Improved Hysteresis of High-Performance p-Type WSe2 Transistors with Native Oxide WOx Interfacial Layer

Atomically thin two-dimensional (2D) semiconductors like transition metal dichalcogenides (TMDs) show great promise as new channel materials for next-generation electronic devices. However, their practical implementation is hampered by the lack of suitable gate dielectrics and interfaces that minimize interface and oxide traps. Here, we introduce a novel strategy to improve the dielectric interface of tungsten diselenide (WSe2) p-type field-effect transistors (p-FETs) by integrating a native oxide, tungsten oxide (WOx), as an interlayer into a high-κ hafnium dioxide (HfO2) back gate stack. The WOx interlayer serves as both a doping layer to adjust the threshold voltage (VTH) and an interfacial layer to improve the WSe2-HfO2 interface. The subthreshold swing (SS) in long-channel p-FETs with this gate stack can achieve a near-ideal value (∼68 mV/dec), and hysteresis improves significantly within a 6 V gate sweep range. This work establishes a pathway for high-κ dielectric integration in high-performance 2D electronics.

High-Performance and Low-Power Applications of n- and p-Type Symmetrically Ultrascaled Pentagonal CX2 Transistors

The disparity in transport properties between n-type and p-type transistors has hindered the advancement of complementary metal-oxide-semiconductor (CMOS) integrated circuits. We designed Penta-CX2 (X = N, P, As, Sb) field-effect transistors (FETs) and utilized first-principles methods to evaluate their quantum transport characteristics. Our results demonstrate that CP2 and CAs2 exhibit superior transport properties and low subthreshold swing (SS) in both n-type and p-type configurations at sub-5 nm channel lengths. For high-performance (HP) applications, the on-state current (Ion) for both n-type and p-type devices exceeds 3000 μA/μm, peaking at 4574 μA/μm. In low-power (LP) applications, Ion for both types of devices surpasses 1000 μA/μm, reaching a maximum of 1735 μA/μm, significantly exceeding the International Roadmap for Devices and Systems (IRDS) standards for HP and LP applications. Furthermore, even when the channel length is reduced to 4 or 3 nm, the devices maintain exceptional performance. Additionally, we established a correlation between carrier effective mass and the saturation current, elucidating how the anisotropy of carrier effective mass influences transport properties and explaining the physical mechanisms by which the device overcomes Boltzmann's tyranny. This study provides valuable insights and references for designing advanced CMOSFETs in the post-Si era using channel materials with unique effective mass.

Recent advances in the fundamentals and in situ characterizations for mechanics in 2D materials

The growing need for integrating two-dimensional materials in electronic and functional devices requires the flexibility of the material. This necessitates the in situ characterization of their mechanical properties to understand their structure under stress loading in working devices. However, it is still challenging to directly characterize the mechanical behaviours of two-dimensional materials due to difficulties in handling these naturally fragile materials. In this review, we summarize the recent studies of mechanical properties in two-dimensional materials and their characterization using various microscopy techniques. This involves advances in fundamentals including the measurements of elastic properties, and the basic understanding of how structural parameters like defects and interfaces influence the deformation and failure process of two-dimensional materials. We also discuss the developed handling techniques for transferring two-dimensional materials to the characterization platforms, with the recent advances in in situ characterization studies based on atomic force microscopy and scanning/transmission electron microscopy. The above developments allowed the direct observation of unconventional mechanisms behind the deformation behaviour of two-dimensional materials, including plastic deformation, interlayer slip, phase transition and nanosized cracking. We then discuss the applications related to the mechanics of two-dimensional materials, including structural materials, electronic and optoelectronic properties, and further conclude with the opportunities and challenges in this field.

Self-Driven High-Performance Gate-Voltage-Tunable and Enhanced Performance Optoelectronic Device Based on FePS3/MoS2 Heterojunctions

The van der Waals heterojunctions are crucial for the development of next-generation high-performance optoelectronic devices due to their high-quality interface. In this study, FePS3/MoS2 van der Waals heterojunctions were fabricated, and their electronic and optoelectronic properties were investigated. The devices demonstrated typical rectification behavior, characterized by a low rectification ratio and electron-dominated conductivity. The suppression of electron recombination was achieved by eliminating non-heterojunction regions on the FePS3 side, leading to enhanced device performance. Notably, a large rectification ratio of 6.3 × 104 and an ideality factor of 1.24 were observed. Furthermore, the devices also exhibited self-driven photodetection performance, including a responsivity of 203 mA/W, a high-speed response/recovery time of 70.4/92 μs, and a high on/off ratio of 5.4 × 103. Responsivity and on/off ratio were further improved to higher values of 1.4 A/W and 1.2 × 105 by the modulation of Vg. The results offer valuable insights for improving and developing high-performance devices based on two-dimensional materials and heterojunctions.

Physics of 2D Materials for Developing Smart Devices

Rapid industrialization advancements have grabbed worldwide attention to integrate a very large number of electronic components into a smaller space for performing multifunctional operations. To fulfill the growing computing demand state-of-the-art materials are required for substituting traditional silicon and metal oxide semiconductors frameworks. Two-dimensional (2D) materials have shown their tremendous potential surpassing the limitations of conventional materials for developing smart devices. Despite their ground-breaking progress over the last two decades, systematic studies providing in-depth insights into the exciting physics of 2D materials are still lacking. Therefore, in this review, we discuss the importance of 2D materials in bridging the gap between conventional and advanced technologies due to their distinct statistical and quantum physics. Moreover, the inherent properties of these materials could easily be tailored to meet the specific requirements of smart devices. Hence, we discuss the physics of various 2D materials enabling them to fabricate smart devices. We also shed light on promising opportunities in developing smart devices and identified the formidable challenges that need to be addressed.

A Valuable and Low-Budget Process Scheme of Equivalized 1 nm Technology Node Based on 2D Materials

Emerging two-dimensional (2D) semiconductors are among the most promising materials for ultra-scaled transistors due to their intrinsic atomic-level thickness. As the stacking process advances, the complexity and cost of nanosheet field-effect transistors (NSFETs) and complementary FET (CFET) continue to rise. The 1 nm technology node is going to be based on Si-CFET process according to international roadmap for devices and systems (IRDS) (2022, https://irds.ieee.org/ ), but not publicly confirmed, indicating that more possibilities still exist. The miniaturization advantage of 2D semiconductors motivates us to explore their potential for reducing process costs while matching the performance of next-generation nodes in terms of area, power consumption and speed. In this study, a comprehensive framework is built. A set of MoS2 NSFETs were designed and fabricated to extract the key parameters and performances. And then for benchmarking, the sizes of 2D-NSFET are scaled to a extent that both of the Si-CFET and 2D-NSFET have the same average device footprint. Under these conditions, the frequency of ultra-scaled 2D-NSFET is found to improve by 36% at a fixed power consumption. This work verifies the feasibility of replacing silicon-based CFETs of 1 nm node with 2D-NSFETs and proposes a 2D technology solution for 1 nm nodes, i.e., "2D eq 1 nm" nodes. At the same time, thanks to the lower characteristic length of 2D semiconductors, the miniaturized 2D-NSFET achieves a 28% frequency increase at a fixed power consumption. Further, developing a standard cell library, these devices obtain a similar trend in 16-bit RISC-V CPUs. This work quantifies and highlights the advantages of 2D semiconductors in advanced nodes, offering new possibilities for the application of 2D semiconductors in high-speed and low-power integrated circuits.

Reconfigurable Inverter Based on Ferroelectric-Gating MoS2 Field-Effect Transistors toward In-Memory Logic Operations

With the advancement of information technology in contemporary society, there is an increasing demand for the rapid processing of large amounts of data. Concurrently, traditional silicon-based integrated circuits have reached their performance limits due to the exacerbation of non-ideal effects. This necessitates further multifunctionalities and miniaturization of modern integrated circuits. In recent years, two-dimensional (2D) materials have demonstrated exceptional physical and electrical properties and have emerged as a promising method for the development of next-generation electronic devices. Ferroelectric materials enable the flexible adjustment of polarization states, thereby simultaneously achieving non-volatile memory and the modulation of carrier transport. Moreover, reconfigurable logic allows for the dynamic adjustment of computational functions when different tasks are executed, significantly enhancing logical operation capabilities. Here, we report a reconfigurable logic inverter based on ferroelectric-gating MoS2 field-effect transistors. Notably, the ferroelectric transistor achieves a high Ion/Ioff ratio of ∼106 and a memory window of ∼20 V. Furthermore, the reconfigurable inverter realized using two as-fabricated ferroelectric field-effect transistors (FeFETs) can produce three distinct output logics (including always "0", always "1", and inverter) in different polarization states under the same input. This study provides a strategy for achieving reconfigurable logic in ferroelectric-gating transistors, thereby offering a potential functional block for the development of in-memory computing.

Investigating vertical charge plasma tunnel field effect transistors beyond semiclassical assumptions

In this paper, we examine the effects of subband quantization on the efficacy of an L-shaped gate vertical dopingless tunneling field-effect transistor. The proposed architecture leverages an intrinsic tunneling interface that is fully aligned with the gate metal, resulting in enhanced electrostatic control. We utilized a two-step numerical simulation approach grounded in the Schrödinger-Poisson equations to evaluate the performance of our proposed device and accurately calculate the ON-state current. Additionally, we assessed the influence of defects at the heterojunction on the performance of our device. Under quantum mechanical assumptions, parameters such as ION = 23.8 µA/µm, SSAVG = 12.03 mV/dec, and the ION/IOFF ratio = 4.88 × 1010 indicate that our structure is a promising candidate for high-performance applications.

Ultranarrow Semiconductor WS2 Nanoribbon Field-Effect Transistors

Semiconducting transition metal dichalcogenides (TMDs) have attracted significant attention for their potential to develop high-performance, energy-efficient, and nanoscale electronic devices. Despite notable advancements in scaling down the gate and channel length of TMD field-effect transistors (FETs), the fabrication of sub-30 nm narrow channels and devices with atomic-scale edge control still poses challenges. Here, we demonstrate a crystallography-controlled nanostructuring technique to fabricate ultranarrow tungsten disulfide (WS2) nanoribbons as small as sub-10 nm in width. The WS2 nanoribbon junctions having different widths display diodic current-voltage characteristics, providing a way to create and tune nanoscale device properties by controlling the size of the structures. The transport properties of the nanoribbon FETs are primarily governed by narrow channel effects, where the mobility in the narrow channels is limited by edge scattering. Our findings on nanoribbon devices hold potential for developing future-generation nanometer-scale van der Waals semiconductor-based devices and circuits.

Wearable Resistive-Type Stretchable Strain Sensors: Materials and Applications

The rapid advancement of wearable electronics over recent decades has led to the development of stretchable strain sensors, which are essential for accurately detecting and monitoring mechanical deformations. These sensors have widespread applications, including movement detection, structural health monitoring, and human-machine interfaces. Resistive-type sensors have gained significant attention due to their simple design, ease of fabrication, and adaptability to different materials. Their performance, evaluated by metrics like stretchability and sensitivity, is influenced by the choice of strain-sensitive materials. This review offers a comprehensive comparison and evaluation of different materials used in resistive strain sensors, including metal and semiconductor films, low-dimensional materials, intrinsically conductive polymers, and gels. The review also highlights the latest applications of resistive strain sensors in motion detection, healthcare monitoring, and human-machine interfaces by examining device physics and material characteristics. This comparative analysis aims to support the selection, application, and development of resistive strain sensors tailored to specific applications.

Complementary Circuits with WSe2/Organic Semiconductor Heterostructure Field-Effect Transistors

A device architecture based on heterostructure WSe2/organic semiconductor field-effect transistors (FETs) is demonstrated in which ambipolar conduction is virtually eliminated, resulting in essentially unipolar FETs realized from an ambipolar semiconductor. For p-channel FETs, an electron-accepting organic semiconductor such as hexadecafluorocopperphthalocyanine (F16CuPc) is used to form a heterolayer on top of WSe2 to effectively trap any undesirable electron currents. For n-channel FETs, a hole-accepting organic semiconductor such as pentacene is used to reduce the hole currents without affecting the electron currents. Off-currents are reduced in FETs with heterolayers compared to WSe2 FETs without organic heterolayers, which will decrease static power dissipation in complementary circuits. In all FETs reported in this work, the organic heterolayers cover only part of the channel, which results in more effective trapping of the carrier type that must be reduced. This device design approach can be effectively combined with p-type doping and contact metal engineering to improve WSe2 based FETs and circuits. Complementary inverters realized with such heterostructured FETs exhibit excellent transfer characteristics. This design approach is also applicable to other ambipolar semiconductors besides WSe2.

van der Waals Photonic Bipolar Junction Transistors Capable of Simultaneously Discerning Wavelength Bands and Dual-Function Chip Application

The exponential growth of the Internet of Things (IoTs) has led to the widespread deployment of millions of sensors, crucial for the sensing layer's perception capabilities. In particular, there is a strong interest in intelligent photonic sensing. However, the current photonic sensing device and chip typically offer limited functionality, and the devices providing their power take up excessive amounts of space. There is a pressing need for smart, multifunctional sensing chips with the capability of intelligent recognition. Here, we propose and demonstrate the functionalities of a two-dimensional van der Waals photonic bipolar junction transistor (2D-vdW photonic BJT) in simultaneous sensing and discerning different wavelength bands of light. Also, a dual-function chip application is given. The optoelectronic detection characteristics in the vision-near-infrared (vis-NIR) band and photovoltaic characteristics are systematically studied. It exhibits negative photoconductivity (NPC) for the 1064 nm laser while maintaining positive photoconductivity (PPC) for the 638 and 1550 nm lasers. Also, the electrical tunable response is realized. Moreover, the function of this chip under real-application conditions has shown its efficacy in applications such as detecting dim light with ∼10 lx illuminance, identifying wavelength bands, and generating power photovoltaically. This work provides a solution for the interconnection of everything.

Controllable synthesis of nonlayered high-κ Mn3O4 single-crystal thin films for 2D electronics

Two-dimensional (2D) materials have been identified as promising candidates for future electronic devices. However, high dielectric constant (κ) materials, which can be integrated with 2D semiconductors, are still rare. Here, we report a hydrate-assisted thinning chemical vapor deposition (CVD) technique to grow manganese oxide (Mn3O4) single crystal nanosheets, enabled by a strategy to minimize the substrate lattice mismatch and control the growth kinetics. The material demonstrated a dielectric constant up to 135, an equivalent oxide thickness (EOT) as low as 0.8 nm, and a breakdown field strength (Ebd) exceeding 10 MV/cm. MoS2 field-effect transistors (FETs) integrated with Mn3O4 thin films through mechanical stacking method operate under low voltages (<1 V), achieving a near 108 Ion/Ioff ratio and a subthreshold swing (SS) as low as 84 mV/dec. The MoS2 FET exhibit nearly zero hysteresis (<2 mV/MV cm⁻¹) and a low drain-induced barrier lowering (~20 mV/V). This work further expands the family of 2D high-κ dielectric materials and provides a feasible exploration for the epitaxial growth of single-crystal thin films of non-layered materials.

Two-Dimensional Materials for Brain-Inspired Computing Hardware

Recent breakthroughs in brain-inspired computing promise to address a wide range of problems from security to healthcare. However, the current strategy of implementing artificial intelligence algorithms using conventional silicon hardware is leading to unsustainable energy consumption. Neuromorphic hardware based on electronic devices mimicking biological systems is emerging as a low-energy alternative, although further progress requires materials that can mimic biological function while maintaining scalability and speed. As a result of their diverse unique properties, atomically thin two-dimensional (2D) materials are promising building blocks for next-generation electronics including nonvolatile memory, in-memory and neuromorphic computing, and flexible edge-computing systems. Furthermore, 2D materials achieve biorealistic synaptic and neuronal responses that extend beyond conventional logic and memory systems. Here, we provide a comprehensive review of the growth, fabrication, and integration of 2D materials and van der Waals heterojunctions for neuromorphic electronic and optoelectronic devices, circuits, and systems. For each case, the relationship between physical properties and device responses is emphasized followed by a critical comparison of technologies for different applications. We conclude with a forward-looking perspective on the key remaining challenges and opportunities for neuromorphic applications that leverage the fundamental properties of 2D materials and heterojunctions.

High-Performance Edge-Contact Monolayer Molybdenum Disulfide Transistors

Edge contact is essential for achieving the ultimate device pitch scaling of stacked nanosheet transistors with monolayer 2-dimensional (2D) channels. However, due to large edge-contact resistance between 2D channels and contact metal, there is currently a lack of high-performance edge-contact device technology for 2D material channels. Here, we report high-performance edge-contact monolayer molybdenum disulfide (MoS2) field-effect transistors (FETs) utilizing well-controlled plasma etching techniques. Plasma etching with pure argon improves the edge dangling bonds and thus improves the edge-contact quality. Edge-contact monolayer MoS2 FET shows good ohmic contact even at cryogenic temperatures (20 K), achieving a record-low contact resistance (R c) of 1.25 kΩ·μm among all edge-contact MoS2 devices. The record-high on-state current of 436 μA/μm and transconductance of 123 μS/μm at V ds = 1 V are achieved on an edge-contact monolayer MoS2 FET with L ch = 120 nm. This work highlights the great potential of edge contacts for high-performance monolayer transition metal dichalcogenide (TMD) material electronics.

Nanomaterials for Flexible Neuromorphics

The quest to imbue machines with intelligence akin to that of humans, through the development of adaptable neuromorphic devices and the creation of artificial neural systems, has long stood as a pivotal goal in both scientific inquiry and industrial advancement. Recent advancements in flexible neuromorphic electronics primarily rely on nanomaterials and polymers owing to their inherent uniformity, superior mechanical and electrical capabilities, and versatile functionalities. However, this field is still in its nascent stage, necessitating continuous efforts in materials innovation and device/system design. Therefore, it is imperative to conduct an extensive and comprehensive analysis to summarize current progress. This review highlights the advancements and applications of flexible neuromorphics, involving inorganic nanomaterials (zero-/one-/two-dimensional, and heterostructure), carbon-based nanomaterials such as carbon nanotubes (CNTs) and graphene, and polymers. Additionally, a comprehensive comparison and summary of the structural compositions, design strategies, key performance, and significant applications of these devices are provided. Furthermore, the challenges and future directions pertaining to materials/devices/systems associated with flexible neuromorphics are also addressed. The aim of this review is to shed light on the rapidly growing field of flexible neuromorphics, attract experts from diverse disciplines (e.g., electronics, materials science, neurobiology), and foster further innovation for its accelerated development.

High-Fidelity Transfer of 2D Semiconductors and Electrodes for van der Waals Devices

As traditional silicon-based materials almost reach their limits in the post-Moore era, two-dimensional (2D) transition metal dichalcogenides (TMDCs) have been regarded as next-generation semiconductors for high-performance electrical and optical devices. Chemical vapor deposition (CVD) is a widely used technique for preparing large-area and high-quality TMDCs. Yet, it suffers from the challenge of transfer due to the strong interaction between 2D materials and substrates. The traditional PMMA-assisted wet etching method tends to induce damage, wrinkles, and inevitable polymer residues. In this work, we propose an etch-free and clean transfer method via a water intercalation strategy for TMDCs, ensuring a high-fidelity, wrinkle-free, and crack-free transfer with negligible residues. Furthermore, metal electrodes can also be transferred via this method and back-gate field-effect transistors (FETs) based on CVD-grown monolayer WSe2 with van der Waals (vdW) metal/semiconductor contacts are fabricated. Compared to the PMMA-assisted transfer method (∼1.2 cm2 V-1 s-1 hole mobility with ∼2 × 106 ON/OFF ratio), our high-fidelity transfer method significantly enhances the electrical performance of WSe2 FET over one order of magnitude, achieving a hole mobility of ∼43 cm2 V-1 s-1 and a high ON/OFF ratio of ∼5 × 107 in air at room temperature.

High performance Si-MoS2 heterogeneous embedded DRAM

Embedded Dynamic RAM (eDRAM) has become a key solution for large-capacity cache in high-performance processors. A heterogeneous two transistor capacitorless eDRAM (2T-eDRAM) that combines silicon and molybdenum disulfide (MoS2) is reported to address the short retention issue in conventional gain cell (GC) eDRAMs meanwhile eliminate the pillar capacitor in one transistor and one capacitor (1T1C) eDRAMs. The MoS2 write transistor with low OFF current (IOFF) enables long data retention, while the Si read transistor offers high drive current and logic compatibility. This combination enhances data retention by 1000 times and sense margin by 100 times respectively compared to full Si and MoS2 counterparts. A three-dimensional (3D) design stacking MoS2 on Si is demonstrated with back-end-of-line (BEOL) process to double integration density. With 6000 s data retention, 35 μA/μm sense margin, 5 ns access speeds, 3D integration and CMOS logic compatibility, this Si-MoS2 eDRAM marks a significant advancement in memory technology.

Giant tunnel electroresistance through a Van der Waals junction by external ferroelectric polarization

The burgeoning interest in two-dimensional semiconductors stems from their potential as ultrathin platforms for next-generation transistors. Nonetheless, there persist formidable challenges in fully obtaining high-performance complementary logic components and the underlying mechanisms for the polarity modulation of transistors are not yet fully understood. Here, we exploit both ferroelectric domain-based nonvolatile modulation of Fermi level in transitional metal dichalcogenides (MoS2) and quantum tunneling through nanoscale hexagonal boron nitride (h-BN). Our prototype devices, termed as vertical tunneling ferroelectric field-effect transistor, utilizes a Van der Waals MoS2/h-BN/metal tunnel junction as the channel. The Fermi level of MoS2 is bipolarly tuned by ferroelectric domains and sensitively detected by the direct quantum tunneling strength across the junction, demonstrating an impressive electroresistance ratio of up to 109 in the vertical tunneling ferroelectric field-effect transistor. It consumes only 0.16 fJ of energy to open a ratio window exceeding 104. This work not only validates the effectiveness of tailored tunnel barriers in manipulating electronic flow but also highlights a new avenue for the design flexibility and functional versatility of advanced ferroelectric memory technology.

Precise p-type and n-type doping of two-dimensional semiconductors for monolithic integrated circuits

The controllable fabrication of patterned p-type and n-type channels with precise doping control presents a significant challenge, impeding the realization of complementary metal-oxide-semiconductor (CMOS) logic using a single van der Waals material. However, such an achievement could offer substantial benefits by enabling continued transistor scaling and unprecedented interlayer interconnect technologies. In this study, we devise a precise method for two-dimensional (2D) semiconductor substitutional doping, which allows for the production of wafer-scale 2H-MoTe2 thin films with specific p-type or n-type doping. Notably, we extend this approach to the synthesis of spatially selective doped 2H-MoTe2 thin films via a one-step growth method, facilitating the monolithic integration of p-type and n-type semiconductor channels. Leveraging this advancement, we successfully fabricate a chip-sized 2D CMOS inverter array that demonstrates excellent device performance and yield. Collectively, these findings represent a significant stride towards the practical incorporation of 2D semiconductors in very large-scale integration technology.

Two-Dimensional ZrS2 and HfS2 for Making Sub-10 nm High-Performance P-Type Transistors

Two-dimensional (2D) transition metal dichalcogenide (TMDC) semiconductors have been recognized as reliable candidates for future sub-10 nm physical gate length field-effect transistors (FETs). However, the device performance of 2D P-type devices is far inferior to that of N-type devices, which seriously hinders the development of complementary metal-oxide-semiconductor (CMOS) integrated circuits. Herein, we presented that two new 2D TMDC channel materials, ZrS2 and HfS2, can realize high-performance P-type MOSFETs through first-principles quantum transport simulations. Different from the 2D MoS2 and WSe2, the continuous in-plane p-orbitals at the valence band edge of 2D ZrS2 and HfS2 lead to a small hole effective mass of 0.24 m0. As a result, 2D ZrS2 and HfS2 P-type MOSFETs with 10 nm gate length possess an on-state current (Ion) as high as 2000 μA/μm. Moreover, even when the gate length shrinks to 5 nm, the Ion can also reach ∼1500 μA/μm with the energy delay product ranging from 3 × 10-30 to 1 × 10-29 Js/μm, which are better than many other 2D P-type MOSFETs like MoS2 and WSe2. Our work demonstrates that 2D ZrS2 and HfS2 are competitive channel materials for constructing future sub-10 nm P-type high-performance FETs.

High-throughput screening and machine learning classification of van der Waals dielectrics for 2D nanoelectronics

Van der Waals (vdW) dielectrics are promising for enhancing the performance of nanoscale field-effect transistors (FETs) based on two-dimensional (2D) semiconductors due to their clean interfaces. Ideal vdW dielectrics for 2D FETs require high dielectric constants and proper band alignment with 2D semiconductors. However, high-quality dielectrics remain scarce. Here, we employed a topology-scale algorithm to screen vdW materials consisting of zero-dimensional (0D), one-dimensional (1D), and 2D motifs from Materials Project database. High-throughput first-principles calculations yielded bandgaps and dielectric properties of 189 0D, 81 1D and 252 2D vdW materials. Among which, 9 highly promising dielectric candidates are suitable for MoS2-based FETs. Element prevalence analysis indicates that materials containing strongly electronegative anions and heavy cations are more likely to be promising dielectrics. Moreover, we developed a high-accuracy two-step machine learning (ML) classifier for screening dielectrics. Implementing active learning framework, we successfully identified 49 additional promising vdW dielectrics. This work provides a rich candidate list of vdW dielectrics along with a high-accuracy ML screening model, facilitating future development of 2D FETs.

Recent Progress in Two-Dimensional Magnetic Materials

The giant magnetoresistance effect in two-dimensional (2D) magnetic materials has sparked substantial interest in various fields; including sensing; data storage; electronics; and spintronics. Their unique 2D layered structures allow for the manifestation of distinctive physical properties and precise performance regulation under different conditions. In this review, we present an overview of this rapidly developing research area. Firstly, these 2D magnetic materials are catalogued according to magnetic coupling types. Then, several vital effects in 2D magnets are highlighted together with theoretical investigation, such as magnetic circular dichroism, magneto-optical Kerr effect, and anomalous Hall effect. After that, we forecast the potential applications of 2D magnetic materials for spintronic devices. Lastly, research advances in the attracting magnons, skyrmions and other spin textures in 2D magnets are discussed.

Electronics and Optoelectronics Based on Tellurium

As a true 1D system, group-VIA tellurium (Te) is composed of van der Waals bonded molecular chains within a triangular crystal lattice. This unique crystal structure endows Te with many intriguing properties, including electronic, optoelectronic, thermoelectric, piezoelectric, chirality, and topological properties. In addition, the bandgap of Te exhibits thickness dependence, ranging from 0.31 eV in bulk to 1.04 eV in the monolayer limit. These diverse properties make Te suitable for a wide range of applications, addressing both established and emerging challenges. This review begins with an elaboration of the crystal structures and fundamental properties of Te, followed by a detailed discussion of its various synthesis methods, which primarily include solution phase, and chemical and physical vapor deposition technologies. These methods form the foundation for designing Te-centered devices. Then the device applications enabled by Te nanostructures are introduced, with an emphasis on electronics, optoelectronics, sensors, and large-scale circuits. Additionally, performance optimization strategies are discussed for Te-based field-effect transistors. Finally, insights into future research directions and the challenges that lie ahead in this field are shared.

Optical Applications of CuInSe2 Colloidal Quantum Dots

The distinctive chemical, physical, electrical, and optical properties of semiconductor quantum dots (QDs) make them a highly fascinating nanomaterial that has been extensively studied. The CuInSe2 (CIS) QDs demonstrates great potential as a nontoxic alternative to CdSe and PbSe QDs for realizing high-performance solution-processed semiconductor devices. The CIS QDs show strong light absorption and bright emission across the visible and infrared spectrum and have been designed to exhibit optical gain. The special characteristics of these properties are of great significance in the fields of solar energy conversion, display, and electronic devices. Here, we present a comprehensive overview of the potential applications of colloidal CIS QDs in various fields, with a particular focus on solar energy conversion (such as QD solar cells, QD-sensitized solar cells, and QD luminescence solar concentrators), solar-to-hydrogen production (such as photocatalytic and photoelectrochemical H2 production), and QD electronics (such as QD transistors, QD light-emitting diodes, and QD photodetectors). Furthermore, we offer our insights into the current challenges and future opportunities associated with CIS QDs for further research.

Design of stimuli-responsive transition metal dichalcogenides

Stimuli-responsive systems are an emerging class of materials in fields as diverse as electronics, optoelectronics, cancer detection, drug delivery, or sensing. Especially focusing on nanomaterials, 2D transition metal dichalcogenides have recently attracted the scientific community's attention due to their remarkable intrinsic stimuli-responsive behaviour upon external stimuli such as pH, light, voltage, or certain pathogens. This significant response can be further enhanced by forming mixed-dimensional heterostructures and by molecular functionalization, capitalizing on chemistry to manipulate and boost their intrinsic stimuli-responsive properties. Furthermore, thanks to the endless possibilities of chemistry, a new class of smart materials based on the combination of stimuli-responsive molecular systems with transition metal dichalcogenides has recently been synthesized. In these materials, the physical properties of the 2D layers are reversibly modified by the switchable molecules, not only enhancing their stimuli-responsive behaviour but also providing memory to the hybrid. Therefore, this review explores the recent breakthroughs in the chemical design of smart transition metal dichalcogenides with built-in responsiveness.

Revealing Bipolar Photoresponse in Multiheterostructured WTe2-GaTe/ReSe2-WTe2 P-N Diode by Hybrid 2D Contact Engineering

The van der Waals (vdW) heterostructures based on two-dimensional (2D) semiconducting materials have been thoroughly investigated with regard to practical applications. Recent studies on 2D materials have reignited attraction in the p-n junction, with promising potential for applications in both electronics and optoelectronics. 2D materials provide exceptional band structural diversity in p-n junction devices, which is rare in regular bulk semiconductors. In this article, we demonstrate a p-n diode based on multiheterostructure configuration, WTe2-GaTe-ReSe2-WTe2, where WTe2 acts as heterocontact with GaTe/ReSe2 junction. Our devices with heterocontacts of WTe2 showed excellent performance in electronic and optoelectronic characteristics as compared to contacts with basic metal electrodes. However, the highest rectification ratio was achieved up to ∼2.09 × 106 with the lowest ideality factor of ∼1.23. Moreover, the maximum change in photocurrent (Iph) is measured around 312 nA at Vds = 0.5 V. The device showed a high responsivity (R) of 4.7 × 104 m·AW-1, maximum external quantum efficiency (EQE) of 2.49 × 104 (%), and detectivity (D*) of 2.1 × 1011 Jones at wavelength λ = 220 nm. Further, we revealed the bipolar photoresponse mechanisms in WTe2-GaTe-ReSe2-WTe2 devices due to band alignment at the interface, which can be modified by applying different gate voltages. Hence, our promising results render heterocontact engineering of the GaTe-ReSe2 heterostructured diode as an excellent candidate for next-generation optoelectronic logic and neuromorphic computing.

Making Patterned Single Defects in MoS2 Thermally with the MoS2/Au Moiré Interface

Normally, it is hard to regulate thermal defects precisely in their host lattice due to the stochastic nature of thermal activation. Here, we demonstrate a thermal annealing way to create patterned single sulfur vacancy (VS) defects in monolayer molybdenum disulfide (MoS2) with about 2 nm separations at subnanometer accuracy. Theoretically, we reveal that the S-Au interface coupling reduces the energy barriers in forming VS defects and that explains the overwhelming formation of interface VS defects. We also discover a phonon regulation mechanism by the moiré interface that effectively condenses the Γ-point out-of-plane acoustic phonons of monolayer MoS2 to its TOP moiré sites, which has been proposed to trigger moiré-patterned thermal VS formation. The high-throughput nanoscale patterned defects presented here may contribute to building scalable defect-based quantum systems.

Large-Area Epitaxial Growth of Transition Metal Dichalcogenides

Over the past decade, research on atomically thin two-dimensional (2D) transition metal dichalcogenides (TMDs) has expanded rapidly due to their unique properties such as high carrier mobility, significant excitonic effects, and strong spin-orbit couplings. Considerable attention from both scientific and industrial communities has fully fueled the exploration of TMDs toward practical applications. Proposed scenarios, such as ultrascaled transistors, on-chip photonics, flexible optoelectronics, and efficient electrocatalysis, critically depend on the scalable production of large-area TMD films. Correspondingly, substantial efforts have been devoted to refining the synthesizing methodology of 2D TMDs, which brought the field to a stage that necessitates a comprehensive summary. In this Review, we give a systematic overview of the basic designs and significant advancements in large-area epitaxial growth of TMDs. We first sketch out their fundamental structures and diverse properties. Subsequent discussion encompasses the state-of-the-art wafer-scale production designs, single-crystal epitaxial strategies, and techniques for structure modification and postprocessing. Additionally, we highlight the future directions for application-driven material fabrication and persistent challenges, aiming to inspire ongoing exploration along a revolution in the modern semiconductor industry.

Synthesis, Modulation, and Application of Two-Dimensional TMD Heterostructures

Two-dimensional (2D) transition metal dichalcogenide (TMD) heterostructures have attracted a lot of attention due to their rich material diversity and stack geometry, precise controllability of structure and properties, and potential practical applications. These heterostructures not only overcome the inherent limitations of individual materials but also enable the realization of new properties through appropriate combinations, establishing a platform to explore new physical and chemical properties at micro-nano-pico scales. In this review, we systematically summarize the latest research progress in the synthesis, modulation, and application of 2D TMD heterostructures. We first introduce the latest techniques for fabricating 2D TMD heterostructures, examining the rationale, mechanisms, advantages, and disadvantages of each strategy. Furthermore, we emphasize the importance of characteristic modulation in 2D TMD heterostructures and discuss some approaches to achieve novel functionalities. Then, we summarize the representative applications of 2D TMD heterostructures. Finally, we highlight the challenges and future perspectives in the synthesis and device fabrication of 2D TMD heterostructures and provide some feasible solutions.

Small Feature-Size Transistors Based on Low-Dimensional Materials: From Structure Design to Nanofabrication Techniques

For several decades after Moore's Law is proposed, there is a continuous effort to reduce the feature-size of transistors. However, as the size of transistors continues to decrease, numerous challenges and obstacles including severe short channel effects (SCEs) are emerging. Recently, low-dimensional materials have provided new opportunities for constructing small feature-size transistors due to their superior electrical properties compared to silicon. Here, state-of-the-art low-dimensional materials-based transistors with small feature-sizes are reviewed. Different from other works that mainly focus on material characteristics of a specific device structure, the discussed topics are utilizing device structure design including vertical structure and nano-gate structure, and nanofabrication techniques to achieve small feature-sizes of transistors. A comprehensive summary of these small feature-size transistors is presented by illustrating their operation mechanism, relevant fabrication processes, and corresponding performance parameters. Besides, the role of small feature-size transistors based on low-dimensional materials in further reducing the small footprint is also clarified and their cutting-edge applications are highlighted. Finally, a comparison and analysis between state-of-art transistors is made, as well as a glimpse into the future research trajectory of low dimensional materials-based small feature-size transistors is briefly outlined.

Quasi-equilibrium growth of inch-scale single-crystal monolayer α-In2Se3 on fluor-phlogopite

Epitaxial growth of two-dimensional (2D) materials with uniform orientation has been previously realized by introducing a small binding energy difference between the two locally most stable orientations. However, this small energy difference can be easily disturbed by uncontrollable dynamics during the growth process, limiting its practical applications. Herein, we propose a quasi-equilibrium growth (QEG) strategy to synthesize inch-scale monolayer α-In2Se3 single crystals, a semiconductor with ferroelectric properties, on fluor-phlogopite substrates. The QEG facilitates the discrimination of small differences in binding energy between the two locally most stable orientations, realizing robust single-orientation epitaxy within a broad growth window. Thus, single-crystal α-In2Se3 film can be epitaxially grown on fluor-phlogopite, the cleavage surface atomic layer of which has the same 3-fold rotational symmetry with α-In2Se3. The resulting crystalline quality enables high electron mobility up to 117.2 cm2 V-1 s-1 in α-In2Se3 ferroelectric field-effect transistors, exhibiting reliable nonvolatile memory performance with long retention time and robust cycling endurance. In brief, the developed QEG method provides a route for preparing larger-area single-crystal 2D materials and a promising opportunity for applications of 2D ferroelectric devices and nanoelectronics.

Two-Dimensional Semiconductors for State-of-the-Art Complementary Field-Effect Transistors and Integrated Circuits

As the trajectory of transistor scaling defined by Moore's law encounters challenges, the paradigm of ever-evolving integrated circuit technology shifts to explore unconventional materials and architectures to sustain progress. Two-dimensional (2D) semiconductors, characterized by their atomic-scale thickness and exceptional electronic properties, have emerged as a beacon of promise in this quest for the continued advancement of field-effect transistor (FET) technology. The energy-efficient complementary circuit integration necessitates strategic engineering of both n-channel and p-channel 2D FETs to achieve symmetrical high performance. This intricate process mandates the realization of demanding device characteristics, including low contact resistance, precisely controlled doping schemes, high mobility, and seamless incorporation of high- κ dielectrics. Furthermore, the uniform growth of wafer-scale 2D film is imperative to mitigate defect density, minimize device-to-device variation, and establish pristine interfaces within the integrated circuits. This review examines the latest breakthroughs with a focus on the preparation of 2D channel materials and device engineering in advanced FET structures. It also extensively summarizes critical aspects such as the scalability and compatibility of 2D FET devices with existing manufacturing technologies, elucidating the synergistic relationships crucial for realizing efficient and high-performance 2D FETs. These findings extend to potential integrated circuit applications in diverse functionalities.

Realization of Extremely High-Gain and Low-Power in nMOS Inverter Based on Monolayer WS2 Transistor Operating in Subthreshold Regime

In this work, we report an n-type metal-oxide-semiconductor (nMOS) inverter using chemical vapor deposition (CVD)-grown monolayer WS2 field-effect transistors (FETs). Our large-area CVD-grown monolayer WS2 FETs exhibit outstanding electrical properties including a high on/off ratio, small subthreshold swing, and excellent drain-induced barrier lowering. These are achieved by n-type doping using AlOx/Al2O3 and a double-gate structure employing high-k dielectric HfO2. Due to the superior subthreshold characteristics, monolayer WS2 FETs show high transconductance and high output resistance in the subthreshold regime, resulting in significantly higher intrinsic gain compared to conventional Si MOSFETs. Therefore, we successfully realize subthreshold operating monolayer WS2 nMOS inverters with extremely high gains of 564 and 2056 at supply voltage (VDD) of 1 and 2 V, respectively, and low power consumption of ∼2.3 pW·μm-1 at VDD = 1 V. In addition, the monolayer WS2 nMOS inverter is further expanded to the demonstration of logic circuits such as AND, OR, NAND, NOR logic gates, and SRAM. These findings suggest the potential of monolayer WS2 for high-gain and low-power logic circuits and validate the practical application in large areas.

Simulation of Novel Nano Low-Dimensional FETs at the Scaling Limit

The scaling of bulk Si-based transistors has reached its limits, while novel architectures such as FinFETs and GAAFETs face challenges in sub-10 nm nodes due to complex fabrication processes and severe drain-induced barrier lowering (DIBL) effects. An effective strategy to avoid short-channel effects (SCEs) is the integration of low-dimensional materials into novel device architectures, leveraging the coupling between multiple gates to achieve efficient electrostatic control of the channel. We employed TCAD simulations to model multi-gate FETs based on various dimensional systems and comprehensively investigated electric fields, potentials, current densities, and electron densities within the devices. Through continuous parameter scaling and extracting the sub-threshold swing (SS) and DIBL from the electrical outputs, we offered optimal MoS2 layer numbers and single-walled carbon nanotube (SWCNT) diameters, as well as designed structures for multi-gate FETs based on monolayer MoS2, identifying dual-gate transistors as suitable for high-speed switching applications. Comparing the switching performance of two device types at the same node revealed CNT's advantages as a channel material in mitigating SCEs at sub-3 nm nodes. We validated the performance enhancement of 2D materials in the novel device architecture and reduced the complexity of the related experimental processes. Consequently, our research provides crucial insights for designing next-generation high-performance transistors based on low-dimensional materials at the scaling limit.

Innovations of metallic contacts on semiconducting 2D transition metal dichalcogenides toward advanced 3D-structured field-effect transistors

2D semiconductors, represented by transition metal dichalcogenides (TMDs), have the potential to be alternative channel materials for advanced 3D field-effect transistors, such as gate-all-around field-effect-transistors (GAAFETs) and complementary field-effect-transistors (C-FETs), due to their inherent atomic thinness, moderate mobility, and short scaling lengths. However, 2D semiconductors encounter several technological challenges, especially the high contact resistance issue between 2D semiconductors and metals. This review provides a comprehensive overview of the high contact resistance issue in 2D semiconductors, including its physical background and the efforts to address it, with respect to their applicability to GAAFET structures.

Performance Limits and Advancements in Single 2D Transition Metal Dichalcogenide Transistor

Two-dimensional (2D) transition metal dichalcogenides (TMDs) allow for atomic-scale manipulation, challenging the conventional limitations of semiconductor materials. This capability may overcome the short-channel effect, sparking significant advancements in electronic devices that utilize 2D TMDs. Exploring the dimension and performance limits of transistors based on 2D TMDs has gained substantial importance. This review provides a comprehensive investigation into these limits of the single 2D-TMD transistor. It delves into the impacts of miniaturization, including the reduction of channel length, gate length, source/drain contact length, and dielectric thickness on transistor operation and performance. In addition, this review provides a detailed analysis of performance parameters such as source/drain contact resistance, subthreshold swing, hysteresis loop, carrier mobility, on/off ratio, and the development of p-type and single logic transistors. This review details the two logical expressions of the single 2D-TMD logic transistor, including current and voltage. It also emphasizes the role of 2D TMD-based transistors as memory devices, focusing on enhancing memory operation speed, endurance, data retention, and extinction ratio, as well as reducing energy consumption in memory devices functioning as artificial synapses. This review demonstrates the two calculating methods for dynamic energy consumption of 2D synaptic devices. This review not only summarizes the current state of the art in this field but also highlights potential future research directions and applications. It underscores the anticipated challenges, opportunities, and potential solutions in navigating the dimension and performance boundaries of 2D transistors.

Simulations of Anisotropic Monolayer GaSCl for p-Type Sub-10 nm High-Performance and Low-Power FETs

Two-dimensional materials have been extensively studied in field-effect transistors (FETs). However, the performance of p-type FETs has lagged behind that of n-type, which limits the development of complementary logical circuits. Here, we investigate the electronic properties and transport performance of anisotropic monolayer GaSCl for p-type FETs through first-principles calculations. The anisotropic electronic properties of monolayer GaSCl result in excellent device performance. The p-type GaSCl FETs with 10 nm channel length have an on-state current of 2351 μA/μm for high-performance (HP) devices along the y direction and an on-state current of 992 μA/μm with an on/off ratio exceeding 107 for low-power (LP) applications along the x direction. In addition, the delay-time (τ) and power dissipation product of GaSCl FETs can fully meet the International Technology Roadmap for Semiconductors standards for HP and LP applications. Our work illustrates that monolayer GaSCl is a competitive p-type channel for next-generation devices.

Antimony-Platinum Modulated Contact Enabling Majority Carrier Polarity Selection on a Monolayer Tungsten Diselenide Channel

We develop a novel metal contact approach using an antimony (Sb)-platinum (Pt) bilayer to mitigate Fermi-level pinning in 2D transition metal dichalcogenide channels. This strategy allows for control over the transport polarity in monolayer WSe2 devices. By adjustment of the Sb interfacial layer thickness from 10 to 30 nm, the effective work function of the contact/WSe2 interface can be tuned from 4.42 eV (p-type) to 4.19 eV (n-type), enabling selectable n-/p-FET operation in enhancement mode. The shift in effective work function is linked to Sb-Se bond formation and an emerging n-doping effect. This work demonstrates high-performance n- and p-FETs with a single WSe2 channel through Sb-Pt contact modulation. After oxide encapsulation, the maximum current density at |VD| = 1 V reaches 170 μA/μm for p-FET and 165 μA/μm for n-FET. This approach shows promise for cost-effective CMOS transistor applications using a single channel material and metal contact scheme.

Eight In. Wafer-Scale Epitaxial Monolayer MoS2

Large-scale, high-quality, and uniform monolayer molybdenum disulfide (MoS2) films are crucial for their applications in next-generation electronics and optoelectronics. Epitaxy is a mainstream technique for achieving high-quality MoS2 films and is demonstrated at a wafer scale up to 4-in. In this study, the epitaxial growth of 8-in. wafer-scale highly oriented monolayer MoS2 on sapphire is reported as with excellent spatial homogeneity, using a specially designed vertical chemical vapor deposition (VCVD) system. Field effect transistors (FETs) based on the as-grown 8-in. wafer-scale monolayer MoS2 film are fabricated and exhibit high performances, with an average mobility and an on/off ratio of 53.5 cm2 V-1 s-1 and 107, respectively. In addition, batch fabrication of logic devices and 11-stage ring oscillators are also demonstrated, showcasing excellent electrical functions. This work may pave the way of MoS2 in practical industry-scale applications.

Integrated 1D epitaxial mirror twin boundaries for ultrascaled 2D MoS2 field-effect transistors

In atomically thin van der Waals materials, grain boundaries-the line defects between adjacent crystal grains with tilted in-plane rotations-are omnipresent. When the tilting angles are arbitrary, the grain boundaries form inhomogeneous sublattices, giving rise to local electronic states that are not controlled. Here we report on epitaxial realizations of deterministic MoS2 mirror twin boundaries (MTBs) at which two adjoining crystals are reflection mirroring by an exactly 60° rotation by position-controlled epitaxy. We showed that these epitaxial MTBs are one-dimensionally metallic to a circuit length scale. By utilizing the ultimate one-dimensional (1D) feature (width ~0.4 nm and length up to a few tens of micrometres), we incorporated the epitaxial MTBs as a 1D gate to build integrated two-dimensional field-effect transistors (FETs). The critical role of the 1D MTB gate was verified to scale the depletion channel length down to 3.9 nm, resulting in a substantially lowered channel off-current at lower gate voltages. With that, in both individual and array FETs, we demonstrated state-of-the-art performances for low-power logics. The 1D epitaxial MTB gates in this work suggest a novel synthetic pathway for the integration of two-dimensional FETs-that are immune to high gate capacitance-towards ultimate scaling.

Molecular beam epitaxy and other large-scale methods for producing monolayer transition metal dichalcogenides

Transition metal dichalcogenide (TMD/TMDC) monolayers have gained considerable attention in recent years for their unique properties. Some of these properties include direct bandgap emission and strong mechanical and electronic properties. For these reasons, monolayer TMDs have been considered a promising material for next-generation quantum technologies and optoelectronic devices. However, for the field to make more gainful advancements and be implemented in devices, high-quality TMD monolayers need to be produced at a larger scale with high quality. In this article, some of the current means to produce larger-scale semiconducting monolayer TMDs will be reviewed. An emphasis will be given to the technique of molecular beam epitaxy (MBE) for two main reasons: (1) there is a growing body of research using this technique to grow TMD monolayers and (2) there is yet to be a body of work that has summarized the current research for MBE monolayer growth of TMDs.

Searching for the Thinnest Metallic Wire

One-dimensional materials have gained much attention in the last decades: from carbon nanotubes to ultrathin nanowires to few-atom atomic chains, these can all display unique electronic properties and great potential for next-generation applications. Exfoliable bulk materials could naturally provide a source for one-dimensional wires with a well-defined structure and electronics. Here, we explore a database of one-dimensional materials that could be exfoliated from experimentally known three-dimensional van der Waals compounds, searching for metallic wires that are resilient to Peierls distortions and could act as vias or interconnects for future downscaled electronic devices. As the one-dimensional nature makes these wires particularly susceptible to dynamical instabilities, we carefully characterize vibrational properties to identify stable phases and characterize electronic and dynamical properties. Our search discovers several stable wires; notably, we identify what could be the thinnest possible exfoliable metallic wire, CuC2, coming a step closer to the ultimate limit in material downscaling.

Ultrafast Non-Volatile Floating-Gate Memory Based on All-2D Materials

The explosive growth of massive-data storage and the demand for ultrafast data processing require innovative memory devices with exceptional performance. 2D materials and their van der Waal heterostructures with atomically sharp interfaces hold great promise for innovations in memory devices. Here, this work presents non-volatile, floating-gate memory devices with all functional layers made of 2D materials, achieving ultrafast programming/erasing speeds (20 ns), high extinction ratios (up to 108), and multi-bit storage capability. These devices also exhibit long-term data retention exceeding 10 years, facilitated by a high gate-coupling ratio (GCR) and atomically sharp interfaces between functional layers. Additionally, this work demonstrates the realization of an "OR" logic gate on a single-device unit by synergistic electrical and optical operations. The present results provide a solid foundation for next-generation ultrahigh-speed, ultralong lifespan, non-volatile memory devices, with a potential for scale-up manufacturing and flexible electronics applications.

Establishing Ohmic Contact of a Radial Compressed CNT Bundle with High Work Function Metal

Establishing low-resistance ohmic contact is critical for developing electronic devices based on traditional silicon and new low-dimensional materials. Due to unprecedented electronic and mechanical properties, the one-dimensional carbon nanotubes (CNTs) have been used as source/drain, gate, or tunnel to fabricate transistors. However, the mechanism causing low-resistance ohmic contact is not clear yet. Here, the hybrid atomic force microscopy-scanning electron microscopy (AFM-SEM) instrument was developed to establish lower-resistance ohmic contact between a radial compressed deformed multiwalled CNT bundle and high work function metal (platinum and gold). The radial compression structure under strong van der Waals attraction was in situ characterized through the SEM image to obtain the diameter and width and through AFM to get height and to perform nanoindentation, indicating that Pt has the smaller radial compression deformation. Molecular dynamics simulations exhibit that compared to Pt, a wider ribbon-like graphene layer formed when the radial compressed CNTs contacted with Au. The bond forming and electron orbital overlapping between C atoms of deformed CNTs and the high work function metal atom is beneficial for good electrical contact.

Numerical investigation on the convergence of self-consistent Schrödinger-Poisson equations in semiconductor device transport simulation

Semiconductor devices at the nanoscale with low-dimensional materials as channels exhibit quantum transport characteristics, thereby their electrical simulation relies on the self-consistent solution of the Schrödinger-Poisson equations. While the non-equilibrium Green's function (NEGF) method is widely used for solving this quantum many-body problem, its high computational cost and convergence challenges with the Poisson equation significantly limit its applicability. In this study, we investigate the stability of the NEGF method coupled with various forms of the Poisson equation, encompassing linear, analytical nonlinear, and numerical nonlinear forms Our focus lies on simulating carbon nanotube field-effect transistors (CNTFETs) under two distinct doping scenarios: electrostatic doping and ion implantation doping. The numerical experiments reveal that nonlinear formulas outperform linear counterpart. The numerical one demonstrates superior stability, particularly evident under high bias and ion implantation doping conditions. Additionally, we investigate different approaches for presolving potential, leveraging solutions from the Laplace equation and a piecewise guessing method tailored to each doping mode. These methods effectively reduce the number of iterations required for convergence.

Pick-up and assembling of chemically sensitive van der Waals heterostructures using dry cryogenic exfoliation

Assembling atomic layers of van der Waals materials (vdW) combines the physics of two materials, offering opportunities for novel functional devices. Realization of this has been possible because of advancements in nanofabrication processes which often involve chemical processing of the materials under study; this can be detrimental to device performance. To address this issue, we have developed a modified micro-manipulator setup for cryogenic exfoliation, pick up, and transfer of vdW materials to assemble heterostructures. We use the glass transition of a polymer PDMS to cleave a flake into two, followed by its pick-up and drop to form pristine twisted junctions. To demonstrate the potential of the technique, we fabricated twisted heterostructure of Bi2Sr2CaCu2O8+x (BSCCO), a van der Waals high-temperature cuprate superconductor. We also employed this method to re-exfoliate NbSe2 and make twisted heterostructure. Transport measurements of the fabricated devices indicate the high quality of the artificial twisted interface. In addition, we extend this cryogenic exfoliation method for other vdW materials, offering an effective way of assembling heterostructures and twisted junctions with pristine interfaces.

Asymmetric contact-induced selective doping of CVD-grown bilayer WS2 and its application in high-performance photodetection with an ultralow dark current

Two-dimensional (2D) transition metal dichalcogenides (TMDs) are excellent candidates for high-performance optoelectronics due to their high carrier mobility, air stability and strong optical absorption. However, photodetectors made with monolayer TMDs often exhibit a high dark current, and thus, there is a scope for further improvement. Herein, we developed a 2D bilayer tungsten disulfide (WS2) based photodetector (PD) with asymmetric contacts that exhibits an exceptionally low dark current and high specific detectivity. High-quality and large-area monolayer and bilayer WS2 flakes were synthesized using a thermal chemical vapor deposition system. Compared to conventional symmetric contact electrodes, utilizing metal electrodes with higher and lower work functions relative to bilayer WS2 aids in achieving asymmetric lateral doping in the WS2 flakes. This doping asymmetry was confirmed through the photoluminescence spectral profile and Raman mapping analysis. With the asymmetric contacts on bilayer WS2, we find evidence of selective doping of electrons and holes near the Ti and Au contacts, respectively, while the WS2 region away from the contacts remains intrinsic. When compared with the symmetric contact case, the dark current in the WS2 PD with asymmetric (Au, Ti) contact decreases by an order of magnitude under reverse bias with a concomitant increase in the photocurrent, resulting in an improved on/off ratio of ∼105 and overall improved device performance under identical illumination conditions. We explained this improved performance based on the energy band alignment showing a unidirectional charge flow under light illumination. Our results indicate that the planar device structure and compatibility with current nanofabrication technologies can facilitate its integration into advanced chips for futuristic low-power optoelectronic and nanophotonic applications.

Can 2D Semiconductors Be Game-Changers for Nanoelectronics and Photonics?

2D semiconductors have interesting physical and chemical attributes that have led them to become one of the most intensely investigated semiconductor families in recent history. They may play a crucial role in the next technological revolution in electronics as well as optoelectronics or photonics. In this Perspective, we explore the fundamental principles and significant advancements in electronic and photonic devices comprising 2D semiconductors. We focus on strategies aimed at enhancing the performance of conventional devices and exploiting important properties of 2D semiconductors that allow fundamentally interesting device functionalities for future applications. Approaches for the realization of emerging logic transistors and memory devices as well as photovoltaics, photodetectors, electro-optical modulators, and nonlinear optics based on 2D semiconductors are discussed. We also provide a forward-looking perspective on critical remaining challenges and opportunities for basic science and technology level applications of 2D semiconductors.