KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Steve Park
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
- KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
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82
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Shen Z, Zhang Z, Zhang N, Li J, Zhou P, Hu F, Rong Y, Lu B, Gu G. High-Stretchability, Ultralow-Hysteresis ConductingPolymer Hydrogel Strain Sensors for Soft Machines. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2203650. [PMID: 35726439 DOI: 10.1002/adma.202203650] [Citation(s) in RCA: 83] [Impact Index Per Article: 41.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/23/2022] [Revised: 06/05/2022] [Indexed: 05/27/2023]
Abstract
Highly stretchable strain sensors based on conducting polymer hydrogel are rapidly emerging as a promising candidate toward diverse wearable skins and sensing devices for soft machines. However, due to the intrinsic limitations of low stretchability and large hysteresis, existing strain sensors cannot fully exploit their potential when used in wearable or robotic systems. Here, a conducting polymer hydrogel strain sensor exhibiting both ultimate strain (300%) and negligible hysteresis (<1.5%) is presented. This is achieved through a unique microphase semiseparated network design by compositing poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS) nanofibers with poly(vinyl alcohol) (PVA) and facile fabrication by combining 3D printing and successive freeze-thawing. The overall superior performances of the strain sensor including stretchability, linearity, cyclic stability, and robustness against mechanical twisting and pressing are systematically characterized. The integration and application of such strain sensor with electronic skins are further demonstrated to measure various physiological signals, identify hand gestures, enable a soft gripper for objection recognition, and remote control of an industrial robot. This work may offer both promising conducting polymer hydrogels with enhanced sensing functionalities and technical platforms toward stretchable electronic skins and intelligent robotic systems.
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Affiliation(s)
- Zequn Shen
- Robotics Institute, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
- State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Zhilin Zhang
- Jiangxi Key Laboratory of Flexible Electronics, Flexible Electronics Innovation Institute, Jiangxi Science and Technology Normal University, Nanchang, 330013, China
| | - Ningbin Zhang
- Robotics Institute, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
- State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Jinhao Li
- Robotics Institute, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
- State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Peiwei Zhou
- Robotics Institute, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
- State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Faqi Hu
- Jiangxi Key Laboratory of Flexible Electronics, Flexible Electronics Innovation Institute, Jiangxi Science and Technology Normal University, Nanchang, 330013, China
| | - Yu Rong
- Robotics Institute, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
- State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Baoyang Lu
- Jiangxi Key Laboratory of Flexible Electronics, Flexible Electronics Innovation Institute, Jiangxi Science and Technology Normal University, Nanchang, 330013, China
| | - Guoying Gu
- Robotics Institute, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
- State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, 200240, China
- Meta Robotics Institute, Shanghai Jiao Tong University, Shanghai, 200240, China
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83
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Yoo J, Li S, Kim DH, Yang J, Choi MK. Materials and design strategies for stretchable electroluminescent devices. NANOSCALE HORIZONS 2022; 7:801-821. [PMID: 35686540 DOI: 10.1039/d2nh00158f] [Citation(s) in RCA: 6] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
Stretchable displays have recently received increasing attention as input and/or output interfaces for next-generation human-friendly electronic systems. Stretchable electroluminescent (EL) devices are a core component of stretchable displays, and they can be classified into two types, structurally stretchable EL devices and intrinsically stretchable EL devices, according to the mechanism for achieving their stretchability. We herein present recent advances in materials and design strategies for stretchable EL devices. First, stretchable devices based on ultrathin EL devices are introduced. Ultrathin EL devices are mechanically flexible like thin paper, and they can become stretchable through various structural engineering methods, such as inducing a buckled structure, employing interconnects with stretchable geometries, and applying origami/kirigami techniques. Secondly, intrinsically stretchable EL devices can be fabricated by using inherently stretchable electronic materials. For example, light-emitting electrochemical cells and EL devices with a simpler structure using alternating current have been developed. Furthermore, novel stretchable semiconductor materials have been presented for the development of intrinsically stretchable light-emitting diodes. After discussing these two types of stretchable EL devices, we briefly discuss applications of deformable EL devices and conclude the review.
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Affiliation(s)
- Jisu Yoo
- Department of Materials Science and Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, Republic of Korea.
| | - Shi Li
- Department of Energy Science and Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea.
| | - Dae-Hyeong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul 08826, Republic of Korea.
- School of Chemical and Biological Engineering, Institute of Chemical Process, Seoul National University, Seoul 08826, Republic of Korea
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Jiwoong Yang
- Department of Energy Science and Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea.
- Energy Science and Engineering Research Center, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea
| | - Moon Kee Choi
- Department of Materials Science and Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, Republic of Korea.
- Graduate School of Semiconductor Materials and Devices Engineering, Center for Future Semiconductor Technology (FUST), Ulsan National Institute of Science and Technology (UNIST), Ulsan 44919, Republic of Korea
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84
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Wu H, Huang Y, Yin Z. Flexible hybrid electronics: Enabling integration techniques and applications. SCIENCE CHINA. TECHNOLOGICAL SCIENCES 2022; 65:1995-2006. [PMID: 35892001 PMCID: PMC9302228 DOI: 10.1007/s11431-022-2074-8] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/31/2022] [Accepted: 05/05/2022] [Indexed: 06/15/2023]
Abstract
The conventional electronic systems enabled by rigid electronic are prone to malfunction under deformation, greatly limiting their application prospects. As an emerging platform for applications in healthcare monitoring and human-machine interface (HMI), flexible electronics have attracted growing attention due to its remarkable advantages, such as stretchability, flexibility, conformability, and wearing comfort. However, to realize the overall electronic systems, rigid components are also required for functions such as signal acquisition and transmission. Therefore, flexible hybrid electronics (FHE), which simultaneously possesses the desirable flexibility and enables the integration of rigid components for functionality, has been emerging as a promising strategy. This paper reviews the enabling integration techniques for FHE, including technologies for two-dimensional/three-dimensional (2D/3D) interconnects, bonding of rigid integrated circuit (IC) chips to soft substrate, stress-isolation structures, and representative applications of FHE. In addition, future challenges and opportunities involved in FHE-based systems are also discussed.
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Affiliation(s)
- Hao Wu
- Flexible Electronics Research Center, State Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074 China
| | - YongAn Huang
- Flexible Electronics Research Center, State Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074 China
| | - ZhouPing Yin
- Flexible Electronics Research Center, State Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074 China
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85
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Wang T, Yang Y, Xu F. Mechanics of tension-induced film wrinkling and restabilization: a review. Proc Math Phys Eng Sci 2022; 478:20220149. [DOI: 10.1098/rspa.2022.0149] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/04/2022] [Accepted: 05/24/2022] [Indexed: 11/12/2022] Open
Abstract
Wrinkling of thin films under tension is omnipresent in nature and modern industry, a phenomenon which has aroused considerable attention during the past two decades because of its intricate nonlinear behaviours and intriguing morphology changes. Here, we review recent advancements in the mechanics of tension-induced film wrinkling and restabilization, by identifying three major stages of its progress: small-strain (less than
5
%
) wrinkling of stiff sheets, finite-strain (up to
30
%
) wrinkling and restabilization (isola-centre bifurcation) of soft films, and the effects of curved configurations and material properties on pattern formation. Growing demand for fundamental understanding, quantitative prediction and precise tracking of secondary bifurcation transitions in morphological evolution of thin films helps to advance finite-strain plate/shell theories and sophisticated modelling methods. This progress not only promotes our insightful understanding of complex instability behaviour but also reveals novel phenomena and sheds light on developing wrinkle-tunable membrane structures and functional surfaces.
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Affiliation(s)
- Ting Wang
- Institute of Mechanics and Computational Engineering, Department of Aeronautics and Astronautics, Fudan University, 220 Handan Road, Shanghai 200433, People’s Republic of China
| | - Yifan Yang
- Institute of Mechanics and Computational Engineering, Department of Aeronautics and Astronautics, Fudan University, 220 Handan Road, Shanghai 200433, People’s Republic of China
| | - Fan Xu
- Institute of Mechanics and Computational Engineering, Department of Aeronautics and Astronautics, Fudan University, 220 Handan Road, Shanghai 200433, People’s Republic of China
- Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai 200433, People’s Republic of China
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86
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Sanchez-Botero L, Shah DS, Kramer-Bottiglio R. Are Liquid Metals Bulk Conductors? ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2109427. [PMID: 35293649 DOI: 10.1002/adma.202109427] [Citation(s) in RCA: 6] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/19/2021] [Revised: 02/01/2022] [Indexed: 06/14/2023]
Abstract
Stretchable electronics have potential in wide-reaching applications including wearables, personal health monitoring, and soft robotics. Many recent advances in stretchable electronics leverage liquid metals, particularly eutectic gallium-indium (EGaIn). A variety of EGaIn electromechanical behaviors have been reported, ranging from bulk conductor responses to effectively strain-insensitive responses. However, numerous measurement techniques have been used throughout the literature, making it difficult to directly compare the various proposed formulations. Here, the electromechanical responses of EGaIn found in the literature is reviewed and pure EGaIn is investigated using three electrical resistance measurement techniques: four point probe, two point probe, and Wheatstone bridge. The results indicate substantial differences in measured electromechanical behavior between the three methods, which can largely be accounted for by correcting for a fixed offset corresponding to the resistances of various parts of the measurement circuits. Yet, even accounting for several of these sources of experimental error, the average relative change in resistance of EGaIn is found to be lower than that predicted by the commonly used bulk conductor assumption, referred to as Pouillet's law. Building upon recent theories proposed in the literature, possible explanations for the discrepancies are discussed. Finally, suggestions are provided on experimental design to enable reproducible and interpretable research.
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Affiliation(s)
- Lina Sanchez-Botero
- School of Engineering & Applied Science, Yale University, New Haven, CT, 06511, USA
| | - Dylan S Shah
- School of Engineering & Applied Science, Yale University, New Haven, CT, 06511, USA
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87
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Lv Z, Wang C, Wan C, Wang R, Dai X, Wei J, Xia H, Li W, Zhang W, Cao S, Zhang F, Yang H, Loh XJ, Chen X. Strain-Driven Auto-Detachable Patterning of Flexible Electrodes. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2202877. [PMID: 35638695 DOI: 10.1002/adma.202202877] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/29/2022] [Revised: 05/11/2022] [Indexed: 06/15/2023]
Abstract
Flexible electrodes that are multilayer, multimaterial, and conformal are pivotal for multifunctional wearable electronics. Traditional electronic circuits manufacturing requires substrate-supported transfer printing, which limits their multilayer integrity and device conformability on arbitrary surfaces. Herein, a "shrinkage-assisted patterning by evaporation" (SHAPE) method is reported, by employing evaporation-induced interfacial strain mismatch, to fabricate auto-detachable, freestanding, and patternable electrodes. The SHAPE method utilizes vacuum-filtration of polyaniline/bacterial cellulose (PANI/BC) ink through a masked filtration membrane to print high-resolution, patterned, and multilayer electrodes. The strong interlayer hydrogen bonding ensures robust multilayer integrity, while the controllable evaporative shrinking property of PANI/BC induces mismatch between the strains of the electrode and filtration membrane at the interface and thus autodetachment of electrodes. Notably, a 500-layer substrateless micro-supercapacitor fabricated using the SHAPE method exhibits an energy density of 350 mWh cm-2 at a power density of 40 mW cm-2 , 100 times higher than reported substrate-confined counterparts. Moreover, a digital circuit fabricated using the SHAPE method functions stably on a deformed glove, highlighting the broad wearable applications of the SHAPE method.
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Affiliation(s)
- Zhisheng Lv
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis, #08-03, Singapore, 138634, Singapore
| | - Changxian Wang
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Changjin Wan
- School of Electronic Science & Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210023, P. R. China
- Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Optoelectronic Engineering, Shenzhen University, Shenzhen, 518060, P. R. China
| | - Renheng Wang
- Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Optoelectronic Engineering, Shenzhen University, Shenzhen, 518060, P. R. China
| | - Xiangyu Dai
- Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Optoelectronic Engineering, Shenzhen University, Shenzhen, 518060, P. R. China
| | - Jiaqi Wei
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Huarong Xia
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Wenlong Li
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis, #08-03, Singapore, 138634, Singapore
| | - Wei Zhang
- Innovation Center for Chemical Science, College of Chemistry, Chemical Engineering and Materials Science, Soochow University, Suzhou, 215123, P. R. China
| | - Shengkai Cao
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis, #08-03, Singapore, 138634, Singapore
| | - Feilong Zhang
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Haiyue Yang
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
| | - Xian Jun Loh
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis, #08-03, Singapore, 138634, Singapore
| | - Xiaodong Chen
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis, #08-03, Singapore, 138634, Singapore
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Singapore
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88
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Yi B, Ai L, Hou C, Lv D, Cao C, Yao X. Liquid Metal Nanoparticles as a Highly Efficient Photoinitiator to Develop Multifunctional Hydrogel Composites. ACS APPLIED MATERIALS & INTERFACES 2022; 14:29315-29323. [PMID: 35699106 DOI: 10.1021/acsami.2c07507] [Citation(s) in RCA: 6] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
Liquid metal (LM) composites are a class of emerging soft multifunctional materials that are promising for a variety of applications, yet the chemistry properties of LM have not been fully understood. Here, we report that LM nanoparticles can directly perform as a photoinitiator for radical polymerization and the in situ development of highly tough and multifunctional LM hydrogel composites. It is revealed that the photocatalytic activity of LM nanoparticles originates from the oxide layer on LM. Significantly, positively charged metal-organic framework (MOF) nanoparticles are used to stabilize LM nanoparticles in aqueous solutions, where the MOF can anchor on the surface of LM nanoparticles by electrostatic interaction while helping to preserve the unshielded oxide layer, therefore realizing the highly efficient photoinitiation and polymerization. The LM nanoparticle-initiated photopolymerization is shown to develop hydrogel composites featuring excellent stretchability, stimuli responsiveness, and sustained photocatalytic activity. The photocatalytic polymerization initiated by LM nanoparticles not only deepens the understanding on the semiconductor properties of the oxide skin on LM but also broadens the application scenarios of multifunctional LM/polymer composites in smart materials, wearable electronics, and soft robotics.
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Affiliation(s)
- Bo Yi
- School of Biomedical Sciences and Engineering, Guangzhou International Campus, South China University of Technology, Guangzhou 511442, P.R. China
- Department of Biomedical Sciences, City University of Hong Kong, Hong Kong 999077, P.R. China
| | - Liqing Ai
- Department of Biomedical Sciences, City University of Hong Kong, Hong Kong 999077, P.R. China
| | - Changshun Hou
- Department of Biomedical Sciences, City University of Hong Kong, Hong Kong 999077, P.R. China
| | - Dong Lv
- Department of Biomedical Sciences, City University of Hong Kong, Hong Kong 999077, P.R. China
| | - Chunyan Cao
- Department of Biomedical Sciences, City University of Hong Kong, Hong Kong 999077, P.R. China
| | - Xi Yao
- Department of Biomedical Sciences, City University of Hong Kong, Hong Kong 999077, P.R. China
- City University of Hong Kong Shenzhen Research Institute, Shenzhen 518000, P.R. China
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89
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Veerapandian S, Kim W, Kim J, Jo Y, Jung S, Jeong U. Printable inks and deformable electronic array devices. NANOSCALE HORIZONS 2022; 7:663-681. [PMID: 35660837 DOI: 10.1039/d2nh00089j] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
Deformable printed electronic array devices are expected to revolutionize next-generation electronics. However, although remarkable technological advances in printable inks and deformable electronic array devices have recently been achieved, technical challenges remain to commercialize these technologies. In this review article a brief introduction to printing methods highlighting significant research studies on ink formation for conductors, semiconductors, and insulators is provided, and the structural design and successful printing strategies of deformable electronic array devices are described. Successful device demonstrations are presented in the applications of passive- and active-matrix array devices. Finally, perspectives and technological challenges to be achieved are pointed out to print practically available deformable devices.
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Affiliation(s)
- Selvaraj Veerapandian
- Department of Materials Science and Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Nam-Gu, Pohang 37673, Republic of Korea.
| | - Woojo Kim
- Department of Convergence IT Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Nam-Gu, Pohang 37673, Republic of Korea
| | - Jaehyun Kim
- Department of Materials Science and Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Nam-Gu, Pohang 37673, Republic of Korea.
| | - Youngmin Jo
- Department of Convergence IT Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Nam-Gu, Pohang 37673, Republic of Korea
| | - Sungjune Jung
- Department of Materials Science and Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Nam-Gu, Pohang 37673, Republic of Korea.
- Department of Convergence IT Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Nam-Gu, Pohang 37673, Republic of Korea
| | - Unyong Jeong
- Department of Materials Science and Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Nam-Gu, Pohang 37673, Republic of Korea.
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90
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Hao XP, Zhang CW, Zhang XN, Hou LX, Hu J, Dickey MD, Zheng Q, Wu ZL. Healable, Recyclable, and Multifunctional Soft Electronics Based on Biopolymer Hydrogel and Patterned Liquid Metal. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2022; 18:e2201643. [PMID: 35532205 DOI: 10.1002/smll.202201643] [Citation(s) in RCA: 4] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/28/2022] [Revised: 04/14/2022] [Indexed: 06/14/2023]
Abstract
Recent years have witnessed the rapid development of sustainable materials. Along this line, developing biodegradable or recyclable soft electronics is challenging yet important due to their versatile applications in biomedical devices, soft robots, and wearables. Although some degradable bulk hydrogels are directly used as the soft electronics, the sensing performances are usually limited due to the absence of distributed conducting circuits. Here, sustainable hydrogel-based soft electronics (HSE) are reported that integrate sensing elements and patterned liquid metal (LM) in the gelatin-alginate hybrid hydrogel. The biopolymer hydrogel is transparent, robust, resilient, and recyclable. The HSE is multifunctional; it can sense strain, temperature, heart rate (electrocardiogram), and pH. The strain sensing is sufficiently sensitive to detect a human pulse. In addition, the device serves as a model system for iontophoretic drug delivery by using patterned LM as the soft conductor and electrode. Noncontact detection of nearby objects is also achieved based on electrostatic-field-induced voltage. The LM and biopolymer hydrogel are healable, recyclable, and degradable, favoring sustainable applications and reconstruction of the device with new functions. Such HSE with multiple functions and favorable attributes should open opportunities in next-generation electronic skins and hydrogel machines.
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Affiliation(s)
- Xing Peng Hao
- Ministry of Education Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Zhejiang University, Hangzhou, 310027, China
| | - Chuan Wei Zhang
- Ministry of Education Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Zhejiang University, Hangzhou, 310027, China
| | - Xin Ning Zhang
- Ministry of Education Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Zhejiang University, Hangzhou, 310027, China
| | - Li Xin Hou
- Ministry of Education Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Zhejiang University, Hangzhou, 310027, China
| | - Jian Hu
- State Key Laboratory for Strength and Vibration of Mechanical Structures, Department of Engineering Mechanics, Xi'an Jiaotong University, Xi'an, 710049, China
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC, 27695, USA
| | - Qiang Zheng
- Ministry of Education Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Zhejiang University, Hangzhou, 310027, China
| | - Zi Liang Wu
- Ministry of Education Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Zhejiang University, Hangzhou, 310027, China
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91
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Jung D, Lim C, Park C, Kim Y, Kim M, Lee S, Lee H, Kim JH, Hyeon T, Kim DH. Adaptive Self-Organization of Nanomaterials Enables Strain-Insensitive Resistance of Stretchable Metallic Nanocomposites. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2200980. [PMID: 35388541 DOI: 10.1002/adma.202200980] [Citation(s) in RCA: 25] [Impact Index Per Article: 12.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/29/2022] [Revised: 03/30/2022] [Indexed: 06/14/2023]
Abstract
Highly conductive and stretchable nanocomposites are promising material candidates for skin electronics. However, the resistance of stretchable metallic nanocomposites highly depends on external strains, often deteriorating the performance of fabricated electronic devices. Here, a material strategy for the highly conductive and stretchable nanocomposites comprising metal nanomaterials of various dimensions and a viscoelastic block-copolymer matrix is presented. The resistance of the nanocomposites can be well retained under skin deformations (<50% strain). It is demonstrated that silver nanomaterials can self-organize inside the viscoelastic media in response to external strain when their surface is conjugated with 1-decanethiol. Distinct self-organization behaviors associated with nanomaterial dimensions and strain conditions are found. Adopting the optimum composition of 0D/1D/2D silver nanomaterials can render the resistance of the nanocomposites insensitive to uniaxial or biaxial strains. As a result, the resistance can be maintained with a variance of < 1% during 1000 stretching cycles under uniaxial and biaxial strains of <50% while a high conductivity of ≈31 000 S cm-1 is achieved.
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Affiliation(s)
- Dongjun Jung
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul, 08826, Republic of Korea
- School of Chemical and Biological Engineering, and Institute of Chemical Processes, Seoul National University, Seoul, 08826, Republic of Korea
| | - Chaehong Lim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul, 08826, Republic of Korea
- School of Chemical and Biological Engineering, and Institute of Chemical Processes, Seoul National University, Seoul, 08826, Republic of Korea
| | - Chansul Park
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul, 08826, Republic of Korea
- School of Chemical and Biological Engineering, and Institute of Chemical Processes, Seoul National University, Seoul, 08826, Republic of Korea
| | - Yeongjun Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul, 08826, Republic of Korea
- School of Chemical and Biological Engineering, and Institute of Chemical Processes, Seoul National University, Seoul, 08826, Republic of Korea
| | - Minseong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul, 08826, Republic of Korea
- School of Chemical and Biological Engineering, and Institute of Chemical Processes, Seoul National University, Seoul, 08826, Republic of Korea
| | - Seunghwan Lee
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul, 08826, Republic of Korea
- School of Chemical and Biological Engineering, and Institute of Chemical Processes, Seoul National University, Seoul, 08826, Republic of Korea
| | - Hyunjin Lee
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul, 08826, Republic of Korea
- School of Chemical and Biological Engineering, and Institute of Chemical Processes, Seoul National University, Seoul, 08826, Republic of Korea
| | - Jeong Hyun Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul, 08826, Republic of Korea
| | - Taeghwan Hyeon
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul, 08826, Republic of Korea
- School of Chemical and Biological Engineering, and Institute of Chemical Processes, Seoul National University, Seoul, 08826, Republic of Korea
| | - Dae-Hyeong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), Seoul, 08826, Republic of Korea
- School of Chemical and Biological Engineering, and Institute of Chemical Processes, Seoul National University, Seoul, 08826, Republic of Korea
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92
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Tissue Adhesive, Conductive, and Injectable Cellulose Hydrogel Ink for On-Skin Direct Writing of Electronics. Gels 2022; 8:gels8060336. [PMID: 35735680 PMCID: PMC9222510 DOI: 10.3390/gels8060336] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/25/2022] [Revised: 05/17/2022] [Accepted: 05/24/2022] [Indexed: 12/18/2022] Open
Abstract
Flexible and soft bioelectronics used on skin tissue have attracted attention for the monitoring of human health. In addition to typical metal-based rigid electronics, soft polymeric materials, particularly conductive hydrogels, have been actively developed to fabricate biocompatible electrical circuits with a mechanical modulus similar to biological tissues. Although such conductive hydrogels can be wearable or implantable in vivo without any tissue damage, there are still challenges to directly writing complex circuits on the skin due to its low tissue adhesion and heterogeneous mechanical properties. Herein, we report cellulose-based conductive hydrogel inks exhibiting strong tissue adhesion and injectability for further on-skin direct printing. The hydrogels consisting of carboxymethyl cellulose, tannic acid, and metal ions (e.g., HAuCl4) were crosslinked via multiple hydrogen bonds between the cellulose backbone and tannic acid and metal-phenol coordinate network. Owing to this reversible non-covalent crosslinking, the hydrogels showed self-healing properties and reversible conductivity under cyclic strain from 0 to 400%, as well as printability on the skin tissue. In particular, the on-skin electronic circuit printed using the hydrogel ink maintained a continuous electrical flow under skin deformation, such as bending and twisting, and at high relative humidity of 90%. These printable and conductive hydrogels are promising for implementing structurally complicated bioelectronics and wearable textiles.
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93
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Lee GH, Lee YR, Kim H, Kwon DA, Kim H, Yang C, Choi SQ, Park S, Jeong JW, Park S. Rapid meniscus-guided printing of stable semi-solid-state liquid metal microgranular-particle for soft electronics. Nat Commun 2022; 13:2643. [PMID: 35551193 PMCID: PMC9098628 DOI: 10.1038/s41467-022-30427-z] [Citation(s) in RCA: 29] [Impact Index Per Article: 14.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 12/07/2021] [Accepted: 04/28/2022] [Indexed: 12/14/2022] Open
Abstract
Liquid metal is being regarded as a promising material for soft electronics owing to its distinct combination of high electrical conductivity comparable to that of metals and exceptional deformability derived from its liquid state. However, the applicability of liquid metal is still limited due to the difficulty in simultaneously achieving its mechanical stability and initial conductivity. Furthermore, reliable and rapid patterning of stable liquid metal directly on various soft substrates at high-resolution remains a formidable challenge. In this work, meniscus-guided printing of ink containing polyelectrolyte-attached liquid metal microgranular-particle in an aqueous solvent to generate semi-solid-state liquid metal is presented. Liquid metal microgranular-particle printed in the evaporative regime is mechanically stable, initially conductive, and patternable down to 50 μm on various substrates. Demonstrations of the ultrastretchable (~500% strain) electrical circuit, customized e-skin, and zero-waste ECG sensor validate the simplicity, versatility, and reliability of this manufacturing strategy, enabling broad utility in the development of advanced soft electronics. In this article, meniscus-guided printing of polyelectrolyte-attached liquid metal particles to simultaneously achieve mechanical stability and initial electrical conductivity at high resolution is introduced.
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Affiliation(s)
- Gun-Hee Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.,School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Ye Rim Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Hanul Kim
- Department of Chemical and Biomolecular Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Do A Kwon
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Hyeonji Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Congqi Yang
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Siyoung Q Choi
- Department of Chemical and Biomolecular Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.,KAIST Institute for the NanoCentury, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Republic of Korea
| | - Seongjun Park
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.,KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Jae-Woong Jeong
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea. .,KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.
| | - Steve Park
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea. .,KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.
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94
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Haake A, Tutika R, Schloer GM, Bartlett MD, Markvicka EJ. On-Demand Programming of Liquid Metal-Composite Microstructures through Direct Ink Write 3D Printing. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2200182. [PMID: 35353948 DOI: 10.1002/adma.202200182] [Citation(s) in RCA: 16] [Impact Index Per Article: 8.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/07/2022] [Revised: 03/23/2022] [Indexed: 06/14/2023]
Abstract
Soft, elastically deformable composites with liquid metal (LM) droplets can enable new generations of soft electronics, robotics, and reconfigurable structures. However, techniques to control local composite microstructure, which ultimately governs material properties and performance, is lacking. Here a direct ink writing technique is developed to program the LM microstructure (i.e., shape, orientation, and connectivity) on demand throughout elastomer composites. In contrast to inks with rigid particles that have fixed shape and size, it is shown that emulsion inks with LM fillers enable in situ control of microstructure. This enables filaments, films, and 3D structures with unique LM microstructures that are generated on demand and locked in during printing. This includes smooth and discrete transitions from spherical to needle-like droplets, curvilinear microstructures, geometrically complex embedded inclusion patterns, and connected LM networks. The printed materials are soft (modulus < 200 kPa), highly deformable (>600 % strain), and can be made locally insulating or electrically conductive using a single ink by controlling the process conditions. These capabilities are demonstrated by embedding elongated LM droplets in a soft heat sink, which rapidly dissipates heat from high-power LEDs. These programmable microstructures can enable new composite paradigms for emerging technologies that demand mechanical compliance with multifunctional response.
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Affiliation(s)
- Aaron Haake
- Department of Mechanical & Materials Engineering, Smart Materials & Robotics Lab, University of Nebraska-Lincoln, Lincoln, NE, 68588, USA
| | - Ravi Tutika
- Department of Mechanical Engineering, Soft Materials and Structures Lab, Virginia Tech, Blacksburg, VA, 24060, USA
- Macromolecules Innovation Institute, Virginia Tech, Blacksburg, VA, 24060, USA
| | - Gwyneth M Schloer
- Department of Mechanical Engineering, Soft Materials and Structures Lab, Virginia Tech, Blacksburg, VA, 24060, USA
| | - Michael D Bartlett
- Department of Mechanical Engineering, Soft Materials and Structures Lab, Virginia Tech, Blacksburg, VA, 24060, USA
- Macromolecules Innovation Institute, Virginia Tech, Blacksburg, VA, 24060, USA
| | - Eric J Markvicka
- Department of Mechanical & Materials Engineering, Smart Materials & Robotics Lab, University of Nebraska-Lincoln, Lincoln, NE, 68588, USA
- Department of Electrical & Computer Engineering, University of Nebraska-Lincoln, Lincoln, NE, 68588, USA
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95
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Heng W, Solomon S, Gao W. Flexible Electronics and Devices as Human-Machine Interfaces for Medical Robotics. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2107902. [PMID: 34897836 PMCID: PMC9035141 DOI: 10.1002/adma.202107902] [Citation(s) in RCA: 107] [Impact Index Per Article: 53.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/02/2021] [Revised: 12/08/2021] [Indexed: 05/02/2023]
Abstract
Medical robots are invaluable players in non-pharmaceutical treatment of disabilities. Particularly, using prosthetic and rehabilitation devices with human-machine interfaces can greatly improve the quality of life for impaired patients. In recent years, flexible electronic interfaces and soft robotics have attracted tremendous attention in this field due to their high biocompatibility, functionality, conformability, and low-cost. Flexible human-machine interfaces on soft robotics will make a promising alternative to conventional rigid devices, which can potentially revolutionize the paradigm and future direction of medical robotics in terms of rehabilitation feedback and user experience. In this review, the fundamental components of the materials, structures, and mechanisms in flexible human-machine interfaces are summarized by recent and renowned applications in five primary areas: physical and chemical sensing, physiological recording, information processing and communication, soft robotic actuation, and feedback stimulation. This review further concludes by discussing the outlook and current challenges of these technologies as a human-machine interface in medical robotics.
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Affiliation(s)
- Wenzheng Heng
- Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, CA, 91125, USA
| | - Samuel Solomon
- Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, CA, 91125, USA
| | - Wei Gao
- Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, CA, 91125, USA
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96
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Wang J, Fukuda K, Inoue D, Hashizume D, Sun L, Xiong S, Yokota T, Someya T. Solution-Processed Electron-Transport Layer-free Organic Photovoltaics with Liquid Metal Cathodes. ACS APPLIED MATERIALS & INTERFACES 2022; 14:14165-14173. [PMID: 35298152 DOI: 10.1021/acsami.1c24235] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/14/2023]
Abstract
Flexible, lightweight, and large-area solar cells provide new power supply opportunities in the renewable energy field and facilitate the supply of power to internet-of-things devices and wearable devices. The choice of printing process technologies is a key parameter for such flexible power sources because of their energy-saving process technology and high throughput rate. In addition to selecting the appropriate printing method for the active and charge transport layers, the development of printed electrodes is critical. Numerous printable materials have been developed to replace conventional evaporated top electrodes. However, achieving fully solution-processed organic photovoltaics (OPVs) with power conversion efficiency (PCE) comparable to OPVs with vacuum-deposited transparent and top electrodes is challenging. This is because of the difficulty of forming a uniform interface between the top solution-processed electrode and the active layers while preventing deterioration. In this study, an electron transport layer-free, eutectic gallium-indium (EGaIn) top-cathode strategy was developed and a record PCE of 12.7% in fully solution-processed, flexible OPVs was achieved. Direct coating of EGaIn on the active layer, in a nitrogen atmosphere, is conducive for energy band matching and obtaining physically perfect interfaces without any penetrations or voids. An average PCE of 14.1% and enhanced operating stability, comparable to conventional OPVs, were achieved with indium tin oxide transparent electrodes by eliminating the electron-transport layer. The fully solution-processed flexible OPVs fabricated with the embedded silver nanowire strategy in ultrathin transparent polyimide, achieved an average PCE of 12.7%, representing a promising technique to meet green and high-throughput energy demands.
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Affiliation(s)
- Jiachen Wang
- Electrical and Electronic Engineering and Information Systems, University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
- Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Kenjiro Fukuda
- Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
- Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Daishi Inoue
- Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Daisuke Hashizume
- Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Lulu Sun
- Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Sixing Xiong
- Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Tomoyuki Yokota
- Electrical and Electronic Engineering and Information Systems, University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
| | - Takao Someya
- Electrical and Electronic Engineering and Information Systems, University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
- Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
- Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
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97
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Feng P, Zheng Y, Li K, Zhao W. Highly stretchable and sensitive strain sensors with ginkgo-like sandwich architectures. NANOSCALE ADVANCES 2022; 4:1681-1693. [PMID: 36134381 PMCID: PMC9417334 DOI: 10.1039/d1na00817j] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/17/2021] [Accepted: 02/13/2022] [Indexed: 05/07/2023]
Abstract
The development of a strain sensor that can detect tensile strains exceeding 800% has been challenging. The non-conductive stretchable Eco-flex tape has been widely used in strain sensors due to its high elastic limit. In this work, an Eco-flex-based strain sensor that was conductive until occurrence of fracture was developed. The silver nanoparticles and carbon nanotubes constituted stretchable conductive paths in the Eco-flex matrix. The maximum tensile strain of this sensor was 867%, and the resistance change rate was higher than 104, while the strain resolution was 7.9%. Moreover, the sensor is characterized by segmented logarithmic linearity. This excellent performance was attributed to the ginkgo-like pattern, the patterned strain-coordinating architecture (PSCL), and specific nanocomposites with micro-cracks. The deformation of the architecture and the evolution of the microcracks were studied. In addition, the application of this strain sensor on a wing-shaped aircraft was proposed and its feasibility was demonstrated.
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Affiliation(s)
- Pengdong Feng
- Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering, Harbin Institute of Technology Shenzhen 518055 People's Republic of China
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology Shenzhen 518055 People's Republic of China
- State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology Harbin 150001 People's Republic of China
| | - Yi Zheng
- Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering, Harbin Institute of Technology Shenzhen 518055 People's Republic of China
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology Shenzhen 518055 People's Republic of China
- State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology Harbin 150001 People's Republic of China
| | - Kang Li
- Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering, Harbin Institute of Technology Shenzhen 518055 People's Republic of China
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology Shenzhen 518055 People's Republic of China
- State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology Harbin 150001 People's Republic of China
| | - Weiwei Zhao
- Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering, Harbin Institute of Technology Shenzhen 518055 People's Republic of China
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology Shenzhen 518055 People's Republic of China
- State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology Harbin 150001 People's Republic of China
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98
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Kizim NF, Golubina EN. Structuring of a Liquid in a Water–Lanthanide (or Nickel) Salt–D2EHPA–Diluent System. RUSSIAN JOURNAL OF PHYSICAL CHEMISTRY A 2022. [DOI: 10.1134/s0036024422020121] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/23/2022]
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99
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Choi W, Heo D, Kim T, Jung S, Choi M, Heo J, Kwon J, Kim B, Lee W, Koh W, Cho JH, Lee S, Hong J. Stress Dissipation Encoded Silk Fibroin Electrode for the Athlete-Beneficial Silk Bioelectronics. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2022; 9:e2105420. [PMID: 35001517 PMCID: PMC8922117 DOI: 10.1002/advs.202105420] [Citation(s) in RCA: 5] [Impact Index Per Article: 2.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 11/25/2021] [Indexed: 06/14/2023]
Abstract
The kinetic body motions have guided the core-shell fabrics of wearable bioelectronics to be elastoplastic. However, the polymeric electrodes follow the trade-off relationship between toughness and stretchability. To this end, the stress dissipation encoded silk fibroin electrode is proposed as the core electrode of wearable bioelectronics. Significantly, the high degree of intrinsic stress dissipation is realized via an amino acid crosslink. The canonical phenolic amino acid (i.e., tyrosine) of silk fibroin is engineered to bridge the secondary structures. A sufficient crosslink network is constructed when tyrosine is exposed near the amorphous strand. The stress dissipative tyrosine crosslink affords 12.5-fold increments of toughness (4.72 to 58.9 MJ m-3 ) and implements the elastoplastic silk fibroin. The harmony of elastoplastic core electrodes with shell fabrics enables the wearable bioelectronics to employ mechanical performance (elastoplasticity of 750 MJ m-3 ) and stable electrical response. The proposed wearable is capable of assisting the effective workouts via triboelectricity. In principle, active mobility with suggested wearables potentially relieves muscular fatigues and severe injuries during daily fitness.
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Affiliation(s)
- Woojin Choi
- Department of Chemical and Biomolecular Engineering, College of EngineeringYonsei UniversitySeoul03722Republic of Korea
| | - Deokjae Heo
- School of Mechanical EngineeringChung‐ang University84, Heukseok‐ro, Dongjak‐guSeoul06974Republic of Korea
| | - Taeho Kim
- Department of Chemical and Biomolecular Engineering, College of EngineeringYonsei UniversitySeoul03722Republic of Korea
| | - Sungwon Jung
- Department of Chemical and Biomolecular Engineering, College of EngineeringYonsei UniversitySeoul03722Republic of Korea
| | - Moonhyun Choi
- Department of Chemical and Biomolecular Engineering, College of EngineeringYonsei UniversitySeoul03722Republic of Korea
| | - Jiwoong Heo
- Department of Chemical and Biomolecular Engineering, College of EngineeringYonsei UniversitySeoul03722Republic of Korea
| | - Jae‐Sung Kwon
- Department and Research Institute of Dental Biomaterials and Bioengineering and BK21 FOUR ProjectYonsei University College of DentistrySeoul03722Republic of Korea
| | - Byeong‐Su Kim
- Department of ChemistryYonsei UniversitySeoul03722Republic of Korea
| | - Wonhwa Lee
- Department of ChemistrySungkyunkwan UniversitySuwon16419Republic of Korea
| | - Won‐Gun Koh
- Department of Chemical and Biomolecular Engineering, College of EngineeringYonsei UniversitySeoul03722Republic of Korea
| | - Jeong Ho Cho
- Department of Chemical and Biomolecular Engineering, College of EngineeringYonsei UniversitySeoul03722Republic of Korea
| | - Sangmin Lee
- School of Mechanical EngineeringChung‐ang University84, Heukseok‐ro, Dongjak‐guSeoul06974Republic of Korea
| | - Jinkee Hong
- Department of Chemical and Biomolecular Engineering, College of EngineeringYonsei UniversitySeoul03722Republic of Korea
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100
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Allioux FM, Ghasemian MB, Xie W, O'Mullane AP, Daeneke T, Dickey MD, Kalantar-Zadeh K. Applications of liquid metals in nanotechnology. NANOSCALE HORIZONS 2022; 7:141-167. [PMID: 34982812 DOI: 10.1039/d1nh00594d] [Citation(s) in RCA: 21] [Impact Index Per Article: 10.5] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/14/2023]
Abstract
Post-transition liquid metals (LMs) offer new opportunities for accessing exciting dynamics for nanomaterials. As entities with free electrons and ions as well as fluidity, LM-based nanomaterials are fundamentally different from their solid counterparts. The low melting points of most post-transition metals (less than 330 °C) allow for the formation of nanodroplets from bulk metal melts under mild mechanical and chemical conditions. At the nanoscale, these liquid state nanodroplets simultaneously offer high electrical and thermal conductivities, tunable reactivities and useful physicochemical properties. They also offer specific alloying and dealloying conditions for the formation of multi-elemental liquid based nanoalloys or the synthesis of engineered solid nanomaterials. To date, while only a few nanosized LM materials have been investigated, extraordinary properties have been observed for such systems. Multi-elemental nanoalloys have shown controllable homogeneous or heterogeneous core and surface compositions with interfacial ordering at the nanoscale. The interactions and synergies of nanosized LMs with polymeric, inorganic and bio-materials have also resulted in new compounds. This review highlights recent progress and future directions for the synthesis and applications of post-transition LMs and their alloys. The review presents the unique properties of these LM nanodroplets for developing functional materials for electronics, sensors, catalysts, energy systems, and nanomedicine and biomedical applications, as well as other functional systems engineered at the nanoscale.
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Affiliation(s)
- Francois-Marie Allioux
- School of Chemical Engineering, University of New South Wales (UNSW), Sydney, NSW 2052, Australia.
| | - Mohammad B Ghasemian
- School of Chemical Engineering, University of New South Wales (UNSW), Sydney, NSW 2052, Australia.
| | - Wanjie Xie
- School of Chemical Engineering, University of New South Wales (UNSW), Sydney, NSW 2052, Australia.
| | - Anthony P O'Mullane
- School of Chemistry and Physics, Queensland University of Technology (QUT), Brisbane, QLD 4001, Australia
| | - Torben Daeneke
- School of Engineering, RMIT University, Melbourne, Victoria, 3001, Australia
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, North Carolina State University, 911 Partners Way, Raleigh, NC, 27695, USA
| | - Kourosh Kalantar-Zadeh
- School of Chemical Engineering, University of New South Wales (UNSW), Sydney, NSW 2052, Australia.
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