Additive Manufacturing of Metal Structures at the Micrometer Scale

On the Resolution Limit of Electrohydrodynamic Redox 3D Printing

Additive manufacturing (AM) will empower the next breakthroughs in nanotechnology by combining unmatched geometrical freedom with nanometric resolution. Despite recent advances, no micro-AM technique has been able to synthesize functional nanostructures with excellent metal quality and sub-100 nm resolution. Here, significant breakthroughs in electrohydrodynamic redox 3D printing (EHD-RP) are reported by directly fabricating high-purity Cu (>98 at.%) with adjustable voxel size from >6µm down to 50 nm. This unique tunability of the feature size is achieved by managing in-flight solvent evaporation of the ion-loaded droplet to either trigger or prevent the Coulomb explosion. In the first case, the landing of confined droplets on the substrate allows the fabrication of high-aspect-ratio 50 nm-wide nanopillars, while in the second, droplet disintegration leads to large-area spray deposition. It is discussed that the reported pillar width corresponds to the ultimate resolution achievable by EHD printing. The unrivaled feature size and growth rate (>100 voxel s-1) enable the direct manufacturing of 30 µm-tall atom probe tomography (APT) tips that unveil the pristine microstructure and chemistry of the deposit. This method opens up prospects for the development of novel materials for 3D nano-printing.

Condensed Matter Systems Exposed to Radiation: Multiscale Theory, Simulations, and Experiment

This roadmap reviews the new, highly interdisciplinary research field studying the behavior of condensed matter systems exposed to radiation. The Review highlights several recent advances in the field and provides a roadmap for the development of the field over the next decade. Condensed matter systems exposed to radiation can be inorganic, organic, or biological, finite or infinite, composed of different molecular species or materials, exist in different phases, and operate under different thermodynamic conditions. Many of the key phenomena related to the behavior of irradiated systems are very similar and can be understood based on the same fundamental theoretical principles and computational approaches. The multiscale nature of such phenomena requires the quantitative description of the radiation-induced effects occurring at different spatial and temporal scales, ranging from the atomic to the macroscopic, and the interlinks between such descriptions. The multiscale nature of the effects and the similarity of their manifestation in systems of different origins necessarily bring together different disciplines, such as physics, chemistry, biology, materials science, nanoscience, and biomedical research, demonstrating the numerous interlinks and commonalities between them. This research field is highly relevant to many novel and emerging technologies and medical applications.

Direct In- and Out-of-Plane Writing of Metals on Insulators by Electron-Beam-Enabled, Confined Electrodeposition with Submicrometer Feature Size

Additive microfabrication processes based on localized electroplating enable the one-step deposition of micro-scale metal structures with outstanding performance, e.g., high electrical conductivity and mechanical strength. They are therefore evaluated as an exciting and enabling addition to the existing repertoire of microfabrication technologies. Yet, electrochemical processes are generally restricted to conductive or semiconductive substrates, precluding their application in the manufacturing of functional electric devices where direct deposition onto insulators is often required. Here, the direct, localized electrodeposition of copper on a variety of insulating substrates, namely Al2O3, glass and flexible polyethylene, is demonstrated, enabled by electron-beam-induced reduction in a highly confined liquid electrolyte reservoir. The nanometer-size of the electrolyte reservoir, fed by electrohydrodynamic ejection, enables a minimal feature size on the order of 200 nm. The fact that the transient reservoir is established and stabilized by electrohydrodynamic ejection rather than specialized liquid cells can offer greater flexibility toward deposition on arbitrary substrate geometries and materials. Installed in a low-vacuum scanning electron microscope, the setup further allows for operando, nanoscale observation and analysis of the manufacturing process.

Operando Colorations from Real-Time Growth of 3D-Printed Nanoarchitectures

While artificial 3D nanostructures can generate precise and flexible coloration, their real-time color changes during 3D nanoprinting remain unexplored owing to the inherent challenges of in situ transient measurements and observations. In this study, a 3D-printing system which supports the operando observation/measurement of the color dynamics of subwavelength metallic nanoarchitectures fabricated in real time is developed and evaluated. During 3D printing, the dimensions and geometries of the 3D nanostructures grow over time, producing a large library of optical spectra associated with real-time color changes. Only a timer is needed to define the expected colors from a single 3D print run. Fin-like nanostructures are used to toggle colors based on the polarization effect and produce color gradients. Based on structural coloration, nanoarchitectures are designed and printed to animate desired color patterns. Moreover, the resulting color dynamics can also serve as an operando identifier for real-time structural information during 3D nanoprinting. A single print run enables the efficient creation of a comprehensive library of desired colorations owing to the flexibility in time-dependent controllability and 3D geometries at the subwavelength scale. 3D nanoprinted plasmonic structures exhibiting time-varying colorations (4D printing of colors) uniquely redefines the coloring stategy, offering considerable potential for numerous applications.

The Roles of Microprobe in Localized Electrodeposition: Electrolyte Localized Transport and Force-Displacement Sensitivity

Facing the rapid development of 6G communication, long-wave infrared metasurface and biomimetic microfluidics, the performance requirements for microsystems based on metal tiny structures are gradually increasing. As one of powerful methods for fabrication metal complex microstructures, localized electrochemical deposition microadditive manufacturing technology can fabricate copper metal micro overhanging structures without masks and supporting materials. In this study, the role of the microprobe cantilever (MC) in localized electrodeposition was studied. The MC can be used for precise deposition with electrolyte localized transport function and high accuracy force-displacement sensitivity. To prove this, the electrolyte flow was simulated when the MC was in bending or normal state. The simulation results can indicate the influence of turbulent flow on the electrolyte flow velocity and the pressure at the end of the pyramid. The results show that the internal flow velocity increased by 8.9% in the bending probe as compared with normal. Besides, this study analyzed the force-potential sensitivity characteristics of the MC. Using the deformation of the MC as an intermediate variable, the model of the probe tip displacement caused by the growth of the deposit and the voltage value displayed by the photodetector was mathematically established. In addition, the deposition of a single voxel was simulated by simulation process with the simulated height of 520 nm for one voxel, and the coincidence of simulation and experimental results was 93.1%. In conclusion, this method provides a new way for localized electrodeposition of complex microstructures.

Manipulating Stacking Fault Energy to Achieve Crack Inhibition and Superior Strength-Ductility Synergy in an Additively Manufactured High-Entropy Alloy

Additive manufacturing (AM) is a revolutionary technology that heralds a new era in metal processing, yet the quality of AM-produced parts is inevitably compromised by cracking induced by severe residual stress. In this study, a novel approach is presented to inhibit cracks and enhance the mechanical performances of AM-produced alloys by manipulating stacking fault energy (SFE). A high-entropy alloy (HEA) based on an equimolar FeCoCrNi composition is selected as the prototype material due to the presence of microcracks during laser powder bed fusion (LPBF) AM process. Introducing a small amount (≈2.4 at%) of Al doping can effectively lower SFE and yield the formation of multiscale microstructures that efficiently dissipate thermal stress during LPBF processing. Distinct from the Al-free HEA containing visible microcracks, the Al-doped HEA (Al0.1CoCrFeNi) is crack free and demonstrates ≈55% improvement in elongation without compromising tensile strength. Additionally, the lowered SFE enhances the resistance to crack propagation, thereby improving the durability of AM-printed products. By manipulating SFE, the thermal cycle-induced stress during the printing process can be effectively consumed via stacking faults formation, and the proposed strategy offers novel insights into the development of crack-free alloys with superior strength-ductility synergy for intricate structural applications.

Piezo inkjet formation of Ag nanoparticles from microdots arrays for surface plasmonic resonance

The study aims to explore a novel approach for fabricating plasmonic nanostructures to enhance the optical properties and performance of various optoelectronic devices. The research begins by employing a piezo-inkjet printing technique to deposit drops containing Ag nanoparticles (NPs) onto a glass substrate at a predefined equidistance, with the goal of obtaining arrays of Ag microdots (Ag-µdots) on the glass substrate. This process is followed by a thermal annealing treatment. The printing parameters are first optimized to achieve uniform deposition of different sizes of Ag-µdots arrays by controlling the number of Ag ink drops. Subsequently, the printed arrays undergo thermal annealing at various temperatures in air for 60 min, enabling precise and uniform control over nanoparticle formation. The printed Ag nanoparticles are characterized using field emission scanning electron microscopy and atomic force microscopy to analyze their morphological features, ensuring their suitability for plasmonic applications. UV-Vis spectrophotometry is employed to investigate the enhanced surface-plasmonic-resonance properties of the printed AgNPs. Measurements confirm that the equidistant arrays of AgNPs obtained from annealing Ag microdots exhibit enhanced light-matter interaction, leading to a surface plasmon resonance response dependent on the Ag NPs' specific surface area. These enhanced surface plasmonic resonances open avenues for developing cutting-edge optoelectronic devices that leverage the benefits of plasmonic nanostructures, thereby enabling new opportunities for future technological developments across various fields.

Gas-Phase Synthesis of Iron Silicide Nanostructures Using a Single-Source Precursor: Comparing Direct-Write Processing and Thermal Conversion

The investigation of precursor classes for the fabrication of nanostructures is of specific interest for maskless fabrication and direct nanoprinting. In this study, the differences in material composition depending on the employed process are illustrated for focused-ion-beam- and focused-electron-beam-induced deposition (FIBID/FEBID) and compared to the thermal decomposition in chemical vapor deposition (CVD). This article reports on specific differences in the deposit composition and microstructure when the (H3Si)2Fe(CO)4 precursor is converted into an inorganic material. Maximum metal/metalloid contents of up to 90 at. % are obtained in FIBID deposits and higher than 90 at. % in CVD films, while FEBID with the same precursor provides material containing less than 45 at. % total metal/metalloid content. Moreover, the Fe:Si ratio is retained well in FEBID and CVD processes, but FIBID using Ga+ ions liberates more than 50% of the initial Si provided by the precursor. This suggests that precursors for FIBID processes targeting binary materials should include multiple bonding such as bridging positions for nonmetals. In addition, an in situ method for investigations of supporting thermal effects of precursor fragmentation during the direct-writing processes is presented, and the applicability of the precursor for nanoscale 3D FEBID writing is demonstrated.

Multijet Gold Nanoparticle Inks for Additive Manufacturing of Printed and Wearable Electronics

Conductive and biofriendly gold nanomaterial inks are highly desirable for printed electronics, biosensors, wearable electronics, and electrochemical sensor applications. Here, we demonstrate the scalable synthesis of stable gold nanoparticle inks with low-temperature sintering using simple chemical processing steps. Multiprinter compatible aqueous gold nanomaterial inks were formulated, achieving resistivity as low as ∼10-6 Ω m for 400 nm thick films sintered at 250 °C. Printed lines with a resolution of <20 μm and minimal overspray were obtained using an aerosol jet printer. The resistivity of the printed patterns reached ∼9.59 ± 1.2 × 10-8 Ω m after sintering at 400 °C for 45 min. Our aqueous-formulated gold nanomaterial inks are also compatible with inkjet printing, extending the design space and manufacturability of printed and flexible electronics where metal work functions and chemically inert films are important for device applications.

Nanodroplet Flight Control in Electrohydrodynamic Redox 3D Printing

Electrohydrodynamic 3D printing is an additive manufacturing technique with enormous potential in plasmonics, microelectronics, and sensing applications thanks to its broad material palette, high voxel deposition rate, and compatibility with various substrates. However, the electric field used to deposit material is concentrated at the depositing structure, resulting in the focusing of the charged droplets and geometry-dependent landing positions, which complicates the fabrication of complex 3D shapes. The low level of concordance between the design and printout seriously impedes the development of electrohydrodynamic 3D printing and rationalizes the simplicity of the designs reported so far. In this work, we break the electric field centrosymmetry to study the resulting deviation in the flight trajectory of the droplets. Comparison of experimental outcomes with predictions of an FEM model provides new insights into the droplet characteristics and unveils how the product of droplet size and charge uniquely governs its kinematics. From these insights, we develop reliable predictions of the jet trajectory and allow the computation of optimized printing paths counterbalancing the electric field distortion, thereby enabling the fabrication of geometries with unprecedented complexity.

Scalable Printing of Metal Nanostructures through Superluminescent Light Projection

Direct printing of metallic nanostructures is highly desirable but current techniques cannot achieve nanoscale resolutions or are too expensive and slow. Photoreduction of solvated metal ions into metallic nanoparticles is an attractive strategy because it is faster than deposition-based techniques. However, it is still limited by the resolution versus cost tradeoff because sub-diffraction printing of nanostructures requires high-intensity light from expensive femtosecond lasers. Here, this tradeoff is overcome by leveraging the spatial and temporal coherence properties of low-intensity diode-based superluminescent light. The superluminescent light projection (SLP) technique is presented to rapidly print sub-diffraction nanostructures, as small as 210 nm and at periods as small as 300 nm, with light that is a billion times less intense than femtosecond lasers. Printing of arbitrarily complex 2D nanostructured silver patterns over 30 µm × 80 µm areas in 500 ms time scales is demonstrated. The post-annealed nanostructures exhibit an electrical conductivity up to 1/12th that of bulk silver. SLP is up to 480 times faster and 35 times less expensive than printing with femtosecond lasers. Therefore, it transforms nanoscale metal printing into a scalable format, thereby significantly enhancing the transition of nano-enabled devices from research laboratories into real-world applications.

Pillar Growth by Focused Electron Beam-Induced Deposition Using a Bimetallic Precursor as Model System: High-Energy Fragmentation vs. Low-Energy Decomposition

Electron-induced fragmentation of the HFeCo3(CO)12 precursor allows direct-write fabrication of 3D nanostructures with metallic contents of up to >95 at %. While microstructure and composition determine the physical and functional properties of focused electron beam-induced deposits, they also provide fundamental insights into the decomposition process of precursors, as elaborated in this study based on EDX and TEM. The results provide solid information suggesting that different dominant fragmentation channels are active in single-spot growth processes for pillar formation. The use of the single source precursor provides a unique insight into high- and low-energy fragmentation channels being active in the same deposit formation process.

Ultrastrong colloidal crystal metamaterials engineered with DNA

Lattice-based constructs, often made by additive manufacturing, are attractive for many applications. Typically, such constructs are made from microscale or larger elements; however, smaller nanoscale components can lead to more unusual properties, including greater strength, lighter weight, and unprecedented resiliencies. Here, solid and hollow nanoparticles (nanoframes and nanocages; frame size: ~15 nanometers) were assembled into colloidal crystals using DNA, and their mechanical strengths were studied. Nanosolid, nanocage, and nanoframe lattices with identical crystal symmetries exhibit markedly different specific stiffnesses and strengths. Unexpectedly, the nanoframe lattice is approximately six times stronger than the nanosolid lattice. Nanomechanical experiments, electron microscopy, and finite element analysis show that this property results from the buckling, densification, and size-dependent strain hardening of nanoframe lattices. Last, these unusual open architectures show that lattices with structural elements as small as 15 nanometers can retain a high degree of strength, and as such, they represent target components for making and exploring a variety of miniaturized devices.

Recent advances in 3D printing of biodegradable metals for orthopaedic applications

The use of biodegradable polymers for treating bone-related diseases has become a focal point in the field of biomedicine. Recent advancements in material technology have expanded the range of materials suitable for orthopaedic implants. Three-dimensional (3D) printing technology has become prevalent in healthcare, and while organ printing is still in its early stages and faces ethical and technical hurdles, 3D printing is capable of creating 3D structures that are supportive and controllable. The technique has shown promise in fields such as tissue engineering and regenerative medicine, and new innovations in cell and bio-printing and printing materials have expanded its possibilities. In clinical settings, 3D printing of biodegradable metals is mainly used in orthopedics and stomatology. 3D-printed patient-specific osteotomy instruments, orthopedic implants, and dental implants have been approved by the US FDA for clinical use. Metals are often used to provide support for hard tissue and prevent complications. Currently, 70-80% of clinically used implants are made from niobium, tantalum, nitinol, titanium alloys, cobalt-chromium alloys, and stainless steels. However, there has been increasing interest in biodegradable metals such as magnesium, calcium, zinc, and iron, with numerous recent findings. The advantages of 3D printing, such as low manufacturing costs, complex geometry capabilities, and short fabrication periods, have led to widespread adoption in academia and industry. 3D printing of metals with controllable structures represents a cutting-edge technology for developing metallic implants for biomedical applications. This review explores existing biomaterials used in 3D printing-based orthopedics as well as biodegradable metals and their applications in developing metallic medical implants and devices. The challenges and future directions of this technology are also discussed.

Metal 3D nanoprinting with coupled fields

Metallized arrays of three-dimensional (3D) nanoarchitectures offer new and exciting prospects in nanophotonics and nanoelectronics. Engineering these repeating nanoarchitectures, which have dimensions smaller than the wavelength of the light source, enables in-depth investigation of unprecedented light-matter interactions. Conventional metal nanomanufacturing relies largely on lithographic methods that are limited regarding the choice of materials and machine write time and are restricted to flat patterns and rigid structures. Herein, we present a 3D nanoprinter devised to fabricate flexible arrays of 3D metallic nanoarchitectures over areas up to 4 × 4 mm2 within 20 min. By suitably adjusting the electric and flow fields, metal lines as narrow as 14 nm were printed. We also demonstrate the key ability to print a wide variety of materials ranging from single metals, alloys to multimaterials. In addition, the optical properties of the as-printed 3D nanoarchitectures can be tailored by varying the material, geometry, feature size, and periodic arrangement. The custom-designed and custom-built 3D nanoprinter not only combines metal 3D printing with nanoscale precision but also decouples the materials from the printing process, thereby yielding opportunities to advance future nanophotonics and semiconductor devices.

Beginner's Guide to Micro- and Nanoscale Electrochemical Additive Manufacturing

Electrochemical additive manufacturing is an advanced microfabrication technology capable of producing features of almost unlimited geometrical complexity. A unique combination of the capacity to process conductive materials, design freedom, and micro- to nanoscale resolution offered by these electrochemical techniques promises tremendous opportunities for a multitude of future applications spanning microelectronics, sensing, robotics, and energy storage. This review aims to equip readers with the basic principles of electrochemical 3D printing at the small length scale. By describing the basic principles of electrochemical additive manufacturing technology and using the recent advances in the field, this beginner's guide illustrates how controlling the fundamental phenomena that underpin the print process can be used to vary dimensions, morphology, and microstructure of printed structures.

Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects

As the microelectronics field pushes to increase device density through downscaling component dimensions, various novel micro- and nano-scale additive manufacturing technologies have emerged to expand the small scale design space. These techniques offer unprecedented freedom in designing 3D circuitry but have not yet delivered device-grade materials. To highlight the complex role of processing on the quality and microstructure of AM metals, we report the electrical properties of micrometer-scale copper interconnects fabricated by Fluid Force Microscopy (FluidFM) and Electrohydrodynamic-Redox Printing (EHD-RP). Using a thin film-based 4-terminal testing chip developed for the scope of this study, the electrical resistance of as-printed metals is directly related to print strategies and the specific morphological and microstructural features. Notably, the chip requires direct synthesis of conductive structures on an insulating substrate, which is shown for the first time in the case of FluidFM. Finally, we demonstrate the unique ability of EHD-RP to tune the materials resistivity by one order of magnitude solely through printing voltage. Through its novel electrical characterization approach, this study offers unique insight into the electrical properties of micro- and submicrometer-sized copper interconnects and steps towards a deeper understanding of micro AM metal properties for advanced electronics applications.

Site-Selective Chemical Vapor Deposition on Direct-Write 3D Nanoarchitectures

Recent advancements in additive manufacturing have enabled the preparation of free-shaped 3D objects with feature sizes down to and below the micrometer scale. Among the fabrication methods, focused electron beam- and focused ion beam-induced deposition (FEBID and FIBID, respectively) associate a high flexibility and unmatched accuracy in 3D writing with a wide material portfolio, thereby allowing for the growth of metallic to insulating materials. The combination of the free-shaped 3D nanowriting with established chemical vapor deposition (CVD) techniques provides attractive opportunities to synthesize complex 3D core-shell heterostructures. Hence, this hybrid approach enables the fabrication of morphologically tunable layer-based nanostructures with the great potential of unlocking further functionalities. Here, the fundamentals of such a hybrid approach are demonstrated by preparing core-shell heterostructures using 3D FEBID scaffolds for site-selective CVD. In particular, 3D microbridges are printed by FEBID with the (CH₃)₃CH₃C₅H₄Pt precursor and coated by thermal CVD using the Nb(NMe₂)₃(N-t-Bu) and HFeCo₃(CO)₁₂ precursors. Two model systems on the basis of CVD layers consisting of a superconducting NbC-based layer and a ferromagnetic Co₃Fe layer are prepared and characterized with regard to their composition, microstructure, and magneto-transport properties.

Printing on Particles: Combining Two-Photon Nanolithography and Capillary Assembly to Fabricate Multimaterial Microstructures

Additive manufacturing at the micro- and nanoscale has seen a recent upsurge to suit an increasing demand for more elaborate structures. However, the integration of multiple distinct materials at small scales remains challenging. To this end, capillarity-assisted particle assembly (CAPA) and two-photon polymerization direct laser writing (2PP-DLW) are combined to realize a new class of multimaterial microstructures. 2PP-DLW and CAPA both are used to fabricate 3D templates to guide the CAPA of soft- and hard colloids, and to link well-defined arrangements of functional microparticle arrays produced by CAPA, a process that is termed "printing on particles." The printing process uses automated particle recognition algorithms to connect colloids into 1D, 2D, and 3D tailored structures, via rigid, soft, or responsive polymer links. Once printed and developed, the structures can be easily re-dispersed in water. Particle clusters and lattices of varying symmetry and composition are reported, together with thermoresponsive microactuators, and magnetically driven "micromachines", which can efficiently move, capture, and release DNA-coated particles in solution. The flexibility of this method allows the combination of a wide range of functional materials into complex structures, which will boost the realization of new systems and devices for numerous fields, including microrobotics, micromanipulation, and metamaterials.

Laser printed microelectronics

Printed organic and inorganic electronics continue to be of large interest for sensors, bioelectronics, and security applications. Many printing techniques have been investigated, albeit often with typical minimum feature sizes in the tens of micrometer range and requiring post-processing procedures at elevated temperatures to enhance the performance of functional materials. Herein, we introduce laser printing with three different inks, for the semiconductor ZnO and the metals Pt and Ag, as a facile process for fabricating printed functional electronic devices with minimum feature sizes below 1 µm. The ZnO printing is based on laser-induced hydrothermal synthesis. Importantly, no sintering of any sort needs to be performed after laser printing for any of the three materials. To demonstrate the versatility of our approach, we show functional diodes, memristors, and a physically unclonable function based on a 6 × 6 memristor crossbar architecture. In addition, we realize functional transistors by combining laser printing and inkjet printing.

Selected Area Deposition of High Purity Gold for Functional 3D Architectures

Selected area deposition of high purity gold films onto nanoscale 3D architectures is highly desirable as gold is conductive, inert, plasmonically active, and can be functionalized with thiol chemistries, which are useful in many biological applications. Here, we show that high-purity gold coatings can be selectively grown with the Me₂Au (acac) precursor onto nanoscale 3D architectures via a pulsed laser pyrolytic chemical vapor deposition process. The selected area of deposition is achieved due to the high thermal resistance of the nanoscale geometries. Focused electron beam induced deposits (FEBID) and carbon nanofibers are functionalized with gold coatings, and we demonstrate the effects that laser irradiance, pulse width, and precursor pressure have on the growth rate. Furthermore, we demonstrate selected area deposition with a feature-targeting resolutions of ~100 and 5 µm, using diode lasers coupled to a multimode (915 nm) and single mode (785 nm) fiber optic, respectively. The experimental results are rationalized via finite element thermal modeling.

3D Nanoprinting Replication Enhancement Using a Simulation-Informed Analytical Model for Electron Beam Exposure Dose Compensation

3D nanoprinting, using focused electron beam-induced deposition, is prone to a common structural artifact arising from a temperature gradient that naturally evolves during deposition, extending from the electron beam impact region (BIR) to the substrate. Inelastic electron energy loss drives the Joule heating and surface temperature variations lead to precursor surface concentration variations due, in most part, to temperature-dependent precursor surface desorption. The result is unwanted curvature when prescribing linear segments in 3D objects, and thus, complex geometries contain distortions. Here, an electron dose compensation strategy is presented to offset deleterious heating effects; the Decelerating Beam Exposure Algorithm, or DBEA, which corrects for nanowire bending a priori, during computer-aided design, uses an analytical solution derived from information gleaned from 3D nanoprinting simulations. Electron dose modulation is an ideal solution for artifact correction because variations in electron dose have no influence on temperature. Thus, the generalized compensation strategy revealed here will help advance 3D nanoscale printing fidelity for focused electron beam-induced deposition.

Additive manufacturing of Zn with submicron resolution and its conversion into Zn/ZnO core-shell structures

Electrohydrodynamic redox 3D printing (EHD-RP) is an additive manufacturing (AM) technique with submicron resolution and multi-metal capabilities, offering the possibility to switch chemistry during deposition "on-the-fly". Despite the potential for synthesizing a large range of metals by electrochemical small-scale AM techniques, to date, only Cu and Ag have been reproducibly deposited by EHD-RP. Here, we extend the materials palette available to EHD-RP by using aqueous solvents instead of organic solvents, as used previously. We demonstrate deposition of Cu and Zn from sacrificial anodes immersed in acidic aqueous solvents. Mass spectrometry indicates that the choice of the solvent is important to the deposition of pure Zn. Additionally, we show that the deposited Zn structures, 250 nm in width, can be partially converted into semiconducting ZnO structures by oxidation at 325 °C in air.

Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing

The control of materials' microstructure is both a necessity and an opportunity for micro/nanometer-scale additive manufacturing technologies. On the one hand, optimization of purity and defect density of printed metals is a prerequisite for their application in microfabrication. On the other hand, the additive approach to materials deposition with highest spatial resolution offers unique opportunities for the fabrication of materials with complex, 3D graded composition or microstructure. As a first step toward both-optimization of properties and site-specific tuning of microstructure-an overview of the wide range of microstructure accessed in pure copper (up to >99.9 at.%) by electrohydrodynamic redox 3D printing is presented, and on-the-fly modulation of grain size in copper with smallest segments ≈400 nm in length is shown. Control of microstructure and materials properties by in situ adjustment of the printing voltage is demonstrated by variation of grain size by one order of magnitude and corresponding compression strength by a factor of two. Based on transmission electron microscopy and atom probe tomography, it is suggested that the small grain size is a direct consequence of intermittent solvent drying at the growth interface at low printing voltages, while larger grains are enabled by the permanent presence of solvent at higher potentials.

Controlled Morphological Bending of 3D-FEBID Structures via Electron Beam Curing

Focused electron beam induced deposition (FEBID) is one of the few additive, direct-write manufacturing techniques capable of depositing complex 3D nanostructures. In this work, we explore post-growth electron beam curing (EBC) of such platinum-based FEBID deposits, where free-standing, sheet-like elements were deformed in a targeted manner by local irradiation without precursor gas present. This process diminishes the volumes of exposed regions and alters nano-grain sizes, which was comprehensively characterized by SEM, TEM and AFM and complemented by Monte Carlo simulations. For obtaining controlled and reproducible conditions for smooth, stable morphological bending, a wide range of parameters were varied, which will here be presented as a first step towards using local EBC as a tool to realize even more complex nano-architectures, beyond current 3D-FEBID capabilities, such as overhanging structures. We thereby open up a new prospect for future applications in research and development that could even be further developed towards functional imprinting.

Investigations of the Microstructure and Mechanical Properties of 17-4 PH ss Printed Using a MarkForged Metal X

The Markforged Metal X (MfMX) printing machine (Markforged Inc., Massachusetts, USA) is one of the latest introduced additive manufacturing (AM) devices. It is getting popular because of its safety, simplicity, and ability to utilize various types of powders/filaments for printing. Despite this, only a few papers have so far reported the various properties and performances of the components fabricated by the MfMX printer. In this study, the microstructure and mechanical properties of MfMX-fabricated 17-4 stainless steel (ss) in the as-printed and heat-treated conditions were investigated. XRD and microscopy analyses revealed a dominant martensitic microstructure with some retained austenite phase. The microstructure is generally characterized by patterned voids that were unfilled due to a lack of fusion between the adjacent filaments. Disregarding these defects (voids), the porosity of the dense region was less than 4%. Depending on the heat treatment conditions, the hardness and tensile strength were enhanced by 17-28% and 21-27%, respectively. However, the tensile strength analyzed in this work was low compared with some previous reports for L-PBF-fabricated 17-4 ss. In contrast, the hardness of the as-printed (331 ± 28 HV) and heat-treated samples under the H900 condition (417 ± 29 HV) were comparable with (and even better than) some reports in the literature, despite the low material density. The results generally indicated that the Markforged printer is a promising technology when the printing processes are fully developed and optimized.

High-resolution deposition of conductive and insulating materials at micrometer scale on complex substrates

Additive manufacturing transforms the landscape of modern microelectronics. Recent years have witnessed significant progress in the fabrication of 2D planar structures and free-standing 3D architectures. In this work, we present a much-needed intermediary approach: we introduce the Ultra-Precise Deposition (UPD) technology, a versatile platform for material deposition at micrometer scale on complex substrates. The versality of this approach is related to three aspects: material to be deposited (conductive or insulating), shape of the printed structures (lines, dots, arbitrary shapes), as well as type and shape of the substrate (rigid, flexible, hydrophilic, hydrophobic, substrates with pre-existing features). The process is based on the direct, maskless deposition of high-viscosity materials using narrow printing nozzles with the internal diameter in the range from 0.5 to 10 µm. For conductive structures we developed highly concentrated non-Newtonian pastes based on silver, copper, or gold nanoparticles. In this case, the feature size of the printed structures is in the range from 1 to 10 µm and their electrical conductivity is up to 40% of the bulk value, which is the record conductivity for metallic structures printed with spatial resolution below 10 µm. This result is the effect of the synergy between the printing process itself, formulation of the paste, and the proper sintering of the printed structures. We demonstrate a pathway to print such fine structures on complex substrates. We argue that this versatile and stable process paves the way for a widespread use of additive manufacturing for microfabrication.

Design Aspects of Additive Manufacturing at Microscale: A Review

Additive manufacturing (AM) technology has been researched and developed for almost three decades. Microscale AM is one of the fastest-growing fields of research within the AM area. Considerable progress has been made in the development and commercialization of new and innovative microscale AM processes, as well as several practical applications in a variety of fields. However, there are still significant challenges that exist in terms of design, available materials, processes, and the ability to fabricate true three-dimensional structures and systems at a microscale. For instance, microscale AM fabrication technologies are associated with certain limitations and constraints due to the scale aspect, which may require the establishment and use of specialized design methodologies in order to overcome them. The aim of this paper is to review the main processes, materials, and applications of the current microscale AM technology, to present future research needs for this technology, and to discuss the need for the introduction of a design methodology. Thus, one of the primary concerns of the current paper is to present the design aspects describing the comparative advantages and AM limitations at the microscale, as well as the selection of processes and materials.

3D nanoprinting via spatially controlled assembly and polymerization

Macroscale additive manufacturing has seen significant advances recently, but these advances are not yet realized for the bottom-up formation of nanoscale polymeric features. We describe a platform technology for creating crosslinked polymer features using rapid surface-initiated crosslinking and versatile macrocrosslinkers, delivered by a microfluidic-coupled atomic force microscope known as FluidFM. A crosslinkable polymer containing norbornene moieties is delivered to a catalyzed substrate where polymerization occurs, resulting in extremely rapid chemical curing of the delivered material. Due to the living crosslinking reaction, construction of lines and patterns with multiple layers is possible, showing quantitative material addition from each deposition in a method analogous to fused filament fabrication, but at the nanoscale. Print parameters influenced printed line dimensions, with the smallest lines being 450 nm across with a vertical layer resolution of 2 nm. This nanoscale 3D printing platform of reactive polymer materials has applications for device fabrication, optical systems and biotechnology.

Additive manufacturing methods at the macroscale have seen significant advances in recent times, but advances for the bottom-up formation of nanoscale polymeric features are yet to be realized. Here, the authors demonstrate that rapid crosslinking of an AFM delivered norbornene crosslinker in presence of a surface-tethered metathesis catalysts facilitates the curing of delivered material in an extremely rapid fashion

Nanoscale electrochemical 3D deposition of cobalt with nanosecond voltage pulses in an STM

To explore a minimal feature size of <100 nm with electrochemical additive manufacturing, we use a strategy originally applied to microscale electrochemical machining for the nanoscale deposition of Co on Au. The concept's essence is the localization of electrochemical reactions below a probe during polarization with ns-long voltage pulses. As shown, a confinement that exceeds that predicted by a simple model based on the time constant for one-dimensional double layer charging enables a feature size of <100 nm for 2D patterning. We further indirectly verify the potential for out-of-plane deposition by tracking growth curves of high-aspect-ratio deposits. Importantly, we report a lack of anodic stability of Au tips used for patterning. As an inert probe is the prerequisite for controlled structuring, we experimentally verify an increased resistance of Pt probes against degradation. Consequently, the developed setup and processes show a path towards reproducible direct 2D and 3D patterning of metals at the nanoscale.

Aligned Stacking of Nanopatterned 2D Materials for High-Resolution 3D Device Fabrication

Two-dimensional materials can be combined by placing individual layers on top of each other, so that they are bound only by their van der Waals interaction. The sequence of layers can be chosen arbitrarily, enabling an essentially atomic-level control of the material and thereby a wide choice of properties along one dimension. However, simultaneous control over the structure in the in-plane directions is so far still rather limited. Here, we combine spatially controlled modifications of 2D materials, using focused electron irradiation or electron beam induced etching, with the layer-by-layer assembly of van der Waals heterostructures. The presented assembly process makes it possible to structure each layer with an arbitrary pattern prior to the assembly into the heterostructure. Moreover, it enables a stacking of the layers with accurate lateral alignment, with an accuracy of currently 10 nm, under observation in an electron microscope. Together, this enables the fabrication of almost arbitrary 3D structures with highest spatial resolution.

Confined pulsed diffuse layer charging for nanoscale electrodeposition with an STM

Regulating the state of the solid-liquid interface by means of electric fields is a powerful tool to control electrochemistry. In scanning probe systems, this can be confined closely to a scanning (nano)electrode by means of fast potential pulses, providing a way to probe the interface and control electrochemical reactions locally, as has been demonstrated in nanoscale electrochemical etching. For this purpose, it is important to know the spatial extent of the interaction between pulses applied to the tip, and the substrate. In this paper we use a framework of diffuse layer charging to describe the localization of electrical double layer charging in response to a potential pulse at the probe. Our findings are in good agreement with literature values obtained in electrochemical etching. We show that the pulse can be much more localized by limiting the diffusivity of the ions present in solution, by confined electrodeposition of cobalt in a dimethyl sulfoxide solution, using an electrochemical scanning tunnelling microscope. Finally, we demonstrate the deposition of cobalt nanostructures (<100 nm) using this method. The presented framework therefore provides a general route for predicting and controlling the time-dependent region of interaction between an electrochemical scanning probe and the surface.

3D printing of multi-metallic microstructures by meniscus-confined electrodeposition

We studied a multi-metallic microscale 3D printing based on the meniscus-confined electrodeposition (MCED). The composition of Cu/Pt alloys can be controlled by applying different bias voltages to the CuSO4/H2PtCl4 mixed solution in MCED. We find that a double-barrel system had higher Cu/Pt alloy purity (maximum 100% Cu or maximum 80% Pt) than a single-barrel system. A Λ-shaped microstructure was printed to verify the capability to multi-metal microstructures in a single printing process.

Overview of 3D-Printed Silica Glass

Not satisfied with the current stage of the extensive research on 3D printing technology for polymers and metals, researchers are searching for more innovative 3D printing technologies for glass fabrication in what has become the latest trend of interest. The traditional glass manufacturing process requires complex high-temperature melting and casting processes, which presents a great challenge to the fabrication of arbitrarily complex glass devices. The emergence of 3D printing technology provides a good solution. This paper reviews the recent advances in glass 3D printing, describes the history and development of related technologies, and lists popular applications of 3D printing for glass preparation. This review compares the advantages and disadvantages of various processing methods, summarizes the problems encountered in the process of technology application, and proposes the corresponding solutions to select the most appropriate preparation method in practical applications. The application of additive manufacturing in glass fabrication is in its infancy but has great potential. Based on this view, the methods for glass preparation with 3D printing technology are expected to achieve both high-speed and high-precision fabrication.

New Dimension in Magnetism and Superconductivity: 3D and Curvilinear Nanoarchitectures

Traditionally, the primary field, where curvature has been at the heart of research, is the theory of general relativity. In recent studies, however, the impact of curvilinear geometry enters various disciplines, ranging from solid-state physics over soft-matter physics, chemistry, and biology to mathematics, giving rise to a plethora of emerging domains such as curvilinear nematics, curvilinear studies of cell biology, curvilinear semiconductors, superfluidity, optics, 2D van der Waals materials, plasmonics, magnetism, and superconductivity. Here, the state of the art is summarized and prospects for future research in curvilinear solid-state systems exhibiting such fundamental cooperative phenomena as ferromagnetism, antiferromagnetism, and superconductivity are outlined. Highlighting the recent developments and current challenges in theory, fabrication, and characterization of curvilinear micro- and nanostructures, special attention is paid to perspective research directions entailing new physics and to their strong application potential. Overall, the perspective is aimed at crossing the boundaries between the magnetism and superconductivity communities and drawing attention to the conceptual aspects of how extension of structures into the third dimension and curvilinear geometry can modify existing and aid launching novel functionalities. In addition, the perspective should stimulate the development and dissemination of research and development oriented techniques to facilitate rapid transitions from laboratory demonstrations to industry-ready prototypes and eventual products.

Augmented Design with Additive Manufacturing Methodology: Tangible Object-Based Method to Enhance Creativity in Design for Additive Manufacturing

Additive manufacturing (AM) brings new design potential compared with traditional manufacturing. Nevertheless, traditional manufacturing knowledge remains embedded in the minds of designers and is a real cognitive barrier to design in AM. Design for Additive Manufacturing (DfAM) provides tools, techniques, and guidelines to optimize design with the specifics of AM. These methods are usable at different moments of the design process. Only few DfAMs focus on the early stages of design, the ideation phase, which allows for the most innovation. The literature highlights the effectiveness of methodologies based on tangible tools, such as cards or objects, to generate creativity. The difficulty with such tools is to be inspirational as well as formative. Therefore, this article presents a method to help designers capture the design potential of AM to design creative solutions at the early stages of product design, named the Augmented Design with AM Methodology (ADAM²). This methodology relies on the potential of AM, defined in 14 opportunities and a set of 14 inspirational objects, each representing an opportunity. Dedicated to creativity sessions, this methodology allows forcing the association between knowledge of a company's sector and the design potential of AM. To validate the effectiveness of the ADAM² methodology, we use it for an industrial application in a jewelry and watchmaking company. The results showed that ADAM² promote the generation of creative solutions and the exploitation of the design potential of AM during the early design stages.

Biomedical Applications of Metal 3D Printing

Additive manufacturing's attributes include print customization, low per-unit cost for small- to mid-batch production, seamless interfacing with mainstream medical 3D imaging techniques, and feasibility to create free-form objects in materials that are biocompatible and biodegradable. Consequently, additive manufacturing is apposite for a wide range of biomedical applications including custom biocompatible implants that mimic the mechanical response of bone, biodegradable scaffolds with engineered degradation rate, medical surgical tools, and biomedical instrumentation. This review surveys the materials, 3D printing methods and technologies, and biomedical applications of metal 3D printing, providing a historical perspective while focusing on the state of the art. It then identifies a number of exciting directions of future growth: (a) the improvement of mainstream additive manufacturing methods and associated feedstock; (b) the exploration of mature, less utilized metal 3D printing techniques; (c) the optimization of additively manufactured load-bearing structures via artificial intelligence; and (d) the creation of monolithic, multimaterial, finely featured, multifunctional implants.

Assembly of multicomponent structures from hundreds of micron-scale building blocks using optical tweezers

The fabrication of three-dimensional (3D) microscale structures is critical for many applications, including strong and lightweight material development, medical device fabrication, microrobotics, and photonic applications. While 3D microfabrication has seen progress over the past decades, complex multicomponent integration with small or hierarchical feature sizes is still a challenge. In this study, an optical positioning and linking (OPAL) platform based on optical tweezers is used to precisely fabricate 3D microstructures from two types of micron-scale building blocks linked by biochemical interactions. A computer-controlled interface with rapid on-the-fly automated recalibration routines maintains accuracy even after placing many building blocks. OPAL achieves a 60-nm positional accuracy by optimizing the molecular functionalization and laser power. A two-component structure consisting of 448 1-µm building blocks is assembled, representing the largest number of building blocks used to date in 3D optical tweezer microassembly. Although optical tweezers have previously been used for microfabrication, those results were generally restricted to single-material structures composed of a relatively small number of larger-sized building blocks, with little discussion of critical process parameters. It is anticipated that OPAL will enable the assembly, augmentation, and repair of microstructures composed of specialty micro/nanomaterial building blocks to be used in new photonic, microfluidic, and biomedical devices.

FEBID 3D-Nanoprinting at Low Substrate Temperatures: Pushing the Speed While Keeping the Quality

High-fidelity 3D printing of nanoscale objects is an increasing relevant but challenging task. Among the few fabrication techniques, focused electron beam induced deposition (FEBID) has demonstrated its high potential due to its direct-write character, nanoscale capabilities in 3D space and a very high design flexibility. A limitation, however, is the low fabrication speed, which often restricts 3D-FEBID for the fabrication of single objects. In this study, we approach that challenge by reducing the substrate temperatures with a homemade Peltier stage and investigate the effects on Pt based 3D deposits in a temperature range of 5–30 °C. The findings reveal a volume growth rate boost up to a factor of 5.6, while the shape fidelity in 3D space is maintained. From a materials point of view, the internal nanogranular composition is practically unaffected down to 10 °C, followed by a slight grain size increase for even lower temperatures. The study is complemented by a comprehensive discussion about the growth mechanism for a more general picture. The combined findings demonstrate that FEBID on low substrate temperatures is not only much faster, but practically free of drawbacks during high fidelity 3D nanofabrication.

Additive Manufacture of Small-Scale Metamaterial Structures for Acoustic and Ultrasonic Applications

Acoustic metamaterials are large-scale materials with small-scale structures. These structures allow for unusual interaction with propagating sound and endow the large-scale material with exceptional acoustic properties not found in normal materials. However, their multi-scale nature means that the manufacture of these materials is not trivial, often requiring micron-scale resolution over centimetre length scales. In this review, we bring together a variety of acoustic metamaterial designs and separately discuss ways to create them using the latest trends in additive manufacturing. We highlight the advantages and disadvantages of different techniques that act as barriers towards the development of realisable acoustic metamaterials for practical audio and ultrasonic applications and speculate on potential future developments.

DNA Origami-Based Nanoprinting for the Assembly of Plasmonic Nanostructures with Single-Molecule Surface-Enhanced Raman Scattering

Metallic nanocube ensembles exhibit tunable localized surface plasmon resonance to induce the light manipulation at the subwavelength scale. Nevertheless, precisely control anisotropic metallic nanocube ensembles with relative spatial directionality remains a challenge. Here, we report a DNA origami based nanoprinting (DOBNP) strategy to transfer the essential DNA strands with predefined sequences and positions to the surface of the gold nanocubes (AuNCs). These DNA strands ensured the specific linkages between AuNCs and gold nanoparticles (AuNPs) that generating the stereo-controlled AuNC-AuNP nanostructures (AANs) with controlled geometry and composition. By anchoring the single dye molecule in hot spot regions, the dramatic enhanced electromagnetic field aroused stronger surface enhanced Raman scattering (SERS) signal amplification. Our approach opens the opportunity for the fabrication of stereo-controlled metal nanostructures for designing highly sensitive photonic devices.

Interconnect Fabrication by Electroless Plating on 3D-Printed Electroplated Patterns

The metallic interconnects are essential components of energy devices such as fuel cells and electrolysis cells, batteries, as well as electronics and optoelectronic devices. In recent years, 3D printing processes have offered complementary routes to the conventional photolithography- and vacuum-based processes for interconnect fabrication. Among these methods, the confined electrodeposition (CED) process has enabled a great control over the microstructure of the printed metal, direct printing of high electrical conductivity (close to the bulk values) metals on flexible substrates without a need to sintering, printing alloys with controlled composition, printing functional metals for various applications including magnetic applications, and for in situ scanning electron microscope (SEM) nanomechanical experiments. However, the metal deposition rate (or the overall printing speed) of this process is reasonably slow because of the chemical nature of the process. Here, we propose using the CED process to print a single layer of a metallic trace as the seed layer for the subsequent selected-area electroless plating. By controlling the activation sites through printing by the CED process, we control, where the metal grows by electroless plating, and demonstrate the fabrication of complex thin-film patterns. Our results show that this combined process improves the processing time by more than 2 orders of magnitude compared to the layer-by-layer printing process by CED. Additionally, we obtained Cu and Ni films with an electrical resistivity as low as ∼1.3 and ∼2 times of the bulk Cu and Ni, respectively, without any thermal annealing. Furthermore, our quantitative experiments show that the obtained films exhibit mechanical properties close to the bulk metals with an excellent adhesion to the substrate. We demonstrate potential applications for radio frequency identification (RFID) tags, for complex printed circuit board patterns, and resistive sensors in a Petri dish for potential biological applications.

Non-Planar Geometrical Effects on the Magnetoelectrical Signal in a Three-Dimensional Nanomagnetic Circuit

Expanding nanomagnetism and spintronics into three dimensions (3D) offers great opportunities for both fundamental and technological studies. However, probing the influence of complex 3D geometries on magnetoelectrical phenomena poses important experimental and theoretical challenges. In this work, we investigate the magnetoelectrical signals of a ferromagnetic 3D nanodevice integrated into a microelectronic circuit using direct-write nanofabrication. Due to the 3D vectorial nature of both electrical current and magnetization, a complex superposition of several magnetoelectrical effects takes place. By performing electrical measurements under the application of 3D magnetic fields, in combination with macrospin simulations and finite element modeling, we disentangle the superimposed effects, finding how a 3D geometry leads to unusual angular dependences of well-known magnetotransport effects such as the anomalous Hall effect. Crucially, our analysis also reveals a strong role of the noncollinear demagnetizing fields intrinsic to 3D nanostructures, which results in an angular dependent magnon magnetoresistance contributing strongly to the total magnetoelectrical signal. These findings are key to the understanding of 3D spintronic systems and underpin further fundamental and device-based studies.

Multiscale Architecture and Superior High-Temperature Performance of Discontinuously Reinforced Titanium Matrix Composites

Discontinuously reinforced titanium matrix composites (DRTMCs), as one of the most important metal matrix composites (MMCs), are expected to exhibit high strength, elastic modulus, high-temperature endurability, wear resistance, isotropic property, and formability. Recent innovative research shows that tailoring the reinforcement network distribution totally differently from the conventional homogeneous distribution can not only improve the strengthening effect but also resolve the dilemma of DRTMCs with poor tensile ductility. Based on the network architecture, multiscale architecture, for example, two-scale network and laminate-network microstructure can further inspire superior strength, creep, and oxidation resistance at elevated temperatures. Herein, the most recent developments, which include the design, fabrication, microstructure, high-temperature performance, strengthening mechanisms, and future research opportunities for DRTMCs with multiscale architecture, are captured. In this regard, the service temperature can be increased by 200 °C, and the creep rupture time by 59-fold compared with those of conventional titanium alloys, which can meet the urgent demands of lightweight nickel-based structural materials and potentially replace nickel base superalloys at 600-800 °C to reduce weight by 45%. In fact, multiscale architecture design strategy will also favorably open a new era in the research of extensive metallic materials for improved performances.

A Review on Micro/Nanoforming to Fabricate 3D Metallic Structures

With the rapid development of micro-electromechanical systems (MEMS), micro/nanoscale fabrication of 3D metallic structures with complex structures and multifunctions is becoming more and more important due to the recent trend of product miniaturization. As a promising micromanufacturing approach based on plastic deformation, micro/nanoforming shows the attractive advantages of high productivity, low cost, near-net-shape, and excellent mechanical properties, compared with other non-silicon-based micromanufacturing technologies. However, micro/nanoforming is far less established due to the so-called size effects in terms of materials models, process laws, tooling design, etc. The understanding of basic issues on micro/nanoforming is not yet mature, and it is currently a topic of rigorous investigation. Here, a systematic review on the micro/nanoforming processes of 3D structures with multifunctional properties is presented, wherein also a critical examination of the interplay between relevant length scales and size effects affecting the structural integrity of micro/mesoscale metallic systems is also provided. Finally, the challenges of micro/nanoscale fabrication are proposed, including the development trends of new micro/nanoforming processes, multiple field coupling effects, and theoretical modeling at the trans-scale.

Expanding 3D Nanoprinting Performance by Blurring the Electron Beam

Additive, direct-write manufacturing via a focused electron beam has evolved into a reliable 3D nanoprinting technology in recent years. Aside from low demands on substrate materials and surface morphologies, this technology allows the fabrication of freestanding, 3D architectures with feature sizes down to the sub-20 nm range. While indispensably needed for some concepts (e.g., 3D nano-plasmonics), the final applications can also be limited due to low mechanical rigidity, and thermal- or electric conductivities. To optimize these properties, without changing the overall 3D architecture, a controlled method for tuning individual branch diameters is desirable. Following this motivation, here, we introduce on-purpose beam blurring for controlled upward scaling and study the behavior at different inclination angles. The study reveals a massive boost in growth efficiencies up to a factor of five and the strong delay of unwanted proximal growth. In doing so, this work expands the design flexibility of this technology.

High-Fidelity 3D Nanoprinting of Plasmonic Gold Nanoantennas

The direct-write fabrication of freestanding nanoantennas for plasmonic applications is a challenging task, as demands for overall morphologies, nanoscale features, and material qualities are very high. Within the small pool of capable technologies, three-dimensional (3D) nanoprinting via focused electron beam-induced deposition (FEBID) is a promising candidate due to its design flexibility. As FEBID materials notoriously suffer from high carbon contents, the chemical postgrowth transfer into pure metals is indispensably needed, which can severely harm or even destroy FEBID-based 3D nanoarchitectures. Following this challenge, we first dissect FEBID growth characteristics and then combine individual advantages by an advanced patterning approach. This allows the direct-write fabrication of high-fidelity shapes with nanoscale features in the sub-10 nm range, which allow a shape-stable chemical transfer into plasmonically active Au nanoantennas. The here-introduced strategy is a generic approach toward more complex 3D architectures for future applications in the field of 3D plasmonics.